Display substrate and manufacturing method thereof, and display device

Abstract

Display substrate, preparation method thereof, and display device. The display substrate includes: a base substrate; a pixel defining layer arranged on one side of the base substrate, the pixel defining layer including an opening area and a non-opening area arranged around the opening area; an organic material layer arranged on the side of the pixel defining layer away from the base substrate; wherein the pixel defining layer in the non-opening area includes a partition structure, and the partition structure is used to thin or isolate the organic material layer at the corresponding position. The present disclosure provides a partition structure on the pixel defining layer in the non-opening area, so that the organic material layer at the corresponding position is thinned or isolated, which is equivalent to reducing or isolating the contact between the organic material layers of each sub-pixel, increasing the contact resistance of the organic material layers between the sub-pixels, and the larger contact resistance prevents the leakage current generated by the light-emitting sub-pixel from flowing to the adjacent sub-pixel, thereby improving lateral leakage and back-lighting, and improving the display effect.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate and a preparation method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) is an active light-emitting display device with the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, wide color gamut, light weight and thinness, and customizable shape. Summary of the Invention

[0003] The present disclosure provides a display substrate, comprising:

[0004] substrate;

[0005] A pixel defining layer is provided on one side of the base substrate, wherein the pixel defining layer includes an opening area and a non-opening area surrounding the opening area;

[0006] An organic material layer is provided on a side of the pixel defining layer away from the base substrate;

[0007] The pixel defining layer in the non-opening area includes a partition structure, and the partition structure is used to thin or partition the organic material layer at the corresponding position.

[0008] In an optional implementation, the partition structure is a partition groove, and the notch of the partition groove faces the opening area.

[0009] In an optional implementation, the pixel defining layer in the non-opening area includes a first material layer and a second material layer stacked together, the first material layer is disposed close to the base substrate, the first material layer has a first end surface facing the opening area, the second material layer has a second end surface facing the opening area, and the first end surface is retracted by a first preset distance relative to the second end surface in a direction away from the opening area;

[0010] Wherein, the first end surface constitutes the bottom of the partition groove.

[0011] In an optional implementation, the pixel defining layer in the non-opening area further includes a third material layer provided on a side of the first material layer close to the base substrate, and the third material layer has a third end surface facing the opening area;

[0012] The first end surface is further retracted relative to the third end surface in a direction away from the opening area.

[0013] In an optional implementation, the second end surface is flush with the third end surface, or the second end surface is retracted by a second preset distance relative to the third end surface in a direction away from the opening area.

[0014] In an optional implementation, the second preset distance is greater than or equal to 30 nanometers and less than or equal to 200 nanometers.

[0015] In an optional implementation, the slope angle of the second end face is greater than or equal to 20° and less than or equal to 70°; and / or,

[0016] The slope angle of the third end face is greater than or equal to 20° and less than or equal to 70°.

[0017] In an optional implementation manner, the material of the first material layer, the material of the second material layer, and the material of the third material layer are all inorganic materials.

[0018] In an optional implementation, the inorganic material includes at least one of the following: silicon oxide, silicon nitride, silicon oxynitride, titanium, and aluminum.

[0019] In an optional implementation, the thickness of the first material layer is greater than or equal to 20 nanometers and less than or equal to 50 nanometers; and / or,

[0020] The thickness of the second material layer is greater than or equal to 20 nanometers and less than or equal to 50 nanometers; and / or,

[0021] The thickness of the third material layer is greater than or equal to 5 nanometers and less than or equal to 40 nanometers.

[0022] In an optional implementation, the pixel defining layer in the non-opening area further includes a fourth material layer provided on a side of the second material layer facing away from the base substrate;

[0023] An orthographic projection of the fourth material layer on the base substrate does not overlap with an orthographic projection of the partition groove on the base substrate.

[0024] In an optional implementation, the first preset distance is greater than or equal to 100 nanometers and less than or equal to 1000 nanometers.

[0025] In an optional implementation, the partition structure is a closed structure surrounding the opening area.

[0026] In an optional implementation, the display substrate further includes:

[0027] A first electrode layer is provided between the base substrate and the pixel defining layer, the first electrode layer includes a first electrode, and an orthographic projection of the first electrode on the base substrate covers an orthographic projection of the opening area on the base substrate; and

[0028] A second electrode layer is provided on the side of the organic material layer facing away from the base substrate, and the second electrode layer is continuous at the location of the partition structure.

[0029] The present disclosure provides a display device, comprising any one of the display substrates described above.

[0030] The present disclosure provides a method for preparing a display substrate, comprising:

[0031] providing a substrate;

[0032] forming a pixel defining layer on one side of the base substrate, wherein the pixel defining layer includes an opening area and a non-opening area surrounding the opening area;

[0033] forming an organic material layer on a side of the pixel defining layer facing away from the base substrate;

[0034] The pixel defining layer in the non-opening area includes a partition structure, and the partition structure is used to thin or partition the organic material layer at the corresponding position.

[0035] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the following is a brief introduction to the drawings required for the description of the embodiments or related technologies. Obviously, the drawings described below are some embodiments of the present disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. It should be noted that the scales in the drawings are for illustration only and do not represent the actual scale.

[0037] Figure 1 A schematic diagram of a planar structure of a display substrate in the related art is shown;

[0038] Figure 2 A schematic cross-sectional structure diagram of a display substrate in the related art is shown;

[0039] Figure 3A schematic cross-sectional structure diagram of a first display substrate provided by an embodiment of the present disclosure is shown;

[0040] Figure 4 A schematic diagram of a partial structure of a first display substrate provided by an embodiment of the present disclosure is shown;

[0041] Figure 5 A partial structural diagram of a second display substrate provided by an embodiment of the present disclosure is shown;

[0042] Figure 6 A schematic cross-sectional structure diagram of a third display substrate provided by an embodiment of the present disclosure is shown;

[0043] Figure 7 A partial structural diagram of a third display substrate provided by an embodiment of the present disclosure is shown;

[0044] Figure 8 A partial structural diagram of a fourth display substrate provided by an embodiment of the present disclosure is shown;

[0045] Figure 9 A schematic diagram of the planar structure of a display substrate provided by an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0047] With the development of OLED technology, the performance of display screens has been greatly improved. At the same time, many technical difficulties have also been encountered. The OLED display substrate includes multiple sub-pixels, each of which includes an opening area or a light-emitting area, such as Figure 1 As shown. Figure 2 Shown Figure 1 The schematic diagram of the cross-sectional structure of the substrate along AA' is shown in FIG. Figure 2 As shown, multiple sub-pixels share a common transport layer 20, which may include layers such as a hole transport layer and an electron transport layer. When a sub-pixel emits light, charge is transferred from the emitting sub-pixel to adjacent sub-pixels through the common transport layer 20. This directional movement of charge leads to leakage current, which in turn causes adjacent sub-pixels to emit light or emit backlight, seriously affecting the display effect.

[0048] In order to solve the above problems, an embodiment of the present disclosure provides a display substrate, referring to Figure 3FIG. 1 shows a schematic cross-sectional structure diagram of a display substrate provided by an embodiment of the present disclosure. Figure 3 As shown, the display substrate includes: a base substrate 31 , a pixel defining layer 32 arranged on one side of the base substrate 31 , and an organic material layer 33 arranged on a side of the pixel defining layer 32 away from the base substrate 31 .

[0049] The pixel defining layer 32 includes an opening area and a non-opening area surrounding the opening area. The pixel defining layer 32 in the non-opening area includes a partition structure A, which is used to thin or partition the organic material layer 33 at the corresponding position.

[0050] In a specific implementation, the organic material layer 33 may include a common transmission layer 331 and a light emitting functional layer 332. The common transmission layer 331 may be disposed on a side of the light emitting functional layer 332 close to the base substrate 31 (eg, Figure 3 ), or a side away from the substrate 31. The common transport layer 331 may include, for example, at least one of the following film layers: a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer.

[0051] In order to achieve color display, Figure 3 As shown, the light-emitting functional layer 332 may include a red light-emitting layer R, a green light-emitting layer G, and a blue light-emitting layer B (not shown in the figure), etc.

[0052] In a specific implementation, the partition structure A may be a partition dam, which may be a structure that protrudes from the pixel defining layer 32 toward the side close to the organic material layer 33; the partition structure A may also be a partition groove, the notch of which faces the organic material layer 33, such as Figure 3 shown.

[0053] The display substrate provided in this example sets a partition structure on the pixel defining layer in the non-opening area, so that the organic material layer at the corresponding position is thinned or isolated, which is equivalent to reducing or isolating the contact between the organic material layers of each sub-pixel, thereby increasing the contact resistance of the organic material layers between the sub-pixels. The larger contact resistance prevents the leakage current generated by the luminous sub-pixel from flowing to the adjacent sub-pixel, blocking the lateral leakage path between the sub-pixels, thereby improving lateral leakage and back-lighting, and improving the display effect.

[0054] In an optional implementation, Figure 3 As shown, the partition structure A is a partition groove, and the notch of the partition groove faces the opening area.

[0055] In this embodiment, the partitioning groove is located on the end surface of the pixel-defining layer 32 in the non-opening area facing the opening area, with the opening of the partitioning groove facing the opening area. During the subsequent evaporation of the organic material layer 33, since the partitioning groove is located on the side of the non-opening area, the organic material layer 33 is not deposited or only partially deposited at the location of the partitioning groove. Therefore, the provision of the partitioning groove can thin or isolate the organic material layer 33 at the location of the partitioning groove.

[0056] Reference Figure 4 Shown Figure 3 The figure shows a schematic diagram of the local structure of the substrate. Figure 4 As shown, the pixel defining layer 32 in the non-opening area includes a first material layer 321 and a second material layer 322 that are stacked. The first material layer 321 is arranged close to the base substrate 31. The first material layer 321 has a first end face facing the opening area, and the second material layer 322 has a second end face facing the opening area. The first end face is retracted by a first preset distance d1 relative to the second end face in a direction away from the opening area.

[0057] The first end surface forms the groove bottom of the partition groove.

[0058] It should be noted that the first end surface and the second end surface are end surfaces of the first material layer 321 and the second material layer 322 facing the same opening area. The first end surface is retracted relative to the second end surface in a direction away from the same opening area.

[0059] like Figure 3 and Figure 4 A first electrode layer 34 may also be provided between the base substrate 31 and the pixel defining layer 32. The first electrode layer 34 includes a first electrode 34, and the orthographic projection of the first electrode 34 on the base substrate 31 overlaps the orthographic projection of the opening region on the base substrate 31. In this case, the surface of the second material layer 322 facing the first electrode 34 forms the wall of the partitioning trench, and the first end surface of the first material layer 321 facing the opening region forms the bottom of the partitioning trench.

[0060] Figure 3 and Figure 4 The figure shows a two-layer partition trench composed of a first material layer 321 and a second material layer 322. In a specific implementation, the two-layer partition trench can be formed using two etching processes to sequentially form the first material layer 321 and the second material layer 322; or the first material layer 321 and the second material layer 322 can be formed simultaneously using a single etching process.

[0061] When a single etching process is used to simultaneously form the first material layer 321 and the second material layer 322, the etching rate of the first material layer 321 can be greater than the etching rate of the second material layer 322 by adjusting the components of the etching gas or etching solution, or adjusting the materials of the first material layer 321 and the second material layer 322, thereby achieving a retraction of the first end face relative to the second end face in a direction away from the opening area.

[0062] The first preset distance d1 may be greater than or equal to 100 nanometers and less than or equal to 1000 nanometers, which is not limited in the present disclosure.

[0063] exist Figure 3 and Figure 4 In the two-layer partition trench shown, the material of the first material layer 321 and the material of the second material layer 322 can both be inorganic materials. The inorganic material can include at least one of the following: silicon oxide, silicon nitride, silicon oxynitride, titanium, and aluminum.

[0064] Specifically, the first material layer 321 may include one or more of the following inorganic materials: silicon oxide, silicon nitride, silicon oxynitride, titanium, and aluminum. The second material layer 322 may include one or more of the following inorganic materials: silicon oxide, silicon nitride, silicon oxynitride, titanium, and aluminum.

[0065] In order to achieve the first end face being retracted relative to the second end face in a direction away from the same opening area, the second material layer 322 can be made of a material with a lower etching rate, and the first material layer 321 can be made of a material with a higher etching rate.

[0066] For example, the material of the first material layer 321 is silicon nitride, and the material of the second material layer 322 is silicon oxide; or the material of the first material layer 321 is silicon oxynitride, and the material of the second material layer 322 is silicon oxide; or the material of the first material layer 321 is aluminum, and the material of the second material layer 322 is titanium; and so on.

[0067] The slope angle a1 of the second end surface can be greater than or equal to 20° and less than or equal to 70°, which is not limited in the present disclosure. The slope angle a1 of the second end surface is the angle between the second end surface and the plane where the base substrate 31 is located.

[0068] Optionally, the thickness of the first material layer 321 may be greater than or equal to 20 nanometers and less than or equal to 50 nanometers, which is not limited in the present disclosure.

[0069] Optionally, the thickness of the second material layer 322 may be greater than or equal to 20 nanometers and less than or equal to 50 nanometers, which is not limited in the present disclosure.

[0070] In a specific implementation, by adjusting the thickness of the first material layer 321, the thickness of the second material layer 322, the first preset distance d1, and the slope angle a1 of the second end face, the organic material layer 33 can be thinned at the location of the partition groove (e.g., Figure 3 and Figure 4 shown) or partition (as Figure 5 shown).

[0071] like Figure 5 As shown, when the organic material layer 33 is disconnected at the location of the partition groove, it is equivalent to isolating the contact between the organic material layers of each sub-pixel, blocking the lateral leakage path between the sub-pixels, thereby further improving the lateral leakage and back light emission, and improving the display effect.

[0072] like Figure 6 As shown, the pixel defining layer 32 in the non-opening area may further include a third material layer 323 disposed on a side of the first material layer 321 close to the base substrate 31 , and the third material layer 323 has a third end surface facing the opening area.

[0073] The first end surface is further retracted relative to the third end surface in a direction away from the opening area.

[0074] It should be noted that the first end surface and the third end surface are end surfaces of the first material layer 321 and the third material layer 323 facing the same opening area. The first end surface is retracted relative to the third end surface in a direction away from the same opening area.

[0075] Reference Figure 7 Shown Figure 6 The figure shows a schematic diagram of the local structure of the substrate. Figure 7 As shown, the third material layer 323, the first material layer 321 and the second material layer 322 form a three-layer structure of the partition groove. The surface of the second material layer 322 facing the third material layer 323 forms the groove wall of the partition groove, and the first end surface forms the groove bottom of the partition groove.

[0076] In a specific implementation, the three-layer partition groove can adopt three etching processes to form the third material layer 323, the first material layer 321 and the second material layer 322 in sequence; or it can adopt one etching process to simultaneously form the third material layer 323, the first material layer 321 and the second material layer 322.

[0077] When a single etching process is used to simultaneously form the third material layer 323, the first material layer 321 and the second material layer 322, the etching rate of the first material layer 321 can be made greater than the etching rates of the second material layer 322 and the third material layer 323 by adjusting the components of the etching gas or etching solution, or adjusting the materials of the third material layer 323, the first material layer 321 and the second material layer 322, thereby achieving a retraction of the first end face relative to the second end face and the third end face in a direction away from the opening area.

[0078] exist Figure 6 and Figure 7 In the three-layer partition trench shown, the materials of the first material layer 321, the second material layer 322, and the third material layer 323 can all be inorganic materials. The inorganic materials may include at least one of silicon oxide, silicon nitride, silicon oxynitride, titanium, and aluminum.

[0079] Specifically, the material of the first material layer 321 may include one or more of the following inorganic materials: silicon oxide, silicon nitride, silicon oxynitride, titanium, and aluminum. The material of the second material layer 322 may include one or more of the following inorganic materials: silicon oxide, silicon nitride, silicon oxynitride, titanium, and aluminum. The material of the third material layer 323 may include one or more of the following inorganic materials: silicon oxide, silicon nitride, silicon oxynitride, titanium, and aluminum.

[0080] In order to achieve the first end face being retracted relative to the second end face and the third end face in a direction away from the same opening area, the second material layer 322 and the third material layer 323 can be made of materials with a lower etching rate, and the first material layer 321 can be made of materials with a higher etching rate.

[0081] For example, the material of the first material layer 321 is silicon nitride, the material of the second material layer 322 is silicon oxynitride, and the material of the third material layer 323 is silicon oxide; or the material of the first material layer 321 is silicon nitride, the material of the second material layer 322 is silicon oxide, and the material of the third material layer 323 is silicon oxide; or the material of the first material layer 321 is silicon oxynitride, the material of the second material layer 322 is silicon oxide, and the material of the third material layer 323 is silicon oxide; or the material of the first material layer 321 is aluminum, the material of the second material layer 322 is titanium, and the material of the third material layer 323 is titanium; and so on.

[0082] It should be noted that the materials of the first material layer 321 , the second material layer 322 and the third material layer 323 may also include organic materials, which is not limited in the present disclosure.

[0083] Alternatively, the second end surface may be flush with the third end surface. In a direction perpendicular to the plane of the substrate, if the second end surface is flush with the third end surface, the second material layer 322 and the third material layer 323 may share a mask, thereby simplifying the process and reducing costs.

[0084] Alternatively, as Figure 7 As shown, the second end surface can be retracted relative to the third end surface in a direction away from the opening region by a second predetermined distance d2. If the second end surface is retracted relative to the third end surface in a direction away from the opening region, the organic material layer 33 can be prevented from accumulating below the second material layer 322, thereby facilitating the formation of a thinned or disconnected organic material layer 33.

[0085] The second preset distance d2 may be greater than or equal to 30 nanometers and less than or equal to 200 nanometers, which is not limited in the present disclosure.

[0086] like Figure 7 As shown, the slope angle a2 of the third end surface can be greater than or equal to 20° and less than or equal to 70°, which is not limited in this disclosure. The slope angle a2 of the third end surface can be the same as or different from the slope angle a1 of the second end surface. The slope angle a2 of the third end surface is the angle between the third end surface and the plane of the substrate.

[0087] The thickness of the third material layer 323 may be greater than or equal to 5 nanometers and less than or equal to 40 nanometers, which is not limited in the present disclosure.

[0088] In a specific implementation, by adjusting the thickness of the first material layer 321, the thickness of the second material layer 322, the thickness of the third material layer 323, the first preset distance d1, the second preset distance d2, the slope angle a2 of the third end face, and the slope angle a1 of the second end face, the organic material layer 33 can be thinned at the location of the partition groove (such as Figure 6 and Figure 7 shown) or partition (as Figure 8 shown).

[0089] like Figure 8 As shown, when the organic material layer 33 is disconnected at the location of the partition groove, it is equivalent to isolating the contact between the organic material layers of each sub-pixel, blocking the lateral leakage path between the sub-pixels, thereby further improving the lateral leakage and back light emission, and improving the display effect.

[0090] like Figures 3 to 8 As shown, the pixel defining layer 32 in the non-opening area may further include a fourth material layer 324 disposed on a side of the second material layer 322 facing away from the base substrate 31 .

[0091] The orthographic projection of the fourth material layer 324 on the base substrate 31 does not overlap with the orthographic projection of the partition groove on the base substrate 31 .

[0092] Specifically, the orthographic projection of the fourth material layer 324 on the base substrate 31 does not overlap with the groove wall of the partition groove, which can prevent the groove wall of the partition groove from being collapsed by the fourth material layer 324 .

[0093] In order to achieve electroluminescence, Figure 3 and Figure 6 As shown, the above-mentioned display substrate may further include a second electrode layer 35 .

[0094] Specifically, the second electrode layer 35 is disposed on the side of the organic material layer 33 facing away from the base substrate 31, and the second electrode layer 35 is continuous at the location of the partition structure A. Figure 3 and Figure 6 As shown, the second electrode layer 35 is continuously provided at the location of the partition groove.

[0095] In order to fully prevent lateral leakage, the partition structure A may be a closed structure surrounding the opening area.

[0096] When partition structure A is a closed structure surrounding the opening area, the organic material layer corresponding to the location of partition structure A can be partially thinned and partially blocked, completely thinned, or completely blocked, and this disclosure is not limited thereto. Specifically, assuming the opening area is shaped like a closed polygon, the organic material layer can be thinned in one section of the polygon and disconnected in another section; the organic material layer can also be completely thinned across the entire polygon; or the organic material layer can also be completely disconnected across the entire polygon.

[0097] To ensure proper power supply and light emission for each sub-pixel, the second electrode layer 35 corresponding to the location of the partition structure A may be partially or fully continuous, though this disclosure does not limit this. When the opening region is a closed polygon, the second electrode layer 35 may be continuous along one section of the polygon and disconnected along another; alternatively, the second electrode layer 35 may be completely continuous across the entire polygon.

[0098] Reference Figure 9 The schematic diagram of the planar structure of the display substrate provided by the present disclosure is shown. The area enclosed by loop line L1 is the opening area; the area outside of the area enclosed by loop line L1 is the non-opening area. The area outside of the area enclosed by loop line L3 is the orthographic projection area of ​​the fourth material layer 324 on the base substrate. The area enclosed by loop line L4 is the orthographic projection area of ​​the first electrode layer on the base substrate.

[0099] when Figure 9 The cross-sectional structure diagram at the middle position BB' is Figure 3 When the partition structure is a two-layer partition groove, the area between the loop line L1 and the loop line L2 can be the orthographic projection area of ​​the second material layer 322 on the base substrate.

[0100] when Figure 9 The cross-sectional structure diagram at the middle position BB' is Figure 6 When the partition structure is a three-layer partition groove, the area between the loop line L1 and the loop line L2 can be the orthographic projection area of ​​the third material layer 323 on the base substrate.

[0101] The display substrate provided in the present disclosure may include sub-pixels of one or more colors, for example, one or more of a red sub-pixel R, a green sub-pixel G, and a blue sub-pixel B. The sub-pixels may be arranged in, for example, RGBG, GGRB, or RGB, and the present disclosure does not limit this.

[0102] It should be noted that the thickness described in this article refers to the dimension in the direction perpendicular to the plane where the corresponding film layer is located.

[0103] It should be noted that in actual processes, due to limitations in process conditions or other factors, the similarities among the above-mentioned features may not be completely identical and may have some deviations. Therefore, as long as the similarities between the above-mentioned features generally meet the above-mentioned conditions, they are all within the scope of protection of this disclosure. For example, the above-mentioned similarities can be allowed within the allowable error range.

[0104] Another embodiment of the present disclosure further provides a display device, which may include the display substrate described in any embodiment.

[0105] Among them, the pixel structure of the display substrate can be an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (Mini LED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), etc.

[0106] It should be noted that the display device in this embodiment can be any product or component with 2D or 3D display function, such as a display panel, electronic paper, mobile phone, tablet computer, television, laptop computer, digital photo frame, or navigator.

[0107] Another embodiment of the present disclosure further provides a method for preparing a display substrate, the method comprising:

[0108] Step S01: providing a base substrate.

[0109] Step S02: forming a pixel defining layer on one side of the base substrate, wherein the pixel defining layer includes an opening area and a non-opening area surrounding the opening area;

[0110] Step S03: forming an organic material layer on the side of the pixel defining layer facing away from the base substrate.

[0111] The pixel defining layer in the non-opening area includes a partition structure, and the partition structure is used to thin or partition the organic material layer at the corresponding position.

[0112] The display substrate of any of the above embodiments can be prepared by using the preparation method provided in this embodiment.

[0113] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0114] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity, or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, commodity, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, commodity, or device that includes the element.

[0115] The above is a detailed introduction to a display substrate, a preparation method thereof, and a display device provided by the present disclosure. Specific examples are used herein to illustrate the principles and implementation methods of the present disclosure. The description of the above embodiments is only used to help understand the method and core ideas of the present disclosure. At the same time, for those skilled in the art, according to the ideas of the present disclosure, there may be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present disclosure.

[0116] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0117] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

[0118] References herein to "one embodiment," "an embodiment," or "one or more embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Furthermore, please note that instances of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0119] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present disclosure may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0120] In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in the claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present disclosure may be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. A display substrate, comprising: substrate; A pixel defining layer is provided on one side of the base substrate, wherein the pixel defining layer includes an opening area and a non-opening area surrounding the opening area; An organic material layer is provided on a side of the pixel defining layer away from the base substrate; The pixel defining layer in the non-opening area includes a partition structure, which is used to thin or isolate the organic material layer at the corresponding position, wherein the partition structure is a partition groove, and the notch of the partition groove faces the opening area, and the organic material layer is thinned or disconnected at the location of the partition groove; The pixel defining layer in the non-opening area includes a first material layer, a second material layer and a fourth material layer arranged on a side of the second material layer away from the base substrate; An orthographic projection of the fourth material layer on the base substrate does not overlap with an orthographic projection of the partition groove on the base substrate.

2. The display substrate according to claim 1, wherein The first material layer is disposed near the base substrate, the first material layer has a first end surface facing the opening area, the second material layer has a second end surface facing the opening area, and the first end surface is retracted by a first preset distance relative to the second end surface in a direction away from the opening area; Wherein, the first end surface constitutes the bottom of the partition groove.

3. The display substrate according to claim 2, wherein: The pixel defining layer in the non-opening area further includes a third material layer provided on a side of the first material layer close to the base substrate, the third material layer having a third end surface facing the opening area; The first end surface is further retracted relative to the third end surface in a direction away from the opening area.

4. The display substrate according to claim 3, wherein: The second end surface is flush with the third end surface, or the second end surface is retracted by a second preset distance relative to the third end surface in a direction away from the opening area.

5. The display substrate according to claim 4, wherein: The second preset distance is greater than or equal to 30 nanometers and less than or equal to 200 nanometers. The display substrate according to claim 3 , wherein: The slope angle of the second end surface is greater than or equal to 20° and less than or equal to 70°; and / or, The slope angle of the third end face is greater than or equal to 20° and less than or equal to 70°.

7. The display substrate according to claim 3, wherein: The material of the first material layer, the material of the second material layer, and the material of the third material layer are all inorganic materials.

8. The display substrate according to claim 7, wherein: The inorganic material includes at least one of the following: silicon oxide, silicon nitride, silicon oxynitride, titanium, and aluminum.

9. The display substrate according to claim 3, wherein: The thickness of the first material layer is greater than or equal to 20 nanometers and less than or equal to 50 nanometers; and / or, The thickness of the second material layer is greater than or equal to 20 nanometers and less than or equal to 50 nanometers; and / or, The thickness of the third material layer is greater than or equal to 5 nanometers and less than or equal to 40 nanometers.

10. The display substrate according to claim 2, wherein: The first preset distance is greater than or equal to 100 nanometers and less than or equal to 1000 nanometers.

11. The display substrate according to any one of claims 1 to 10, wherein: The partition structure is a closed structure surrounding the opening area.

12. The display substrate according to claim 1, wherein: The display substrate further includes: A first electrode layer is provided between the base substrate and the pixel defining layer, the first electrode layer includes a first electrode, and an orthographic projection of the first electrode on the base substrate covers an orthographic projection of the opening area on the base substrate; and A second electrode layer is provided on the side of the organic material layer facing away from the base substrate, and the second electrode layer is continuous at the location of the partition structure.

13. A display device, wherein: The display substrate comprises the display substrate according to any one of claims 1 to 12.

14. A method for preparing a display substrate, comprising: providing a substrate; forming a pixel defining layer on one side of the base substrate, wherein the pixel defining layer includes an opening area and a non-opening area surrounding the opening area; forming an organic material layer on a side of the pixel defining layer facing away from the base substrate; The pixel defining layer in the non-opening area includes a partition structure, which is used to thin or isolate the organic material layer at the corresponding position, wherein the partition structure is a partition groove, and the notch of the partition groove faces the opening area, and the organic material layer is thinned or disconnected at the location of the partition groove; The pixel defining layer in the non-opening area includes a first material layer, a second material layer and a fourth material layer arranged on a side of the second material layer away from the base substrate; An orthographic projection of the fourth material layer on the base substrate does not overlap with an orthographic projection of the partition groove on the base substrate.

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