Display panel, manufacturing method thereof, and display device

Abstract

The application discloses a display panel and a preparation method thereof, and a display device. The preparation method of the display panel comprises the following steps: providing a transfer substrate; preparing a cavity structure, an auxiliary connecting structure and a light emitting element on one side of the transfer substrate; the cavity structure penetrates part of the transfer substrate; at least part of the auxiliary connecting structure is arranged in a staggered mode with the cavity structure; the light emitting element is located on the side, away from the transfer substrate, of the auxiliary connecting structure and is along the thickness direction of the display panel, and the light emitting element and the cavity structure are at least partially overlapped; providing an array substrate and adhering the transfer substrate and the array substrate on the side of the light emitting element, facing the array substrate, of the light emitting element, so that the light emitting element and the array substrate are electrically connected; and removing at least the auxiliary connecting structure in contact with the transfer substrate, so that the transfer substrate is separated from the light emitting element. According to the technical scheme, the cavity structure and the auxiliary connecting structure arranged on one side of the transfer substrate can better and more accurately realize the separation of the transfer substrate from the light emitting element, the light emitting element transfer mode is simple, and the transfer efficiency is high.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of display, and in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] With the development of display technology, the micro-component manufacturing process has become a development trend of display panels, such as micro light emitting diode (LED), i.e. Micro-LED technology. Compared with organic light emitting diode (OLED) technology which is also self-luminous display, Micro-LED not only has higher efficiency and longer life, but also is relatively stable in material and can avoid the phenomenon of residual image.

[0003] However, the mass transfer of Micro-LED chips is a difficulty in the manufacturing process. Since the Micro-LED chips are very small, the mass transfer requires very high efficiency, yield and transfer accuracy, so the mass transfer technology becomes the biggest technical difficulty in the manufacturing process of Micro-LED panel, which hinders the popularization and use of Micro-LED technology. SUMMARY

[0004] Embodiments of the present application provide a display panel, a preparation method thereof and a display device, which improve the efficiency of transferring light emitting elements to an array substrate.

[0005] In a first aspect, embodiments of the present application provide a preparation method of a display panel, comprising:

[0006] providing a transfer substrate;

[0007] preparing a cavity structure, an auxiliary connecting structure and a light emitting element on one side of the transfer substrate; the cavity structure penetrates part of the transfer substrate; at least part of the auxiliary connecting structure is arranged away from the cavity structure; the light emitting element is located on the side of the auxiliary connecting structure away from the transfer substrate, and the light emitting element and the cavity structure at least partially overlap in the thickness direction of the display panel;

[0008] providing an array substrate and adhering the transfer substrate and the array substrate with the light emitting element facing one side of the array substrate, the light emitting element and the array substrate being electrically connected;

[0009] removing at least the auxiliary connecting structure in contact with the transfer substrate to separate the transfer substrate from the light emitting element.

[0010] In a second aspect, an embodiment of the present invention provides a display panel, which is prepared using any one of the preparation methods described in the first aspect;

[0011] The display panel includes:

[0012] an array substrate;

[0013] A light emitting element is located on one side of the array substrate.

[0014] In a third aspect, an embodiment of the present invention provides a display device comprising the display panel described in any one of the second aspects.

[0015] The method for manufacturing a display panel provided by an embodiment of the present invention first provides a transfer substrate; secondly, a cavity structure, an auxiliary connection structure, and a light-emitting element are prepared on one side of the transfer substrate; further, an array substrate is provided and the transfer substrate and the array substrate are bonded together with the light-emitting element facing the array substrate, electrically connecting the light-emitting element and the array substrate; finally, at least the auxiliary connection structure in contact with the transfer substrate is removed to separate the transfer substrate from the light-emitting element. The technical solution provided by an embodiment of the present invention, through the cavity structure and auxiliary connection structure provided on one side of the transfer substrate, effectively and accurately separates the transfer substrate from the light-emitting element, simplifying the light-emitting element transfer method and improving transfer efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings introduced here only illustrate some of the embodiments to be described by the present invention, and are not exhaustive. A person skilled in the art can derive other drawings based on these drawings without inventive effort.

[0017] Figure 1 is a schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0018] Figure 2 is a process diagram of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0019] Figure 3 is a structural schematic diagram of a light-emitting element provided by an embodiment of the present invention;

[0020] Figure 4 is a schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention;

[0021] Figure 5 is a process diagram of another method for manufacturing a display panel provided by an embodiment of the present invention;

[0022] Figure 6is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application;

[0023] Figure 7 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application;

[0024] Figure 8 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application;

[0025] Figure 9 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application;

[0026] Figure 10 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application;

[0027] Figure 11 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application;

[0028] Figure 12 is a structural diagram of a display panel according to an embodiment of the present application;

[0029] Figure 13 is Figure 12 is a zoomed-in diagram of the area 200A in FIG. 2B;

[0030] Figure 14 is a structural diagram of another display panel according to an embodiment of the present application;

[0031] Figure 15 is a structural diagram of another display panel according to an embodiment of the present application;

[0032] Figure 16 is a structural diagram of another display panel according to an embodiment of the present application;

[0033] Figure 17 is a structural diagram of another display panel according to an embodiment of the present application;

[0034] Figure 18 is a structural diagram of a display device according to an embodiment of the present application. DETAILED DESCRIPTION

[0035] The present application will be further described below in conjunction with the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only the parts related to the present application are shown in the drawings, rather than all the structures.

[0036] Figure 1is a schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention. Figure 2 is a process diagram of a method for manufacturing a display panel provided by an embodiment of the present invention, Figure 3 This is a schematic diagram of the structure of a light emitting element provided by an embodiment of the present invention, with reference to Figures 1 to 3 As shown, the method for manufacturing a display panel provided by an embodiment of the present invention may include:

[0037] S110, providing a transfer substrate.

[0038] Illustratively, the provided transfer substrate is used to transfer the light-emitting element. The embodiment of the present invention does not limit the type and quantity of the transfer substrate.

[0039] S120. Prepare a cavity structure, an auxiliary connection structure and a light-emitting element on one side of the transfer substrate; the cavity structure penetrates part of the transfer substrate; at least part of the auxiliary connection structure is staggered with the cavity structure; the light-emitting element is located on a side of the auxiliary connection structure away from the transfer substrate, and projected along the thickness direction of the display panel, the light-emitting element and the cavity structure at least partially overlap.

[0040] Among them, the light-emitting element can be a light-emitting diode, for example, a Micro LED chip, that is, a micro light-emitting diode (LED). The Micro LED chip has the display characteristics of self-luminescence, and its advantages include all-solid-state, long life, high brightness, low power consumption, small size, ultra-high resolution and can be used in extreme environments such as high temperature or radiation. The light-emitting element is transferred by transferring the substrate.

[0041] Specifically, the auxiliary connecting structure can be understood as an intermediate connecting structure that connects the transfer substrate and the light-emitting element during the transport of the light-emitting element and separates the transfer substrate and the light-emitting element by ablating its own structure during the transport of the light-emitting element. The auxiliary connecting structure can be a photosensitive structure, a heat-sensitive structure, or any other structure that can function as a connection and can ablate itself when the external environment changes. The embodiments of the present invention do not limit the specific material of the auxiliary structure.

[0042] refer to Figure 2 As shown, a cavity structure 110, an auxiliary connection structure 120, and a light-emitting element 130 are sequentially formed on one side of a transfer substrate 100. Specifically, the cavity structure 110 extends through a portion of the transfer substrate 100, and the auxiliary connection structure 120 is formed at least in the portion of the transfer substrate 100 where the cavity structure 110 is not already formed. The transfer substrate 100 is bonded to a wafer (not shown) on which the light-emitting element 130 is grown. After the wafer is debonded using laser lift-off technology, the light-emitting element 130 is positioned on the side of the auxiliary connection structure 120 away from the transfer substrate 100.

[0043] Furthermore, at least part of the auxiliary connection structure 120 is staggered with the cavity structure 110, that is, the auxiliary connection structure 120 is arranged at least in the area of ​​the transfer substrate 100 where the cavity structure 110 is not arranged, for example, the auxiliary connection structure 120 is arranged in the interval area between two adjacent cavity structures 110. Figure 2 As shown, an auxiliary connection structure 120 is prepared on the surface of the transfer substrate 100 between two adjacent cavity structures 110. Of course, at least part of the auxiliary connection structure 120 is staggered with the cavity structure 110, and part of the auxiliary connection structure 120 can also be arranged corresponding to the cavity structure 110, that is, when projected along the thickness direction h of the display panel, part of the auxiliary connection structure 120 overlaps with the cavity structure 110, as shown in FIG. Figure 2 In the region a, the auxiliary connection structure 120 overlaps with the cavity structure 110 .

[0044] Furthermore, the light-emitting element 130 contacts the auxiliary connection structure 120, and the light-emitting element 130 is isolated from the transfer substrate 100 through the auxiliary connection structure 120. In this way, the light-emitting element 130 can be naturally separated from the transfer substrate 100 during the subsequent ablation process of the auxiliary connection structure 120, making it easier and more convenient to transfer the light-emitting element 130 to the array substrate 200.

[0045] Furthermore, when projected along the thickness direction h of the display panel, the light emitting element 130 and the cavity structure 110 at least partially overlap, that is, the light emitting element 130 may partially overlap with the cavity structure 110 (not specifically shown in the figure), or the light emitting element 130 may completely overlap with the cavity structure 110. Figure 2 As shown, projected along the thickness direction h of the display panel, the cavity structure 110 covers the light emitting element 130. Providing the cavity structure 110 on the transfer substrate 100 ensures that the transfer substrate 100 and the light emitting element 130 do not contact each other, making it easier for the light emitting element 130 to be directly removed from the transfer substrate 100.

[0046] S130 , providing an array substrate and laminating the transfer substrate and the array substrate with the light emitting elements facing the side of the array substrate, and electrically connecting the light emitting elements and the array substrate.

[0047] Exemplary, reference Figure 2 and 3As shown, the light-emitting element 130 includes a first electrode 131 and a second electrode 132. The first electrode 131 and the second electrode 132 are electrically connected to the array substrate 200. The array substrate 200 drives the light-emitting element 130 to emit light, thereby achieving normal display of the light-emitting element 130. Furthermore, the light-emitting element 130 also includes a first semiconductor layer 133, a light-emitting layer 134, and a second semiconductor layer 135. The first semiconductor layer 133 is electrically connected to the first electrode 131, and the second semiconductor layer 135 is electrically connected to the second electrode 132. The embodiments of the present invention do not specifically limit the film layers included in the light-emitting element 130.

[0048] S140 , removing at least the auxiliary connection structure in contact with the transfer substrate, so as to separate the transfer substrate from the light-emitting element.

[0049] The auxiliary connection structure in contact with the transfer substrate is removed to separate the transfer substrate from the light emitting element, that is, the transfer substrate is separated from the array substrate, thereby realizing the transfer of the light emitting element from the transfer substrate to the array substrate. Figure 2 As shown, all auxiliary connection structures 120 are removed to achieve the transfer of the light-emitting elements 130 to the array substrate 200. In embodiments of the present invention, a portion of the auxiliary connection structures 120 (not specifically shown) may also be removed. For example, only the auxiliary connection structures 120 in contact with the transfer substrate 100 may be removed, leaving the portion of the auxiliary connection structures 120 above the light-emitting elements 130. This can prevent light conductive crosstalk between light-emitting elements 130 of different colors while achieving the transfer of the light-emitting elements 130 to the array substrate 200. In other words, in embodiments of the present invention, the extent of removal of the auxiliary connection structures 120 is not specifically limited, as long as the light-emitting elements 130 are successfully transferred to the array substrate 200.

[0050] In summary, the preparation method of the display panel provided by the embodiment of the present invention is through the cavity structure and the auxiliary connection structure set on one side of the transfer substrate. The cavity structure and the auxiliary connection structure isolate the light-emitting element and the transfer substrate, and the light-emitting element and the transfer substrate can be directly separated during the subsequent ablation process of the auxiliary connection structure. The method of separating the light-emitting element from the transfer substrate is simple, the method of transporting the light-emitting element is simple and convenient, and the transfer efficiency is high.

[0051] Optional, continue to refer to Figure 2 As shown, projected along the thickness direction h of the display panel, the cavity structure 110 covers the light emitting element 130 .

[0052] refer to Figure 2 As shown, along the projection in the thickness direction h perpendicular to the display panel, the cavity structure 110 covers the light emitting element 130, that is, the vertical projection of the cavity structure 110 on the plane where the array substrate is located covers the vertical projection of the light emitting element 130 on the plane where the array substrate is located. Figure 2As shown in the cross-sectional view, the extension length of the cavity structure 110 is b, the extension length of the light emitting element 130 is c, and b is greater than c, that is, the extension length of the cavity structure 110 is greater than the extension length of the light emitting element 130. By adjusting the size relationship between the cavity structure 110 and the light emitting element 130, it can be ensured that the ablation process of the auxiliary connecting structure 120 can directly separate the light emitting element 130 and the transfer substrate 100. Specifically, in the case where the cavity structure 110 completely covers the light emitting element 130, if the transfer substrate 100 is not timely peeled off during the ablation process of the auxiliary connecting structure 120, the transfer substrate 100 falls to one side of the array substrate 200 electrically connected with the light emitting element 130, and by covering the light emitting element 130 through the cavity structure 110, direct contact between the light emitting element 130 and the transfer substrate 100 can be avoided, and the reliability and stability of the transfer of the light emitting element 130 can be improved.

[0053] The preparation method of the display panel will be described in detail below.

[0054] As a feasible implementation manner, Figure 4 is a flowchart of another preparation method of a display panel provided by an embodiment of the present application, Figure 5 is a process diagram of another preparation method of a display panel provided by an embodiment of the present application, referring to Figure 4 and Figure 5 As shown in the drawings, the preparation method of another display panel provided by an embodiment of the present application includes:

[0055] S210, providing a first transfer substrate and a second transfer substrate.

[0056] Specifically, referring to Figure 5 As shown in the drawings, when the transfer substrate is provided for the transfer of the light emitting element, two transfer substrates, i.e., the first transfer substrate 100A and the second transfer substrate 100B, are provided.

[0057] S220, preparing an auxiliary connecting structure and a light emitting element on one side of the first transfer substrate, and the light emitting element is located on the side of the auxiliary connecting structure close to the first transfer substrate.

[0058] Continuing to refer to Figure 5 As shown in the drawings, the auxiliary connecting structure 120 and the light emitting element 130 are prepared on one side of the first transfer substrate 100A, and the position of the light emitting element 130 is close to the side of the first transfer substrate 100A relative to the auxiliary connecting structure 120. Specifically, the first transfer substrate 100A is attached to a wafer (not shown in the drawings) on which the light emitting element 130 is grown, and then the light emitting element 130 is peeled off from the wafer by laser peeling technology, and the light emitting element 130 is transferred to one side of the first transfer substrate 100A.

[0059] S230 , preparing a cavity structure on a surface of one side of the second transfer substrate.

[0060] refer to Figure 5 As shown, a cavity structure 110 is prepared on one side of the second transfer substrate 100B. The cavity structure 110 can ensure that when the second transfer substrate 100B and the first transfer substrate 100A are bonded, the second transfer substrate 100B does not contact the light-emitting element 130, which facilitates the subsequent direct removal of the light-emitting element 130 from the second transfer substrate 100B for transfer.

[0061] S240 , attaching the first transfer substrate and the second transfer substrate with the auxiliary connection structure facing the side of the second transfer substrate.

[0062] The first transfer substrate 100A and the second transfer substrate 100B are bonded together via the auxiliary connection structure 120. Specifically, the auxiliary connection structure 120 bonds the side facing away from the first transfer substrate 100A to the second transfer substrate 100B, thereby achieving bonding between the first transfer substrate 100A and the second transfer substrate 100B. Furthermore, in the embodiments of the present invention, by providing the first transfer substrate 100A and the second transfer substrate 100B, the light-emitting element 130 is first transferred to the first transfer substrate 100A. At this point, the light-emitting element 100 can be transferred to the first transfer substrate 100A with its electrodes directly facing one side of the first transfer substrate 100A, simplifying the transfer process for the light-emitting element 130. Furthermore, after the first transfer substrate 100A is subsequently peeled off, the electrodes of the light-emitting element 130 are directly exposed, facilitating direct electrical connection with the array substrate during subsequent transfer to the array substrate. In other words, the use of two transfer substrates ensures that the electrodes of the light-emitting element 130 face the array substrate 200, simplifying the process and ensuring accurate and stable electrical connection between the light-emitting element 130 and the array substrate 200.

[0063] S250 , peeling off the first transfer substrate.

[0064] Exemplary, reference Figure 5 As shown, the first transfer substrate 100A is peeled off, so that the cavity structure 110 , the auxiliary connection structure 120 and the light emitting element 130 all fall onto the second transfer substrate 100B.

[0065] S260 , providing an array substrate and attaching the second transfer substrate to the array substrate with the light emitting element facing the side of the array substrate, and electrically connecting the light emitting element to the array substrate.

[0066] like Figure 5 As shown, the second transfer substrate 100B is attached to the array substrate 200 to achieve the transfer of the light emitting element 130 to the array substrate 200 and ensure the transfer of the light emitting element 130 .

[0067] S270 , removing at least the auxiliary connection structure in contact with the second transfer substrate, so as to separate the transfer substrate from the light-emitting element.

[0068] like Figure 5 As shown, at least the auxiliary connection structure 120 in contact with the second transfer substrate 100B is removed to separate the second transfer substrate 100B from the light emitting element 130 , and the light emitting element 130 is directly transferred to the array substrate 200 .

[0069] In summary, the method for preparing a display panel provided by an embodiment of the present invention provides two transfer substrates, prepares an auxiliary connection structure and a light-emitting element on the first transfer substrate, and prepares a cavity structure on the second transfer substrate. The cavity structure, the auxiliary connection structure and the light-emitting element are prepared on one side of the transfer substrate by bonding the first transfer substrate and the second transfer substrate. The method for separating the light-emitting element from the transfer substrate is simple, the method for transporting the light-emitting element is simple and convenient, and the transfer efficiency is high. Moreover, by using two transfer substrates, the electrode direction of the light-emitting element can be directly directed toward the array substrate, thereby ensuring accurate and stable electrical connection between the light-emitting element and the array substrate.

[0070] As another possible implementation, Figure 6 is a schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention. Figure 7 is a process diagram of another method for manufacturing a display panel provided by an embodiment of the present invention, with reference to Figure 6 and Figure 7 As shown, another method for manufacturing a display panel provided by an embodiment of the present invention includes:

[0071] S310, providing a transfer substrate.

[0072] S320, preparing a cavity structure on one side of the transfer substrate.

[0073] refer to Figure 7 As shown, a cavity structure 110 is prepared on one side of the transfer substrate 100. The cavity structure 110 can ensure that the transfer substrate 100 and the light-emitting element 130 are not in contact, so that the light-emitting element 130 can be directly removed from the transfer substrate 100 for transfer.

[0074] S330, preparing a sacrificial structure in the cavity structure, wherein the sacrificial structure fills the cavity structure.

[0075] refer to Figure 7 As shown, a cavity structure 110 is prepared on one side of the transfer substrate 100, and a sacrificial structure 111 is filled in the cavity structure 110. The sacrificial structure 111 can prevent the auxiliary connection structure 120 from entering the cavity structure 110, so as to prevent the auxiliary connection structure 120 in the subsequent cavity structure 110 from connecting to the light-emitting element 130, causing the light-emitting element 130 to be unable to be separated from the transfer substrate 100.

[0076] S340, preparing an auxiliary connection structure on the surface of the transfer substrate.

[0077] refer to Figure 7 , an auxiliary connection structure 120 is prepared on the surface of the transfer substrate 100, and the auxiliary connection structure 120 and the cavity structure 110, that is, the sacrificial structure 111 are at least partially staggered to facilitate subsequent removal of the sacrificial structure 111.

[0078] S350: Remove the sacrificial structure.

[0079] Exemplary, reference Figure 7 As shown, after the sacrificial structure 111 is removed, the transfer substrate 100 retains the cavity structure 110 and the auxiliary connection structure 120. Specifically, the sacrificial structure can be removed according to the material of the sacrificial structure. For example, if the sacrificial structure can be dissolved in a certain chemical reagent, the sacrificial structure can be removed by the chemical reagent; for another example, if the sacrificial structure can be removed by changing the environmental conditions, such as heating or light, then the sacrificial structure can be removed by heating or light. The embodiment of the present invention does not limit the specific material of the sacrificial structure and the removal method. It should be noted that in the process of removing the sacrificial structure, it is necessary to ensure that the auxiliary connection structure is not damaged.

[0080] S360, transferring the light-emitting element to a side of the auxiliary connection structure away from the transfer substrate.

[0081] Specifically, the transfer substrate 100 is bonded to a wafer (not shown in the figure) on which the light-emitting element 130 is grown, and then the light-emitting element 130 is separated from the wafer by laser stripping technology and transferred to one side of the transfer substrate 100. However, it is necessary to consider facing the electrode of the light-emitting element 130 to the side away from the transfer substrate 100 to ensure subsequent electrical connection and bonding with the array substrate 200.

[0082] S370 , providing an array substrate and attaching the transfer substrate and the array substrate together with the light emitting element facing the side of the array substrate, so that the light emitting element and the array substrate are electrically connected.

[0083] S380 , removing at least the auxiliary connection structure in contact with the transfer substrate, so as to separate the transfer substrate from the light-emitting element.

[0084] In summary, the preparation method of the display panel provided by the embodiment of the present application avoids the auxiliary connection structure from being filled in the cavity structure by setting the sacrifice structure, and the transfer substrate can be directly separated from the light emitting element by removing the sacrifice structure, thereby improving the stability and reliability of the light emitting element transfer. Moreover, the auxiliary connection structure can be directly prepared in only one transfer substrate by setting the sacrifice structure to avoid the auxiliary connection structure from being filled in the cavity structure, thereby saving the number of transfer substrates and reducing the preparation cost.

[0085] As another possible implementation, Figure 8 is a flowchart of another preparation method of a display panel provided by an embodiment of the present application, Figure 9 is a process diagram of another preparation method of a display panel provided by an embodiment of the present application, referring to Figures 8 to 9 the preparation method of another display panel provided by an embodiment of the present application includes:

[0086] S410, providing a transfer substrate.

[0087] S420, preparing an auxiliary connection structure on the surface of the transfer substrate.

[0088] S430, preparing a cavity structure in the transfer substrate by taking the auxiliary connection structure as a mask.

[0089] Specifically, the auxiliary connection structure can be used as an etching mask of the transfer substrate, and the transfer substrate can be etched by the auxiliary connection structure as a mask, thereby saving a mask process and reducing the process cost. Referring to Figure 9 the auxiliary connection structure 120 is prepared on one side of the transfer substrate 100, and the auxiliary connection structure 120 is used as a mask, and the cavity structure 120 is prepared on one side of the transfer substrate 100 by the etching process, that is, the cavity structure 110 and the auxiliary connection structure 120 are directly prepared on only one transfer substrate 100, thereby saving the number of transfer substrates 100 and reducing the cost.

[0090] Optionally, referring to Figure 9 the cavity structure 110 is prepared in the transfer substrate 100 by taking the auxiliary connection structure 120 as a mask and using an isotropic etching process, so that the cavity structure 110 covers the light emitting element 130 along the thickness direction h of the display panel.

[0091] Illustratively, referring to Figure 9 the cavity structure 110 in the transfer substrate 100 is prepared by taking the auxiliary connection structure 120 as a mask and using an isotropic etching process. The isotropic etching process can use a wet etching process to ensure that the etching speed in each direction is consistent, and the cavity structure 110 in Figure 9 is prepared. Further, referring toFigure 9 As shown, projected along the thickness direction h perpendicular to the display panel, the extension length of the cavity structure 110 is m, and the extension length of the light-emitting element 130 is n, where m is greater than n, which ensures that the cavity structure 110 can cover the light-emitting element 130. When the transfer substrate 100 is not peeled off in time during the ablation process of the auxiliary connection structure 120, the transfer substrate 100 falls to the side of the array substrate 200 electrically connected to the light-emitting element 130. The light-emitting element 130 is covered by the cavity structure 110, which can avoid direct contact between the light-emitting element 130 and the transfer substrate 100, thereby improving the reliability and stability of the transfer of the light-emitting element 130.

[0092] S440, transferring the light-emitting element to a side of the auxiliary connection structure away from the transfer substrate, wherein the size of the light-emitting element is larger than the size between two adjacent auxiliary connection structures.

[0093] Specifically, the transfer substrate is bonded to the wafer with the light-emitting element, and then the light-emitting element is separated from the wafer through laser stripping technology and transferred to one side of the transfer substrate. However, it is necessary to consider facing the electrode of the light-emitting element to the side away from the transfer substrate to ensure subsequent electrical connection with the array substrate.

[0094] For further reference, Figure 9 As shown, the size of the light-emitting element 130 is d, and the size between two adjacent auxiliary connection structures 120 is e, which satisfies the condition that e is less than d, that is, the size of the light-emitting element 130 is larger than the size between two adjacent auxiliary connection structures 120, ensuring that the light-emitting element 130 can be arranged on the side of the auxiliary connection structure 120 away from the transfer substrate 100 and does not contact the transfer substrate 100, thereby preventing the light-emitting element 130 from falling into the cavity structure 110 and contacting the transfer substrate 100 in subsequent processes, thereby ensuring the stability and reliability of the transfer of the light-emitting element 130.

[0095] S450 , providing an array substrate and attaching the transfer substrate and the array substrate together with the light emitting elements facing the side of the array substrate, so that the light emitting elements and the array substrate are electrically connected.

[0096] S460 , removing at least the auxiliary connection structure in contact with the transfer substrate, so as to separate the transfer substrate from the light-emitting element.

[0097] In summary, in the method for preparing a display panel provided by an embodiment of the present invention, the auxiliary connection structure on the transfer substrate is used as a mask, and the transfer substrate is etched to prepare a cavity structure, which can save a mask process and ensure that the cavity structure, auxiliary connection structure and light-emitting structure are prepared on one transfer substrate, thereby reducing the preparation cost.

[0098] In summary, the above embodiments illustrate the preparation process of the display panel through three feasible implementation methods. By preparing a cavity structure, an auxiliary connection structure and a light-emitting element in a transfer substrate, and removing the auxiliary connection structure in a subsequent process to ensure that the light-emitting element is separated from the transfer substrate, the separation process is simple and efficient.

[0099] On the basis of the above embodiments, continue to refer to Figure 2 As shown, the auxiliary connection structure 120 includes a first connection segment 121 and a second connection segment 122 connected to each other. The second connection segment 122 is located on the side of the first connection segment 121 away from the cavity structure 110. The distance between two adjacent first connection segments 121 is L1, and the distance between two adjacent second connection segments 122 is L2. L1 <L2;发光元件130位于第一连接分部121远离转移基板100的一侧,且位于相邻两个第二连接分部122之间。

[0100] Specifically, the auxiliary connection structure 120 includes a first connection sub-section 121 and a second connection sub-section 122, and when projected along the thickness direction h perpendicular to the display panel, the extension length of the first connection sub-section 121 is greater than the extension length of the second connection sub-section 122, that is, the distance between two adjacent first connection sub-sections 121 is less than the distance between two adjacent second connection sub-sections 122. For example, referring to Figure 2 As shown, the auxiliary connection structure 120 is a T-shaped structure as a whole, which facilitates the placement of the light-emitting element 130 between adjacent second connection segments 122, that is, the light-emitting element 130 is placed on the side of the auxiliary connection structure 120 away from the transfer substrate 100. The embodiment of the present invention does not limit the specific shape of the auxiliary connection structure 120.

[0101] Based on the above embodiments, Figure 10 is a flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention, with reference to Figure 10 As shown, another method for manufacturing a display panel provided by an embodiment of the present invention includes:

[0102] S510: providing a transfer substrate.

[0103] S520. Prepare a cavity structure, an auxiliary connection structure and a light-emitting element on one side of the transfer substrate; the cavity structure penetrates part of the transfer substrate; at least part of the auxiliary connection structure is staggered with the cavity structure; the light-emitting element is located on a side of the auxiliary connection structure away from the transfer substrate and is projected along the thickness direction of the display panel, and the light-emitting element and the cavity structure at least partially overlap.

[0104] S530 , providing an array substrate and attaching the transfer substrate and the array substrate together with the light emitting element facing the side of the array substrate, so that the light emitting element and the array substrate are electrically connected.

[0105] S540, exposing and developing the photosensitive structure to remove at least the photosensitive structure in contact with the transfer substrate.

[0106] The auxiliary connecting structure can include a photosensitive structure, and the photosensitive structure can be removed by subsequent light exposure and the like. Specifically, the photosensitive structure is first exposed by subsequent processes, the photosensitive structure is denatured by light exposure, and the photosensitive structure can be removed by developing, that is, the effect of removing the auxiliary connecting structure is achieved, and the diversity of the display panel preparation is improved.

[0107] Optionally, the exposing of the auxiliary connecting structure further includes: exposing the auxiliary connecting structure from the side of the transfer substrate.

[0108] Specifically, when the auxiliary connecting structure is a photosensitive structure and is exposed, the auxiliary connecting structure can be exposed from the side of the transfer substrate. On the one hand, it can ensure that the contact surface of the transfer substrate and the auxiliary connecting structure fully receives light and is denatured, which is convenient for peeling off from the transfer substrate after subsequent developing, and on the other hand, it can also avoid the influence of light on the performance of elements in the array substrate, such as channels in the active layer in the array substrate, so as to ensure that the auxiliary connecting structure is removed while protecting other elements in the array substrate, and improve the safety and stability of the transfer of the light emitting element.

[0109] In summary, in the display panel preparation method provided by the embodiment of the application, the auxiliary connecting structure includes a photosensitive structure, and the effect of removing the auxiliary connecting structure can be achieved by exposing and developing the photosensitive structure, and the diversity of the display panel preparation is improved.

[0110] Figure 11 is a flowchart of another display panel preparation method provided by the embodiment of the application, and as shown in Figure 11 the display panel preparation method provided by the embodiment of the application includes:

[0111] S610, providing a transfer substrate.

[0112] S620, preparing a cavity structure, an auxiliary connecting structure and a light emitting element on one side of the transfer substrate; the cavity structure penetrates part of the transfer substrate; at least part of the auxiliary connecting structure is arranged away from the cavity structure; the light emitting element is located on the side of the auxiliary connecting structure away from the transfer substrate and projects in the thickness direction of the display panel, and the light emitting element at least partially overlaps the cavity structure.

[0113] S630, providing an array substrate and bonding the transfer substrate and the array substrate with the light emitting element facing the array substrate, and the light emitting element and the array substrate are electrically connected.

[0114] S640 , performing a heat treatment on the thermosensitive structure so as to remove at least the thermosensitive structure in contact with the transfer substrate after the thermosensitive structure is heated and sublimated.

[0115] The auxiliary connection structure may include a thermosensitive structure, which can be removed by subsequent heating or other conditions. Specifically, the thermosensitive structure is first heated in a subsequent process. As the temperature rises, the thermosensitive structure changes state, for example, from a solid state to a gaseous state at high temperatures, and is removed. This effectively removes the auxiliary connection structure, thereby increasing the diversity of display panel manufacturing.

[0116] In summary, in the method for manufacturing a display panel provided by an embodiment of the present invention, the auxiliary connection structure includes a thermosensitive structure. The auxiliary connection structure can be removed by heating the thermosensitive structure, thereby improving the diversity of display panel manufacturing.

[0117] Based on the same inventive concept, an embodiment of the present invention further provides a display panel, Figure 12 is a structural diagram of a display panel provided by an embodiment of the present invention, Figure 13 for Figure 12 Enlarged diagram of the 200A area, see Figure 12 and Figure 13 As shown, the display panel 10 is manufactured by using the display panel manufacturing method provided by any of the above embodiments. The display panel 10 includes: an array substrate 200 and a light emitting element 130 located on one side of the array substrate 200 .

[0118] Among them, the light-emitting element can be a light-emitting diode, for example, a Micro LED chip, that is, a micro light-emitting diode (LED). The Micro LED chip has the display characteristics of self-luminescence, and its advantages include all-solid-state, long life, high brightness, low power consumption, small size, ultra-high resolution and can be used in extreme environments such as high temperature or radiation. The light-emitting element is transferred to the array substrate through the transfer substrate.

[0119] For further reference, Figure 3 As shown, the light-emitting element 130 includes a first electrode 131 and a second electrode 132. The first electrode 131 and the second electrode 132 are electrically connected to the array substrate 200, thereby driving the light-emitting element 130 to emit light. The light-emitting element 130 also includes a first semiconductor layer 133, a light-emitting layer 134, and a second semiconductor layer 135. The first semiconductor layer 133 is electrically connected to the first electrode 131, and the second semiconductor layer 135 is electrically connected to the second electrode 132. The embodiment of the present invention does not specifically limit the film layers included in the light-emitting element 130.

[0120] Specifically, refer to Figure 13As shown, the array substrate 200 also includes a substrate 210 and a pixel circuit 270, and the pixel circuit 270 is used to drive the light-emitting element 130 to emit light. Exemplarily, the array substrate 200 also includes a buffer layer 220, a gate insulating layer 230, an interlayer insulating layer 240, and a passivation layer 250. The embodiment of the present invention does not limit the specific film layers of the array substrate 200. Furthermore, the pixel circuit 120 may include at least one thin film transistor, and the thin film transistor includes an active layer 272, a source and drain electrode 273, and a gate 271. The embodiment of the present invention does not limit the specific structure and overall number of the thin film transistors. The light-emitting element 130 can be electrically connected to the first connection metal 274 and the second connection metal 275 in the array substrate 200 through the first electrode 131 and the second electrode 132.

[0121] Figure 14 is a schematic diagram of the structure of another display panel provided by an embodiment of the present invention, referring to Figure 14 As shown, the light-emitting element 130 includes a first light-emitting surface 130A away from the side of the array substrate 200; the display panel 10 also includes a first connecting section 121 located on the side of the first light-emitting surface 130A away from the array substrate 200, and the first connecting section 121 covers at least part of the edge of the first light-emitting surface 130A; the first connecting section 121 includes a light-shielding connecting section.

[0122] Among them, reference Figure 14 As shown, the display panel 10 includes an array substrate 200, a light-emitting element 130, and a first connection sub-section 121. The first connection sub-section 121 may be a portion of an auxiliary connection structure that is not removed when the transfer substrate is transferred to the array substrate 200 during the process of manufacturing the display panel 10. The first connection sub-section 121 may be a black retaining wall.

[0123] Furthermore, the light-emitting element 130 includes a first light-emitting surface 130A, i.e., the light-emitting surface of the light-emitting element 130 on the side away from the array substrate 200. A first connecting portion 121 is located at a portion of the edge of the first light-emitting surface 130A. The first connecting portion 121 is a light-shielding connecting portion that blocks the transmission of light. This prevents crosstalk between light-emitting elements 130 of different colors, thereby improving the overall display quality of the display panel 10. Figure 14 In the figure, the first connection sub-portions 121 are provided on all edges of the first light emitting surface 130A as an example for description. In the embodiment of the present invention, the first connection sub-portions 121 can also be provided on part of the edges of the first light emitting surface 130A, which is not specifically shown in the figure.

[0124] Figure 15 is a schematic structural diagram of another display panel provided by an embodiment of the present invention. Figure 16 is a schematic diagram of the structure of another display panel provided by an embodiment of the present invention, referring to Figure 15 andFigure 16 As shown, the light emitting element 130 includes a side light emitting surface 130B; the display panel 10 also includes a second connecting section 122 located between two adjacent light emitting elements 130, and the second connecting section 122 covers at least part of the side light emitting surface 130B; the second connecting section 122 includes a light-shielding connecting section.

[0125] Specifically, the display panel 10 includes an array substrate 200, a light-emitting element 130, and a second connection sub-section 122. The second connection sub-section 122 may be a portion of an auxiliary connection structure that is not removed when the transfer substrate is transferred to the array substrate 200 during the process of manufacturing the display panel 10. The second connection sub-section 122 may be a black retaining wall.

[0126] Furthermore, the light emitting element 130 includes a side light emitting surface 130B, that is, the light emitting element 130 can emit light on the side away from the array substrate 200, and can also emit light on the side of the light emitting element 130. Figure 15 and Figure 16 As shown, the second connection section 122 covers the side light emitting surface 130B. The second connection section 122 is a light shielding connection portion that can block the transmission of light, thereby avoiding the crosstalk between light emitting elements 130 of different colors when emitting light from the side, thereby improving the overall display effect of the display panel 10. Figure 15 and Figure 16 In the figure, the second connection section 122 covers the entire side light emitting surface 130B as an example for description. In the embodiment of the present invention, the second connection section 122 can also cover part of the side light emitting surface 130B, which is not specifically shown in the figure. Figure 15 As shown, the second connecting portion 122 between two adjacent light emitting elements 130 may be a continuous structure. Figure 16 As shown, the second connecting portion 122 between two adjacent light emitting elements 130 may be a discontinuous structure, which is not specifically limited in the embodiment of the present invention.

[0127] Figure 17 is a schematic diagram of the structure of another display panel provided by an embodiment of the present invention, referring to Figure 17 As shown, the light-emitting element 130 includes a first light-emitting surface 130A on a side away from the array substrate 200 and a side light-emitting surface 130B connected to the first light-emitting surface 130A; the display panel 10 also includes a first connecting section 121 located on the side of the first light-emitting surface 130A away from the array substrate 200 and a second connecting section 122 located between two adjacent light-emitting elements 130, the second connecting section 122 covers at least part of the side light-emitting surface 130B, and at least part of the first connecting section 121 is connected to the second connecting section 122; the first connecting section 121 and the second connecting section 122 both include light-shielding connecting sections.

[0128] Specifically, refer to Figure 17 As shown, the display panel 10 includes an array substrate 200, a light-emitting element 130, a first connection sub-section 121, and a second connection sub-section 122. The first connection sub-section 121 and the second connection sub-section 122 may be auxiliary connection structures that are not removed when the transfer substrate is transferred to the array substrate 200 during the preparation of the display panel 10. The second connection sub-section 122 may be a black retaining wall.

[0129] Furthermore, the light emitting element 130 includes a first light emitting surface 130A and a side light emitting surface 130B, and the first light emitting surface 130A and the side light emitting surface 130B are connected. The first connecting portion 121 is located at the edge of a portion of the first light emitting surface 130A, and the second connecting portion 122 covers at least a portion of the side light emitting surface 130B. Figure 16 As shown, the first connection sub-section 121 and the second connection sub-section 122 can be connected, and the first connection sub-section 121 and the second connection sub-section 122 both include a light-shielding connection sub-section, which can better prevent the light emitted by different light-emitting elements 130 from crosstalking, thereby improving the overall display effect of the display panel 10. Figure 17 In the embodiment, the first connection section 121 and the second connection section 122 may be connected, and the first connection section 121 and the second connection section 122 may not be connected, which is not specifically shown in the figure and is not specifically limited in the embodiment of the present invention.

[0130] Based on the same inventive concept, an embodiment of the present invention further provides a display device, Figure 18 is a structural diagram of a display device provided by an embodiment of the present invention, such as Figure 18 As shown, the display device 1 includes the display panel 10 described in any of the above embodiments. Therefore, the display device 1 provided by the embodiment of the present invention has the corresponding beneficial effects of the above embodiments, which will not be repeated here. For example, the display device 1 can be an electronic device such as a mobile phone, a computer, a smart wearable device (such as a smart watch), and an in-vehicle display device, which is not limited in the embodiment of the present invention.

[0131] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for preparing a display panel, characterized in that: include: providing a transfer substrate; Prepare a cavity structure, an auxiliary connection structure and a light-emitting element on one side of the transfer substrate; The cavity structure penetrates a portion of the transfer substrate; At least a portion of the auxiliary connection structure is staggered with the cavity structure; the light-emitting element is located on a side of the auxiliary connection structure away from the transfer substrate, and projected along the thickness direction of the display panel, the light-emitting element and the cavity structure at least partially overlap; Providing an array substrate and attaching the transfer substrate and the array substrate with the light-emitting element facing the array substrate, wherein the light-emitting element and the array substrate are electrically connected; At least the auxiliary connection structure in contact with the transfer substrate is removed to separate the transfer substrate from the light emitting element.

2. The preparation method according to claim 1, characterized in that Projected along the thickness direction of the display panel, the cavity structure covers the light emitting element.

3. The preparation method according to claim 1, characterized in that The step of providing a transfer substrate comprises: providing a first transfer substrate and a second transfer substrate; The step of preparing the cavity structure, the auxiliary connection structure and the light-emitting element on one side of the transfer substrate includes: preparing an auxiliary connection structure and a light-emitting element on one side of the first transfer substrate, wherein the light-emitting element is located on a side of the auxiliary connection structure close to the first transfer substrate; preparing a cavity structure on a surface of one side of the second transfer substrate; Laminating the first transfer substrate and the second transfer substrate with the auxiliary connection structure facing the side of the second transfer substrate; The first transfer substrate is peeled off.

4. The preparation method according to claim 1, characterized in that The step of preparing the cavity structure, the auxiliary connection structure and the light-emitting element on one side of the transfer substrate includes: preparing a cavity structure on one side of the transfer substrate; preparing a sacrificial structure in the cavity structure, wherein the sacrificial structure fills the cavity structure; preparing an auxiliary connection structure on the surface of the transfer substrate; removing the sacrificial structure; The light emitting element is transferred to a side of the auxiliary connection structure away from the transfer substrate.

5. The preparation method according to claim 1, characterized in that The step of preparing the cavity structure, the auxiliary connection structure and the light-emitting element on one side of the transfer substrate includes: preparing an auxiliary connection structure on the surface of the transfer substrate; using the auxiliary connection structure as a mask to prepare a cavity structure in the transfer substrate; The light-emitting element is transferred to a side of the auxiliary connection structure away from the transfer substrate, and the size of the light-emitting element is larger than the size between two adjacent auxiliary connection structures.

6. The preparation method according to claim 5, characterized in that Using the auxiliary connection structure as a mask, preparing a cavity structure in the transfer substrate includes: The auxiliary connection structure is used as a mask and an isotropic etching process is adopted to prepare a cavity structure in the transfer substrate so that the cavity structure covers the light emitting element when projected along the thickness direction of the display panel.

7. The preparation method according to claim 1, characterized in that The auxiliary connection structure includes a first connection section and a second connection section connected to each other, wherein the second connection section is located on a side of the first connection section away from the cavity structure; The distance between two adjacent first connection sections is L1, and the distance between two adjacent second connection sections is L2. <L2; The light emitting element is located on a side of the first connecting portion away from the transfer substrate and between two adjacent second connecting portions.

8. The preparation method according to claim 1, characterized in that The auxiliary connection structure includes a photosensitive structure; Removing at least the auxiliary connection structure in contact with the transfer substrate, comprising: The photosensitive structure is subjected to exposure and development treatments to at least remove the photosensitive structure in contact with the transfer substrate.

9. The preparation method according to claim 8, characterized in that Performing an exposure process on the auxiliary connection structure includes: The auxiliary connection structure is exposed from one side of the transfer substrate.

10. The preparation method according to claim 1, characterized in that The auxiliary connection structure includes a heat-sensitive structure; Removing at least the auxiliary connection structure in contact with the transfer substrate, comprising: The heat-sensitive structure is subjected to a heat treatment so as to heat-sublimate the heat-sensitive structure and at least remove the heat-sensitive structure in contact with the transfer substrate.

11. A display panel, characterized in that: Prepared by the preparation method according to any one of claims 1 to 10; The display panel includes: array substrate; A light emitting element is located on one side of the array substrate.

12. The display panel according to claim 11, wherein: The light emitting element comprises a first light emitting surface away from the array substrate; The display panel further includes a first connecting portion located on a side of the first light emitting surface away from the array substrate, the first connecting portion covering at least a portion of an edge of the first light emitting surface; the first connecting portion includes a light shielding connecting portion.

13. The display panel according to claim 11, wherein: The light emitting element includes a side light emitting surface; The display panel further includes a second connecting section located between two adjacent light-emitting elements, the second connecting section covering at least a portion of the side light-emitting surface; the second connecting section includes a light-shielding connecting section.

14. The display panel according to claim 11, wherein: The light emitting element comprises a first light emitting surface away from the array substrate and a side light emitting surface connected to the first light emitting surface; The display panel also includes a first connecting section located on the side of the first light-emitting surface away from the array substrate and a second connecting section located between two adjacent light-emitting elements, the second connecting section covers at least part of the side light-emitting surface, and at least part of the first connecting section is connected to the second connecting section; the first connecting section and the second connecting section both include a light-shielding connecting section.

15. The display panel according to claim 11, wherein: The light emitting element includes a micro light emitting diode.

16. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 11 to 15.

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