Electronic device housing with an integrated antenna

Abstract

The present disclosure relates to an electronic device housing with an integrated antenna. The present disclosure relates to an electronic device that may include a display, a housing member that at least partially surrounds the display and includes a first section, a second section, and a bridging section, the first section defining a first portion of the outer surface of the electronic device, the second section defining a second portion of the outer surface of the electronic device and configured to act as an antenna, and the bridging section structurally and conductively coupling the first section to the second section. The electronic device may further include a molding element positioned between the first section and the second section and defining a third portion of the outer surface of the electronic device.

Description

[0001] This application is a divisional application of a Chinese invention patent application filed with the Chinese National Patent Office on July 19, 2019, with the application number 201910655609.5, the priority dates of August 30, 2018 and November 7, 2018, and the invention title of "Electronic Device Housing with Integrated Antenna".

[0002] Cross - Reference to Related Applications

[0003] This patent application is a non - provisional patent application of U.S. Provisional Patent Application No. 62 / 725,227, titled "Electronic Device Housing with Integrated Antenna", filed on August 30, 2018, and claims the benefit of this U.S. provisional patent application. The entire disclosure of this U.S. provisional patent application is incorporated herein by reference. Technical Field

[0004] The described embodiments generally relate to electronic device housings, and more particularly, to housings including integrated antennas. Background Art

[0005] Electronic devices often use wireless communication to send and receive information. For example, tablet computers, mobile phones, and laptop computers all use radio devices to send and receive information. In some cases, a device may use multiple different antennas to assist with wireless communication in different frequency bands. The antennas may be positioned inside the electronic device housing and may send and receive wireless signals (e.g., electromagnetic waves) through the device housing. Summary of the Invention

[0006] An electronic device may include a display, a housing member at least partially surrounding the display and including a first section, a second section, and a bridging section. The first section defines a first part of the outer surface of the electronic device, the second section defines a second part of the outer surface of the electronic device and is configured to act as an antenna, and the bridging section structurally and conductively couples the first section to the second section. The electronic device may further include a molding element positioned between the first section and the second section and defining a third part of the outer surface of the electronic device.

[0007] The first section, the second section, and the bridging section may be formed from a single piece of metal. The first section, the second section, and the bridging section may include a conductive material, and the molding element may be a non - conductive polymer material. The first section may define the rear wall of the electronic device, and the second section may define the side wall of the electronic device. The molding element may at least partially encapsulate the bridging section.

[0008] The electronic device may further include an antenna circuit, which is coupled to the second section and configured to process signals corresponding to a wireless communication protocol. The length of the second section may correspond to the wavelength of the wireless communication protocol.

[0009] An electronic device may include a display, a cover assembly defining at least a portion of the front surface of the electronic device, a touch sensor configured to detect a touch input applied to the front surface of the electronic device, and a housing member at least partially encapsulating the display and the touch sensor. The housing member may include a first section defining a first portion of the rear surface of the electronic device, a second section coupled to the first section and defining a second portion of the rear surface of the electronic device, and a recess formed along the inner side of the second section. The recess may be configured to adjust the capacitive coupling between the first section and the second section. The electronic device may further include a molding element and an antenna circuit coupled to the second section, the molding element being positioned between the first section and the second section and defining a third portion of the rear surface of the electronic device. The second section may be set apart from the first section by a slit, and the molding element may be positioned in the slit.

[0010] The second section may define a protrusion extending into the internal volume of the electronic device, the recess may be one of a series of recesses formed in the protrusion, the protrusion may define at least a portion of a mounting surface, and the cover assembly may be attached to the mounting surface. The series of recesses may extend along the entire length of the second section.

[0011] The molding element may be a first molding element, and the electronic device may further include an additional molding element within the recess of the series of recesses. The additional molding element may define an additional portion of the mounting surface.

[0012] The recess may define an interlocking feature, the electronic device may further include an additional molding element positioned within the recess and engaging the interlocking feature, and the engagement between the additional molding element and the interlocking feature may restrict the movement of the additional molding element in multiple directions.

[0013] An electronic device may include a display, a cover located on the display and defining at least a portion of the front surface of the electronic device, and a conductive housing member defining at least a portion of a rear wall opposite the front surface. The conductive housing member may include a first section defining a first portion of the rear wall of the electronic device and a second portion of the rear wall, the second portion extending along a slit formed in the housing member and having a reduced thickness relative to the first portion of the rear wall. The conductive housing member may further include a second section configured to act as an antenna, the second section defining a third portion of the rear wall and a fourth portion of the rear wall, the fourth portion extending along the slit and having a reduced thickness relative to the third portion of the rear wall. The electronic device may further include a molding element positioned in the slit and defining a fifth portion of the rear wall.

[0014] A slit may be formed in the rear wall, the slit may define the length of the second section, and the length of the second section may correspond to the wavelength of the wireless communication frequency of the antenna. A second portion of the rear wall may define a first bevel, and a fourth portion of the rear wall may define a second bevel, and the first bevel and the second bevel adjust the capacitive coupling between the first section and the second section.

[0015] The conductive housing member may be a single piece of aluminum, and the first section and the second section may be connected by a bridging section defined by the single piece of aluminum. The first section may further define a first portion of the side wall of the electronic device, the second section may further define a second portion of the side wall, and the molded element further defines a third portion of the side wall between the first section and the second section.

[0016] The second section may define a protrusion extending into the internal volume of the electronic device, the protrusion may define a series of recesses configured to adjust the capacitive coupling between the second section and the display, the protrusion may define at least a portion of the mounting surface, and the cover is attached to the mounting surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0018] Figure 1A A front view of an exemplary electronic device is shown;

[0019] Figure 1B Shows Figure 1A a rear view of the electronic device;

[0020] Figure 1C Shows Figure 1A an exploded view of the electronic device;

[0021] Figures 1D to 1E Shows Figure 1A a partial view of the electronic device;

[0022] Figure 2A A front view of an exemplary housing for an electronic device is shown;

[0023] Figure 2B Shows Figure 2A a rear view of the housing;

[0024] Figure 3 A portion of the housing for an electronic device is shown;

[0025] Figure 4 Shows Figure 3 a partial cross-sectional view of the housing;

[0026] Figures 5A to 5CShows a partial cross-sectional view of an exemplary housing for an electronic device;

[0027] Figure 6 Shows a partial cross-sectional view of an exemplary housing for an electronic device;

[0028] Figure 7A Shows a portion of a housing for an electronic device;

[0029] Figure 7B Shows Figure 7A a partial cross-sectional view of the housing of;

[0030] Figure 7C Shows a portion of a housing member for an electronic device;

[0031] Figures 7D to 7E Shows Figure 7C a partial cross-sectional view of the housing of;

[0032] Figure 8 Shows a portion of a housing member for an electronic device;

[0033] Figure 9 Shows a partial cross-sectional view of a housing for an electronic device;

[0034] Figures 10A to 10B Shows an exemplary housing for an electronic device; and

[0035] Figure 11 Shows a schematic diagram of an exemplary electronic device. Detailed Description

[0036] Reference will now be made specifically to the representative embodiments shown in the drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred embodiment. Instead, it is intended to cover alternative forms, modifications, and equivalents that may be included within the spirit and scope of the described embodiments as defined by the appended claims.

[0037] In conventional portable electronic devices, an antenna may be positioned inside the housing. For example, in the case of a mobile phone (e.g., a smart phone) including a housing and a transparent cover, the antenna may be positioned in an internal cavity defined by the housing and the cover. The antenna may transmit and receive wireless signals (e.g., radio frequency (RF) electromagnetic signals) through the materials of the housing and / or the cover. To avoid or reduce attenuation of the input and output signals, the housing and / or the cover may be formed of a substantially non-conductive material such as plastic.

[0038] In some cases, it is desirable to use other housing materials. For example, a metal housing can be stronger, more resilient, easier to manufacture, etc. However, a housing that includes metal (or other conductive materials such as carbon fiber) or is formed of metal can have a shielding effect on internal antennas that reduces their efficiency and / or effectiveness. Thus, as described herein, in cases where the housing includes a conductive material such as metal, a portion of the housing itself can be used as an antenna to transmit and / or receive RF signals. More specifically, a metal or conductive housing can include a structure that serves both as a structural part of the housing (such as a sidewall) and as an RF radiation and / or receiving component. To act as an antenna, these structures may need to be separated from other conductive parts of the housing while still being structurally joined to other conductive parts of the housing.

[0039] As described herein, the antenna structure of a device can be integral with the housing (or a portion of the housing). For example, a single piece of metal can be machined or otherwise formed to include an antenna structure from the same piece of metal as the housing body. In some cases, the antenna structure can even define a structural part of the housing, such as a sidewall that defines the outer surface of the housing. For example, an integrated antenna structure can be formed by machining a slit (e.g., an elongate channel-shaped opening) in a housing member. The slit can form a beam-like cantilever member that extends from a main portion of the housing member. Figures 2A to 2B Illustrated is how a slit in a housing member can define an antenna structure.

[0040] Material can be positioned in the gap to seal the gap and structurally support the antenna structure. The housing and the antenna structure can also include interlocking features such as holes, dovetails, recesses, protrusions, etc., which are joined by a filler material to help hold the filler material in place and improve the overall structural strength of the housing and its antenna structure.

[0041] Since the integrated antenna structure can be close to other metal or conductive parts of the housing, the antenna structure can be capacitively coupled to the nearby housing (or other conductive components of the device such as a display or a circuit board), thereby reducing or otherwise negatively affecting the performance of the antenna. Thus, the antenna structure and / or housing described herein can include features that reduce the capacitive coupling between the antenna structure and adjacent portions of the housing (compared to antenna structures and / or housings that do not include such features). Such features can help regulate the capacitive coupling (e.g., can subject the antenna features to a capacitive coupling below a threshold level) without requiring a drastic increase in the spacing between the antenna and the housing or otherwise weakening the overall structure. For example, the nearby portions of the antenna structure and the housing can have chamfers, rounded edges, recesses, or other features or shapes that effectively remove material from the parts of the antenna and the housing that are closest to each other. This can ultimately regulate the capacitive coupling between these components, and / or the capacitive coupling between the antenna structure and any other conductive or potentially interfering components adjacent to the antenna structure.

[0042] As used herein, a feature that adjusts the capacitive coupling between an antenna structure and another component can cause the antenna structure to experience a capacitive coupling that is equal to or below a threshold level, or in other words, a reduced capacitive coupling relative to the same (or similar) antenna structure without that feature. The threshold level of capacitive coupling can be a level below which proper antenna functionality may not be achievable. For example, the threshold level of capacitive coupling can be a level at which the antenna cannot operate reasonably according to a target wireless communication protocol. The wireless communication protocol can include established protocols such as IEEE 802.11x, GSM, LTE, CDMA, TDMA, Bluetooth, Bluetooth Low Energy, ISO / IEC 18000-3, or any other target wireless communication protocol or standard (including protocols and / or standards yet to be developed). Additionally, when the antenna communicates via a wireless communication protocol or standard, the threshold level of capacitance can specify the antenna efficiency of the antenna (e.g., the electrical efficiency by which a radio antenna converts the radio frequency power received at its terminals into radiated power). For example, in some cases, the threshold level of capacitive coupling can be a threshold level that allows the antenna to operate according to the wireless communication protocol while achieving a target antenna efficiency.

[0043] Although in some cases herein, features that provide mechanical interlocking and reduce harmful capacitive coupling are described in the context of an integrated housing and antenna structure (e.g., a single-piece material), similar features, structures, and techniques can also be used for multi-part housings and antenna structures. For example, in the case where the antenna structure is a single-piece metal that is separate from the housing feature (e.g., as Figures 10A to 10B shown), the interlocking and capacitance reduction features described herein can be used to provide similar beneficial effects.

[0044] Figures 1A to 1B An electronic device is shown. In this example, the electronic device 100 includes a housing member formed of a single-piece conductive material (e.g., metal), and wherein the antenna is directly formed into the single-piece housing member. The electronic device 100 is depicted as a tablet computer, but this is only one exemplary embodiment of an electronic device, and the concepts discussed herein can equally or by analogy apply to other electronic devices, including mobile phones (e.g., smart phones), watches (e.g., smart watches), wearable electronic devices, laptop computers, desktop computers, health monitoring devices, head-mounted displays, digital media players (e.g., mp3 players), etc.

[0045] The electronic device 100 includes a housing, which may include an outer shell 102 and a transparent cover 106 (also simply referred to as the "cover") coupled to the outer shell 102. The cover 106 may define the front face of the electronic device 100. For example, in some cases, the cover 106 substantially defines the entire front face and / or front surface of the electronic device. The cover 106 may also define the input surface of the device 100. For example, as described herein, the device 100 may include a touch sensor and / or a force sensor that detects inputs applied to the cover 106. The cover 106 may be formed of, or include, glass, sapphire, polymer, dielectric, laminate, composite material, or any other suitable material or combination thereof.

[0046] The cover 106 ( Figure 1B ) may cover at least a portion of a display 107 that is at least partially positioned within the outer shell 102. The display 107 may define an output area for displaying graphical output. The graphical output may include a graphical user interface, user interface elements (e.g., buttons, sliders, etc.), text, lists, photos, videos, etc. The display 107 may include a liquid crystal display (LCD), an organic light emitting diode (OLED) display, or any other suitable component or display technology.

[0047] The display 107 may include or be associated with a touch sensor and / or a force sensor that extends along the output area of the display and may use any suitable sensing element and / or sensing technology. Using the touch sensor, the device 100 can detect touch inputs applied to the cover 106, including detecting the location of the touch input, the movement of the touch input (e.g., the speed, direction, or other parameters of a gesture applied to the cover 106), etc. Using the force sensor, the device 100 can detect the amount or magnitude of the force associated with a touch event applied to the cover 106. The touch sensor and / or the force sensor can detect various types of user inputs to control or modify the operation of the device, including tapping, swiping, multi-finger inputs, single-finger or multi-finger touch gestures, pressing, etc. This document describes touch sensors and / or force sensors that can be used with wearable electronic devices such as device 100. Figure 11

[0048] ​The housing 102 of device 100 may include molded elements 104 (e.g., 104-1, 104-2) positioned in gaps, spaces, slits, or other regions between portions of housing member 101. The molded elements 104 may, together with the housing member 101, define portions of the outer surface of device 100. The housing member 101 may be formed of or include a conductive material such as a metal (e.g., aluminum, steel, stainless steel, titanium, amorphous alloy, magnesium, or other metal or alloy), carbon fiber, etc. The molded elements 104 may be formed of or include a polymeric material, a reinforced polymeric material (e.g., a fiber-reinforced material), a ceramic, or any other suitable material, and may be formed of a substantially non-conductive material and / or an electrically insulating material, or otherwise configured to electrically (e.g., conductively and / or capacitively) isolate or insulate portions of the housing member 101 from one another, as described in more detail herein. In some cases, the molded elements 104 may be formed by injecting a material into gaps, spaces, slits, or other voids defined in the housing member 101.

[0049] As described herein, the housing member 101 may include a section that forms an antenna for an electronic device. For example, the housing member 101 may include a beam, a cantilever member, or other features that are (at least partially) separated from a main portion of the housing member by a gap, slit, or space. The molded element 104 may be positioned in the gap, slit, or space to fill the gap and enhance the antenna structure and the housing 102 as a whole. Figures 2A to 2B An exemplary housing is shown having a slit in which the molded element 104 may be positioned.

[0050] Figure 1B A rear view of device 100 is shown. Figure 1B An exemplary configuration of the housing member 101 and the molded element 104 is shown more clearly. The housing member 101 may define a first section 110, which may define a first portion of the outer surface of the electronic device. For example, the first section 110 may define at least a portion of the rear surface (and rear wall) of the electronic device. In some cases, the first section 110 defines substantially all of the rear surface of the electronic device, such as greater than about 80%, greater than about 90%, or greater than about 95% of the rear surface of the electronic device. As Figures 2A to 2B more clearly shown, the first section 110 may also define at least a portion of the side wall of device 100 (e.g., the lateral side wall of the device), and in some cases, may define portions of multiple side walls of the device (e.g., a portion of the top side wall and a portion of the left side wall, as Figure 2A shown).

[0051] The housing member 101 may also define a second section 112 (e.g., 112-1... 112-n). The second section 112 may also define a portion of one or more outer surfaces of the device 100. For example, the second section 112 may define a portion of the rear surface of the device 100 and a portion of the side surface of the device 100. In some cases, the second section 112 defines at least a portion of the side walls (e.g., top side wall and bottom side wall) of the device 100 and at least a portion of the rear wall of the device 100. Figures 5A to 5C A cross-sectional view is shown which shows how the second section can define at least a portion of the rear wall and at least a portion of the side walls of the device.

[0052] The second section 112 may also define a corner of the device 100. For example, the second section 112-2( Figure 1C ) defines a portion of the first side wall 126 of the device 100 and a portion of the second side wall 128 of the device 100. Other second sections 112 of the device may similarly define portions of at least two side walls of the device 100, as shown.

[0053] As described herein, the second section 112 may be integral with the first section 110. In other words, the housing member 101 may be a single unitary part, and the first section 110 and the second section 112 may be parts of the single unitary part. One or more of the second sections in the second section 112 may be configured to act as an antenna for the device 100.

[0054] The molding element 104 located in the space or gap between the first section 110 and the second section 112 may also define a portion of the outer surface of the electronic device. For example, one or more of the first section 110, one or more of the second sections in the second section 112, and one or more of the molding elements in the molding element 104 may define a single continuous outer surface of the device. In some cases, the single continuous surface may be the rear surface 114 or the side surface of the device 100. The single continuous surface defined by these three components may be (or appear to the user as) substantially smooth and / or seamless. For example, the interface between adjacent components may be smooth or tight enough such that the user cannot tactilely perceive or feel any gaps, cracks, grooves, depressions, protrusions, or other surface irregularities when touching the device.

[0055] The shape, size, location, or other dimension or property of the second section 112 can be selected based on several factors. In the case where the second section 112 (or a portion thereof) is configured as an antenna structure (e.g., a structure for transmitting and / or receiving wireless communication signals), it can have a length corresponding to the wavelength of the wireless communication protocol. In some cases, the length of the second section 112 (or the portion configured as an antenna structure) can be equal to the wavelength of the frequency band of the wireless communication protocol (e.g., a full-wave antenna). In other cases, it can correspond to a fractional or harmonic frequency of the frequency band. For example, the length can be half of the wavelength (e.g., a half-wavelength antenna), or a quarter of the wavelength (e.g., a quarter-wavelength antenna), or any other suitable length that facilitates communication through the desired frequency band. The wireless communication protocol can use frequency bands around 2.4 GHz, 5 GHz, 15 GHz, 800 MHz, 1.9 GHz, or any other suitable frequency band. As used herein, a frequency band can include the frequency at the nominal frequency of the frequency band as well as additional frequencies near the nominal frequency. For example, an antenna structure configured to communicate using the 2.4 GHz frequency band can receive and / or transmit signals in the range from approximately 2.4000 GHz to approximately 2.4835 GHz (or in any other suitable range). Other frequency bands can also include a range of nearby frequencies, and antennas configured to communicate via these frequency bands are also capable of transmitting and receiving frequencies within these ranges.

[0056] The length of the second section 112 can correspond to the length of the section from the base (where the second section joins the remainder of the housing member 101) to the end of the section (e.g., the terminal end separated from the remainder of the housing member 101). The second section 112 configured to operate as an antenna can be coupled to an antenna circuit that is configured to process signals corresponding to the wireless communication protocol. Exemplary antenna circuits can include a processor, an inductor, a capacitor, an oscillator, a signal generator, an amplifier, etc.

[0057] Figure 1C is shown Figure 1AExploded view of device 100, which shows the cover 106 removed from the housing 102. The display 107 can be positioned below the cover 106 and within the housing 102. The display 107 can include various display components, such as a liquid crystal display (LCD) component, one or more light sources (e.g., light emitting diodes (LEDs), organic light emitting diodes (OLEDs)), filter layers, polarizers, light diffusers, covers (e.g., glass or plastic cover sheets), etc. The display 107 can integrate (or the device 100 can otherwise include) a touch sensor and / or a force sensor. Using the touch sensor, the device 100 can detect touch inputs applied to the cover 106, including detecting the location of the touch input, the movement of the touch input (e.g., the speed, direction, or other parameters of a gesture applied to the cover 106), etc. Using the force sensor, the device 100 can detect the amount or magnitude of the force associated with a touch event applied to the cover 106. The force sensor can be configured to produce an electrical response corresponding to the amount of force applied to the cover 106. The electrical response can increase continuously as the amount of force applied increases, and thus can provide non-binary force sensing. Thus, the force sensor can determine one or more attributes of the applied force associated with a touch input based on the electrical response of the force sensing component. The touch sensor and / or the force sensor can detect various types of user inputs to control or modify the operation of the device, including taps, swipes, multi-finger inputs, single-finger or multi-finger touch gestures, presses, etc.

[0058] The device 100 can also include internal components. The internal components (shown as boxes for clarity) can include any suitable components of the device, including a processor, a memory, a haptic actuator, circuits, circuit boards, imaging devices, cameras, batteries, input devices, radios, communication circuits, light sources, etc. The internal components can be positioned within the internal volume of the electronic device, which can be defined at least in part by the housing 102 (which can form a cavity defined by the rear wall and side walls of the housing 102) and the cover 106.

[0059] Figure 1D A partial view of the housing 102 is shown, which corresponds to the first corner of the housing 102 (e.g., the upper left corner of the housing 102 as oriented in Figure 1B ). Figure 1DShows how a second section 112 (e.g., second section 112-2) can be electrically connected to an antenna circuit to receive and / or transmit wireless communication signals. For example, the antenna circuit can be connected to the second section 112-2 at a first connection point 120 and a second connection point 122. In some cases, the first connection point 120 is coupled to an electrical ground, and the second connection point 122 is coupled to an antenna feed (e.g., an electromagnetic signal source that sends a wireless signal to the second section 112-2, and / or a circuit that receives and / or analyzes the electromagnetic signal received by the second section 112-2). A conductive path 129 can be defined between the connection points 120, 122, and the conductive path 129 corresponds to the conductive path of an electromagnetic component corresponding to the wireless communication signal being transmitted or received.

[0060] As described above, the molded element 104-1 can be formed of a dielectric material, such as a polymer, a fiber-reinforced polymer, various polymers, etc. The molded element 104-1 can electrically isolate the second section 112-2 from the first section 110 at least along the length of the second section 112-2. Thus, the molded element 104-1 helps to define the conductive path 129 and isolate the conductive path 129 to the second section 112-2, allowing the second section 112-2 to act as an antenna.

[0061] Figure 1D Also shown is another second section 112-5 that can operate as an antenna. For example, similar to that discussed above with respect to the second section 112-2, the antenna circuit can be connected to the second section 112-5 at a first connection point 130 and a second connection point 132. In some cases, the first connection point 130 is coupled to an electrical ground, and the second connection point 132 is coupled to an antenna feed (e.g., an electromagnetic signal source that sends a wireless signal to the second section 112-5, and / or a circuit that receives and / or analyzes the electromagnetic signal received by the second section 112-5). A conductive path 133 can be defined between the connection points 130, 132, and the conductive path 133 corresponds to the conductive path of an electromagnetic component corresponding to the wireless communication signal being transmitted or received.

[0062] Figure 1D An exemplary configuration of two of the second sections 112 defined by the housing member 101 is shown. Similar configurations can be used for other second sections 112 of the housing member 101 to allow those second sections 112 to act as antennas. In some cases, the lengths of the second sections 112 (and / or the lengths of the slots that at least partially define the second sections 112) can be different from each other, or can otherwise be configured to communicate using different frequencies, frequency bands, wireless communication protocols, etc. For example, Figure 1DThe second section 112-2 shown in [Figure] can be configured to operate on the 2.4 GHz and 5 GHz frequency bands, while another second section 112 (e.g., the second section 112-1, Figure 1C ) can be configured to operate on the 800 MHz frequency band (including the appropriate range of nearby frequencies as described above). In some cases, one second section 112 can operate on multiple frequency bands, while another second section 112 can operate on a single frequency band. In this way, different wireless communication functions can be provided by different second sections 112. For example, one second section 112 can be configured as a WiFi antenna, while another second section is configured as a cellular antenna (e.g., communicating with a telecommunications provider via a cellular telecommunications network).

[0063] Figure 1E Another partial view of the housing 102 is shown, which corresponds to the second corner of the housing 102 (e.g., the upper right corner of the housing 102 as oriented in [Figure]). Figure 1B Figure 1E Shows how the second section 112-1 can be electrically connected to the antenna circuit to receive and / or transmit wireless communication signals. For example, the antenna circuit can be connected to the second section 112-1 at the first connection point 134 and the second connection point 135. In some cases, the first connection point 134 is coupled to an electrical ground, and the second connection point 135 is coupled to an antenna feed (e.g., an electromagnetic signal source that sends a wireless signal to the second section 112-1, and / or a circuit that receives and / or analyzes the electromagnetic signal received by the second section 112-1). A conductive path 136 can be defined between the connection points 134, 135, and the conductive path 136 corresponds to the conductive path of the electromagnetic component corresponding to the transmitted or received wireless communication signal.

[0064] As described above, different second sections 112 can be configured to communicate via different frequency bands and / or different wireless communication protocols. For example, Figures 1D to 1E each of the second sections 112-1, 112-2, and 112-5 shown in [Figure] can act as an antenna and can be configured to communicate via different frequency bands and / or wireless communication protocols.

[0065] Figure 2A A front view of the housing member 101 is shown, with the internal components of the device 100 and the molding element 104 removed. Figure 2A Shows the integral construction of the housing member 101. Specifically, the housing member 101 defines a first section 110 and a second section 112 (e.g., 112-1 – 112-4). The housing member 101 also defines a bridging section 202 (e.g., 202-1 …… 202-n) that structurally couples the second section 112 to the first section 110. Although Figure 2A ​Shows bridging sections 202-1 and 202-2 that couple second sections 112-1 and 112-2 to first section 110 respectively, but it should be understood that similar bridging sections may couple second sections 112-3 and 112-4 to first section 110. Bridging section 202 may be at least partially covered and / or encapsulated by molding element 104, as shown and described herein.

[0066] Bridging section 202 may also conductively couple second section 112 to first section 110. For example, in the case where housing member 101 is a single-piece metal, since all sections are formed from a single metal structure, bridging section 202 may structurally and conductively couple second section 112 to first section 110. In other cases, first section 110 and second section 112 may be separate components, and they may be structurally and conductively coupled to each other via a separate bridging section. In such cases, the bridging section may be attached to the first and second sections via welding, fasteners, rivets, posts, adhesives, interlocking, or any other suitable mechanism or technique.

[0067] Housing member 101 may define or include slit 204. Slit 204 may define second section 112 and set second section 112 apart from first section 110 (at least along the length of the slit). For example, slit 204 may define a section of housing member 101 that is at least partially separated from the remainder of housing member 101 (e.g., first section 110). As Figure 2A shown, slit 204 may be defined by various walls of housing member 101. For example, slit 204-3 forms an opening in side wall 206 of housing member 101 and in rear wall 208 of housing member 101. Additionally, slit 204 may define the length of second section 112, which may correspond to and / or define a particular wireless communication protocol that second section 112 is configured to communicate with. For example, the length of second section 112 (which may determine the frequency at which it resonates) may be equal to the length of the slit that defines second section 112, or may be equal to the length of second section 112 defined by the slit.

[0068] Figure 2B Shows a rear view of housing member 101. As Figure 2AAs shown, the second section 112 (e.g., 112-1–112-6) is coupled to the first section 110 via a bridging section 202 (e.g., 202-1–202-4). Notably, although the bridging section 202 connects the first section 110 to the second section 112, blind recesses 210 are formed in the housing member 101 along the bridging section 202. One or more blind recesses 210 may connect a number of slits (formed completely through the housing member 101) to form a single continuous opening along the rear and side walls of the device 100. Once the continuous opening is filled with a molding element (e.g., molding element 104-1, Figure 1B ), the molding element may extend over the bridging sections 202-1, 202-2 in a continuous unbroken line (e.g., filling the blind recess 210 extending over the bridging sections 202-1, 202-2). Thus, the bridging section 202 may be invisible from the outside of the device, and each of the molding elements 104 may appear as a continuous unbroken member.

[0069] Figure 3 A partial view of the housing 102 is shown, showing the housing member 101 having molding elements positioned in the slits defining the second sections 112-1 and 112-2. As described above, the second section 112 (or portions thereof) of the housing member 101 may be used as an antenna structure. Figure 3 Several features of the housing 102 are shown that facilitate the antenna function of the second section and facilitate a secure engagement between one or more molding elements and the housing member 101.

[0070] As Figure 3 shown, the housing member 101 includes second sections 112-1, 112-2, and 112-5 defined by slits formed in the housing member 101. The slits are occupied by the molding elements 104-1.

[0071] The second section 112-2 may define a first antenna structure 302, and the second section 112-5 may define a second antenna structure 303, and the second section 112-1 may define a third antenna structure 304, where each antenna structure is defined by a slit. For example, the first antenna structure 302 is at least partially defined by the slit 204-3, the second antenna structure 303 is defined by the slit 204-2, and the third antenna structure 304 is defined by a portion of the slit 204-1.

[0072] As described above, the conductor acting as the antenna may be adversely affected by nearby conductive materials. For example, the capacitive coupling between the first antenna structure 302 and the portion of the housing member 101 that spans the slit 204-3 from the first antenna structure 302 (e.g., the first section 110) can reduce the effectiveness of the first antenna structure 302. To adjust the capacitive coupling between the first antenna structure 302 and the housing member 101, the second section 112-2 may define one or more recesses 305 on the inner side of the second section 112-2 (e.g., recesses configured to be within the internal volume of the device 100 during device assembly). The inner side of the second section 112-2 may be opposite to the outer side of the second section 112-2, where the outer side of the second section 112-2 defines the outer surface of the device 100. The recesses 305 may be positioned along the convex portion of the second section 112-2, as Figure 4 shown in more detail. As Figure 3 shown, the plurality of recesses 305 that define a series of recesses 305 may be defined by the second section 112-2 along the slit 204-2. The series of recesses 305 may extend along substantially the entire length of the slit (and / or the entire length of the portion of the second section 112-2 that extends along the slit). Other antenna structures (e.g., antenna structures 303, 304) may include similar recesses 305, as Figure 3 shown.

[0073] The recesses 305 can adjust the capacitive coupling between the second section 112-2 of the housing member 101 and the first section 110 by (at least in the region where the recesses are formed) increasing the distance between the second section 112-2 and the first section 110, or increasing the distance between the second section 112-2 and any conductive component in the device that is close to (e.g., directly across from) the recesses 305 and can be capacitively coupled to the second section 112-2. More specifically, the capacitive coupling between two conductors can be reduced by increasing the distance between the two conductors. By forming the recesses 305 in the second section 112-2, as Figure 3As shown, compared to the case where the recess 305 is not included, a greater amount of the second section 112-2 is positioned farther from the first section 110 and / or another internal conductive component. In other words, the recess can increase the average distance between the second section 112-2 and the first section 110 (or between the second section 112-2 and another conductive material or component such as a display). Therefore, the capacitive coupling between the second section 112-2 and another component can be lower than in the case where the recess 305 is not included. More specifically, in some cases, the second section 112-2 can define a surface that faces or otherwise approaches the surface of another conductive material. The recess 305 can be formed along or within the surface of the second section 112-2 to increase the distance between the surfaces, thereby reducing the capacitive coupling. The recesses 305 can be empty, or they can be filled with a moldable material, which can be the same moldable material as that occupying the slit (e.g., slit 204-2).

[0074] The first section 110 can also include recesses. The recesses can also be used to adjust the capacitive coupling between the antenna structure and the first section 110 (e.g., to reduce the capacitive coupling relative to a section without a recess). Additionally, the recesses can act as retaining features that engage a molded element (e.g., molded element 104-1) positioned in the slit. Specifically, the recesses can define an undercut that prevents the molded element from separating from the recess. More specifically, as Figure 4 shown, the recesses can be pill-shaped or diamond-shaped recesses having an opening that is narrower than the width or widest dimension of the recess, which can also be referred to as an undercut or an undercut feature. Thus, once the moldable material is introduced into the recesses (and cured or otherwise hardened), the moldable material is captured in the recesses and is thus fixed (at least along some directions) to the first section 110. Of course, other shapes of the recesses can also be envisioned, such as dovetail, triangular, etc.

[0075] Although the features in Figure 3 have been described with reference to the first antenna structure 302 and the slit 204-2, it should be understood that similar features can also be applied to other parts of the housing member 101. For example, Figure 3 recesses 305 positioned along the slit 204-1 are also shown.

[0076] Figure 3An example of another feature portion that can provide an interlock function and some additional functions is also shown. Specifically, the housing member 101 (especially related to the first section 110) includes a protrusion feature portion 310. The protrusion feature portion 310 can take the form of a column extending from the first section 110. The protrusion feature portion 310 can be cylindrical, square, or any other suitable shape, and can have threads or be otherwise configured to receive fasteners or other components. A molded element (e.g., molded element 104-1) can surround, partially surround, or otherwise engage with the protrusion feature portion 310 such that the molded element is fixed to the protrusion feature portion 310. In addition to forming a structure for the molded element to structurally engage, the protrusion feature portion 310 also provides other functions. For example, the internal components of the device can be attached to the housing member 101 via the protrusion feature portion 310. For example, a circuit board, antenna, camera module, battery, sensor, ground conductor, etc. can be fixed to the housing member 101 using fasteners that engage the protrusion feature portion.

[0077] Figure 4 A detailed view of the housing member 101 is shown. Specifically, Figure 4 A portion of the second section 112-2 including a recess 305 is shown. As shown, the recess 305 can be formed in a protrusion 402 that extends into the internal volume of the electronic device. The recess 305 can be at least partially filled with or otherwise occupied by another material 400. In some cases, the material 400 filling the recess 305 can be the same as the molded element located in the slit between the first section 110 and the second section 112-2. In some cases, the recess 305 is filled during the same molding process that fills the slit defining the antenna structure of the device. For example, the housing member 101 can be inserted into the mold of a molding machine, and a moldable material can be injected into the mold such that the material flows into one or more slits, into the recess 305, and into and / or around one or more additional features, retention structures, recesses, protrusions, dovetails, holes, etc. This process is generally referred to as injection molding or insert molding. After the molding process is completed, the housing member 101 with the moldable material can be machined or otherwise processed to form the final shape of the housing 102. The machining process can separate portions of the moldable material into discrete components or workpieces. For example, in some cases, after the moldable material is applied to the housing member 101, the material in the recess 305 abuts the molded element 104-1 (which can be formed of a moldable material such as a polymer) located in the slit 204-2 ( Figure 2A ). After machining, the material in the recess 305 can be separated from the material in the slit.

[0078] As Figure 4As shown, the recess 305 can be configured to hold the material 400 within the recess 305. For example, the recess 305 can include chamfer features 404, 406, and the material 400 can engage the chamfer features 404, 406 to constrain the material 400 within the recess 305, thereby preventing it from leaving or disengaging from the recess 305. More specifically, the engagement between the material 400 and the chamfer feature 406 can prevent the material 400 from leaving or disengaging from the recess 305 in an upward direction (relative to Figure 4 the orientation shown), while the chamfer feature 404 can prevent the material 400 from leaving the recess 305 in a downward direction. Additionally, the recess 305 can have a narrowed region along the front face 408 of the protrusion 402, preventing the material 400 from leaving the recess 305 in a direction parallel to the protrusion 402 (e.g., parallel to the mounting surface 410 defined by the protrusion 402).

[0079] As described above, the recess 305 can be configured to adjust the capacitive coupling between the antenna structure (e.g., the first antenna structure 302 defined by the second section 112-2) and another part of the device (e.g., the first section 110, the display, the internal frame, etc.). Figure 4 It is shown how the current corresponding to the received or transmitted electromagnetic signal is restricted to the path 412, which is further towards the outer surface of the second section 112-2 (thereby moving the path 412 further away from other metal components, such as the first section 110, that can be capacitively coupled to the second section 112-2 and interfere with the antenna performance). If the recess 305 were not included and the protrusion 402 were instead a solid continuous metal section, the path 412 could be oriented closer to the face 408 of the protrusion 402 than Figure 4 shown, which could be used to increase the detrimental effects of other metal components or conductive components of the housing (e.g., by reducing the distance between the current path and other conductive components).

[0080] Figure 4 Additional features that can be formed in or otherwise defined by the housing member 101 are also shown. For example, the housing member 101 can include through-holes 414 and retention holes 416. The through-holes 414 and retention holes 416 are shown in the second section 112-2, but the same or similar features can be located at any other suitable location of the housing member 101.

[0081] The through-holes 414 can be configured to provide a passage through the housing member 101 for devices that require or benefit from exposure to the external environment. For example, the through-holes 414 can be positioned adjacent to a speaker or other audio output device to allow sound to be directed outside of the housing 102. The through-holes 414 can also provide environmental access (e.g., into the external environment surrounding the device) to other components such as microphones, pressure sensors, temperature sensors, or their components.

[0082] The retention hole 416 can be configured to receive a moldable material to provide strength and rigidity to the integral housing structure. For example, as described in more detail with respect to Figure 5A the retention hole 416 can be angled or otherwise configured to prevent the second section 112-2 from separating, breaking, or bending away from the first section 110 when a separating force is applied between the first section 110 and the second section 112-2. Figure 4 The molding element 104-1 is omitted for clarity, but it should be understood that the molding element 104-1 can fully or partially occupy the retention hole 416.

[0083] Figures 5A to 5C A partial cross-sectional view of an electronic device housing is shown, which shows additional details of the housing members and molding elements that can be implemented in various housing configurations. For example, Figure 5A a partial cross-sectional view of the housing 102 taken along line B-B in Figure 4 is shown, which shows an exemplary configuration of the retention hole 416. As shown, the retention hole 416 communicates with a slit (such as slit 204-3) in which the molding element 104-1 is located. The retention hole 416 is angled with respect to a horizontal axis (with respect to the orientation shown in Figure 5A ). This angle can help increase the strength of the second section 112-2 relative to the first section 110. For example, the engagement between the molding element 104-1 and the angled retention hole 416 can help prevent the second section 112-2 from being pulled away from the first section 110. In contrast, a non-angled retention hole (e.g., a horizontal hole) does not provide as much resistance to a separating force. In some cases, the retention hole 416 can also adjust the capacitive coupling between the second section 112-2 and the first section 110 by increasing the average distance between the second section 112-2 and the first section 110 in a manner similar to the recess 305 described above.

[0084] Figure 5A Another feature of the housing member 101 is also shown, which helps to adjust the capacitive coupling between different parts of the housing member 101 (e.g., between the second section 112-2 and the first section 110 that can act as an antenna). Specifically, the slit 204-3 can be between the first section 110 and the second section 112-2, and can define the length, width, and / or other dimensions or configurations of the second section 112-2 itself. The slit 204-3, particularly the walls defining the slit, can have a reduced thickness at the opening of the slit 204-3, which can reduce the capacitive coupling between the first section 110 and the second section 112-2 (relative to the walls in a region without the reduced thickness).

[0085] For example, as Figure 5AAs shown, the first section 110 may define a first portion 502 of the rear wall 208 of the housing 102, where the first portion 502 has a first thickness. The first section 110 may also define a second portion 504 of the rear wall 208, where the second portion 504 extends along the slit 204-3 and has a reduced thickness relative to the first portion 502 of the rear wall 208. Similarly, the second section 112-2 may define a third portion 506 of the rear wall, where the third portion 506 has a third thickness, and may also define a fourth portion 508 of the rear wall, where the fourth portion 508 has a reduced thickness relative to the third portion 506. As shown, portions 504, 508 (also referred to as reduced-thickness portions 504, 508) are defined by chamfer 511 formed into the housing member 101 along the first section 110 and the second section 112-2. In other embodiments, the reduced-thickness portions may be defined by other shapes (e.g., notches, recesses, etc.).

[0086] By reducing the thickness of the first section 110 and the second section 112-2 where they abut (e.g., along the slit 204-3), the amount or degree of capacitive coupling between the first section 110 and the second section 112-2 can be reduced compared to a configuration where the sections do not have a reduced thickness. As described above, in the case where the second section 112-2 operates as an antenna, this configuration can provide better antenna performance. More specifically, by reducing the facing area of the conductive materials facing each other across the slit 204-3, the capacitive coupling between the two conductive materials (here, the first section 110 and the second section 112-2) can be reduced. In some cases, the reduced-thickness portions 504, 508 extend over the entire length of the slit 204-3 (including any linear portions, curved portions, etc.). In some cases, each slit in the housing member defining the antenna portion may include a reduced-thickness portion along the length of the slit (e.g., the entire length of the slit).

[0087] Figure 5A Also shown is how the protrusion 402 and the molding material 400 cooperate to define a mounting surface 410. The mounting surface 410 may receive and / or support another component or assembly of the device. For example, a cover assembly (which may include a cover 106 and optionally one or more components such as a display, a touch sensor, a force sensor, etc.) may be positioned on the mounting surface 410. In some cases, the cover assembly (or any other suitable component) may be adhered to the mounting surface 410. In this case, an adhesive (e.g., a thermosensitive adhesive, a pressure-sensitive adhesive, a liquid adhesive, etc.) may be placed on the mounting surface 410 and / or the cover assembly, and the cover assembly may be placed on the mounting surface 410 and bonded thereto. The cover assembly may alternatively or additionally be fixed to the housing 102 by fasteners, clamps, latches, mechanical interlock structures, or any other suitable features or materials.

[0088] Figure 5B is a partial cross-sectional view of another housing 510. Figure 5B may represent a cross-section of housing 102 at a location different from the Figure 5A location shown (e.g., line C-C in Figure 4 ), or may represent a cross-section of a different housing. Housing 510 includes a first section 512 (which may be an embodiment of first section 110 or otherwise similar to first section 110) and a second section 513 (which may be an embodiment of second section 112-2 or otherwise similar to second section 112-2). The first section 512 and the second section 513 may define a slit 519 that separates the first section 512 and the second section 513 at least along the length of the slit 519. Housing 510 may also include a protrusion 518 on which components (e.g., a cover assembly) may be supported and / or adhered. As shown, the protrusion 518 may be defined only by the material of the second section 513 (at least at the location corresponding to the Figure 5B cross-section shown). Thus, there may be no recess filled with molding material. The outermost surface of the protrusion 518 may extend less towards the interior volume of the device than the outermost surface of the protrusion 402 ( Figure 4 ). In this way, the capacitive coupling between the protrusion 518 and other components within the electronic device can be adjusted to achieve target antenna performance, efficiency, resonant frequency, etc.

[0089] The first section 512 and the second section 513 may also define wall portions having reduced thicknesses 514, 516, respectively. The reduced thickness portions 514, 516 may provide functionality similar to that of the reduced thickness portions 504, 508 discussed with respect to Figure 5A . Housing 510 also includes a molding element 517 positioned in the slit 519. The molding element may correspond to any of the molding elements described herein, and thus such details of the molding element will not be repeated here. The molding element 517 may have a configuration (e.g., dimensions, thickness) different from that of the Figure 5A molding element shown. Additionally, the first section 512 and the second section 513 do not include retention features, such as blind holes 416 (at least at the location corresponding to the Figure 5B cross-section shown), and thus the molding element 517 does not have corresponding features to engage with the retention features. Of course, retention features, such as undercuts, threaded holes, blind holes (e.g., blind holes 416), etc. may be located at other locations on the housing 510.

[0090] Figure 5C is a partial cross-sectional view of another housing 520. Figure 5C may represent a cross-section of housing 102 at a location different from the Figure 5A location shown (e.g., Figure 4the line C-C therein), or may represent cross-sections of different outer shells. The outer shell 520 includes a first section 522 (which may be an embodiment of the first section 110 or otherwise similar to the first section 110) and a second section 523 (which may be an embodiment of the second section 112-2 or otherwise similar to the second section 112-2). The first section 522 and the second section 523 may define a slit 529 that separates the first section 522 and the second section 523 at least along the length of the slit 529. The outer shell 520 may also include a protrusion 528 on which components (e.g., a cover assembly) may be supported and / or adhered. As shown, the protrusion 528 may be defined only by the material of the second section 523 (at least at the position corresponding to Figure 5C the cross-section therein). Thus, there may be no recess filled with molded material. The outermost surface of the protrusion 528 may extend less towards the internal volume of the device than the outermost surface of the protrusion 402 ( Figure 4 ). In this way, the capacitive coupling between the protrusion 528 and other components within the electronic device can be adjusted to achieve the target antenna performance.

[0091] The first section 522 and the second section 523 may also define wall portions having reduced thicknesses 524, 526, respectively. The reduced-thickness portions 524, 526 may provide functionality similar to that of the reduced-thickness portions 504, 508 discussed with respect to Figure 5A . The outer shell 520 also includes a molded element 527 positioned in the slit 529. The molded element may correspond to any of the molded elements described herein, and thus such details of the molded element will not be repeated here.

[0092] The outer shell 520 shows alternative retaining features that may be included in the outer shell member to increase the strength, rigidity, toughness, or other structural properties of the outer shell 520 and / or increase the attachment strength of the molded element 527 to the outer shell member defining the first section 522 and the second section 523. For example, the second section 523 may define a blind hole 521. The blind hole 521 may be angled relative to the horizontal axis (relative to the Figure 5C orientation shown). Thus, the blind hole 521 may operate similarly to the blind hole 416 described above. However, compared to the blind hole 416, the blind hole 521 can extend at an angle different from that of the blind hole 416. For example, it may extend at a downward angle relative to the horizontal axis.

[0093] The first section 522 further includes a retention feature 525. The retention feature 525 can be formed into the first section 522 via any suitable process, such as machining, forging, etching, attaching a separate component to the first section 522, etc. The retention feature 525 can extend from the surrounding surface or portion of the first section 522, and the molding element 527 can at least partially surround, encapsulate, or otherwise engage the retention feature 525. The engagement between the molding element 527 and the retention feature 525 can increase the strength, rigidity, toughness, or other structural properties of the housing 520 and / or increase the attachment strength of the molding element 527 to the first section 522. The retention feature 525 can be a post, such as a cylindrical post, a square post, or a post of any other shape. In some cases, the retention feature 525 can have threads, grooves, splines, or other features that facilitate a secure engagement between the retention feature 525 and the molding element 527. In addition to or instead of the retention feature 525, other types of retention features, such as dovetails, holes, recesses, channels, undercuts, etc., can be used on the first section 522.

[0094] Figure 6 Partial cross-sectional view of housing 102 as viewed along Figure 3 line A-A in, which line extends through bridging section 202-2. Figure 6 Shows how the first section 110 and the second section can be joined together by a bridging section (e.g., bridging section 202-2 that joins the second section 112-2 to the first section 110). As described above, the housing member 101 can be a single-piece metal. Thus, the bridging section 202-2, the second sections 112-2, 112-5 ( Figure 3) and the first section 110 can be a single-piece uninterrupted metal (or any other suitable material). In some cases, one or more slits separating the first section 110 of the housing from one or more second sections continue through the bridging section 202-2. For example, although the molded element may appear uninterrupted along the rear wall of the housing, the slit in which the molded element is located does not completely cut off the first section 110 from the second section. Instead, blind recesses 602 can be formed in the bridging section 202-2 (and other bridging sections shown and described herein) such that the molded element 104-1 is a single continuous member. The blind recesses 602 can communicate with and substantially engage the slits 204-1 and 204-2. By forming the blind recesses 602 through the bridging section 202-2, the molded element 104-1 can be more robust and less likely to disengage from the housing member 101 due to the increased structural integrity resulting from the overall structure (as opposed to having smaller discontinuous molded elements separating the first section 110 from the second sections 112-2, 112-5, etc.). Additionally, the molded element 104-1 can at least partially encapsulate the bridging section 202-2. For example, the molded element 104-1 can be molded in the blind recesses 602 and around at least some sides of the bridging section 202-2, and optionally above the inward-facing side of the bridging section 202-2. This can further strengthen the coupling between the molded element 104-1 and the bridging section 202-2.

[0095] The blind recesses 602 can have a shape similar to that of the adjacent slits (e.g., slit 204-2 and / or slit 204-3). For example, the opening of the blind recess 602 along the rear surface 114 of the housing can have the same width as the adjacent portion of the slit 204 (which can have a constant or variable width along the length of the slit). This can result in a molded element having a uniform width dimension, as Figures 1A to 1C shown. Additionally, the blind recesses 602 can be defined by wall portions having a reduced thickness (such as the beveled edges Figures 5A to 5C described). In some cases, the blind recesses 602 in the bridging section 202-2 can be formed by one or more of the same tools and / or one or more machining operations used to form the slits 204. For example, a generally rectangular groove can be machined into the wall portion of the housing member 101, and then a beveled edge can be machined into the wall portion to define the reduced thickness portion, thereby forming the slit. In some cases, the tool used to form the beveled edge can be larger than the opening of the initial rectangular channel in one dimension and smaller than the opening in another dimension. For example, the tool can have a rectangular shape that can be inserted into the channel only when it is in one orientation (e.g., its long axis is parallel to the length of the channel). In such cases, the tool can be aligned so that its long axis is parallel to the channel, inserted into the channel, and then rotated to remove the material in the channel and form the reduced thickness portion (e.g., the beveled edge).

[0096] Figure 7A Partial view of housing 102, showing the protruding feature portions 310 of housing member 101 and how the molding element 104-1 engages the protruding feature portions 310. As shown, each of the protruding feature portions 310 includes an opening 702 within a post or other feature extending above the surface of the first section 110. The opening 702 may be threaded or otherwise configured to receive a fastener.

[0097] In some cases, the protruding feature portions 310 extend from the inner surface of the rear wall of the device. The molding element 104-1 may at least partially surround the protruding feature portions 310 and, in some cases, completely surround at least the outer circumference or perimeter of the protruding feature portions 310 (as shown), thereby securing the molding element 104-1 to the first section 110 of the housing member 101. More specifically, by at least partially surrounding the protruding feature portions 310, the molding element 104-1 helps prevent the molding element 104-1 from disengaging from the first section 110 at least in a direction parallel to the rear wall 208 of the housing 102 ( Figure 2A ).

[0098] Figure 7B is a partial cross-sectional view of housing 102 taken along line D-D in Figure 7A . As shown, the protruding feature portions 310 extend a height 706 above the inner surface 704 of the first section 110. Because the protruding feature portions 310 extend above the inner surface 704, the molding element 104-1 is able to at least partially surround or otherwise engage the protruding feature portions 310 to provide the above-described structural coupling. Additionally, as described above, by extending above the inner surface 704, the protruding feature portions 310 may help regulate the capacitive coupling between a component fastened to the housing 102 via the protruding feature portions 310 and the rear wall of the housing 102. For example, if the top surface 708 of the protruding feature portions 310 is flush with the inner surface 704 of the first section 110, a component fastened to the housing via the protruding feature portions 310 may be substantially flush with or in contact with the first section 110. This may create an undesirable capacitive coupling between the component and the first section 110. Because the protruding feature portions 310 are raised above the inner surface 704, the distance between the component coupled via the protruding feature portions 310 and the first section 110 can be increased, which can regulate the capacitive coupling between these components.

[0099] Figure 7AAlso shown is the area where the slit 204-2 extends through the side wall 206 of the housing member 101. As described above, the molding element 104-1 may occupy some or all of the opening 705 in the side wall 206, and the molding element 104-1 itself may define a part of the side surface of the housing 102 (e.g., together with the side wall defined by one or more second segments and / or one or more bridging segments to form a continuous side surface). The opening 705 may be part or a feature of a slit (e.g., the slit 204-2) in the housing member 101 that defines the second segment 112-5.

[0100] The second segment 112-5 and / or the side wall (which may be defined by the second segment and / or the bridging segment) may also define an interlocking feature adjacent to the opening 705. The molding element 104-1 may engage the interlocking feature to help strengthen the housing 102 in the area of the slit 204-2, which area is prone to being pried open or squeezed together due to the use and / or misuse of the device. The interlocking feature may include an opening, a recess, a post, an undercut, a hole, a thread, or a grooved feature, or any other suitable feature that the molding element 104-1 may engage to help hold the molding element 104-1 to the housing member 101.

[0101] Figure 7C A portion of the housing member 101 including the opening 704 is shown, which shows the housing without the molding element 104-1 and displays exemplary interlocking features. As shown, the second segment 112-5, which may be at least partially separated from the first segment 110 by the slit 204-2, includes a shelf feature 710 that defines an opening 712. Similarly, a corresponding interlock may define an opening 716. As Figures 7D to 7E shown in more detail, the molding element 104-1 may fill the openings 712, 716 and surround the shelf feature 710. As described herein, the interlocking engagement between the molding element 104-1 and the openings 712, 716 fixes the molding element 104-1 to the housing member 101 and increases the strength of the housing 102.

[0102] Figure 7D A partial cross-sectional view of the housing 102 taken along Figure 7A the line E-E is shown. Figure 7D Shown are the shelf feature 710 and the opening 712 in the shelf feature 710, and how the molding element 104-1 engages the shelf feature 710 and the opening 712.

[0103] Figure 7E A partial cross-sectional view of the housing 102 taken along Figure 7A the line F-F is shown. Figure 7Eshows the opening 716 and how the molding element 104-1 engages the shelf feature opening 716. As described above, the bridging section 202-1 may include a blind recess 602( Figure 6 ), which connects the slit 204-1 to the slit 204-2( Figure 2A ) and allows the molding element 104-1 to form a continuous and unbroken member along the rear wall 208 of the housing 102( Figure 2A ). As Figure 7E shown, the opening 716 may extend from the top surface 718 of the interlocking feature to the surface 720 that defines a part of the blind recess 602.

[0104] As described above, the capacitive coupling between the section of the housing member 101 that serves as an antenna and other sections of the housing may adversely affect the effectiveness, efficiency, or other operating properties of the antenna. Therefore, various features are used to adjust the capacitive coupling between such sections of the housing member 101. Figure 8 Another feature of the housing member 101 is shown, which reduces the capacitive coupling between the antenna structure and another section of the housing member 101. Specifically, Figure 8 the first section 110 and the second section 112-2 where the slit 204-3 is formed in the housing member 101 are shown.

[0105] The slit 204-3 may extend through the rear wall 208 of the housing member 101 and through the side wall 206 of the housing member. The slit 204-3 may define an opening 802 in the side wall 206 of the housing member 101. When the second section 112-2 serves as an antenna, the proximity of the end face 804 of the first section 110 to the second section 112-2 may result in capacitive coupling between the end face 804 and the first section 110. To help adjust the capacitive coupling between the end face 804 of the first section 110 and the second section 112-2, a recess 806 may be formed in the end face 804. The recess 806 may be a blind recess and may have any suitable depth. For example, the recess 806 may have a depth of about 0.5 mm, about 0.75 mm, about 1.0 mm, about 1.25 mm, about 1.5 mm, about 2.0 mm (e.g., measured from the end face 804) or any other suitable depth. In some cases, the recess may have a depth of about 5.0 mm or greater. In some cases, the recessed area of the end face 804 may be characterized by a percentage of the total area of the end face 804 (e.g., the surface area of the end face 804 if there is no recess in the end face 804). In some cases, the recessed area is equal to or greater than about 50%, about 60%, about 70%, about 80%, about 90%, or about 95% of the total area of the end face 804. By making most of the end face 804 recessed, the amount of the end face 804 close to the first section 110 can be reduced, thereby reducing the capacitive coupling between the second section 112-2 and the first section 110.

[0106] Figure 8 Also shown is an exemplary interlock feature 808 in a portion of the first section 110 formed on one side of the defined opening 802. The interlock feature 808 may include a shelf feature 812 that defines an opening 814 and an opening 815 in the housing member 101. The molding element 104-1 may engage the shelf feature 812 and the opening 814 in a manner similar to that described with respect to Figure 7C and Figure 7D the shelf feature 710 described above.

[0107] In some cases, the second section 112-2 defines a threaded hole 816 adjacent to the opening 802. Instead of the molding element 104-1 filling the threaded hole 816, the molding element 104-1 may define a corresponding through hole aligned with the threaded hole 816. A threaded fastener may be used to secure the molding element 104-1 to the second section 112-2, as shown in more detail with respect to Figure 9 shown more particularly.

[0108] Figure 9 An exemplary cross-sectional view of the housing 102 taken along line G-G in Figure 8 is shown. However, although Figure 8 only the housing member 101 is shown, Figure 9 also shown is the molding element 104-1 having a through hole 902 and a threaded fastener 904 that extends through the through hole 902 and engages the threaded hole 816 in the second section 112-2. The fastener 904 may include a head 906, and the molding element 104-1 may be captured between the head 906 and the second section 112-2. The force applied by the head 906 squeezes the molding element 104-1 between the head 906 and the second section 112-2, holding the molding element 104-1 to the second section 112-2 (and more generally to the housing member 101).

[0109] In other cases, the second section 112-2 defines an interlock feature that the molding element 104-1 engages, similar to other retention features described herein. For example, the second section 112-2 may define a hole, recess, threaded hole, post, protrusion, undercut, inclined hole, or any other suitable interlock feature, and the molding element 104-1 may engage these engagement features by at least partially filling, at least partially surrounding, or otherwise engaging and / or interlocking with the interlock feature to help hold the molding element 104-1 to the housing member 101.

[0110] The features and concepts described herein can be implemented in a device housing having an antenna structure formed in a one-piece housing member such as housing member 101. These features and concepts can also be implemented in a device housing in which a plurality of discrete components are joined together to define a housing such as Figures 10A to 10B the housing shown.

[0111] Figure 10A An exemplary housing 1000 for an electronic device (e.g., a tablet computer) is shown. Housing 1000 may be generally similar in shape to housing member 101 described herein, except that second section 1002 is a separate component from first section 1004. Second section 1002 may be secured to first section 1004 via a molding element (which may be the same as or similar to molding element 104 described herein). In some cases, first section 1004 and second section 1002 include interlocking and / or retaining features, and the molding element engages the interlocking and / or retaining features to hold second section 1002 to first section 1004. As described above, the molding element may be substantially non-conductive and may electrically isolate first section 1004 from second section 1002 while also mechanically engaging or holding second section 1002 to first section 1004. All or part of second section 1002 may be used as an antenna for the device, and first section 1004 and / or second section 1002 may include features for adjusting the capacitive coupling between the sections. For example, either first section 1004 and / or second section 1002 may include recesses such as recesses 305 and / or recess 806 described herein.

[0112] Figure 10B An exemplary housing 1010 for an electronic device (e.g., a tablet computer) is shown. While housing 1000 includes a first section 1004 that defines a rear wall of the device (and, together with second section 1002, defines a side wall of the device), housing 1010 may be a frame that substantially only defines the side walls of the device. The rear wall and the front wall may be defined by other members or components coupled to housing 1010, such as a transparent cover (e.g., glass, plastic, sapphire, polycarbonate, etc.), a plate (formed of metal, plastic, composite material, and / or other materials), etc. In some cases, both the front wall and the rear wall may be defined by a transparent cover, and one or both of the front wall and the rear wall may have a display therebelow (e.g., a touch-sensitive display and / or a force-sensitive display, or a display without sensors).

[0113] The housing 1010 may include sections 1012 that can be secured together via one or more molding elements (which may be the same as or similar to the molding elements 104 described herein). In some cases, the sections 1012 include interlocking and / or retention features, and one or more molding elements engage the interlocking and / or retention features to hold the sections 1012 together. As described above, the molding elements may be substantially non-conductive and may electrically isolate adjacent sections 1012 from each other while also mechanically engaging or holding adjacent sections 1012 together. All or part of the sections 1012 may be used as an antenna of the device, and the sections 1012 may include features that adjust the capacitive coupling between the sections, or between a given section 1012 and another component of the device (such as another housing member, a structural frame, an internal circuit, or other electronic components, etc.). For example, any of the sections 1012 may include recesses, such as the recesses 305 and / or recesses 806 described herein.

[0114] Figure 11 An exemplary schematic diagram of an electronic device 1100 is shown. For example, Figure 11 the device 1100 may correspond to Figures 1A to 1D the electronic device 100 shown (or any other electronic device described herein). Where multiple functions, operations, and structures are disclosed as being part of, incorporated into, or performed by the device 1100, it should be understood that various embodiments may omit any or all of such described functions, operations, and structures. Thus, different embodiments of the device 1100 may have some or all or none of the various capabilities, means, physical characteristics, modes, and operating parameters described herein.

[0115] The device 1100 includes one or more processing units 1101 configured to access a memory 1102 on which instructions are stored. The instructions or computer programs may be configured to perform one or more of the operations or functions described with respect to the device 1100. For example, the instructions may be configured to control or coordinate the operation of one or more displays 1108, one or more touch sensors 1103, one or more force sensors 1105, one or more communication channels 1104, one or more cameras 1111, one or more sensors 1112, and / or one or more haptic feedback devices 1106.

[0116] Figure 11The processing unit 1101 can be implemented as any electronic device capable of processing, receiving, or sending data or instructions. For example, the processing unit 1101 can include one or more of the following: a microprocessor, a central processing unit (CPU), an application specific integrated circuit (ASIC), a digital signal processor (DSP), or a combination of such devices. As used herein, the term "processor" is intended to cover a single processor or processing unit, multiple processors, multiple processing units, or one or more other suitably configured computing elements.

[0117] The memory 1102 can store electronic data that can be used by the device 1100. For example, the memory can store electronic data or content, such as, for example, audio and video files, images, documents and applications, device settings and user preferences, timing and control signals or data for various modules, data structures, or databases, and the like. The memory 1102 can be configured as any type of memory. By way of example only, the memory can be implemented as random access memory, read only memory, flash memory, removable memory, other types of storage elements, or a combination of such devices.

[0118] The touch sensor 1103 can be configured to determine the location of a touch on the touch-sensitive surface of the device 1100 (e.g., the input surface defined by the cover 106). The touch sensor 1103 can use any suitable components and can rely on any suitable phenomenon to detect a physical input. For example, the touch sensor 1103 can use or include a capacitive sensor, a resistive sensor, a surface acoustic wave sensor, a piezoelectric sensor, a strain gauge, and the like. The touch sensor 1103 can include any suitable components for detecting touch-based inputs and generating signals or data that can be accessed using processor instructions, including electrodes (e.g., electrode layers), physical components (e.g., substrates, spacer layers, structural supports, compressible elements, etc.), processors, circuits, firmware, and the like. In some cases, the touch sensor 1103 associated with the touch-sensitive surface of the device 1100 can include a capacitive array of electrodes or nodes operating according to a mutual capacitance or self-capacitance scheme. The touch sensor 1103 can be integrated with one or more layers of the display stack (e.g., the display 107) to provide the touch-sensing functionality of a touch screen. The touch sensor 1103 can operate in cooperation with the force sensor 1105 to generate signals or data in response to a touch input.

[0119] The force sensor 1105 can detect various types of force-based inputs and generate signals or data that can be accessed using processor instructions. The force sensor 1105 can use any suitable components and can rely on any suitable phenomenon to detect physical inputs. For example, the force sensor 1105 can be a strain-based sensor, a piezoelectric-based sensor, a piezoresistive-based sensor, a capacitive sensor, a resistive sensor, etc. The force sensor 1105 can include any suitable components for detecting force-based inputs and generating signals or data that can be accessed using processor instructions, including electrodes (e.g., electrode layers), physical components (e.g., substrates, spacer layers, structural supports, compressible elements, etc.), processors, circuits, firmware, etc. The force sensor 1105 can be used with various input mechanisms to detect various types of inputs. For example, the force sensor 1105 can be used to detect presses or other force inputs that meet a force threshold (which can represent a more forceful input than a typical input of a standard "touch" input). Similar to the touch sensor 1103, the force sensor 1105 can be integrated with any part of the device 1100 or otherwise configured to detect force inputs applied to any part of the device. The force sensor 1105 can be integrated with one or more layers of the display stack (e.g., the display 107) to provide force sensing functionality for a touch screen.

[0120] The device 1100 can also include one or more haptic devices 1106. The haptic devices 1106 can include one or more of a variety of haptic technologies, such as but not limited to rotary haptic devices, linear actuators, piezoelectric devices, vibration elements, etc. Generally, the haptic devices 1106 can be configured to provide intermittent and distinct feedback to a user of the device. More specifically, the haptic devices 1106 can be adapted to produce tapping or clicking sensations and / or vibration sensations. Such haptic outputs can be provided in response to detecting touch and / or force inputs and can be imparted to the user through the outer surface of the device 1100 (e.g., via glass or other surface that serves as a touch-sensitive and / or force-sensitive display or surface).

[0121] One or more communication channels 1104 may include one or more wireless interfaces adapted to provide communication between one or more processing units 1104 and external devices. Generally, one or more communication channels 1104 may be configured to transmit and receive data and / or signals that may be interpreted by instructions executed on processing unit 1101. In some cases, the external device is part of an external communication network configured to exchange data with the wireless device. Generally speaking, wireless interfaces may include, but are not limited to, radio frequency, optical, acoustic, and / or magnetic signals, and may be configured to operate over a wireless interface or protocol. Exemplary wireless interfaces include radio frequency cellular interfaces, fiber optic interfaces, acoustic interfaces, Bluetooth interfaces, infrared interfaces, USB interfaces, Wi-Fi interfaces, TCP / IP interfaces, network communication interfaces, or any conventional communication interface. Communication channel 1104 may be configured to use components of the device housing (e.g., the second section 112) as an antenna to transmit and / or receive wireless communication.

[0122] As Figure 11 shown, device 1100 may include a battery 1107 for storing electricity and providing power to other components of device 1100. Battery 1107 may be a rechargeable power source configured to provide power to device 1100 while the device 1100 is being used by a user.

[0123] Device 1100 may also include one or more displays 1108. Display 1108 may use any suitable display technology, including liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), active matrix organic light emitting diode displays (AMOLEDs), etc. If display 1108 uses LCD technology, display 1108 may also include a backlight component that may be controlled to provide variable display brightness levels. If display 1108 includes OLED or LED technology, the brightness of display 1108 may be controlled by modifying the electrical signals provided to the display elements. Display 1108 may correspond to any of the displays shown or described herein (e.g., display 107).

[0124] Device 1100 may also include one or more additional sensors 1112 to receive input (e.g., from a user or another computer, device, system, network, etc.) or to detect any suitable attributes or parameters of the device, the environment surrounding the device, people or objects interacting with (or near) the device, etc. For example, the device may include an accelerometer, a temperature sensor, a position / orientation sensor, a biometric sensor (e.g., a fingerprint sensor, a spectrometer, a blood oxygen sensor, a blood glucose sensor, etc.), an eye tracking sensor, a retina scanner, a humidity sensor, buttons, switches, an eyelid closure sensor, etc.

[0125] In reference Figure 11To the extent that the various functions, operations, and structures described are disclosed as being part of, incorporated into, or performed by device 1100, it should be understood that various embodiments may omit any or all of such described functions, operations, and structures. Thus, different embodiments of device 1100 may have some or all or none of the various capabilities, means, physical characteristics, modes, and operating parameters described herein.

[0126] For purposes of illustration, the foregoing description uses specific names to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that the described embodiments may be practiced without specific details. Thus, the foregoing description of the specific embodiments described herein is presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art in light of the above teachings. Additionally, when used herein to refer to the position of components, the terms above and below or their synonyms do not necessarily refer to an absolute position relative to an external reference, but rather to the relative position of the components with respect to the drawings.

Claims

1. An electronic device, comprising: a display; a cover member, disposed over the display and defining at least a portion of the front surface of the electronic device; and a housing, comprising: a first metal section, defining a portion of the rear surface of the electronic device; a second metal section, defining: a first portion of the top side surface of the electronic device; and a first portion of the first lateral side surface of the electronic device; a third metal section, defining: a second portion of the top side surface of the electronic device; and a first portion of the second lateral side surface of the electronic device; and a molded element, formed of a polymeric material and positioned between the first metal section and the second metal section and between the first metal section and the third metal section, and defining: a second portion of the first lateral side surface of the electronic device; a second portion of the second lateral side surface of the electronic device; and a third portion of the top side surface of the electronic device.

2. The electronic device according to claim 1, wherein the second metal section is configured to act as an antenna.

3. The electronic device according to claim 2, wherein: the antenna is a first antenna; and the third metal section is configured to act as a second antenna.

4. The electronic device according to claim 3, wherein: the housing defines a slit extending through the rear surface; the slit defines the length of the second metal section; and the length of the second metal section corresponds to the wavelength of the radio communication frequency of the antenna.

5. The electronic device according to claim 4, wherein: the slit is a first slit; the radio communication frequency is a first radio communication frequency; the housing further defines a second slit extending through the rear surface, the second slit having a length different from that of the first slit; the second slit defines the length of the third metal section; and the length of the third metal section corresponds to the wavelength of a second radio communication frequency, the second radio communication frequency being different from the first radio communication frequency.

6. The electronic device according to claim 1, wherein: the housing is a single piece of aluminum; the first metal section and the second metal section are connected by a first bridging section defined by the single piece of aluminum; and the first metal section and the third metal section are connected by a second bridging section defined by the single piece of aluminum.

7. The electronic device according to claim 1, wherein the second metal section is longer than the first metal section.

8. An electronic device, comprising: a display; a cover assembly, defining at least a portion of the front surface of the electronic device; a touch sensor, configured to detect a touch input applied to the front surface of the electronic device; a housing, at least partially surrounding the display and the touch sensor, and comprising: a first conductive section, defining a first portion of the rear surface of the electronic device; a second conductive section, defining: a first portion of the first lateral side surface of the electronic device; and a first portion of the top side surface of the electronic device; a third conductive section, coupled to the first conductive section and defining: a first portion of a second side surface of the electronic device; and a second portion of a top side surface of the electronic device, the second portion of the top side surface being longer than the first portion of the top side surface; and a non-conductive molding element positioned in: a first slit defined between the first conductive section and the second conductive section; and a second slit defined between the first conductive section and the third conductive section, the non-conductive molding element defining a second portion of a first side surface of the electronic device, a second portion of a second side surface of the electronic device, and a second portion of a rear surface of the electronic device; and an antenna circuit coupled to the second conductive section.

9. The electronic device according to claim 8, wherein the housing further comprises: a first bridging section that structurally and conductively couples the first conductive section to the second conductive section; and a second bridging section that structurally and conductively couples the first conductive section to the third conductive section.

10. The electronic device according to claim 9, wherein the first conductive section, the second conductive section, the third conductive section, the first bridging section, and the second bridging section are formed from a single piece of metal.

11. The electronic device according to claim 9, wherein: the housing further comprises a fourth conductive section that is structurally and conductively coupled to the first conductive section through the first bridging section; the antenna circuit is a first antenna circuit; and the electronic device further comprises a second antenna circuit coupled to the fourth conductive section.

12. The electronic device according to claim 8, further comprising: an electrical ground coupled to a first location of the second conductive section; and an antenna feed coupled to a second location of the second conductive section.

13. The electronic device according to claim 8, wherein: the antenna circuit is a first antenna circuit configured to process signals corresponding to a first wireless communication protocol; and the electronic device further comprises a second antenna circuit coupled to the third conductive section and configured to process signals corresponding to a second wireless communication protocol different from the first wireless communication protocol.

14. An electronic device, comprising: a display; a housing member at least partially surrounding the display and comprising: a first conductive section defining a first portion of a rear wall of the electronic device; a second conductive section configured to act as an antenna and defining: a corner of the housing member; a first portion of a first side wall of the electronic device; and a first portion of a second side wall of the electronic device, the second side wall joining the first side wall at the corner of the housing member; and a molded non-conductive element defining: a second portion of the rear wall of the electronic device; a second portion of the first side wall of the electronic device; and a second portion of the second side wall of the electronic device.

15. The electronic device according to claim 14, wherein the housing member further defines a bridging section that structurally and conductively couples the first conductive section to the second conductive section.

16. The electronic device according to claim 15, wherein the first conductive section, the second conductive section, and the bridging section are formed from a single piece of metal.

17. The electronic device according to claim 15, wherein the molded non-conductive element at least partially encapsulates the bridging section.

18. The electronic device according to claim 14, wherein the electronic device further includes an antenna circuit coupled to the second conductive section and configured to process signals corresponding to a wireless communication protocol.

19. The electronic device according to claim 18, wherein the length of the second conductive section corresponds to the wavelength of the wireless communication protocol.

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