Chemical mechanical polishing system and chemical mechanical polishing method

Abstract

This application provides a chemical mechanical polishing (CMP) system and a CMP method. The CMP system includes: a polishing disc with a polishing pad on its surface; at least two polishing heads disposed on one side of the polishing pad, each polishing head used to fix an object to be polished; a composite support arm disposed on one side of the polishing pad, and a slide rail disposed within the composite support arm; a diamond disc movably connected to the slide rail and movable along the axial direction of the slide rail for trimming the polishing pad; and a polishing fluid supply module disposed on the composite support arm for supplying polishing fluid to the polishing pad. Through the above method, this application enables each polishing disc to correspond to at least two polishing heads for operation, thereby improving production efficiency and reducing hardware costs.

Description

Technical Field

[0001] This application relates to the semiconductor field, and more particularly to a chemical mechanical polishing system and a chemical mechanical polishing method. Background Technology

[0002] Chemical mechanical polishing (CMP) is a process that combines chemical reactions with mechanical polishing. CMP is a crucial process for achieving wafer planarization in integrated circuit manufacturing. As process nodes shrink, the requirements for wafer planarization become increasingly stringent, leading to a surge in the number of CMP processes and mounting pressure on CMP production capacity.

[0003] like Figure 1 As shown, a typical CMP system operates with a single grinding head 12 on a single grinding disc 10. To improve production efficiency, the existing solution is to simultaneously increase the number of grinding discs 10 and grinding heads 12. However, this solution increases the footprint of the CMP system and the corresponding hardware costs. Summary of the Invention

[0004] The first aspect of this application provides a chemical mechanical polishing system, comprising: a polishing disc with a polishing pad disposed on its surface; at least two polishing heads disposed on one side of the polishing pad, each polishing head being used to fix an object to be polished; a composite support arm disposed on one side of the polishing pad, and a slide rail disposed within the composite support arm; a diamond disc movably connected to the slide rail and movable along the axial direction of the slide rail for trimming the polishing pad; and a polishing fluid supply module fixedly disposed on the composite support arm for supplying polishing fluid to the polishing pad.

[0005] In an embodiment of the first aspect of this application, the polishing slurry supply module includes a polishing slurry supply channel and at least two nozzles communicating with the polishing slurry supply channel; wherein each nozzle is capable of forming at least one polishing slurry landing point on the polishing pad.

[0006] In an embodiment of the first aspect of this application, the composite support arm includes a first surface and two first side surfaces connected to the first surface; wherein the first surface faces the grinding pad, the two first side surfaces are arranged radially opposite to each other along the slide rail, and at least one of the first side surfaces is provided with the nozzle.

[0007] In an embodiment of the first aspect of this application, at least two nozzles are provided on at least one of the first side surfaces, arranged at axial intervals along the slide rail.

[0008] In an embodiment of the first aspect of this application, in the axial direction, the length of the slide rail is greater than or equal to the radius of the grinding pad and less than the diameter of the grinding pad; each grinding head corresponds to one composite support arm, and each composite support arm is provided with one diamond disc.

[0009] In an embodiment of the first aspect of this application, the orthographic projection of at least two of the composite support arms onto the grinding pad divides the grinding pad into at least two regions, with a grinding head corresponding to each region.

[0010] In an embodiment of the first aspect of this application, the chemical mechanical polishing system includes two grinding heads and two composite support arms; wherein the two composite support arms are arranged opposite each other along the same diameter direction of the grinding pad to divide the grinding pad into two regions equally along the same diameter direction, and one grinding head is correspondingly arranged in each region.

[0011] In an embodiment of the first aspect of this application, the length of the slide rail is greater than or equal to the diameter of the grinding pad in the axial direction; at least two grinding heads correspond to one composite support arm, and at least two grinding heads are respectively disposed on both sides of the composite support arm; and two diamond discs are disposed on the composite support arm, and nozzles are respectively disposed on the two first side surfaces.

[0012] A second aspect of this application provides a chemical mechanical polishing method utilizing the chemical mechanical polishing system described in any of the above embodiments. The chemical mechanical polishing method includes: having at least two of the polishing heads respectively adsorb an object to be polished and bringing the object to be polished into contact with the polishing pad; driving the polishing disc to rotate and providing polishing fluid to the surface of the polishing pad via a polishing fluid supply module, so that the polishing fluid forms a radiation range on the polishing pad, the radiation range covering the area where the object to be polished is in contact with the polishing pad, the polishing pad polishing the surface of the object to be polished; and the diamond disc finishing the surface of the polishing pad.

[0013] In an embodiment of the second aspect of this application, the abrasive pad simultaneously abrades at least two of the surfaces of the objects to be abraded, and at least two of the diamond discs in the chemical mechanical polishing system simultaneously trim the surface of the abrasive pad. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a CMP system;

[0015] Figure 2 This is a schematic diagram of the structure of the CMP system provided in the embodiments of this application;

[0016] Figure 3for Figure 2 A top view of an embodiment of the composite support arm, the polishing fluid supply module, and the diamond disc;

[0017] Figure 4 for Figure 2 A front view schematic diagram of an embodiment of the composite support arm, the polishing fluid supply module, and the diamond disc;

[0018] Figure 5 This is a schematic diagram of the structure of the CMP system provided in the embodiments of this application;

[0019] Figure 6 for Figure 5 A front view schematic diagram of an embodiment of the composite support arm, the polishing fluid supply module, and the diamond disc;

[0020] Figure 7 This is a schematic flowchart of the chemical mechanical polishing method provided in the embodiments of this application. Detailed Implementation

[0021] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this specification.

[0022] Typically, CMP systems operate with a single grinding head on a single grinding disc. Please refer to [link / reference]. Figure 1 , Figure 1 This is a schematic diagram of a CMP system. A CMP system generally includes a polishing disc 10, a polishing head 12, a polishing slurry supply system 14, and a diamond dresser 16. The polishing disc 10 has a polishing pad 18 on its surface. The CMP system typically operates as follows: the polishing head 12 picks up the object to be polished (e.g., a wafer) and brings its surface into contact with the polishing pad 18; the polishing slurry supply system 14 provides polishing slurry to the surface of the polishing pad 18, which then polishes the object's surface; the diamond dresser 16 tidies up the polishing pad 18 to prevent slurry blockage. Generally, the polishing pad 18 is made of porous foam material, and the polishing slurry contains uniformly dispersed polishing particles with a diameter of approximately 100 nm. During normal operation, these particles become embedded in the pores of the polishing pad 18. After polishing the object, the particles become worn and less sharp, reducing their activity. The diamond dresser 16 is then used to scrape off the worn particles, and the polishing slurry is sprayed on again for polishing. During grinding, the grinding fluid supply system 14 is required to provide fresh grinding fluid, and the diamond dressing tool 16 is also required to scrape off the used grinding particles.

[0023] Specifically, such as Figure 1 As shown, a rotating shaft 13 is provided below the grinding disc 10. The rotating shaft 13 can rotate under the action of the first drive motor (not shown), thereby driving the grinding disc 10 to rotate.

[0024] The CMP system also includes a first drive assembly 11, which is connected to the grinding head 12. The first drive assembly 11 includes a first connecting shaft 110, a grinding head support arm 112 connected to the upper end of the first connecting shaft 110, a grinding head shaft 114 disposed at the end of the grinding head support arm 112 away from the first connecting shaft 112, and a second drive motor (not shown) that rotates the grinding head 12 around its axis. The grinding head shaft 114 is connected to the lower end of the first connecting shaft 112, and the grinding head 12 is connected to the lower end of the grinding head shaft 114. The second drive motor can be disposed in the grinding head support arm 112 and can drive the grinding head shaft 114 to rotate, thereby causing the grinding head 12 to rotate. Furthermore, the first drive assembly 11 may also include a third drive motor (not shown), which is connected to the grinding head support arm 112 and is used to drive the grinding head support arm 112 to swing back and forth at predetermined angles clockwise and counterclockwise around the first connecting shaft 110. Of course, the first drive assembly 11 also includes a first lifting mechanism (not shown) for driving the grinding head 12 toward or away from the grinding disk 10.

[0025] The diamond dressing tool 16 includes a diamond disc 160 and a second drive assembly 162 connected to the diamond disc 160. The second drive assembly 162 includes a second connecting shaft 1620, a diamond disc support arm 1622 connected to the upper end of the second connecting shaft 1620, a diamond disc shaft 1624 disposed at the end of the diamond disc support arm 1622 away from the second connecting shaft 1620, and a fourth drive motor (not shown) that rotates the diamond disc 160 around its axis. The diamond disc 160 is connected to the lower end of the diamond disc shaft 1624. The fourth drive motor can be disposed in the diamond disc support arm 1622, and drives the diamond disc shaft 1624 to rotate, thereby causing the diamond disc 160 to rotate. Furthermore, the second drive assembly 162 may also include a fifth drive motor (not shown), which can be connected to the diamond disc support arm 1622 to drive the diamond disc support arm 1622 to swing back and forth at predetermined angles in a clockwise and counterclockwise direction around the second connecting shaft 1620. Of course, the second drive assembly 162 also includes a second lifting mechanism (not shown) for driving the diamond disc 160 to move toward or away from the grinding disc 10.

[0026] The polishing slurry supply system 14 includes a polishing slurry supply pipe and a nozzle 140 connected to the polishing slurry supply pipe. The polishing slurry sprayed from the nozzle 140 can land at the center of the polishing pad 18. Due to the rotation of the polishing disc 10, the polishing slurry dripping onto the polishing pad 18 can spread evenly under the action of centrifugal force.

[0027] Currently, CMP (Chip Motion Picture Processing) is a key process for achieving wafer planarization in integrated circuit manufacturing. As process nodes shrink, the requirements for wafer planarization become increasingly stringent, leading to a surge in the number of CMP processes and mounting pressure on CMP production capacity. Figure 1 Based on the structure shown, the existing solution to improve production efficiency is to increase the number of grinding discs 10, that is, to still operate a single grinding head 12 on a single grinding disc 10, but only to increase the number of grinding discs 10 and grinding heads 12 simultaneously; however, this solution increases the footprint of the CMP system and the corresponding hardware costs. Therefore, it is necessary to provide a new CMP system that improves production efficiency.

[0028] This application innovatively proposes a method of integrating the polishing slurry supply module and the diamond disc onto the same composite support arm, specifically as follows: Figure 2 As shown, Figure 2 This is a schematic diagram of the CMP system provided in an embodiment of this application. The CMP system of this application includes a polishing disc 20, at least two polishing heads 22, a composite support arm 24, a diamond disc 26, and a polishing slurry supply module 28.

[0029] Specifically, a grinding pad 21 is provided on the surface of the grinding disc 20. Optionally, both the grinding disc 20 and the grinding pad 21 are circular, and the grinding pad 21 can be adhered to the surface of the grinding disc 20 by an adhesive layer. Alternatively, a rotating shaft (not shown) is provided below the grinding disc 20, and the rotating shaft can rotate clockwise or counterclockwise under the action of a first drive motor (not shown). Figure 2 The grinding disc 20 rotates in the direction shown in the figure, thereby driving the grinding disc 20 to rotate.

[0030] At least two polishing heads 22 are disposed on one side of the polishing pad 21, each polishing head 22 being used to fix an object to be polished (e.g., a wafer). Optionally, the CMP system includes a first drive assembly for fixing and driving the movement of the polishing heads 22, the specific structure of which can be similar to... Figure 1 The same applies to the grinding head 22, so it will not be repeated here. Each grinding head 22 can correspond to a first driving component, and at least two first driving components can simultaneously drive at least two grinding heads 22 to work together.

[0031] The composite support arm 24 is disposed on one side of the grinding pad 21, and as follows: Figure 3 and Figure 4 As shown, Figure 3 for Figure 2 A top view of the embodiment of the composite support arm, the polishing slurry supply module, and the diamond disc. Figure 4 for Figure 2 A front view schematic diagram of an embodiment of the composite support arm 24, the polishing slurry supply module, and the diamond disc. A slide rail 240 is provided within the composite support arm 24; optionally, the slide rail 240 can extend in a straight line, and the axial direction X of the slide rail 240 can be parallel to the axial direction X of the composite support arm 24.

[0032] A diamond disc 26 is positioned on the side of the composite support arm 24 facing the polishing pad 21. The diamond disc 26 is movably connected to the slide rail 240 and can move along the axial direction X of the slide rail 240 for dressing the polishing pad 21. Optionally, the chemical polishing system also includes a rotation drive motor and a translation drive motor connected to the diamond disc 26. The rotation drive motor drives the diamond disc 26 to rotate around its center, and the translation drive motor drives the diamond disc 26 to move back and forth along the axial direction X of the slide rail 240.

[0033] The polishing slurry supply module 28 is fixedly mounted on the composite support arm 24 and is used to supply polishing slurry to the polishing pad 21. During the operation of the CMP system, after the polishing slurry supplied by the polishing slurry supply module 28 drips onto the polishing pad 21, it is dispersed outward by centrifugal force due to the rotation of the polishing disc 20, and then spread evenly. The radiation range formed by the polishing slurry on the polishing pad 21 can cover the area in contact between the object to be polished and the polishing pad 21.

[0034] As can be seen, in this application, the diamond disc 26 and the polishing fluid supply module 28 are integrated onto the same composite support arm 24, and the diamond disc 26 moves along the slide rail 240 on the composite support arm 24 to save space on one side of the polishing disc 20, thereby making room for at least two polishing heads 22, making it possible for one polishing disc 20 to correspond to at least two working polishing heads 22, thereby improving production efficiency and reducing hardware costs; in addition, in this application, one polishing pad 21 polishes at least two objects to be polished at the same time, thereby saving the cost of the polishing pad 21.

[0035] In the embodiments of this application, such as Figure 3 and Figure 4 As shown, the polishing slurry supply module 28 includes a polishing slurry supply channel 280 and at least two nozzles 282 connected to the polishing slurry supply channel 280; wherein each nozzle 282 is capable of forming at least one polishing slurry landing point on the polishing pad 21.

[0036] Optionally, the number of polishing slurry supply channels 280 can be one, located within the composite support arm 24, extending along the axial direction X of the slide rail 240, with one end connected to an external polishing slurry supply source. Of course, in other embodiments, the number of polishing slurry supply channels 280 can be at least two, and this application does not limit this.

[0037] Alternatively, a nozzle 282 may have only one outlet, and a single nozzle 282 may form one abrasive slurry droplet on the abrasive pad 21. Of course, in other embodiments, a nozzle 282 may also have at least two outlets, similar to a shower head, in which case a single nozzle 282 may form at least two abrasive slurry droplets on the abrasive pad 21.

[0038] During the operation of a CMP system, the polishing slurry typically flows vertically from nozzle 282 at a flow rate of 200–300 ml / min in a column shape towards the polishing pad 21 below. Due to the presence of at least two polishing heads 22, some slurry droplets may be too close to the head 22, failing to spread sufficiently before reaching it. Therefore, to reduce this issue, this application introduces at least two nozzles 282. The arrangement of at least two nozzles 282 improves the uniformity of the polishing slurry, thereby enhancing the polishing effect.

[0039] In the embodiments of this application, such as Figure 2 , Figure 3 and Figure 4 As shown, the composite support arm 24 includes a first surface 242 and two first side surfaces 244 connected to the first surface 242; wherein, the first surface 242 faces the polishing pad 21, and the diamond disc 26 is disposed between the first surface 242 and the polishing pad 21, the two first side surfaces 244 are arranged opposite each other along the radial Y of the slide rail 240, and at least one first side surface 244 is provided with a nozzle 282. The above-mentioned arrangement of the diamond disc 26 and the nozzle 282 is relatively simple and reduces the interference between the polishing fluid sprayed from the diamond disc 26 and the nozzle 282.

[0040] In the embodiments of this application, such as Figure 2 As shown, at least two nozzles 282 are arranged at intervals along the axial direction X on at least one first side 244. The arrangement design of the above-mentioned at least two nozzles 282 is relatively simple.

[0041] Optional, Figure 2 In this embodiment, at least two nozzles 282 are schematically shown on only one first side 244; in other embodiments, at least two nozzles 282 may also be provided on each of the two first side 244.

[0042] Another option, such as Figure 4 As shown, the orthographic projection of at least two nozzles 282 on the first side 244 can be located above the orthographic projection of the slide rail 240 on the first side 244, i.e. away from the diamond disc 26. This design is relatively simple.

[0043] Another option, such as Figure 2As shown, each grinding head 22 may correspond to a nozzle group formed by at least two spaced nozzles 282. During the operation of the CMP system, the grinding head 22 is located downstream of the grinding disk 20 in the rotation direction relative to its corresponding nozzle group, so that the grinding liquid dripping from the nozzle 282 onto the grinding pad 21 can be evenly spread under the corresponding grinding head 22 under the action of centrifugal force.

[0044] In the embodiments of this application, such as Figure 2 As shown, in the axial direction X, the length of the slide rail 240 is greater than or equal to the radius of the polishing pad 21, and less than the diameter of the polishing pad 21. At this time, the composite support arm 24 can span half of the polishing pad 21 in the diametrical direction. Each polishing head 22 corresponds to one composite support arm 24, and each composite support arm 24 is equipped with a diamond disc 26 and a polishing fluid supply module 28. This arrangement of one polishing head 22 corresponding to one composite support arm 24 ensures that when at least two polishing heads 22 are working simultaneously, their corresponding diamond discs 26 can promptly grind away the depleted polishing particles, and the polishing fluid supply module 28 can promptly provide fresh polishing fluid, thereby improving the polishing effect. Furthermore, when performing maintenance on the CMP system and replacing the polishing pad 21, the composite support arm 24 can be easily removed from the polishing disc 20. 一 侧 Remove it to make it easier to replace with a new grinding pad.

[0045] Optional, such as Figure 4 As shown, the CMP system may also include: a connecting shaft 23 connected to the composite support arm 24, the composite support arm 24 can swing about one end of the connecting shaft 23 under the action of a drive motor; during the operation of the CMP system, the position of the composite support arm 24 is fixed relative to the connecting shaft 23, that is, the composite support arm 24 does not swing; when the CMP system needs to be maintained, the composite support arm 24 can be rotated to a certain angle relative to the connecting shaft 23 to be removed from above the grinding pad 20 for easy replacement of a new grinding pad.

[0046] Another option, such as Figure 2 As shown, the orthographic projection of at least two composite support arms 24 onto the grinding pad 21 divides the grinding pad 21 into at least two equal regions, with a grinding head 22 corresponding to each region. The above layout is relatively simple and can ensure a good grinding effect for each grinding head 22.

[0047] For example, such as Figure 2As shown, the CMP system includes two grinding heads 22 and two composite support arms 24; the two composite support arms 24 are arranged opposite each other along the same diameter direction of the grinding pad 21 to divide the grinding pad 21 into two equal regions, with one grinding head 22 corresponding to each region. Of course, in other embodiments, the CMP system may also include at least two grinding heads 22 and composite support arms 24, for example, three grinding heads 22 and three composite support arms 24, etc.

[0048] Optional, such as Figure 2 As shown, each composite support arm 24 may have only one first side 244 with at least two nozzles 282 arranged at X-intervals along the axial direction, and the first side 244s with nozzles 282 on adjacent composite support arms 24 are not adjacent. Specifically, the nozzle of one composite support arm 24 is located on the left side of its respective composite support arm 24, and the nozzle of the other composite support arm 24 is located on the right side of its respective composite support arm 24. In this case, one grinding head 22 corresponds to at least two nozzles 282 on one first side 244. The above design is relatively simple and has low hardware cost.

[0049] Furthermore, during the operation of the CMP system, the diamond discs 26 on at least two composite support arms 24 can move towards each other or move away from each other synchronously. Specifically, the movement path and speed of each diamond disc 26 can be freely set according to actual needs.

[0050] In the embodiments of this application, such as Figure 5 As shown, Figure 5 This is a schematic diagram of the CMP system provided in another embodiment of this application. In the axial direction X, the length of the slide rail 240 is greater than or equal to the diameter of the polishing pad 21; at this time, the composite support arm 24 can span the entire polishing pad 21 in the diametrical direction. At least two polishing heads 22 correspond to one composite support arm 24, and the at least two polishing heads 22 are respectively disposed on one side of the two first surfaces 244; and two diamond discs 26 are disposed on the composite support arm 24, with nozzles 282 respectively disposed on the two first sides 244. This design allows the corresponding diamond discs 26 to promptly grind away exhausted polishing particles when at least two polishing heads 22 are working simultaneously, and the polishing fluid supply module 28 to promptly provide fresh polishing fluid, thereby improving the polishing effect.

[0051] Optional, such as Figure 6 As shown, Figure 6 for Figure 5A front view schematic diagram of the composite support arm, polishing slurry supply module, and diamond disc embodiment. The CMP system may also include two connecting shafts 23, which are detachably connected to the ends of the composite support arm 24 in the axial direction X. During the operation of the CMP system, the position of the composite support arm 24 is fixed relative to the connecting shafts 23, and the two connecting shafts 23 provide good support for the composite support arm 24; when maintenance of the CMP system is required, the composite support arm 24 can be detached from the connecting shafts 23 to allow the composite support arm 24 to be quickly removed from above the polishing disc 20.

[0052] Optionally, a buffer (e.g., foam) is provided at the middle position of the composite support arm 24 along the X-axis of the slide rail 240 to reduce the probability of collision and damage during the simultaneous movement of the two diamond discs 26. Of course, in other embodiments, the buffer may not be provided, and the movement paths of the two diamond discs 26 can be pre-set by a program to ensure that the distance between the two diamond discs 26 along the X-axis is greater than the minimum safe distance at any given time.

[0053] In the embodiments of this application, please refer to Figure 7 , Figure 7 This is a schematic flowchart of a chemical mechanical polishing method provided in an embodiment of this application. The chemical mechanical polishing method utilizes the chemical mechanical polishing system mentioned in any of the above embodiments. The chemical mechanical polishing method includes:

[0054] S101: At least two grinding heads are respectively attached to the object to be ground, and the object to be ground is brought into contact with the grinding pad.

[0055] Optionally, the object to be ground can be a wafer, etc.

[0056] S102: Drive the grinding disc to rotate and supply grinding fluid to the surface of the grinding pad via the grinding fluid supply module so that the grinding fluid forms a radiation range on the grinding pad, the radiation range covering the area where the object to be ground is in contact with the grinding pad, the grinding pad grinding the surface of the object to be ground; and, the diamond disc trims the surface of the grinding pad.

[0057] Optionally, the abrasive pad simultaneously abrades at least two object surfaces, and at least two diamond discs in the chemical mechanical polishing system simultaneously finish the abrasive pad surface.

[0058] As can be seen, in this application, the diamond disc and the polishing fluid supply module are integrated onto the same composite support arm, and the diamond disc moves along the slide rail on the composite support arm to save space on one side of the polishing pad, thereby making room for at least two polishing heads. This makes it possible for one polishing pad to correspond to at least two working polishing heads, thereby improving production efficiency and reducing hardware costs. In addition, in this application, one polishing pad polishes at least two objects to be polished at the same time, thereby saving polishing pad costs.

[0059] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Any modifications or equivalent substitutions made within the spirit and principles of this specification should be included within the scope of protection of this specification.

Claims

1. A chemical mechanical polishing system, characterized in that, include: A grinding disc, the surface of which is provided with a grinding pad; At least two grinding heads are disposed on one side of the grinding pad, and each grinding head is used to fix an object to be ground; A composite support arm is disposed on one side of the grinding pad, and a slide rail is provided inside the composite support arm; A diamond disc, movably connected to the slide rail and capable of moving along the axial direction of the slide rail, is used to trim the grinding pad. A polishing slurry supply module is fixedly mounted on the composite support arm to provide polishing slurry to the polishing pad.

2. The chemical mechanical polishing system according to claim 1, characterized in that, The polishing slurry supply module includes a polishing slurry supply channel and at least two nozzles connected to the polishing slurry supply channel; wherein each nozzle is capable of forming at least one polishing slurry landing point on the polishing pad.

3. The chemical mechanical polishing system according to claim 2, characterized in that, The composite support arm includes a first surface and two first side surfaces connected to the first surface; The first surface faces the grinding pad, the two first sides are arranged radially opposite each other along the slide rail, and at least one of the first sides is provided with the nozzle.

4. The chemical mechanical polishing system according to claim 3, characterized in that, At least one of the first side surfaces is provided with at least two nozzles arranged at intervals along the axial direction of the slide rail.

5. The chemical mechanical polishing system according to claim 3, characterized in that, Along the axial direction, the length of the slide rail is greater than or equal to the radius of the grinding pad and less than the diameter of the grinding pad; each grinding head corresponds to one composite support arm, and each composite support arm is provided with one diamond disc.

6. The chemical mechanical polishing system according to claim 5, characterized in that, The orthographic projection of at least two of the composite support arms onto the grinding pad divides the grinding pad into at least two regions, with a grinding head corresponding to each region.

7. The chemical mechanical polishing system according to claim 6, characterized in that, The chemical mechanical polishing system includes two of the aforementioned grinding heads and two of the aforementioned composite support arms; The two composite support arms are arranged opposite each other along the same diameter direction of the grinding pad to divide the grinding pad into two regions on the same diameter direction, and a grinding head is arranged in each region.

8. The chemical mechanical polishing system according to claim 3, characterized in that, In the axial direction, the length of the slide rail is greater than or equal to the diameter of the grinding pad; at least two grinding heads correspond to one composite support arm, and at least two grinding heads are respectively disposed on both sides of the composite support arm; and two diamond discs are disposed on the composite support arm, and nozzles are respectively disposed on the two first side surfaces.

9. A chemical mechanical polishing method, characterized in that, Using the chemical mechanical polishing system of any one of claims 1-8, the chemical mechanical polishing method comprises: At least two of the grinding heads are respectively used to adsorb the object to be ground, and the object to be ground is brought into contact with the grinding pad; The grinding disc is driven to rotate, and grinding fluid is supplied to the surface of the grinding pad via the grinding fluid supply module, so that the grinding fluid forms a radiation range on the grinding pad, the radiation range covering the area of ​​the object to be ground in contact with the grinding pad, and the grinding pad grinds the surface of the object to be ground; and... The diamond disc trims the surface of the polishing pad.

10. The chemical mechanical polishing method according to claim 9, characterized in that, The abrasive pad simultaneously abrades at least two of the surfaces of the objects to be abraded, and at least two of the diamond discs in the chemical mechanical polishing system simultaneously trim the surface of the abrasive pad.

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