Manufacturing apparatus of display device and manufacturing method of display device

Abstract

Disclosed are a manufacturing apparatus of a display device and a manufacturing method of a display device, the manufacturing apparatus of a display device including: a worktable to support a target substrate including a first voltage application pad electrically connected with a first probe; a first guide rail fixed to a lower surface of the worktable and moving together with the worktable; a first slip ring module arranged below the first guide rail and not moving together with the worktable; and the first probe fixedly arranged on an end side surface of the worktable in a first direction and electrically connected to the first guide rail moving together with the worktable, wherein a first voltage for forming an electric field is generated in the first slip ring module, the first slip ring module is electrically connected with the first guide rail to apply the first voltage generated by the first slip ring module to the first guide rail, and the first voltage applied to the first guide rail is provided to the first voltage application pad through the first probe.

Description

Technical Field

[0001] This invention relates to a manufacturing apparatus for a display device and a manufacturing method for a display device. Background Technology

[0002] With the development of multimedia technology, the importance of display devices is increasing. Correspondingly, various types of display devices, such as Organic Light Emitting Display (OLED) and Liquid Crystal Display (LCD), have been put into use.

[0003] Devices for displaying images as display devices include display panels such as organic light-emitting display panels or liquid crystal display panels. The light-emitting display panel may include light-emitting elements, such as organic light-emitting diodes (OLEDs) that use organic materials as fluorescent materials, and inorganic light-emitting diodes that use inorganic materials as fluorescent materials, in the case of light-emitting diodes (LEDs).

[0004] Inorganic light-emitting diodes (LEDs) using inorganic semiconductors as fluorescent materials exhibit durability even at high temperatures and offer higher blue light efficiency compared to organic LEDs. Furthermore, a transfer method utilizing dielectrophoresis (DEP) has been developed to address the limitations of existing inorganic LED manufacturing processes. In this regard, research continues on inorganic LEDs with superior durability and efficiency compared to organic LEDs.

[0005] On the other hand, inkjet printing apparatus can be used to transfer inorganic light-emitting diode elements or form organic material layers contained in display devices using electrophoresis. Alternatively, the inorganic light-emitting diode elements or organic material layers can be transferred by inkjet printing any ink or solution followed by post-processing. The inkjet printing apparatus can perform the process of supplying a predetermined ink or solution to an inkjet head and causing the inkjet head to spray the ink or solution onto a predetermined substrate.

[0006] After ink is printed using an inkjet printing process to include inorganic light-emitting diode (or bipolar) elements, an insulation (passivation) process is performed as a post-processing step. Summary of the Invention

[0007] Technical issues

[0008] The problem to be solved by the present invention is to provide a manufacturing apparatus for a display device, wherein an electric field is continuously formed on a target substrate between a printing process for printing ink including inorganic light-emitting diode elements and an insulating process.

[0009] Another problem to be solved by the present invention is to provide a method for manufacturing a display device, wherein an electric field is continuously formed on a target substrate between a printing process for printing ink including inorganic light-emitting diode elements and an insulating process.

[0010] The problems of this invention are not limited to those mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the following description.

[0011] Solution

[0012] A manufacturing apparatus for a display device according to an embodiment for solving the above-mentioned problems includes: a stage for supporting a target substrate including a first voltage application pad electrically connected to a first probe, the target substrate being movable along a first direction and located on an upper surface of the stage; a first guide rail fixed to a lower surface of the stage, extending along the first direction and movable with the stage; a first slip ring module disposed below the first guide rail, extending along the first direction and not movable with the stage; and a first probe fixedly disposed on one end side surface of the stage in the first direction and electrically connected to the first guide rail movable with the stage, wherein a first voltage for forming an electric field is generated in the first slip ring module, the first slip ring module being electrically connected to the first guide rail to apply the first voltage generated by the first slip ring module to the first guide rail, and the first voltage applied to the first guide rail being provided to the first voltage application pad via the first probe.

[0013] A method for manufacturing a display device according to an embodiment for solving another problem mentioned above includes: a target substrate and stage preparation step, wherein a stage for supporting the target substrate is prepared, the target substrate including voltage application pads electrically connected to probes and moving along a first direction and located on an upper surface of the stage; a voltage generation step, wherein a voltage is generated to form an electric field for a slip ring module disposed below a guide rail, the guide rail being fixed to a lower surface of the stage and extending along the first direction; an electric field formation step, wherein the generated voltage is applied to the voltage application pads by the guide rail electrically connected to the slip ring module and the probe electrically connected to the guide rail, thereby forming an electric field on the target substrate; an ink jetting step, wherein ink is jetted onto the target substrate generating the electric field by an inkjet device; a substrate moving step, wherein the target substrate is moved from the inkjet device to a drying device by the stage; and a drying step, wherein the ink jetted onto the stage is dried by the drying device, wherein, in the substrate moving step, the target substrate is moved from the inkjet device to the drying device while the electric field is generated.

[0014] Specific details of other embodiments are included in the detailed description and accompanying drawings.

[0015] Beneficial effects

[0016] According to one embodiment of the display device manufacturing apparatus and manufacturing method, since an electric field is continuously formed on the target substrate between the printing process and the insulating process, the arrangement of the formed inorganic light-emitting diode elements can be maintained even when the target substrate on the worktable is moved in one direction.

[0017] The effects of the embodiments are not limited to those illustrated above, and include a wider variety of effects in this specification. Attached Figure Description

[0018] Figure 1 This is a flowchart of a method for manufacturing a display device according to an embodiment.

[0019] Figure 2 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figures 11 to 14 yes Figure 1 Cross-sectional views of each process step in the manufacturing method of the display device.

[0020] Figure 3 yes Figure 1 A perspective view of a process step in the manufacturing method of a display device.

[0021] Figure 8 This is a perspective view showing the arrangement of a first slip ring module and a first guide rail according to an embodiment.

[0022] Figure 9 This is a plan view showing the arrangement of a first slip ring and a first guide rail, as well as a second slip ring and a second guide rail according to an embodiment.

[0023] Figure 10 It is shown Figure 1 A perspective view of a process step in the manufacturing method of a display device.

[0024] Explanation of reference numerals in the attached figures

[0025] SUB: Substrate; STA: Stage

[0026] 90: Ink 91: Solvent

[0027] 95: Bipolar element RL1: First roller

[0028] RL2: Second roller; SRU1: First slip ring module

[0029] SRU2: Second slip ring module; SR: Slip ring

[0030] SB: Voltage Generating Section; RP: Roller Section

[0031] LSP: Power generating device; 300: Inkjet unit

[0032] 310: First base section; 330: Inkjet head

[0033] 335: Nozzle 710: First probe

[0034] 711: First probe support portion; 715: First probe pad

[0035] 720: Second probe; 721: Second probe support.

[0036] 725: Second probe pad; 800: Drying device.

[0037] FM1: First frame FM2: Second frame

[0038] FM3: The Third Frame Detailed Implementation

[0039] The advantages and features of the present invention, as well as the methods for achieving these advantages and features, will become clear from the accompanying drawings and the embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in many different forms. These embodiments are provided merely to make the disclosure of the invention more complete and to enable those skilled in the art to fully understand the scope of the invention, which is defined only by the scope of the claims.

[0040] When an element or layer is referred to as "on" another element or layer, it includes both cases where the element or layer is directly on top of the other element or layer, and cases where another layer or element is inserted in between. Similarly, when referred to as "below," "left," and "right," it includes both cases where it is arranged adjacent to another element, and cases where another layer or element is inserted in between. Throughout the specification, the same reference numerals indicate the same constituent elements.

[0041] Although terms such as "first," "second," etc., are used to describe various constituent elements, it is clear that these constituent elements are not limited by these terms. These terms are only used to distinguish one constituent element from another. Therefore, within the scope of the technical concept of the present invention, the first constituent element described below can be a second constituent element.

[0042] The embodiments will now be described with reference to the accompanying drawings.

[0043] Figure 1 This is a flowchart of a method for manufacturing a display device according to an embodiment. Figure 2 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figures 11 to 14 yes Figure 1 Cross-sectional views of each process step in the manufacturing method of the display device. Figure 3 yes Figure 1 A perspective view of a process step in the manufacturing method of a display device. Figure 8 This is a perspective view showing the arrangement of a first slip ring module and a first guide rail according to an embodiment. Figure 9 This is a plan view showing the arrangement of a first slip ring and a first guide rail, as well as a second slip ring and a second guide rail according to an embodiment. Figure 10 It is shown Figure 1 A perspective view of a process step in the manufacturing method of a display device.

[0044] Reference Figure 1A method for manufacturing a display device according to one embodiment includes: a target substrate and stage preparation step S10, wherein a stage for supporting the target substrate is prepared, the target substrate including voltage application pads electrically connected to probes and moving along a first direction and located on the upper surface of the stage; a voltage generation step S20, wherein a voltage is generated to form an electric field for a slip ring module disposed below a guide rail, the guide rail being fixed to the lower surface of the stage and extending along the first direction; an electric field formation step S30, wherein the generated voltage is applied to the voltage application pads through the guide rail electrically connected to the slip ring module and the probe electrically connected to the guide rail, thereby forming an electric field on the target substrate; an ink jetting step S40, wherein ink is jetted onto the target substrate generating the electric field using an inkjet device; a substrate moving step S50, wherein the target substrate is moved from the inkjet device to a drying device using the stage; and a drying step S60, wherein the ink jetted onto the stage is dried using the drying device.

[0045] A display device manufactured according to a method for manufacturing a display device according to an embodiment displays moving or still images. A display device can refer to any electronic device that provides a display screen. For example, a display device may include a television, laptop computer, monitor, billboard, Internet of Things device, mobile phone, smartphone, tablet PC (personal computer), electronic clock, smartwatch, watch phone, head-mounted display, mobile communication terminal, electronic notebook, e-book, PMP (portable multimedia player), navigator, game console, digital camera, camcorder, etc. A display device includes a display panel that provides a display screen. Examples of display panels may include inorganic light-emitting diode (LED) display panels, organic light-emitting diode (OLED) display panels, quantum dot LED (QD) display panels, plasma display panels, field emission display panels, etc. Hereinafter, as an example of a display panel, an inorganic LED display panel is illustrated, but the application is not limited to this; other display panels can be applied as long as the same technical concept is applicable.

[0046] First, refer to Figures 1 to 3 A method for manufacturing a display device according to one embodiment includes a target substrate and a stage preparation step S10, wherein a stage STA for supporting a target substrate SUB is prepared, the target substrate SUB including voltage application pads electrically connected to probes, and moving along a second direction DR2 and located on the upper surface of the stage STA.

[0047] In this embodiment, the first direction DR1, the second direction DR2, and the third direction DR3 can intersect each other in different directions. Figure 3In the perspective view, for ease of explanation, a second direction DR2 is defined as the travel direction of the worktable STA, a first direction DR1 intersecting the second direction DR2 in a planar view, and a third direction DR3 as the thickness direction of the worktable STA. However, the directions mentioned in the embodiments should be understood as relative directions, and the embodiments are not limited to the mentioned directions.

[0048] In the target substrate and stage preparation step S10, the target substrate SUB may include a first substrate 11 and a semiconductor layer, a plurality of conductive layers and a plurality of insulating layers disposed on the first substrate 11.

[0049] Specifically, the first substrate 11 can be an insulating substrate. The first substrate 11 can be formed of an insulating material, such as glass, quartz, or polymer resin. In addition, the first substrate 11 can be a rigid substrate, but it can also be a flexible substrate that can be bent, folded, rolled, etc.

[0050] Light-shielding layers BML1 and BML2 may be disposed on the first substrate 11. The first light-shielding layer BML1 and the second light-shielding layer BML2 are arranged to overlap at least with the active material layers DT_ACT and ST_ACT of the driving transistor DT and the switching transistor ST, respectively. Light-shielding layers BML1 and BML2 include materials for blocking light to prevent light from incident on the active material layers DT_ACT and ST_ACT of each transistor. For example, the first light-shielding layer BML1 and the second light-shielding layer BML2 may be formed of an opaque metallic material that blocks light transmission. However, this is not a limitation; depending on the circumstances, light-shielding layers BML1 and BML2 may be omitted, or only the first light-shielding layer BML1 may be included.

[0051] The buffer layer 12 can be disposed on the entire surface of the first substrate 11, including the light-shielding layers BML1 and BML2. The buffer layer 12 is formed on the first substrate 11 to protect the pixel transistors DT and ST from moisture that penetrates through the easily permeable first substrate 11, and the buffer layer 12 also serves to planarize the surface. The buffer layer 12 can be composed of multiple alternately stacked inorganic layers. For example, the buffer layer 12 can be formed from silicon oxide (SiO2). x ), silicon nitride (SiN) x A multilayer consisting of alternating inorganic layers of at least one of silicon oxynitride (SiON).

[0052] A semiconductor layer is disposed on buffer layer 12. The semiconductor layer may include a first active material layer DT_ACT for driving transistor DT and a second active material layer ST_ACT for switching transistor ST. The first active material layer DT_ACT and the second active material layer ST_ACT may be arranged to partially overlap with the gate electrodes DT_G, ST_G, etc. of the first gate conductive layer, which will be described later.

[0053] In an exemplary embodiment, the semiconductor layer may include polycrystalline silicon, monocrystalline silicon, oxide semiconductor, etc. Polycrystalline silicon can be formed by crystallizing amorphous silicon. When the semiconductor layer includes polycrystalline silicon, the first active material layer DT_ACT may include a plurality of doped regions DT_ACTa, DT_ACTb doped with impurities and a first channel region DT_ACTc located therebetween. The second active material layer ST_ACT may also include a plurality of doped regions ST_ACTa, ST_ACTb and a second channel region ST_ACTc located therebetween.

[0054] In another exemplary embodiment, the semiconductor layer may also include an oxide semiconductor. In this case, the doped regions of the active material layers DT_ACT and ST_ACT may be conductive regions, respectively. The oxide semiconductor may be an oxide semiconductor including indium (In). In some embodiments, the oxide semiconductor may be indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium zinc tin oxide (IZTO), indium gallium tin oxide (IGTO), indium gallium zinc oxide (IGZO), indium gallium zinc tin oxide (IGZTO), etc. However, it is not limited to this.

[0055] A first gate insulating layer 13 is disposed on the semiconductor layer and the buffer layer 12. The first gate insulating layer 13 may include the semiconductor layer and may be disposed on the buffer layer 12. The first gate insulating layer 13 can serve as the gate insulating layer for each transistor DT, ST. The first gate insulating layer 13 may be made of an inorganic material (e.g., silicon oxide (SiO2)). x ), silicon nitride (SiN) x It consists of inorganic layers of silicon oxynitride (SiON) and silicon oxynitride (SiON), or is formed as a structure by stacking them.

[0056] A first gate conductive layer is disposed on a first gate insulating layer 13. The first gate conductive layer may include a first gate electrode DT_G of the driving transistor DT and a second gate electrode ST_G of the switching transistor ST. The first gate electrode DT_G may be arranged to overlap with a first channel region DT_ACTc of the first active material layer DT_ACT along the thickness direction, and the second gate electrode ST_G may be arranged to overlap with a second channel region ST_ACTc of the second active material layer ST_ACT along the thickness direction. The first gate conductive layer may be formed as a single layer or multiple layers composed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof. However, it is not limited thereto.

[0057] A first protective layer 15 is disposed on the first gate conductive layer. The first protective layer 15 can be arranged to cover the first gate conductive layer to protect it. The first protective layer 15 can be made of inorganic materials (e.g., silicon oxide (SiO2)). x ), silicon nitride (SiN) x It consists of inorganic layers of silicon oxynitride (SiON) and silicon oxynitride (SiON), or is formed as a structure by stacking them.

[0058] A second gate conductive layer is disposed on the first protective layer 15. The second gate conductive layer may include a first capacitor electrode CE1 of a storage capacitor, at least a portion of which overlaps with the first gate electrode DT_G along the thickness direction. The first capacitor electrode CE1 may overlap with the first gate electrode DT_G in the thickness direction, the first protective layer 15 is located between the first capacitor electrode CE1 and the first gate electrode DT_G, and the storage capacitor may be formed between the first capacitor electrode CE1 and the first gate electrode DT_G. The second gate conductive layer may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof. However, it is not limited thereto.

[0059] The first interlayer insulating layer 17 can be disposed on the second gate conductive layer. The first interlayer insulating layer 17 can function as an insulating layer between the second gate conductive layer and other layers disposed above the second gate conductive layer. The first interlayer insulating layer 17 can be made of inorganic materials (e.g., silicon oxide (SiO2)). x ), silicon nitride (SiN) x It consists of inorganic layers of silicon oxynitride (SiON) and silicon oxynitride (SiON), or is formed as a structure by stacking them.

[0060] The first data conductive layer may be disposed on the first interlayer insulating layer 17. The first data conductive layer may include the first source / drain electrode DT_SD1 and the second source / drain electrode DT_SD2 of the driving transistor DT, and the first source / drain electrode ST_SD1 and the second source / drain electrode ST_SD2 of the switching transistor ST.

[0061] The source / drain electrodes DT_SD1 and DT_SD2 of the driving transistor DT can contact the doped regions DT_ACTa and DT_ACTb of the first active material layer DT_ACT, respectively, through contact holes penetrating the first interlayer insulating layer 17 and the first gate insulating layer 13. The source / drain electrodes ST_SD1 and ST_SD2 of the switching transistor ST can contact the doped regions ST_ACTa and ST_ACTb of the second active material layer ST_ACT, respectively, through contact holes penetrating the first interlayer insulating layer 17 and the first gate insulating layer 13. Furthermore, the first source / drain electrode DT_SD1 of the driving transistor DT and the first source / drain electrode ST_SD1 of the switching transistor ST can be electrically connected to the first light-shielding layer BML1 and the second light-shielding layer BML2, respectively, through another contact hole.

[0062] The first data conductive layer can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof. However, it is not limited to this.

[0063] The second interlayer insulating layer 18 can be disposed on the first data conductive layer. The second interlayer insulating layer 18 can cover the first data conductive layer and can be disposed on the entire surface of the first interlayer insulating layer 17 to protect the first data conductive layer. The second interlayer insulating layer 18 can be made of inorganic materials (e.g., silicon oxide (SiO2)). x ), silicon nitride (SiN) x It consists of inorganic layers of silicon oxynitride (SiON) and silicon oxynitride (SiON), or is formed as a structure by stacking them.

[0064] The second data conductive layer can be disposed on the second interlayer insulating layer 18. The second data conductive layer may include a first voltage wiring VL1, a second voltage wiring VL2, and a first conductive pattern CDP. A high potential voltage (or a first power supply voltage) supplied to the driving transistor DT can be applied to the first voltage wiring VL1, and a low potential voltage (or a second power supply voltage) supplied to the second electrode 22 can be applied to the second voltage wiring VL2. Furthermore, in the manufacturing process of the display device, a method for aligning the light-emitting element 95 (see reference 1) can also be used. Figure 5 The required alignment signal is applied to the second voltage wiring VL2.

[0065] The first conductive pattern CDP can be electrically connected to the first source / drain electrode DT_SD1 of the driving transistor DT through contact holes formed in the second interlayer insulating layer 18. The first conductive pattern CDP can also contact the first electrode 21 (described later), and the driving transistor DT can transmit the first power supply voltage applied from the first voltage line VL1 to the first electrode 21 through the first conductive pattern CDP. Furthermore, although the second data conductive layer is shown in the figures as including a second voltage line VL2 and a first voltage line VL1, it is not limited thereto. The second data conductive layer may include a greater number of first voltage lines VL1 and second voltage lines VL2.

[0066] The second conductive layer can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof. However, it is not limited to this.

[0067] A first planarization layer 19 is disposed on the second data conductive layer. The first planarization layer 19 may include an organic insulating material (e.g., an organic material such as polyimide (PI)) to perform surface planarization.

[0068] Multiple first embankment portions 40, multiple electrodes 21, 22, a light-emitting element 95, a second embankment portion 45, and multiple contact electrodes 26, 27 are arranged on the first planarization layer 19. In addition, multiple insulating layers 51, 52, 53, and 54 (see reference) Figure 2 , Figure 13 and Figure 14 It can be further arranged on the first planarization layer 19.

[0069] Multiple first dam portions 40 can be directly disposed on the first planarization layer 19. The multiple first dam portions 40 can extend along the second direction DR2 in each sub-pixel, and can be spaced apart from each other at the boundaries between sub-pixels and terminate therethere, so as not to extend to other adjacent sub-pixels in the second direction DR2. Furthermore, the multiple first dam portions 40 can be arranged to be spaced apart from each other and opposite each other along the first direction DR1. The first dam portions 40 can be arranged to be spaced apart from each other, forming areas therebetween for arranging light-emitting elements 95. The multiple first dam portions 40 can be disposed in each sub-pixel to form a linear pattern in the display area of ​​the display device. Although two first dam portions 40 are shown in the figures, this is not a limitation. A greater number of first dam portions 40 can be disposed depending on the number of electrodes 21, 22 described later.

[0070] The first dam portion 40 may have a structure in which at least a portion protrudes relative to the upper surface of the first planarization layer 19. The protruding portion of the first dam portion 40 may have an inclined side surface, and light emitted from the light-emitting element 95 may travel toward the inclined side surface of the first dam portion 40. Electrodes 21, 22 disposed on the first dam portion 40 may comprise a material with high reflectivity, and light emitted from the light-emitting element 95 may be reflected by the electrodes 21, 22 disposed on the side surface of the first dam portion 40 and emitted toward the upper direction of the first planarization layer 19. That is, the first dam portion 40 can provide an area for disposing of the light-emitting element 95, while also acting as a reflective wall that reflects light emitted from the light-emitting element 95 toward the upper direction. The side surface of the first dam portion 40 may be inclined in a linear shape, but is not limited thereto; the outer surface of the first dam portion 40 may also have a curved semi-circular or semi-elliptical shape. In an exemplary embodiment, the first dam portion 40 may comprise an organic insulating material such as polyimide (PI), but is not limited thereto.

[0071] Multiple electrodes 21 and 22 are disposed on the first embankment 40 and the first planarization layer 19. The multiple electrodes 21 and 22 may include a first electrode 21 and a second electrode 22. The first electrode 21 and the second electrode 22 may extend along a second direction DR2, and they may be arranged to be spaced apart from each other and opposite each other along a first direction DR1. The first electrode 21 and the second electrode 22 may have a shape substantially similar to that of the first embankment 40, and may have a shape with a length greater than that of the first embankment 40 measured along the second direction DR2.

[0072] The first electrode 21 and the second electrode 22 extend along the second direction DR2 in the sub-pixel, respectively, and are spaced apart from other electrodes 21, 22 at the boundaries of other sub-pixels adjacent to each other along the second direction DR2. In some embodiments, the second embankment 45 may be arranged at the boundary of each sub-pixel, and the electrodes 21, 22 arranged in each sub-pixel adjacent to each other along the second direction DR2 may be spaced apart from each other at the portions overlapping with the second embankment 45. However, this is not a limitation; some electrodes 21, 22 may also be arranged to extend across the sub-pixels adjacent to each other along the second direction DR2, rather than being separated according to each sub-pixel.

[0073] The first electrode 21 can be electrically connected to the driving transistor DT through a first contact hole CT1 at the boundary of a sub-pixel adjacent to the second direction DR2. For example, at least a portion of the first electrode 21 can be arranged to overlap with a portion of the second embankment 45 extending along the first direction DR1, and the first electrode 21 can contact the first conductive pattern CDP through the first contact hole CT1 penetrating the first planarization layer 19. The second electrode 22 can be electrically connected to the second voltage line VL2 at the boundary of a sub-pixel adjacent to the second direction DR2 through a second contact hole CT2. For example, the second electrode 22 can be arranged to overlap with a portion of the second embankment 45 extending along the first direction DR1, and can contact the second voltage line VL2 through the second contact hole CT2 penetrating the first planarization layer 19. However, this is not a limitation. In some embodiments, the first contact hole CT1 and the second contact hole CT2 can also be arranged in the region surrounded by the second embankment 45 such that the first contact hole CT1 and the second contact hole CT2 do not overlap with the second embankment 45.

[0074] Although the accompanying drawings show one first electrode 21 and one second electrode 22 arranged in each sub-pixel, this is not a limitation. In some embodiments, the number of first electrodes 21 and second electrodes 22 arranged in each sub-pixel can be increased. Furthermore, the first electrodes 21 and second electrodes 22 arranged in each sub-pixel do not necessarily have a shape extending in one direction, and the first electrodes 21 and second electrodes 22 can be arranged in various structures. For example, the first electrodes 21 and second electrodes 22 can have a partially curved or bent shape, and can also be arranged such that one electrode surrounds the other. The structure or shape of arranging the first electrodes 21 and second electrodes 22 is not particularly limited as long as at least a portion of the regions of the first electrodes 21 and second electrodes 22 are spaced apart from each other and opposite each other, and as long as an area for arranging the light-emitting element 95 is formed between them.

[0075] Multiple electrodes 21 and 22 are electrically connected to the light-emitting element 95 and can be applied with a predetermined voltage to make the light-emitting element 95 emit light. For example, the multiple electrodes 21 and 22 can be electrically connected to the light-emitting element 95 through contact electrodes 26 and 27 described later, and the electrical signals applied to the electrodes 21 and 22 can be transmitted to the light-emitting element 95 through the contact electrodes 26 and 27.

[0076] In an exemplary embodiment, one of the first electrode 21 and the second electrode 22 may be electrically connected to the anode electrode of the light-emitting element 95, and the other may be electrically connected to the cathode electrode of the light-emitting element 95. However, this is not a limitation, and the opposite is also possible.

[0077] Each electrode 21, 22 can also be used to form an electric field in a sub-pixel to align the light-emitting element 95. The light-emitting element 95 can be arranged between the first electrode 21 and the second electrode 22 by means of the electric field formed on the first electrode 21 and the second electrode 22. When the inkjet apparatus 300 described later is used, ink including the light-emitting element 95 is sprayed onto the electrodes 21, 22, and the electric field generating device 700 is electrically connected to each electrode 21, 22, thereby generating an electric field EL on the electrodes 21, 22 (see reference). Figure 4 The light-emitting element 95 dispersed in the ink can receive electrophoretic force through the electric field EL generated on the electrodes 21 and 22, thereby aligning itself on the electrodes 21 and 22.

[0078] Each of the first electrode 21 and the second electrode 22 may be disposed on the first embankment 40. The first electrode 21 and the second electrode 22 may be spaced apart from each other and opposite each other along a first direction DR1, and a plurality of light-emitting elements 95 may be disposed between them. The light-emitting elements 95 may be disposed between the first electrode 21 and the second electrode 22, and at least one end of the light-emitting element 95 may be electrically connected to the first electrode 21 and the second electrode 22.

[0079] In some embodiments, each of the first electrode 21 and the second electrode 22 may be formed to have a width greater than that of the first embankment 40. For example, each of the first electrode 21 and the second electrode 22 may be arranged to cover the outer surface of the first embankment 40. Each of the first electrode 21 and the second electrode 22 may be arranged on a side surface of the first embankment 40, and the distance between the first electrode 21 and the second electrode 22 may be less than the distance between the first embankments 40. Furthermore, at least a portion of the first electrode 21 and the second electrode 22 may be directly disposed on the first planarization layer 19.

[0080] Each electrode 21, 22 may include a transparent conductive material. For example, each of the first electrode 21 and the second electrode 22 may include indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), etc., but is not limited thereto. In some embodiments, each electrode 21, 22 may include a conductive material with high reflectivity. For example, each electrode 21, 22 may include metals such as silver (Ag), copper (Cu), aluminum (Al), etc., as materials with high reflectivity. In this case, each electrode 21, 22 can reflect light emitted from the light-emitting element 95 and traveling toward the side surface of the first embankment 40 toward the upper direction of each sub-pixel.

[0081] However, this is not the only limitation. Each electrode 21, 22 may be configured as a structure consisting of one or more transparent conductive materials and one or more highly reflective metal layers stacked together, or it may be formed as a single layer comprising a transparent conductive material and a highly reflective metal layer. In an exemplary embodiment, each electrode 21, 22 may have a stacked structure such as ITO / silver (Ag) / ITO, ITO / Ag / IZO, or ITO / Ag / ITZO / IZO, or it may be an alloy including aluminum (Al), nickel (Ni), lanthanum (La), etc.

[0082] A first insulating layer 51 is disposed on the first planarization layer 19, the first electrode 21, and the second electrode 22. The first insulating layer 51 is arranged to include the region between the first electrode 21 and the second electrode 22 and to partially cover the first electrode 21 and the second electrode 22. For example, the first insulating layer 51 may be arranged to cover most of the upper surfaces of the first electrode 21 and the second electrode 22 and to expose a portion of the first electrode 21 and the second electrode 22. In other words, the first insulating layer 51 may be formed substantially on the entire surface of the first planarization layer 19 and may include openings (not shown) that partially expose the first electrode 21 and the second electrode 22.

[0083] In an exemplary embodiment, the first insulating layer 51 may be formed with steps, such that the portion of the upper surface of the first insulating layer 51 located between the first electrode 21 and the second electrode 22 is recessed. However, this is not a limitation. The first insulating layer 51 may be formed with a flat upper surface, allowing the light-emitting element 95 to be disposed on the first insulating layer 51.

[0084] The first insulating layer 51 protects the first electrode 21 and the second electrode 22 while insulating them from each other. Furthermore, it prevents the light-emitting element 95, disposed on the first insulating layer 51, from being damaged by direct contact with other components. However, the shape and structure of the first insulating layer 51 are not limited to this.

[0085] The second dam 45 may be disposed on the first insulating layer 51. The second dam 45 may surround the area on the first insulating layer 51 where the first dam 40 is disposed, and may be disposed at the boundary between each sub-pixel. The second dam 45 may be arranged to have a shape extending along a first direction DR1 and a second direction DR2 to form a grid pattern on the entire surface of the display area. The portion of the second dam 45 extending along the first direction DR1 partially overlaps with the first electrode 21 and the second electrode 22, and the portion of the second dam 45 extending along the second direction DR2 may be spaced apart from the plurality of first dams 40, the first electrode 21 and the second electrode 22.

[0086] In one embodiment, the height of the second dike 45 may be greater than the height of the first dike 40. Unlike the first dike 40, the second dike 45 not only divides adjacent sub-pixels but also prevents ink from overflowing into adjacent sub-pixels during the inkjet printing process in the manufacturing process of the display device. The second dike 45 can separate different sub-pixels, preventing inks containing different light-emitting elements 95 in different sub-pixels from mixing with each other. The second dike 45 may include polyimide (PI) like the first dike 40, but is not limited to this.

[0087] The target substrate SUB may include a pad region PA at its other end along the second direction DR2. Multiple voltage-applying pads may be arranged in the pad region PA. The pad region PA may include a first pad region PA1 and a second pad region PA2, the first pad region PA1 being located on one side of the first direction DR1, and the second pad region PA2 being spaced apart from the first pad region PA1 along the first direction DR1 and located on the other side of the first direction DR1. The first voltage-applying pad may be arranged in the first pad region PA1, and the second voltage-applying pad may be arranged in the second pad region PA2. The first voltage-applying pad may be electrically connected to a first probe 710, and the second voltage-applying pad may be electrically connected to a second probe 720.

[0088] The target substrate SUB can be located on the upper surface of the stage STA of a display device manufacturing apparatus according to one embodiment. In the display device manufacturing process, the stage STA can move along a second direction DR2. The stage STA can support the target substrate SUB disposed on the upper surface of the stage STA.

[0089] According to one embodiment, the manufacturing apparatus for a display device may further include a first guide rail RL1 and a second guide rail RL2 fixed to the lower surface of a worktable STA. The first guide rail RL1 and the second guide rail RL2 extend along a second direction DR2 and move together with the worktable STA. The second guide rail RL2 may be positioned to be spaced apart from the first guide rail RL1 along the first direction DR1.

[0090] According to one embodiment, the manufacturing apparatus for a display device may further include a first slip ring module SRU1 and a second slip ring module SRU2 disposed below a first guide rail RL1. The first slip ring module SRU1 and the second slip ring module SRU2 extend along a second direction DR2 and do not move with the worktable STA. The second slip ring module SRU2 may be positioned to be spaced apart from the first slip ring module SRU1 along a first direction DR1.

[0091] The manufacturing apparatus for a display device according to one embodiment may further include a first probe 710 and a second probe 720. The first probe 710 is fixedly arranged on the other end surface of the worktable STA in a second direction DR2 and is electrically connected to a first guide rail RL1 that moves together with the worktable STA, and the second probe 720 is electrically connected to a second guide rail RL2. The second probe 720 may be spaced apart from the first probe 710 along the first direction DR1.

[0092] Next, refer to Figures 1 to 3 , Figure 6 and Figure 7 According to one embodiment, a method for manufacturing a display device includes a voltage generation step S20, wherein a voltage is generated to form an electric field EL for slip ring modules SRU1 and SRU2 arranged below guide rails RL1 and RL2, the guide rails RL1 and RL2 being fixed to the lower surface of the worktable STA and extending along a second direction DR2.

[0093] A first voltage for forming an electric field EL can be generated in the first slip ring module SRU1, and the first slip ring module SRU1 can be electrically connected to the first rail RL1 to apply the first voltage generated by the first slip ring module SRU1 to the first rail RL1, and the first voltage applied to the first rail RL1 can be provided to the first voltage application pad through the first probe 710.

[0094] A second voltage for forming an electric field EL can be generated in the second slip ring module SRU2, and the second slip ring module SRU2 can be electrically connected to the second rail RL2 to apply the second voltage generated from the second slip ring module SRU2 to the second rail RL2, and the second voltage applied to the second rail RL2 can be provided to the second voltage application pad through the second probe 720.

[0095] The first probe 710 may include a first probe support 711 and a first probe pad 715, wherein the first probe support 711 is in direct contact with the first guide rail RL1, and the first probe pad 715 is connected to the first probe support 711 and connected to the first voltage application pad. The second probe 720 may include a second probe support 721 and a second probe pad 725, wherein the second probe support 721 is in direct contact with the second guide rail RL2, and the second probe pad 725 is connected to the second probe support 721 and connected to the second voltage application pad.

[0096] Here, either the first voltage or the second voltage may include an AC voltage, while the other may include a ground voltage. For example, the first voltage may include an AC voltage, while the second voltage may include a ground voltage.

[0097] Next, refer to Figure 1 , Figure 3 , Figure 4 and Figure 6 According to one embodiment, a method for manufacturing a display device includes an electric field forming step S30, wherein an electric field EL is formed on a target substrate SUB by applying generated voltages (a first voltage and a second voltage) to a voltage application pad through rails RL1 and RL2 electrically connected to slip ring modules SRU1 and SRU2 and probes 710 and 720 electrically connected to rails RL1 and RL2.

[0098] Since the AC voltage included in the first voltage alternates between positive and negative voltages at a predetermined frequency, the direction of the electric field generated between the first voltage, which alternates between positive and negative voltages at a predetermined frequency, and the second voltage, which has a constant ground voltage, can be changed based on the aforementioned frequency.

[0099] The bipolar element 95 (or inorganic light-emitting diode element) of the ink 90 ejected from the inkjet device 300 described later includes a first end and a second end with polarity, and when placed in an electric field EL formed by a first voltage and a second voltage, it can be subjected to electrophoretic force, thereby changing its position or orientation.

[0100] In some embodiments, the electric field EL can be formed parallel to the upper surface of the target substrate SUB. The bipolar element 95 sprayed onto the target substrate SUB can be oriented by the electric field EL such that the direction in which its long axis extends is parallel to the upper surface of the target substrate SUB. Furthermore, the bipolar element 95 can be placed on the target substrate SUB, wherein the polarized first end of the bipolar element 95 can be oriented in a specific direction.

[0101] Next, refer to Figures 3 to 7 A method for manufacturing a display device according to one embodiment includes an ink jetting step S40, wherein ink 90 is jetted onto a target substrate SUB that generates an electric field EL by an inkjet device 300.

[0102] The manufacturing apparatus for a display device according to one embodiment may further include an inkjet device 300, which jets ink 90 onto a target substrate SUB.

[0103] The inkjet device 300 may include a plurality of inkjet heads 330 and may be arranged on the first frame FM1. The inkjet device 300 may use the inkjet heads 330 to jet ink 90 onto the target substrate SUB.

[0104] A manufacturing apparatus for a display device according to one embodiment may include a plurality of frames FM1 to FM3 (see reference FM3) Figure 10 ). Frames FM1 to FM3 can be used to arrange inkjet unit 300 and drying unit 800 (described later) on the upper and side of workbench STA.

[0105] The inkjet unit 300 can be separated from the worktable STA, which passes through the lower part of the first frame FM1, by a predetermined distance. The distance between the inkjet unit 300 and the worktable STA can be adjusted within the range that, when the target substrate SUB is arranged on the worktable STA, the inkjet unit 300 and the target substrate SUB are spaced to a certain extent, thereby ensuring the space required for the printing process.

[0106] like Figure 3 and Figure 5 As shown, the inkjet device 300 may include a base portion 310 and a plurality of inkjet heads 330 disposed on the bottom surface of the base portion 310. The inkjet head 330 may include a plurality of nozzles 335.

[0107] Multiple inkjet heads 330 can be arranged spaced apart from each other in one direction and can be arranged in one or more columns. Although the inkjet heads 330 are shown in a single column in the accompanying drawings, this is not a limitation. The inkjet heads 330 can be arranged in more columns, and can also be arranged alternately or adjacent to each other. The shape of the inkjet heads 330 is not particularly limited; for example, the inkjet heads 330 can have a rectangular shape. The inkjet heads 330 arranged in the inkjet apparatus 300 can spray ink 90 onto the target substrate SUB arranged above the stage STA.

[0108] In one embodiment, ink 90 may include solvent 91 and a plurality of bipolar elements 95 included in solvent 91. In an exemplary embodiment, ink 90 may be provided in a solution state or a colloidal state. For example, solvent 91 can be acetone, water, alcohol, toluene, propylene glycol (PG) or propylene glycol methyl acetate (PGMA), triethylene glycol monobutyl ether (TGBE), diethylene glycol monophenyl ether (DGPE), amide solvent, dicarbonyl solvent, diethylene glycol dibenzoate, tricarbonyl solvent, triethyl citrate, phthalate solvent, benzyl butylphthalate, bis(2-ethylhexyl)phthalate, bis(2-ethylhexyl)isophthalate, ethylene glycol ethyl glycolate, etc., but is not limited to these. Multiple bipolar elements 95 may be included in ink 90 in a state of dispersion in solvent 91 and provided to and discharged from inkjet device 300.

[0109] The inkjet head 330 may include an inner tube 331 and a plurality of nozzles 335, through which ink 90 is discharged. The ink 90 discharged from the nozzles 335 may be sprayed onto a target substrate SUB provided on a stage STA. The nozzles 335 may be located on the bottom surface of the inkjet head 330 and may be arranged in one direction extending from the inkjet head 330.

[0110] The ink 90 discharged through the nozzle 335 may include a solvent 91 and a bipolar element 95 dispersed in the solvent 91. According to one embodiment, the bipolar element 95 may have a shape extending in one direction. The bipolar element 95 may be randomly dispersed in the ink 90 and flow along the inner tube 331 before being supplied to the nozzle 335. Because the bipolar element 95 has a shape extending in one direction, it may have an orientation direction consistent with its long axis. Furthermore, the bipolar element 95 may include a first end with a first polarity and a second end with a second polarity, the first and second ends being the two ends of the bipolar element 95 along its long axis. The orientation direction of the bipolar element 95 extending in one direction may be defined based on the direction of the first end. The orientation direction of the bipolar element 95 flowing in the inner tube 331 and nozzle 335 of the inkjet head 330 may not be uniform, but may be dispersed in random directions. However, it is not limited to this; the bipolar element 95 may flow in the inner tube 331 and nozzle 335 with a specific orientation direction.

[0111] Ink 90 ejected from inkjet head 330 is sprayed onto target substrate SUB. After bipolar elements 95 are sprayed onto target substrate SUB with a specific orientation, they are aligned on target substrate SUB in a specific orientation by an electric field EL generated by slip ring modules SRU1 and SRU2. That is, bipolar elements 95 can be aligned on target substrate SUB in one direction by electric field EL.

[0112] Next, refer to Figure 1 , Figure 3 , Figure 8 and Figure 9 A method for manufacturing a display device according to one embodiment includes a substrate moving step S50, wherein a target substrate SUB is moved from an inkjet device 300 to a drying device 800 by a stage STA.

[0113] In the substrate moving step S50, the target substrate SUB can be moved from the inkjet device 300 to the drying device 800 while generating an electric field EL. The process of generating an electric field EL on the target substrate SUB in the substrate moving step S50 is the same as the process of generating an electric field EL on the target substrate SUB through slip ring modules SRU1 and SRU2 in the ink jetting step S40, so a repeated description of it is omitted.

[0114] In addition, in the substrate moving step S50, the stage STA is moved by the lower slip ring modules SRU1 and SRU2.

[0115] like Figure 9As shown, each slip ring module SRU1, SRU2 can be arranged overlapping with guide rails RL1, RL2 in the thickness direction. (Refer to...) Figure 8 The relationship between each slip ring module SRU1, SRU2 and guide rails RL1, RL2 is described in more detail.

[0116] like Figure 8 As shown, the first slip ring module SRU1 may include a plurality of slip rings SR arranged spaced apart along a second direction DR2 and a slip ring housing SRC on which the plurality of slip rings SR are arranged. A first guide rail RL1, fixed below the worktable STA, can directly contact the plurality of slip rings SR and can move along the second direction DR2 via the directly contacting slip rings SR. Furthermore, as described above, a first voltage generated by the plurality of slip rings SR can be applied to the directly contacting first guide rail RL1.

[0117] In addition, the slip ring SR may include: a voltage generating unit SB that generates a first voltage; a roller RP that is electrically connected to the voltage generating unit SB and rotates to move the first guide rail RL1 along the second direction DR2; and a power generating unit LSP that provides rotational power to the roller RP.

[0118] Figure 8 The first slip ring module SRU1 shown is merely exemplary and is not limited thereto. That is, various structures are possible as long as the first slip ring module SRU1 has a structure that generates a first voltage, is in direct contact with the first guide rail RL1, and is capable of moving the stage STA along the second direction DR2.

[0119] For example, the power generating unit LSP that provides rotational power to the roller RP can also be a hydraulic cylinder device, an electric motor or other power generating device.

[0120] The second slip ring module SRU2 is basically the same as the first slip ring module SRU1. The only difference is that the second slip ring module SRU2 is in direct contact with the second guide rail RL2 and applies the generated second voltage to the second guide rail RL2. Therefore, repeated descriptions are omitted.

[0121] In the substrate moving step S50, under the state of generating an electric field EL, the target substrate SUB moves from the inkjet device 300 to the drying device 800, thereby causing the bipolar elements 95 in the ink 90 ejected from the inkjet device 300 to move in an aligned state according to the generated electric field EL. Therefore, in the substrate moving step S50, there is an advantage that the phenomenon of the bipolar elements 95 dispersed in the solvent 91 continuously moving due to the flow of the solvent 91 is minimized, thereby improving the alignment reliability of the bipolar elements 95.

[0122] Next, refer to Figure 1 , Figures 10 to 12A method for manufacturing a display device according to one embodiment includes a drying step S60, wherein ink 90 sprayed onto a worktable STA is dried by a drying device 800.

[0123] The manufacturing apparatus for a display device according to one embodiment may further include a drying apparatus 800.

[0124] The drying device 800 may include a second base portion 801 and a heat treatment unit 805. According to one embodiment, in addition to the first frame FM1 on which the inkjet device 300 is arranged, a second frame FM2 and a third frame FM3 are further arranged along the second direction DR2, and the drying device 800 may be arranged between the second frame FM2 and the third frame FM3.

[0125] The heat treatment unit 805 can be arranged on the second base portion 801. The heat treatment unit 805 can irradiate heat energy on the upper part of the target substrate SUB arranged on the stage STA. In this specification, as an example of a drying apparatus 800, a solvent drying apparatus including the heat treatment unit 805 and utilizing heat energy is illustrated, but it is not limited to this. The drying apparatus 800 is an apparatus for drying the solvent 91 of ink 90, and can include various units. For example, the drying apparatus 800 may also include an IR irradiation unit that irradiates infrared light. However, it is not limited to this.

[0126] The arrangement of the heat treatment unit 805 on the second base portion 801 is not particularly limited. Although the heat treatment unit 805 is shown in the drawings as being directly attached to the second base portion 801, the heat treatment unit 805 may be attached to or placed on the second base portion 801 as a separate component. The heat treatment unit 805 of the drying apparatus 800 may be spaced apart from other components arranged on the target substrate SUB to prevent damage to other components due to the heat energy irradiated. Furthermore, in some embodiments, a shielding device may be further arranged on the lower surface of the heat treatment unit 805. The shielding device may also partially shield the heat energy irradiated from the heat treatment unit 805 to prevent damage to the target substrate SUB.

[0127] When the stage STA passes the drying unit 800 after the inkjet unit 300, the drying unit 800 can apply heat to the target substrate SUB. However, it is not limited to this, and the drying process can also be performed while the stage STA is stopped below the drying unit 800 for a predetermined time.

[0128] The ink 90 sprayed onto the target substrate SUB includes a bipolar element 95 oriented in one direction and a solvent 91 including the bipolar element 95. The drying apparatus 800 can remove the solvent 91 from the ink 90 and can position the bipolar element 95 on the target substrate SUB in a fixed position. According to one embodiment, to prevent changes in the orientation and position of the bipolar element 95 when the solvent 91 is removed, the solvent drying process can be performed while an electric field EL is generated on the target substrate SUB by slip ring modules SRU1 and SRU2.

[0129] When the stage STA passes through the drying apparatus 800, heat energy can be irradiated onto the target substrate SUB, removing the solvent 91 and thus placing the bipolar element 95 on the target substrate SUB. However, as mentioned above, the solvent 91 in the ink 90 can be a high-viscosity solvent to maintain the dispersed state of the bipolar element 95 for a long time. During the process of removing the solvent 91 by thermal drying or evaporation, the initial alignment state of the bipolar element 95 may change due to the attraction of fluid flow or the attraction between the solvent 91 and the bipolar element 95. According to one embodiment, the slip ring modules SRU1 and SRU2 can generate an electric field EL on the target substrate SUB even during the drying process of the solvent 91, and prevent misalignment problems caused by changes in the orientation and position of the bipolar element 95.

[0130] Furthermore, by irradiating the upper part of the target substrate SUB with heat energy by the drying device 800, the solvent 91 is dried from the surface of the target substrate SUB, thereby minimizing internal convection due to heat energy.

[0131] Figure 13 The target substrate SUB after completing the drying step S60 is shown in the figure.

[0132] like Figure 13 As shown, the inorganic light-emitting diode element 95 can be arranged on each electrode 21, 22. One end of the inorganic light-emitting diode element 95 can be located on the first electrode 21, and the other end can be located on the second electrode 22. The inorganic light-emitting diode element 95 can be arranged directly above the first insulating layer 51, and furthermore, it can overlap with the upper surface of the first insulating layer 51, which is recessed along the thickness direction to form a step in the portion located between the first electrode 21 and the second electrode 22.

[0133] Next, as Figure 14 As shown, a method for manufacturing a display device according to one embodiment includes the steps of sequentially stacking a second insulating layer 52, a first contact electrode 26, a third insulating layer 53, a second contact electrode 27, and a fourth insulating layer 54.

[0134] The second insulating layer 52 may be partially disposed on the inorganic light-emitting diode element 95 disposed between the first electrode 21 and the second electrode 22. The second insulating layer 52 may be partially disposed around the outer surface of the inorganic light-emitting diode element 95. The portion of the second insulating layer 52 disposed on the inorganic light-emitting diode element 95 may have a shape extending in a second direction DR2 between the first electrode 21 and the second electrode 22 in a plane. For example, the second insulating layer 52 may form a linear or island pattern in each sub-pixel.

[0135] The second insulating layer 52 can be disposed on the inorganic light-emitting diode element 95, and can expose one end and the other end of the inorganic light-emitting diode element 95. The second insulating layer 52 can protect the inorganic light-emitting diode element 95, and can also serve to fix the inorganic light-emitting diode element 95 during the manufacturing process of the display device. In addition, in an exemplary embodiment, a portion of the material of the second insulating layer 52 can also be disposed between the lower surface of the inorganic light-emitting diode element 95 and the first insulating layer 51. As described above, the second insulating layer 52 can also be formed to fill the space between the first insulating layer 51 and the inorganic light-emitting diode element 95 formed during the manufacturing process of the display device. Therefore, the second insulating layer 52 is arranged to surround the outer surface of the inorganic light-emitting diode element 95 to protect the inorganic light-emitting diode element 95, and can also fix the inorganic light-emitting diode element 95 during the manufacturing process of the display device.

[0136] Multiple contact electrodes 26, 27 and a third insulating layer 53 can be arranged on the second insulating layer 52.

[0137] The plurality of contact electrodes 26, 27 may have a shape extending in one direction. The plurality of contact electrodes 26, 27 may respectively contact the inorganic light-emitting diode element 95 and electrodes 21, 22. The first contact electrode 26 and the second contact electrode 27 may be respectively disposed on a portion of the first electrode 21 and the second electrode 22. The first contact electrode 26 may be disposed on the first electrode 21, and the second contact electrode 27 may be disposed on the second electrode 22, and the first contact electrode 26 and the second contact electrode 27 may each have a shape extending in a second direction DR2.

[0138] A third insulating layer 53 is disposed on the first contact electrode 26. The third insulating layer 53 electrically insulates the first contact electrode 26 from the second contact electrode 27. The third insulating layer 53 is arranged to cover the first contact electrode 26 and may not be disposed on the other end of the inorganic light-emitting diode element 95, allowing the inorganic light-emitting diode element 95 to contact the second contact electrode 27. The third insulating layer 53 may partially contact the first contact electrode 26 and the second insulating layer 52 on the upper surface of the second insulating layer 52. The side surface of the third insulating layer 53 in the direction where the second electrode 22 is disposed may be aligned with the side surface of the second insulating layer 52. Furthermore, the third insulating layer 53 may also be disposed on a non-light-emitting area (e.g., the first insulating layer 51 disposed on the first planarization layer 19). However, it is not limited to this.

[0139] The second contact electrode 27 is disposed on the second electrode 22, the second insulating layer 52, and the third insulating layer 53. The second contact electrode 27 can contact the other end of the inorganic light-emitting diode element 95 and the exposed upper surface of the second electrode 22. The other end of the inorganic light-emitting diode element 95 can be electrically connected to the second electrode 22 through the second contact electrode 27.

[0140] That is, the first contact electrode 26 can be disposed between the first electrode 21 and the third insulating layer 53, and the second contact electrode 27 can be disposed on the third insulating layer 53. The second contact electrode 27 can partially contact the second insulating layer 52, the third insulating layer 53, the second electrode 22, and the inorganic light-emitting diode element 95. One end of the second contact electrode 27 can be disposed on the third insulating layer 53. The first contact electrode 26 and the second contact electrode 27 can be separated from each other by the second insulating layer 52 and the third insulating layer 53. However, this is not a limitation; depending on the circumstances, the third insulating layer 53 can be omitted.

[0141] Contact electrodes 26 and 27 may include conductive materials. For example, they may include ITO, IZO, ITZO, aluminum (Al), etc. For example, contact electrodes 26 and 27 may include transparent conductive materials, and light emitted from the inorganic light-emitting diode element 95 may pass through contact electrodes 26 and 27 to travel to electrodes 21 and 22. Each electrode 21 and 22 may include a material with high reflectivity, and electrodes 21 and 22 placed on the inclined side surface of the first embankment 40 may reflect incident light toward the upper part of the first substrate 11. However, this is not a limitation.

[0142] The fourth insulating layer 54 can be disposed on the entire surface of the first substrate 11. The fourth insulating layer 54 can protect the components disposed on the first substrate 11 from the influence of the external environment.

[0143] Each of the first insulating layer 51, the second insulating layer 52, the third insulating layer 53, and the fourth insulating layer 54 may comprise an inorganic insulating material or an organic insulating material. In an exemplary embodiment, the first insulating layer 51, the second insulating layer 52, the third insulating layer 53, and the fourth insulating layer 54 may comprise an inorganic insulating material, such as silicon oxide (SiO2). x ), silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y Examples of organic insulating materials include: alumina (Al₂O₃) and aluminum nitride (AlN). Alternatively, they may include acrylic resins, epoxy resins, phenolic resins, polyamide resins, polyimide resins, unsaturated polyester resins, polystyrene resins, polyphenylene sulfide resins, benzocyclobutene, calomel resins, siloxane resins, silsesquioxane resins, polymethyl methacrylate, polycarbonate, and polymethyl methacrylate-polycarbonate synthetic resins. However, they are not limited to these.

[0144] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art should understand that the invention can be implemented in other specific forms without changing the technical concept or essential features of the invention. Therefore, the above embodiments should be understood as exemplary in all respects, and not restrictive.

Claims

1. A manufacturing apparatus for a display device, comprising: A worktable for supporting a target substrate including a first voltage-applying pad electrically connected to a first probe, the target substrate being moved along a first direction and located on the upper surface of the worktable; The first guide rail is fixed to the lower surface of the worktable, extends along the first direction, and moves together with the worktable; The first slip ring module is arranged below the first guide rail, extends along the first direction, and does not move with the worktable; as well as The first probe is fixedly arranged on one end side surface of the worktable in the first direction and is electrically connected to the first guide rail that moves together with the worktable. Specifically, a first voltage for forming an electric field is generated in the first slip ring module. The first slip ring module is electrically connected to the first guide rail to apply the first voltage generated by the first slip ring module to the first guide rail. The first voltage applied to the first guide rail is provided to the first voltage application pad through the first probe.

2. The manufacturing equipment for the display device according to claim 1, further comprising: The second guide rail is fixed to the lower surface of the worktable, spaced apart from the first guide rail along a second direction intersecting the first direction, and extends along the first direction; The second slip ring module is arranged below the second guide rail, spaced apart from the first slip ring module along the second direction, extends along the first direction, and does not move with the worktable; as well as The second probe is fixedly arranged on one end side surface of the worktable in the first direction and is electrically connected to the second guide rail.

3. The manufacturing equipment for the display device according to claim 2, wherein, The target substrate also includes a second voltage application pad electrically connected to the second probe.

4. The manufacturing equipment for the display device according to claim 3, wherein, A second voltage is generated in the second slip ring module to form the electric field; The second slip ring module is electrically connected to the second guide rail to apply the second voltage generated by the second slip ring module to the second guide rail. The second voltage applied to the second guide rail is provided to the second voltage application pad via the second probe.

5. The manufacturing equipment for the display device according to claim 4, wherein, One of the first voltage and the second voltage includes an AC voltage, and the other of the first voltage and the second voltage includes a ground voltage.

6. The manufacturing equipment for the display device according to claim 4, further comprising: An inkjet device that sprays ink onto the target substrate.

7. The manufacturing equipment for the display device according to claim 6, wherein, The inkjet device sprays the ink onto the target substrate that generates the electric field.

8. The manufacturing equipment for the display device according to claim 7, wherein, The ink comprises a solvent and a plurality of bipolar elements dispersed in the solvent, and Through the electric field, one end of the bipolar element is aligned in one direction.

9. A method for manufacturing a display device, comprising: The target substrate and stage preparation steps include preparing a stage for supporting the target substrate, the target substrate including voltage application pads electrically connected to probes, and moving along a first direction and located on the upper surface of the stage; The voltage generation step includes generating a voltage for creating an electric field in a slip ring module disposed below a guide rail, the guide rail being fixed to the lower surface of the worktable and extending along the first direction. An electric field forming step, wherein an electric field is formed on the target substrate by applying a voltage generated to the voltage application pad through the guide rail electrically connected to the slip ring module and the probe electrically connected to the guide rail; An ink jetting step, wherein ink is jetted onto the target substrate that generates the electric field using an inkjet device; A substrate moving step, wherein the target substrate is moved from the inkjet apparatus to the drying apparatus via the stage; and A drying step, wherein the ink sprayed onto the worktable is dried by the drying device. In the substrate moving step, the target substrate moves from the inkjet device to the drying device while the electric field is generated.

10. The method of claim 9, wherein, In the ink ejection step, the ink includes a solvent and a plurality of bipolar elements dispersed in the solvent, and Through the electric field, one end of the bipolar element is aligned in one direction.

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