Touch screen module, manufacturing method and display device

Abstract

The application provides a touch screen module, a preparation method and a display device. The touch screen module comprises a light emitting device layer and a touch layer located on the light emitting side of the light emitting device layer. The touch layer comprises m film layer groups arranged in sequence in a direction away from the light emitting device layer, wherein m is a positive integer greater than or equal to 1. Each film layer group comprises an organic film layer, an inorganic film layer located on the side of the organic film layer away from the light emitting device layer, and a metal film layer located on the side of the inorganic film layer away from the organic film layer. The inorganic film layer has a plurality of openings to fully release stress and relieve the problem of cracks in the inorganic film layer when the touch screen module is bent. The orthographic projection of the metal film layer on the surface of the organic film layer is located in the orthographic projection of the inorganic film layer on the surface of the organic film layer, so that when the metal film layer is formed, the inorganic film layer can fully isolate the metal film layer from the organic film layer, and the metal film layer does not directly contact the organic film layer, thereby avoiding the short circuit problem caused by the formation of a metal complex.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a touch screen module, its manufacturing method, and a display device. Background Technology

[0002] In recent years, flexible display technology has gradually matured, with flexible OLED (Organic Light-Emitting Diode) technology being a representative example. Furthermore, to reduce the overall screen thickness, TOE (Touch On Encapsulation) technology is used to integrate the touch and display circuitry of the entire screen, reducing bonding and sharing the same IC (integrated circuit) driver to lower screen costs.

[0003] The touch layer is located on the light-emitting side of the light-emitting device layer. In order to improve the reliability of the screen when it is bent, the light-emitting device layer is generally used as the neutral layer. However, the touch layer is off from the neutral layer. When the screen is bent, it will be subjected to tensile or compressive stress, which will cause the inorganic film layers such as the dielectric layer and buffer layer in the touch layer to crack, affecting the touch performance. Therefore, in the prior art, the inorganic film layers such as the dielectric layer and buffer layer are replaced with organic film layers to alleviate the cracking problem.

[0004] However, when forming metal traces, the metal film is directly deposited on the organic film. When the metal comes into contact with the organic material, metal complexes are generated. When the metal film is etched in the subsequent process, the metal complexes cannot be completely removed, which can easily lead to short circuits. Summary of the Invention

[0005] This application provides a touch screen module, a manufacturing method, and a display device, which avoids the formation of metal complexes between the metal film layer and the organic film layer in the touch layer while ensuring that the inorganic film layer is not easily broken.

[0006] In a first aspect, a touch screen module is provided for use in foldable phones or computers with foldable screens for displaying images. The touch screen module includes: a light-emitting device layer and a touch layer located on the light-emitting side of the light-emitting device layer; the touch layer includes m film layer groups arranged sequentially along a direction away from the light-emitting device layer, where m is a positive integer greater than or equal to 1; each film layer group includes an organic film layer, an inorganic film layer located on the side of the organic film layer opposite to the light-emitting device layer, and a metal film layer located on the side of the inorganic film layer opposite to the organic film layer; the inorganic film layer has multiple openings to fully release... Stress relief is provided to mitigate the potential cracking of the inorganic film layer when the touch screen module is bent. The orthographic projection of the metal film layer onto the surface of the organic film layer lies within the orthographic projection of the inorganic film layer onto the surface of the organic film layer. This ensures that the inorganic film layer can fully isolate the metal film layer from the organic film layer during the formation of the metal film layer, preventing direct contact between the metal film layer and the organic film layer. This avoids short circuits caused by the formation of metal complexes. Furthermore, when m≥2, the two metal film layers located in two adjacent module layers are connected through metallized vias, allowing the metal film layers of different layers to form a conductive circuit.

[0007] In one specific feasible implementation, in each film layer group, the orthographic projection of the metal film layer on the surface of the organic film layer coincides with the orthographic projection of the inorganic film layer on the surface of the organic film layer. The metal film layer and the inorganic film layer can be etched in one step, which helps to simplify the process.

[0008] In one specific implementation scheme, in each membrane layer group, the area of ​​the metal membrane layer projected onto the surface of the organic membrane layer is smaller than the area of ​​the inorganic membrane layer projected onto the surface of the organic membrane layer, which allows the metal membrane layer to be further away from the organic membrane layer, thus avoiding the formation of metal complexes.

[0009] In one specific feasible implementation, the material of each inorganic film layer is SiN. x SiO x The inorganic film layer comprises one of SiN and SiON; or, the inorganic film layer comprises multiple stacked sub-film layers, wherein each sub-film layer is SiN. x SiO x One of them is SiON.

[0010] In one specific feasible implementation, the thickness of each inorganic film layer is between 1 nm and 1 μm to avoid the inorganic film layer being too thick, which would lead to increased bending stress, or too thin, which would lead to poor strength and easy breakage.

[0011] In one specific feasible implementation, each organic film layer is made of one or more of acrylic, epoxy resin and silicone.

[0012] In one specific feasible implementation, the thickness of each organic film layer is between 0.5μm and 5μm. This avoids the situation where the organic film layer is too thick, which would hinder the achievement of a thinner screen and increase bending stress, or the organic film layer is too thin, which would make the organic film layer easily damaged with increasing bending cycles.

[0013] Secondly, a method for fabricating a touch screen module is provided. The touch screen module includes a light-emitting device layer. The fabrication method includes sequentially forming m film layer groups on the light-emitting side of the light-emitting device layer, where m is a positive integer greater than or equal to 1. When forming each film layer group, an organic film layer is first formed. Then, an inorganic film layer is formed on the side of the organic film layer away from the light-emitting device layer to avoid the subsequent formation of a metal complex with the organic film layer, which could lead to a short circuit. Next, a metal film layer is formed on the side of the inorganic film layer away from the organic film layer. When m ≥ 2, two metal film layers located in adjacent module layers are connected through metallized vias. Then, the inorganic film layer and the metal film layer are patterned to form multiple openings in the inorganic film layer, thereby discretizing the inorganic film layer, reducing bending stress, and preventing cracking of the inorganic film layer. Furthermore, the orthographic projection of the metal film layer onto the surface of the organic film layer needs to be within the orthographic projection of the inorganic film layer onto the surface of the organic film layer to ensure that the inorganic film layer can fully isolate the metal film layer from the organic film layer throughout the entire process.

[0014] When m≥2, there can be multiple ways to form metallized vias. In a specific feasible implementation, during the formation of the second to the mth film layer group, after forming an inorganic film layer on the side of the organic film layer away from the light-emitting device layer, the process further includes: forming multiple connecting holes that penetrate the inorganic film layer and the organic film layer, each connecting hole extending from the surface of the inorganic film layer away from the organic film layer to the surface of the metal film layer in the previous film layer group; depositing metal material on the surface of the inorganic film layer away from the organic film layer, with a portion of the metal material deposited in the connecting holes to form metallized vias, and another portion of the metal material located on the surface of the inorganic film layer away from the organic film layer to form a metal film layer.

[0015] In one specific implementation scheme, in each film layer group, the orthographic projection of the metal film layer onto the surface of the organic film layer coincides with the orthographic projection of the inorganic film layer onto the surface of the organic film layer. This allows for the simultaneous etching of the metal and inorganic film layers, simplifying the process.

[0016] In one specific implementation scheme, in each membrane layer group, the area of ​​the metal membrane layer projected onto the surface of the organic membrane layer is smaller than the area of ​​the inorganic membrane layer projected onto the surface of the organic membrane layer, which allows the metal membrane layer to be further away from the organic membrane layer, thus avoiding the formation of metal complexes.

[0017] Thirdly, a display device is provided, comprising a frame and a touch screen module provided by any of the above-mentioned technical solutions. The frame includes a first middle frame, a rotating support portion, and a second middle frame, which are rotatably connected via the rotating support portion. The touch screen module covers the first middle frame, the rotating support portion, and the second middle frame. Because the touch screen module provided by any of the above-mentioned technical solutions is used, when the touch screen module bends due to the movement of the first middle frame, the rotating support portion, and the second middle frame, the inorganic film layer within the touch screen module is less prone to cracking. Furthermore, the metal film layer will not combine with the organic film layer to form a metal complex, thus preventing short circuits and improving the stability of the display device. Attached Figure Description

[0018] Figure 1a This diagram illustrates the structure of a foldable phone in its unfolded state.

[0019] Figure 1b It shows Figure 1a The diagram shown illustrates the structure of a foldable phone when folded.

[0020] Figure 2a express Figure 1a A cross-sectional view of the central touch screen module 20 at position AA;

[0021] Figure 2b Indicate Figure 2a A schematic diagram of the touch screen module 20 when it is bent.

[0022] Figure 3 Indicate when Figure 2a and Figure 2b A cross-sectional view of the touch layer 25 in the middle when a conventional technical solution is used;

[0023] Figure 4 Indicate when Figure 2a and Figure 2b A cross-sectional view of the touch layer 25 when the touch screen module 20 adopts the technical solution provided in the embodiments of this application;

[0024] Figure 5 Indicate Figure 4 A cross-sectional view of a deformed structure of the touch layer 25 shown;

[0025] Figure 6a A schematic diagram showing the structure after step S101 is provided.

[0026] Figure 6b A schematic diagram showing the structure after step S102 is provided.

[0027] Figure 6c A schematic diagram showing the structure after step S103 is provided.

[0028] Figure 6dA schematic diagram showing the structure after step S104 is provided.

[0029] Figure 6e A schematic diagram showing the structure after step S105 is provided.

[0030] Figure 6f A schematic diagram showing the structure after step S106 is provided.

[0031] Figure 6g A schematic diagram showing the structure after step S107 is provided.

[0032] Figure 6h A schematic diagram showing the structure after step S108 is provided.

[0033] Figure 6i A schematic diagram showing the structure after step S109 is provided.

[0034] Figure 6j A schematic diagram showing the structure after step S110 is provided.

[0035] Figure 7 The diagram shows the structure after step S104'. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0037] To facilitate understanding of the touch screen module provided in this application embodiment, its application scenario will be explained first. The touch screen module is applied in a foldable display device for displaying images. Specifically, the foldable device can be a mobile phone with a foldable screen or a laptop with a foldable screen.

[0038] Take foldable display devices, such as foldable phones, as an example:

[0039] Figure 1a This diagram illustrates the structure of a foldable phone in its unfolded state. Figure 1b It shows Figure 1a The diagram shown illustrates the structure of a foldable phone when folded. Please refer to... Figure 1a and Figure 1b The foldable phone 01 includes a frame 10 and a touchscreen module 20. The frame 10 includes a first middle frame 11, a rotating support 12, and a second middle frame 13. The first middle frame 11 and the second middle frame 13 are rotatably connected via the rotating support 12 around the central axis S. (See reference...) Figure 1bWhen the first middle frame 11 rotates relative to the second middle frame 13 about the central axis S, the first middle frame 11 and the second middle frame 13 fold together, and the touch screen module 20 is exemplarily located outside the frame 10. The touch screen module 20 uses a flexible screen and covers the first middle frame 11, the rotating support 12, and the second middle frame 13. When the first middle frame 11 rotates relative to the second middle frame 13, the rotating support 12 undergoes flexible deformation, still providing sufficient support for the touch screen module 20. The overall structure of the frame 10 can be a known and commonly used prior art, and will not be described in detail here. Figure 1a and Figure 1b The touch screen module 20 in this application may be the touch screen module provided in the embodiments of this application.

[0040] Figure 2a express Figure 1a A cross-sectional view of the central touchscreen module 20 at position AA, for reference. Figure 2a The touchscreen module 20 includes a flexible substrate 21, a thin-film transistor layer 22, a light-emitting device layer 23, a thin-film encapsulation (TFE) layer 24, and a touch layer 25. The thin-film transistor layer 22 is located on the surface of the flexible substrate 21, and the flexible substrate 21 and the thin-film transistor layer 22 form a flexible array substrate. The flexible substrate 21 can be made of PI (polyimide) film. The light-emitting device layer 23 is located on the surface of the flexible substrate (on the side of the thin-film transistor layer 22 facing away from the flexible substrate 21). The light-emitting device layer 23 can be a flexible OLED layer or a flexible light-emitting structure such as a microLED (micro light-emitting diode). The thin-film encapsulation layer 24 is located on the side of the light-emitting device layer 23 facing away from the flexible array substrate. The material of the thin-film encapsulation layer 24 can be any known and commonly used material, which will not be described in detail here. The touch layer 25 is located on the side of the thin-film encapsulation layer 24 facing away from the light-emitting device layer 23, and thus, on the light-emitting side of the light-emitting device layer 23.

[0041] exist Figure 2a In the touch screen module 20 shown, the light-emitting device layer 23 serves as a neutral layer, and is not subjected to tensile stress or only very small tensile stress when bent, while the touch layer 25 is offset from the neutral layer. Figure 2b Indicate Figure 2a The diagram shown illustrates the touchscreen module 20 when bent, i.e., the touchscreen module 20 is bent... Figure 1b The diagram shows the bending process of the touch screen module 20. After bending, the touch layer 25, located on the outside, is subjected to greater tensile stress.

[0042] The following sections will describe the use of conventional technical solutions and the technical solutions provided in the embodiments of this application for the touch layer 25.

[0043] Figure 3Indicate when Figure 2a and Figure 2b A cross-sectional view of the touch layer 25 in the middle using a traditional technical solution, for reference. Figure 3 In a conventional technical solution, the touch layer 25 includes a buffer layer 25a', a dielectric layer 25b', a protective layer 25c', a metal film layer TMA', and a metal film layer TMB'. The buffer layer 25a' is formed on the side of the thin-film encapsulation layer 24 opposite to the light-emitting device layer 23. The metal film layer TMA' is formed on the surface of the buffer layer 25a' opposite to the thin-film encapsulation layer 24, and the metal film layer TMA' is patterned to form a specific type of circuit. The dielectric layer 25b' is formed on the surface of the buffer layer 25a' opposite to the thin-film encapsulation layer 24 and covers the metal film layer TMA'. The metal film layer TMB' is disposed on the surface of the dielectric layer 25b' opposite to the buffer layer 25a', and the metal film layer TMB' is patterned to form a specific type of circuit. The metal film layers TMA' and TMB' are electrically connected through a metallized via TMC' penetrating the dielectric layer 25b'. A protective layer 25c' is formed on the surface of the dielectric layer 25b' facing away from the buffer layer 25a' and is covered with a metal film layer TMB'. When the buffer layer 25a' and the dielectric layer 25b' are made of inorganic materials such as SiNx, inorganic materials have low strength and high brittleness. When the touch screen module 20 is... Figure 2b When the device is bent, the buffer layer 25a' and dielectric layer 25b' crack, and the cracks further propagate into the thin film encapsulation layer 24, causing black spots to appear in some areas of the touch module 20 and causing it to fail. Furthermore, due to the poor bending resistance of the buffer layer 25a' and dielectric layer 25b', the bending radius of the touch screen module 20 cannot be further reduced, making it difficult to bring a better end-product experience. For this reason, the buffer layer 25a' and dielectric layer 25b' are sometimes replaced with organic materials. However, when forming the metal film layer TMA', the metal is directly deposited onto the buffer layer 25a', and the metal and organic materials will form metal complexes. When the metal film layer TMA' is patterned in subsequent steps, the aforementioned metal complexes are difficult to remove, resulting in short circuits in the circuits of the metal film layer TMA'. Here, "complexes" contain units of complex molecules or ions formed by the combination of a central atom or ion with several ligand molecules or ions through coordination bonds. These units are usually called "coordination units".

[0044] Figure 4 Indicate when Figure 2a and Figure 2b A cross-sectional view of the touch layer 25 when the touch screen module 20 adopts the technical solution provided in the embodiments of this application, referring to... Figure 4The touch layer 25 includes film layer group M1, film layer group M2, and protective layer 25c. Film layer group M1 includes an organic film layer 25a formed on the surface of the thin film encapsulation layer 24 opposite to the light-emitting device layer 23, an inorganic film layer 25d formed on the surface of the organic film layer 25a opposite to the surface of the thin film encapsulation layer 24, and a metal film layer TMA formed on the surface of the inorganic film layer 25d opposite to the organic film layer 25a. The inorganic film layer 25a can be made of SiN. x SiO x The inorganic film layer 25d can be a composite film layer, which may specifically include multiple sub-film layers stacked sequentially, each sub-film layer being made of SiN. x SiO x The composite film is formed by combining SiN and SiON materials, wherein adjacent sub-films in the composite film can be made of SiN. x SiO x Unlike SiON, the inorganic film layer 25d has a thickness ranging from 1 nm to 1 μm, specifically 1 nm, 10 nm, 50 nm, 100 nm, 200 nm, 300 nm, 500 nm, 700 nm, 900 nm, or 1 μm. This avoids the problem of excessively thick inorganic film layers leading to increased bending stress, or excessively thin layers resulting in poor strength and brittleness. The organic film layer 25a is one or more of acrylic, epoxy resin, and silicone. This avoids the problem of excessively thick organic film layers hindering screen thinning and increasing bending stress, or excessively thin organic film layers leading to easy damage with increasing bending cycles. When using several of the above materials, it can specifically be a mixture or composite film of these organic materials, and the thickness of the organic film layer 25a is between 0.5 μm and 5 μm, specifically 0.5 μm, 0.7 μm, 1 μm, 1.5 μm, 2 μm, 3 μm, 4 μm, or 5 μm.

[0045] Continue to refer to Figure 4 Since the metal film layer TMA is completely located on the surface of the inorganic film layer 25d, an inorganic material for making the inorganic film layer 25d has been deposited on the surface of the organic film layer 25a before the metal film layer TMA is formed. The inorganic film layer 25d completely isolates the metal film layer TMA and the organic film layer 25a. The metal film layer TMA does not come into direct contact with the organic film layer 25a and is not likely to form a metal complex with the organic film layer 25a. Thus, the short circuit problem caused by the inability to effectively remove the metal complex after the metal film layer TMA is patterned is avoided.

[0046] In addition, Figure 4In the structure shown, the inorganic film layer 25d is also patterned, forming multiple openings U1 and exhibiting a discrete morphology. This facilitates stress release, reducing bending stress compared to a solid inorganic film, thus preventing cracking of the inorganic film layer 25d. Furthermore, the organic film layer 25a itself has a low elastic modulus, resulting in low bending stress and making it less prone to cracking. By employing a composite of patterned inorganic film layer 25d and organic film layer 25a, both the direct contact between the metal film layer TMA and the organic film layer 25a, preventing the formation of metal complexes, and avoiding the technical problem of the inorganic film layer 25d cracking due to insufficient bending stress, can be effectively addressed.

[0047] Furthermore, since the inorganic film layer 25a and the metal film layer TMA have the same pattern, the orthographic projection of the metal film layer TMA onto the surface of the organic film layer 25a completely overlaps with the orthographic projection of the inorganic film layer 25a onto the surface of the organic film layer 25a. This facilitates the direct etching of the inorganic material layer and the metal material layer in one step after first depositing the inorganic material layer to fabricate the inorganic film layer 25a and then depositing the metal material layer to fabricate the metal film layer TMA, thus avoiding the trouble caused by multiple etching processes.

[0048] Continue to refer to Figure 4 Similar to film layer group M1, film layer group M2 includes an organic film layer 25b formed on the surface of organic film layer 25a facing away from light-emitting device layer 23, an inorganic film layer 25e formed on the surface of organic film layer 25b facing away from organic film layer 25a, and a metal film layer TMB formed on the surface of inorganic film layer 25e facing away from organic film layer 25b. Metal film layer TMA and metal film layer TMB are electrically connected through a metallized via TMC penetrating inorganic film layer 25e and organic film layer 25b. The metal materials in metal film layer TMA, metal film layer TMB, and metallized via TMC can all be titanium / aluminum / titanium composite films (a structure with aluminum in the middle and titanium on both sides) or other commonly used metal materials. For details regarding the materials and shapes of organic film layer 25b, inorganic film layer 25e, and metal film layer TMB, please refer to organic film layer 25a, inorganic film layer 25d, and metal film layer TMA in film layer group M1. A protective layer 25c is also covered on the side of the organic film layer 25b that faces away from the organic film layer 25a. This protective layer 25c covers both the inorganic film layer 25e and the metal film layer TMB. The material of the protective layer 25c can be acrylic, epoxy resin, silicone, or other transparent materials with a certain strength, to provide physical protection for the film layer group M2.

[0049] Figure 5 Indicate Figure 4 A cross-sectional view of a deformed structure of the touch layer 25 shown, for reference. Figure 5 , Figure 5 The touch layer 25 shown is Figure 4The difference in the touch layer 25 shown is that the orthographic projection of the metal film layer TMA onto the surface of the organic film layer 25a lies within the orthographic projection of the inorganic film layer 25d onto the surface of the organic film layer 25a. Furthermore, the area of ​​the orthographic projection of the metal film layer TMA onto the surface of the organic film layer 25a is smaller than the area of ​​the orthographic projection of the inorganic film layer 25d onto the surface of the organic film layer 25a. This results in the inorganic film layer 25d having additional structure at its edge relative to the metal film layer TMA, and the metal film layer TMA being recessed relative to the inorganic film layer 25d. This makes it less likely for the metal film layer TMA to come into contact with the organic film layer 25a. During the patterning of the metal film layer TMA, or in subsequent steps such as forming the organic film layer 25b, the metal film layer TMA is less likely to deform due to heat or external force and come into contact with the organic film layer 25a to form a metal complex. The projection relationship between the metal film layer TMB and the inorganic film layer 25e onto the organic film layer 25b can also be referenced from the projection relationship between the metal film layer TMA and the inorganic film layer 25d.

[0050] above Figure 4 and Figure 5 In the corresponding embodiments, in each membrane layer group, the orthographic projection of the metal membrane layer on the surface of the corresponding organic membrane layer is located within the orthographic projection of the corresponding inorganic membrane layer on the surface of the organic membrane layer, so as to avoid the metal membrane layer contacting the organic membrane layer in the membrane layer group to form a metal complex when the metal membrane layer is formed.

[0051] also, Figure 4 and Figure 5 In the corresponding embodiment, the touch screen module includes two film layer groups, film layer group M1 and film layer group M2. This is merely an example; it may also have only one film layer group, or three or more film layer groups arranged sequentially. The cooperation relationship between each pair of film layer groups can refer to the relationship between film layer group M1 and film layer group M2. Furthermore, when m≥2, two metal film layers located in two adjacent module layers can be connected through metallized vias to connect the metal film layers of different layers to form a circuit. As long as the touch layer 25 includes m film layer groups arranged sequentially along the direction away from the light-emitting device layer 23, where m is a positive integer greater than or equal to 1, it is acceptable.

[0052] The following describes the preparation method of the touch module provided in the embodiments of this application.

[0053] refer to Figure 2a A thin-film transistor layer 22 is formed on the surface of the flexible substrate 21. A light-emitting device layer 23 is formed on the surface of the thin-film transistor layer 22 facing away from the flexible substrate 21. A thin-film encapsulation layer (TFE) 24 is formed on the side of the light-emitting device layer 23 facing away from the thin-film transistor layer 22. Next, a touch layer 25 is formed on the thin-film encapsulation layer 24.

[0054] The touch module 20 adopts Figure 4 Taking the touch layer 25 shown as an example, one feasible method for forming the touch layer 25 is as follows:

[0055] Step S100: Film layer group M1 and film layer group M2 are sequentially formed on the thin film encapsulation layer 24.

[0056] The following steps S101 to S104 are the process of forming the film layer group M1.

[0057] Step S101: Figure 6a The diagram shows the structure after step S101, for reference. Figure 6a An organic film layer 25a is formed on the surface of the thin film encapsulation layer 24 away from the light-emitting device layer 23. The organic film layer 25a can be formed by coating.

[0058] Step S102: Figure 6b The diagram shows the structure after step S102, for reference. Figure 6b An inorganic film layer 25d is formed on the surface of the organic film layer 25a that is away from the thin film encapsulation layer 24. The inorganic film layer 25d can be formed by coating.

[0059] Step S103: Figure 6c The diagram shows the structure after step S103, for reference. Figure 6c A metal film TMA is formed on the surface of the inorganic film layer 25d away from the organic film layer 25a. The metal film TMA can be formed by coating.

[0060] Step S104: Figure 6d The diagram shows the structure after step S104, for reference. Figure 6d Meanwhile, the metal film TMA and the inorganic film 25d are patterned, for example, by using an etching process to etch specific patterns into the metal film TMA and the inorganic film 25d, forming multiple openings U1 in the inorganic film 25d.

[0061] The following steps S105 to S110 are the process of forming the film layer group M2.

[0062] Step S105: Figure 6e The diagram shows the structure after step S105, for reference. Figure 6e An organic film layer 25b is formed on the side of the organic film layer 25a away from the thin film encapsulation layer 24. Specifically, the organic film layer 25b can be formed by coating. The organic film layer 25b fills the opening formed after the metal film layer TMA and the inorganic film layer 25d are patterned, and covers the metal film layer TMA and the inorganic film layer 25d.

[0063] Step S106: Figure 6fThe diagram shows the structure after step S106, for reference. Figure 6f An inorganic film layer 25e is formed on the surface of the organic film layer 25b that is opposite to the organic film layer 25a. The inorganic film layer 25e can be formed by a coating process.

[0064] Step S107: Figure 6g The diagram shows the structure after step S107, for reference. Figure 6g Multiple connection holes k are formed that penetrate the inorganic film layer 25e and the organic film layer 25b and extend to the metal film layer TMA. For example, the connection holes k can be formed by etching process.

[0065] Step S108, Figure 6h The diagram shows the structure after step S108, for reference. Figure 6h A metal material is formed on the surface of the inorganic film layer 25e away from the organic film layer 25b. Part of this metal material is deposited into the above-mentioned multiple connecting holes k and electrically connected with the metal film layer TMA to form a metallized via TMC. The other part covers the surface of the inorganic film layer 25e away from the organic film layer 25b to form a metal film layer TMB.

[0066] Step S109, Figure 6i The diagram shows the structure after step S109, for reference. Figure 6i Meanwhile, the metal film TMA and the inorganic film 25d are patterned, for example, by using an etching process to etch specific patterns into the metal film TMB and the inorganic film 25e, forming multiple openings U2 in the inorganic film 25d.

[0067] Step S110, Figure 6j The diagram shows the structure after step S110, for reference. Figure 6j A protective layer 25c is formed on the side of the organic film layer 25b opposite to the organic film layer 25a. This protective layer 25c simultaneously covers the inorganic film layer 25e and the metal film layer TMB, thus forming... Figure 4 The structure shown.

[0068] Forming the touch module 20 using Figure 5 The method of forming the touch layer 25 shown is the same as that used in forming the touch module 20. Figure 4 The difference in the method of the touch layer 25 shown is:

[0069] Replace step S104 with step S104'. Figure 7 The diagram shows the structure after step S104', for reference. Figure 7Step S104' involves patterning the metal film layer TMA and the inorganic film layer 25d. After patterning, the orthographic projection of the metal film layer TMA onto the surface of the organic film layer 25a lies within the orthographic projection of the inorganic film layer 25d onto the surface of the organic film layer 25a. Furthermore, the area of ​​the orthographic projection of the metal film layer TMA onto the surface of the organic film layer 25a is smaller than the area of ​​the orthographic projection of the inorganic film layer 25d onto the surface of the organic film layer 25a. Specifically, a semi-transparent mask process can be used during patterning, employing masks with different transmittance regions. The mask for the portion of the inorganic film layer 25d that protrudes relative to the metal film layer TMA uses a structure with relatively high transmittance, while the mask for the portion of the metal film layer TMA that is ultimately retained uses a structure with high transmittance. This allows the photoresist corresponding to the protruding portion of the metal film layer TMA to be etched away relatively early, resulting in the metal film layer TMA shrinking relative to the inorganic film layer 25d after etching.

[0070] Alternatively, it can also be in Figure 6d Based on this, the metal film TMA is further etched, causing the metal film TMA to shrink 25d relative to the inorganic film. Alternatively, the metal film TMA can be etched first to form a larger opening, and then the exposed inorganic film 25d can be etched to form a smaller opening.

[0071] The patterning method for the metal film TMB and the inorganic film 25e can refer to the patterning process of the metal film TMA and the inorganic film 25d.

[0072] For the fabrication process of the touch layer 25 having one or more film layers, the above-mentioned fabrication process of the touch layer 25 having film layers M1 and M2 can be referred to.

[0073] Based on the same inventive concept, this application also provides a display device, which can be a mobile phone with a foldable screen or a laptop computer with a foldable screen. The display device includes a frame and a touch screen module provided in the above embodiments. The frame includes a first middle frame, a rotating support part, and a second middle frame. The first middle frame and the second middle frame are rotatably connected through the rotating support part. The touch screen module covers the first middle frame, the rotating support part, and the second middle frame.

[0074] Taking foldable display devices, such as foldable phones, as an example, their specific structure can be found in the previous section. Figure 1a and Figure 1b The description of the structure shown, and Figure 1a and Figure 1b The touch screen module in this application adopts the technical solution provided in the embodiments.

[0075] refer to Figure 4 and Figure 5In the touchscreen module 20, the touch layer 25 utilizes organic film layers 25a and 25b as a buffer layer and dielectric layer, respectively. Organic materials have a low elastic modulus, which reduces the bending radius of the touchscreen module 20, making it less prone to breakage. Furthermore, a patterned inorganic film layer 25d is provided between the metal film layer TMA and the organic film layer 25a. The orthographic projection of the metal film layer TMA onto the surface of the organic film layer 25a lies within the orthographic projection range of the inorganic film layer 25a onto the surface of the organic film layer 25a. This prevents the metal film layer TMA from easily contacting the organic film layer 25a to form a metal complex during its formation. Additionally, the inorganic film layer has a discrete structure, making it less prone to cracking during bending. The inorganic film 25e offers the same advantages.

[0076] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions of different embodiments are consistent and can be referenced by each other. The technical features of different embodiments can be combined to form new embodiments according to their inherent logical relationship.

[0077] Furthermore, the components in the accompanying drawings of the embodiments of this application are only for illustrating the working principle of the touch screen module and the display device, and do not actually reflect the actual size relationship of each component.

[0078] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A touch screen module, characterized in that, include: A light-emitting device layer and a touch layer located on the light-emitting side of the light-emitting device layer; The touch layer includes m film layer groups arranged sequentially along the direction away from the light-emitting device layer, where m is a positive integer greater than or equal to 1; Each of the film layer groups includes an organic film layer, an inorganic film layer located on the side of the organic film layer opposite to the light-emitting device layer, and a metal film layer located on the side of the inorganic film layer opposite to the organic film layer; both the inorganic film layer and the metal film layer have multiple openings, and in each of the film layer groups, the openings in the metal film layer are larger than the openings in the inorganic film layer, wherein the multiple openings in the inorganic film layer are used to release stress in the inorganic film layer when the touch screen module is bent; When m≥2, the two metal films located in two adjacent film groups are connected by metallized vias.

2. The touch screen module according to claim 1, characterized in that, Each of the inorganic films is made of SiN. x SiO x And one of SiON; or, The inorganic film layer comprises multiple stacked sub-film layers, wherein each sub-film layer is SiN. x SiO x One of SiON.

3. The touch screen module according to claim 1, characterized in that, The thickness of each inorganic film layer ranges from 1 nm to 1 μm.

4. The touch screen module according to claim 1, characterized in that, Each of the organic film layers is made of one or more of acrylic, epoxy resin, and silicone.

5. The touch screen module according to claim 1, characterized in that, The thickness of each organic film layer is between 0.5 μm and 5 μm.

6. A method for manufacturing a touch screen, the touch screen comprising a light-emitting device layer, characterized in that, The method includes: sequentially forming m film layer groups on the light-emitting side of the light-emitting device layer, where m is a positive integer greater than or equal to 1; wherein, The method for forming each of the said film layer groups includes: An organic film layer is formed, an inorganic film layer is formed on the side of the organic film layer away from the light-emitting device layer, and a metal film layer is formed on the side of the inorganic film layer away from the organic film layer. When m≥2, the two metal film layers located in two adjacent film layer groups are connected by metallized vias. The inorganic film layer and the metal film layer are patterned so that both the inorganic film layer and the metal film layer form multiple openings, and in each film layer group, the opening in the metal film layer is larger than the opening in the inorganic film layer, wherein the multiple openings in the inorganic film layer are used to release the stress in the inorganic film layer when the touch screen module is bent.

7. The method according to claim 6, characterized in that, When m≥2, during the process of forming the second to the mth film layer group, after forming the inorganic film layer on the side of the organic film layer away from the light-emitting device layer, the process further includes: A plurality of connection holes are formed through the inorganic film layer and the organic film layer, each connection hole extending from the surface of the inorganic film layer away from the organic film layer to the surface of the metal film layer in the previous film layer group; A metal material is deposited on the surface of the inorganic film layer away from the organic film layer. A portion of the metal material is deposited in the connecting hole to form the metallized via, and another portion of the metal material is located on the surface of the inorganic film layer away from the organic film layer to form the metal film layer.

8. A display device, characterized in that, The display device includes a frame and a touch screen module according to any one of claims 1 to 5. The frame includes a first middle frame, a rotating support portion and a second middle frame. The first middle frame and the second middle frame are rotatably connected through the rotating support portion. The touch screen module covers the first middle frame, the rotating support portion and the second middle frame.

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