Display panel and manufacturing method thereof

By filling the bending area of ​​the OLED display panel with a spacer layer, the stress problem of the encapsulation layer during bending is solved, improving the encapsulation effect and yield.

CN114784081BActive Publication Date: 2026-06-09GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
Filing Date
2022-05-27
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

When existing OLED display panels are bent, the encapsulation layer cracks due to uneven film morphology at the bottom cut opening, resulting in significant bending stress and affecting encapsulation performance and yield.

Method used

A spacer layer is filled into the opening in the bending area of ​​the display panel to improve the flatness of the film layer, enhance the support of the first encapsulation sub-layer, and reduce bending stress.

Benefits of technology

By improving the flatness of the film layer and reducing the bending stress of the encapsulation layer, the encapsulation effect is enhanced, thereby increasing the yield of the display panel.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a display panel and its manufacturing method. It includes a substrate, a conductive layer, a spacer layer, a support layer, a cathode layer, and a first encapsulation layer. The conductive layer is disposed on the substrate and includes at least one auxiliary electrode. The spacer layer is disposed on the side of the conductive layer away from the substrate and includes at least one opening, with each opening corresponding to an auxiliary electrode. The support layer is disposed on the side of the spacer layer away from the conductive layer and includes at least one support portion, with each opening corresponding to at least one support portion. The support portion is disposed on the spacer layer and partially extends above the corresponding opening. The cathode layer is disposed on the side of the support layer away from the spacer layer and extends into the opening to overlap with the auxiliary electrode. The first encapsulation layer includes a first encapsulation sub-layer and a spacer layer filled within the opening, the first encapsulation sub-layer covering the cathode layer and the spacer layer. This invention can reduce the bending stress on the first encapsulation sub-layer, improve the encapsulation effect of the encapsulation layer, and increase the yield of the display panel.
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Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel and its manufacturing method. Background Technology

[0002] In order to increase the transmittance of top emission in organic light-emitting diode (OLED) display panels, the metal cathode is relatively thin, resulting in a large sheet resistance and a serious current voltage drop (IR-drop), which leads to obvious brightness unevenness in the display panel. To improve the brightness unevenness of the panel, an auxiliary cathode can be installed and connected to the thinner metal cathode, which reduces the impedance and current voltage drop of the panel's cathode and improves the brightness uniformity to a certain extent.

[0003] Currently, the common method for achieving overlap between the auxiliary cathode and the metal cathode is to form an under-cut opening above the auxiliary cathode and control the deposition angle of the cathode layer so that the cathode layer extends into the under-cut opening to overlap with the auxiliary cathode. However, during the encapsulation layer preparation process, the uneven film morphology at the under-cut opening makes it difficult for the inorganic layer in the encapsulation layer to receive effective support when covering the under-cut opening. Consequently, when the display panel is bent, the inorganic layer in the encapsulation layer will be subjected to significant bending stress, leading to cracking and encapsulation failure. Summary of the Invention

[0004] This invention provides a display panel and its manufacturing method, which can improve the flatness of the opening covered by the first encapsulation sublayer, reduce the bending stress of the first encapsulation sublayer in the bending sub-region, and improve the encapsulation yield of the display panel.

[0005] This invention provides a display panel including a display area, the display area including a bent sub-area, and the display panel further including:

[0006] substrate;

[0007] A conductive layer is disposed on the substrate and includes at least one auxiliary electrode distributed within the display area;

[0008] A spacer layer is disposed on the side of the conductive layer away from the substrate. The spacer layer includes at least one opening, and one of the openings is disposed corresponding to one of the auxiliary electrodes to expose the upper surface of the corresponding auxiliary electrode.

[0009] A support layer is disposed on the side of the spacer layer away from the conductive layer, and includes at least one support portion, and each opening is provided corresponding to at least one support portion, the support portion being disposed on the spacer layer and partially extending above the corresponding opening;

[0010] A light-emitting layer is disposed on the side of the support layer away from the spacer layer and extends partially into the opening;

[0011] A cathode layer is disposed on the side of the light-emitting layer away from the support layer, and the cathode layer extends into the opening to cover the light-emitting layer located in the opening, and overlaps with the auxiliary electrode;

[0012] The first encapsulation layer includes a first encapsulation sublayer located at least within the display area and a spacer layer located at least within the bending sub-area and filling the opening, wherein the first encapsulation sublayer covers the cathode layer and the spacer layer.

[0013] In one embodiment of the present invention, the first encapsulation layer further includes a second encapsulation sublayer disposed between the cathode layer and the first encapsulation sublayer. The second encapsulation sublayer includes a first sub-part covering the portion of the cathode layer outside the opening and the support portion. The distance from the surface of the spacer sublayer away from the substrate to the substrate is equal to the distance from the surface of the first sub-part located on the support portion away from the substrate to the substrate.

[0014] In one embodiment of the invention, the second encapsulation sublayer further includes a second sub-part extending into the opening and covering the cathode layer, wherein the spacer sublayer fills the opening and covers the second sub-part.

[0015] In one embodiment of the present invention, the opening includes at least one first side and at least one second side, each of the support portions is disposed on the first side of the corresponding opening and extends from the first side to above the opening, and the cathode layer extends from the second side of the opening into the opening and overlaps with the auxiliary electrode, the second sub-portion is connected to the first sub-portion and extends from the second side into the opening and covers the cathode layer.

[0016] In one embodiment of the present invention, the thickness of the second encapsulation sublayer is less than the thickness of the first encapsulation sublayer.

[0017] In one embodiment of the present invention, the material of the spacer layer includes an organic material, and the materials of the first encapsulation layer and the second encapsulation layer include inorganic materials.

[0018] In one embodiment of the present invention, the spacer layer is distributed within the display area and fills each of the openings, wherein the first encapsulation layer covers the cathode layer and the spacer layer within the display area.

[0019] In one embodiment of the present invention, the display panel further includes a plurality of thin-film transistors disposed between the substrate and the spacer layer and distributed within the display area, the conductive layer further includes the source and drain of the thin-film transistors, the support layer further includes signal terminals disposed outside the display area, and the signal terminals are electrically connected to the cathode layer.

[0020] In one embodiment of the present invention, the display panel further includes a second encapsulation layer disposed on the side of the first encapsulation layer away from the cathode layer, and the second encapsulation layer at least covers the display area. The second encapsulation layer includes a first inorganic sublayer, an organic sublayer, and a second inorganic sublayer stacked on the first encapsulation layer.

[0021] According to the above-mentioned objectives of the present invention, embodiments of the present invention also provide a method for manufacturing a display panel, the display panel including a display area, the display area including a bent sub-area, and the method for manufacturing the display panel including the following steps:

[0022] A conductive layer is formed on a substrate, the conductive layer including at least one auxiliary electrode formed in the display area;

[0023] A spacer layer is formed on the side of the conductive layer away from the substrate. The spacer layer includes at least one opening, and one of the openings is disposed corresponding to one of the auxiliary electrodes to expose the upper surface of the corresponding auxiliary electrode.

[0024] A support layer is formed on the side of the spacer layer away from the conductive layer. The support layer includes at least one support portion, and each opening is provided with at least one support portion. The support portion is provided on the spacer layer and extends partially above the corresponding opening.

[0025] A light-emitting layer is formed on the side of the support layer away from the spacer layer, and the light-emitting layer extends into the opening;

[0026] A cathode layer is formed on the side of the light-emitting layer away from the support layer, and the cathode layer extends into the opening to cover the light-emitting layer located in the opening and overlaps with the auxiliary electrode;

[0027] A first encapsulation layer is formed on the side of the cathode layer away from the light-emitting layer. The first encapsulation layer includes a first encapsulation sub-layer formed at least in the display area and a spacer layer located at least in the bending sub-area and filling the opening. The first encapsulation sub-layer covers the cathode layer and the spacer layer.

[0028] The beneficial effects of the present invention are as follows: By filling the opening with a spacer layer at least in the bending sub-region, the present invention improves the flatness of the film layer at the opening. As a result, when the first encapsulation sub-layer covers the opening, the flatness of the first encapsulation sub-layer and the support of the underlying film layer on the first encapsulation sub-layer are improved. Consequently, when the display panel is bent, the bending stress on the first encapsulation sub-layer is reduced, the encapsulation effect of the encapsulation layer is improved, and the yield of the display panel is increased. Attached Figure Description

[0029] The technical solution and other beneficial effects of the present invention will become apparent from the following detailed description of specific embodiments of the invention, in conjunction with the accompanying drawings.

[0030] Figure 1 This is a schematic diagram of the structure of a display panel corresponding to an auxiliary electrode in a related technology.

[0031] Figure 2 This is a schematic diagram of a display panel provided in an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of another structure of the display panel provided in an embodiment of the present invention;

[0033] Figure 4 A structural diagram illustrating the positional relationship between a support portion and an opening, provided in an embodiment of the present invention;

[0034] Figure 5 This is a structural diagram showing the positional relationship between the support portion and the opening, provided in an embodiment of the present invention.

[0035] Figure 6 This is a structural diagram showing the positional relationship between the support portion and the opening, provided in an embodiment of the present invention.

[0036] Figure 7 A flowchart illustrating the manufacturing method of a display panel provided in an embodiment of the present invention;

[0037] Figures 8 to 11 This is a schematic diagram of the manufacturing process structure of a display panel provided in an embodiment of the present invention. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0039] The following disclosure provides many different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0040] In related technologies, to reduce the voltage drop of the surface cathode, an auxiliary cathode is connected in parallel with the surface cathode to further reduce the voltage drop. Please refer to [reference needed]. Figure 1 The assembly includes an auxiliary cathode 1, an organic planarization layer 2 covering the auxiliary cathode 1, an organic light-emitting layer 3 disposed on the organic planarization layer 2, a surface cathode 4 disposed on the organic light-emitting layer 3, and an encapsulation layer 5 disposed on the surface cathode 4. The organic planarization layer 2 has a slot 6 to expose the auxiliary cathode 1, and a support unit 7 is disposed on the organic planarization layer 2. The support unit 7 extends from a portion of the side of the slot 6 to the top of the slot 6, so that the organic light-emitting layer 3 and the surface cathode 4 are separated at the support unit 7. The organic light-emitting layer 3 and the surface cathode 4 extend from the side without the support unit 7 into the slot 6 and extend to the auxiliary cathode 1. The evaporation angle of the surface cathode 4 is controlled so that the surface cathode 4 extends to the bottom of the support unit 7 to cover the organic light-emitting layer 3 and overlap with the auxiliary cathode, so that the surface cathode 4 and the auxiliary cathode 1 are connected in parallel. Because the encapsulation layer 5 is relatively thick, typically more than 1 micrometer, when it covers the slot 6, it forms a continuous coverage without immediate breakage. However, at the slot 6, the sidewall of the organic planarization layer 2 is recessed relative to the sidewall of the support unit 7, forming a depression. Consequently, the encapsulation layer 5, which continuously covers the slot 6, lacks effective support at the depression. When the display panel is bent, the encapsulation layer 5 will be subjected to significant stress and crack, leading to encapsulation failure.

[0041] Continuing from the above, this embodiment of the invention provides a display panel, please refer to... Figure 2 The display panel includes a display area 101, which includes a bent sub-area 1011. The display panel also includes a substrate 10, a conductive layer 20, a spacer layer 30, a support layer 40, a light-emitting layer 80, a cathode layer 50, and a first encapsulation layer.

[0042] The conductive layer 20 is disposed on the substrate 10 and includes at least one auxiliary electrode 21 distributed within the display area 101. A spacer layer 30 is disposed on the side of the conductive layer 20 away from the substrate 10, i.e., on the side where at least one auxiliary electrode 21 is away from the substrate 10. The spacer layer 30 includes at least one opening 301, and each opening 301 corresponds to one auxiliary electrode 21, exposing the upper surface of the corresponding auxiliary electrode 21. A support layer 40 is disposed on the side of the spacer layer 30 away from the conductive layer 20 and includes at least one support portion 41. Each opening 301 corresponds to at least one auxiliary electrode 21. A support portion 41 is provided, which is disposed on the spacer layer 30 and extends partially above the corresponding opening 301; a light-emitting layer 80 is disposed on the side of the support layer 40 away from the spacer layer 30 and extends partially into the opening 301; a cathode layer 50 is disposed on the side of the light-emitting layer 80 away from the support layer 40, and the cathode layer 50 extends into the opening 301 to cover the light-emitting layer 80 located in the opening 301 and overlaps with the auxiliary electrode 21; the first encapsulation layer includes a first encapsulation sub-layer 61 located at least in the display area 101 and a spacer sub-layer 62 located at least in the bending sub-area 1011.

[0043] Furthermore, the spacer layer 62 is located at least within the bent sub-region 1011 and fills the opening 301, and the first encapsulation sub-layer 61 covers the cathode layer 50 and the spacer layer 62.

[0044] In the implementation process, the embodiments of the present invention fill at least the opening 301 of the bending sub-region 1011 with a spacer layer 62 to improve the flatness of the film layer at the opening 301, thereby providing effective support for the first encapsulation sub-layer 61 covering the opening 301. As a result, when the display panel is bent, the bending stress on the first encapsulation sub-layer 61 can be reduced, improving the encapsulation effect and increasing the yield of the display panel.

[0045] Please continue to refer to Figure 2 The display panel provided in this embodiment of the invention includes a display area 101, which includes a bent sub-area 1011 and a non-bent sub-area 1012 adjacent to the bent sub-area 1011.

[0046] Furthermore, the display panel also includes a substrate 10, a display functional layer 70 disposed on the substrate 10, a conductive layer 20 disposed on the display functional layer 70, a spacer layer 30 disposed on the conductive layer 20, a light-emitting layer 80 disposed on the spacer layer 30, a cathode layer 50 disposed on the light-emitting layer 80, and a first encapsulation layer disposed on the cathode layer 50.

[0047] Specifically, the substrate 10 is a flexible substrate, and its material may include organic materials such as polyimide.

[0048] The conductive layer 20 includes at least one auxiliary electrode 21 disposed on the substrate 10, and the spacer layer 30 covers the display functional layer 70 and has at least one opening 301, each opening 301 corresponding to the exposure of the upper surface of an auxiliary electrode 21.

[0049] Optionally, the conductive layer 20 includes a plurality of auxiliary electrodes 21, and the plurality of auxiliary electrodes 21 may be uniformly distributed in the display area 101, or the distribution density of the auxiliary electrodes 21 may gradually decrease along a direction away from the center of the display area 101.

[0050] The support layer 40 is disposed on the spacer layer 30 and includes at least one support portion 41, and each opening 301 is provided with at least one support portion 41, that is, the number of first support portions 41 needs to be greater than or equal to the number of openings 301; wherein, each support portion 41 is disposed on the spacer layer 30 and extends from a portion of the side of the opening 301 to the top of the opening 301.

[0051] A light-emitting layer 80 is disposed on a support layer 40. Because the sidewall of the spacer layer 30 at the opening 301 is recessed relative to the sidewall of the support portion 41, forming a depression, and because the thickness of the light-emitting layer 80 is relatively small, the light-emitting layer 80 cannot be continuously formed at the depression. That is, the light-emitting layer 80 is interrupted at the portion of the support portion 41 located above the opening 301, and extends from the side of the opening 301 where the support portion 41 is not located into the opening 301, covering a portion of the upper surface of the auxiliary electrode 21. A cathode layer 50 is disposed on the light-emitting layer 80, and the cathode layer 50 is also interrupted at the portion of the support portion 41 located above the opening 301, extending from the side of the opening 301 where the support portion 41 is not located into the opening 301, covering the light-emitting layer 80 located within the opening 301, and extending below the support portion 41 to overlap with the auxiliary electrode 21.

[0052] It should be noted that the cathode layer 50 at least covers the display area 101 and extends outside the display area 101 to be electrically connected to the signal terminal. The auxiliary electrode 21 can be electrically connected to the signal terminal outside the display area 101 through the signal line, so as to realize the parallel connection of the cathode layer 50 and the auxiliary electrode 21, thereby reducing the surface resistance of the cathode layer 50, reducing the voltage drop, and improving the display uniformity of the display panel.

[0053] In one embodiment of the present invention, please refer to Figure 2 , Figure 3 as well as Figure 4 ,in, Figure 2 Can be regarded as Figure 4 A schematic diagram of the cross-sectional structure along line AA. Figure 3 Can be regarded as Figure 4A schematic diagram of the cross-sectional structure along the BB line is shown. In this embodiment of the invention, the opening 301 may be rectangular, and the opening 301 includes three connected first sides 3011 and one second side 3012. Each opening 301 corresponds to three support parts 41. Each support part 41 is disposed at one of the first sides 3011 of the opening 301 and extends from the corresponding first side 3011 to the top of the opening 301. The light-emitting layer 80 and the cathode layer 50 extend from the second side 3012 of the opening 301 into the opening 301, and part of the cathode layer 50 extends to the bottom of the support part 41 and overlaps with the auxiliary electrode 21.

[0054] In another embodiment of the invention, please refer to Figure 3 as well as Figure 5 , Figure 3 Can be regarded as Figure 5 A schematic diagram of the cross-sectional structure along the CC line shows that the opening 301 is also rectangular, and the opening 301 includes two adjacent first sides 3011 and two adjacent second sides 3012. Each opening 301 corresponds to two support parts 41. Each support part 41 is disposed at one of the first sides 3011 of the opening 301 and extends from the corresponding first side 3011 to the top of the opening 301. The light-emitting layer 80 and the cathode layer 50 extend from the second side 3012 of the opening 301 into the opening 301, and part of the cathode layer 50 extends to the bottom of the support part 41 and overlaps with the auxiliary electrode 21.

[0055] In another embodiment of the invention, please refer to Figure 3 as well as Figure 6 , Figure 3 Can be regarded as Figure 6 A schematic diagram of the cross-sectional structure along the DD line is shown. The opening 301 is also rectangular and includes a first side 3011 and three adjacent second sides 3012. Each opening 301 corresponds to a support part 41. Each support part 41 is disposed at a first side 3011 of the opening 301 and extends from the corresponding first side 3011 to the top of the opening 301. The light-emitting layer 80 and the cathode layer 50 extend from the second side 3012 of the opening 301 into the opening 301, and part of the cathode layer 50 extends to the bottom of the support part 41 and overlaps with the auxiliary electrode 21.

[0056] It should be noted that in other embodiments of the present invention, the opening 301 may also be of other shapes, such as circular, elliptical or other polygonal, and the support portion 41 is disposed on at least one side of the opening 301. It is necessary to ensure that the periphery of the opening 301 is not completely surrounded by the support portion 41, so that the light-emitting layer 80 and the cathode layer 50 can extend into the opening 301, and the cathode layer 50 can overlap with the auxiliary electrode 21 in the opening 301.

[0057] In one embodiment of the present invention, the display functional layer 70 may include the active layer, gate, signal line, and insulating layer covering the active layer, gate, and signal line of a thin film transistor. The conductive layer 20 may also include the source and drain of the thin film transistor. That is, the auxiliary electrode 21 may be made of the same metal material as the source and drain, such as a Ti / Al / Ti stacked structure. The spacer layer 30 may be a planar layer covering the source and drain. The support layer 40 may also include a signal terminal located outside the display area 101, and the signal terminal may be electrically connected to the cathode layer 50.

[0058] In another embodiment of the present invention, the display functional layer 70 may include an active layer, gate, source, drain, signal line, an insulating layer covering the active layer, gate, source, drain, and signal line, and a planarization layer covering the insulating layer. The conductive layer 20 may also include a plurality of anodes disposed on the planarization layer, i.e., the auxiliary electrode 21 may be fabricated using the same metal as the anode. The spacer layer 30 may be a pixel definition layer covering the conductive layer 20. The spacer layer 30 may also include a plurality of pixel openings formed in the display area 101, and the pixel openings and openings 301 may be fabricated in the same process. In addition, the support layer 40 may also include a signal terminal located outside the display area 101, and the signal terminal may be electrically connected to the cathode layer 50.

[0059] Furthermore, in this embodiment of the invention, the display panel further includes a first encapsulation layer disposed on the side of the cathode layer 50 away from the substrate 10. The first encapsulation layer includes a first encapsulation sub-layer 61 covering at least the display area 101 and a spacer layer 62 located at least within the bending sub-area 1011. The spacer layer 62 at least fills the opening 301 within the bending sub-area 1011, while the first encapsulation sub-layer 61 covers the cathode layer 50 and the spacer layer 62 at the opening 301 within the bending sub-area 1011. This embodiment of the invention improves the flatness of the film layer at the opening 301 by filling the opening 301 with the spacer layer 62, thereby providing effective support for the first encapsulation sub-layer 61, reducing the bending stress on the first encapsulation sub-layer 61, improving the encapsulation effect of the first encapsulation layer, and increasing the yield of the display panel.

[0060] Preferably, the spacer layer 62 may also be located within the non-bending sub-region 1012 and fill all the openings 301, so as to provide a flat film morphology for the first encapsulation sub-layer 61 and improve the encapsulation effect of the first encapsulation sub-layer 61.

[0061] Furthermore, the first encapsulation layer also includes a second encapsulation sublayer 63 disposed between the first encapsulation sublayer 61 and the cathode layer 50. The second encapsulation sublayer 63 includes a first sub-part 631 covering part of the cathode layer 50 outside the opening 301 and the support portion 41, and a second sub-part 632 extending into the opening 301 and covering the cathode layer 50. The spacer layer 62 fills the opening 301 and covers the second sub-part 632. The distance from the surface of the spacer layer 62 away from the substrate 10 to the substrate 10 is equal to the distance from the surface of the first sub-part 631 on the support portion 41 away from the substrate 10 to the substrate 10. That is, the surface of the first sub-part 631 around the opening 301 is flush with the surface of the spacer layer 62 away from the substrate 10. The first encapsulation sublayer 61 covers the first sub-part 631 and the spacer layer 62, thereby making the opening 301 a plane, which can provide good support for the first encapsulation sublayer 61 and reduce the bending stress on the first encapsulation sublayer 61.

[0062] Optionally, the spacer layer 62 can be an organic material, such as acrylic, while the first encapsulation layer 61 and the second encapsulation layer 63 can be inorganic materials, such as silicon nitride or silicon oxide. In this embodiment of the invention, the spacer layer 62 is an organic material. To prevent the spacer layer 62 from corroding the cathode layer 50, the second encapsulation layer 63 is first provided to cover the cathode layer 50, thereby improving the bonding yield between the cathode layer 50 and the auxiliary electrode 21.

[0063] In this embodiment of the invention, the sidewall of the spacer layer 30 at the opening 301 is recessed relative to the sidewall of the support portion 41 to form a recess; and the thickness of the second encapsulation sub-layer 63 is less than the thickness of the first encapsulation sub-layer 61, and the thickness of the second encapsulation sub-layer 63 can be controlled to be about 0.1 micrometers. As a result, the second encapsulation sub-layer 63 cannot be continuously filmed at the recess in the opening 301, so as to be separated into the first sub-part 631 and the second sub-part 632, so as to expose the recess in the opening 301. This allows the spacer sub-layer 62 to completely fill the opening 301 and the recess, and the second sub-part 632 can also cover the cathode layer 50 in the opening 301.

[0064] Furthermore, the first encapsulation sublayer 61 has a relatively large thickness, which can cover the cathode layer 50 and the opening 301 to block water and oxygen.

[0065] It should be noted that the second sub-part 632 is connected to the first sub-part 631 at the location where the opening 301 does not have a support part 41, that is, the second side 3012 of the opening 301, as shown. Figure 3 As shown, the second sub-part 632 extends from the second side 3012 of the opening 301 into the opening 301 to cover the cathode layer 50.

[0066] Furthermore, the display panel also includes a second encapsulation layer disposed on the side of the first encapsulation layer away from the substrate 10, and the second encapsulation layer at least covers the display area 101. The second encapsulation layer may include a first inorganic sublayer, an organic sublayer, and a second inorganic sublayer stacked on the first encapsulation layer to encapsulate the display panel. It can be understood that the first encapsulation layer can be regarded as encapsulating the connection between the cathode layer 50 and the auxiliary electrode 21, while the second encapsulation layer mainly encapsulates the entire display panel, which is a conventional encapsulation layer in an OLED display panel. Therefore, the structure of the second encapsulation layer can be implemented by conventional means and is not limited here.

[0067] In summary, the embodiments of the present invention improve the flatness of the film layer at the opening 301 by filling at least the spacer layer 62 in the opening 301 of the bending sub-region 1011, thereby providing effective support for the first encapsulation sub-layer 61 covering the opening 301. As a result, when the display panel is bent, the bending stress on the first encapsulation sub-layer 61 can be reduced, improving the encapsulation effect and increasing the yield of the display panel.

[0068] In addition, this embodiment of the invention also provides a method for manufacturing the display panel described in the above embodiments, please refer to... Figure 2 , Figure 7 , Figures 8 to 11 The display panel includes a display area 101, which includes a bent sub-area 1011. The method for manufacturing the display panel includes the following steps:

[0069] S10. A conductive layer 20 is formed on the substrate 10. The conductive layer 20 includes at least one auxiliary electrode 21 formed in the display area 101.

[0070] A substrate 10 is provided, and a display functional layer 70 and a conductive layer 20 are sequentially formed on the substrate 10.

[0071] The conductive layer 20 includes at least one auxiliary electrode 21 formed in the display area 101.

[0072] S20. A spacer layer 30 is formed on the side of the conductive layer 20 away from the substrate 10. The spacer layer 30 includes at least one opening 301, and the opening 301 is correspondingly disposed with an auxiliary electrode 21 to expose the upper surface of the corresponding auxiliary electrode 21.

[0073] S30. A support layer 40 is formed on the side of the spacer layer 30 away from the conductive layer 20. The support layer 40 includes at least one support portion 41, and each opening 301 is provided with at least one support portion 41. The support portion 41 is provided on the spacer layer 30 and extends partially above the corresponding opening 301.

[0074] It should be noted that the support part 41 can be provided on one or more sides of the opening 301, but it is necessary to ensure that the periphery of the opening 301 is not completely surrounded by the support part 41, so that the subsequent light-emitting layer 80 and cathode layer 50 can extend into the opening 301, and the cathode layer 50 can overlap with the auxiliary electrode 21 in the opening 301.

[0075] S40. A light-emitting layer 80 is formed on the side of the support layer 40 away from the spacer layer 30, and part of the light-emitting layer 80 extends into the opening 301.

[0076] S50, a cathode layer 50 is formed on the side of the light-emitting layer 80 away from the support layer 40, and the cathode layer 50 extends into the opening 301 to cover the light-emitting layer 80 located in the opening 301 and overlaps with the auxiliary electrode 21.

[0077] A light-emitting layer 80 and a cathode layer 50 are sequentially formed on the support layer 40, and the cathode layer 50 at least covers the display area 101 and extends outside the display area 101 to be electrically connected to the signal terminal.

[0078] The light-emitting layer 80 and the cathode layer 50 are separated above the opening 301 where the support portion 41 is provided. The light-emitting layer 80 and the cathode layer 50 extend into the opening 301 above the opening 301 where the support portion 41 is not provided. Inside the opening 301, the cathode layer 50 covers the light-emitting layer 80 and extends below the support portion 41, overlapping with the auxiliary electrode 21. On the other hand, the auxiliary electrode 21 can also be electrically connected to the signal terminal outside the display area 101 via a signal, so as to realize the parallel connection of the auxiliary electrode 21 and the cathode layer 50.

[0079] S60. A first encapsulation layer is formed on the side of the cathode layer 50 away from the light-emitting layer 80. The first encapsulation layer includes a first encapsulation sub-layer 61 formed at least in the display area 101 and a spacer layer 62 located at least in the bending sub-area 1011 and filling the opening 301. The first encapsulation sub-layer 61 covers the cathode layer 50 and the spacer layer 62.

[0080] A second encapsulation sub-layer 63 is formed on the side of the cathode layer 50 away from the support layer 40. The second encapsulation sub-layer 63 is separated at the position where the support portion 41 is provided above the opening 301, and extends into the opening 301 from the position where the support portion 41 is not provided, so as to cover the cathode layer 50.

[0081] Next, ink 91 can be formed in the opening 301 using an inkjet printer, so that the ink 91 completely fills the opening 301. After the ink 91 solidifies, a spacer layer 62 is formed, and the spacer layer 62 covers the auxiliary electrode 21 and the second encapsulation layer 63. The spacer layer 62 can completely fill the opening 301.

[0082] A first encapsulation sublayer 61 is formed on the second encapsulation sublayer 63 and the spacer sublayer 62, and the first encapsulation sublayer 61 covers the second encapsulation sublayer 63 and covers the spacer sublayer 62 at the opening 301.

[0083] A second encapsulation layer can then be formed on top of the first encapsulation layer to further encapsulate the display panel.

[0084] In addition, embodiments of the present invention also provide a display device, and the display device further includes a frame of the display panel described in the above embodiments, and the display panel is disposed within the frame.

[0085] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0086] The above provides a detailed description of a display panel and its manufacturing method according to embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of the present invention. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel, characterized in that, The display panel includes a display area, which includes a bent sub-area, and the display panel further includes: substrate; A conductive layer is disposed on the substrate and includes at least one auxiliary electrode distributed within the display area; A spacer layer is disposed on the side of the conductive layer away from the substrate. The spacer layer includes at least one opening, and one of the openings is disposed corresponding to one of the auxiliary electrodes to expose the upper surface of the corresponding auxiliary electrode. A support layer is disposed on the side of the spacer layer away from the conductive layer, and includes at least one support portion, and each opening is provided corresponding to at least one support portion, the support portion being disposed on the spacer layer and partially extending above the corresponding opening; A light-emitting layer is disposed on the side of the support layer away from the spacer layer and extends partially into the opening; A cathode layer is disposed on the side of the light-emitting layer away from the support layer, and the cathode layer extends into the opening to cover the light-emitting layer located in the opening, and overlaps with the auxiliary electrode; The first encapsulation layer includes a first encapsulation sublayer located at least within the display area, a second encapsulation sublayer disposed between the cathode layer and the first encapsulation sublayer, and a spacer sublayer located at least within the bending sub-region and filling the opening. The first encapsulation sublayer covers the cathode layer and the spacer sublayer. The second encapsulation sublayer includes a first sub-part covering a portion of the cathode layer and the support portion outside the opening, and the distance from the surface of the spacer layer away from the substrate to the substrate is equal to the distance from the surface of the first sub-part located on the support portion away from the substrate to the substrate.

2. The display panel according to claim 1, characterized in that, The second encapsulation sublayer also includes a second sub-part extending into the opening and covering the cathode layer, the spacer sublayer filling the opening and covering the second sub-part.

3. The display panel according to claim 2, characterized in that, The opening includes at least one first side and at least one second side. Each of the support portions is disposed on the first side of the corresponding opening and extends from the first side to above the opening. The cathode layer extends from the second side of the opening into the opening and overlaps with the auxiliary electrode. The second sub-portion is connected to the first sub-portion and extends from the second side into the opening and covers the cathode layer.

4. The display panel according to claim 1, characterized in that, The thickness of the second encapsulation sublayer is less than the thickness of the first encapsulation sublayer.

5. The display panel according to claim 1, characterized in that, The material of the spacer layer includes organic materials, while the materials of the first encapsulation layer and the second encapsulation layer include inorganic materials.

6. The display panel according to claim 1, characterized in that, The spacer layer is distributed within the display area and fills each of the openings. Within the display area, the first encapsulation layer covers the cathode layer and the spacer layer.

7. The display panel according to claim 1, characterized in that, The display panel further includes a plurality of thin-film transistors disposed between the substrate and the spacer layer and distributed within the display area. The conductive layer further includes the source and drain of the thin-film transistors. The support layer further includes signal terminals disposed outside the display area, and the signal terminals are electrically connected to the cathode layer.

8. The display panel according to claim 1, characterized in that, The display panel further includes a second encapsulation layer disposed on the side of the first encapsulation layer away from the cathode layer, and the second encapsulation layer at least covers the display area. The second encapsulation layer includes a first inorganic sublayer, an organic sublayer, and a second inorganic sublayer stacked on the first encapsulation layer.

9. A method for manufacturing a display panel, characterized in that, The display panel includes a display area, the display area includes a bent sub-area, and the method for manufacturing the display panel includes the following steps: A conductive layer is formed on a substrate, the conductive layer including at least one auxiliary electrode formed in the display area; A spacer layer is formed on the side of the conductive layer away from the substrate. The spacer layer includes at least one opening, and one of the openings is disposed corresponding to one of the auxiliary electrodes to expose the upper surface of the corresponding auxiliary electrode. A support layer is formed on the side of the spacer layer away from the conductive layer. The support layer includes at least one support portion, and each opening is provided with at least one support portion. The support portion is provided on the spacer layer and extends partially above the corresponding opening. A light-emitting layer is formed on the side of the support layer away from the spacer layer, and the light-emitting layer extends partially into the opening; A cathode layer is formed on the side of the light-emitting layer away from the support layer, and the cathode layer extends into the opening to cover the light-emitting layer located in the opening and overlaps with the auxiliary electrode; A first encapsulation layer is formed on the side of the cathode layer away from the light-emitting layer. The first encapsulation layer includes a first encapsulation sub-layer formed at least in the display area and a spacer layer located at least in the bending sub-area and filling the opening. The first encapsulation sub-layer covers the cathode layer and the spacer layer. The step of forming a first encapsulation layer on the side of the cathode layer away from the light-emitting layer includes: A second encapsulation sublayer is formed on the side of the cathode layer away from the support layer. The second encapsulation sublayer includes a portion of the cathode layer covering the opening and a first sub-part of the support portion. The distance from the surface of the spacer sublayer away from the substrate to the substrate is equal to the distance from the surface of the first sub-part on the support portion away from the substrate to the substrate.