Shaker for electronic equipment

Abstract

The present disclosure is entitled "Shaker for an Electronic Device." Aspects of the subject technology relate to a shaker module for an electronic device. The shaker module may include a movable component that is resiliently suspended relative to a voice coil by one or more pairs of gap-separated leaf springs. The leaf springs reduce the z-height of the shaker module to be implemented in, for example, a compact electronic device. The gap-separated leaf spring pairs facilitate adjustment of the resonant frequency of the shaker module substantially independently of adjustment of drop performance, while providing stability to prevent undesired rocking motion of the movable component.

Description

Technical Field

[0001] The present specification relates generally to electronic devices and, more particularly, but not exclusively, to shakers for electronic devices. Background Art

[0002] Electronic devices such as computers, media players, cellular phones, and other electronic equipment typically have acoustic components such as speakers for producing audio output. However, integrating acoustic components capable of producing low frequency sounds into electronic devices, such as compact devices including portable electronic devices, can be challenging. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] Certain features of the subject technology are set forth in the appended claims. However, for purposes of explanation, several embodiments of the subject technology are set forth in the following drawings.

[0004] Figure 1 A perspective view of an exemplary electronic device having a shaker in accordance with various aspects of the subject technology is shown.

[0005] Figure 2 A cross-sectional view of a portion of an electronic device including a shaker module coupled to a housing of the device in accordance with various aspects of the subject technology is shown.

[0006] Figure 3 An exploded perspective view of a shaker module in accordance with various aspects of the subject technology is shown.

[0007] Figure 4 A cross-sectional side view of a portion of a shaker module in accordance with various aspects of the subject technology is shown.

[0008] Figure 5 A top view of an exemplary leaf spring of a shaker module in accordance with various aspects of the subject technology is shown.

[0009] Figure 6 Shown is a top view of a shaker module in accordance with various aspects of the subject technology.

[0010] Figure 7 A flow chart illustrating exemplary operations for operating a shaker module of an electronic device in accordance with various aspects of the subject technology is shown.

[0011] Figure 8 An electronic system is shown that can be used to implement one or more implementations of the subject technology. DETAILED DESCRIPTION

[0012] The specific embodiments shown below are intended to be descriptions of various configurations of the subject technology and are not intended to represent the only configuration that the subject technology can be put into practice. The accompanying drawings are incorporated herein and constitute a part of the specific embodiments. The specific embodiments include specific details intended to provide a thorough understanding of the subject technology. However, it will be clear and obvious to those skilled in the art that the subject technology is not limited to the specific details shown herein and can be put into practice without these specific details. In some cases, well-known structures and components are shown in block diagram form to avoid blurring the concept of the subject technology.

[0013] Electronic devices such as desktop computers, televisions, set-top boxes, Internet of Things (IoT) devices, wearable devices such as headphones and earbuds, and portable electronic devices including mobile phones, portable music players, smart watches, tablets, smart speakers, remote controls for other electronic devices, and laptops typically include one or more acoustic components, such as speakers for producing audio output from the device, and / or one or more tactile components for producing tactile feedback or other movement or vibration of the device or a portion of the device.

[0014] Particularly in compact electronic devices such as wearable electronic devices and portable electronic devices, it can be difficult to provide speakers and / or haptic components that are capable of generating or simulating low frequency sounds and / or vibrations due to the small volume available for the components.

[0015] According to various aspects of the subject disclosure, a shaker module for an electronic device is provided. The shaker module can be mounted within the electronic device within a limited z-height specified for the module. The shaker module can be attached to a wall or other structure of the electronic device, such as to an interior surface of a housing of the electronic device. The shaker module can be operated to generate and / or simulate a low-frequency audio output of the device, and / or provide a tactile output for the device.

[0016] In one or more specific implementations, the shaker module may include a moving element and may be arranged to prevent the rocking motion of the moving element while allowing the out-of-plane movement of the moving element. The shaker module may also be arranged to prevent the in-plane movement of the moving element. In one or more specific implementations, the shaker module disclosed in the present invention may include two layers of leaf springs separated by a vertical gap, each of which extends parallel to a common plane. The two leaf springs may be arranged to cooperate to allow linear actuation of the moving element in a direction perpendicular to the common plane and prevent the moving element from rocking relative to the common plane. The two leaf springs may also help prevent damage to the shaker in a drop event, such as by allowing the moving element to be temporarily elastically displaced due to the drop impact on the electronic device.

[0017] Figure 1An exemplary electronic device including a shaker module is shown in FIG. Figure 1 In the example of FIG. 1 , the electronic device 100 (eg, an electronic device) has been implemented using a housing that is small enough to be portable and carried by a user (eg, Figure 1 The electronic device 100 may be a handheld electronic device such as a tablet computer or a cellular phone or a smart phone. Figure 1 As shown, electronic device 100 includes a display such as display 110 mounted on the front face of housing 106. Electronic device 100 may include one or more input / output devices (such as a touch screen incorporated into display 110), virtual or mechanical buttons or switches (such as button 104), and / or other input-output components disposed on or behind display 110 or disposed on or behind other portions of housing 106. Display 110 and / or housing 106 include one or more openings to accommodate button 104, speakers, light sources, microphones, and / or cameras.

[0018] exist Figure 1 In the example of the embodiment of the present invention, the housing 106 includes an opening 108 along an edge (e.g., a bottom edge) of the housing 106. In this example, the opening 108 forms a port for an acoustic component such as a speaker and / or a microphone. For example, one of the openings 108 may form a microphone port for a microphone assembly disposed within the housing 106. Another opening 108 in the housing 106 may form a speaker port for a speaker disposed within the housing 106.

[0019] The housing 106, which may sometimes be referred to as a casing, may be formed of plastic, glass, ceramic, fiber composite materials, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or any combination of two or more of these materials. In one example, the housing 106 may be formed of a metal perimeter portion and a metal or glass back panel mounted to the metal perimeter portion, the metal perimeter portion extending around the perimeter of the electronic device 100 (e.g., continuously or in a sheet). In this example, the casing may be formed of the metal perimeter portion, the back panel, and the display 110, such that device circuits such as a shaker module, a battery, one or more processors, memory, an application specific integrated circuit, a sensor, an antenna, acoustic components, etc. are housed within the casing.

[0020] However, it should be understood that Figure 1 The configuration of the electronic device 100 is merely illustrative. In other specific implementations, the electronic device 100 may be a computer, such as a computer integrated into a display (such as a computer monitor), a laptop computer, a tablet device, a slightly smaller portable device (such as a smart watch, a hanging device, a wearable device or a micro device), a media player, a gaming device, a navigation device, a computer monitor, a television, a headset, or other electronic equipment.

[0021] For example, in some implementations, the housing 106 can be formed using a unitary configuration in which some or all of the housing 106 is machined or molded into a single structure, or the housing can be formed using multiple structures (e.g., an internal frame structure, one or more structures forming an external housing surface, etc.). Figure 1 The housing 106 is shown as a single structure, but the housing 106 can have multiple parts. For example, in other implementations, the housing 106 can have an upper portion and a lower portion, the lower portion being coupled to the upper portion using a hinge that allows the upper portion to rotate relative to the lower portion about a rotation axis. In some implementations, a keyboard such as a QWERTY keyboard and a touchpad can be mounted in the lower housing portion.

[0022] In some implementations, the electronic device 100 may be provided in the form of a computer integrated into a computer monitor and / or other display (such as a television). The display 110 may be mounted on the front surface of the housing 106, and optionally a stand may be provided to support the housing 106 (e.g., on a desktop computer) and / or the housing 106 may be mounted on a surface such as a wall.

[0023] In some implementations, the electronic device 100 may be provided in the form of a wearable device such as a smart watch. For example, in some implementations, the housing 106 may include one or more interfaces for mechanically coupling the housing 106 to a strap or other structure for securing the housing 106 to the wearer. In some implementations, the electronic device 100 may be a mechanical or other non-electronic device, wherein a speaker, microphone, or shaker module may be mounted within the housing, such as a pen or a support structure such as a monitor stand for a computer monitor. In any of these exemplary implementations, the housing 106 includes an opening 108 associated with a microphone assembly.

[0024] In order to produce and / or simulate sound, such as having a sound of a frequency lower than the frequency that can be produced by the speaker of the electronic device 100, and / or in order to produce a sense of touch (e.g., vibration) output from the electronic device, one or more shaker modules can be arranged in the housing. The shaker module can be attached to a part of the housing 106 and / or to one or more other structures of the electronic device 100, and can be operated to apply movement (e.g., vibration) to the housing and / or other structures. For example, the shaker module can be attached to a part of the housing 106 so that when the shaker module is operated, the part of the housing to which the shaker module is attached vibrates accordingly. In this way, the housing 106 itself (e.g., or a part thereof) can be used as a radiation surface for projecting and / or simulating sound (e.g., low-frequency sound) from an electronic device.

[0025] For example, Figure 2A cross-sectional view of a portion of the electronic device 100 is shown in an implementation in which a shaker module 200 is attached to an interior surface 202 of the housing 106. As shown, a connector 204, such as a flexible printed circuit or other electrical connector, may be coupled to the shaker module 200 to provide control signals for operation of the shaker module 200 (e.g., from system circuitry, such as one or more processors of the electronic device). Figure 2 The arrows in indicate how a portion of the housing 106 to which the shaker module is attached is actuated in response to operation of the shaker module (e.g., in a direction perpendicular to a plane defining the housing and / or by the shaker module), which can cause the housing 106 to generate and / or simulate low-frequency sounds (e.g., sounds having frequencies lower than those that can be produced by a speaker of an electronic device).

[0026] Figure 3 An exploded perspective view of a shaker module 200 is shown according to one or more implementations. Figure 3 As shown, the shaker module 200 may include a frame 300. As shown, the frame 300 may be formed into a straight line (eg, Figure 3 In this arrangement, the frame 300 may define at least a portion of an outer peripheral edge 304 of the shaker module 200 and the interior opening 302. The outer peripheral edge 304 may define a plane (e.g., parallel to the center of the frame 300) extending through the interior opening 302 (e.g., through the entire interior opening 302 and through a point around the entire outer peripheral edge). Figure 3 As shown, the frame 300 may have a thickness in a direction perpendicular to the xy plane (e.g., Figure 3 For example, the plane may be defined by at least three points on the top end of the outer peripheral edge 304, by at least three points on the bottom end of the outer peripheral edge 304, or by at least three points located on the outer peripheral edge and at any common vertical distance between the top end and the bottom end of the outer peripheral edge 304.

[0027] The movable member 306 may be disposed within the interior opening 302 in the frame 300 (eg, when the shaker module is assembled, as described below in conjunction with Figure 4 further discussion). Figure 3 As shown, the shaker module 200 may include a plurality of radially parallel surfaces (eg, parallel to a plane defined by an outer peripheral edge of the frame and parallel to a plane defined by an outer peripheral edge of the frame). Figure 3 The shaker module 200 may further include one or more first leaf springs 308 extending in a direction perpendicular to the plane (e.g., along the xy plane in the image). Figure 3 The second leaf spring 310 is spaced apart from the first leaf spring 308 in the z direction shown. As shown, each second leaf spring 310 extends parallel to the corresponding first leaf spring 308 and parallel to a plane (eg, the xy plane).

[0028] exist Figure 3 In the example of FIG. 3 , the movable component 306 includes a magnet assembly including a ring plate 316 , side magnets 318 , a center plate 320 , a center magnet 322 , and a bracket 324 . Figure 3 In the example of FIG. 1 , the shaker module 200 further includes a reinforcement plate 312 having a first side 313. In one or more specific implementations, the first side 313 of the reinforcement plate 312 can be attached to the interior surface 202 of the housing 106 (e.g., as shown in FIG. 1 ). Figure 2 ), and / or attached to another surface and / or structure of the electronic device 100. The frame 300 may be attached to the opposite second side of the reinforcing plate 312. Figure 3 As shown, the shaker module 200 can also include a coil 314, such as a voice coil (e.g., formed by multiple windings of a conductive wire to form a circular coil of wire around a central opening forming a hole). The coil 314 can also be attached to the second side of the reinforcement plate 312 so that the coil 314 is centrally mounted within the internal opening 302 in the frame 300 in the assembled configuration. In one or more specific implementations, a connector such as the connector 204 (e.g., a flexible printed circuit) can be coupled to the coil 314 (e.g., via the frame 300) to provide a control signal (e.g., from the system circuitry of the electronic device 100 to the coil). The control signal can be used to drive a current in the coil 314, which causes the magnet assembly to actuate (e.g., along the Figure 3 z direction).

[0029] Figure 4 Shown in assembled configuration Figure 3 200 is a cross-sectional side view of a portion of the shaker module 200. Figure 4 The portion of the shaker module 200 shown includes Figure 3 One of the four first leaf springs 308 and Figure 3 One second leaf spring among the four second leaf springs 310 . Figure 3 and Figure 4 shows how the shaker module 200 may include one or more first leaf springs 308 that are parallel to a plane (eg, parallel to a plane defined by the outer peripheral edge of the frame and parallel to Figure 3 and Figure 4 , (xy plane in FIG. 3 ) extends from the frame 300 to the movable member 306 (eg, to the ring plate 316). Figure 3 and Figure 4It also shows how the shaker module 200 may also include one or more second leaf springs 310, each of which is arranged in a direction perpendicular to the plane (e.g., along Figure 3 and Figure 4 The z direction shown) is separated from the first leaf spring 308. Figure 4 In the portion of the shaker module 200 shown, it can be seen that the second leaf spring 310 extends parallel to the corresponding first leaf spring 308 and parallel to the plane between the frame 300 and the movable member 306 (e.g., to the bracket 324). As shown, the first leaf spring 308 and the second leaf spring 310 are each extended in a direction perpendicular to the plane (e.g., Figure 3 and Figure 4 The spring has a thickness in the z-direction of the plane and is substantially flat in a dimension parallel to the plane (e.g., the spring has a thickness in a dimension parallel to the plane). Figure 3 and Figure 4 The xy plane of the embodiment of the present invention extends within the plane of the xy plane without bending or curving out of that plane).

[0030] In by Figure 4 The portion of the shaker module 200 shown shows an assembled configuration of the shaker module 200 (eg, wherein Figure 3 The four first leaf springs 308 and the four second leaf springs 310 are similar to Figure 4 In the assembly configuration shown, the first leaf spring 308 and the second leaf spring 310 are mounted between the frame and the magnet assembly, and the first leaf spring 308 and the second leaf spring 310 can cooperate to allow the movable member 306 to elastically move in a direction perpendicular to the plane (for example, in Figure 3 and Figure 4 elastic movement in the z-direction) to prevent the movable component from moving within the plane and to prevent the movable component 306 from rotating out of the plane.

[0031] exist Figure 4 In the example of , the reinforcement plate 312 is attached to the frame 300 (e.g., by an adhesive, a weld such as a vibration weld, or by one or more fasteners or other attachment mechanisms). The coil 314 can be coupled to (e.g., attached to or otherwise mounted to) the reinforcement plate 312. The movable component 306 (e.g., including the ring plate 316, the side magnets 318, the center plate 320, the center magnet 322, and the bracket 324) may include a portion of the magnet assembly (e.g., including the center plate 320 and the center magnet 322) that is positioned within the coil 314 by the first leaf spring 308, the second leaf spring 310, and the bracket, as shown. Figure 4In the example of FIG. 3 , the side magnets 318 are positioned (e.g., by the ring plate 316 and the bracket 324) to extend around and near the outer edge of the coil 314, and the center magnet is at least partially positioned within the bore of the coil 314 by the bracket 324. In this manner, the coil 314 is operable to cause the magnet assembly to move in a direction perpendicular to the plane (e.g., in response to a magnetic field generated by the coil that interacts with the magnetic fields of the side magnets and the center magnet, Figure 3 and Figure 4 moves in the z direction).

[0032] Figure 3 and Figure 4 Any or all of the first leaf spring 308 and the second leaf spring 310 may be formed of a relatively hard material such as non-magnetic steel or steel alloy (e.g., "SUS 301" or "SUS304"). Such a hard material may allow the spring to have a flat configuration as shown, while providing elastic positioning of the movable part 306 in the z-direction and sufficient in-plane strength to prevent the shaker module from being damaged by an impact including an in-plane force component.

[0033] exist Figure 4 In the cross-sectional view of , the thickness of the first leaf spring 308 and the second leaf spring 310 in the z-direction and the substantially flat arrangement of each of the first leaf spring 308 and the second leaf spring 310 in a plane perpendicular to the z-direction can be seen. The thickness of the frame 300 in the z-direction can also be seen. Figure 4 Also shown is how the first leaf spring 308 and the second leaf spring 310 may form a pair of gap-separated leaf springs separated in the z-direction by a gap 400. This separation of the two layers of leaf springs by the gap 400 provides rotational stability to the magnet assembly (e.g., including the ring plate 316, the side magnets 318, the center plate 320, the center magnet 322, and the bracket 324), which prevents rotation or swaying of the magnet assembly (e.g., the magnet assembly rotates out of a plane parallel to the xy plane).

[0034] Figure 4 The example of also shows how the first leaf spring 308 may include an outer beam 408, an inner beam 410, and a leaf spring element 412 extending parallel to a plane (e.g., parallel to the xy plane) from the outer beam 408 to the inner beam 410. As shown, the second leaf spring 310 separated from the first leaf spring 308 by a gap 400 may include an outer beam 402, an inner beam 404, and a leaf spring element 406 extending parallel to a plane (e.g., parallel to the xy plane) from the outer beam 402 to the inner beam 404. Figure 4 In the example of FIG. 4 , the outer beam 408 includes a curved portion molded into the frame 300. However, in other implementations, the outer beam 408 may be substantially flat without any curvature.

[0035] like Figure 4 As shown, in the assembled configuration of the shaker module 200, the outer beam 408 of the first leaf spring 308 can be attached to (e.g., insert molded into) the frame 300, the inner beam 410 of the first leaf spring 308 can be attached to (e.g., welded such as laser welded) the ring plate 316 of the magnet assembly, the outer beam 402 of the second leaf spring 310 can be attached to the frame 300 (e.g., fixed in a recess 420 in the frame), and the inner beam 404 of the second leaf spring 310 can be attached to (e.g., welded such as laser welded) the bracket 324 of the magnet assembly. As shown, the side magnet 318 can have a (e.g., linear) annular shape and can be attached to the bottom surface of the ring plate 316 on a first side and attached to the top surface of the bracket 324 on an opposite second side. In this arrangement, the ring plate 316 and the side magnet 318 extend around the outer edge of the coil 314.

[0036] As shown, the bracket 324 may extend from a portion mounted between the inner beam 404 of the second leaf spring 310 and the side magnets 318 below the coil 314 to a central portion that supports the central magnet 322 at a location within the bore of the coil 314 .

[0037] Figure 5 2 shows a top view of an exemplary leaf spring for a shaker module 200 in accordance with aspects of the present disclosure. Figure 5 In the example of FIG. 3 , a second leaf spring 310 is shown that includes an outer beam 402, an inner beam 404, and a plurality of leaf spring elements 406, each extending from the outer beam 402 to the inner beam 404 along a corresponding curved path parallel to a plane (eg, an xy plane). Figure 5 In the example of FIG. 4 , the second leaf spring 310 includes four leaf spring elements 406. Figure 5 In the example of FIG. 4 , each leaf spring element extends from the outer beam 402 to the inner beam 404 along a similarly shaped s-curve in the xy plane.

[0038] In various implementations, the first leaf spring 308 or the second leaf spring 310 may include one, two, three, four, or more than four leaf spring elements. In various implementations, the one, two, three, four, or more than four leaf spring elements of the leaf spring may have a common curved shape (e.g., an S-curve), such as Figure 5 In other embodiments, one or more of the one, two, three, four, or more leaf spring elements of the leaf spring may have a shape different from the s-shape shown. For example, one or more of the one, two, three, four, or more leaf spring elements may extend along a curved path that includes more than one s-shape. Figure 5 An S-curve has two less in-plane curvatures or more in-plane curvatures.

[0039] like Figure 5As shown, the inner beam 404 is offset from the outer beam 402, the inner beam and the outer beam have a width A, the leaf spring element is separated from the inner beam and the outer beam by a minimum distance B less than the width A, and the leaf spring element 406 has a width C greater than the minimum distance B and the width A. In one or more specific implementations, the width A can be between, for example, 0.4 millimeters (mm) and 0.7 mm. In one or more specific implementations, the minimum distance B can be between, for example, 0.2 mm and 0.5 mm. In one or more specific implementations, the width C can be between, for example, 1 mm and 1.3 mm.

[0040] The exemplary s-shaped leaf spring arrangement of the first leaf spring 308 and the second leaf spring 310 described herein provides mechanical and design advantages over other mounting arrangements for the magnet assembly. For example, in addition to the low z-height of the flat arrangement, the s-shaped leaf spring elements include curved portions (e.g., in-plane curved portions) but do not include bend points that may form weak points that fatigue develops over time.

[0041] In this S-shaped leaf spring arrangement, the drop performance of the shaker module can be improved (e.g., by modifying the geometry, length and / or path of the S-shape of the leaf spring element) substantially independently of the resonant frequency performance (e.g., which can be modified by modifying the thickness of the leaf spring), in contrast to other spring arrangements in which a harder material used to improve drop performance can increase the minimum resonant frequency that the shaker component can achieve. In addition, the leaf spring arrangement described herein provides improved shape stability under laser welding (e.g., when the first leaf spring 308 is laser welded to the ring plate 316 and / or when the second leaf spring 310 is laser welded to the bracket 324) compared to other non-leaf spring arrangements.

[0042] Figure 6 A top view (e.g., without a frame for clarity) of the springs and moving parts of a shaker module 200 in an implementation including four first leaf springs 308 is shown, each leaf spring being disposed along a corresponding edge of the linear shaker module 200. As shown, the shaker module 200 can be provided in a rectangular arrangement having two opposing long edges and two opposing short edges. In this example, the shaker module 200 includes two first leaf springs 308, each first leaf spring being disposed along a corresponding one of the opposing long edges, and each first leaf spring having four leaf spring elements 412 extending along a corresponding curved path parallel to the xy plane. In this example, the shaker module 200 also includes two first leaf springs 308, each first leaf spring being disposed along a corresponding one of the opposing short edges, and each first leaf spring having two leaf spring elements 412 extending along a corresponding curved path in the xy plane.

[0043] exist Figure 6In the example of the shaker module 200, the shaker module 200 also includes four corresponding second leaf springs 310, each of which is arranged along a corresponding edge of the linear shaker module 200, and each of which is separated from a corresponding first leaf spring of the first leaf springs 308 by a vertical gap (e.g., gap 400). In this example, the shaker module 200 includes two second leaf springs 310, each of which is arranged along a corresponding long edge of the opposite long edges, and each of which has four leaf spring elements 406 extending along a corresponding curved path parallel to the xy plane. In this example, the shaker module 200 also includes two first leaf springs 308, each of which is arranged along a corresponding short edge of the opposite short edges, and each of which has two leaf spring elements 406 extending along a corresponding curved path parallel to the xy plane. As shown in the figure, the curved path of each leaf spring element 412 of the first leaf spring 308 is a mirror image of the curved path of the corresponding one of the leaf spring elements 406 of the corresponding second leaf spring 310.

[0044] In this example, each edge of the shaker module 200 includes a first leaf spring 308 and a second leaf spring 310 that form a gap-partitioned leaf spring pair 600. In each gap-partitioned pair 600, the corresponding curved paths of the plurality of leaf spring elements 412 of the first leaf spring 308 are each a mirror image of the corresponding curved path of one of the plurality of leaf spring elements 406 of the second leaf spring 310 of the gap-partitioned pair 600. Figure 6 As shown, except Figure 4 The rocker module 200 may include two, three, four, or more than four additional gap-spaced leaf spring pairs in addition to the gap-spaced pair shown and disposed around the perimeter of the interior of the interior opening 302 in the frame 300 .

[0045] In this arrangement, the shaker module 200 includes two layers of leaf springs (a first layer including first leaf springs 308 and a second layer including second leaf springs 310) separated by a vertical gap 400, each extending parallel to a common plane. The two layers of gap-separated springs cooperate to allow linear actuation of the moving element in a direction (e.g., z-direction) perpendicular to the common plane (e.g., xy plane) and prevent rocking of the moving element relative to the common plane.

[0046] like Figures 1 to 6 As shown in the example of , an electronic device such as electronic device 100 may include a shaker module 200, the shaker module including a reinforcing plate 312 having a first side 313 attached to the interior surface 202 of the housing 106 of the device and an opposite second side attached to the frame 300. The shaker module may also include a coil 314 attached to the opposite second side of the reinforcing layer. The electronic device may also include one or more processors configured to generate control signals (see, for example, Figure 8812), and a flexible printed circuit (e.g., connector 204) coupled to the coil 314 and configured to provide control signals from the one or more processors to the coil.

[0047] In one or more specific implementations, the movable component 306 of the shaker module 200 may include a magnet assembly including side magnets 318 extending around the outer edge of the coil 314, and a center magnet 322 at least partially disposed within the bore of the coil 314. The shaker module may also include a bracket 324 extending from the side magnets 318 to the center magnet 322 and positioning the center magnet 322 at least partially within the bore of the coil 314. The shaker module may also include a ring plate 316 attached to the top surface of the side magnets 318.

[0048] like Figures 1 to 6 As shown in the example of FIG. 1 , in one or more specific implementations, the electronic device 100 includes a first leaf spring 308 extending from the frame 300 to the movable part 306 parallel to a plane (e.g., a plane defined by the reinforcing plate), and a second leaf spring 310 spaced apart from the first leaf spring in a direction perpendicular to the plane, the second leaf spring being parallel to the first leaf spring and extending between the frame 300 and the movable part 306 parallel to the plane. In one or more specific implementations, the first leaf spring 308 includes a first portion (e.g., an outer beam 408) attached to the frame 300, a second portion (e.g., an inner beam 410) attached to the top surface of the ring plate 316, and one or more leaf spring elements 412 extending along a curved path between the first portion and the second portion of the first leaf spring. In one or more specific implementations, the second leaf spring 310 includes a first portion (e.g., an outer beam 402) attached to the frame 300, a second portion (e.g., an inner beam 404) attached to the bottom surface of the bracket 324, and one or more leaf spring elements 406 extending along a curved path between the first portion and the second portion of the second leaf spring.

[0049] Figure 7 A flow chart of an exemplary process 700 for operating a shaker module of an electronic device according to an implementation of the subject technology is shown. Figure 1 The process 700 is described with reference to the electronic device 100. However, the process 700 is not limited to Figure 1The electronic device 100 of the present invention, and one or more frames (or operations) of process 700 may be performed by one or more other components of other suitable devices (including any other device that implements a shaker module such as shaker module 200). Further for the purpose of explanation, some frames of process 700 are described herein as occurring sequentially or linearly. However, multiple frames of process 700 may occur in parallel. In addition, the frames of process 700 do not have to be performed in the order shown, and / or one or more frames of process 700 do not have to be performed and / or may be replaced by other operations.

[0050] like Figure 7 As shown, at block 702, a control signal may be provided from a control circuit (e.g., one or more processors) of an electronic device, such as electronic device 100, to a shaker module (e.g., shaker module 200) of the electronic device. In one or more specific implementations, the shaker module may include a frame (such as frame 300) that defines at least a portion of an outer peripheral edge (such as outer peripheral edge 304 of shaker module 200) and an internal opening (such as internal opening 302), wherein the outer peripheral edge 304 defines a plane extending through the internal opening. In one or more specific implementations, the shaker module may also include a movable component, such as movable component 306, disposed within the internal opening in the frame. In one or more specific implementations, the shaker module may also include a first leaf spring, such as one of first leaf springs 308 extending parallel to the plane from the frame to the movable component. In one or more specific implementations, the shaker module may further include a second leaf spring, such as one of the second leaf springs 310 spaced apart from the first leaf spring in a direction perpendicular to the plane, the second leaf spring extending parallel to the first leaf spring and parallel to the plane between the frame and the movable component. In one or more specific implementations, the control signal may be provided in conjunction with a control signal for an audio component or an acoustic component (e.g., a speaker) of the electronic device.

[0051] At box 704, the movable component can be moved (e.g., actuated) relative to the frame based on the control signal. For example, moving the movable component can include generating a current in a coil such as coil 314 in response to the control signal, which causes one or more magnets in the magnet assembly of the movable component (e.g., a center magnet 322 disposed in the coil 314 and / or a side magnet 318 extending around the outer periphery of the coil 314) to move in a direction parallel to the coil axis. In one or more specific implementations, the shaker module (e.g., a reinforcement layer of the shaker module) can be attached to a portion of a housing or other structure of an electronic device. In one or more specific implementations, moving the movable component can cause a portion of a housing or other structure of an electronic device to move and / or vibrate. The movement and / or vibration of a portion of a housing or other structure of an electronic device can generate and / or simulate sound, and / or provide a tactile output from the electronic device.

[0052] For example, the control signal for the shaker module can be configured to cause the shaker module to vibrate a portion of the housing of the electronic device to produce and / or simulate low-frequency sounds that complement or supplement the higher-frequency sounds produced by the speaker. For example, the control signal for the speaker may cause the speaker to produce sounds corresponding to the voice of a singer or a musical instrument such as a guitar, piano, snare drum or cymbals, or a trumpet, stringed instrument, or woodwind instrument (as an example), while the control signal for the shaker module causes the shaker module (e.g., by actuating a portion of the device housing or other structure of the device) to produce and / or simulate sounds corresponding to low-frequency instruments such as a bass guitar or bass drum. For another example, the control signal for the speaker may cause the speaker to produce sounds corresponding to the voice of a person in a movie or video game (as an example), while the control signal for the shaker module causes the shaker module (e.g., by actuating a portion of the device housing or other structure of the device) to produce and / or simulate sounds corresponding to a car crash or explosion in a movie or video game.

[0053] In one or more implementations, the control signal corresponds to a low frequency audio output of the electronic device. In one or more implementations, the control signal is provided in conjunction with an additional control signal for a speaker of the electronic device, the additional control signal corresponding to a relatively high frequency audio output control signal for the electronic device. In one or more implementations, the shaker module is attached to a housing (e.g., housing 106) of the electronic device, and moving the movable component causes movement of at least a portion of the housing based on the control signal.

[0054] Figure 8 An electronic system 800 is shown that can be used to implement one or more implementations of the subject technology. The electronic system 800 can be, for example, Figure 1One or more of the devices such as the electronic device 100 shown, and / or may be a part thereof. The electronic system 800 may include various types of computer-readable media and interfaces for various other types of computer-readable media. The electronic system 800 includes a bus 808, one or more processing units 812, a system memory 804 (and / or a buffer), a ROM 810, a permanent storage device 802, an input device interface 814, an output device interface 806, and one or more network interfaces 816, or a subset and variation thereof.

[0055] The bus 808 generally represents all system buses, peripheral busses, and chipset buses that communicatively connect the many internal devices of the electronic system 800. In one or more specific implementations, the bus 808 communicatively connects one or more processing units 812 with the ROM 810, the system memory 804, and the permanent storage device 802. The one or more processing units 812 retrieve instructions to be executed and data to be processed from these various memory units in order to perform the processes disclosed in the present subject matter. In different specific implementations, the one or more processing units 812 can be a single processor or a multi-core processor.

[0056] ROM 810 stores static data and instructions required by one or more processing units 812 and other modules of the electronic system 800. On the other hand, permanent storage device 802 can be a read-write memory device. Permanent storage device 802 can be a non-volatile memory unit that stores instructions and data even when the electronic system 800 is turned off. In one or more specific implementations, a mass storage device (such as a magnetic disk or optical disk and its corresponding disk drive) can be used as permanent storage device 802.

[0057] In one or more implementations, a removable storage device (such as a floppy disk, a flash drive, and its corresponding disk drive) may be used as the permanent storage device 802. Like the permanent storage device 802, the system memory 804 may be a read-write memory device. However, unlike the permanent storage device 802, the system memory 804 may be a volatile read-write memory, such as a random access memory. The system memory 804 may store any of the instructions and data that one or more processing units 812 may need at runtime. In one or more implementations, the processes disclosed in the subject matter are stored in the system memory 804, the permanent storage device 802, and / or the ROM 810. The one or more processing units 812 retrieve instructions to be executed and data to be processed from these various memory units in order to perform the processes of one or more implementations.

[0058] The bus 808 is also connected to an input device interface 814 and an output device interface 806. The input device interface 814 enables a user to transmit information and select commands to the electronic system 800. The input device that can be used with the input device interface 814 may include, for example, an alphanumeric keyboard and a pointing device (also referred to as a "cursor control device"). The output device interface 806 may, for example, enable the display of images generated by the electronic system 800. The output device that can be used with the output device interface 806 may include, for example, a shaker module, an audio component, a printer, and a display device, such as a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, a flexible display, a flat panel display, a solid-state display, a projector, or any other device for outputting information. One or more specific implementations may include a device that acts as both an input device and an output device, such as a touch screen. In these specific implementations, the feedback provided to the user may be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and the input from the user may be received in any form, including acoustic, voice, or tactile input.

[0059] Finally, if Figure 8 As shown, bus 808 also couples electronic system 800 to one or more networks and / or to one or more network nodes via one or more network interfaces 816. In this manner, electronic system 800 may be part of a computer network, such as a LAN, a wide area network ("WAN"), or an intranet, or may be part of a network of networks, such as the Internet. Any or all components of electronic system 800 may be used with the subject disclosure.

[0060] According to some aspects of the subject disclosure, a shaker module for an electronic device is provided. The shaker module includes a frame that defines at least a portion of an outer peripheral edge of the shaker module and an internal opening. The outer peripheral edge defines a plane extending through the internal opening. The shaker module also includes a movable component disposed within the internal opening in the frame. The shaker module also includes a first leaf spring extending from the frame to the movable component parallel to the plane. The shaker module also includes a second leaf spring spaced apart from the first leaf spring in a direction perpendicular to the plane, the second leaf spring extending parallel to the first leaf spring and parallel to the plane between the frame and the movable component.

[0061] According to other aspects of the subject disclosure, there is provided an electronic device comprising a housing and a shaker module attached to the inner surface of the housing. The shaker module comprises a frame defining at least a portion of an outer peripheral edge of the shaker module and an inner opening. The outer peripheral edge defines a plane extending through the inner opening. The shaker module also comprises a movable component disposed within the inner opening in the frame. The shaker module also comprises a first leaf spring extending from the frame to the movable component parallel to the plane. The shaker module also comprises a second leaf spring spaced apart from the first leaf spring in a direction perpendicular to the plane, the second leaf spring extending between the frame and the movable component parallel to the first leaf spring and parallel to the plane.

[0062] According to other aspects of the subject disclosure, a method for operating an electronic device is provided, the method comprising providing a control signal from a control circuit of the electronic device to a shaker module of the electronic device. The shaker module comprises a frame, the frame defining at least a portion of an outer peripheral edge and an inner opening of the shaker module. The outer peripheral edge defines a plane extending through the inner opening. The shaker module also comprises a movable component disposed within the inner opening in the frame. The shaker module also comprises a first leaf spring extending from the frame to the movable component parallel to the plane. The shaker module also comprises a second leaf spring spaced apart from the first leaf spring in a direction perpendicular to the plane, the second leaf spring being parallel to the first leaf spring and extending between the frame and the movable component parallel to the plane. The method also comprises moving the movable component relative to the frame based on the control signal.

[0063] Implementations within the scope of the present disclosure may be implemented in part or in whole using a tangible computer-readable storage medium (or multiple tangible computer-readable storage media of one or more types) programmed with one or more instructions. Tangible computer-readable storage media may also be non-transitory in nature.

[0064] Computer-readable storage media can be any storage media that can be read, written, or otherwise accessed by a general or special computing device, including any processing electronics and / or processing circuitry capable of executing instructions. For example, without limitation, computer-readable media can include any volatile semiconductor memory, such as RAM, DRAM, SRAM, T-RAM, Z-RAM, and TTRAM. Computer-readable media can also include any non-volatile semiconductor memory, such as ROM, PROM, EPROM, EEPROM, NVRAM, flash memory, nvSRAM, FeRAM, FeTRAM, MRAM, PRAM, CBRAM, SONOS, RRAM, NRAM, racetrack memory, FJG, and Millipede memory.

[0065] In addition, the computer-readable storage medium may include any non-semiconductor memory, such as optical disk storage, magnetic disk storage, magnetic tape, other magnetic storage devices, or any other medium capable of storing one or more instructions. In one or more specific implementations, the tangible computer-readable storage medium may be directly coupled to the computing device, while in other specific implementations, the tangible computer-readable storage medium may be indirectly coupled to the computing device, for example, via one or more wired connections, one or more wireless connections, or any combination thereof.

[0066] Instructions can be directly executable, or can be used to develop executable instructions. For example, instructions can be implemented as executable or non-executable machine code, or can be implemented as high-level language instructions that can be compiled to produce executable or non-executable machine code. In addition, instructions can also be implemented as data, or can include data. Computer executable instructions can also be organized in any format, including routines, subroutines, programs, data structures, objects, modules, applications, applets, functions, etc. As recognized by those skilled in the art, the details including but not limited to the number, structure, sequence and organization of instructions can be significantly different without changing the underlying logic, function, processing and output.

[0067] Although the above discussion mainly involves microprocessors or multi-core processors that execute software, one or more implementations are performed by one or more integrated circuits such as ASICs or FPGAs. In one or more implementations, such integrated circuits execute instructions stored on the circuits themselves.

[0068] The various functions described above may be implemented in digital electronic circuits, computer software, firmware or hardware. The technology may be implemented using one or more computer program products. A programmable processor and a computer may be included in a mobile device or packaged as a mobile device. The process and logic flow may be performed by one or more programmable processors and one or more programmable logic circuits. General and special computing devices and storage devices may be interconnected via a communication network.

[0069] Some specific implementations include electronic components such as microprocessors, storage devices, and memories that store computer program instructions in machine-readable or computer-readable media (or computer-readable storage media, machine-readable media, or machine-readable storage media). Some examples of such computer-readable media include RAM, ROM, CD-ROM, CD-R, CD-RW, digital versatile disk (e.g., DVD-ROM, double-layer DVD-ROM), various recordable / rewritable DVDs (e.g., DVD-RAM, DVD-RW, DVD+RW, etc.), flash memory (e.g., SD card, mini-SD card, micro-SD card, etc.), magnetic and / or solid-state hard drives, ultra-density optical disks, any other optical or magnetic media, and floppy disks. Computer-readable media can store computer programs that can be executed by at least one processing unit and include instruction sets for performing various operations. Examples of computer programs or computer codes include machine code, such as machine code generated by a compiler, and files including higher-level code that can be executed by a computer, electronic component, or microprocessor using an interpreter.

[0070] Although the above discussion mainly involves microprocessors or multi-core processors that execute software, some implementations are performed by one or more integrated circuits such as application specific integrated circuits (ASICs) or field programmable gate arrays (FPGAs). In some implementations, such integrated circuits execute instructions stored on the circuits themselves.

[0071] As used in this specification and any claims of this patent application, the terms "computer", "processor" and "memory" refer to electronic or other technical devices. These terms exclude people or groups of people. For the purposes of this specification, the terms "display" or "displaying" mean displaying on an electronic device. As used in this specification and any claims of this patent application, the terms "computer-readable medium" and "computer-readable media" are entirely limited to tangible, tangible objects that store information in a form that can be read by a computer. These terms do not include any wireless signals, wired download signals, and any other transient signals.

[0072] Many of the features and applications described above can be implemented as a software process specified as a set of instructions recorded on a computer-readable storage medium (also referred to as a computer-readable medium). When these instructions are executed by one or more processing units (e.g., one or more processors, cores of a processor, or other processing units), these instructions cause the one or more processing units to perform the actions indicated in the instructions. Examples of computer-readable media include, but are not limited to, CD-ROMs, flash drives, RAM chips, hard drives, EPROMs, etc. Computer-readable media do not include carrier waves and electrical signals transmitted wirelessly or through wired connections.

[0073] In this specification, the term "software" is intended to include firmware residing in a read-only memory or applications stored in a magnetic storage device, which can be read into a memory for processing by a processor. Similarly, in some specific implementations, while retaining the different software aspects disclosed in this subject, multiple software aspects disclosed in this subject can be implemented as sub-parts of a larger program. In some specific implementations, multiple software aspects can also be implemented as independent programs. Finally, any combination of independent programs that jointly implement the software aspects described herein is within the scope of this subject disclosure. In some specific implementations, when installed to run on one or more electronic systems, the software program defines one or more specific machine implementations that execute and enforce the operations of the software program.

[0074] A computer program (also referred to as a program, software, software application, script, or code) may be written in any form of programming language, including compiled or interpreted languages, declarative or procedural languages, and may be deployed in any form, including as a stand-alone program or as a module, component, subroutine, object, or other unit suitable for use in a computing environment. A computer program may, but need not, correspond to a file in a file system. A program may be stored in a portion of a file that holds other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to the program in question, or in multiple coordinated files (e.g., files storing one or more modules, subroutines, or code portions). A computer program may be deployed to execute on one computer or on multiple computers located at the same site or distributed across multiple sites and interconnected by a communications network.

[0075] It should be understood that the specific order or the hierarchical structure of the frame in the process disclosed by the present invention are the illustration of exemplary methods. Based on the design preferred requirements, it should be understood that the specific order or the hierarchical structure of the frame in the process can be rearranged or all the frames shown are executed. Some frames in these frames can be executed simultaneously. For example, in some cases, multitasking and parallel processing may be advantageous. In addition, the division of each system component in the above-mentioned embodiment should not be understood as requiring this type of division in all embodiments, and it should be understood that the program component and system can be generally integrated in a single software product or encapsulated in a plurality of software products.

[0076] The previous description is provided to enable those skilled in the art to practice the various aspects described herein. Various modifications of these aspects are apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects. Therefore, the claims are not intended to be limited to the aspects shown herein, but are intended to make the full scope consistent with the language claims, wherein reference to elements in singular values ​​is not intended to mean "one and only one", but to refer to "one or more", unless specifically noted. Unless otherwise specifically stated, the term "some" refers to one or more. Male pronouns (e.g., his) include female and neutral (e.g., her and its), and vice versa. Titles and subtitles (if any) are used only for convenience and do not limit the subject disclosure.

[0077] The predicate words "configured to," "operable to," and "programmed to" do not imply any specific tangible or intangible modification of a subject matter but are intended to be used interchangeably. For example, a component or a processor configured to monitor and control an operation may also mean that the processor is programmed to monitor and control the operation or that the processor is operable to monitor and control the operation. Likewise, a processor configured to execute code may be interpreted as a processor programmed to execute code or operable to execute code.

[0078] Phrases such as "aspects" do not mean that the aspect is essential to the subject technology or that the aspect applies to all configurations of the subject technology. A disclosure related to an aspect may apply to all configurations, or one or more configurations. Phrases such as aspects may refer to one or more aspects and vice versa. Phrases such as "configurations" do not mean that the configuration is essential to the subject technology or that the configuration applies to all configurations of the subject technology. A disclosure related to a configuration may apply to all configurations or one or more configurations. Phrases such as configurations may refer to one or more configurations and vice versa.

[0079] The word “exemplary” is used herein to mean “serving as an example or illustration.” Any aspect or design described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects or designs.

[0080] In one aspect, the term "coupled" or the like may refer to a direct coupling. On the other hand, the term "coupled" or the like may refer to an indirect coupling.

[0081] Terms such as top, bottom, front, back, side, horizontal, vertical, etc. refer to an arbitrary frame of reference, not the usual gravitational frame of reference. Thus, such terms may extend upward, downward, diagonally, or horizontally in a gravitational frame of reference.

[0082] All structural and functional equivalents of the elements throughout the various aspects described in this disclosure that are known or later become known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be covered by the claims. In addition, anything disclosed herein is not intended to be provided to the public, regardless of whether the disclosure is explicitly stated in the claims. No claim element should be interpreted under the provisions of 35 U.S.C. §112(f) unless the element is explicitly stated using the phrase "device for..." or, in the case of a method claim, the element is stated using the phrase "step for..." In addition, the terms "including", "having", etc. are used in the specification or claims to the extent that such terms are intended to be included in a manner similar to how the term "including" is interpreted when used as a transitional word in a claim.

Claims

1. A shaker module for an electronic device, the shaker module include: a frame defining at least a portion of an outer peripheral edge of the shaker module and an interior opening, wherein the outer peripheral edge defines a plane extending through the interior opening, wherein the interior opening extends through a thickness of the frame from a top end of the frame to a bottom end of the frame; a movable member disposed within the interior opening in the frame; a first leaf spring extending parallel to the plane from the frame to the movable member; and a second leaf spring spaced from the first leaf spring in a direction perpendicular to the plane, the second leaf spring extending parallel to the first leaf spring and parallel to the plane between the frame and the movable member, wherein the first leaf spring and the second leaf spring form a pair of gap-spaced leaf springs, wherein the first leaf spring and the second leaf spring are each flat in a dimension parallel to the plane; as well as A plurality of additional gap-spaced leaf spring pairs each extend parallel to the plane between the frame and the magnet assembly.

2. The shaker module according to claim 1, wherein the first leaf spring and the second leaf spring cooperate to allow the movable part to elastically move in the direction perpendicular to the plane, to prevent the movable part from moving within the plane, and to prevent the movable part from rotating out of the plane.

3. The shaker module according to claim 1, further comprising: include: a reinforcement plate attached to the frame; and a voice coil coupled to the reinforcement plate, wherein the movable component includes a magnet assembly having at least a portion positioned within the voice coil by the first leaf spring and the second leaf spring, and wherein the voice coil is operable to cause the magnet assembly to move in the direction perpendicular to the plane. 4 . The shaker module of claim 3 , wherein the first leaf spring and the second leaf spring each have a thickness in the direction perpendicular to the plane.

5. The shaker module of claim 4, wherein the first leaf spring and the second leaf spring each include an outer beam, an inner beam, and a plurality of leaf spring elements, the plurality of leaf spring elements each extending from the outer beam to the inner beam along a corresponding curved path parallel to the plane.

6. The shaker module of claim 5, wherein the outer beam of the first leaf spring is insert-molded into the frame, the inner beam of the first leaf spring is welded to the ring plate of the magnet assembly, the outer beam of the second leaf spring is fixed in a recess in the frame, and the inner beam of the second leaf spring is welded to a bracket of the magnet assembly.

7. The shaker module of claim 5, wherein the corresponding bending path of each of the plurality of leaf spring elements of the first leaf spring is a mirror image of the corresponding bending path of one of the plurality of leaf spring elements of the second leaf spring. 8 . The shaker module of claim 1 , wherein the frame has a thickness in the direction perpendicular to the plane.

9. An electronic device, the electronic device include: shell; and a shaker module, the shaker module being attached to the interior surface of the housing, the shaker module comprising: a coil attached to a reinforcement layer of the shaker mold; a frame defining at least a portion of an outer peripheral edge of the shaker module and an interior opening, wherein the outer peripheral edge defines a plane extending through the interior opening, wherein the interior opening extends through a thickness of the frame from a top end of the frame to a bottom end of the frame; a movable component disposed within the interior opening in the frame, wherein the movable component comprises a magnet assembly comprising: a side magnet extending around an outer edge of the coil; and a central magnet disposed at least partially within the bore of the coil; a first leaf spring extending parallel to the plane from the frame to the movable member; and A second leaf spring, the second leaf spring is separated from the first leaf spring in a direction perpendicular to the plane, the second leaf spring is parallel to the first leaf spring and extends between the frame and the movable part parallel to the plane, wherein the first leaf spring and the second leaf spring are each flat in a dimension parallel to the plane.

10. The electronic device of claim 9, wherein the shaker module comprises a reinforcement layer having a first side attached to the frame and an opposing second side attached to the interior surface of the housing. The electronic device of claim 10 , wherein the coil is attached to the first side of the reinforcement layer.

12. The electronic device according to claim 11, further comprising: include: one or more processors configured to generate control signals; and A flexible printed circuit is coupled to the coil and configured to provide the control signal from the one or more processors to the coil.

13. The electronic device according to claim 9, wherein the shaker module further include: a bracket extending from the side magnets to the center magnet and positioning the center magnet at least partially within the bore of the coil; and A ring plate is attached to a top surface of the side magnet.

14. The electronic device according to claim 13, wherein the first leaf spring include: a first portion, the first portion being attached to the frame, a second portion, the second portion being attached to a top surface of the ring plate, and a plurality of leaf spring elements extending between the first portion and the second portion of the first leaf spring along a curved path parallel to the plane; And wherein the second leaf spring comprises: a first portion, the first portion being attached to the frame, a second portion attached to a bottom surface of the bracket, and A plurality of leaf spring elements extend between the first portion and the second portion of the second leaf spring along a curved path parallel to the plane.

15. A method for operating an electronic device, the method include: A control signal is provided from a control circuit of the electronic device to a shaker module of the electronic device, wherein the shaker module comprises: a frame defining at least a portion of an outer peripheral edge of the shaker module and an interior opening, wherein the outer peripheral edge defines a plane extending through the interior opening, wherein the interior opening extends through a thickness of the frame from a top end of the frame to a bottom end of the frame; a movable member disposed within the interior opening in the frame and comprising a magnet assembly; a first leaf spring extending parallel to the plane from the frame to the movable member; and a second leaf spring, the second leaf spring being spaced apart from the first leaf spring in a direction perpendicular to the plane, the second leaf spring extending parallel to the first leaf spring and parallel to the plane between the frame and the movable member, wherein the first leaf spring and the second leaf spring each include an outer beam, an inner beam, and one or more leaf spring elements, the one or more leaf spring elements each extending from the outer beam to the inner beam along a corresponding curved path parallel to the plane, wherein the first leaf spring and the second leaf spring each are planar in a dimension parallel to the plane, and wherein the outer beam of the first leaf spring is attached to the frame, the inner beam of the first leaf spring is attached to a ring plate of the magnet assembly, the outer beam of the second leaf spring is fixed within a recess in the frame, and the inner beam of the second leaf spring is attached to a bracket of the magnet assembly; and Based on the control signal, the movable member is moved relative to the frame.

16. The method of claim 15, wherein the control signal corresponds to a low frequency audio output of the electronic device.

17. The method of claim 16, wherein the control signal is provided in conjunction with an additional control signal for a speaker of the electronic device, the additional control signal corresponding to a relatively higher frequency audio output control signal for the electronic device.

18. The method of claim 15, wherein the shaker module is attached to a housing of the electronic device, and wherein moving the movable member causes movement of at least a portion of the housing based on the control signal.

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