display module

Abstract

A display module includes a buffer plate having a transmittance of 20% to 40% at a spectral wavelength of 380 nm to 780 nm in an area thereof other than an area in which a through-hole is formed, so that a difference in transmittance in an area in which the through-hole is not formed and an area in which the through-hole is formed can be minimized as much as possible. Minimizing the difference in transmittance in the area in which the through-hole is not formed and the area in which the through-hole is formed can realize reflectance visibility in the area in which the through-hole is not formed and reflectance visibility in the area in which the through-hole is formed as close to each other as possible, thereby minimizing low gray level non-uniformity near the through-hole area.

Description

Technical Field

[0001] This disclosure relates to a display module that includes through-holes in the display area. More specifically, this disclosure provides a display module that minimizes the occurrence of low-grayscale mura near the through-holes. Background Technology

[0002] Display devices are being implemented in a variety of forms, such as televisions, monitors, smartphones, tablets, laptops, and wearable devices.

[0003] A display device typically includes a display area of ​​a display screen and a non-display area formed along the periphery of the display area.

[0004] The non-display area is also known as the bezel area. When the bezel area is thick, the user's gaze is distracted; when the bezel area is thin, the user's gaze is fixed on the display area of ​​the screen, thus enhancing the user's sense of immersion.

[0005] In one example, in recent display devices, various components such as camera modules, speakers, and facial recognition sensor modules can be placed on the front of the display device with the display area.

[0006] In this case, the area where the aforementioned components are located may be a non-display area, and the increase in non-display areas may lead to a decrease in user immersion. Summary of the Invention

[0007] In order to minimize the increase in non-display area caused by various components placed on the front of the display device, holes can be formed in the display area so that the components can be inserted into the holes respectively.

[0008] Specifically, holes can be formed in at least one area of ​​the buffer plate disposed on the back of the display panel, allowing various components to be inserted into the holes respectively. Furthermore, holes can be formed in the display panel according to the characteristics of the components.

[0009] By inserting various components into the holes formed in the display area instead of the non-display area, the reduction in the display area can be minimized without increasing the non-display area, thereby enhancing the user's immersive experience.

[0010] However, due to the holes formed in the display area, there may be a difference in contrast between the areas with and without holes, due to the difference in light transmittance between the areas with and without holes.

[0011] In particular, when the buffer plate is black, the color difference between the areas with holes and the areas without holes becomes more pronounced, thus making the difference in contrast between the areas with holes and the areas without holes more obvious.

[0012] Therefore, when the scrolling pattern used to test the display panel is driven under various environmental conditions, changes in the elements that alter the screen color of the display panel may occur due to the color difference between the areas with and without holes.

[0013] Changes in the components of the display panel eventually lead to uneven low gray levels around the area where holes are formed.

[0014] Therefore, this disclosure relates to a display module that includes a through-hole defined in a display area and reduces low grayscale non-uniformity near the through-hole.

[0015] One aspect of this disclosure provides a display module that can reduce the difference in transmittance between areas with and without holes in the display area.

[0016] Another aspect of this disclosure provides a display module that enables the visibility of reflected light in the area with holes and in the area without holes in the display area, in a manner that allows them to be as close as possible to each other.

[0017] Another aspect of this disclosure provides a display module that can minimize component variations that may occur when a scrolling pattern used to test a display device is driven under various environmental conditions such as room temperature, high temperature, and high humidity.

[0018] Another aspect of this disclosure provides a display module that minimizes the occurrence of low grayscale inhomogeneity that may result from component variations.

[0019] In the following description, other features and aspects will be described in detail to a certain extent and will become readily apparent from the description or may be learned by practice of the inventive concepts provided herein. Other features and aspects of the inventive concepts may also be realized and obtained by means of the structures described in detail in the written description or derived therefrom, the appended claims, and the drawings. A display module according to an embodiment of this disclosure includes a display panel, a back plate disposed on the back side of the display panel, and a buffer plate disposed on the back side of the back plate, wherein the buffer plate has at least one through-hole defined therein, and the buffer plate has a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm.

[0020] According to some embodiments of this disclosure, the transmittance of the buffer plate is measured based on light emitted from the display module in the front direction, and is its transmittance in the area other than the area where the through-hole is formed.

[0021] According to some embodiments of this disclosure, the buffer plate may include an adhesive layer, a buffer layer, and a heat dissipation layer, wherein the adhesive layer may have a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm.

[0022] According to some embodiments of this disclosure, the adhesive layer may be gray.

[0023] According to some embodiments of this disclosure, the buffer plate may include an adhesive layer, an adhesive support layer, a buffer layer, and a heat dissipation layer, wherein at least one of the adhesive layer and the adhesive support layer may have a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm.

[0024] According to some embodiments of this disclosure, at least one of the adhesive layer and the adhesive support layer may be gray.

[0025] According to some embodiments of this disclosure, the buffer plate has a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm, which minimizes the difference in transmittance between the region with the through-hole and the region without the through-hole, thereby minimizing the occurrence of low gray level inhomogeneity near the through-hole.

[0026] The display module according to some embodiments of the present disclosure includes a buffer plate having a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm in the region other than the region in which the through-hole is formed, thereby minimizing the difference in transmittance between the region without the through-hole and the region with the through-hole.

[0027] Minimizing the difference in transmittance between areas without and with vias allows for the visibility of reflected light in both areas to be as close as possible to each other.

[0028] Furthermore, according to some embodiments of this disclosure, the difference in transmittance between regions without vias and regions with vias can be minimized as much as possible. Therefore, component variations that may occur when the rolling pattern used in the testing apparatus is driven under various environmental conditions such as room temperature, high temperature, and high humidity can be minimized.

[0029] Furthermore, according to some embodiments of this disclosure, minimizing component variations can minimize the occurrence of low grayscale non-uniformity near the area where vias are formed, which could otherwise result in low grayscale non-uniformity due to component variations.

[0030] The effects of this disclosure are not limited to those described above, and those skilled in the art will clearly understand from the following description other effects not mentioned. Attached Figure Description

[0031] The accompanying drawings are included to provide a further understanding of the present disclosure and form part of this application, illustrating embodiments of the present disclosure and serving, together with the description, to explain the principles of the present disclosure.

[0032] Figure 1A and Figure 1B These are plan views of the front and back sides of a display device according to an embodiment of the present disclosure.

[0033] Figure 2 This is a plan view of the back of a display module according to an embodiment of the present disclosure.

[0034] Figure 3 This is a cross-sectional view of a display module including through holes according to an embodiment of the present disclosure.

[0035] Figure 4 This is a cross-sectional view of a display module including through holes according to another embodiment of the present disclosure.

[0036] Figure 5 This is a cross-sectional view of a display module including through holes according to another embodiment of the present disclosure.

[0037] Figure 6A and Figure 6B These are cross-sectional views showing the differences in light reflection due to differences in transmittance according to comparative examples and embodiments of the present disclosure, respectively.

[0038] Figure 7A and Figure 7B The images shown are actual photographs of the buffer plates according to the comparative examples and embodiments of the present disclosure, respectively.

[0039] Figure 8A and Figure 8B These are actual photographs of the front of a display module including a buffer plate, according to a comparative example and an embodiment of the present disclosure, respectively. Detailed Implementation

[0040] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become apparent from the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various different forms. Therefore, these embodiments are set forth only to complete this disclosure and to fully inform those skilled in the art to which this disclosure pertains, and this disclosure is limited only by the scope of the claims.

[0041] The shapes, dimensions, scales, angles, quantities, etc., disclosed in the accompanying drawings used to describe embodiments of this disclosure are exemplary, and this disclosure is not limited thereto. The same reference numerals throughout this document refer to the same elements. Furthermore, for the sake of simplicity, descriptions and details of well-known steps and elements have been omitted. In addition, numerous specific details are set forth in the following detailed description of this disclosure to provide a thorough understanding of it. However, it should be understood that this disclosure can be practiced without these specific details. In other instances, well-known methods, processes, components, and circuits have not been described in detail to avoid unnecessarily obscuring aspects of this disclosure. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, the singular forms “a” and “an” are also intended to include the plural forms unless the context clearly indicates otherwise. It should be further understood that, when used in this specification, the terms “comprising,” “including,” and “having” specify the presence of the stated features, integers, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, operations, elements, components, and / or portions thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. When used before a column of elements, expressions such as "at least one" may modify the entire column of elements, but may not modify the individual elements within that column. In the interpretation of numerical values, errors or tolerances may arise even if not explicitly described.

[0042] Furthermore, it should be understood that when a first element or layer is referred to as existing "on" a second element or layer, the first element may be directly disposed on the second element, or may be indirectly disposed on the second element if a third element or layer is disposed between the first and second elements or layers. It should be understood that when an element or layer is referred to as being "connected to" or "coupled to" another element or layer, it may be directly on the other element or layer, directly connected to or coupled to the other element or layer, or one or more intermediate elements or layers may exist. Additionally, it should be understood that when an element or layer is referred to as being "between" two elements or layers, it may be the only element or layer between the two elements or layers, or one or more intermediate elements or layers may exist.

[0043] In descriptions of temporal relationships, such as those between two events, such as "after," "following," or "before," unless it is specified that "directly after," "directly following," or "directly before," another event may occur between the two events.

[0044] It should be understood that while the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the spirit and scope of this disclosure, the first element, component, region, layer, or portion described below may be referred to as the second element, component, region, layer, or portion.

[0045] The features of the various embodiments of this disclosure can be combined or integrated with each other in part or in whole, and can interact and cooperate with each other, and can be driven in a manner that can be fully understood by those skilled in the art. The embodiments of this disclosure can be implemented independently of each other, or they can be implemented together in combination with each other.

[0046] The following sections will describe in detail the various configurations of display modules that can reduce low grayscale inhomogeneity near vias.

[0047] Figure 1A A brief illustration shows the front of the display device where the display area AA is located. Figure 1B The back of the display device is briefly shown.

[0048] also, Figure 2 This is a plan view of the back of a display module according to an embodiment of the present disclosure.

[0049] As used herein, the front direction refers to the direction facing the front, i.e., the Z-axis direction. In other words, the front direction refers to the direction the cover member 20 faces, while the back direction refers to the direction facing the rear, i.e., the -Z-axis direction. In other words, the back direction refers to the direction the frame 30 faces. Furthermore, as used herein, the top of the display device 1 or display module 10 faces the Y-axis direction, while the bottom of the display device 1 or display module 10 faces the -Y-axis direction.

[0050] The display device 1 includes a display module 10, which includes a cover member 20 and a frame 30 disposed on the back of the display module 10 and supporting the cover member 20.

[0051] The cover member 20 can be configured to cover the display panel and protect the display module 10 from external impacts.

[0052] The edge of the cover member 20 may have a rounded shape that is curved in the direction toward the back of which the display panel 200 is disposed.

[0053] In this case, the cover member 20 can cover at least a portion of the side of the display module 10 disposed on its back, thereby protecting not only the front of the display module 10, but also its sides from external impacts.

[0054] The cover member 20 includes the display area AA of the display screen, and therefore can be formed of a transparent material such as encapsulating glass to display the screen. For example, the cover member 20 can be formed of a transparent plastic material, a glass material, or a tempered glass material.

[0055] The frame 30 can be disposed on the back of the display module 10 and therein accommodate the display module 10, and contact the cover member 20 to support the cover member 20.

[0056] The frame 30 serves as a housing defining the outermost back surface of the display device 1 and can be formed from various materials such as plastic, metal, or glass.

[0057] Furthermore, the front surface of the cover member 20 can be divided into a display area AA and a non-display area NAA, which is the area other than the display area AA. The non-display area NAA can be formed along the edge of the display area AA, and the non-display area NAA can be defined as a border area.

[0058] Figure 2 It is a plan view of the back of the display module 10 including the cover member 20, and shows the frame 30 not connected to it.

[0059] like Figure 2 As shown, in the display module 10, in order to reduce the bezel area, the display panel, specifically, the flexible circuit board 220 coupled to the display substrate 201, can be bent toward the back of the display panel.

[0060] The flexible circuit board 220 can be bent at the bottom of the display module 10. Therefore, the display substrate 201 and the flexible circuit board 220 can overlap each other and form the back of the display panel, thereby minimizing the bezel area.

[0061] The buffer plate 300 can be mounted on the back of the display module 10.

[0062] The buffer plate 300 may have at least one through hole 350 defined therein. For example, the through hole 350 may include a first through hole 351, a second through hole 352, and a third through hole 353.

[0063] In one example, the first through-hole 351 may be located near the center of the display area AA on which the flexible circuit board 220 is disposed.

[0064] The fingerprint sensor module 510 can be inserted into the first through hole 351 from the back of the display module 10.

[0065] In this case, a separate through hole may not be formed in the area of ​​the display panel 200 corresponding to the first through hole 351, so that the user in front of the display module 10 will not directly recognize the fingerprint sensor module 510.

[0066] The fingerprint sensor module 510, located on the back of the display panel 200, can be activated when it detects that a user is touching the front of the display module 10.

[0067] Therefore, the first through hole 351 (in which the fingerprint sensor module 510 is inserted) is set at the corresponding position in the display area AA, so that the display area AA will not be reduced.

[0068] In one example, the second through hole 352 and the third through hole 353 may be located in the display area AA near the top of the display module 10.

[0069] The camera sensor module 520 can be inserted into the second through hole 352, and the infrared sensor module 530 can be inserted into the third through hole 353.

[0070] In this case, the through holes can be further defined at positions on the display panel 200 corresponding to the second through hole 352 and the third through hole 353, respectively, so that the camera sensor module 520 and the infrared sensor module 530 can be recognized by the user in front of the display module 10.

[0071] In this way, the camera sensor module 520 and the infrared sensor module 530 are not placed in a separate non-display area NAA, but are respectively inserted into through holes that are defined in the display area AA, thereby minimizing the reduction of the display area AA without increasing the non-display area NAA, thus enhancing the user's immersion.

[0072] As mentioned above, the number of through holes in the buffer plate 300 is not limited to a specific number. Additional through holes can be formed to allow additional components, such as receivers, to be inserted therein.

[0073] In the following text, reference will be made to Figures 3 to 5 A detailed description is provided of various embodiments of a display module including through-holes according to the present disclosure.

[0074] According to one embodiment of the present disclosure, a display module 10 includes a display panel 200, a back plate 210 disposed on the back side of the display panel 200, and a buffer plate 300 disposed on the back side of the back plate 210, wherein the buffer plate has at least one through hole 350 defined therein.

[0075] The display panel 200 may include a display substrate 201 on which a pixel array is disposed.

[0076] The display substrate 201 can be used as a base substrate for the display panel 200. The display substrate 201 can be formed of a flexible plastic material, and therefore can be used as a flexible display substrate.

[0077] In one example, the display substrate 201 may be formed of polyimide, which is a flexible plastic material, or it may be formed of a flexible thin glass material.

[0078] A pixel array can be formed on one surface of the display substrate 201. The pixel array can be formed as a display area AA corresponding to the front-facing image displayed towards the cover member 20.

[0079] Therefore, the area of ​​the cover member 20 corresponding to the pixel array can be the display area AA, and the area other than the display area AA can be the border area.

[0080] Pixel arrays can be implemented in the form of various elements that display images. However, pixel arrays are not particularly limited.

[0081] The pixel array can be disposed in a pixel region defined by signal lines on one side of the display substrate 201, and can include multiple pixels that display an image based on signals provided to the signal lines. The signal lines can include gate lines, data lines, and pixel driving power lines.

[0082] Each of the plurality of pixels may include a switching thin-film transistor, an anode electrically connected to the switching thin-film transistor, a light-emitting element layer formed on the anode, and a cathode electrically connected to the light-emitting element layer, all of which are disposed in the pixel region.

[0083] The anode can be set in each pixel region to correspond to an opening region defined according to the pattern shape of the pixel, and can be electrically connected to a switching thin-film transistor.

[0084] In one example, the light-emitting element layer may include organic light-emitting elements formed on the anode. The organic light-emitting elements may be implemented to emit light of the same color, such as white light, in the pixel, or may be implemented to emit different colors, such as red, green, and blue light beams, in the pixel.

[0085] In another example, the light-emitting element layer may include miniature light-emitting diode elements electrically connected to each of the anode and cathode. A miniature light-emitting diode element refers to a light-emitting diode implemented as an integrated circuit (IC) or chip, and may include a first terminal electrically connected to the anode and a second terminal electrically connected to the cathode.

[0086] The cathodes can be connected together to the light-emitting elements in the light-emitting element layer located in each pixel area.

[0087] The back panel 210 is placed on the back of the display panel 200.

[0088] The back plate 210 is disposed on the back of the display panel 200 to enhance the rigidity of the display panel 200 and keep the display panel 200 flat.

[0089] The buffer plate 300 is located on the back of the back plate 210.

[0090] In one embodiment, such as Figure 3 As shown, the buffer plate 300 may include an adhesive layer 310, a buffer layer 320, an anti-peel layer 330, and a heat dissipation layer 340.

[0091] Furthermore, in another embodiment, such as Figure 4 and Figure 5 As shown, the buffer plate 300 may include an adhesive layer 310, an adhesive support layer 311, a buffer layer 320, an anti-peel layer 330, and a heat dissipation layer 340.

[0092] The adhesive layer 310, buffer layer 320, anti-peel layer 330 and heat dissipation layer 340 of the buffer plate 300 can be stacked in this order facing the back of the display module 10.

[0093] Furthermore, the adhesive layer 310, adhesive support layer 311, buffer layer 320, anti-peel layer 330 and heat dissipation layer 340 of the buffer plate 300 can be stacked in this order facing the back of the display module 10.

[0094] However, the arrangement order of the layers constituting the buffer plate 300 is not limited to this and can be changed as needed.

[0095] The adhesive layer 310 can be configured to secure the buffer plate 300 to the back plate 210. The adhesive layer 310 can contact the back side of the back plate 210 to form an interface with the back plate 210.

[0096] In one example, the adhesive layer 310 may be formed of pressure-sensitive adhesive (PSA).

[0097] The adhesive support layer 311 can support the adhesive layer 310, so that the buffer plate 300 can be firmly fixed to the back plate 210.

[0098] Therefore, the adhesive support layer 311 can contact the back side of the adhesive layer 310 to form an interface with the adhesive layer 310.

[0099] The adhesive support layer 311 can be implemented as an embossed layer, which includes an uneven structure formed on its surface. When the buffer plate 300 is attached to the back plate 210, the uneven structure of the adhesive support layer 311 can prevent air bubbles from forming between the back plate 210 and the buffer plate 300.

[0100] In one example, the adhesive support layer 311 may be formed of PET material. However, the embodiments of this disclosure are not limited thereto.

[0101] The buffer layer 320 can be disposed on the back side of the adhesive support layer 311.

[0102] The buffer layer 320 may include foam strips or foam pads and may be black. The buffer layer 320 can mitigate impacts applied to various components that may come into contact with the buffer plate 300. The shock-absorbing buffer layer 320 can enhance the rigidity of the buffer plate 300.

[0103] The anti-peel layer 330 can be disposed on the back side of the buffer layer 320. The anti-peel layer 330 can be formed of a flexible material such as polyimide or PET film.

[0104] When the display panel 200 is bent, curvature is created. Therefore, the buffer plate 300 attached to it may have peeling defects.

[0105] Therefore, the buffer plate 300 may include a flexible anti-peel layer 330. Thus, although curvature is generated when the display panel 200 is bent, peeling defects can be minimized.

[0106] Furthermore, the anti-peel layer 330 can be implemented as a black layer with a black color. Therefore, the anti-peel layer 330 can be used as a black layer, thereby improving the sensitivity of components in the display device and preventing their performance degradation.

[0107] The heat dissipation layer 340 can be disposed on the back side of the anti-peel layer 330.

[0108] The heat dissipation layer 340 can be used to provide heat dissipation for components that generate high temperatures, and may include materials with high thermal conductivity.

[0109] For example, the heat dissipation layer 340 may include a metal layer with high thermal conductivity and, for example, formed of copper, or may include a graphite layer. Furthermore, since the heat dissipation layer 340 is conductive, it may have functions of heat dissipation, grounding, and protecting the back side of the display substrate 201.

[0110] The buffer plate 300 includes at least one through hole 350 extending through the buffer plate 300 and disposed within the display area AA.

[0111] According to Figures 3 to 5 In one embodiment, the first through-hole 351 into which the fingerprint sensor module 510 is inserted is shown as an example of the through-hole 350 of the buffer plate 300.

[0112] Since the through hole 350 is formed to extend through the buffer plate 300, a portion of the buffer plate 300 is removed in the area corresponding to the through hole 350.

[0113] Therefore, the area in the buffer plate 300 where the through hole 350 is formed can have very high transmittance, and is affected by the transmittance of the back plate 210 placed above the buffer plate 300, so it can have a transmittance of about 85% or more.

[0114] Conversely, the area of ​​the buffer plate 300 where the through-hole 350 is not formed may include various layers such as adhesive layer 310, adhesive support layer 311, buffer layer 320, anti-peel layer 330 and heat dissipation layer 340, and may have a transmittance that is affected by each layer.

[0115] For example, at least one of the buffer layer 320 and the anti-peel layer 330 may be black. When the adhesive layer 310 and the adhesive support layer 311 are transparent, the color of the buffer plate 300 is perceived as black.

[0116] However, in the area of ​​the buffer plate 300 where the through-hole 350 is formed, the layers constituting the buffer plate 300 have been removed. Therefore, the through-hole area becomes a transparent area that is not perceived as black by the user.

[0117] Figure 6A The comparative example shown illustrates that light is reflected in a case where each of the buffer layer 320 and the anti-peel layer 330 is black, while each of the adhesive layer 310 and the adhesive support layer 311 is transparent.

[0118] Light incident on the front of the display panel 200 can be reflected from the interfaces between the layers.

[0119] Therefore, light reflection occurs at the interface between the back plate 210 and the buffer plate 300. Most of the light is reflected from the interface between the back plate 210 and the air-filled area of ​​the through-hole 350.

[0120] In one example, in the area where the through-hole 350 is not formed, each of the adhesive layer 310 and the adhesive support layer 311 is formed of a transparent layer, while the buffer layer 320 disposed below the adhesive support layer 311 is black, so that the buffer plate 300 is generally perceived as black.

[0121] Therefore, most of the light incident on the front of the display panel 200 passes through the adhesive layer 310 and the adhesive support layer 311 and is not reflected from the interface of the buffer layer 320, but is absorbed by the black buffer layer 320.

[0122] In other words, in the display module 10 with the same structure as the comparative example, due to the large color difference between the area where the through hole 350 is formed and the area where the through hole 350 is not formed, there is a large difference in transmittance and reflectance between the area where the through hole 350 is formed and the area where the through hole 350 is not formed.

[0123] Therefore, there is a significant difference in contrast between the area where the via 350 is formed and the area where the via 350 is not formed. Such a large difference in contrast may lead to component variations.

[0124] Specifically, the element may include a pixel array having a light-emitting element layer. The area where the via 350 is formed does not include the buffer plate 300, and the contrast ratio or contrast ratio may be reduced due to reflected light, thus potentially degrading display characteristics. To cover up the degraded display characteristics, current is continuously applied to the area where the via 350 is formed, therefore the light-emitting element layer may turn white, i.e., element changes may occur.

[0125] In other words, when an image is displayed on the display panel 200, the current applied to the area where the via 350 is formed and the current applied to the area where the via 350 is not formed may be different from each other. Due to perceptual errors, current is continuously applied to the area where the via 350 is formed, which may cause the element to appear white, i.e., element variation may occur.

[0126] Changes in the components of the display panel can eventually lead to uneven low grayscale levels around the area where the via 350 is formed.

[0127] To address this problem, the buffer plate 300 according to an embodiment of the present disclosure is configured to have a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm.

[0128] In this case, the transmittance of the buffer plate 300 refers to the transmittance measured based on the light emitted from the display module 10 in the front direction.

[0129] Specifically, the transmittance of the buffer plate 300 refers to the transmittance of the buffer plate 300 in the area other than the area where the through hole 350 is formed.

[0130] Specifically, in such Figure 3 In the example shown, the adhesive layer 310 can have a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm.

[0131] In addition, Figure 4 and Figure 5 In the example shown, at least one of the adhesive layer 310 and the adhesive support layer 311 may have a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm.

[0132] Therefore, when at least one of the adhesive layer 310 and the adhesive support layer 311 has a transmittance of 20% to 40% in the spectral wavelength of 380 nm to 780 nm, the transmittance of the buffer plate 300, measured based on the light emitted from the display panel 200 in the front direction, is 20% to 40% in the spectral wavelength of 380 nm to 780 nm.

[0133] According to one embodiment of this disclosure, in order to enable the buffer plate 300 to have a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm, at least one of the adhesive layer 310 or the adhesive support layer 311 may be gray.

[0134] As described above, when at least one of the adhesive layer 310 and the adhesive support layer 311 is gray, the buffer plate 300 can have a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm.

[0135] Gray can be expressed by reading the data values ​​of L*, A*, and B* using a colorimeter and then reading the ΔE*ab (color difference) between these data values ​​and the data values ​​of a standard sample.

[0136] For example, a standard sample can be selected, and the color corresponding to the selected standard sample can be used as a reference to adjust the color difference to ±3, thereby adjusting the color within the range from light gray to dark gray according to the size of the color difference.

[0137] As described above, when the buffer plate 300 is gray, and even when the buffer layer 320 is black, the buffer plate 300 will not be perceived as black, but will generally be perceived as gray.

[0138] Therefore, when compared with a buffer plate 300 perceived as black as in the comparative example, the color difference between the buffer plate 300 perceived as gray as in the example of this disclosure and the color of the through-hole area is reduced, thereby reducing the contrast difference between it and the through-hole area.

[0139] Figure 6B In the embodiments of this disclosure, light is reflected in each of the buffer layer 320 and the anti-peel layer 330, which is black, while each of the adhesive layer 310 and the adhesive support layer 311 is gray and thus has a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm.

[0140] As described above, light incident on the front of the display panel 200 can be reflected from the interfaces between the layers.

[0141] Therefore, light reflection occurs at the interface between the back plate 210 and the buffer plate 300. Most of the light is reflected from the interface between the back plate 210 and the air-filled area of ​​the through-hole 350.

[0142] In one example, in the area where the through-hole 350 is not formed, each of the adhesive layer 310 and the adhesive support layer 311 is gray. Therefore, even when the buffer layer 320 disposed below the adhesive support layer 311 is black, the buffer plate 300 is generally perceived as gray.

[0143] Therefore, most of the light incident through the front of the display panel 200 is reflected from the interface between the back panel 210 and the adhesive layer 310.

[0144] In other words, in the display module according to the embodiments of this disclosure, the buffer plate has a transmittance of 20% to 40% in the spectral wavelength range of 380 nm to 780 nm in areas other than the regions where through-holes are formed. Therefore, the difference in transmittance between the regions where through-holes are not formed and the regions where through-holes are formed can be minimized as much as possible.

[0145] Furthermore, minimizing the difference in transmittance between the regions with and without vias can achieve both reflected light visibility in the regions with and without vias in a manner that brings them as close to each other as possible.

[0146] Furthermore, in the display module according to embodiments of the present disclosure, the difference in transmittance between areas without vias and areas with vias can be minimized as much as possible. Therefore, component variations that may occur when the scrolling pattern used for the testing device is driven under various environmental conditions such as room temperature, high temperature, and high humidity can be minimized.

[0147] In this way, minimizing component variation can minimize the occurrence of low-grayscale non-uniformity that may occur near the area where vias are formed due to component variation.

[0148] Figure 7A and Figure 7B The images shown are actual photographs of the buffer plates according to the comparative examples and embodiments of the present disclosure, respectively.

[0149] Specifically, according to Figure 7A In the comparative example, the buffer plate was identified as black, while according to Figure 7B In one embodiment, the buffer plate is identified as gray.

[0150] like Figure 7A As shown, when the buffer plate of the comparative example is identified as black, it can be seen that there may be a very large difference in contrast between the areas with through holes and the areas without through holes.

[0151] On the contrary, such as Figure 7B As shown, when the buffer plate according to the embodiments of the present disclosure is perceived as gray, the difference in contrast between the region with through holes and the region without through holes can be significantly reduced compared to the comparative example.

[0152] Figure 8A and Figure 8B These are actual photographs of the front of a display module including a buffer plate, according to a comparative example and an embodiment of the present disclosure, respectively.

[0153] like Figure 8A As shown, in the front of the display module according to the comparative example, which includes a buffer plate perceived as black, unevenness appears near the area corresponding to the through hole.

[0154] On the contrary, such as Figure 8B As shown, in the front portion of the display module including a buffer plate perceived as gray according to an embodiment of the present disclosure, no non-uniformity occurs near the area corresponding to the through-hole. Therefore, it can be clearly identified that the non-uniformity is suppressed according to the embodiment of the present disclosure compared to the comparative example.

[0155] In one example, typically, when the display module 10 is provided to a consumer for manufacturing a display device 1, the display module 10 is shipped with the frame 30 not coupled to the back of the display module 10 and the back of the display module 10 exposed.

[0156] Therefore, when the display module 10 is moved or stored for shipment to consumers without the frame 30 being attached to the display module 10, a back protective film (or protective film) 400 can be attached to protect the back of the display module 10.

[0157] Specifically, the back protective film 400 covering the through-hole 350 can be attached to the display module 10 including the through-hole 350 to prevent contamination caused by foreign objects entering or penetrating into the module through the through-hole 350.

[0158] Therefore, the back protective film 400 covering the through hole 350 of the display module 10 can be attached to the back of the display module 10.

[0159] In one example, the back protective film 400 can be attached to the back of the display panel 200 while also being attached to the buffer plate 300. The back protective film 400 can be attached to the back of the buffer plate 300 to cover the through-hole 350.

[0160] However, the embodiments disclosed herein are not limited thereto. The back protective film 400 may be disposed separately from the buffer plate 300. In this case, the buffer plate 300 may be attached to the back of the display module 10 first, and then the back protective film 400 may be attached to the back of the display module 10 separately.

[0161] Since the back protective film 400 covers the through hole 350, it can minimize the intrusion of foreign objects into the through hole 350 or the damage to the module caused by external impact.

[0162] Since the back protective film 400 contacts the back of the buffer plate 300, the film 400 not only protects the surface of the buffer plate 300 itself, but also protects the through hole 350 passing through the buffer plate 300.

[0163] In one example, the back protective film 400 according to an embodiment of the present disclosure may further include an anti-transfer layer 410, which may be attached to the front side of the back protective film 400 and located in the through-hole 350.

[0164] The back protective film adhesive layer can be additionally disposed between the back protective film 400 and the anti-transfer layer 410.

[0165] When the anti-transfer layer 410 is placed on the front of the back protective film 400, it can minimize the intrusion of the adhesive material of the back protective film 400 into the cover member 20 or the display panel 200.

[0166] The front side of the back protective film 400 refers to the surface of the back protective film 400 facing the cover member 20.

[0167] Since the back protective film 400 must be attached to the buffer plate 300, the back protective film adhesive layer is formed on one surface of the back protective film 400 attached to the buffer plate 300.

[0168] The back protective film 400 is attached to the buffer plate 300 to cover the through hole 350. Therefore, after the back protective film 400 is attached to the buffer plate 300, the adhesive layer of the back protective film is exposed toward the through hole 350 in the display area AA of the display panel 200.

[0169] In this case, depending on the location of the through hole 350, the through hole 350 can be formed in the area corresponding to the display panel 200 and the back plate 210, so that the cover member 20, which serves as the top of the display module 10, can be exposed through the through hole 350.

[0170] Therefore, when pressure or impact is applied to the back protective film 400 during the manufacturing process of the display module 10, the adhesive material in the adhesive layer of the back protective film is transferred to the inner surface of the cover member 20, thereby contaminating the cover member 20 and thus causing stains.

[0171] When the inner surface of the cover component 20 is contaminated by adhesive material, the performance of the camera module fastened to the through hole 350 deteriorates.

[0172] However, as in one embodiment according to this disclosure, the anti-transfer layer 410 is additionally provided on the back protective film adhesive layer on the front side of the back protective film 400 facing the cover member 20. Therefore, even when the back protective film 400 comes into contact with the cover member 20 during processing, adhesive material can be prevented from transferring to the cover member 20.

[0173] The anti-transfer layer 410 can be formed of a transparent material.

[0174] Since the anti-transfer layer 410 is provided in a manner corresponding to the through hole 350 and is formed of a transparent material, it is easy to identify whether there are foreign objects inside the through hole 350 even when the back protective film 400 and the anti-transfer layer 410 are not removed.

[0175] The anti-transfer layer 410 can be formed of PET material. However, the embodiments disclosed herein are not limited thereto.

[0176] The following describes a display module according to an embodiment of the present disclosure.

[0177] A display module according to an embodiment of the present disclosure includes a display panel, a back plate disposed on the back side of the display panel, and a buffer plate disposed on the back side of the back plate, wherein the buffer plate has at least one through hole defined therein.

[0178] According to some embodiments of this disclosure, the buffer plate can have a transmittance in the range of 20% to 40% for light with spectral wavelengths from 380 nm to 780 nm.

[0179] According to some embodiments of this disclosure, the transmittance of the buffer plate is measured based on light emitted from the display panel in the front direction, and is the transmittance of a first region of the buffer plate, which is different from a second region of the buffer plate including at least one through hole.

[0180] According to some embodiments of this disclosure, the buffer plate may include an adhesive layer, a buffer layer, and a heat dissipation layer, and the adhesive layer may have a transmittance in the range of 20% to 40% for light with a spectral wavelength of 380 nm to 780 nm.

[0181] According to some embodiments of this disclosure, the adhesive layer may be gray.

[0182] According to some embodiments of this disclosure, the adhesive layer, the buffer layer, and the heat dissipation layer can be sequentially stacked on the back of the display panel.

[0183] According to some embodiments of this disclosure, the buffer plate may include an adhesive support layer, a buffer layer, and a heat dissipation layer, and at least one of the adhesive layer and the adhesive support layer may have a transmittance in the range of 20% to 40% for light with a spectral wavelength of 380 nm to 780 nm.

[0184] According to some embodiments of this disclosure, an adhesive layer, an adhesive layer support layer, a buffer layer, and a heat dissipation layer can be sequentially stacked on the back of the display panel.

[0185] According to some embodiments of this disclosure, at least one of the adhesive layer and the adhesive support layer may be gray.

[0186] According to some embodiments of this disclosure, the adhesive layer may contact the backsheet. Additionally, an adhesive support layer may contact the adhesive layer, and the adhesive layer may contact the backsheet.

[0187] According to some embodiments of this disclosure, the buffer plate may further include an anti-peel layer located between the heat dissipation layer and the buffer layer, and the anti-peel layer may be black.

[0188] According to some embodiments of this disclosure, the portion of the buffer plate corresponding to at least one through hole can be removed.

[0189] According to some embodiments of this disclosure, the display module may further include a protective film attached to the back of the buffer plate to cover at least one through-hole.

[0190] According to some embodiments of this disclosure, the display module may further include an anti-transfer layer attached to the front side of the protective film and disposed in at least one through-hole.

[0191] According to some embodiments of this disclosure, the display module may further include a fingerprint sensor module or a camera module housed in at least one through-hole.

[0192] Various modifications and variations of this disclosure will be apparent to those skilled in the art without departing from its technical concept or scope. Therefore, such modifications and variations, intended to cover embodiments of this disclosure, are permitted as long as they fall within the scope of the appended claims and their equivalents.

Claims

1. A display module, comprising: Display panel; A back panel is disposed on the back of the display panel; as well as A buffer plate is disposed on the back side of the back plate and includes at least one through hole. The buffer plate has a transmittance in the range of 20% to 40% for light with a spectral wavelength of 380 nm to 780 nm. The transmittance of the buffer plate is measured based on light emitted from the front direction of the display panel. The transmittance of the buffer plate is the transmittance of a first region of the buffer plate, which is different from a second region of the buffer plate that includes at least one through hole.

2. The display module according to claim 1, wherein, The buffer plate includes an adhesive layer, a buffer layer, and a heat dissipation layer, which are sequentially stacked on the back side of the display panel. The adhesive layer has a transmittance of 20% to 40% for light with a spectral wavelength of 380 nm to 780 nm.

3. The display module according to claim 2, wherein, The adhesive layer is gray.

4. The display module according to claim 1, wherein, The buffer plate includes an adhesive layer, an adhesive support layer, a buffer layer, and a heat dissipation layer, which are sequentially stacked on the back side of the display panel. Wherein, at least one of the adhesive layer and the adhesive support layer has a transmittance in the range of 20% to 40% for light with a spectral wavelength of 380 nm to 780 nm.

5. The display module according to claim 4, wherein, At least one of the adhesive layer and the adhesive support layer is gray.

6. The display module according to claim 2, wherein, The adhesive layer is in contact with the back plate.

7. The display module according to claim 4, wherein, The adhesive support layer is in contact with the adhesive layer, wherein the adhesive layer is in contact with the back plate.

8. The display module according to claim 2 or 4, wherein, The buffer plate also includes an anti-peel layer located between the heat dissipation layer and the buffer layer, and The anti-peel layer is black.

9. The display module according to claim 1, wherein, The portion of the buffer plate corresponding to the at least one through hole is removed.

10. The display module of claim 1, further comprising a protective film attached to the back of the buffer plate and configured to cover the at least one through hole.

11. The display module according to claim 10, further comprising an anti-transfer layer, the anti-transfer layer being attached to the front side of the protective film and disposed in the at least one through hole.

12. The display module according to claim 1 further includes a fingerprint sensor module or a camera module, wherein the fingerprint sensor module or camera module is accommodated in the at least one through hole.

Images