Novel package design for dual-sided cooling on laser chips
By using thermal interposers and air-cooling heat sinks in the laser chip packaging, double-sided cooling of the laser chip is achieved, solving the complexity and high cost of single-sided cooling solutions, and achieving efficient and economical temperature control.
CN114389142APending Publication Date: 2022-04-22INTEL CORP
0 Cites 4 Cited by
Patent Information
- Application Number
- CN202111088680.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2020-10-21
- Filing Date
- 2021-09-16
- Publication Date
- 2022-04-22
AI Technical Summary
Technical Problem
Existing laser chip packages can only be cooled on one side, resulting in complex and expensive cooling solutions that cannot effectively utilize the double-sided cooling potential of the chip.
Method used
Double-sided cooling of the laser chip is achieved by replacing wire bonds with thermally conductive interposers, combining air-cooled heat sinks and thermoelectric cooling devices to provide cooling paths from the bottom and top surfaces of the chip.
Benefits of technology
Lowering the temperature of the laser chip simplifies the cooling solution, reducing cost and complexity while enabling efficient double-sided cooling.
✦ Generated by Eureka AI based on patent content.
Abstract
Embodiments disclosed herein include a dual-sided cooling architecture for laser packages. In an embodiment, an electronic package includes a package substrate and a laser chip attached to the package substrate. In an embodiment, a laser chip has a first surface and a second surface opposite the first surface. In an embodiment, an interposer is disposed over a laser chip, where the interposer is suspended over an edge of the laser chip. In an embodiment, the electronic package also includes an interconnect between the interposer and the package substrate.
Need to check novelty before this filing date? Find Prior Art