Polisher, method for dressing a polishing pad, and method for manufacturing a glass substrate
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AGC INC
- Filing Date
- 2022-01-12
- Publication Date
- 2026-06-16
Smart Images
Figure CN114800277B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a dresser for dressing polishing pads, a dressing method using the dresser, and a method for manufacturing a glass substrate using the dresser. Background Technology
[0002] For example, the surface of a glass substrate used in flat panel displays (FPDs) such as LCDs (Liquid Crystal Displays) and OLEDs (Organic Light-Emitting Diodes) is polished using a polishing apparatus. For instance, Patent Document 1 describes a method for polishing the surface of a glass substrate using a polishing pad and a slurry.
[0003] The polishing pad has numerous micropores or grooves (hereinafter referred to as "micropores") that hold abrasive grains dispersed in the slurry. Polishing is performed using abrasive grains held on the polishing surface of the polishing pad through these micropores. However, when polishing a glass substrate repeatedly, blockages occur in the micropores on the polishing surface of the polishing pad. As a result, the polishing accuracy and efficiency of the glass substrate decrease, leading to situations such as uneven surface of the glass substrate or excessively long polishing time.
[0004] Therefore, after grinding a specified number of glass substrates, a dressing device or the like, to which diamond microparticles have been electrodeposited, is brought into contact with the grinding surface of the grinding pad to remove the area on the grinding surface of the grinding pad intended for grinding the glass substrates, thereby eliminating blockage. Patent Document 2 discloses a diamond dressing device that electrodeposits diamond microparticles to form an abrasive layer, and a brush dressing device composed of a brush.
[0005] Prior art literature
[0006] Patent documents
[0007] Patent Document 1: Japanese Patent Application Publication No. 2004-122351
[0008] Patent Document 2: Japanese Patent Application Publication No. 11-333698 Summary of the Invention
[0009] The problem that the invention aims to solve
[0010] However, the diamond dresser described in Patent Document 2 has the problem of shortening the service life of the abrasive pad because it grinds away the surface of the abrasive pad. In particular, for suede-type abrasive pads with a polyurethane foam layer (hereinafter also referred to as "NAP layer") on the abrasive surface, the NAP layer is easily ground away by the diamond dresser, thus shortening the service life of the abrasive pad.
[0011] Furthermore, while using a brush trimmer to remove clogging material from the micropores of the polishing pad makes it difficult to grind the surface of the pad, it suffers from the problem of not reliably removing clogging material accumulated in the micropores. Moreover, in the case of a suede-type polishing pad, the NAP layer on the polishing surface is damaged, creating unevenness on the polishing surface. This can lead to problems such as insufficient reduction of the surface roughness and waviness of the polished glass substrate, or uneven surface roughness of the polished glass substrate.
[0012] Furthermore, the inventors discovered that when using the circular flat-plate dresser disclosed in Patent Document 2, the precision of removing clogging material from the grinding surface tends to be uneven. This can be attributed to the fact that the contact time between the grinding pad and the dresser varies depending on the location.
[0013] For example, when using a circular flat-plate dresser and rotating the polishing pad relative to it, the contact time between the polishing pad and the dresser differs at the center and the outer periphery of the polishing pad. Therefore, if, for example, the contact time between the polishing pad and the dresser is shorter at the outer periphery compared to the contact time at the center of the polishing pad, problems may arise where the clogging material at the center of the polishing pad is removed, but the clogging material at the outer periphery is not.
[0014] The purpose of this invention is to provide a dressing device and dressing method that can suppress damage to the grinding surface of the grinding pad or cause unevenness and roughness, remove clogging material on the grinding surface of the grinding pad, and uniformly dress the grinding surface of the grinding pad.
[0015] Technical solutions for solving the problem
[0016] (1) The trimmer of the present invention is characterized in that it has: a cylindrical main body having a curved surface; and a trimming part formed on the curved surface of the main body, the trimming part having a height of more than 1.0 mm and less than 30 mm from the curved surface of the main body.
[0017] (2) The trimmer according to (1), wherein the trimming part is formed in a spiral shape along the curved surface of the main body, and the trimming part is formed with a lead angle of 10° or more and 80° or less relative to a direction perpendicular to the axial direction of the main body.
[0018] (3) The trimmer according to (2), wherein the number of trimmers formed in a spiral shape along the curved surface of the main body is 3 or more and 30 or less.
[0019] (4) The trimmer according to (2) or (3), wherein the pitch of the trimmer in the axial direction of the main body is 10 mm or more and 200 mm or less.
[0020] (5) The trimmer according to any one of (2) to (4), wherein the width of the trimmer in the direction perpendicular to the extension direction of the trimmer is 1.0 mm or more and 25 mm or less.
[0021] (6) The trimmer according to any one of (1) to (5), wherein the axial length of the main body is 1500 mm or more and 5500 mm or less.
[0022] (7) The trimmer according to any one of (1) to (6), wherein the diameter of the main body is 30 mm or more and 200 mm or less.
[0023] (8) The dressing device according to any one of (1) to (7), wherein the dressing part has an end face that abuts against the grinding surface of the grinding pad during dressing and a side face that connects the end face to the main body, and a chamfer is formed between the end face and the side face.
[0024] (9) The dressing device according to any one of (1) to (8), wherein the dressing part has an end face that abuts against the grinding surface of the grinding pad during dressing and a side face that connects the end face to the main body, and the end face of the dressing part has a recess.
[0025] (10) The trimmer according to (9), wherein the depth of the recess is more than 0.1 mm and less than 0.8 mm.
[0026] (11) A method for dressing an abrasive pad, wherein the dressing method uses the dressing device described in (1) to (10) to dress the abrasive surface of the abrasive pad, characterized in that, while the dressing part is brought into contact with the abrasive surface of the abrasive pad, the dressing device is rotated about the central axis of the main body as the rotation axis, and the abrasive surface of the abrasive pad is dressed by moving the dressing device relative to the abrasive pad.
[0027] (12) The grinding pad dressing method according to (11) wherein the grinding surface of the grinding pad is dressed while the dressing device is oscillating along the axial direction of the main body.
[0028] (13) The method for dressing the abrasive pad according to (11) or (12) wherein the abrasive surface of the abrasive pad is dressed while slurry is supplied to the abrasive surface of the abrasive pad.
[0029] (14) A method for manufacturing a glass substrate, comprising a grinding step of grinding the glass substrate using a grinding pad, wherein the grinding pad is a grinding pad that has been dressed using a dressing device of any one of (1) to (10).
[0030] (15) The method for manufacturing a glass substrate according to (14), wherein the glass substrate is for use in a display.
[0031] Invention Effects
[0032] According to the present invention, a dresser and dressing method are provided that can suppress damage to the grinding surface of the grinding pad or roughen the grinding surface of the grinding pad and remove clogging material on the grinding surface of the grinding pad, and can uniformly dress the grinding surface of the grinding pad. Attached Figure Description
[0033] Figure 1 This is a top view showing the first embodiment.
[0034] Figure 2 yes Figure 1 Sectional view 2-2.
[0035] Figure 3 yes Figure 1 Enlarged view of the trimmed part in section view 2-2.
[0036] Figure 4 This is a top view showing a modified example of the first embodiment.
[0037] Figure 5 This is a top view showing the second embodiment.
[0038] Figure 6 yes Figure 5 Sectional view 6-6.
[0039] Figure 7 This is a top view showing the third embodiment.
[0040] Figure 8 yes Figure 7 Sectional view 8-8.
[0041] Figure 9 This is a top view showing the fourth embodiment.
[0042] Figure 10 This is a top view showing a modified example of the fourth embodiment.
[0043] Figure 11 This is a top view showing the fifth embodiment.
[0044] Figure 12 This is a conceptual diagram illustrating the principle of removing blockages using the trimmer of the present invention.
[0045] Figure 13 This is a top view of the dressing method using the dressing device shown in the first embodiment.
[0046] Figure 14 This is a side view of a trimming method using the trimmer shown in the first embodiment. Detailed Implementation
[0047] Hereinafter, embodiments of the present invention will be described together with illustrated examples.
[0048] Figures 1 to 11 This is a conceptual diagram illustrating the trimmer of the present invention. Figure 12 This is a conceptual diagram illustrating the principle of removing blockages using the dressing device of the present invention. Figure 13 as well as Figure 14 This is a conceptual diagram representing the trimming method. In Figure 13 as well as Figure 14 In China, use Figure 1 The first embodiment of the trimmer is illustrated.
[0049] Figures 1 to 11 This is a conceptual diagram related to a dresser used when dressing a polishing pad for grinding a glass substrate. The glass substrate is used in flat panel displays (FPDs) such as LCDs (Liquid Crystal Displays) and OLEDs (Organic Light-Emitting Diodes).
[0050] The trimmer of the present invention has a cylindrical main body with a curved surface, and a trimming part formed on the curved surface of the main body. It should be noted that, in this specification, the axial direction of the cylindrical main body is referred to as the X-direction, and the direction perpendicular to the axial direction is referred to as the Y-direction.
[0051] (First Implementation)
[0052] like Figure 1 As shown, in the first embodiment, the trimming portion 14 is formed in a spiral shape along the curved surface of the main body portion 12. In the first embodiment, the number of threads, pitch P, lead L, and lead angle α are defined as follows.
[0053] (Number of items)
[0054] In the first embodiment, the number of threads refers to the number of trimming portions 14 formed in a spiral shape along the curved surface of the main body portion 12. Figure 1 The trimmer 10 shown has 3 sections. Therefore, it is cut with section plane 2-2. Figure 1In the case of the trimmer 10 shown, such as Figure 2 As shown, trimming portions 14 are formed at three points on the curved surface of the main body 12.
[0055] The more stripes there are, the better the removal performance of clogging substances from the abrasive pad. Therefore, the number of stripes is preferably 3 or more, more preferably 5 or more, and even more preferably 10 or more. When the number of stripes is too large, the trimmed portions 14 on the curved surface of the main body 12 are too densely packed, and the removal performance may decrease. Therefore, the number of stripes is preferably 30 or less, more preferably 25 or less, and even more preferably 20 or less.
[0056] (Pitch P)
[0057] In the first embodiment, the pitch P refers to the distance in the X direction of the trimming portion 14, which is formed in a spiral shape along the curved surface of the main body portion 12. A smaller pitch P means that the trimming portion 14 is formed more densely on the curved surface of the main body portion 12. When the pitch P is too small, the trimming portion 14 is too densely distributed on the curved surface of the main body portion 12, which may reduce the removal performance of the clogging material. Therefore, the pitch P is preferably 10 mm or more, more preferably 15 mm or more, and even more preferably 20 mm or more. Furthermore, when the pitch P is too large, the number of contacts between the trimming portion 14 and the abrasive surface of the abrasive pad decreases during trimming, which may reduce the removal performance of the clogging material. Therefore, the pitch P is preferably 200 mm or less, more preferably 100 mm or less, and even more preferably 50 mm or less.
[0058] (Lead L)
[0059] In the first embodiment, the lead L refers to the distance traveled in the X direction by a particular trimming part 14 when it completes one revolution around the cylindrical surface of the main body 12, among one or more trimming parts 14 formed in a spiral shape along the curved surface of the main body 12. Therefore, in the case of a trimmer with one trimmer, the lead L and the pitch P are the same; however, when the number of trimmers is not one, they are not the same, and the lead L becomes the product of the number of trimmers and the pitch P. Therefore, the lead L is determined by the number of trimmers and the pitch P, and is not particularly limited.
[0060] (Lead angle α)
[0061] In the first embodiment, the lead angle α refers to an acute angle α (0° < α < 90°) formed by the trimming portion 14 and the direction perpendicular to the axial direction of the main body portion 12 (Y direction). When the lead angle α is too small, the removal performance of the clogging material decreases. Therefore, the lead angle α is preferably 10° or more, more preferably 20° or more, even more preferably 30° or more, and particularly preferably 40° or more. Furthermore, when the lead angle α is too large, the removal performance of the clogging material also decreases. Therefore, the lead angle α is preferably 80° or less, more preferably 70° or less, even more preferably 60° or less, and particularly preferably 50° or less.
[0062] (Main Body)
[0063] The main body 12 of the trimmer 10 of the present invention is a cylindrical shape with a curved surface. The material of the main body 12 is not particularly limited, for example, it is stainless steel. Furthermore, the main body 12 may also be hollow. By forming a hollow structure, the trimmer can be made lightweight and can be driven with less power.
[0064] When the diameter of the main body 12 is large, a plurality of trimming portions 14 can be formed on the curved surface of the main body 12, thus improving the removal performance of blockage material per rotation of the trimmer 10. Therefore, the diameter of the main body 12 is preferably 20 mm or more, more preferably 40 mm or more, further preferably 60 mm or more, and particularly preferably 80 mm or more. If the diameter of the main body 12 is small, the trimmer 10 of the present invention can be driven to rotate with less power, and the trimming device using the trimmer 10 of the present invention can be simplified. Therefore, the diameter of the main body 12 is preferably 300 mm or less, more preferably 200 mm or less, further preferably 150 mm or less, and particularly preferably 120 mm or less.
[0065] When the polishing pad is circular, the axial length of the main body 12 is preferably longer than the diameter of the polishing pad. When the polishing pad is rectangular, the axial length of the main body 12 is preferably longer than at least one side of the rectangular polishing pad. This allows the polishing surface to be finished in one pass, thus improving polishing efficiency. The axial length of the main body 12 can be appropriately adjusted according to the size of the polishing pad being finished, but is, for example, between 1500 mm and 5500 mm.
[0066] (Repair Department)
[0067] The trimming part 14 is a protrusion formed on the curved surface of the main body part 12, and is the part used to trim the grinding pad. Figure 3 The text shows that... Figure 2The image shows an enlarged view of the trimming portion 14. The trimming portion 14 has an end face 16 that abuts against the abrasive surface of the abrasive pad during trimming, and a side face 18 that connects the end face 16 to the main body portion 12. Furthermore, a chamfered portion 20 may be formed between the end face 16 and the side face 18.
[0068] The trimming part 14 can be made of a different material than the main body 12, but from the perspective of ease of processing, it is preferable to use the same material. For example, the trimming part 14 can be made of stainless steel.
[0069] If the height H of the trimming portion 14 is too low, it is difficult to remove the clogging material from the abrasive pad. Therefore, the height H of the trimming portion 14 is 1.0 mm or more, preferably 2.0 mm or more, more preferably 3.0 mm or more, and even more preferably 5.0 mm or more. Furthermore, when the height H of the trimming portion 14 is too high, when removing the clogging material, force is applied near the main body 12 of the trimming portion 14, which may cause the trimming portion 14 to deform. Therefore, the height H of the trimming portion 14 is 30 mm or less, preferably 20 mm or less, more preferably 15 mm or less, and even more preferably 10 mm or less.
[0070] In the first embodiment, the width W of the trimming portion 14 is measured in a direction perpendicular to the extending direction of the trimming portion 14 (the direction in which the lead angle α is tilted from the Y direction). When the width W of the trimming portion 14 is too small, the strength decreases, and the trimming portion 14 may deform. Therefore, the width W of the trimming portion 14 is preferably 1.0 mm or more, more preferably 2.0 mm or more, and even more preferably 3.0 mm or more. Furthermore, when the width W of the trimming portion 14 is small, the pressure applied when pressing against the abrasive pad increases, thereby improving the removal performance of clogging substances. Therefore, the width W of the trimming portion 14 is preferably 15 mm or less, more preferably 10 mm or less, even more preferably 8.0 mm or less, and particularly preferably 5.0 mm or less.
[0071] In the first embodiment, the aspect ratio H / W (dimensionless) of the trimmed portion 14, which is the height H divided by the width W, is preferably 5.0 or less, more preferably 3.0 or less, and particularly preferably 2.0 or less. By having an aspect ratio below the aforementioned upper limit, the trimmed portion is less prone to deformation. Furthermore, the aspect ratio is preferably 0.1 or more, more preferably 0.5 or more, and even more preferably 1.0 or more.
[0072] Furthermore, the corner formed by the end face 16 and the side face 18 of the trimming portion 14 is preferably chamfered. In this case, a chamfered portion 20 is formed between the end face 16 and the side face 18. The chamfered portion 20 is preferably a C-shaped chamfer or a R-shaped chamfer. By chamfering the corner, it is possible to suppress the generation of unevenness on the polishing surface of the polishing pad during trimming. This is particularly effective when used with suede-type polishing pads on which a NAP layer is formed on the polishing surface.
[0073] Both C-shaped and R-shaped chamfers are sufficient to remove the corners formed by the end face and side face of the trimmed part. Therefore, in the case of a C-shaped chamfer, the chamfer depth is, for example, 0.3 mm to 1.0 mm. A C-shaped chamfer is easier to process and is therefore preferred. An R-shaped chamfer results in a smooth shape, which further suppresses the generation of unevenness on the grinding surface of the grinding pad during trimming.
[0074] (A variation of the first embodiment)
[0075] Figure 4 A variation of the first embodiment is shown in the figure. Figure 4 The trimmer 10 described herein has a recess 22 on the end face 16 of the trimming part 14.
[0076] (The concave part of the end face of the trimming section)
[0077] exist Figure 4 In this structure, the recess 22 is formed along the width direction of the trimming portion 14, but its orientation is not limited; for example, it may be formed along the axial direction of the cylindrical main body portion 12. By forming the recess 22 on the end face 16 of the trimming portion, the removal performance of the clogging material is improved. The width of the recess 22 is preferably 0.1 mm or more, more preferably 0.3 mm or more, and even more preferably 0.5 mm or more. If it is above the lower limit value, the removal performance of the clogging material based on the recess 22 is improved. Furthermore, the width of the recess 22 is preferably 2.0 mm or less, more preferably 1.5 mm or less, and even more preferably 1.2 mm or less.
[0078] Furthermore, the depth of the recess 22 is preferably 0.1 mm or more, more preferably 0.2 mm or more, and even more preferably 0.3 mm or more. If the depth is above or below the aforementioned lower limit, an improvement in the removal performance of the clogging material based on the recess 22 is expected. Furthermore, the depth of the recess 22 is preferably 0.8 mm or less, more preferably 0.7 mm or less, and even more preferably 0.6 mm or less.
[0079] When the distance between adjacent recesses 22 is too small, the strength of the trimming portion 14 may decrease. Therefore, the distance between adjacent recesses 22 is preferably 1.0 mm or more, more preferably 2.0 mm or more, and even more preferably 3.0 mm or more. Furthermore, when the distance between adjacent recesses 22 is too large, an improvement in removal performance based on the recesses 22 cannot be expected. Therefore, the distance between adjacent recesses 22 is preferably 50 mm or less, more preferably 30 mm or less, and even more preferably 20 mm or less.
[0080] The following describes the trimmer according to the second to fifth embodiments. The trimmers of the second to fifth embodiments differ from the trimmers of the first embodiment in the shape of the trimming part. Except for the shape of the trimming part, the main body, the height and width of the trimming part, and the chamfer of the corner formed by the end face and the side face are the same as those of the trimmers of the first embodiment in the trimmers described in the second to fifth embodiments.
[0081] (Second Implementation)
[0082] Figure 5 The image shows a trimmer 10 according to a second embodiment. The trimming portions 14 of the trimmer 10 of the second embodiment are formed parallel to the axial direction (X direction) of the main body 12. The trimmer 10 of the second embodiment has a plurality of trimming portions 14 on the curved surface of the main body 12. The plurality of trimming portions 14 are formed in a stripe pattern. The number of trimming portions 14 is not particularly limited, for example, it is 3 or more and 30 or less. Figure 6 This is a 6-6 sectional view of the trimmer 10 according to the second embodiment. Figure 6 The described trimmer 10 has eight trimming sections 14.
[0083] Furthermore, in the case of the trimmer 10 of the second embodiment, the width W of the trimming portion 14 is measured in a direction perpendicular to the axial direction of the main body portion 12. In the trimmer 10 of the second embodiment, a recess 22 is also provided on the end face 16 of the trimming portion 14 (see reference). Figure 4 And we can expect improved performance in removing blockage substances.
[0084] (Third Implementation)
[0085] Figure 7 The dressing device 10 of the third embodiment is shown. The dressing portion 14 of the dressing device 10 of the third embodiment is formed in a zigzag shape on the curved surface of the main body portion 12. In addition to the zigzag shape, it can also be formed in a wavy shape, such as a sine curve. If it is a wavy shape like a sine curve, there are fewer corners compared to the zigzag shape, so damage to the abrasive surface of the abrasive pad can be suppressed. Figure 8 This is a cross-sectional view of the trimmer 10 according to the third embodiment. Figure 8 The trimmer 10 has six trimming portions 14. In the trimmer 10 of the third embodiment, a recess 22 is also provided on the end face 16 of the trimming portion 14 (see reference). Figure 4 And we can expect improved performance in removing blockage substances.
[0086] (Fourth Implementation)
[0087] Figure 9 The image shows a trimmer 10 according to a fourth embodiment. The trimming portions 14 of the trimmer 10 of the fourth embodiment are formed in a grid pattern on the curved surface of the main body 12. The size of each trimming portion 14 is, for example, a rectangle with one side measuring 3.0 mm or more and 30 mm or less. Furthermore, the shape of each trimming portion 14 is not limited to a rectangular shape. Figure 10 As shown, it can also be Figure 9 The shape of each trimming portion 14 shown is changed from rectangular to circular. That is, the trimming portion 14 can also be formed in the shape of a water droplet. The diameter of the circular trimming portion 14 is not particularly limited, for example, it is 3.0 mm or more and 30 mm or less. In the trimmer 10 of the fourth embodiment, a recess 22 is also provided on the end face 16 of the trimming portion 14 (see reference). Figure 4 And we can expect improved performance in removing blockage substances.
[0088] (Fifth Implementation)
[0089] Figure 11 The trimming portion 14 of the trimmer 10 described herein is formed in a mesh shape. The width of the trimming portion 14 forming the mesh is preferably 1.0 mm or more, more preferably 2.0 mm or more, and even more preferably 3.0 mm or more. If it is at or above the aforementioned lower limit, deformation of the trimming portion 14 can be prevented. Furthermore, the width W of the trimming portion 14 is preferably 15 mm or less, more preferably 10 mm or less, even more preferably 8.0 mm or less, and particularly preferably 5.0 mm or less. When the width W of the trimming portion 14 is smaller, the pressure applied when pressing against the abrasive pad becomes higher, thus improving the removal performance of clogging substances. In the trimmer 10 of the fifth embodiment, a recess 22 is also provided on the end face 16 of the trimming portion 14 (see reference). Figure 4 And we can expect improved performance in removing blockage substances.
[0090] (Based on the principle of removing clogging material from the dressing device shown in the embodiments of the present invention)
[0091] Figure 12This diagram conceptually illustrates the principle of removing blockage material 26 from the trimmer 10 based on the present invention. The abrasive pad 28 is made of, for example, synthetic resin fibers, nonwoven fabric, or polyurethane, and is a porous material having many micropores 24. Abrasive grains from the slurry are retained in the micropores 24, and the glass substrate is abraded by pressing it against the abrasive surface of the abrasive pad 28.
[0092] However, as the grinding operation proceeds, abrasive grains and grinding debris that reduce grinding ability become clogged in the micropores 24 of the grinding pad 28, making it impossible to maintain the supply of new abrasive grains. Therefore, the grinding pad 28 is dressed by the dresser 10 after grinding, for example, a predetermined number of glass substrates.
[0093] like Figure 12 (a) to Figure 12 As shown in (c), the clogging material 26 of the micropores 24 is removed by pressing the protrusion forming the micropores 24 from the side direction of the protrusion using the trimming part 14. At this time, the height H of the curved surface of the trimming part 14 from the main body part 12 (refer to...) Figure 3 The diameter is 1.0 mm or more, which allows the clogging material 26 to be removed from the micropores 24 of the polishing pad 28. Furthermore, the trimmer 10 moves relative to the polishing pad 28, so the trimming part 14 presses against adjacent protrusions in sequence. Finally, the clogging material 26 is removed from the micropores 24 from the entire surface of the polishing pad.
[0094] (A dressing method for a dressing device based on an embodiment of the present invention)
[0095] The dressing of the abrasive pad based on the dressing device of the present invention is performed as follows. Abrasive pad 28 as... Figure 13 As shown, it is located in the XY plane. The trimmer 10 is positioned above the polishing surface of the polishing pad 28, on which a predetermined number of glass substrates have been polished, and the trimmer 14 comes into contact with the polishing surface of the polishing pad 28. Next, the trimmer 10 is rotated about the central axis of the main body 12 and moved from one end of the polishing pad 28 toward the other end (in the direction of arrow A). The direction of movement is orthogonal to the axial direction of the main body 12. At this time, slurry 32 can also be supplied to the polishing surface of the polishing pad 28 from the slurry supply section 30. By trimming while supplying slurry 32, the clogging substance 26 can be removed efficiently. Cerium oxide is used as the slurry 32, for example.
[0096] Furthermore, the trimmer 10 can be swung along the axial direction (arrow B direction) of the main body 12 while trimming. This allows for efficient removal of the clogging material 26.
[0097] At the contact point between the dresser 10 and the abrasive pad 28, the rotation direction of the dresser 10 (arrow C direction) is preferably the same as the travel direction of the dresser 10 relative to the abrasive pad 28 (arrow A direction). As a result, the dressing part 14 can easily press the side of the protrusion of the abrasive surface of the abrasive pad 28, thus efficiently removing the clogging substance 26.
[0098] Alternatively, after moving the trimmer 10 from one end of the polishing pad 28 to the other, the trimmer 14 can be separated from the polishing pad 28, and trimming can be performed again after rotating the polishing pad 28 and the trimmer 10 relative to each other in the XY plane. By rotating the polishing pad 28 and the trimmer 10 relative to each other in the XY plane and trimming the polishing pad 28 from multiple directions, the clogging material 26 of the polishing pad 28 can be reliably removed. That is, for example, in Figure 13 When using a circular abrasive pad 28, rotate the abrasive pad 28 around point O.
[0099] According to the above structure, it is possible to suppress damage to the grinding surface of the grinding pad 28 or to roughen the grinding surface of the grinding pad 28, and to remove the clogging material 26 on the grinding surface of the grinding pad 28, and to uniformly finish the grinding surface of the grinding pad 28.
[0100] Label Explanation
[0101] 10… Dresser;
[0102] 12…Main body;
[0103] 14…Repair Department;
[0104] 16…end face;
[0105] 18…side view;
[0106] 20… Chamfered edge;
[0107] 22…concave;
[0108] 24…micropores;
[0109] 26…blocking substances;
[0110] 28…abrasive pad;
[0111] 30…Slurry Supply Department;
[0112] 32…slurry;
[0113] 34…Injection nozzle.
Claims
1. A dressing device for dressing the grinding surface of a grinding pad, characterized in that, have: The main body is cylindrical and has curved surfaces; and The trimming section is formed on the curved surface of the main body. The trimming part has a height of 1.0 mm or more and 30 mm or less from the curved surface of the main body. The trimming part has an end face that abuts against the grinding surface of the grinding pad during trimming and a side face that connects the end face to the main body. A chamfer is formed between the end face and the side face. The end face of the trimming part has a recess.
2. The trimmer according to claim 1, wherein, The trimming portion is formed in a spiral shape along the curved surface of the main body, and the trimming portion is formed with a lead angle of 10° or more and 80° or less relative to the direction perpendicular to the axis of the main body.
3. The trimmer according to claim 2, wherein, The number of trimming parts that are formed in a spiral shape along the curved surface of the main body is 3 or more and 30 or less.
4. The trimmer according to claim 2 or 3, wherein, The pitch of the trimming part along the axial direction of the main body is 10 mm or more and 200 mm or less.
5. The trimmer according to claim 2 or 3, wherein, The width of the trimming part in the direction perpendicular to the extension direction of the trimming part is more than 1.0 mm and less than 25 mm.
6. The trimmer according to any one of claims 1 to 3, wherein, The axial length of the main body is more than 1500 mm and less than 5500 mm.
7. The trimmer according to any one of claims 1 to 3, wherein, The diameter of the main body is 30 mm or more and 200 mm or less.
8. The trimmer according to any one of claims 1 to 3, wherein, The depth of the recess is greater than 0.1 mm and less than 0.8 mm.
9. A method for preparing an abrasive pad, The dressing method uses the dressing device according to any one of claims 1 to 3 to dress the grinding surface of the grinding pad, characterized in that... While the dressing part is brought into contact with the grinding surface of the grinding pad, the dressing device is rotated about the central axis of the main body. The abrasive surface of the abrasive pad is trimmed by moving the trimmer relative to the abrasive pad.
10. The method for conditioning the abrasive pad according to claim 9, wherein, While swinging the dressing device along the axial direction of the main body, the grinding surface of the grinding pad is dressed.
11. The method for conditioning the abrasive pad according to claim 9, wherein, While supplying slurry to the grinding surface of the grinding pad, the grinding surface of the grinding pad is trimmed.
12. A method for manufacturing a glass substrate, comprising a polishing step of polishing the glass substrate using a polishing pad, wherein the polishing pad is a polishing pad that has been trimmed using a trimmer as described in any one of claims 1 to 3.
13. The method for manufacturing a glass substrate according to claim 12, wherein, The glass substrate is used for displays.