Short lead semiconductor laser and test fixture and test method thereof

Abstract

A short lead semiconductor laser and its test fixture and test method belong to the technical field of semiconductor laser packaging. The laser comprises a tube base, a tube cap, a laser chip, a transition heat sink, a PD chip and gold wires. The laser chip is sintered on the transition heat sink, and the transition heat sink and the PD chip are bonded on the tube base. The light emitting surface of the laser chip faces outward, and the back light surface faces the PD chip. The laser chip and the PD chip are respectively connected by the gold wires. The tube cap is welded on the tube base, and there is an opening outside the light emitting surface of the laser chip. A single tube base structure can be used to support various internal interconnections, realize packaging of different lead definition lasers, and complete shell fixation and lead contact conduction of the short lead laser by means of a test fixture specially used for the same, and testing is carried out.

Description

Technical Field

[0001] This invention relates to a short-lead semiconductor laser and its test fixture and test method, belonging to the field of semiconductor laser packaging technology. Background Technology

[0002] Compared to other forms of lasers such as solid, gas, and liquid, semiconductor lasers have developed rapidly since their inception. With their advantages such as small size, high efficiency, simple structure, and good reliability, they have gradually emerged in many fields such as process manufacturing, communication interconnection, sensing and measurement, and consumer entertainment, and have gradually entered people's daily lives.

[0003] In some lighting and medical therapy applications, to maximize the coverage of laser irradiation, a large number of semiconductor lasers are often used in a single device. The most common method is to solder multiple TO-packaged semiconductor lasers onto a PCB. Because conventional TO-packaged lasers have relatively long leads (6-14mm), the excess leads need to be trimmed after soldering. For products using a large number of lasers, trimming the leads on the PCB significantly increases production time and labor costs. Therefore, users of such lasers typically prefer to use TO-packaged semiconductor lasers with short leads.

[0004] For laser manufacturers, there are two main methods to produce short-lead TO structure semiconductor lasers: (1) directly using short-lead sockets to package the laser; (2) after conventional laser production and testing, the laser manufacturer cuts the leads. The main problems with the former include the limited internal interconnection structure that can be achieved with existing sockets, and the difficulty in fixing the leads and making the test circuit conductive during testing of short-lead lasers; the latter simply transfers the cutting cost to the laser manufacturer and cannot perform further electrical parameter checks after cutting.

[0005] To solve the above problems, it is necessary to design a laser tube socket that supports multiple internal interconnection structures, and to design a device and method that can fix and test short-lead lasers. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a short-lead semiconductor laser, its test fixture, and a test method. It can use a single socket structure, support multiple internal interconnects, and realize the packaging of lasers with different lead definitions. At the same time, with the help of a dedicated test fixture, the housing of the short-lead laser is fixed and the lead contact is made conductive.

[0007] The technical solution of the present invention is as follows:

[0008] A short-lead semiconductor laser includes a socket, a cap, a laser chip, a transition heat sink, a PD chip, and gold wires; the laser chip is sintered on the transition heat sink, and the transition heat sink and the PD chip are bonded to the socket.

[0009] The laser chip emits light outwards, while its backlight faces the PD chip. The laser chip and the PD chip are connected by gold wires.

[0010] The cap is welded to the tube base, and there is an opening outside the light-emitting surface of the laser chip.

[0011] Preferably, the tube socket includes a substrate, a tube tongue, and a lead wire; the substrate has a positioning notch on its side; the tube tongue is disposed on the surface of the substrate, and a die bonding platform is disposed on the tube tongue, with a transition heat sink disposed on the die bonding platform;

[0012] The lead penetrates the substrate and protrudes 2-3mm below the substrate. The lead is short and has two soldering platforms at its upper end, one parallel to the lead and the other perpendicular to the lead.

[0013] More preferably, the number of leads is three, of which two leads are provided with insulating glass between them and the substrate, the insulating glass isolating the leads from the substrate, and the other lead is connected to the substrate.

[0014] More preferably, the second welding platform parallel to the lead wire is located above the second welding platform perpendicular to the lead wire.

[0015] Preferably, the PD chip is connected to the substrate via a PD platform.

[0016] Preferably, the short-lead semiconductor laser comprises one of the following:

[0017] i. The positive or negative electrode of the laser chip faces the transition heat sink;

[0018] ii. The heat sink should be made of conductive materials (such as copper, silicon, etc.) or non-conductive materials (such as aluminum nitride, etc.).

[0019] iii. PD chips use P-type or N-type substrates;

[0020] iv. The upper surface of the PD chip is a single electrode or a dual electrode.

[0021] The gold wires form interconnections between the laser chip, PD chip, transition heat sink, tube tongue, and leads, enabling various lead definitions.

[0022] A test fixture for a short-lead semiconductor laser includes a base and a cover plate. The base has a laser through-hole at its center, the diameter of which is smaller than the diameter of the laser tube socket. The laser through-hole is used to hold the laser, and the laser lead extends out from the through-hole. A slider assembly is provided above the base and is slidably connected to the base. The slider assembly is used to hold the laser and is in communication with the laser lead. A spring is provided on the outer side of the slider assembly that contacts the base. A push rod is provided below the base and contacts the slider assembly. The push rod is used to control the sliding of the slider assembly.

[0023] The cover plate is placed on top of the base and is detachably connected to the base by bolts or screws.

[0024] Preferably, the push rod is a hollow cylinder with rounded corners at the top edge.

[0025] Preferably, the base has four slider slots on top, which are used to hold slider groups. The slider slots are equipped with slide rails, and the slider groups move along the slide rails.

[0026] The slider assembly includes four sliders: a middle slider, two side sliders, and a cover slider. Springs are provided on the outer sides of all four sliders. The four sliders are located in the slide rail on the base, each held in place by a spring, with the bottom contacting the top rod and the top pressed down by the cover plate.

[0027] More preferably, one end of the middle slider has a convex conductive pin for contacting the substrate of the laser tube socket under test; one end of each of the two side sliders has a conductive pin with a concave tip for contacting the leads on the left and right sides of the laser under test; the conductive pins are used to connect to the laser under test.

[0028] The cover plate slider has an open cover plate at the front end, which is used to press against the laser tube cap and the laser substrate during the test to prevent the laser from shaking during the test.

[0029] In a further preferred embodiment, each of the four sliders has an inclined surface below it, and the push rod contacts the inclined surface. By moving the push rod up and down, the four sliders with inclined surfaces move along the slide rail, pushing the slider group closer to or away from the laser under test. This achieves the fixation of the laser under test, conduction of the lead wires, or release of the laser and suspension of the lead wires. Combined with the laser absorption and push rod pushing structure, it can be connected to any existing laser testing system.

[0030] A further preferred embodiment is a 45° inclined surface.

[0031] In a further preferred embodiment, conductive springs are provided in the three slider slots corresponding to the middle slider and the two side sliders. The conductive springs contact the conductive pins of the three sliders to form a conductive circuit. The conductive springs are led out through bonding wires and can be connected to any laser testing system.

[0032] A testing method for a test fixture used in short-lead semiconductor lasers includes the following steps:

[0033] Before the test begins, the push rod is in the raised position, and the slider assembly is pushed to all sides. At the start of the test, the laser under test is placed on the base of the test fixture using a suction nozzle or other mechanical device, with its lead wire extending from the laser through-hole in the center of the base. Then, the push rod begins to fall under the control of a cylinder or other structure, and the slider assembly slides towards the laser under test in the center due to the spring force, until the front end of the slider assembly touches the laser under test, thus fixing the laser position and ensuring the lead wire conduction. Afterward, the push rod continues to descend, and the entire system remains in a stable position, at which point the laser can be powered on for testing. After powering on, the push rod is pushed up, and the above steps are reversed to remove the laser, completing the entire test.

[0034] The beneficial effects of this invention are as follows:

[0035] This invention provides a short-lead semiconductor laser and its packaging and testing methods. It allows for the direct production of short-lead semiconductor lasers, eliminating the need for downstream customers to trim excessively long leads after soldering. Furthermore, it enables the implementation of various internal device interconnection structures on a single socket. Using a short-lead laser testing fixture, the laser's housing is fixed and lead contact is established, quickly completing the housing fixation and lead contact of the short-lead laser. Combined with peripheral circuitry, this allows for laser testing and can be used in various automated laser testing systems. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the appearance of the laser and test fixture of the present invention;

[0037] Figure 2-1 This is a schematic diagram of the laser structure of the present invention;

[0038] Figure 2-2 This is a schematic diagram of the laser disassembled structure of the present invention;

[0039] Figure 3-1 This is a top view of the tube seat structure of the present invention;

[0040] Figure 3-2 This is a bottom view of the tube seat structure of the present invention;

[0041] Figure 4-1 This is a schematic diagram of the interconnection scheme implemented by the laser in Embodiment 3 of the present invention;

[0042] Figure 4-2 This is a schematic diagram of the interconnection scheme implemented by the laser in Embodiment 4 of the present invention;

[0043] Figure 4-3 This is a schematic diagram of the interconnection scheme implemented by the laser in Embodiment 5 of the present invention;

[0044] Figure 4-4 This is a schematic diagram of the interconnection scheme implemented by the laser in Embodiment 6 of the present invention;

[0045] Figure 5-1 This is a top view schematic diagram of the test fixture structure of the present invention;

[0046] Figure 5-2 This is a schematic diagram of the test fixture structure from below in this invention;

[0047] Figure 5-3 This is a schematic diagram of the exploded disassembly structure of the test fixture of the present invention;

[0048] Figure 6 This is a schematic diagram of the slider assembly structure of the present invention;

[0049] Figure 7-1 This is a schematic diagram of the base structure of the present invention;

[0050] Figure 7-2 This is a top view of the base structure of the present invention;

[0051] Figure 8-1 This is a bottom view of the base structure of the present invention;

[0052] Figure 8-2 This is a schematic diagram of the conductive spring structure of the present invention;

[0053] Figure 9-1 This is a schematic diagram of the push rod structure of the present invention;

[0054] Figure 9-2 This is a schematic diagram illustrating the working principle of the push rod of the present invention;

[0055] Figure 10 This is a schematic diagram of the testing method of the present invention;

[0056] The components are: 1. Short-lead semiconductor laser, 2. Test fixture, 3. Tube socket, 4. Tube cap, 5. Laser chip, 6. Transition heat sink, 7. PD chip, 8. Gold wire, 9. Substrate, 10. Tube tongue, 11. Lead wire, 12. Insulating glass, 13. Positioning notch, 14. PD platform, 15. Die bonding platform, 16. Two-welding platform, 17. Two-welding platform, 18. Screw, 19. Cover plate, 20. Slider assembly, 21. Base, 22. Push rod, 23. Middle slider, 24. Side sliders, 25. Cover plate slider, 26. Spring, 27. Conductive push pin, 28. Conductive spring, 29. Laser through hole, 30. Slide rail, 31. Spring limiting protrusion. Detailed Implementation

[0057] To clearly illustrate the technical features of this solution, the invention will be described in detail below through specific embodiments and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the invention. To simplify the disclosure of the invention, components and arrangements of specific examples are described below. Furthermore, reference numerals and / or letters may be repeated in different examples. This repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that the components illustrated in the drawings are not necessarily drawn to scale. Descriptions of well-known components, processing techniques, and processes are omitted in this invention to avoid unnecessarily limiting the invention.

[0058] Example 1:

[0059] A short-lead semiconductor laser, such as Figure 2-1 , Figure 2-2 As shown, it includes a tube socket 3, a tube cap 4, a laser chip 5, a transition heat sink 6, a PD chip 7, and a gold wire 8; the laser chip is sintered on the transition heat sink, and the transition heat sink and the PD chip are bonded to the tube socket.

[0060] The laser chip emits light outwards, while its backlight faces the PD chip. The laser chip and the PD chip are connected by gold wires.

[0061] The cap is welded to the tube base, and there is an opening outside the light-emitting surface of the laser chip.

[0062] The socket includes a substrate 9, a tongue 10, and a lead 11. A positioning notch 13 is provided on the side of the substrate for orientation positioning during packaging and use. The tongue is located on the surface of the substrate and is a column with a fan-shaped cross-section. A die-bonding platform 15 is provided on the tongue, and a transition heat sink 6 is provided on the die-bonding platform. A PD platform 14 for bonding the PD chip is located at the center of the substrate, and the PD chip is connected to the substrate through the PD platform.

[0063] The lead penetrates the substrate and protrudes 2-3mm below the substrate. The lead is short and has two bonding platforms 16 parallel to the lead and two bonding platforms 17 perpendicular to the lead at its upper end.

[0064] Example 2:

[0065] A short-lead semiconductor laser has the structure described in Example 1, except that it has three leads, with the left and right leads (i.e., the two leads on the left and right sides) Figure 3-1 An insulating glass 12 is provided between the exposed leads and the substrate, such as... Figure 3-2 As shown, insulating glass isolates the lead from the substrate, and a middle lead is directly sintered on the lower surface of the substrate and is connected to the substrate and the tube tongue.

[0066] The second bonding platform, perpendicular to the lead, is located above the insulating glass and is used for bonding PD chip wires. The second bonding platform, parallel to the lead, is located above the second bonding platform perpendicular to the lead, at the top of the lead, and is used for bonding laser chips and transition heat sink wires. The entire socket structure is symmetrical from left to right.

[0067] Example 3:

[0068] A short-lead semiconductor laser, the structure of which is as described in Embodiment 1, comprises one of the following:

[0069] i. The positive or negative electrode of the laser chip faces the transition heat sink;

[0070] ii. The transition heat sink uses conductive materials (such as copper, silicon, etc.) or non-conductive materials (such as aluminum nitride, etc.); it forms a good ohmic contact by sintering the upper surface solder with the laser chip and the lower surface solder with the tube tongue.

[0071] iii. PD chips use P-type or N-type substrates;

[0072] iv. The upper surface of the PD chip is a single electrode or a dual electrode.

[0073] The gold wires form interconnections between the laser chip, PD chip, transition heat sink, tube tongue, and leads. Depending on the design requirements, various different lead definitions can be achieved.

[0074] The following diagram illustrates several different lead wire connection methods.

[0075] like Figure 4-1 The laser chip's positive electrode (P) faces the transition heat sink, which is made of conductive material. The PD chip uses an N-type substrate with a positive electrode on the lower surface and a single negative electrode on the upper surface. The PD chip is bonded to the PD platform of the socket using conductive silver paste. Gold wires connect the upper surface electrode (N) of the laser chip to the second bonding platform of the right lead and the upper surface electrode (P) of the PD chip to the second bonding platform of the left lead. Finally, the middle pin ② of the laser chip is the common positive electrode. The laser chip current flows out from pin ①, and the PD chip current flows out from pin ② (the PD chip operates in reverse conduction mode, with current flowing from N to P).

[0076] In this embodiment, the right lead is the lead with more exposed on the right side of the figure, corresponding to pin ①; the left lead is the lead with less exposed on the left side of the figure, corresponding to pin ③; the middle lead is not shown in the figure, is located below the tongue, and corresponds to pin ②. The following different lead connection embodiments are similar.

[0077] Example 4:

[0078] A short-lead semiconductor laser, the structure of which is as described in Example 3, except that:

[0079] like Figure 4-2 The laser chip's positive electrode (P) faces the transition heat sink; the transition heat sink uses a non-conductive material; the PD chip uses a P-type substrate, with a negative electrode on the lower surface and a single positive electrode on the upper surface. The PD chip is bonded to the PD platform of the socket using conductive silver paste; gold wires connect the upper surface electrode (N) of the laser chip to the die bonding platform 15, connect the upper surface of the transition heat sink to the right lead bonding platform, and connect the upper surface electrode (N) of the PD chip to the left lead bonding platform. Finally, the middle pin ② of the laser is the common negative electrode, with laser chip current flowing in from pin ① and PD chip current flowing in from pin ②.

[0080] Example 5:

[0081] A short-lead semiconductor laser, the structure of which is as described in Example 3, except that:

[0082] like Figure 4-3 The laser chip's positive electrode (P) faces the transition heat sink, which is made of conductive material. The PD chip uses an N-type substrate with a positive electrode on the lower surface and one positive and one negative electrode on the upper surface. The PD chip is bonded to the PD platform of the socket via non-conductive bonding. Gold wires connect the upper surface electrode (N) of the laser chip to the second bonding platform of the right lead, the upper surface electrode (N) of the PD chip to the second bonding platform of the left lead, and the upper surface electrode (P) of the PD chip to the second bonding platform of the right lead. Finally, the right pin ① of the laser is the common negative electrode, the laser chip current flows in from pin ②, and the PD chip current flows in from pin ③.

[0083] Example 6:

[0084] A short-lead semiconductor laser, the structure of which is as described in Example 3, except that:

[0085] like Figure 4-4 The positive electrode (P) of the laser chip faces the transition heat sink; the transition heat sink is made of a non-conductive material; there is no PD chip; gold wires connect the upper surface electrode (N) of the laser chip to the second bonding platform of the right lead, and connect the upper surface of the transition heat sink to the second bonding platform of the left lead. Finally, the middle pin ② of the laser is not conductive, and the laser chip current flows in from pin ③ and flows out from pin ①.

[0086] Since the socket structure used in this application is symmetrical, the pin definition can be flipped by simply changing the left and right positions of the gold wire soldering during packaging.

[0087] Example 7:

[0088] A test fixture for short-lead semiconductor lasers is provided to fix the laser housing and ensure lead wire contact and conduction. It works in conjunction with the peripheral circuitry of an existing laser test system to complete laser testing. The fixture includes a base 21 and a cover plate 19. The base is a hollow cube with a laser through-hole 29 at its center. The diameter of the through-hole is smaller than the diameter of the laser tube socket. The through-hole is used to hold the laser, and the laser lead wire extends from the through-hole. A slider assembly 20 is located above the base and is slidably connected to it. The slider assembly is used to hold the laser and conduct electricity through its lead wire. A spring 26 is located on the outer side of the slider assembly that contacts the base. A push rod 22 is located inside the base below, contacting the slider assembly and controlling its sliding. The push rod is a hollow cylinder with rounded corners at its upper edge.

[0089] The cover plate is placed on top of the base and is fixed to the base by bolts or screws 18, making it detachable.

[0090] Example 8:

[0091] A test fixture for short-lead semiconductor lasers has the structure described in Embodiment 7, except that four slider slots are provided above the base. The slider slots are used to place slider groups. Slide rails 30 are provided in the slider slots. The slider groups move along the slide rails. Each slide rail has a spring limiting protrusion 31 at the rear end to fix the spring behind each slider in the slider group.

[0092] The slider group consists of four sliders, such as Figure 6 As shown, there are four sliders: a middle slider 23, two side sliders 24, and a cover slider 25. Springs 26 are provided on the outer sides of each slider. The four sliders are located in the slide rail on the base, each of them is held in place by a spring, and are in contact with the top rod below and pressed down by the cover plate above.

[0093] One end of the middle slider has a convex conductive pin for contacting the laser tube socket substrate under test. The tip of the pin is pointed and its height is flush with the laser tube socket substrate. It is used to abut against the positioning notch of the laser under test, thereby achieving contact and conductivity with the socket, i.e., the middle lead. One end of each of the two side sliders has a conductive pin with a concave tip. The tip of the pin has a groove and its height is lower than the laser tube socket substrate. It is used to abut against the left and right leads of the laser under test, thereby achieving contact and conductivity with the left and right leads. Figure 6 As shown; the conductive pin 27 is used to connect to the laser under test.

[0094] The cover plate slider has an open cover plate at the front end, which is used to press against the laser tube cap and the laser substrate during the test to prevent the laser from shaking during the test.

[0095] Example 9:

[0096] A test fixture for short-lead semiconductor lasers, with the structure described in Example 8, differs in that each of the four sliders has a 45° smooth inclined surface below it, and the upper end of the push rod is in contact with and tangential to the inclined surface. The push rod can be moved vertically by a cylinder or other structure. In the stationary state, the push rod is lifted, pushing the sliders outward (e.g., ...). Figure 9-2 The two sliders (24) are positioned so that the laser is not in contact with the ejector pin. During testing, the ejector rod moves downwards, and the sliders, under spring pressure, move towards the laser until the ejector pins of the two sliders contact the left and right leads of the laser under test, the ejector pin of the middle slider abuts against the positioning notch of the laser under test, and the cover slider abuts against the laser cap and presses against the laser substrate, thus stably placing the laser on the test fixture and starting the test. The sliders can remain in their original positions even after the ejector rod continues to move downwards. This process is reversible; therefore, moving the ejector rod upwards will push the sliders away, and the laser will no longer be fixed. By moving the ejector rod up and down, the four sliders with inclined surfaces move along the slide rail, pushing the slider group closer to or away from the laser under test, thus fixing the laser under test, making the leads conductive, or releasing the laser and suspending the leads. Combined with the laser absorption and ejector rod pushing structure, it can be connected to any existing laser testing system.

[0097] Example 10:

[0098] A test fixture for short-lead semiconductor lasers has the structure described in Embodiment 8, except that three conductive spring pieces 28 are provided in the three slider slots corresponding to the middle slider and the two side sliders, for a total of three. After the slider assembly is installed, the conductive spring pieces contact the conductive pins of the three sliders to form a conductive circuit, thereby realizing the conduction between the conductive spring pieces, the conductive pins, and the lead. Figure 8-2 The three conductive contacts from left to right are used for testing. Figures 4-1 to 4-4 Leads ①, ②, and ③ are shown in the diagram. The conductive spring is led out via bonding wires and can be connected to any laser testing system.

[0099] Example 11:

[0100] A test method for a test fixture used in short-lead semiconductor lasers, such as... Figure 10 The steps include the following:

[0101] Before the test begins, the push rod is in the raised position, and the slider assembly is pushed to all sides (the last few steps in the diagram only show the main structure including the laser under test, the slider assembly, the conductive spring, and the push rod). At the start of the test, the laser under test is placed on the base of the test fixture using a suction nozzle or other mechanical device, so that its lead wire extends out from the laser through hole in the center of the base. Then, the push rod begins to fall under the control of a cylinder or other structure, and the slider assembly begins to slide towards the laser under test located in the center due to the spring force, until the front end of the slider assembly touches the laser under test, thus fixing the laser position and connecting the lead wire. After that, the push rod continues to descend, and the entire system remains in a stable position. At this point, the laser can be powered on for testing. After the power-on is completed, the push rod is pushed up, and the above steps are reversed to remove the laser, completing the entire test.

[0102] While the specific embodiments of the present invention have been described above in conjunction with the accompanying drawings, this is not intended to limit the scope of protection of the present invention. Those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art without creative effort based on the technical solutions of the present invention are still within the scope of protection of the present invention.

Claims

1. A short-lead semiconductor laser, characterized in that, It includes a tube socket, tube cap, laser chip, transition heat sink, PD chip, and gold wire; the laser chip is sintered on the transition heat sink, and the transition heat sink and PD chip are bonded to the tube socket; The laser chip emits light outwards, while its backlight faces the PD chip. The laser chip and the PD chip are connected by gold wires. The cap is welded to the tube base, and there is an opening outside the light-emitting surface of the laser chip; The tube socket includes a substrate, a tube tongue, and a lead wire; the substrate has a positioning notch on its side; the tube tongue is disposed on the surface of the substrate, and a die bonding platform is disposed on the tube tongue, with a transition heat sink disposed on the die bonding platform; The lead penetrates the substrate and protrudes 2-3mm below the substrate. The upper end of the lead has two bonding platforms parallel to the lead and two bonding platforms perpendicular to the lead. The number of leads is three, two of which are separated from the substrate by insulating glass, and the other lead is connected to the substrate. The second welding platform parallel to the lead wire is located above the second welding platform perpendicular to the lead wire; The PD chip is connected to the substrate via the PD platform.

2. The short-lead semiconductor laser according to claim 1, characterized in that, Short-lead semiconductor lasers include one or more of the following: i. The positive or negative electrode of the laser chip faces the transition heat sink; ii. Use conductive or non-conductive materials for the transition heat sink; iii. PD chips use P-type or N-type substrates; iv. The upper surface of the PD chip is a single electrode or a dual electrode.

3. A test fixture for the short-lead semiconductor laser of claim 1, comprising a base and a cover plate, wherein the base has a laser through hole at its center, the diameter of which is smaller than the diameter of the laser tube socket; a slider assembly is provided above the base, the slider assembly being slidably connected to the base, the slider assembly being used to hold the laser and being in communication with the laser's leads; a spring is provided on the outer side of the slider assembly that contacts the base; a push rod is provided below the base, the push rod contacting the slider assembly, the push rod being used to control the sliding of the slider assembly; The cover plate is placed on top of the base, and the cover plate and the base are detachably connected. The base has four slider slots on top, which are used to hold slider assemblies. The slider slots are equipped with slide rails, and the slider assemblies move along the slide rails. The slider assembly includes four sliders: a middle slider, two side sliders, and a cover slider. The outer sides of the four sliders are equipped with springs. The bottom of the four sliders is equipped with an inclined surface, and the top rod contacts the inclined surface. The middle slider has a convex conductive pin at one end for contacting the laser tube socket under test; both side sliders have a conductive pin with a concave tip at one end for contacting the leads on both sides of the laser under test; the conductive pins are used to connect with the laser under test; the front end of the cover plate slider is provided with a cover plate with an opening for pressing against the laser tube cap and pressing the laser substrate during the test.

4. The test fixture according to claim 3, characterized in that, The top rod is a hollow cylinder with rounded corners on the upper edge.

5. The test fixture according to claim 3, characterized in that, The inclined surface is at a 45° angle.

6. The test fixture according to claim 3, characterized in that, Conductive springs are installed in the three slider slots corresponding to the middle slider and the two side sliders.

7. A testing method using the test fixture for short-lead semiconductor lasers as described in claim 3, characterized in that, The steps include the following: Before the test begins, the push rod is in the raised position, and the slider assembly is pushed to all sides. At the start of the test, the laser under test is placed on the base of the test fixture using a suction nozzle or other mechanical device, with its lead wire extending from the laser through-hole in the center of the base. Then, the push rod begins to fall under the control of a cylinder or other structure, and the slider assembly slides towards the laser under test in the center due to the spring force, until the front end of the slider assembly touches the laser under test, thus fixing the laser position and ensuring the lead wire conduction. Afterward, the push rod continues to descend, and the entire system remains in a stable position, at which point the laser can be powered on for testing. After powering on, the push rod is pushed up, and the above steps are reversed to remove the laser, completing the entire test.

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