Multimodal haptic device

Abstract

The invention relates to a multi-modal haptic device comprising a matrix (1) comprising at least one cell (10), each cell comprising: - at least one thermal element (110, 111, 112) capable of generating cooling and heating; - at least one vibration element (130) capable of generating vibrations; and - at least one encapsulation layer (500, 501, 502) made of an electrically insulating material; the at least one vibration element and the at least one thermal element being anchored in the at least one encapsulation layer in at least one portion; each cell being adapted to be in direct or indirect contact with a person's skin to transmit a thermal and / or vibratory sensation to this person, the cell having a thickness less than or equal to 10 millimeters.

Description

Technical Field

[0001] This invention relates to the field of tactile sensation, and more particularly to multimodal tactile devices, that is, devices capable of applying force, pressure, vibration and / or movement, and temperature differences to a user to convey different sensations or different information (texture, viscosity, shape, force, heat, etc.) to that person. More specifically, the tactile device takes the form of a multimodal tactile matrix, which includes one or more units contained in the matrix. Background Technology

[0002] The term "haptic" refers to the science of touch. Unlike the term "tactile," which only defines the sensation of touch, "haptic" includes the kinematic dimension of touch, that is, the body's perception of touch in the environment.

[0003] A haptic device is a tactile and kinesthetic system that can significantly create communication between a human and a part of his or her environment, and, if necessary, between the user and a virtual environment. Haptic devices can, for example, allow users to design, model, and manipulate objects in a virtual environment with tactile sensation (touch) and kinesthetic perception.

[0004] Several technologies typically combine haptic and kinetic feedback by mounting a touchscreen onto a force feedback device. These technologies generally implement mechanical devices with, for example, miniaturized motors or piezoelectric elements that generate vibrations that can actually be modulated, but overall do not provide truly tactile information. Thus, haptic feedback is generally insufficient to make the environment tangible and rather lacks realism. Human touch perception is actually multimodal; humans require various information, such as form, texture, and temperature, to identify objects through touch. Interestingly, even in the absence of other tactile information, humans can distinguish various materials based solely on thermal signals.

[0005] Some technologies incorporate piezoelectric elements into flexible substrates, such as flexible silicone polymers, to better interact with the human body. Other technologies based on microfluidic elements make it possible to generate localized pressure on the hand, and thus produce some kind of tactile sensation. However, the reality remains that these technologies only convey a limited amount of information that would allow for the true perception of human touch.

[0006] Other technologies include elements used to generate a thermal tactile effect.

[0007] US Patent 9703381 describes a multimodal haptic device comprising a first container and a second container, each containing fluids (e.g., hot and cold fluids) at specific temperatures; a first conduit and a second conduit, each connected via a manifold to the first container and the second container, respectively; and at least one haptic display unit connected to the first and second conduits, which is essentially a haptic transmission unit capable of transmitting haptic information to the body. The manifold includes a pump and valves for controlling and regulating the circulation of fluids in the conduits. The containers are connected by a Peltier element that can heat the first container while simultaneously cooling the second container. Thus, the hot fluid circulates in the first conduit, the cold fluid circulates in the second conduit, and the fluids are mixed in a set proportion before reaching the haptic transmission unit to transmit a modulated thermal sensation. The haptic transmission unit may include an inflatable chamber made of an elastic material and can transmit haptic feedback. Therefore, the described device is based on fluid elements, and the Peltier element makes it possible to modulate the heat of these elements, thereby indirectly participating in the transfer of heat to the body. Therefore, the described device is relatively complex, with many components, which makes it a relatively large device with the risk of fluid leakage and the potential risk of heat loss.

[0008] Another multimodal haptic device is presented in the publication “Altered Touch: Miniature Haptic Display with Force, Thermal and Tactile Feedback for Augmented Haptics”, Takaki Murakami, Tanner Person, Charith Lasantha Fernando, and Kouta Minamizawa (SIGCGRAPH 2017 Emerging Technologies, July 2017, Article No. 2, pp. 1-2, DOI: http: / / dx.doi.org / 10.1145 / 3084822.3084836). The described multimodal haptic device includes a Peltier module associated with a motor to generate tactile and thermal effects. However, it is a module suitable only for the fingertips. It is relatively large. It may contain only a single Peltier module, which is not repeatable to obtain a large sensory surface.

[0009] Other techniques focus on fabricating flexible Peltier modules in the form of flexible thin layers (rather than the type of Peltier module with "legs" as previously described and commonly used), which makes it possible to reduce the volume of Peltier modules. For example, a technique is described in the publication "High-performance and compact-designed flexible thermoelectric modules enabled by a reticulate carbon nanotube architecture" (Nature Communications, DOI:10.1038 / ncomms14886), which presents a Peltier module fabricated from a thick deposition of carbon nanotubes doped with a solution of polyethyleneimine (PEI) in ethanol. This method makes it possible to obtain p and n doping and fabricate flexible modules. However, such Peltier modules allow for temperature variations in the thin layer rather than in a plane perpendicular to the layer. Furthermore, they do not form multimodal haptic devices.

[0010] The present invention aims to overcome the above-mentioned shortcomings of the prior art.

[0011] More specifically, the present invention aims to provide a multimodal haptic device that makes it possible to transmit not only mechanical or vibrational stress (hereinafter referred to as "vibrational mode") but also thermal stress (hereinafter referred to as "thermal mode") to the body, and has a reduced thickness, that is, a few millimeters or even less than one millimeter.

[0012] Preferably, a flexible multimodal tactile device is sought that can adapt to different shapes and can even form a second skin.

[0013] A multimodal haptic device is also sought that can be driven according to both vibration and thermal modes, and simultaneously according to both vibration and thermal modes. Summary of the Invention

[0014] The subject of this invention is a multimodal haptic device that makes it possible to overcome these shortcomings, said device comprising a matrix containing at least one unit, each unit comprising:

[0015] - At least one thermal element capable of generating both cooling and heating;

[0016] - At least one vibrating element capable of generating vibration; and

[0017] - At least one encapsulation layer made of electrically insulating material;

[0018] The at least one vibrating element and the at least one heating element are anchored in at least one portion within the at least one encapsulation layer; each unit is adapted to come into direct or indirect contact with a person’s skin in order to transmit heat and / or vibration sensation to that person, the unit having a thickness of less than or equal to ten millimeters, and the at least one heating element having a height greater than the height of the at least one vibrating element.

[0019] An encapsulation layer is understood to refer to a layer conforming to at least a portion of the thermal and / or vibration elements or multiple thermal and / or vibration elements of the anchoring unit and / or matrix. The encapsulation layer does not necessarily completely surround the thermal and vibration elements or multiple thermal and vibration elements.

[0020] According to the present invention, the terms "thickness" and "height" refer to the dimensions in a direction perpendicular to the skin when the tactile device is directly or indirectly disposed on human skin. The longitudinal direction refers to the direction corresponding to the maximum dimension of the unit, matrix, or device in its principal plane. The terms "below" and "above" should be understood with reference to the vertical direction.

[0021] The unit can have a length between 1 mm and 20 mm and a width between 1 mm and 20 mm.

[0022] Therefore, the tactile device according to the invention is a multimodal tactile device, which makes it possible not only to transmit vibrational stress but also thermal stress to human skin, and its matrix-like structure with one or more units gives it a reduced thickness.

[0023] The device according to the invention may also include one or more of the following features, either individually or according to all possible combinations of technologies.

[0024] Preferably, at least one unit further comprises:

[0025] - Multiple bottom conductive traces, which enable electrical connections at the bottom of thermal and vibrational components; and

[0026] - Multiple top conductive traces that can create electrical connections at the top of thermal and vibrational elements, and preferably create wiring for driving the elements.

[0027] The bottom and / or top conductive traces may be made of metal (e.g., copper, gold, aluminum or nickel) or carbon, or even based on conductive particles realized, for example, in the form of conductive ink (e.g. based on PEDOT-PSS, which is an acronym for poly(3,4-ethylenedioxythiophene) (PEDOT) and sodium poly(styrene sulfonate) (PSS)).

[0028] Preferably, the at least one unit includes a plurality of conductive vias that allow vertical electrical connections to be made between the top conductive trace and the thermal and vibrational elements.

[0029] Through holes can be made of copper, gold, aluminum, and / or conductive adhesive.

[0030] According to one embodiment, the at least one encapsulation layer includes a first encapsulation layer made of a first insulating material and a second encapsulation layer made of a second insulating material, the first and second layers being able to be bonded, and / or the first and second insulating materials being the same.

[0031] According to a particular embodiment, the second encapsulation layer includes top conductive traces to form an interconnect redistribution layer, which is preferably flexible.

[0032] According to a preferred embodiment, at least one thermal element is a Peltier element, preferably at least two Peltier elements of type N and type connected in series to form a Peltier module.

[0033] In particular, at least one unit may include a heat sink device associated with at least one Peltier module. This makes it possible to ensure optimal operation of the Peltier module in cooling mode.

[0034] According to one embodiment that can be combined with the foregoing embodiments, at least one heating element is a heating resistor and / or a radiating element, such as an infrared (IR) radiating element. The heating resistor may be a resistor made of graphite (C) or a resistor made of silver (Ag).

[0035] Vibrating elements can be piezoelectric elements, ferroelectric elements, and / or electromagnetic elements.

[0036] According to a particular embodiment, at least one thermal and / or vibration element, preferably all thermal and / or vibration elements, is completely encapsulated in at least one encapsulation layer.

[0037] The encapsulation layer (or multiple encapsulation layers) may be made of one or more of the following materials: polymers, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polycarbonate (PC), or silicone; glass; metal; or even inorganic materials such as silicon oxide.

[0038] The encapsulation layer (or multiple encapsulation layers) may be made of flexible and / or stretchable materials, such as flexible polymers and / or elastomers.

[0039] According to one embodiment that can be combined with the foregoing embodiments, at least one unit further includes at least one additional heating trace below at least one thermal and / or vibrational element and preferably below at least one bottom conductive trace.

[0040] According to one embodiment that can be combined with the foregoing embodiments, at least one unit includes a thinned section within the thickness of at least one encapsulation layer between at least two thermal and / or vibrational elements. This makes it possible to make the unit more flexible.

[0041] According to one embodiment that can be combined with the foregoing embodiments, at least one unit includes a pressure element capable of indirectly applying pressure to the skin, particularly a layer of possibly elastic polymer or plastic disposed over the entire unit and supported on at least one element. This makes it possible to promote better thermal contact between the unit and the skin, and to promote the vibratory behavior of a diaphragm formed of encapsulation material actuated by a vibrating element.

[0042] According to a particular embodiment, at least one unit comprises:

[0043] -The central vibrating element; and

[0044] - At least two Peltier modules are arranged around the vibrating element.

[0045] Advantageously, the Peltier module can have a height greater than that of the vibrating element. Thus, the Peltier module with encapsulating material can form a reinforcing element for actuating the vibrating element, thereby enhancing vibration operation.

[0046] The matrix preferably includes several units, and even more preferably several identical units.

[0047] According to one embodiment, at least two thermal and / or vibrational elements are arranged in the same unit and / or a matrix of units, one on top of the other.

[0048] According to alternative or supplementary embodiments to the foregoing embodiments, at least two thermal and / or vibrational elements are arranged side by side in the same unit and / or matrix of units. Attached Figure Description

[0049] Other features, details, and advantages of the invention will become apparent upon reading the description given with reference to the accompanying drawings, which are shown by way of example, respectively:

[0050] Figure 1 This describes a first embodiment of the multimodal tactile device according to the present invention.

[0051] Figure 2 This illustrates a second embodiment of the multimodal tactile device according to the present invention.

[0052] Figure 3 This represents a third embodiment of the multimodal tactile device according to the present invention.

[0053] Figure 4This describes a fourth embodiment of the multimodal tactile device according to the present invention.

[0054] Figure 5 This represents a fifth embodiment of the multimodal tactile device according to the present invention.

[0055] Figure 6A , Figure 6B , Figure 6C and Figure 6D Several examples are shown of the arrangement between the vibrating element and the thermal element in the plane of the multimodal haptic device according to the invention.

[0056] Figure 7A , Figure 7B and Figure 7C Different heat sink devices associated with the Peltier module of a multimodal haptic device according to the present invention are described.

[0057] Figure 8A , Figure 8B , Figure 8C and Figure 8D Indicates corresponding to Figure 6A Four variations of the configuration.

[0058] Figure 9A and Figure 9B This represents a sixth embodiment of the multimodal haptic device according to the present invention, based on two variations.

[0059] Figure 10 This represents a matrix composed of several units of the multimodal tactile device according to the present invention.

[0060] Figure 11 Examples of methods for manufacturing a multimodal haptic device according to the present invention are shown.

[0061] In all these figures, the same reference numerals may refer to the same or similar elements.

[0062] Furthermore, to make the accompanying drawings clearer and more readable, the different parts shown in the drawings are not necessarily represented at a uniform scale. Detailed Implementation

[0063] In all embodiments, unit 10 extends in the main plane XY. It has a thickness of less than or equal to 10 mm, preferably between 0.1 mm and 5 mm. For example, in the case of vertical integration, it may have a thickness between 1 mm and 5 mm, while in the case of planar integration, it may have a thickness between 0.1 mm and 1 mm.

[0064] Unit 10 may have a length (dimension in direction X) between 1 mm and 20 mm and a width (dimension in direction Y) between 1 mm and 20 mm.

[0065] The (encapsulation) material (or multiple encapsulation materials) can be flexible and / or stretchable, but it / they can also be rigid to be placed on interfaces such as smartphones.

[0066] Although vibrating elements are generally presented in the form of piezoelectric elements, this is not limiting, and they can also be ferroelectric and / or electromagnetic elements.

[0067] exist Figures 1 to 8D In this unit, the various elements are arranged side-by-side in a plane XY, and particularly in the X direction of the plane XY. This integration of the various elements in this plane is preferred because it makes it possible to achieve minimal thickness, and in particular, it makes it possible to increase the flexibility / flexibility of the unit. Furthermore, it makes it possible to promote the dynamics and efficiency of transmission through the close proximity of the elements to the skin, so as to heat and cool as much of the skin's surface as possible to transmit vibrations to that surface. The small size of the various elements also makes it possible to maintain a spatial resolution close to that obtained using the natural resolution of the skin's mechanical and thermal receptors, making it possible to reproduce localized sensations on the skin.

[0068] In addition, Figures 1 to 7C , Figure 9A and Figure 9B In this process, at least one encapsulation layer is required to fully encapsulate both the thermal and vibrational components. However, this is not limiting. For example... Figures 8A to 8D As shown, the at least one encapsulation layer conforms to a portion of the thermal and vibration elements of the anchoring unit only.

[0069] Figure 1 This indicates a first embodiment of the multimodal haptic device according to the present invention, and more specifically, a first embodiment of the unit included in the multimodal haptic device according to the present invention.

[0070] Unit 10 includes:

[0071] - Peltier module 110, which includes two Peltier elements 111, 112, each module being capable of generating cooling and / or heating according to the electrical bias applied to the element;

[0072] - A vibrating element 150 arranged side-by-side with the Peltier module in the X direction; and

[0073] - At least one encapsulation layer 500 made of electrically insulating encapsulation material.

[0074] A Peltier module with two elements has been shown, but in general, a Peltier module includes more than two elements, which is applicable to all embodiments, and more generally, to the cells or matrices according to the invention.

[0075] Typically, a Peltier module comprises P-type doped Peltier elements alternately connected with N-type elements, and this arrangement allows heat to be absorbed on the top surface of the module, correspondingly the bottom surface, and to be discharged on another bottom surface, correspondingly the top surface. These elements can be electrically connected in series with each other.

[0076] Alternatively, the individual Peltier elements of the module can operate only in cooling mode. In this case, another heating element, such as a heating resistor and / or a radiating element, can be provided for heating, as described below.

[0077] Typically, the vibrating element is a piezoelectric element.

[0078] Multiple bottom conductive traces 201, 202, 205 make it possible to create electrical connections 201, 202 on the bottom of Peltier elements 111, 112 and to complete electrical contacts 205 on the bottom of vibrating element 150.

[0079] Multiple 300 top conductive traces 301, 305 make it possible to create a top electrical connection between the Peltier element and the wiring (trace 301) for the control signal of the Peltier element and the wiring (trace 305) for the control signal of the vibrating element.

[0080] The bottom and / or top conductive traces may be made of metal (e.g., copper, gold, aluminum or nickel) or carbon, or even based on conductive particles, such as conductive ink (e.g. based on PEDOT-PSS, which is an acronym for poly(3,4-ethylenedioxythiophene) (PEDOT) and sodium poly(styrene sulfonic acid) (PSS)).

[0081] The vertical electrical connection between the top conductive trace and the component is created through a via 500 made of a conductive material such as copper, gold, aluminum and / or conductive adhesive.

[0082] All components are fully encapsulated in at least one encapsulation layer 500 to form the unit.

[0083] In the unit shown, there are two encapsulation layers 501 and 502 joined together: a first layer or bottom layer 501 (made of a first encapsulation material) and a second layer or top layer 502 (made of a second encapsulation material).

[0084] The first encapsulation layer 501 makes it possible to completely encapsulate the two Peltier elements 111, 112 and the resonating element 150. It also makes it possible to encapsulate the bottom conductive trace 200, the via 400, and possibly the top conductive trace 300 to a certain height. The second encapsulation layer 502 makes it possible to cover the top conductive trace 300.

[0085] The second encapsulation layer 502 has a partial opening (opening or “pad” 600) on the top conductive trace 300 to allow drive connections for all components.

[0086] The first and second encapsulation materials may be selected from one or more of the following materials: polymers, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polycarbonate (PC), silicone resin; thin glass; or even thin metal; or even inorganic materials such as silicon oxide. They may be made of the same material or of several different materials.

[0087] The encapsulation material can be a flexible material, such as an elastomer.

[0088] The first and / or second encapsulation material is preferably a dielectric material, especially for forming electrical insulation between the element and the electrical connection traces (particularly the electrical connection traces on the top).

[0089] Unit 10 is intended to come into direct or indirect contact with human skin (e.g., via fabric).

[0090] Vibrational and thermal elements are contained side-by-side in the main plane of the unit, and more specifically, they are combined side-by-side in the main plane of the unit in the longitudinal direction X of the unit 10.

[0091] In this first embodiment, the height of the vibrating element is less than the height of the Peltier element. This makes it possible to enhance the performance level of the element, and in particular the performance level of the vibrating element, as will be explained below. Furthermore, this change in height is reflected by a change in the thickness of the encapsulation layer, and in particular a change in the thickness of the bottom layer 501. This results in a specific topology, which provides advantages, as will also be elaborated below. More generally, in the invention, the thermal element or multiple thermal elements have a height greater than the height of the vibrating element or multiple vibrating elements in order to enhance the performance level of the element, and in particular the performance level of the vibrating element.

[0092] Figure 2 This illustrates a second embodiment of the multimodal haptic device according to the invention, and more specifically, a second embodiment of a unit included in the multimodal haptic device according to the invention. The unit differs from the unit of the first embodiment in that it further includes a heating resistor 130 formed by additional bottom conductive traces 203, which are arranged side-by-side with the vibrating element 150 in the X direction. The two additional top conductive traces 303 make it possible to generate continuity of electrical contact between the heating resistor 130 and the wiring for the control signal of the resistor.

[0093] Heating resistors can be resistors made of graphite (C) or resistors made of silver (Ag), for example resistors obtained from inks containing particles (possibly having nanoscale) of, for example, carbon or silver (e.g., nano-Ag).

[0094] The first encapsulation layer 501 makes it possible to completely encapsulate the two Peltier elements 111, 112, the heating resistor 130, and the vibrating element 150. This further makes it possible to encapsulate the bottom conductive trace 200, the via 400, and possibly the top conductive trace 300 to a certain height. The second encapsulation layer 502 makes it possible to cover the top conductive trace 300.

[0095] In the first embodiment, the vibration element and the thermal element (Peltier element and heating resistor) are contained side by side in the main plane of the unit, and more specifically, they are combined side by side in the main plane of the unit in the longitudinal direction X of the unit 10.

[0096] The height of the vibrating element and the heating resistor is less than that of the Peltier element. Furthermore, this height variation is reflected by variations in the height of the two encapsulation layers, and particularly in the height of the bottom layer 501. This results in a specific topology that offers advantages, as will also be discussed below.

[0097] It should be noted that if the Peltier module is used for heating in addition to its cooling function, the heating resistor may not be necessary, and the first embodiment can then be applied.

[0098] Figure 3 This illustrates a third embodiment of the multimodal haptic device according to the invention, and more specifically, a third embodiment of a unit included in the multimodal haptic device according to the invention, which is shown as being placed on the skin S. The unit differs from the unit of the second embodiment in that it further includes a radiating element 140, and that the unit has a flat topology, such that even though the heights of different elements are different, the Peltier module has a greater height than the other elements.

[0099] The radiating element can be an infrared (IR) radiating element, such as a low-temperature radiating element that produces a slow, gentle heat sensation, or conversely, a high-temperature radiating element for a rapid, gentle heat sensation. Thus, the radiating element can be suitable for rapid heating, while the heating resistor is better suited for slow heating. Consequently, the two heating elements can be complementary.

[0100] Additional conductive traces 204 are provided below the radiating element. Two additional top conductive traces 304 allow for wiring of control signals for the radiating element 140.

[0101] The first encapsulation layer 501 makes it possible to completely encapsulate the two Peltier elements 111, 112, the heating resistor 130, the radiating element 140, and the vibrating element 150. This further makes it possible to encapsulate the bottom conductive trace 200, the via 400, and possibly the top conductive trace 300 to a certain height. The second encapsulation layer 502' makes it possible to cover the top conductive trace 300.

[0102] Furthermore, the top conductive traces are shown as being contained within the interconnect redistribution layer, forming a flexible top encapsulation layer 502'. This makes it possible to route all the traces necessary for controlling the various elements of the cell, and to converge all these traces at a common and flexible output. This feature is independent of the addition of radiating elements; therefore, it can be applied independently to any other embodiment, or more broadly to the multimodal haptic device according to the invention.

[0103] Additionally, the unit shown includes a heat sink 700 above the Peltier module. This heat sink is described below.

[0104] In the first and second embodiments, the vibration element and the thermal element (Peltier element, heating resistor and radiation element) are arranged side by side in the main plane of the unit, and more specifically, they are arranged side by side in the main plane of the unit in the longitudinal direction X of the unit 10.

[0105] Figure 4 The fourth embodiment of the multimodal haptic device according to the invention is shown as being placed on the skin S, and more specifically, it is a fourth embodiment of a unit included in the multimodal haptic device according to the invention. The unit differs from the unit of the first embodiment in that it further includes an additional Peltier module 110', which is arranged such that the vibrating element 150 is positioned between the two Peltier modules 110, 110'.

[0106] In the first embodiment, the height of the vibrating element is less than the height of the two Peltier modules, and this is to enhance the performance level of the element, and especially the performance level of the vibrating element. This height variation is reflected by the height variation of the two encapsulation layers, and especially the height variation of the bottom layer 501. This results in a specific topology. This topology can be advantageously used to facilitate contact between the Peltier element and the skin. Furthermore, this specific topology makes it possible to allow the piezoelectric element to move freely to ensure its vibration. Contact can be enhanced by using, for example, a pressure element 800, such as a layer of possibly elastic polymer or plastic supported on the Peltier element to hold all the units in place, by applying pressure to the top surface of the Peltier element and thus applying pressure (which can vary) to the skin. This makes it possible to facilitate better thermal contact between the unit and the skin, and to facilitate the vibrational behavior of the diaphragm formed by the encapsulation material actuated by the piezoelectric element.

[0107] Figure 5 This illustration depicts a fifth embodiment of the multimodal haptic device according to the invention, shown as placed on skin S, and more specifically, a fifth embodiment of a unit included in the multimodal haptic device according to the invention. The difference from other embodiments is that the encapsulation layer 501 is thinned (thinning section 900) between the elements of the unit (here, between each Peltier module and the vibrating element). This makes it possible to promote the flexibility of the unit. This can be applied to any embodiment, or more broadly, between at least two elements of a unit included in the multimodal haptic device according to the invention.

[0108] exist Figure 5 As can be seen from this, such as in Figure 3 In this context, the top conductive trace is represented as being contained within an interconnect redistribution layer, forming a flexible top encapsulation layer 502', which is a feature that can be applied to any other embodiment or more broadly to the multimodal haptic device according to the invention.

[0109] Furthermore, it can be seen that in this embodiment, a series of supplementary heating traces 251, 255, 251' 250 are inserted below each element and below the bottom conductive trace 200. These make it possible to create a heating resistor below each element of the unit, thereby enabling the heating resistor to be implemented on almost all surfaces in contact with the skin to achieve better resolution. Figure 2 The heating trace 250 can be made of graphite (C) or metal such as silver (Ag).

[0110] This feature is independent of the thinning of the encapsulation material and can be applied to any other embodiment, or more broadly, to the multimodal haptic device according to the invention, without necessarily being combined with the feature of thinning the encapsulation material. Furthermore, the supplementary heating traces do not necessarily need to be inserted under all elements, but can be inserted under one or more elements forming the unit.

[0111] The various embodiments presented so far represent elements arranged side-by-side with each other in the longitudinal direction X of the unit. However, this arrangement is not limiting, and vibration and thermal elements can be positioned in different ways in the XY plane of the unit. In other words, in all the embodiments presented so far, the elements can be arranged in ways other than alignment in the longitudinal direction X.

[0112] Preferably, the positioning of the various elements is optimized to amplify the vibration stress through the arrangement of thermal elements, particularly Peltier elements and / or modules around the vibrating element or several vibrating elements.

[0113] Figures 6A to 6D Several examples of the construction of the vibrating element (a piezoelectric element in each example) and the heating element (several Peltier modules in each example) presented in the XY plane of the unit cell are shown. Electrical connections are not shown in these figures, but supplementary heating traces 250 that make it possible to generate a heating resistor are shown. In the four constructions shown, a single piezoelectric element 150 is present, and several Peltier modules 110 are arranged in a square form (…). Figure 6A Or arranged in any of the circular forms around the piezoelectric element, in which the Peltier module forms a ring around the piezoelectric element. Figures 6B to 6D ).

[0114] The Peltier module's positioning around the piezoelectric element offers several advantages:

[0115] - The weight of the Peltier module makes it possible to form an anchor around the piezoelectric element to ensure its vibration operation;

[0116] - Therefore, the surface occupied by the Peltier modules makes it possible to increase their effect of enhancing thermal sensation; it also conforms to the fact that the resolution of thermal sensation of the skin is generally less than the resolution of mechanical sensation;

[0117] - The resulting coupling between the two functions (vibration and heat) makes it possible to modulate perception and enhance cognitive effects.

[0118] More generally, the coupling of the two functions (vibration and heat) could, for example, make it possible to amplify the brain’s perception and interpretation of stimuli (especially thermal stimuli in the presence of tactile sensation).

[0119] In all the presented embodiments, and more broadly in the context of this invention, the different bottom conductive traces need not have the same thickness. The same applies to the different top conductive traces. Furthermore, the different bottom conductive traces can have different heights depending on the element they are associated with, and the same is true for the different top conductive traces. Conductive traces connecting Peltier elements can be thicker than conductive traces connecting vibrating elements, and this is true for both bottom and / or top traces. The bottom and top conductive traces need not be made of the same material. More generally, in the context of this invention, the characteristics of the electrical connections can be specific to different elements.

[0120] The Peltier elements and modules, as well as the piezoelectric elements, will now be described in detail, which can be implemented for each of the presented embodiments, and more generally for the multimodal haptic device according to the invention.

[0121] Peltier components and modules

[0122] To achieve sufficient spatial resolution for both thermal and vibrational stresses, the size of the Peltier element is preferably limited to a maximum of a few millimeters, or even less than one millimeter.

[0123] Preferably, several thermoelectric elements or Peltier elements (“thermoelectric arms”) are used, and more particularly multiple N and P elements linked together, wherein the height of the N and P elements is between 0.2 mm and 5 mm, preferably 0.2 mm to 1 mm, and their cross-section is 0.2 mm. 2 With and 4mm 2 Between (typically 1 mm) 2 Peltier elements can be manufactured based on bismuth telluride, which allows operation at temperatures between -10°C and 100°C, or based on silicides (MgSiSn, MnSi, SiGe, etc.).

[0124] For ease of integration into the unit, preferably, one or two Peltier elements are pre-assembled in the module, that is, pre-assembled on an insulating substrate covered with conductive traces (typically copper or silver). Conventionally, materials such as aluminum nitride (AlN), aluminum oxide (Al₂O₃), zirconium oxide (ZrO₂), and even... A thin substrate (polyimide film) is used, which makes it possible to ensure the flexibility of the Peltier module. When the substrate is not flexible, the Peltier module can be made flexible, for example, by assembling the elements together with a flexible material. Preferably, the total height of the module (substrate, elements, and traces) is less than 2 mm.

[0125] In the various embodiments presented, and more generally for the multimodal tactile device according to the invention, the presented element is electrically controlled via a top conductive trace that allows control of the voltage and / or current to be applied to the presented element. These controls are generated in a manner that locally produces vibration and thermal tactile sensation. Preferably, the control is dynamic, that is, only the element located on the area to be stimulated is electrically activated; thus, each area can be displaced and its surface is temporally modulated, thereby giving a realistic impression of a stimulus moving on the skin surface.

[0126] Each Peltier module can be driven by applying a current ranging from tens of μA to several amperes, which varies depending on the module's material and geometry (especially the size and number of elements).

[0127] Peltier modules can be coupled to thermocouples, thermistors, or any other device that can measure the temperature of skin contact when the tactile device is applied to a person's skin. The measured temperature can be fed into a feedback loop to determine the current to be applied to the module's input.

[0128] Depending on the construction of the Peltier module and, possibly, the construction of the heat sink associated with it, the temperature difference can range from a few degrees for a relatively short time to tens of degrees (typically 20°C) for a sustained period. For a strong cooling sensation lasting more than a few minutes, a heat sink must be used to dissipate the heat. Without a heat sink or with a very thin one, the sensation of cold heat will be brief and will last from a few seconds to about one minute.

[0129] The unit may further include supplemental heating devices associated with the heating element, similar to a heat sink (in... Figure 3 (Indicated by reference numeral 700 in the accompanying drawings) and / or supplementary mechanical devices associated with the vibrating element, such as stiffeners, all of which are intended to enhance the performance level. These supplementary thermal and / or mechanical devices may consist of additional elements or may be obtained through the integration and optimized placement of existing elements.

[0130] Figures 7A to 7C Different heat sinks are shown. These heat sinks are advantageously implemented to ensure optimal operation of the Peltier module in cooling mode.

[0131] exist Figure 7A In this configuration, the heat sink is a heat diffuser 701 contained in or already present in the top conductive trace 300, and more specifically in the conductive trace located above the Peltier module. The diffuser may be made of metal or carbon.

[0132] This diffuser, constructed in this way, enhances natural convection by allowing for both good heat distribution and increased surface area for heat exchange with the outside. Under steady-state conditions, it can provide a temperature difference of several degrees Celsius, while in transient conditions, it can provide a larger temperature difference over a time span of less than one second.

[0133] This solution is one of the preferred solutions when the Peltier module and / or unit is flexible.

[0134] exist Figure 7B In this configuration, a passive external heat sink element 702, such as a finned block of copper or aluminum, is added to the top conductive trace 300, at least to the conductive trace located above the Peltier module, to allow for enhanced natural convection. As shown, the finned heat sink element is in contact with the heat diffuser 701.

[0135] This external heat sink element makes it possible to facilitate the storage of heat absorbed by the Peltier module (in the form of specific heat capacity) and its release into the ambient air via natural convection. Under steady-state conditions, it can provide a temperature difference of several degrees Celsius, while in transient conditions, it can provide a larger temperature difference over a time span of several seconds.

[0136] However, this solution is limited when the modules and / or units are flexible, unless they are offset outside the flexible region.

[0137] exist Figure 7C In this configuration, a flexible microfluidic loop 703 is positioned on the top conductive trace 300, at least above the Peltier module. This enables, and further enhances, heat dissipation through forced convection and by extracting heat using a heat transfer fluid in cooling. The extracted heat is then transferred to a heat exchanger 704 to cool the heat transfer fluid via natural convection. Such a device can be designed to be portable. Under steady-state conditions, it can provide a temperature difference of tens of degrees Celsius.

[0138] Vibrating element

[0139] The vibrating element can be a piezoelectric element, a ferroelectric element, and / or an electromagnetic element. The geometry of these vibrating elements can vary. For example, it is possible to use an element in the form of a parallelepiped with a square cross-section, the side length of which is between 0.5 mm and 10 mm, preferably 1 mm. The thickness can be between 1 μm and 1 mm, preferably between 50 μm and 100 μm. When the thickness is larger, a larger voltage will be applied to the material to obtain an electric field, and thus an equivalent vibration effect.

[0140] Figure 8A , Figure 8B , Figure 8C and Figure 8D Indication and basis Figure 6A The unit has four corresponding variations in construction. That is, when viewed in a cross-section along the axis XX' and applied to the skin S, it has a piezoelectric element 150 at the center and eight Peltier modules 110 surrounding the piezoelectric element 150, but without resistors 250. The different variations make it possible to enhance the operation and vibration response of the piezoelectric element by employing the presence of Peltier modules surrounding the piezoelectric element.

[0141] Figure 8A This represents the first variant, in which the encapsulation layer 501 makes it possible to anchor the bottom of the Peltier module and the piezoelectric element, but it does not completely encapsulate them.

[0142] The encapsulation layer is 150 μm thick and has dimensions of 5*5 mm in the XY plane. 2 .

[0143] Figure 8B The second variant differs from the first variant in that it further includes a pressure element 800, such as a layer of possibly elastic polymer or plastic supported on a Peltier element to hold all the units in place, which applies pressure to the top surface of the Peltier element and thus to the skin (the pressure can vary). This makes it possible to promote better thermal contact between the units and the skin and to promote the vibrational behavior of the diaphragm formed by the encapsulation material actuated by the piezoelectric element.

[0144] The encapsulation layer is 150 μm thick and has dimensions of 5*5 mm in the XY plane. 2 .

[0145] Figure 8C This represents a third variant, which differs from the first variant in that the piezoelectric element is completely encapsulated in a first encapsulation layer 501, which has a thickness of 650 μm (150 μm + 500 μm). The Peltier module is anchored in the bottom by the first encapsulation layer 501 and in the top by a second encapsulation layer 502 with a thickness of 500 μm.

[0146] The encapsulation layer has a size of 5*5mm in the XY plane. 2 .

[0147] Figure 8D This indicates the fourth variant, which differs from the first variant in that the piezoelectric element and Peltier module are anchored in the top by a 150μm thick encapsulation layer 503.

[0148] The encapsulation layer 503 has a size of 5*5mm in the XY plane. 2 .

[0149] Different variations are simulated using COMSOL digital simulation software.

[0150] The simulation was performed using Peltier modules, each Peltier module forming a 1mm shape. 3 The cube, and the piezoelectric element is formed into a 1mm high cube with a height of 100μm. 2 The parallelepiped is a piezoelectric element. In the simulation, the Peltier modules are uniformly spaced from each other and from the piezoelectric element, with a distance of 500 μm between two adjacent Peltier modules and between the piezoelectric element and the nearest Peltier module. The first or second encapsulation layer has a size of 5*5 mm in the XY plane. 2 And the thickness is 150μm or 650μm, as described above.

[0151] The encapsulation material is preferably flexible. It can be a flexible polymer. Simulations were performed using polyimide.

[0152] This is not limiting: Peltier modules and piezoelectric elements can have the same dimensions (and different heights) in the XY plane, or different dimensions in the XY plane. Similarly, different Peltier modules can also have the same dimensions or different dimensions (in the XY plane and / or at height Z). Furthermore, the spacing between two adjacent Peltier modules in a given direction X and / or Y varies with the dimension of the element in that direction. The spacing in a given direction X and / or Y can range from 1 / 10 to 2 times the dimension of the element in that direction. Additionally, the piezoelectric element can extend over the entire surface vacated by the Peltier module at the center of the cell, or over a portion of that surface. Preferably, half the dimension of the piezoelectric element in direction X, and correspondingly in direction Y, is between 50% and 60% of the distance between the piezoelectric element and the nearest Peltier module in direction X, and correspondingly in direction Y. The encapsulation material can be made of another flexible polymer, or it doesn't even have to be flexible.

[0153] Simulations show that the encapsulation layer forms a diaphragm that can transmit vibrations generated by the piezoelectric element, producing a vibratory tactile effect on the skin (which may be accompanied by a thermal effect through the Peltier module). Furthermore, the Peltier module with encapsulation material forms a reinforcement for actuating the piezoelectric element, thereby enhancing vibration operation.

[0154] Thus, the inventors have demonstrated a synergistic effect between the Peltier module and the vibrating element, whereby the Peltier module not only generates heat or cold but also facilitates the operation of the vibrating element. It should be noted that this may also apply to any other thermal element besides the Peltier element, provided it has a greater height than the vibrating element. This further makes it possible to avoid adding supplementary mechanical components, such as stiffeners, associated with the vibrating element.

[0155] The vibration amplitude depends on several parameters, including the size of the diaphragm formed by the encapsulation layer and the type of vibrating element. The inventors have determined that a 1cm [diaphragm] can be used at voltages on the order of 10V. 2 The diaphragm / encapsulation layer can easily achieve amplitudes on the order of 10 μm (compatible with vibration tactile effects).

[0156] The resonant frequency of the unit depends on several parameters, including the thickness of the diaphragm / encapsulation layer, and especially such as Figure 8C The thickness of the encapsulation surrounding the piezoelectric element is shown in the figure. The inventors have determined that for a thickness of 650 μm ( Figure 8C The resonant frequency of the unit is 244kHz, which is relatively high for a thickness of 150μm. Figure 8A or Figure 8B The resonant frequency of the unit is 77kHz.

[0157] The resonant frequency of the unit also depends on the dimensions of the diaphragm / encapsulation layer in the plane. The inventors have determined that by increasing the dimensions of the encapsulation layer, the resonant frequency decreases. Simulations have made it possible to demonstrate this in a 7*7mm... 2 In the case of the size (and 3.5*3.5mm) 2 In the case of piezoelectric elements and 20 Peltier modules, the resonant frequency is 31.5kHz, and in a 20*20mm... 2 In the case of the size (and 10*10mm) 2 In the case of piezoelectric elements and 56 Peltier modules, the resonant frequency is 3.8kHz.

[0158] Figure 8D Simulations of the fourth variant yielded a frequency of 77 kHz. This fourth variant allows sound waves to be transmitted to the surface of the skin.

[0159] Figure 9A and Figure 9B This represents a sixth embodiment of the multimodal tactile device according to the present invention, wherein the elements are not arranged side by side with each other in a plane XY, but are arranged on top of each other in a direction Z perpendicular to the plane. Figure 9A and Figure 9B Specifically, this refers to thermal elements (especially Peltier modules) that are positioned above and assembled together with the vibrating element.

[0160] First variant ( Figure 9AIn this configuration, the thermal element 110 is encapsulated in a first encapsulation layer 510, and the vibration element 150 is encapsulated in a second encapsulation layer 520. These two layers are made of the same material or two different materials. The two layers are assembled together, for example, by lamination. Each layer can be flexible, for example, made of a flexible polymer. Each of the layers can include electrical connections that allow various components to be powered and driven.

[0161] Second variant ( Figure 9B In this process, the thermal element 110 and the vibration element 150 are encapsulated in the same encapsulation layer 530.

[0162] This sixth embodiment can be developed into several variations, which cannot all be fully developed. These variations include those with thermal elements other than Peltier elements, variations with one or more vibrating elements, variations with one or more additional layers, and so on. Furthermore, this embodiment can be combined with other embodiments because the elements can be arranged side-by-side in the XY plane and also in the Z direction. All technically possible combinations are conceivable.

[0163] Several units, particularly those described according to different embodiments, can be assembled side-by-side in a matrix in a plane XY, making it possible to obtain tactile devices with a larger surface area. It is possible to assemble units of the same type or different units.

[0164] Figure 10 This represents a matrix composed of several units, which is included in the multimodal haptic device according to the present invention. Matrix 1 is shown schematically without the electrical connections necessary for powering and driving the various components. The matrix shown includes multiple identical basic units 10. The basic units correspond to a number of regularly repeated... Figure 6A The unit consists of a central piezoelectric element 150 and eight Peltier modules evenly arranged around it. Furthermore, two adjacent units share a row of three Peltier modules.

[0165] The matrix shown comprises several identical cells arranged regularly side-by-side in the XY plane, and they are encapsulated in the same encapsulation layer. However, this configuration is not restrictive. Thus, the matrix can consist of the following:

[0166] - Several identical or different units; and / or

[0167] - Several elements arranged regularly or irregularly in a plane XY; and / or

[0168] - Units with different encapsulation layers; and / or

[0169] - Setting one or more elements on top of another in the direction Z, which is perpendicular to the plane XY; and / or

[0170] - Set one or more units on top of another in the direction Z that is perpendicular to the plane XY, etc.

[0171] Figure 11 Examples illustrate methods for manufacturing a multimodal haptic device according to the invention, and more specifically, for including units within the device according to the invention. Reference to the elements within the units can be made to the preceding drawings, and in particular to… Figures 1 to 5 :

[0172] - Step 1: The starting point is a substrate made of insulating material, which can be a flexible or stretchable substrate made of polymer (PET, PEN, PI, PC, silicone, etc.), thin glass, or even thin metal; the substrate can be obtained in the form of a dry film or a cured liquid film.

[0173] - Step 2 (optional): Deposit one or more heating traces 250; they may be formed by deposition of metal or conductive ink (e.g., silver- or carbon-based) and then structured by photolithography or printing;

[0174] - Step 3 (optional): Deposit a film made of an insulating material; it can be one of the materials listed for the substrate, or even the same material as the substrate, and it can be obtained in the form of a dry film or a cured liquid film;

[0175] - Step 4: Fabricate the bottom conductive traces 200; they can be made by depositing metal or conductive ink (e.g., silver- or carbon-based) and then structuring them by photolithography or printing;

[0176] - Step 5: Make the vibrating element or multiple vibrating elements 150 contact the corresponding bottom conductive trace 205;

[0177] - Steps 6 and 7: Contact the heating element or multiple heating elements 111, 112, 110, 130, 140 with the corresponding bottom conductive traces 201, 202, 203, 204: for example, at least one P-type Peltier element 11 and at least one N-type Peltier element 112 to form a Peltier module 110, a heating resistor 130 and / or a radiating element 140;

[0178] - Step 8: Deposit a layer of insulating material: which may be one of the materials listed for the substrate, or even the same material as the substrate; the deposition may be performed in liquid form, for example by one of the “spin coating” or “slot die” methods known to those skilled in the art; this makes it possible to complete the first insulating material layer (first encapsulation layer 501);

[0179] - Step 9 (optional): A step of planarizing the insulating material layer deposited in step 8 may be provided, for example by chemical mechanical polishing (CMP);

[0180] - Step 10: Open the via 400 in the insulating material layer deposited in step 8 by using, for example, photolithography and chemical or plasma etching methods or laser methods;

[0181] - Step 11: Fill the via with a conductive material (e.g., copper) to create an electrical connection: this may involve a growth method ("electrically neutral" method or a method of depositing conductive paste by screen printing);

[0182] - Step 12: Fabricate the top conductive trace 300 (for Peltier components and for wiring connections for various components): This may involve depositing metal or conductive ink (e.g., based on silver or carbon) and then structuring it by photolithography or printing;

[0183] - Step 13 (optional): If necessary, especially in cases with several levels, wiring interconnects can be fabricated: this may involve depositing metal or conductive ink (e.g., based on silver or carbon) and then structuring it by photolithography or printing;

[0184] - Step 14: Fabricate a second insulating material layer (second encapsulation layer 502); which may involve one of the materials listed for the substrate, or even the same material as the substrate, and may be applied in the form of a dry film or a curing liquid film;

[0185] - Step 15: Create openings in the pad 600 in the second layer by using methods such as photolithography and chemical or plasma etching or laser methods to allow for the connection used to drive all components;

[0186] - Step 16 (optional): For example, by photolithography and chemical or plasma etching methods, or by laser methods, a thin section 900 of one or more layers of insulating material can be fabricated.

[0187] Regarding steps 1, 3, and 8, they are as described above, but in several steps a first encapsulation layer is formed to support, introduce, and cover the components and conductive traces. It can be seen that this first layer can be made of a single insulating material or of several different insulating materials.

[0188] Regarding step 5, these can be piezoelectric or ferroelectric elements, or even electromagnetic elements, such as those based on PZT (lead zirconate titanate) or any other suitable material; the transfer can be performed using a "pick and place" type of method (retrieving the element from the source support via a motorized arm, positioning and placing the element on the substrate).

[0189] Regarding steps 6 and 7, Peltier elements can be manufactured based on bismuth telluride, which allows operation at temperatures between -10°C and 100°C; or based on silicides (MgSiSn, MnSi, SiGe, etc.), which are materials with lower performance levels in this temperature range but are less resource-constrained.

[0190] Peltier elements can be pre-integrated into modules, that is, pre-assembled on an insulating substrate covered with conductive traces (typically copper or silver). Thus, Peltier elements can be manufactured based on solid materials transferred to a DBC (direct-bonded copper) type insulating substrate via a "pick-and-place" method, such as aluminum nitride (AlN), alumina (Al₂O₃), zirconium oxide (ZrO₂), or even... (Polyimide film); or manufactured by thin or thick deposition techniques (tens to hundreds of micrometers).

[0191] Preferably, thin solid-state elements (typically between 200 μm and 600 μm) are used to enhance performance levels. These elements can also be deposited or printed in films (carbon nanotube / polymer composites, TiS2 / hexylamine superlattices).

[0192] Therefore, cells can be easily manufactured using known microelectronics manufacturing methods. Several cells can be manufactured simultaneously during the aforementioned steps to form a matrix of cells.

[0193] The different embodiments presented can be combined with each other.

[0194] Furthermore, the present invention is not limited to the previously described embodiments, but extends to any embodiments falling within the scope of the claims.

Claims

1. A multimodal haptic device comprising a matrix (1) containing at least one unit (10), each unit comprising: - At least one thermal element (110, 111, 112, 130, 140, 110') capable of generating cooling and heating. - At least one vibrating element (150) capable of generating vibration; as well as - At least one encapsulation layer (500, 501, 502, 502', 503, 510, 520, 530) made of an electrically insulating material; The at least one vibration element and the at least one thermal element are anchored in at least a portion of the at least one encapsulation layer; Each unit (10) is adapted to come into direct or indirect contact with human skin, such that at least one thermal element can transmit thermal sensation to the person and at least one vibrating element can transmit vibrational sensation to the person, the unit having a thickness of less than or equal to 10 mm, and the at least one thermal element having a height greater than the height of the at least one vibrating element.

2. The device according to claim 1, wherein at least one unit (10) further comprises: - Multiple bottom conductive traces (201, 202, 203, 204, 205) that enable electrical connections at the bottom of the thermal and vibration elements; and - Multiple top conductive traces (301, 303, 304, 305) that are capable of creating electrical connections at the top of the thermal and vibrational elements.

3. The device of claim 2, wherein the plurality of top conductive traces (301, 303, 304, 305) are capable of generating wiring for driving the thermal element and the vibration element.

4. The device according to claim 2, wherein the at least one unit (10) further comprises a plurality of conductive vias (400) that allow vertical electrical connections to be made between the top conductive trace and the thermal element and the vibration element.

5. The device according to claim 2, wherein the at least one encapsulation layer (500) comprises a first encapsulation layer (501, 510) made of a first insulating material and a second encapsulation layer (502, 502', 520) made of a second insulating material, the first encapsulation layer and the second encapsulation layer being bondable, and / or the first insulating material and the second insulating material being the same.

6. The device of claim 5, wherein the second encapsulation layer (502') includes the top conductive trace to form an interconnect redistribution layer.

7. The device of claim 6, wherein the redistribution layer is flexible.

8. The device according to any one of claims 1 to 7, wherein at least one thermal element is a Peltier element.

9. The device according to claim 8, wherein the at least one thermal element comprises at least two Peltier elements (111, 112) of type N and type connected in series to form a Peltier module (110).

10. The device according to claim 8, wherein at least one unit (10) includes a heat sink device (700, 701, 702, 703) associated with at least one Peltier module (110).

11. The device according to any one of claims 1 to 7, wherein at least one heating element is a heating resistor (130) and / or a radiating element (140).

12. The device according to claim 11, wherein the at least one thermal element is an infrared (IR) radiating element.

13. The device according to any one of claims 1 to 7, wherein at least one vibrating element (150) is a piezoelectric element, a ferroelectric element and / or an electromagnetic element.

14. The device according to any one of claims 1 to 7, wherein at least one thermal element and / or vibration element is completely encapsulated in at least one encapsulation layer.

15. The device according to any one of claims 1-7, wherein all of the thermal elements and / or vibration elements are completely encapsulated in at least one encapsulation layer.

16. The device according to any one of claims 1 to 7, wherein the at least one encapsulation layer is made of one or more of the following materials: polymer; glass; or inorganic material.

17. The device according to claim 16, wherein the polymer is polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polycarbonate (PC), or silicone resin.

18. The device according to any one of claims 1 to 7, wherein the at least one encapsulation layer is made of a flexible or stretchable material.

19. The device according to any one of claims 1 to 7, wherein the at least one encapsulation layer is made of a flexible polymer and / or elastomer.

20. The device according to any one of claims 1 to 7, wherein at least one unit (10) further includes at least one additional heating trace (250) below at least one thermal element and / or vibration element.

21. The device of claim 20, wherein the at least one additional heating trace (250) is below at least one bottom conductive trace.

22. The device according to any one of claims 1 to 7, wherein at least one unit (10) includes a thinned section (900) in the thickness of at least one encapsulation layer (500) between at least two thermal elements and / or vibration elements.

23. The device according to any one of claims 1 to 7, wherein at least one unit (10) includes a pressure element (800) capable of indirectly applying pressure to the skin, disposed above all said units and supported on at least one element.

24. The device according to claim 23, wherein the pressure element (800) is a layer of elastic polymer or plastic.

25. The device according to any one of claims 1 to 7, wherein at least one unit (10) comprises: - Central vibrating element (150); as well as - At least two Peltier modules (110, 110') are arranged around the vibrating element.

26. The device according to claim 25, wherein the Peltier module (110, 110') has a height greater than that of the vibrating element (150).

27. The device according to any one of claims 1 to 7, wherein the matrix (1) comprises a plurality of units (10).

28. The device according to claim 27, wherein the matrix (1) comprises a plurality of identical units.

29. The device according to any one of claims 1 to 7, wherein at least two thermal elements and / or vibration elements are arranged in the same unit and / or a matrix of units, one on top of the other.

30. The device according to any one of claims 1 to 7, wherein at least two thermal elements and / or vibration elements are arranged side by side in the same unit and / or a matrix of units.

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