Playing operation device

Abstract

The performance control device includes a distance sensor, an operating member, and a holding unit. The distance sensor comprises a first substrate and a second substrate, each with a conductor disposed thereon, and measures the distance between the first substrate and the second substrate. The operating member can be operated by an operator. The holding unit holds the first substrate between the operating member and the second substrate and moves integrally with the operating member. Furthermore, the performance control device includes a distance sensor, an operating member, a first component, and a holding unit. The first component is linked to the operating member. The holding unit holds the first substrate between the first component and the second substrate and moves integrally with the first component.

Description

Technical Field

[0001] This invention relates to a performance operation device. Background Technology

[0002] In electronic keyboard musical instruments, the pressing of keys is detected, and a sound signal is generated based on the detection result. Key pressing is detected using either contact or non-contact sensors. For such non-contact sensors, there are also sensors that can function as distance sensors, thus enabling continuous measurement of the amount of key pressed. This allows for high-precision reflection of key movement in the sound production, and also enables the detection of the distance after touch.

[0003] Non-contact sensors include, for example, optical sensors. Compared to magnetic sensors, optical sensors are more susceptible to the effects of external light or contaminants. For instance, in electronic keyboard instruments, lubricant is used in the moving parts. This lubricant can splatter and sometimes contaminate the optical sensor. Additionally, such sensors are sometimes used in acoustic pianos, which are equipped with sound sources. In the case of acoustic pianos, sometimes a part of the frame (e.g., the top plate) is opened during playing, exposing the sensor to external light.

[0004] As a non-contact sensor that is not affected by such factors, there are magnetic induction sensors (e.g., Patent Document 1).

[0005] Patent Document 1: US Patent No. 4,580,478 Summary of the Invention

[0006] Magnetic induction sensors are non-contact; therefore, one of the substrates housing the coil needs to be mounted on the part that moves with the keys, thus requiring corresponding mounting for each key. Keyboard instruments use a large number of keys, therefore, the efficiency of mounting substrates to each key is crucial in the manufacturing process of keyboard instruments.

[0007] One of the objectives of this invention is to simplify the manufacturing process of a performance control device using a magnetic induction sensor.

[0008] According to one embodiment of the present invention, a performance operation device having a distance sensor, an operating member, and a holding member is provided. The distance sensor includes a first substrate and a second substrate, each having a conductor disposed thereon, and measures the distance between the first substrate and the second substrate. The operating member can be operated by an operator. The holding member holds the first substrate between the operating member and the second substrate and moves integrally with the operating member.

[0009] According to one embodiment of the present invention, a performance operation device having a distance sensor, an operating member, and a holding member is provided. The distance sensor includes a first substrate and a second substrate, each having a conductor disposed thereon, and measures the distance between the first substrate and the second substrate. The operating member can be operated by an operator. The first component is linked to the operating member. The holding member holds the first substrate between the first component and the second substrate and moves integrally with the first component.

[0010] The operating element and the retaining part can be made of the same material.

[0011] The first component and the retaining part can be made of the same material.

[0012] The first component may include a portion capable of elastic deformation. When subjected to a force from the operating member, the first component elastically deforms, thereby changing the distance between the first substrate and the second substrate. In this case, the force received by the first component from the operating member may be a direct force or a force received inter-componently.

[0013] The holding part can hold the first substrate in a detachable manner.

[0014] The holding portion may include an elastic body. When the elastic body is in a first state, the holding portion holds the first substrate. When the elastic body is in a second state, which is further elastically deformed compared to the first state, the holding portion releases the holding of the first substrate.

[0015] The holding portion includes a first plate portion and a second plate portion, the first plate portion and the second plate portion being able to change their positional relationship. In a first state in which the first substrate is held by the first plate portion and the second plate portion, the holding portion holds the first substrate. In a second state in which the first plate portion and the second plate portion are further apart than in the first state, the holding portion releases the holding portion from holding the first substrate.

[0016] The effects of the invention

[0017] According to one embodiment of the present invention, the manufacturing process of a performance operation device using a magnetic induction sensor can be simplified. Attached Figure Description

[0018] Figure 1 This is a diagram illustrating a keyboard device according to the first embodiment of the present invention.

[0019] Figure 2 This is a diagram illustrating the internal structure (when a key is released) of the keyboard device according to the first embodiment of the present invention.

[0020] Figure 3 This is a diagram illustrating the internal structure of the keyboard device according to the first embodiment of the present invention (when the white key is pressed).

[0021] Figure 4 This is a diagram illustrating the active circuit board according to the first embodiment of the present invention.

[0022] Figure 5 This is a diagram illustrating the passive circuit board according to the first embodiment of the present invention.

[0023] Figure 6 This is a diagram illustrating the substrate holder with the passive circuit board removed according to the first embodiment of the present invention.

[0024] Figure 7 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the first embodiment of the present invention.

[0025] Figure 8 This is a view from below of the substrate holder with the fixing components removed according to the first embodiment of the present invention.

[0026] Figure 9 This is a cross-sectional view (cut lines Ac1-Ac2) illustrating the substrate holder according to the first embodiment of the present invention.

[0027] Figure 10 This is a cross-sectional view (cut-off lines Bc1-Bc2) illustrating the substrate holder according to the first embodiment of the present invention.

[0028] Figure 11 This is a cross-sectional view (cut lines Bc1-Bc2) illustrating the substrate holder with the fixing component installed according to the first embodiment of the present invention.

[0029] Figure 12 This is a diagram illustrating the substrate holder with the passive circuit board removed, according to the second embodiment of the present invention.

[0030] Figure 13 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the second embodiment of the present invention.

[0031] Figure 14 This is a diagram illustrating the substrate holder with the passive circuit board removed according to the third embodiment of the present invention.

[0032] Figure 15 This is a diagram illustrating the state in which a passive circuit board is arranged in a substrate holder according to the third embodiment of the present invention.

[0033] Figure 16 This is a cross-sectional view (cut-off lines Cc1-Cc2) illustrating the state in which a passive circuit board is arranged in a substrate holder according to the third embodiment of the present invention.

[0034] Figure 17 This means that in Figure 16 The diagram shows a cross-section of the passive circuit board mounted on the board holder with the cover closed.

[0035] Figure 18 This is a diagram illustrating the fourth embodiment of the present invention, showing a substrate holder with the passive circuit board removed.

[0036] Figure 19 This is a cross-sectional view (cut-off lines Dc1-Dc2) illustrating the substrate holder according to the fourth embodiment of the present invention.

[0037] Figure 20 This is a diagram illustrating the passive circuit board according to the fourth embodiment of the present invention.

[0038] Figure 21 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the fourth embodiment of the present invention.

[0039] Figure 22 This is a diagram illustrating the passive circuit board according to the fifth embodiment of the present invention.

[0040] Figure 23 This is a cross-section illustrating the substrate holder according to the fifth embodiment of the present invention (and...). Figure 19 (Corresponding) diagram.

[0041] Figure 24 This is a diagram illustrating the internal structure (when a key is released) of the keyboard device according to the sixth embodiment of the present invention.

[0042] Figure 25 This is a diagram illustrating the internal structure of the keyboard device according to the sixth embodiment of the present invention (when the white key is pressed).

[0043] Figure 26 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the sixth embodiment of the present invention.

[0044] Figure 27 This is a diagram illustrating the internal structure (when releasing a key) of the keyboard device according to the seventh embodiment of the present invention.

[0045] Figure 28 This is a diagram illustrating the internal structure of the keyboard device according to the seventh embodiment of the present invention (when the white key is pressed).

[0046] Figure 29 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the seventh embodiment of the present invention.

[0047] Figure 30This is a diagram illustrating the inner side of a substrate holder with a passive circuit board mounted according to the seventh embodiment of the present invention (view of the substrate holder from below).

[0048] Figure 31 This is a cross-sectional view (cut-off lines Ec1-Ec2) illustrating the substrate holder according to the seventh embodiment of the present invention.

[0049] Figure 32 This is a diagram illustrating the inner side of a substrate holder with a passive circuit board mounted according to the eighth embodiment of the present invention (view of the substrate holder from below).

[0050] Figure 33 This is a cross-sectional view (cut-off lines Fc1-Fc2) illustrating the substrate holder according to the eighth embodiment of the present invention.

[0051] Figure 34 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the ninth embodiment of the present invention.

[0052] Figure 35 This is a diagram illustrating the internal structure (when releasing a key) of the keyboard device according to the 10th embodiment of the present invention.

[0053] Figure 36 This is a diagram illustrating the mounting position of the substrate holder according to the tenth embodiment of the present invention.

[0054] Figure 37 This is a diagram illustrating another example of the mounting position of the substrate holder according to the tenth embodiment of the present invention.

[0055] Figure 38 This is a diagram illustrating the internal structure (when a key is released) of the keyboard device according to the 11th embodiment of the present invention.

[0056] Figure 39 This is a diagram illustrating the mounting position of the substrate holder according to the 11th embodiment of the present invention.

[0057] Figure 40 This is a diagram illustrating an example of mounting the substrate holder of the 11th embodiment of the present invention in another manner.

[0058] Figure 41 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the 12th embodiment of the present invention.

[0059] Figure 42 This is a cross-sectional view (cut lines Gc1-Gc2) illustrating the substrate holder according to the 12th embodiment of the present invention.

[0060] Figure 43This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the 13th embodiment of the present invention.

[0061] Figure 44 This is a cross-sectional view (cut-off lines Hc1-Hc2) illustrating the substrate holder according to the 13th embodiment of the present invention. Detailed Implementation

[0062] Hereinafter, a keyboard device according to one embodiment of the present invention will be described in detail with reference to the accompanying drawings. The embodiments shown below are examples of embodiments of the present invention and should not be construed as limiting the present invention to these embodiments. Furthermore, in the drawings referred to in this embodiment, the same or similar reference numerals (A, B, etc., following numbers) are used for the same parts or parts having the same function, and repeated descriptions are sometimes omitted. Additionally, the dimensions in the drawings may differ from actual proportions for ease of explanation, or parts of the structure may be omitted from the drawings.

[0063] <First Embodiment>

[0064] In the first embodiment, a keyboard device used as an electronic keyboard musical instrument will be described. According to this keyboard device, key presses can be detected by a magnetic induction type sensor. Key presses are detected, for example, as the position of a key that moves by pressing a key or the posture of a key. The keyboard device will now be described in detail.

[0065] [1. Overview of the Keyboard Device]

[0066] Figure 1 This diagram illustrates a keyboard device according to a first embodiment of the present invention. The keyboard device 1 is an electronic keyboard instrument, specifically an electronic piano in this example. The keyboard device 1 includes keys 10, a frame 50, a speaker 60, a sound source 80, and an operation unit 90. In the following description, for ease of explanation, the side where the player is located relative to the keyboard device 1 (the side where the keys 10 are located relative to the frame 50) is defined as the front side, and the side opposite the player is defined as the rear side. Furthermore, left and right, up and down, are also defined as directions as viewed from the player's perspective.

[0067] Multiple keys 10 are arranged in one direction. Here, the direction of the scale arrangement of the multiple keys 10 is called the left-right direction D1. In the following explanation, when distinguishing between left and right, the left direction is called D1a, and the right direction is called D1b. The direction orthogonal to the left-right direction D1 is called the front-back direction D2. When the keyboard device 1 is viewed from above, the length direction of the keys 10 is the same as the front-back direction D2. In the following explanation, when distinguishing between front and back, the front direction is called D2a, and the back direction is called D2b. The direction orthogonal to both the left-right direction D1 and the front-back direction D2 is called the up-down direction D3 (see reference). Figure 2 The up-down direction D3 roughly corresponds to the vertical direction when the keyboard device 1 is laid flat. That is, when the keyboard device 1 is laid flat horizontally, the left-right direction D1 and the front-back direction D2 are directions in the horizontal plane. In the following description, when distinguishing between up and down, the up direction will be referred to as D3a and the down direction as D3b.

[0068] Key 10 is rotatable relative to the frame 50. The rotation range of key 10 includes the alignment of its length direction and its front-to-back direction D2. The frame 50 is equipped with a speaker 60, a key press measurement unit 70, a sound source unit 80, and an operation unit 90. When the player (operator) operates key 10, sound is emitted from the speaker 60 via the sound output function of the keyboard device 1. The operation unit 90 includes operation buttons, touch sensors, and sliders, receives instructions to change the type (timbre) and volume of the emitted sound, and outputs a signal corresponding to the input operation to the sound source unit 80. Furthermore, the keyboard device 1 may also include an interface for inputting and outputting signals to external devices. Such interfaces include, for example, terminals for outputting audio signals to external devices, and cable connection terminals for transmitting and receiving MIDI data.

[0069] The key press measurement unit 70 includes a magnetic induction sensor configured for each of the plurality of keys 10. Each sensor corresponding to each key 10 detects the position (press amount) within the rotation range of the key 10. The key press measurement unit 70 outputs key information determined for any one of the plurality of keys 10 and press amount information corresponding to the determined press amount of the key 10 to the sound source unit 80. The press amount information can be the value of the press amount of the key 10 itself, or a value that can be calculated based on the press amount, such as speed calculated based on the change in press amount, or a combination of these. This combination of the key press measurement unit 70 and the keys 10 is an example of an input device. The detailed structure of the key press measurement unit 70 will be described later.

[0070] The sound source unit 80 is a signal processing circuit that generates sound signals in response to the playing operation of the keys 10. Specifically, the sound source unit 80 generates sound signals based on information output from the key press measurement unit 70 and outputs the generated sound signals to the speaker 60. The speaker 60 amplifies the sound signals output from the sound source unit 80 and outputs them, thereby emitting a sound corresponding to the sound signals.

[0071] [2. Internal structure of keyboard device 1]

[0072] Next, the internal structure of the keyboard device 1 will be described. Here, a cross-section is used to schematically represent the keyboard device 1 cut through by a surface with the left-right direction D1 as its normal (including the front-back direction D2 and the up-down direction D3). Figure 2 and Figure 3 Please provide an explanation.

[0073] Figure 2 This is a diagram illustrating the internal structure (when releasing a key) of the keyboard device according to the first embodiment of the present invention. Figure 3 This diagram illustrates the internal structure of the keyboard device according to the first embodiment of the present invention (when the white key is pressed). The structure corresponding to the white key 10w in the key 10 is shown. The structure corresponding to the black key 10b is the same as the structure corresponding to the white key 10w, so only the position of the black key 10b is shown, and other structures are omitted.

[0074] The frame 20 is fixed to the frame 50 and supports a plurality of keys 10 arranged in the left-right direction D1. In this example, the frame 20 is formed of resin material. The frame 20 includes a key guide portion 201, a key support portion 203, a rib portion 205, and a substrate holding portion 207.

[0075] The key guide 201 is located below the front end of the key 10 and restricts the left-right movement D1 of the key 10 by means of a component that slides with the key 10. The key support 203 supports the elastic portion 105 disposed at the rear end of the key 10. The elastic portion 105 deforms in the vertical direction, thereby allowing the free end of the key 10 to rotate about the key support 203. At this time, the left-right movement D1 of the key 10 is restricted by the key guide 201, and therefore it rotates about the left-right direction D1 as an axis. The rib 205 is a plate-shaped component having a surface including the front-back direction D2 and the vertical direction D3 (a surface with a normal in the left-right direction D1). A plurality of ribs 205 are arranged along the left-right direction D1. Each of the plurality of ribs 205 is connected to the key guide 201, the key support 203, and the substrate holding portion 207, respectively.

[0076] The substrate holding portion 207 is a plate-shaped member that holds the active circuit board 700. In this example, the active circuit board 700 is disposed on the upper surface side (key 10 side) of the substrate holding portion 207. A substrate holder 170 is fixed on the lower surface side (substrate holding portion 207 side) of the key 10. The substrate holder 170 (holding portion) holds the passive circuit board 750 in the manner described below.

[0077] The active circuit board 700 and the passive circuit board 750, as described later, are elements constituting a magnetic induction type sensor and are structural elements included in the key press measurement unit 70. The passive circuit board 750 is provided corresponding to each key 10. In this example, the active circuit board 700 is provided corresponding to multiple keys 10, but it may also be provided corresponding to each key 10.

[0078] The load section 30 (first component) is configured correspondingly to each key 10. The load section 30 and the key 10 are linked together by being engaged and connected to each other through the key connection section 301 (sliding section 307) of the load section 30. The load section 30 includes the key connection section 301, the bearing 303, and the hammer section 305. The bearing 303 is provided corresponding to the shaft provided on the frame 20. The key connection section 301 is disposed on the opposite side of the hammer section 305 relative to the bearing 303. The sliding section 307 provided at one end of the key connection section 301 slides relative to the load connection section 103 provided below the key 10. The load section 30 has a center of gravity located on the side of the hammer section 305 closer to the bearing 303 than the bearing 303. Therefore, when the key 10 is not pressed, the hammer section 305 is placed on the lower stop 351, holding the key 10 in a rest position (equivalent to when the key is released). The lower stop 351 and the upper stop 353 are supported on the frame 20.

[0079] If in Figure 2 If key 10 is pressed in the current state, then as follows: Figure 3 As shown, the load part 30 rotates around the bearing 303 in conjunction with the rotation of the key 10, causing the hammer part 305 to move upward and collide with the upper stop 353, thus limiting further movement. At this time, as... Figure 3 As shown, the active circuit board 700 and the passive circuit board 750 are close together. The key press amount information output by the key press amount measurement unit 70 is information corresponding to the distance between the active circuit board 700 and the passive circuit board 750 (i.e., the relative positional relationship between the active circuit board 700 and the passive circuit board 750). Furthermore, the load unit 30 may not be provided in the keyboard device 1. In this case, it is sufficient to provide a structure that limits the press range of the key 10.

[0080] [3. Structure of the button measurement unit 70]

[0081] The key press measurement unit 70, as described above, includes an active circuit board 700 and a passive circuit board 750. The active circuit board 700 includes a coil (hereinafter referred to as an active coil) for generating a magnetic field by supplied power. If the passive circuit board 750, which includes the coil (hereinafter referred to as a passive coil), moves in this magnetic field, the active circuit 770 (…) is magnetically coupled to the position of the passive coil. Figure 4 (Referring to) anti-resonance, that is, changes in the circuit characteristics of the active circuit 770 lead to changes in the output signal obtained from the active circuit board 700. Therefore, based on the signal obtained from the active circuit board 700, the distance between the active circuit board 700 and the passive circuit board 750 can be measured. As described above, the button quantity measuring unit 70 includes a distance sensor. Hereinafter, the structure of the button quantity measuring unit 70 will be described in detail.

[0082] [3-1. Structure of the active circuit board 700]

[0083] Figure 4 This diagram illustrates an active circuit board according to a first embodiment of the present invention. The active circuit board 700 is a printed circuit board comprising multiple active circuits 770, a multiplexer 709, and various wirings (including clock signal lines, select signal lines, input signal lines, output signal lines, etc., in addition to the ground wiring 708). Furthermore, the active circuit board 700 includes signal processing circuitry (not shown). Each of the multiple active circuits 770 is provided corresponding to each key 10. The two wirings connecting the active circuits 770 and the multiplexer 709 correspond to the signal input section 703a and the signal output section 703b.

[0084] The active circuit 770 includes an active coil 701 (conductor), capacitors 706a and 706b, and resistors 707a and 707b. The active coil 701 is formed on a substrate and includes wiring 701a formed on the upper surface side (bond 10 side) of the substrate and wiring 701b provided on the lower surface side (substrate holding portion 207 side) of the substrate. Figure 4 The structure arranged on the lower surface of the substrate is shown in dashed lines. An active coil 701 with two coils (first coil 701x and second coil 701y) connected in series is formed by interconnected wiring 701a and wiring 701b.

[0085] The first coil 701x and the second coil 701y are arranged along the front-to-back direction D2, with their winding directions being opposite to each other. Here, "opposite winding directions" does not mean that the wiring is wound in opposite directions in terms of construction, but rather that the wiring is wound such that the current flows in opposite directions when the circuit is energized. This is also true in other embodiments and variations described below. Therefore, the magnetic flux generated by the active coil 701 is formed such that it immediately passes through the second coil 701y after exiting the first coil 701x.

[0086] Capacitors 706a and 706b are connected in series between the two ends of the active coil 701. A grounding wire 708 is connected between capacitors 706a and 706b. The grounding wire 708 is provided in a common manner for each active circuit 770. A resistor 707a is connected between capacitor 706a and signal input section 703a, and a resistor 707b is connected between capacitor 706b and signal output section 703b.

[0087] If an AC signal is input to the signal input unit 703a via the multiplexer 709, the active coil 701 generates a magnetic field corresponding to the input signal. The active coil 701 and the passive coil 751 are magnetically coupled, thereby modulating the signal output from the signal output unit 703b. The modulated signal is output via the multiplexer 709 to a signal processing circuit (not shown) and converted into key press information. The signal processing circuit outputs key information and key press information of key 10 corresponding to the signal obtained by the multiplexer 709.

[0088] [3-2. Structure of the passive circuit board 750]

[0089] Figure 5 This is a diagram illustrating the passive circuit board according to the first embodiment of the present invention. Figure 5 The surface 750a of the passive circuit board 750 shown is on Figure 2The surface 750b faces downwards (D3b), while the surface 750b faces upwards (D3a). The passive circuit board 750 is a printed circuit board containing a passive coil 751 (conductor) and a capacitor 756. The passive coil 751 is formed on the board and, similar to the active coil 701, includes two coils 751x and 751y with opposite winding directions. The coils 751x and 751y are connected via holes 751xt1, 751xt2, 751yt1, and 751yt2 that pass through surfaces 750a and 750b. The term "opposite winding direction" does not mean that the wiring is wound in opposite directions in construction, but rather that the wiring is wound so that the current flows in opposite directions when an induced current occurs in the circuit. This is also true in other embodiments and variations described below. Furthermore, a capacitor 756 is connected in series between the two ends of the passive coil 751 (between coil 751x and coil 751y). In this example, the surface of the passive circuit board 750 (the surface where the passive coil 751 is formed) is approximately parallel to the upper surface (operating surface) of the key 10. Additionally, the capacitor 756 is disposed on surface 750a. Unless otherwise specified, the passive circuit board structure described below is common to the passive circuit board 750 described above.

[0090] [4. Structure of substrate holder 170]

[0091] Next, use Figures 6 to 11 The structure of the substrate holder 170, which is fixed to the key 10 and holds the passive circuit board 750, will be described.

[0092] Figure 6 This is a diagram illustrating the substrate holder with the passive circuit board removed according to the first embodiment of the present invention. Figure 7 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the first embodiment of the present invention. Figure 8 This is a view from below of the substrate holder with the fixing components removed according to the first embodiment of the present invention. Figure 9 This is a cross-sectional view (cut lines Ac1-Ac2) illustrating the substrate holder according to the first embodiment of the present invention. Figure 10 This is a cross-sectional view (cut-off lines Bc1-Bc2) illustrating the substrate holder according to the first embodiment of the present invention. Figure 11 This is a cross-sectional view (cut-off lines Bc1-Bc2) illustrating the substrate holder with the mounting fixing member according to the first embodiment of the present invention. A key 10 is disposed on the substrate holder 170 in the upper direction D3a shown in each figure. In other words, the substrate holder 170 is connected to the surface of the key 10 in the lower direction D3b.

[0093] The key 10 and the substrate holder 170 are secured by a fixing member 190. The fixing member 190 is made of metal. The fixing member 190 is not limited to metal and may also be made of other materials such as resin. This is also true in other embodiments and variations described below.

[0094] In this example, the substrate holder 170 is formed of resin and manufactured by injection molding. The substrate holder 170 has a generally cuboid shape with a partial opening. The partial opening is due to the limitations of injection molding manufacturing and also to achieve the function of the structure described below. Furthermore, the manufacturing method of the substrate holder 170 is not limited to injection molding; it can also be manufactured by other methods such as cutting. This is also the case in other embodiments and variations below.

[0095] A plate-shaped bottom portion 179 is disposed on the upper direction D3a (key 10 side) of the substrate holder 170. A groove 1795c is disposed in the central portion of the bottom portion 179. The groove 1795c is a portion of the bottom portion 179 that thins along the front-rear direction D2. Through holes 1795a and 1795b, which penetrate the bottom portion 179, are disposed at both ends of the groove 1795c in the front-rear direction D2. Figure 6 , Figure 11 As shown, the fixing member 190 includes a plate-shaped member 190c having a longitudinal length, and key embedding portions 190a and 190b that are bent in the same direction and substantially perpendicularly at both ends of the plate-shaped member 190c in the longitudinal length direction. The plate-shaped member 190c is disposed along the groove 1795c, and the key embedding portions 190a and 190b are embedded into the key 10 through through holes 1795a and 1795b, respectively, and fixed to the key 10. The thinned portion of the groove 1795c in the bottom part 179 is clamped by the plate-shaped member 190c and the key 10, thereby fixing the key 10 and the substrate holder 170. By fixing the positional relationship between the key 10 and the substrate holder 170, the substrate holder 170 can move integrally with the key 10.

[0096] A raised portion 177a is disposed on the left side (D1a) of the bottom surface 179 via an elastic portion 1775a. The elastic portion 1775a functions as an elastic body by being cantilevered by the bottom surface 179. The raised portion 177a protrudes downward (D3b) relative to the bottom surface 179. The raised portion 177a can move in the vertical direction (D3) by elastic deformation via the elastic portion 1775a. A raised portion 177b is disposed on the right side (D1b) of the bottom surface 179 via an elastic portion 1775b. The elastic portion 1775b functions as an elastic body by being cantilevered by the bottom surface 179. The raised portion 177b protrudes downward (D3b) relative to the bottom surface 179. The raised portion 177b can move in the vertical direction (D3) by elastic deformation via the elastic portion 1775b. In this example, the raised portion 177a and the raised portion 177b are arranged with the groove portion 1795c separated by a space.

[0097] A side portion 171a extending downward in the direction D3b is disposed at the left end of the bottom portion 179 in the direction D1a. A side portion 171b extending downward in the direction D3b is disposed at the right end of the bottom portion 179 in the direction D1b. A side portion 178 extending downward in the direction D3b is disposed at the rear end of the bottom portion 179 in the direction D2b. The side portions 171a, 171b, and 178 are plate-shaped members including portions that are substantially perpendicular to the bottom portion 179.

[0098] At the lower end (D3b) and both ends (front-rear direction) of the side portion 171a, cover portions 172a and 173a extending in the rightward direction (D1b) are respectively provided. Cover portions 172a and 173a are plate-shaped members substantially parallel to the bottom portion 179. A linear protrusion 1725a is provided on the surface of cover portion 172a facing upward (D3a) (the surface inside the substrate holder 170). The linear protrusion 1725a is arranged along the front-rear direction (D2). A linear protrusion 1735a is provided on the surface of cover portion 173a facing upward (D3a) (the surface inside the substrate holder 170). The linear protrusion 1735a is arranged along the front-rear direction (D2).

[0099] At the lower end (D3b) and both ends (front-rear direction) of the side portion 171b, cover portions 172b and 173b extending to the left (D1a) are respectively provided. Cover portions 172b and 173b are plate-shaped members substantially parallel to the bottom portion 179. A linear protrusion 1725b is provided on the surface of cover portion 172b facing upwards (D3a) (the surface inside the substrate holder 170). The linear protrusion 1725b is arranged along the front-rear direction (D2). A linear protrusion 1735b is provided on the surface of cover portion 173b facing upwards (D3a) (the surface inside the substrate holder 170). The linear protrusion 1735b is arranged along the front-rear direction (D2).

[0100] At the frontal D2a end of the bottom portion 179, a raised portion 175 is provided via an elastic portion 1755. The elastic portion 1755 functions as an elastic body by being cantilevered by the bottom portion 179. The raised portion 175 protrudes downward D3b relative to the bottom portion 179, and its length in the front-rear direction D2 becomes shorter the further it protrudes downward D3b. The raised portion 175 includes a portion that is substantially perpendicular to the bottom portion 179 on the rearward D2b side surface (the surface inside the substrate holder 170). If a force F is applied to the raised portion 175 in the upward D3a, the elastic portion 1755 elastically deforms and the raised portion 175 moves in the upward D3a. An opening 170a is formed in the frontal D2a of the substrate holder 170. The opening 170a is ensured to be sized such that the passive circuit board 750 can be inserted into the interior of the substrate holder 170 by moving the raised portion 175 in the upward D3a.

[0101] If the passive circuit board 750 is inserted into the board holder 170 through the opening 170a, the raised portions 177a and 177b of the passive circuit board 750 move upward in the direction D3a, and finally, the passive circuit board 750 contacts the side portion 178. If this state is achieved, the raised portion 175 returns to its original position. During this process, the capacitor 756 disposed on the passive circuit board 750 passes between the cover portion 172a and the cover portion 172b. Therefore, even the shape of the capacitor 756 protruding from the surface 750a will not become an obstacle during the insertion of the passive circuit board 750. Furthermore, the raised portion 175 can also contact the end face or edge of the passive circuit board 750 without completely returning to its original position. That is, the passive circuit board 750 can make the elastic part 1755 continue to be subjected to the upward force F of D3a, but at least until the position of the raised part 175 is restored to the point that the passive circuit board 750 cannot pass through the opening 170a.

[0102] When the passive circuit board 750 is housed in the board holder 170, its position in the left-right direction (D1) is determined by the side portions 171a and 171b of the board holder 170, and its position in the front-back direction (D2) is determined by the side portion 178 and the raised portion 175. After the passive circuit board 750 moves, the raised portions 177a and 177b attempt to return to their original positions due to the restoring forces of the elastic portions 1775a and 1775b. Therefore, the raised portions 177a and 177b apply a downward force (D3b) to the passive circuit board 750, pushing the passive circuit board 750 against the linear protrusions 1725a, 1725b, 1735a, and 1735b. As a result, the vertical position (D3) of the passive circuit board 750 is determined. As described above, the passive circuit board 750 is held in the board holder 170.

[0103] Furthermore, even if the position of the passive circuit board 750 is within a certain allowable range in the left-right direction D1 and the front-back direction D2, the passive circuit board 750 is clamped in the substrate holder 170 from the vertical direction D3. Therefore, the passive circuit board 750 will not move substantially while held inside the substrate holder 170.

[0104] On the other hand, with the passive circuit board 750 held in the board holder 170, a force F is applied to cause the elastic portion 1755 to elastically deform, causing the raised portion 175 to move upward in the direction D3a, thereby widening the opening 170a. This releases the board holder 170 from holding the passive circuit board 750. As described above, in a state where the elastic portion 1755 is further elastically deformed compared to the state when the passive circuit board 750 is held in the board holder 170 (first state) (second state), the holding of the passive circuit board 750 is released. In this state, the passive circuit board 750 can be removed from the board holder 170 by sliding it towards the opening 170a.

[0105] As described above, the keyboard device 1 according to the first embodiment of the present invention can measure the amount of key 10 pressed using a magnetic induction sensor in the key press measurement unit 70. A passive circuit board 750 needs to be provided for each key 10. In this example, the board holder 170 fixed to the key 10 can hold or release the passive circuit board 750 by elastically deforming the elastic portion 1755; that is, the passive circuit board 750 is held in a detachable manner. Therefore, it is easy to install or remove the passive circuit board 750 relative to the board holder 170, resulting in simplified manufacturing processes for the keyboard device 1 and improved maintenance performance.

[0106] <Second Implementation>

[0107] In the first embodiment, the key 10 and the substrate holder 170 are separate structures, and their relative positions are fixed by the fixing member 190. In the second embodiment, using Figure 12 , Figure 13 The substrate holder 170A, which is integrally formed with the key 10, will be described. In this example, the key 10 and the substrate holder 170A are integrally formed by injection molding and are made of the same material.

[0108] Figure 12 This is a diagram illustrating the substrate holder with the passive circuit board removed, according to the second embodiment of the present invention. Figure 13This diagram illustrates a substrate holder with a passive circuit board mounted according to the second embodiment of the present invention. The substrate holder 170A is continuously configured with the key 10 and includes a structure similar to that of the substrate holder 170. The side portions 171Aa, 171Ab, 178A, and the cover portions 172Aa, 172Ab have similar structures to their counterparts in the substrate holder 170, therefore their descriptions are omitted. In the substrate holder 170A, the structure of the opening 170Aa differs from that of the opening 170a in the substrate holder 170.

[0109] A raised portion 175Aa is disposed at the end of the side portion 171Aa in the forward direction D2a and the end in the upward direction D3a, via an elastic portion 1755Aa extending in the rightward direction D1b. The elastic portion 1755Aa functions as an elastic body, supported by the side portion 171Aa in a cantilever manner. The raised portion 175Aa protrudes upward in the direction D3a relative to the elastic portion 1755Aa. The raised portion 175Aa includes a portion that is substantially perpendicular to the bottom portion 179A at the surface on the rearward direction D2b side (the surface on the inner side of the substrate holder 170A). If a force F is applied to the raised portion 175Aa in the downward direction D3b, the elastic portion 1755Aa elastically deforms and the raised portion 175Aa moves in the downward direction D3b.

[0110] At the end of the side portion 171Ab in the forward direction D2a and the end in the upward direction D3a, a raised portion 175Ab is provided via an elastic portion 1755Ab extending in the leftward direction D1a. The elastic portion 1755Ab functions as an elastic body, supported by the side portion 171Ab in a cantilever manner. The raised portion 175Ab protrudes upward in the direction D3a relative to the elastic portion 1755Ab. The raised portion 175Ab includes a portion that is substantially perpendicular to the bottom portion 179A at the surface on the rearward direction D2b side (the surface on the inner side of the substrate holder 170A). If a force F is applied to the raised portion 175Ab in the downward direction D3b, the elastic portion 1755Ab elastically deforms and the raised portion 175Ab moves in the downward direction D3b.

[0111] An opening 170Aa is formed in the forward direction D2a of the substrate holder 170A. The opening 170Aa is sized such that the passive circuit board 750 can be inserted into the substrate holder 170A by moving the raised portions 175Aa and 175Ab in the downward direction D3b. When the passive circuit board 750 is inserted into the substrate holder 170A through the opening 170Aa, the passive circuit board 750 contacts the side portion 178A. If this state is achieved, the raised portions 175Aa and 175Ab return to their original positions. During this process, the capacitor 756 disposed on the passive circuit board 750 passes between the raised portions 175Aa and 175Ab. Furthermore, the raised portions 175Aa and 175Ab may also contact the end face or edge of the passive circuit board 750 without completely returning to their original positions. That is, the passive circuit board 750 can make the elastic portions 1755Aa and 1755Ab continue to be subjected to the upward force F of D3a, but at least until the position of the raised portions 175Aa and 175Ab is restored to the point that the passive circuit board 750 cannot pass through the opening 170Aa.

[0112] When the passive circuit board 750 is housed in the board holder 170A, its position in the left-right direction (D1) is determined by the side portions 171Aa and 171Ab of the board holder 170A; its position in the front-back direction (D2) is determined by the side portion 178A and the raised portions 175Aa and 175Ab; and its position in the vertical direction (D3) is determined by the bottom portion 179A and the cover portions 172Aa and 172Ab. As described above, the passive circuit board 750 is held in the board holder 170A. Furthermore, similar to the first embodiment, a structure corresponding to the elastic portion 1775a and the raised portion 177a may be provided in the board holder 170A. Additionally, an upward force (D3a) may be applied to the passive circuit board 750 from the protrusions on the upward (D3a) surfaces of the cover portions 172Aa and 172Ab. In this case, if the passive circuit board 750 is held in place and the cover portions 172Aa and 172Ab are elastically deformed in the downward direction D3b, then this structure can be realized.

[0113] With the raised portions 175Aa and 175Ab moved downward in the direction D3b, the passive circuit board 750 can be removed from the board holder 170A by sliding it toward the opening 170Aa. As described above, the board holder 170A holds the passive circuit board 750 in a detachable manner.

[0114] As described above, the substrate holder 170A is integrally formed with the key 10. In particular, when the key 10 and the substrate holder 170A are integrally formed by injection molding, the fixing member 190 of the first embodiment, whose shape is limited due to manufacturing limitations, may not be present.

[0115] <Third Implementation>

[0116] In the third embodiment, using Figures 14 to 17 The substrate holder 170B, which holds the passive circuit board 750 in a removable manner by opening and closing the cover, will be described.

[0117] Figure 14 This is a diagram illustrating the substrate holder with the passive circuit board removed according to the third embodiment of the present invention. Figure 15 This is a diagram illustrating the state in which a passive circuit board is arranged in a substrate holder according to the third embodiment of the present invention. Figure 16 This is a cross-sectional view (cut-off lines Cc1-Cc2) illustrating the state in which a passive circuit board is arranged in a substrate holder according to the third embodiment of the present invention. Figure 17 This means that in Figure 16 The diagram shows a cross-sectional view of the passive circuit board mounted on the substrate holder with the cover 172B closed. In this example, the substrate holder 170B is formed of resin and manufactured by injection molding. The substrate holder 170B has a generally cuboid shape with a partial opening and a cover structure on one side that can be opened and closed.

[0118] A plate-shaped bottom portion 179B is disposed on the upper direction D3a (key 10 side) of the substrate holder 170B. The bottom portion 179B is disposed on the front direction D2a and the bottom portion 179Bb is disposed on the rear direction D2b. The bottom portion 179B has a through hole 1795B, and the bottom portion 179Bb has a through hole 1795Bb. These through holes 1795B and 1795Bb can be used to configure a fixing member for fixing the substrate holder 170B to the key 10, and for example, they can have the same function as the through holes 1795a and 1795b in the first embodiment.

[0119] A side portion 171Ba is disposed at the left end (D1a) of the bottom portion 179B. A side portion 171Bb is disposed at the right end (D1b) of the bottom portion 179B. A side portion 174B is disposed at the front end (D2a) of the bottom portion 179B. A side portion 178B is disposed at the rear end (D2b) of the bottom portion 179B. Side portions 171Ba, 171Bb, 174B, and 178B are plate-shaped members including portions substantially perpendicular to the bottom portion 179. A raised portion 175Ba is disposed on the side portion 174B. The raised portion 175Ba protrudes forward (D2a) relative to the side portion 174B. A plate-shaped cover portion 172B is disposed at the lower end (D3b) of the side portion 178B via a hinge portion 1725B. A cutout portion 172Ba is formed in the approximately central portion of the cover portion 172B. A locking part 175Bb is provided at the end of the cover 172B opposite to the hinge part 1725B.

[0120] The cover portion 172B is rotatable relative to the bottom portion 179B with the hinge portion 1725B as the central axis. That is, the positional relationship between the cover portion 172B and the bottom portion 179B can be changed. With the cover portion 172B open, the passive circuit board 750 is placed on the bottom portion 179B, and the cover portion 172B is moved in the closing direction C. At this time, a force is applied to the engaging portion 175Bb in a direction away from the cover portion 172B, thereby the engaging portion 175Bb passes through the raised portion 175Ba and moves upward toward the raised portion 175Ba toward the D3a side. As a result, the cover portion 172B is closed, thus the passive circuit board 750 is held by the two plate-shaped members, that is, by the cover portion 172B and the bottom portion 179B (first state). In this state, the passive circuit board 750 is held by the board holder 170B. At this time, the capacitor 756 of the passive circuit board 750 avoids contact with the cover portion 172B through the cutout portion 172Ba.

[0121] When the passive circuit board 750 is housed in the board holder 170B, its position in the left-right direction D1 is determined by its side portions 171Ba and 171Bb, its position in the front-back direction D2 is determined by its side portions 178B and 174B, and its position in the up-down direction D3 is determined by its bottom portion 179B and cover portion 172B. As described above, the passive circuit board 750 is held in the board holder 170B. Furthermore, similar to the first embodiment, a structure corresponding to the elastic portion 1775a and the raised portion 177a may be provided in the board holder 170B. In addition, by clamping an elastomer or non-woven fabric between the cover portion 172B and the passive circuit board 750, an upward force D3a may be applied to the passive circuit board 750 from the cover portion 172B, and the board holder 170B may hold the passive circuit board 750 more forcefully.

[0122] When the engaging portion 175Bb is subjected to force F, the cover portion 172B is opened, and with the cover portion 172B and the bottom portion 179B separated (second state), the passive circuit board 750 is released from its holding position. As described above, the board holder 170B holds the passive circuit board 750 in a detachable manner.

[0123] <Fourth Implementation>

[0124] In the fourth embodiment, using Figures 18 to 21 The substrate holder 170C, which holds the passive circuit board 750 in a removable manner by means of a snap fit, will be described.

[0125] Figure 18 This is a diagram illustrating the fourth embodiment of the present invention, showing a substrate holder with the passive circuit board removed. Figure 19 This is a cross-sectional view (cut-off lines Dc1-Dc2) illustrating the substrate holder according to the fourth embodiment of the present invention. Figure 20 This is a diagram illustrating the passive circuit board according to the fourth embodiment of the present invention. Figure 21 This diagram illustrates a substrate holder with a passive circuit board mounted according to the fourth embodiment of the present invention. In this example, the substrate holder 170C is formed of resin and manufactured by injection molding.

[0126] A plate-shaped bottom portion 179C is disposed on the upper direction D3a (key 10 side) of the substrate holder 170C. A bottom portion 179Ca is disposed on the front direction D2a of the bottom portion 179C, and a bottom portion 179Cb is disposed on the rear direction D2b. The bottom portion 179Ca has a through hole 1795Ca, and the bottom portion 179Cb has a through hole 1795Cb. These through holes 1795Ca and 1795Cb can be used to configure a fixing member for fixing the substrate holder 170C to the key 10, and for example, they can have the same function as the through holes 1795a and 1795b in the first embodiment. A raised portion 177C is disposed approximately at the center of the bottom portion 179C via an elastic portion 1775C. The elastic portion 1775C functions as an elastic body, supported by the bottom portion 179C in a cantilever manner. The raised portion 177C protrudes downward in the direction D3b relative to the bottom portion 179C. The bottom portion 179C has thinned grooves 179Cc and 179Cd at its rearward end in the direction D3b.

[0127] At the front end of the bottom portion 179C in the forward direction D2a, a side portion 174Ca, an elastic portion 1755C, and a side portion 174Cb extending in the downward direction D3b are arranged sequentially along the left-right direction D1. The side portions 174Ca, 174Cb, and the elastic portion 1755C are plate-shaped members including portions substantially perpendicular to the bottom portion 179C. A raised portion 175C is provided at the lower end of the elastic portion 1755C in the downward direction D3b. The elastic portion 1755C functions as an elastic body, supported by the bottom portion 179C in a cantilever manner. The raised portion 175C protrudes rearward in the direction D2b relative to the elastic portion 1755C. The surface of the raised portion 175C on the upper direction D1a side includes a portion substantially parallel to the bottom portion 179.

[0128] A side portion 178C extending downward in the direction D3b is disposed at the rearward end of the bottom portion 179C. The side portion 178C has a guide portion 178Ca protruding forward in the direction D2a. The guide portion 178Ca is a plate-shaped member extending in the vertical direction D3 and the front-back direction D2. A cover portion 173C extending forward in the direction D2a is disposed at the downward end of the side portion 178C in the direction D3b. The cover portion 173C is a plate-shaped member substantially parallel to the bottom portion 179C.

[0129] like Figure 20 As shown, the passive circuit board 750C has a notch 7508C. The notch 7508C and the guide portion 178Ca have corresponding shapes. When the passive circuit board 750C is mounted on the board holder 170C, firstly, as shown... Figure 19As shown, the passive circuit board 750C is placed in the substrate holder 170C by inserting the guide portion 178Ca into the cut portion 7508C. Then, if a force F is applied to the raised portion 175C in the forward direction D2a, the elastic portion 1755C elastically deforms and the raised portion 175C moves in the forward direction D2a. Furthermore, the passive circuit board 750C is pressed towards the bottom portion 179C by the force Fc, thereby embedding the passive circuit board 750C into the substrate holder 170C.

[0130] The passive circuit board 750C's position in the left-right direction D1 is determined by the engagement of the guide portion 178Ca and the cutout portion 7508C of the board holder 170C (specifically, the contact between the guide portion 178Ca and the cutout portion 7508C in the left-right direction D1), and its position in the front-back direction D2 is determined by the guide portion 178Ca (or the side portion 178C) and the side portions 174Ca and 174Cb. The raised portion 177C, which has moved to the upward direction D3a side due to the passive circuit board 750C, is said to return to its original position due to the restoring force of each elastic portion 1775C. Therefore, the raised portion 177C applies a downward direction D3b force to the passive circuit board 750C, pushing the passive circuit board 750C against the cover portion 173C and the raised portion 177C. Thus, the vertical direction D3 position of the passive circuit board 750C is determined. As described above, the passive circuit board 750C is held in the board holder 170C.

[0131] On the other hand, with the passive circuit board 750C held in the board holder 170C, a force F is applied to cause the elastic portion 1755C to elastically deform, causing the raised portion 175C to move forward in the direction D2a, thereby releasing the holding of the passive circuit board 750C by the board holder 170C. As described above, with the elastic portion 1755C further elastically deformed compared to the state when the passive circuit board 750C is held in the board holder 170C, the holding of the passive circuit board 750C is released.

[0132] <Fifth Implementation>

[0133] In the fifth embodiment, using Figure 22 , Figure 23 This describes a passive circuit board 750D with two cutouts 7505D and 7508D, and a board holder 170D that holds it.

[0134] Figure 22 This diagram illustrates a passive circuit board according to the fifth embodiment of the present invention. The cutout portion 7508D of the passive circuit board 750D is the same as the cutout portion 7508C of the fourth embodiment. The cutout portion 7505D is formed at a position opposite to the cutout portion 7508D.

[0135] Figure 23 This is a cross-section illustrating the substrate holder according to the fifth embodiment of the present invention (and...). Figure 19 (See the corresponding figure). The substrate holder 170D has a structure that is basically the same as that of the substrate holder 170C, but it does not have the side portions 174Ca and 174Cb of the substrate holder 170C. In addition, a guide portion 1758D protruding from the elastic portion 1755C is disposed on the bottom portion 179C side of the raised portion 175C. The same structure is labeled with the same reference numerals as the substrate holder 170C of the fourth embodiment. The guide portion 1758D has a shape corresponding to the cut portion 7505D. When the passive circuit substrate 750D is held in the substrate holder 170D, the guide portion 1758D is embedded in the cut portion 7505D.

[0136] In this example, with the passive circuit board 750D held in the board holder 170D, the position of the passive circuit board 750D in the left-right direction D1 is determined by the engagement of the guide portion 178Ca and the cut portion 7508D (in particular, the contact between the guide portion 178Ca and the cut portion 7508D in the left-right direction D1) and the engagement of the guide portion 1758D and the cut portion 7505D (in particular, the contact between the guide portion 1758D and the cut portion 7505D in the left-right direction D1). The position in the front-back direction D2 is determined by the guide portion 178Ca (or the side portion 178C) and the guide portion 1758D (or the elastic portion 1755C). The position in the vertical direction D3 of the passive circuit board 750D is determined in the same manner as in the fourth embodiment. As described above, the passive circuit board 750D is held in the board holder 170D.

[0137] On the other hand, with the passive circuit board 750D held in the board holder 170D, a force F is applied to cause the elastic portion 1755D to elastically deform, causing the raised portion 175D to move forward in the direction D2a, thereby releasing the holding of the passive circuit board 750D by the board holder 170D. As described above, with the elastic portion 1755C further elastically deformed compared to the state when the passive circuit board 750D is held in the board holder 170D, the holding of the passive circuit board 750D is released.

[0138] <Sixth Implementation>

[0139] In the sixth embodiment, using Figures 24 to 26 The keyboard device 1E, which includes a base plate holder 170E that is not fixed to the key 10 but fixed to a component that is linked to the key 10, will be described. Here, the key connection portion 301 of the load portion 30 is shown as an example of the component that is linked to the key 10.

[0140] Figure 24This is a diagram illustrating the internal structure (when a key is released) of the keyboard device according to the sixth embodiment of the present invention. Figure 25 This diagram illustrates the internal structure of the keyboard device according to the sixth embodiment of the present invention (when the white key is pressed). In the keyboard device 1E, the substrate holder 170E is fixed to the lower surface side of the key connection portion 301. Therefore, the substrate holder 207E, on which the active circuit board 700 is disposed, is located below the key connection portion 301. Figure 24 If key 10 is pressed in the current state, then as follows: Figure 25 As shown, the load part 30 rotates in conjunction with the rotation of the key 10, thereby causing the hammer part 305 to move upward and collide with the upper stop 353, thus limiting further movement. At this time, as... Figure 25 As shown, the key connection portion 301 moves downward, and the active circuit board 700 and the passive circuit board 750D approach each other. Here, the board holder 170E is arranged near the center of rotation so that the amount of movement during rotation is small, but the board holder 170E can also be arranged at a position away from the center of rotation depending on the application.

[0141] Furthermore, regarding the angle between the passive circuit board 750D and the active circuit board 700, the difference between when the key is released and when it is pressed is greater than in the first embodiment where the passive circuit board 750D is mounted on the key 10. Even though the angle change is large, since the amount of magnetic flux passing through the passive coil 751 also changes, it is not a problem for the positional relationship between the passive coil 751 and the active coil 701 to be as in the sixth embodiment.

[0142] Figure 26 This diagram illustrates a substrate holder with a passive circuit board mounted according to the sixth embodiment of the present invention. In this example, the substrate holder 170E directly uses a structure equivalent to that of the substrate holder 170D in the fifth embodiment. Furthermore, the substrate holder 170E and the key connection portion 301 are integrally formed by injection molding and are made of the same material. Since the substrate holder 170E and the substrate holder 170D have the same structure, the passive circuit board 750D shown in the fifth embodiment can be mounted on the substrate holder 170E. The bottom portion 179E, side portion 178E, cover portion 173E, guide portion 178Ea, elastic portion 1755E, and raised portion 175E of the substrate holder 170E correspond to the bottom portion 179C, side portion 178C, cover portion 173C, guide portion 178Ca, elastic portion 1755C, and raised portion 175D of the substrate holder 170D, respectively.

[0143] <Seventh Implementation>

[0144] In the 7th embodiment, using Figures 27 to 31The keyboard device 1F, which includes a substrate holder 170F mounted on the key 10 and the load section 30, will be described.

[0145] Figure 27 This is a diagram illustrating the internal structure (when releasing a key) of the keyboard device according to the seventh embodiment of the present invention. Figure 28 This diagram illustrates the internal structure of the keyboard device according to the seventh embodiment of the present invention (when the white key is pressed). In the keyboard device 1F, a substrate holder 170F is disposed below the key connection portion 301 on the substrate holding portion 207E, covering the active circuit board 700. The substrate holder 170F is a dome-shaped structure formed of an elastomer such as rubber, and has a mechanism for holding a passive circuit board 750F in a portion thereof. Figure 27 If key 10 is pressed in the current state, then as follows: Figure 28 As shown, the load portion 30 rotates in conjunction with the rotation of the key 10, causing the hammer portion 305 to move upward and collide with the upper stop 353, thus limiting further movement. At this time, during the downward movement of the key connection portion 301, the key connection portion 301 contacts the substrate holder 170F.

[0146] The key connection portion 301 deforms the substrate holder 170F by moving further downward. By deforming the substrate holder 170F, the passive circuit board 750F held in the substrate holder 170F approaches the active circuit board 700. If the key 10 returns to its original position, it becomes... Figure 27 In the state shown, the substrate holder 170F returns to its original shape through its own restoring force, and the passive circuit board 750F moves away from the active circuit board 700. As described above, within a portion of the key range, the shape of the substrate holder 170F changes in conjunction with the movement of the key 10. Therefore, the substrate holder 170F can be referred to as a component linked to the key 10. Next, the substrate holder 170F will be described.

[0147] Figure 29 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the seventh embodiment of the present invention. Figure 30 This is a diagram illustrating the inner side of a substrate holder with a passive circuit board mounted according to the seventh embodiment of the present invention (view of the substrate holder from below). Figure 31 This is a cross-sectional view (cut-off lines Ec1-Ec2) illustrating the substrate holder according to the seventh embodiment of the present invention. The substrate holder 170F includes a base 170Fz and a portion forming a dome shape extending upward in a direction D3a from the base 170Fz. The dome-shaped portion includes a lower side portion 170Fy, an upper side portion 170Fx, and an upper surface portion 170Ft. Cover portions 172Fa and 172Fb protruding inward to the inner surface side are disposed on the upper side portion 170Fx.

[0148] The base 170Fz and the four corner portions are respectively provided with protrusions 1705Fz that protrude downward in the direction D3b. The protrusions 1705Fz are embedded in the holes TH provided in the active circuit board 700. As a result, the position of the board holder 170F (passive circuit board 750F) relative to the active circuit board 700 is determined.

[0149] The passive circuit board 750F has an outer periphery that follows the shape of the upper side portion 170Fx. Unlike the passive circuit board 750 of the above embodiment, the portion corresponding to the corner of the rectangle is formed in an arc shape. The passive circuit board 750F is held in the board holder 170F by being clamped by the upper surface portion 170Ft and the cover portions 172Fa and 172Fb. The passive circuit board 750F is a rigid structure, so even though the board holder 170F is an elastic body, it maintains its shape due to the influence of the passive circuit board 750F and does not deform substantially, even at the upper surface portion 170Ft side, which is closer to the cover portions 172Fa and 172Fb. Therefore, when the board holder 170F is deformed by the bond connection portion 301, the lower side portion 170Fy deforms and the upper surface portion 170Ft moves closer to the active circuit board 700.

[0150] When mounting or removing the passive circuit board 750F from the board holder 170F, the board holder 170F is deformed by applying a force F to expand the cover portions 172Fa and 172Fb outwards, allowing the opening 170Fa to expand to a degree that allows the passive circuit board 750F to pass through. That is, the passive circuit board 750F passes through the gap between the cover portions 172Fa and 172Fb, thereby enabling mounting or removal from the board holder 170F.

[0151] Furthermore, the substrate holder 170F is provided correspondingly to each key 10. The bases 170Fz of adjacent substrate holders 170F can also be connected.

[0152] <Eighth Implementation>

[0153] In the 8th embodiment, using Figure 32 , Figure 33 The substrate holder 170G, which is formed by placing a passive circuit board 750F into an injection molding mold when the substrate holder 170F as described in the 7th embodiment is formed by injection molding, will be described.

[0154] Figure 32 This is a diagram illustrating the inner side of a substrate holder on which a passive circuit board is mounted, according to the eighth embodiment of the present invention. Figure 33This is a cross-sectional view (cut-off lines Fc1-Fc2) illustrating the substrate holder according to the eighth embodiment of the present invention. Like the substrate holder 170F, the substrate holder 170G is an elastomer formed by injection molding. In this example, the passive circuit board 750F is placed into the elastomer during injection molding, therefore the passive circuit board 750F cannot be attached or detached from the substrate holder 170G. The upper surface portion 170Gt, upper side portion 170Gx, lower side portion 170Gy, base portion 170Gz, and protrusion 1705Gz of the substrate holder 170G correspond to the upper surface portion 170Ft, upper side portion 170Fx, lower side portion 170Fy, base portion 170Fz, and protrusion 1705Fz of the substrate holder 170F, respectively.

[0155] On the other hand, in the substrate holder 170G, the structure of the cover 172G disposed on the inner surface side of the upper side portion 170Gx is different from that of the cover 172Fa of the substrate holder 170F. A through hole 172Gp is ​​formed in the cover 172G. It is not necessary to form the through hole 172Gp, but in this example, the capacitor 756 of the passive circuit board 750F is exposed. Depending on the injection molding conditions, the resin may sometimes exert stress on the capacitor 756 due to the expansion and contraction of the material. As in this example, by forming the through hole 172Gp that exposes the capacitor 756 in the cover 172G, the effects of the aforementioned stress can be avoided. On the other hand, it is preferable to make such a through hole 172Gp as small as possible in order to retain the passive circuit board 750F. Furthermore, in order to prevent the position of the passive circuit board 750F from changing during injection molding, it is preferable to support the passive circuit board 750F from the outside by multiple pins or the like. In this case, for example, through holes with shapes corresponding to the portions where pins are disposed are provided on the upper surface portion 170Ft and the upper side portion 170Fx. However, all through holes, including the aforementioned through hole 172Gp, are preferably of a size that cannot be passed through by the passive circuit board 750F.

[0156] As described above, the substrate holder 170G and the passive circuit board 750F are integrally formed, so the substrate holder 170G cannot be configured to allow the passive circuit board 750F to be detached, but it is effective when the substrate holder 170G is replaced as a unit.

[0157] <Ninth Embodiment>

[0158] In the 9th embodiment, using Figure 34 The substrate holder 170H is described in which the substrate holder 170G of the eighth embodiment is applied instead of the substrate holder 170E of the sixth embodiment.

[0159] Figure 34This diagram illustrates a substrate holder with a passive circuit board mounted according to the ninth embodiment of the present invention. In this example, a substrate holder 170H is disposed on the lower surface side of the key connection portion 301. The substrate holder 170H and the key connection portion 301 are integrally formed by injection molding. At this time, the passive circuit board 750 is also placed in the mold and formed together with the substrate holder 170H. Similar to the substrate holder 170G of the eighth embodiment, a through hole 1705Ha is formed on the lower surface portion 170Ha of the substrate holder 170H. The capacitor 756 of the passive circuit board 750 is exposed from the substrate holder 170H through the through hole 1705Ha. In addition, through holes 1705Hb and 1705Hc are formed on the side portions 170Hb and 170Hc. The through holes 1705Hb and 1705Hc are holes formed for arranging pins that support the passive circuit board 750 during injection molding.

[0160] <10th Implementation>

[0161] Magnetic induction sensors can also be used in acoustic pianos. In the 10th embodiment, a magnetic induction sensor is used. Figures 35 to 37 The grand piano 1J using the base plate holder 170 will be described.

[0162] Figure 35 This is a diagram illustrating the internal structure (when releasing a key) of the keyboard device according to the 10th embodiment of the present invention. Figure 36 This diagram illustrates the mounting position of the substrate holder according to the tenth embodiment of the present invention. In this example, the substrate holder 170 is mounted to the hammer shank 305J of the grand piano 1J via a fixing member 190J. The fixing member 190J is shaped to surround the shaft of the hammer shank 305J. Figure 36 As shown in the hammer shank 305J, when the outer edge of its cross-section (a cross-section perpendicular to the longitudinal length direction) is not round, a fixing member 190J with an inner surface shape matching its outer edge shape is used, thereby preventing rotation about the axis. The fixing member 190J can also be glued to the hammer shank 305J. Alternatively, the fixing member 190 described in the first embodiment can be inserted into the hammer shank 305J to fix the substrate holder 170 to the hammer shank 305J.

[0163] The active circuit board 700 is disposed on the board holding portion 207J fixed to the frame 20J. Furthermore, in this example, the active circuit board 700 is disposed on the lower surface side of the board holding portion 207J, but if the board holding portion 207J is a resin structure, it can also be disposed on the upper surface side. Additionally, the board holder 170 can also be mounted at other locations on the hammer shank 305J.

[0164] Figure 37This is a diagram illustrating another example of the mounting position of the substrate holder according to the tenth embodiment of the present invention. Figure 37 In the example shown, a substrate holder 170 is mounted on the opposite side of the portion of the hammer shank 305J where the hammer roller 309J is installed. This side is a planar portion of the hammer shank 305J with a relatively wide range. Therefore, the substrate holder 170 is easy to configure.

[0165] Furthermore, the substrate holder 170 can be mounted on the push rod 307J or the key 10J, except for the hammer shank 305J. When the substrate holder 170 is mounted on the push rod 307J, the active circuit board 700 can also be arranged on the frame 20J. In this case, the active circuit board 700 is arranged upright with its surface normal facing the push rod 307J. Alternatively, when the substrate holder 170 is mounted on the key 10J, the active circuit board 700 can also be arranged on the shelf 50J.

[0166] <11th Implementation>

[0167] In the 11th embodiment, using Figures 38 to 40 An explanation will be given for the upright piano 1K which uses the base plate holder 170.

[0168] Figure 38 This is a diagram illustrating the internal structure (when a key is released) of the keyboard device according to the 11th embodiment of the present invention. Figure 39 This diagram illustrates the mounting position of the base plate holder according to the 11th embodiment of the present invention. In this example, the base plate holder 170 is mounted to the hammer shank 305K of the upright piano 1K via a fixing member 190K. The fixing member 190K is shaped to surround the axis of the hammer shank 305K. The hammer shank 305K is cylindrical. Therefore, a portion of the butt portion 311K supporting the hammer shank 305K is brought into contact with the base plate holder 170 in region CA so that the base plate holder 170 does not rotate with the hammer shank 305K as its central axis. The fixing member 190K may also be bonded to the hammer shank 305K. Alternatively, the fixing member 190K described in the first embodiment may be inserted into the butt portion 311K in region CA for fixation.

[0169] The active circuit board 700 is disposed in the board holder 207K, which is fixed in a frame (not shown). Alternatively, the board holder 170 may be mounted to the hammer shank 305K in other ways.

[0170] Figure 40This figure illustrates an example of mounting the substrate holder of the 11th embodiment of the present invention in another manner. In this example, the substrate holder 170 is fixed to the hammer shank 305K by inserting the fixing member 190 described in the first embodiment into the hammer shank 305K. At this time, an auxiliary member 195M for filling the space between the substrate holder 170 and the hammer shank 305K may also be provided.

[0171] <12th Embodiment>

[0172] In the 12th embodiment, using Figure 41 and Figure 42 This section describes a substrate holder 170N that holds a passive circuit board 750N using other structures, in relation to a substrate holder 170E integrally formed with the key connection portion 301 as in the sixth embodiment.

[0173] Figure 41 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the 12th embodiment of the present invention. Figure 42 This is a cross-sectional view (cut lines Gc1-Gc2) illustrating the substrate holder according to the 12th embodiment of the present invention. Figure 41 This is a view of the substrate holder 170N from below. The substrate holder 170N is positioned below the key connection portion 301.

[0174] The bottom portion 179N, side portion 178N, cover portion 173N, and guide portion 178Na of the substrate holder 170N are... Figure 26 The bottom portion 179E, side portion 178E, cover portion 173E, and guide portion 178Ea of the substrate holder 170E shown correspond to each other. The cutout portion 7508N of the passive circuit board 750N mounted on the substrate holder 170N corresponds to... Figure 22 The cutout portion 7508D corresponds to the passive circuit board 750D shown.

[0175] On the other hand, the substrate holder 170E has an elastic portion 1755E and a raised portion 175E, while the substrate holder 170N has an external thread 175N and an internal thread 1795N. The internal thread 1795N is formed on the bottom portion 179N. The passive circuit board 750D has a cutout portion 7505D, while the passive circuit board 750N has an opening portion 7505N. When the external thread 175N is fastened to the internal thread 1795N, the external thread 175N passes through the opening portion 7505N, and the head of the external thread 175N contacts the surface 750Na of the passive circuit board 750N.

[0176] In this state, the passive circuit board 750N is held by the head and bottom portion 179N of the external thread 175N, which determines its position in the vertical direction D3. Its position in the front-back direction D2 is determined by the side portion 178E and the shaft portion of the external thread 175N. Its position in the left-right direction D1 is determined by the engagement of the guide portion 178Na and the cutout portion 7508N (specifically, the contact between the guide portion 178Na and the cutout portion 7508N in the left-right direction D1). By removing the external thread 175N from the internal thread 1795N, the holding of the passive circuit board 750N by the board holder 170N is released.

[0177] <13th Implementation>

[0178] In the 12th embodiment, using Figure 43 and Figure 44 This section describes a substrate holder 170P that holds a passive circuit board 750P using other structures in relation to the substrate holder 170N of the 12th embodiment.

[0179] Figure 43 This is a diagram illustrating a substrate holder with a passive circuit board mounted according to the 13th embodiment of the present invention. Figure 44 This is a cross-sectional view (cut-off lines Hc1-Hc2) illustrating the substrate holder according to the 13th embodiment of the present invention. The substrate holder 170P is disposed below the key connection portion 301.

[0180] The external thread 175Pb and internal thread 1795Pb of the substrate holder 170P correspond to the external thread 175N and internal thread 1795N of the substrate holder 170N, respectively. The opening 7505Pb of the passive circuit board 750P mounted on the substrate holder 170P corresponds to the opening 7505N of the passive circuit board 750N.

[0181] The substrate holder 170N has a side portion 178N, a cover portion 173N, and a guide portion 178Na, while the substrate holder 170P has an external thread 175Pa and an internal thread 1795Pa. The passive circuit board 750N has a cutout portion 7508N, while the passive circuit board 750P has an opening portion 7505Pa. In this example, the substrate holder 170P has protrusions 1755Pa and 1755Pb that protrude downward from the bottom portion 179P. The passive circuit board 750P has openings 7555Pa and 7555Pb for inserting the protrusions 1755Pa and 1755Pb.

[0182] In this example, the opening 7505Pa is a structure in which a portion of the opening reaches the end of the passive circuit board 750P, but a portion of the opening 7505Pa is not surrounded by the passive circuit board 750P. However, the opening 7505Pa can also be formed in a position where the entire board is surrounded. When a portion of the opening 7505Pa is not surrounded by the passive circuit board 750P, it is preferable that the size of the unenclosed portion is smaller than the diameter of the shaft of the external thread 175Pa, that is, so that the shaft of the external thread 175Pa cannot pass through the opening 7505Pa from the inside to the outside.

[0183] With the external thread 175Pa fastened to the internal thread 1795Pa and the external thread 175Pb fastened to the internal thread 1795Pb, the external threads 175Pa and 175Pb respectively penetrate the openings 7505Pa and 7505Pb, and the heads of each external thread 175Pa and 175Pb contact the surface 750Pb of the passive circuit board 750P. The protrusions 1755Pa and 1755Pb also penetrate the openings 7555Pa and 7555Pb respectively. The protrusion 1755Pa may enter the interior of the opening 7555Pa, or it may not need to penetrate the opening 7555Pa. The same applies to the protrusion 1755Pb.

[0184] In this state, the passive circuit board 750P is held by the head and bottom portion 179P of the external threads 175Pa and 175Pb, respectively, which determines its position in the vertical direction D3. Its position in the horizontal direction D1 and the front-back direction D2 are determined by the protrusions 1755Pa and 1755Pb. Without the protrusions 1755Pa and 1755Pb, the passive circuit board 750P can also have its position in the horizontal direction D1 and the front-back direction D2 determined by the shaft portions of the external threads 175Pa and 175Pb. Alternatively, its position in the horizontal direction D1 and the front-back direction D2 can be determined by any two of the structures: the protrusions 1755Pa and 1755Pb, and the external threads 175Pa and 175Pb. To determine the position in the vertical direction D3, either the external threads 175Pa or 175Pb is sufficient.

[0185] By removing the external thread 175Pa from the internal thread 1795Pa and removing the external thread 175Pb from the internal thread 1795Pb, the substrate holder 170P releases the passive circuit board 750P from the internal thread 1795Pb.

[0186] In this example, a recess 1756P is further formed on the bottom surface 179P. The recess 1756P is formed at a position corresponding to the capacitor 756P of the passive circuit board 750P. Therefore, even if the passive circuit board 750P is arranged with the capacitor 756P facing the bottom surface 179P, a portion of the capacitor 756P can be accommodated in the area of ​​the recess 1756P. This prevents physical interference to the capacitor 756P from other structures.

[0187] <Variation Example>

[0188] The present invention has been described above with respect to one embodiment, but this embodiment can be modified in various ways as described below. Furthermore, the above-described embodiments and the modifications described below can be combined and applied to each other. Moreover, regarding a part of the structure of each embodiment, other structures can be added, deleted, or replaced. In the following description, unless otherwise specified, examples of modifications to the first embodiment are given, but these examples can also be applied to modifications of other embodiments.

[0189] (1) A passive coil 751 is provided on the passive circuit board 750, but a metal plate may be provided instead of the passive coil 751. Even with this structure, the output signal of the active circuit 770 can be modulated by the eddy current generated by the metal plate in the same way as the passive coil 751. That is, in the passive circuit board 750, a conductor such as a metal plate that can absorb energy through a magnetic field may be provided instead of a coil.

[0190] (2) In the first embodiment, the active coil 701 is disposed on the frame 20 side, and the passive coil 751 is held in the substrate holder 170 and disposed on the key 10 side. The passive coil 751 does not require a power supply, etc., so it is easy to design in a structure with movable parts, but it can also be implemented even with the reverse arrangement. That is, the active coil 701 can be disposed on the key 10 side, and the passive coil 751 can be disposed on the frame 20 side. In this case, a structure for providing a power supply, etc., can also be provided in the substrate holder 170.

[0191] (3) The distance between the active coil 701 and the passive coil 751 is closer when pressing the key than when releasing the key, but it can also be closer when releasing the key. This structure can be implemented by a component linked to the key 10, or the active circuit board 700 can be disposed on the upper surface side of the key 10.

[0192] (4) One set of active circuitry 770 and passive circuit board 750 is provided for each key 10, but multiple sets may be provided for each key 10. For example, it may be configured such that the movement of multiple components can be measured by a sensor that measures the amount of pressure applied to the key 10 as shown in the first embodiment and a sensor that measures the amount of movement of components linked to the key 10 as shown in the sixth embodiment. Multiple sensors may also be provided on the key 10. In this case, the range of pressure applied that can be measured by each sensor may be different. In addition, information related to sound timing and key press speed may be generated based on the sensor provided on the load section 30, and information related to muting timing may be generated based on the sensor provided on the key 10.

[0193] (5) In addition to the various methods described above, the coil shape of the active coil 701 can also be adopted in various other ways. Furthermore, the active coil 701 can also be implemented using multiple coils. The same applies to the passive coil 751. As long as a magnetic field can be formed in the active coil 701 and the passive coil 751 can induce anti-resonance in the active circuit 770 through the magnetic field, various methods can be adopted for both the active coil 701 and the passive coil 751.

[0194] (6) The active circuit board 700 is disposed on the frame 20 (board holding part 207) which is not linked with the key 10. However, as long as the positional relationship between the active circuit board 700 and the passive circuit board 750 changes when the key is placed and when the key is pressed, the active circuit board 700 can also be disposed on the component linked with the key 10.

[0195] (7) The fixing member 190 that fixes the substrate holder 170 to the key 10 or a component linked to the key 10 can be a combination of screws, bolts and nuts, double-sided tape, adhesive, nails, nail guns, or hot bonders. Various materials and methods are possible, but to reduce the influence of the magnetic field, a material with a relative permeability close to 1 or an insulating material such as resin is preferred. Alternatively, if the key 10 is made of wood or a specific elastic material such as resin, the substrate holder 170 and the key 10 can be fixed by pressing in with pins or the like. Alternatively, the passive circuit board 750 can be directly fixed to the key 10 or a component linked to the key 10 using the fixing member without using the substrate holder 170. In this case, the fixing member can also be double-sided tape, adhesive, nails, nail guns, or hot bonders. Various materials and methods are possible, but to reduce the influence of the magnetic field, a material with a relative permeability close to 1 or an insulating material such as resin is preferred.

[0196] (8) The passive circuit board 750 and the active circuit board 700 are positioned approximately opposite each other on their surfaces. When the key 10 is pressed, coils on both surfaces move closer or further apart in the approximately vertical direction D3, causing a change in their distance. The key press measurement unit 70 functions as a distance sensor by outputting a signal corresponding to this distance. On the other hand, when both surfaces are arranged approximately perpendicular to the operating surface of the key 10, the key press measurement unit 70 can also function as a distance sensor in the same manner. For example, imagine that either surface of the passive circuit board 750 or the active circuit board 700 is arranged with a normal along the horizontal direction D1. In this case, when viewed along the horizontal direction D1, the distance between the passive circuit board 750 and the active circuit board 700 changes in conjunction with the pressing of the key 10, and the area of ​​overlap between their surfaces changes. This change in area causes a change in the output signal from the active circuit board 700, thus enabling the key press measurement unit 70 to function as a distance sensor.

[0197] (9) In the above embodiments, an electronic keyboard instrument is described having a structure with a speaker 60 and a sound source 80, and a structure with a sound-producing mechanism such as strings, as in an acoustic piano such as a grand piano or an upright piano. However, it is also possible to omit the structure of the speaker 60 and the sound source 80 from the electronic keyboard instrument. In this case, the key press measurement unit 70 is used to record the keyboard playing content or output the playing signal to the outside.

[0198] As understood from the above description, the present invention is also specifically a device (performance operation device) for controlling sound production by outputting an operation signal corresponding to a performance action to the sound source 80 or the sound-producing mechanism. As illustrated in the various embodiments described above, the performance operation device includes an instrument (keyboard device 1) having a sound source 80 that outputs sound signals, and an instrument having a sound-producing mechanism that produces sound. However, in addition to the aforementioned instruments, it may also include devices that do not output sound signals (e.g., a MIDI controller) and devices that do not produce sound themselves (e.g., a pedal mechanism). In this case, the keys and pedals are specifically defined as operating elements for performance operation. As described above, the performance operation device includes a device that controls the production of sound and changes its mode of production by the performer (operator) operating the operating elements with their hands or feet, or outputs sound signals.

[0199] When applied to a pedal mechanism, the configuration is such that the passive circuit board 750 held by the board holder 170, which serves as an operating member, is opposite to the active circuit board 700 provided in the support portion that supports the pedal to be operable. As long as the distance (positional relationship) between the passive circuit board 750 and the active circuit board 700 changes due to the operation of the pedal, the operation can be detected.

[0200] Explanation of the label

[0201] 1, 1E, 1F…Keyboard assembly, 1J…Grand piano, 1K…Upright piano, 10, 10J…Keys, 10b…Black keys, 10w…White keys, 20, 20J…Frame, 30…Load-bearing section, 50…Frame body, 50J…Shelf, 60…Speaker, 70…Key measurement section, 80…Sound source section, 90…Operating section, 103…Load connection section, 105…Elastic section, 170, 170A, 170B, 170C, 170D, 170E, 170F, 170G, 170H, 170N, 170P…Substrate holder, 170a, 170Aa, 170Fa, 7505N, 7505Pa, 7505Pb, 7555Pa, 7555Pb…Opening, 17 0Ft, 170Gt… Upper surface, 170Fx, 170Gx… Upper side, 170Fy, 170Gy… Lower side, 170Fz, 170Gz… Base, 170Ha… Lower surface, 170Hb, 170Hc, 171a, 171Aa, 171Ab, 171b, 171Ba, 171Bb, 174B, 174Ca, 174Cb, 178, 178A, 178B, 178C, 178E, 178N… Side, 172a, 172Aa, 172Ab, 172b, 172B, 172Fa, 172Fb, 172G, 173a, 173b, 173C, 173E, 173N… Cover, 172 Ba, 7505D, 7508C, 7508D, 7508N…cutouts, 172Gp, 1705Ha, 1705Hb, 1705Hc, 1795a, 1795b…through holes, 175, 175Aa, 175Ab, 175Ba, 175C, 175E, 177a, 177b, 177C…raised portions, 175Bb…engulfing portions, 175N, 175Pa, 175Pb…external threads, 1755Pa, 1755Pb…protrusions, 178Ca, 178Ea, 1758D, 178Na…guide portions, 179, 179A, 179B, 179Ba, 179Bb, 179C, 179Ca, 179Cb, 179E 179N, 179P… Bottom surface, 179Cc, 179Cd, 1795c… Groove, 1795N, 1795Pa, 1795Pb… Internal thread, 190, 190J, 190K… Fixing component, 190a, 190b… Key embedding portion, 190c… Plate-shaped component, 195M… Auxiliary component, 201… Key guide, 203… Key support, 205… Rib, 207, 207E, 207J, 207K… Base plate holding portion, 301… Key connecting portion, 303… Bearing, 305… Hammer portion, 305J, 305K… Hammer handle, 307J… Top rod, 309J… Hammer roller, 311K… Connecting portion, 351… Lower stop, 353… Upper stop.700…Active circuit board, 701…Active coil, 701a…Wiring, 701b…Wiring, 701x…First coil, 701y…Second coil, 703a…Signal input section, 703b…Signal output section, 706a, 706b…Capacitors, 707a, 707b…Resistors, 708…Ground wiring, 709…Multiplexer, 750, 750C, 750D, 750F, 750N, 750P…Passive circuit board, 750a, 750b… 750Na… Surface, 751… Passive coil, 751x, 751y… Coil, 751xt1, 751xt2, 751yt1, 751yt2… Hole, 756… Capacitor, 770… Active circuit, 1725a, 1725b, 1735a, 1735b… Linear protrusion, 1725B… Hinge, 1755, 1755Aa, 1755Ab, 1755C, 1755E, 1775a, 1775b, 1775C… Elastic part,

Claims

1. A performance control device, comprising: A magnetic induction sensor includes a first substrate and a second substrate, each disposed with a conductor, for measuring the distance between the first substrate and the second substrate; Operating components that can be operated by an operator; as well as The holding part holds the first substrate between the operating member and the second substrate, and moves integrally with the operating member. At least one of the conductors disposed on the first substrate and the second substrate respectively includes a coil. The retaining portion supports the first substrate toward the operating member. The first substrate has a recess or opening that appears when viewed from a direction orthogonal to the surface on which the conductor is disposed. A portion of the retaining part is disposed in the recess or the opening.

2. A performance control device, comprising: A magnetic induction sensor includes a first substrate and a second substrate, each disposed with a conductor, for measuring the distance between the first substrate and the second substrate; Operating components that can be operated by an operator; The first component is linked to the operating element; as well as A holding part that holds the first substrate between the first component and the second substrate, and moves integrally with the first component. At least one of the conductors disposed on the first substrate and the second substrate respectively includes a coil. The retaining portion supports the first substrate toward the operating member. The first substrate has a recess or opening that appears when viewed from a direction orthogonal to the surface on which the conductor is disposed. A portion of the retaining part is disposed in the recess or the opening.

3. The playing operation device according to claim 1, wherein, The operating component and the retaining part are made of the same material.

4. The playing operation device according to claim 2, wherein, The first component and the retaining part are made of the same material.

5. The playing operation device according to claim 2, wherein, The first component includes a portion capable of elastic deformation. The first component undergoes elastic deformation due to the force from the operating member, thereby changing the distance between the first substrate and the second substrate.

6. The playing operation device according to any one of claims 1 to 5, wherein, The holding part holds the first substrate in a detachable manner.

7. The playing operation device according to claim 6, wherein, The retaining part includes an elastomer. When the elastomer is in the first state, the holding portion holds the first substrate. When the elastomer is in a second state, which has undergone further elastic deformation compared to the first state, the holding portion releases the first substrate.

8. The playing operation device according to claim 6, wherein, The retaining part includes a first plate part and a second plate part. The first plate and the second plate can change their positional relationship. In the first state, when the first substrate is held between the first plate portion and the second plate portion, the holding portion holds the first substrate. In a second state, where the first plate portion and the second plate portion are further apart than in the first state, the holding portion releases the holding of the first substrate.

Images