Display panel, display device and manufacturing method of display panel

Abstract

This application provides a display panel, a display device, and a method for manufacturing the display panel, relating to the field of display technology, and is used to solve the technical problem that defects in a flexible substrate affect the function of a display device. The display panel of this application includes a first flexible substrate with an opening; a first inorganic layer located on one side of the first flexible substrate, covering the opening. This display panel removes the first flexible substrate within the opening to reduce or eliminate the adverse effects of the first flexible substrate, thereby ensuring the function of the display device.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] With the continuous development of display technology, OLED (Organic Light-Emitting Diode) display technology has gradually become the mainstream technology in the display field due to its unique advantages such as low power consumption, high saturation, fast response time and wide viewing angle. It has broad application prospects in automotive, mobile phone, tablet, computer and TV products in the future, especially flexible display panels in OLED display technology. Summary of the Invention

[0003] In view of the above problems, embodiments of this application provide a display panel, a display device, and a method for manufacturing a display panel, so as to reduce or eliminate the adverse effects of the first flexible substrate, improve the bending performance of the bendable area of ​​the display panel, and / or improve the light transmittance of the corresponding area of ​​the photosensitive element of the display panel.

[0004] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0005] The first aspect of this application provides a display panel, including:

[0006] A first flexible substrate, wherein the first flexible substrate is provided with an opening;

[0007] The first inorganic layer is located on one side of the first flexible substrate and covers the opening.

[0008] In the display panel of this application embodiment, since the first flexible substrate is provided with an opening, the first flexible substrate within the opening can be removed to reduce or eliminate the adverse effects of the first flexible substrate, such as increasing the light transmittance of the corresponding area of ​​the photosensitive element of the display panel, and / or improving the bendability of the bending area, thereby ensuring the function of the display device.

[0009] In one possible implementation, the opening is a non-closed opening.

[0010] In one possible implementation, the first inorganic layer includes a first portion and a second portion connected together, the orthographic projections of the first portion and the second portion onto the first flexible substrate being located within an opening, the orthographic projection of the first portion onto the first flexible substrate overlapping at least a portion of the boundary of the opening, and the roughness of the surface of the first portion facing the opening being greater than the roughness of the surface of the second portion facing the opening.

[0011] In one possible implementation, when the opening is a non-closed opening, the orthographic projection of the first portion onto the first flexible substrate overlaps with at least a portion of the boundary of the non-closed end of the opening.

[0012] In one possible implementation, the opening includes a first opening, the display panel includes a first display area and a photosensitive element corresponding area, the light transmittance of the photosensitive element corresponding area is greater than the light transmittance of the first display area, and the first opening is located in the photosensitive element corresponding area.

[0013] And / or, the opening includes a second opening, the display panel includes a first non-bending area, a second non-bending area, and a bendable area located between the first non-bending area and the second non-bending area; the second opening is located in the bendable area.

[0014] In one possible implementation, the area corresponding to the photosensitive element is the second display area.

[0015] In one possible implementation, the display panel further includes: a second flexible substrate, a second inorganic layer, a driving array layer, and a light-emitting device layer, which are sequentially stacked on the side of the first inorganic layer away from the first flexible substrate and in a direction away from the first inorganic layer.

[0016] A second aspect of this application provides a display device, including: a photosensitive element and a display panel as described in any of the above, wherein the opening includes a first opening, and the photosensitive element is located on the side of the first opening away from the first inorganic layer.

[0017] Since the display device of this application embodiment includes any of the above-mentioned display panels, the display device also has the advantages of any of the above-mentioned display panels, which will not be described again in this application embodiment.

[0018] A third aspect of this application provides a method for manufacturing a display panel, comprising:

[0019] Provide a first flexible substrate;

[0020] A first inorganic layer is formed on a first flexible substrate;

[0021] Infrared laser is used to irradiate a predetermined area from the side of the first flexible substrate away from the first inorganic layer in order to reduce the adhesion between the first flexible substrate and the first inorganic layer in the predetermined area.

[0022] The first flexible substrate is cut along the edge of the preset area;

[0023] The first flexible substrate within the preset area is peeled off so that an opening is formed in the first flexible substrate within the preset area.

[0024] The display panel manufacturing method provided in this application embodiment involves forming a first inorganic layer on a first flexible substrate, then irradiating a predetermined area with an infrared laser from the side of the first flexible substrate away from the first inorganic layer. Since the first inorganic layer absorbs the infrared laser, the intermolecular forces between the first inorganic layer and the first flexible substrate are reduced, thereby reducing the adhesion between the first flexible substrate and the first inorganic layer in the predetermined area. Then, the first flexible substrate in the predetermined area is cut and peeled off to remove the first flexible substrate in the predetermined area, forming an opening. Furthermore, the display panel manufacturing method of this application embodiment, due to the absorption of infrared laser by the first inorganic layer, can reduce or eliminate the irradiation of infrared laser onto other film layers located on the side of the first inorganic layer away from the first flexible substrate, preventing damage to other film layers by the infrared laser and thus ensuring the quality of the display panel.

[0025] In one possible implementation, the preset region includes a first sub-region near the edge of the preset region and a second sub-region connected to the first sub-region; the power of the infrared laser in the first sub-region is greater than the power of the infrared laser in the second sub-region.

[0026] The process of peeling off the first flexible substrate within a predetermined area includes: peeling the first flexible substrate in the first sub-region from the first inorganic layer, wherein the first flexible substrate in the first sub-region causes the first flexible substrate in the second sub-region to gradually separate from the first inorganic layer.

[0027] In one possible implementation, the opening is a non-closed opening, and the first sub-region overlaps at least partially with the boundary of the non-closed end of the opening.

[0028] In one possible implementation, the first flexible substrate includes an effective region and a region to be cut. After peeling off the first flexible substrate in the preset region, the method further includes cutting off the first flexible substrate located in the region to be cut and the film layer located on the first flexible substrate. The first sub-region is located in the region to be cut, and the second sub-region is located in the effective region.

[0029] In one possible implementation, the first flexible substrate is a polyimide layer; the first inorganic layer is a silicon oxide layer;

[0030] In one possible implementation, the thickness of the silicon oxide layer is...

[0031] In one possible implementation, the wavelength of the infrared laser is 9400–9800 nm; the power of the infrared laser is 2–12 W. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a cross-sectional structural diagram of the display panel according to an embodiment of this application;

[0034] Figure 2 This is a bottom view of the display panel according to an embodiment of this application;

[0035] Figure 3 This is a bottom view of the display panel structure in some implementations of the embodiments of this application;

[0036] Figure 4 This is a bottom view of the display panel structure in some implementations of the embodiments of this application;

[0037] Figure 5 This is a schematic diagram of the first flexible substrate curling up inside the closed opening.

[0038] Figure 6 This is a bottom view of the display panel structure in some implementations of the embodiments of this application;

[0039] Figure 7 This is a schematic diagram of the display panel structure in some implementations of the embodiments of this application;

[0040] Figure 8 This is a schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application.

[0041] Figure 9 This is a schematic diagram of the formation of the first flexible substrate on a glass substrate;

[0042] Figure 10 A schematic diagram of the formation of the first inorganic layer on the first flexible substrate;

[0043] Figure 11 This is a schematic diagram of forming a second flexible substrate and a second inorganic layer on a first inorganic layer.

[0044] Figure 12 This is a schematic diagram showing the sequential formation of a driving array layer, a light-emitting device layer, and a packaging layer on the second inorganic layer.

[0045] Figure 13 This is a schematic diagram of irradiating a predetermined area from the side of the first flexible substrate away from the first inorganic layer using an infrared laser;

[0046] Figure 14 A cross-sectional structural diagram showing the application of infrared laser to irradiate a predetermined area from the side of the first flexible substrate away from the first inorganic layer.

[0047] Figure 15 A schematic diagram of a dot-matrix distributed infrared laser;

[0048] Figure 16 This is a schematic diagram showing the infrared laser power in the first sub-region being greater than that in the second sub-region.

[0049] Figure 17 A schematic diagram showing the curling of the first flexible substrate within the first sub-region;

[0050] Figure 18 This is a schematic diagram of cutting the first flexible substrate along the edge of a preset area;

[0051] Figure 19 A schematic diagram showing the formation of a cutting line between the first flexible substrate and other parts of the first flexible substrate within a preset area;

[0052] Figure 20 A schematic diagram of the first flexible substrate being peeled off within a predetermined area;

[0053] Figure 21 A schematic diagram of a display panel with an opening formed on a first flexible substrate;

[0054] Figure 22 This is a bottom view of the display panel structure when there is an area to be cut.

[0055] Explanation of reference numerals in the attached figures:

[0056] 100. Glass substrate;

[0057] 200. First flexible substrate;

[0058] 210. Opening;

[0059] 220. Edge;

[0060] 300. First inorganic layer;

[0061] 310. Part One;

[0062] 320. Part Two;

[0063] 400. Drive array layer;

[0064] 500, Light-emitting device layer;

[0065] 600, Encapsulation layer;

[0066] 700, Second flexible substrate;

[0067] 800, Second Inorganic Layer;

[0068] 900, Infrared laser;

[0069] 1000, Ultraviolet Laser;

[0070] 1100, clamp. Detailed Implementation

[0071] As described in the background section, there is a technical problem in the related art where defects in the flexible substrate affect the function of the display device. To address this technical problem, embodiments of this application provide a display panel and a display device, in which an opening is provided in a first flexible substrate, allowing the first flexible substrate within the opening to be removed. This reduces or eliminates the adverse effects of the first flexible substrate, improves the light transmittance of the corresponding area of ​​the photosensitive element in the display panel, and / or improves the bendability of the bendable area, thereby ensuring the function of the display device.

[0072] This application also provides a method for manufacturing a display panel. By using infrared laser irradiation to reduce the viscosity between a first flexible substrate and a first inorganic layer within a predetermined area, and then cutting and peeling off the first flexible substrate within the predetermined area, the ease of removing the first flexible substrate is improved. Furthermore, due to the absorption effect of the first inorganic layer on the infrared laser, the irradiation of the infrared laser onto other film layers located on the side of the first inorganic layer opposite to the first flexible substrate can be reduced or eliminated, preventing damage to other film layers by the infrared laser and thus ensuring the quality of the display panel.

[0073] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0074] refer to Figure 1The display panel of this application embodiment includes a first flexible substrate 200 and a first inorganic layer 300. The first flexible substrate 200 provides support for other film layers of the display panel and has bendable or foldable properties. Exemplarily, the first flexible substrate can be a polyimide layer. A polyimide layer refers to a film layer formed of polyimide material. Polyimide (PI) is an aromatic heterocyclic polymer compound containing imide chain segments, which has advantages such as high temperature resistance, high insulation, and high radiation resistance. Exemplarily, the material of the polyimide layer can be yellow polyimide (YPI) or colorless polyimide (CPI), etc.

[0075] For example, the thickness of the polyimide layer can be 6 to 12 μm, such as 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, and 12 μm. When the thickness of the polyimide layer is within 6 to 12 μm, the display panel can have better bending ability and can save the amount of polyimide material used, thereby reducing the cost of the display panel.

[0076] Understandably, the first flexible substrate can also be other materials, such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).

[0077] refer to Figure 1 The first flexible substrate 200 is provided with an opening 210. Since the first flexible substrate 200 is provided with an opening 210, it is equivalent to removing the first flexible substrate at the position corresponding to the opening 210, so as to reduce or eliminate the adverse effects of the first flexible substrate, thereby improving the light transmittance of the area corresponding to the photosensitive element of the display panel, and / or improving the bendability of the bending area, thereby ensuring the function of the display device.

[0078] For example, the display panel includes a first display area and a photosensitive element corresponding area, wherein the light transmittance of the photosensitive element corresponding area is greater than that of the first display area. The opening includes a first opening 210-1 located in the photosensitive element corresponding area. The photosensitive element corresponding area can be a second display area, and the display panel located within the photosensitive element corresponding area has a display function.

[0079] For example, the area corresponding to the photosensitive element can be an under-display fingerprint area. The under-display fingerprint area refers to the area on the display panel opposite the fingerprint recognition module. The display panel located in the under-display fingerprint area is light-transmitting and has a display function. When a finger is placed on the display panel within the under-display fingerprint area, the fingerprint recognition module can acquire the fingerprint image of that finger and recognize the fingerprint image to obtain the identity information corresponding to that finger. The first opening 210-1 is located in the under-display fingerprint recognition area, which is equivalent to removing the first flexible substrate 200 located within the under-display fingerprint area, increasing the light transmittance of the display panel within the under-display fingerprint area, improving the quality of the fingerprint image acquired by the fingerprint recognition module, and thus improving the accuracy of fingerprint recognition. For example, the under-display fingerprint area can be located on the side of the first flexible substrate 200 near the bottom edge of the display panel. It is understood that the under-display fingerprint area can also be located at other positions on the first flexible substrate 200.

[0080] For example, refer to Figure 2 , Figure 1 It can be along Figure 2 A cross-sectional view along the A1A2 direction. The area corresponding to the photosensitive element can also be the under-display camera area. The under-display camera area refers to the area on the display panel opposite the camera. The display panel located in the under-display camera area has both light-transmitting and display functions. The camera can capture images of the outside world through the display panel in the under-display camera area. Therefore, there is no need to reserve an area on the display panel to install the camera, thus improving the screen-to-body ratio of the display device. The first opening 210-1 is located in the under-display camera area, which is equivalent to removing the first flexible substrate 200 located in the under-display camera area, increasing the light transmittance of the display panel in the under-display camera area, and improving the image quality captured by the camera. For example, the under-display camera area can be located on the side of the first flexible substrate 200 near the top edge of the display device. It is understood that the under-display camera area can also be located at other positions on the first flexible substrate 200.

[0081] For example, refer to Figure 3 , Figure 1 It can be along Figure 3A cross-sectional view along the B1B2 direction. The display panel may further include a first non-bending area A, a second non-bending area B, and a bendable area C located between the first non-bending area A and the second non-bending area B. The display panel is bent or folded within the bendable area C to achieve the bending function of the display device. The opening includes a second opening 210-2, which may be located within the bendable area C. The second opening 210-2 being located within the bendable area C is equivalent to removing the first flexible substrate 200 located within the bendable area C, thereby reducing the thickness of the bendable area C and reducing the bending stress generated by the first flexible substrate 200 when the display panel is bent, thus facilitating the folding of the display panel. Exemplarily, the bendable area C may be located in the middle of the first flexible substrate 200 and penetrate through the first flexible substrate 200. It is understood that the bendable area may also be located at other locations on the first flexible substrate 200. The bendable area C may be located in the display area. The first non-bending area A and / or the second non-bending area B may be located in the display area.

[0082] For example, an infrared laser can be used to irradiate a portion of the first flexible substrate 200 from the side facing away from the first inorganic layer 300, thereby reducing the adhesion between the first flexible substrate and the first inorganic layer in the irradiated area. Then, an ultraviolet laser is used to cut the first flexible substrate in the irradiated area, and the first flexible substrate in the irradiated area is removed to form an opening 210 (such as a first opening 210-1 and / or a second opening 210-2). Due to the absorption of infrared laser light by the first inorganic layer 300, the irradiation of infrared laser light onto other film layers located on the side of the first inorganic layer 300 facing away from the first flexible substrate 200 can be reduced or eliminated, preventing damage to other film layers by the infrared laser and thus ensuring the quality of the display panel.

[0083] In some implementations of the embodiments of this application, reference is made to Figure 2 The opening 210 can be a closed opening. When removing the first flexible substrate inside the closed opening, the first flexible substrate inside the closed opening can be adsorbed by a suction cup, and then a pulling force is applied to the suction cup and the first flexible substrate connected to the suction cup to remove the first flexible substrate inside the closed opening.

[0084] The higher the power of the infrared laser in the irradiated area, the weaker the adhesion between the first flexible substrate and the first inorganic layer 300. The higher the power of the infrared laser in the irradiated area, the greater the damage to the first inorganic layer 300 in the irradiated area, and the greater the roughness of the first inorganic layer 300 in the irradiated area.

[0085] The opening 210 can be a closed opening, meaning that the portion of the first flexible substrate 200 to be removed (corresponding to the preset region F) is located within the entire first flexible substrate 200, rather than at the edge. The first flexible substrate 200 to be removed can be irradiated with an infrared laser of equal power, or it can be irradiated with infrared lasers of different powers in different regions. Irradiating with infrared lasers of different powers in different regions, with high-power infrared lasers irradiating the edge regions of the region to be removed and low-power infrared lasers irradiating the middle regions, reduces damage to the first inorganic layer 300 compared to higher equal-power infrared laser irradiation, and makes it easier to tear off the first flexible substrate to be removed from the region compared to lower equal-power infrared laser irradiation. While higher equal-power infrared laser irradiation makes it easier to tear off the first flexible substrate to be removed from the region, it is more likely to damage the first inorganic layer 300, resulting in a rougher first inorganic layer 300; lower equal-power infrared laser irradiation causes less damage to the first inorganic layer 300, but it is not easy to tear off.

[0086] In other implementations of the embodiments of this application, reference is made to Figure 3 and Figure 4 The opening 210 can also be a non-closed opening. When removing the first flexible substrate at the location corresponding to the non-closed opening, the first flexible substrate at the location corresponding to the non-closed opening can be clamped at the non-closed end D of the non-closed opening, and then the first flexible substrate at the location corresponding to the non-closed opening can be torn off, which improves the convenience of removing the first flexible substrate within the opening 210. In contrast, the location corresponding to the closed opening is surrounded by a film layer, which is not conducive to tearing off the first flexible substrate. Compared to a non-closed opening, when the opening is a closed opening, [reference...] Figure 5 The first flexible substrate at the edge region corresponding to the closed opening needs to be tilted at a larger angle so that tools such as chucks or tweezers can be used to hold the first flexible substrate in the area to be removed. Therefore, the width of the area irradiated by high-power laser in the irradiated area when forming a closed opening is greater than the width of the area irradiated by high-power laser in the irradiated area when forming a non-closed opening. The area of ​​the first inorganic layer 300 with a large degree of damage when forming a closed opening is greater than the area of ​​the first inorganic layer 300 with a large degree of damage when forming a non-closed opening.

[0087] refer to Figure 1The first inorganic layer 300 is located on one side of the first flexible substrate 200, and covers the opening 210. The first inorganic layer 300 and the first flexible substrate 200 have strong adhesion, which improves the adhesion between the first flexible substrate 200 and other film layers located on the side of the first inorganic layer 300 away from the first flexible substrate 200. Furthermore, the first inorganic layer 300 can also block impurities such as moisture and oxygen, preventing these impurities from entering other film layers on the side of the first inorganic layer 300 away from the first flexible substrate 200 and affecting the display performance of the display panel.

[0088] For example, refer to Figure 2 , Figure 3 and Figure 4 The first inorganic layer 300 may include a first portion 310 and a second portion 320 connected together. The orthographic projections of the first portion 310 and the second portion 320 on the first flexible substrate 200 are located within the opening 210. The orthographic projection of the first portion 310 on the first flexible substrate 200 overlaps with at least a portion of the boundary of the opening 210. The surface roughness of the first portion 310 facing the opening 210 is greater than the surface roughness of the second portion 320 facing the opening 210.

[0089] When removing the first flexible substrate within the opening 210, an infrared laser can be used to irradiate the area corresponding to the opening 210 from the side of the first flexible substrate 200 facing away from the first inorganic layer 300. This reduces the adhesion between the first flexible substrate 200 and the first inorganic layer 300, thereby facilitating the removal of the first flexible substrate to form the opening. For example, since the orthographic projection of the first portion 310 onto the first flexible substrate 200 at least partially overlaps with the boundary of the opening 210, the first portion 310 is close to the boundary of the opening 210. When using an infrared laser to irradiate the opening 210, the power of the infrared laser in the first part 310 can be greater than the power of the infrared laser in the second part 320, so that the adhesion between the first flexible substrate and the first inorganic layer 300 in the first part 310 is less than the adhesion between the first flexible substrate and the first inorganic layer 300 in the second part 320. When removing the first flexible substrate, the first flexible substrate corresponding to the first part 310 can be removed first, and then the first flexible substrate corresponding to the second part 320 can be gradually separated from the first inorganic layer 300, which improves the convenience of removing the first flexible substrate in the opening 210.

[0090] The higher the power of the infrared laser in the irradiated area, the weaker the adhesion between the first flexible substrate and the first inorganic layer 300. When the infrared laser power irradiating the edge area of ​​the first flexible substrate to be removed is high, the adhesion between the first flexible substrate and the first inorganic layer 300 is very small. After laser cutting, the edge area of ​​the first flexible substrate to be removed will be raised at a certain angle, making it easier to grasp with chucks or tweezers, and then using the edge area as the starting point to gradually tear off the entire area to be removed. The higher the power of the infrared laser in the irradiated area, the greater the damage to the first inorganic layer 300 in the irradiated area, and the greater the roughness of the first inorganic layer 300 in the irradiated area. The roughness of the surface of the first part 310 facing the opening 210 is greater than the roughness of the surface of the second part 320 facing the opening 210. By dividing the area to be removed from the first flexible substrate, the irradiation power of the infrared laser in the middle area is reduced and the irradiation power of the infrared laser in the outer peripheral area is increased, so as to reduce the damage to the first inorganic layer 300 in the middle area and ensure that the first flexible substrate that is raised on the outer periphery can be easily picked up with chucks or tweezers, and the outer peripheral area is used as the starting point for tearing, which facilitates tearing.

[0091] Optionally, the first flexible substrate includes an effective region M and a region E to be cut, with a first portion 310 located within the region E. A second portion 320 may be located within the effective region. The effective region may include a display area and a non-display area surrounding at least a portion of the display area. The second portion 320 may be located within the display area and / or the non-display area. (Reference) Figure 6 Because the portion of the first inorganic layer irradiated by the high-power infrared laser suffers significant damage, its ability to block water and oxygen is reduced. Therefore, this portion of the first inorganic layer can be placed within the original cutting area E, facilitating the subsequent removal of that portion of the first inorganic layer and the film layer above it. The display panel without the cutting area E removed can be called the original display panel, while the display panel with the cutting area E removed can be called the final display panel. This final display panel can then be installed in electronic devices such as mobile phones, tablets, and laptops.

[0092] Optionally, the display panel is a motherboard, which includes multiple spaced sub-regions and a cutting area E located between the sub-regions. Multiple sub-display panels are formed by cutting along the boundary line between the sub-regions (the effective areas) and the cutting area E. The first part 310 may be located within the cutting area E. The cutting area E may contain test circuits, test pads, etc., for testing the performance of the display panel.

[0093] It should be noted that the orthographic projection of the first part 310 on the first flexible substrate 200 at least partially overlaps with the boundary of the opening 210, meaning that the orthographic projection of the first part 310 on the first flexible substrate 200 may only partially overlap with the boundary of the opening 210 or may completely overlap.

[0094] For example, refer to Figure 3 and Figure 4 When the opening 210 is not closed, the orthographic projection of the first portion 310 onto the first flexible substrate 200 at least partially overlaps with the boundary of the non-closed end D of the opening 210. When the opening 210 is irradiated with an infrared laser, the power of the infrared laser in the first portion 310 can be greater than the power of the infrared laser in the second portion 320. The adhesion between the first flexible substrate in the first portion 310 and the first inorganic layer 300 is less than the adhesion between the first flexible substrate in the second portion 320 and the first inorganic layer 300. Since the first portion 310 is close to the non-closed end of the opening 210, the first flexible substrate in the first portion 310 will curl. When removing the first flexible substrate in the opening 210, the curled first flexible substrate in the first portion 310 can be held with tools such as chucks or tweezers. The first flexible substrate in the first portion 310 drives the first flexible substrate in the second portion 320 to gradually separate from the first inorganic layer 300, improving the convenience of removing the first flexible substrate at the opening 210.

[0095] In some implementations of this application, the display panel further includes a region E to be cut, which is located at the edge of the display panel. During the manufacturing process of the display panel, the first flexible substrate and other film layers located on the first flexible substrate within the region E to be cut are removed from the display panel. The first portion 310 may be located within the region E to be cut. When the region E to be cut is removed, the first portion 310 can be removed from the display panel to eliminate the influence of the first portion 310 on the performance of the display panel.

[0096] For example, the first inorganic layer 300 can be a silicon oxide layer. The silicon oxide layer and the polyimide layer have strong intermolecular forces, which can increase the adhesion between the silicon oxide layer and the polyimide layer. Furthermore, the silicon oxide layer can absorb infrared laser light, preventing it from reaching other film layers located on the side of the silicon oxide layer opposite to the polyimide layer, thereby ensuring the display performance of the display panel. For example, the thickness of the silicon oxide layer can be [missing information]. For example, it can be... or Etc. Thickness is The silicon oxide layer can effectively absorb infrared laser light, thus protecting the other film layers on the side of the silicon oxide layer facing away from the polyimide layer.

[0097] It is understandable that the first inorganic layer can also be other materials, such as silicon nitride.

[0098] For example, refer to Figure 7The display panel also includes a second flexible substrate 700, a second inorganic layer 800, a driving array layer 400, and a light-emitting device layer 500, which are sequentially stacked on the side of the first inorganic layer 300 away from the first flexible substrate 200 and in a direction away from the first inorganic layer 300. The first flexible substrate 200 and the second flexible substrate 700 can improve the buffering capacity of the display panel, buffering the forces generated by subsequent processes and reducing the impact of these forces on the display panel, thus protecting it. The second flexible substrate 700 can be a colorless flexible substrate or a colored flexible substrate. The colorless flexible substrate can be colorless polyimide. The colored flexible substrate can be yellow polyimide.

[0099] In some other implementations of the embodiments of this application, a third flexible substrate and a third inorganic layer may be sequentially disposed between the second inorganic layer 800 and the driving array layer 400. That is, there may be multiple flexible substrates and inorganic layers to further enhance the bending ability and buffering ability of the display panel.

[0100] The display panel also includes an encapsulation layer 600 located on the side of the light-emitting device layer 500 facing away from the driving array layer 400. The encapsulation layer 600 encapsulates and protects the light-emitting device layer 500, preventing impurities such as moisture and oxygen from entering the light-emitting device layer 500, thereby ensuring the display performance of the display panel. The encapsulation layer 600 may be a thin-film encapsulation layer.

[0101] This application also provides a display device, including: a photosensitive element and a display panel as described above, the opening including a first opening, and the photosensitive element located on the side of the first opening away from the first inorganic layer. Since the display device of this application includes the aforementioned display panel, it also possesses the advantages of the aforementioned display panel, which will not be elaborated further in this application. The photosensitive element may include a camera, a fingerprint sensor, etc. The photosensitive element is located on the non-display side of the display panel. This display device can be installed in mobile phones, tablet computers, etc.

[0102] refer to Figure 8 The method for manufacturing a display panel according to an embodiment of this application includes:

[0103] S100 provides a first flexible substrate.

[0104] The first flexible substrate provides support for the display panel and has properties such as being bendable or foldable.

[0105] For example, the first flexible substrate 200 may be a polyimide layer. (Reference) Figure 9 When fabricating a polyimide film, liquid polyimide can be applied to a rigid substrate, such as a glass substrate 100; then the liquid polyimide is cured to form a polyimide layer on the glass substrate 100.

[0106] During the fabrication of the polyimide layer 200, the glass substrate 100 provides support for the polyimide layer 200, facilitating its formation and improving the ease of fabrication. For example, in subsequent processing steps, the glass substrate 100 can be removed by laser lift-off or mechanical glass removal.

[0107] S200, A first inorganic layer is formed on the first flexible substrate.

[0108] refer to Figure 10 A first inorganic layer 300 is formed on the first flexible substrate 200. Exemplarily, the first inorganic layer can be a silicon oxide layer. Exemplarily, silicon oxide material can be deposited on the first flexible substrate 200 using chemical vapor deposition (CVD) to form the silicon oxide layer. The CVD deposition temperature of the silicon oxide layer can be 350–450°C, which can reduce the deformation of the first flexible substrate 200 caused by heat, prevent damage to the first flexible substrate 200, and ensure the quality of the display panel.

[0109] For example, the material of the silicon oxide layer can be silicon monoxide, silicon dioxide, or a mixture of silicon monoxide and silicon dioxide, and the material of the silicon oxide layer can also include other silicon oxide compounds.

[0110] refer to Figure 11 In some implementations of this application, a second flexible substrate 700 and a second inorganic layer 800 can be sequentially fabricated on the first inorganic layer 300. The first flexible substrate 200 and the second flexible substrate 700 can improve the buffering capacity of the display panel, buffering the forces generated by subsequent processes and reducing the impact of these forces on the display panel, thereby protecting the display panel. For example, when peeling the glass substrate 100, the first flexible substrate 200 and the second flexible substrate 700 can buffer the peeling force to reduce the effect of the peeling force on other film layers, preventing cracks in other film layers or separation between other film layers, thereby preventing damage to the display panel.

[0111] For example, refer to Figure 12 The method for manufacturing a display panel according to the present application embodiment further includes: on the side of the first inorganic layer away from the first flexible substrate, a driving array layer 400, a light-emitting device layer 500 and an encapsulation layer 600 are sequentially stacked in a direction away from the first inorganic layer.

[0112] It is understandable that, after removing the first flexible substrate within the preset region F, the driving array layer 400, the light-emitting device layer 500, and the encapsulation layer 600 can be sequentially formed on the second inorganic layer 800.

[0113] S300: Use an infrared laser to irradiate a preset area from the side of the first flexible substrate away from the first inorganic layer, so as to reduce the adhesion between the first flexible substrate and the first inorganic layer in the preset area.

[0114] For example, after the encapsulation layer 600 is formed, the glass substrate 100 can be removed. For example, the glass substrate 100 and the first flexible substrate 200 can be separated by laser peeling or mechanical peeling, and then the glass substrate 100 can be removed.

[0115] refer to Figure 13 After removing the glass substrate 100, an infrared laser can be used to irradiate a predetermined region F from the side of the first flexible substrate 200 away from the first inorganic layer 300, thereby reducing the adhesion between the first flexible substrate 200 and the first inorganic layer 300 within the predetermined region F. The first inorganic layer 300 can absorb the infrared laser, which reduces the intermolecular forces between the first inorganic layer 300 and the first flexible substrate 200, thus reducing the adhesion between them within the predetermined region F. The infrared laser can be emitted using a carbon dioxide laser.

[0116] Furthermore, since the first inorganic layer 300 has an absorption effect on infrared lasers, it can reduce or eliminate the infrared laser irradiation onto other film layers on the side of the first inorganic layer 300 away from the first flexible substrate 200, preventing the infrared laser from damaging other film layers, thereby ensuring the quality of the display panel.

[0117] For example, the wavelength of the infrared laser can be 9400-9800 nm, such as 9400 nm, 9600 nm, or 9800 nm. The first inorganic layer 300 has a high absorption rate for infrared lasers with wavelengths of 9400-9800 nm, which can reduce the intermolecular forces between the first inorganic layer 300 and the first flexible substrate 200, thus ensuring the anti-adhesion effect between the first inorganic layer 300 and the first flexible substrate 200.

[0118] The power of the infrared laser can be 2 to 12 W, such as 2 W, 4 W, 6 W, 8 W, 10 W, or 12 W. An infrared laser with a power of 2 to 12 W can provide sufficient energy to reduce the adhesion between the first inorganic layer 300 and the first flexible substrate 200, preventing the adhesion between the first inorganic layer 300 and the first flexible substrate 200 from being too great, which would cause the first flexible substrate within the preset region F to be unable to be peeled off.

[0119] It should be noted that the preset region F refers to the area on the first flexible substrate 200 that needs to be removed. Removing the first flexible substrate within the preset region F forms the opening 210.

[0120] refer to Figure 14 A dot-matrix distributed infrared laser 900 can be used to irradiate a preset area F from the side of the first flexible substrate 200 away from the first inorganic layer 300. During the irradiation process, the display panel can be flipped so that the first flexible substrate 200 is on top, so as to facilitate the irradiation of the preset area F of the first flexible substrate 200.

[0121] For example, refer to Figure 15 The dot-matrix distributed infrared laser 900 refers to an infrared laser with a spot shape of dots or a matrix of dots. When irradiating the first flexible substrate 200, the dots or dot-matrix spots are arranged in a matrix within a preset area to fill the preset area F, forming a dot-matrix distribution. The area of ​​the dot-matrix distributed infrared laser can be equal to the area of ​​the preset area F to irradiate the first flexible substrate 200 within the preset area F, thereby reducing the adhesion between the first flexible substrate 200 and the first inorganic layer 300 within the preset area F.

[0122] In some implementations of this application, the preset region F includes a first sub-region G near its edge 220 and a second sub-region H connected to the first sub-region G. The power of the infrared laser in the first sub-region G is greater than that in the second sub-region H, so that the adhesion between the first flexible substrate and the first inorganic layer 300 in the first sub-region G is less than that between the first flexible substrate and the first inorganic layer 300 in the second sub-region H. When removing the first flexible substrate in the preset region F, the first flexible substrate in the first sub-region G can be peeled off from the first inorganic layer 300 firstly, and then the first flexible substrate in the first sub-region G can be used to gradually separate the first flexible substrate in the second sub-region H from the first inorganic layer 300, improving the convenience of removing the first flexible substrate in the preset region F. The adhesion between the first flexible substrate and the first inorganic layer 300 in the region not irradiated by the infrared laser is greater than that in the region irradiated by the infrared laser. The roughness of the first inorganic layer 300 in the region not irradiated by the infrared laser is less than the roughness of the first inorganic layer 300 in the region irradiated by the infrared laser.

[0123] refer to Figure 14 , Figure 16 and Figure 17 Taking the preset area F as the under-display camera area as an example, when the first sub-area G is close to the edge 220 of the preset area F, the power P1 of the infrared laser in the first sub-area G of the preset area F can be greater than the power P2 of the infrared laser dot matrix in the second sub-area H. (Reference) Figure 16The infrared laser in the first sub-region G has a higher power, and the adhesion between the first flexible substrate and the first inorganic layer 300 in the first sub-region G is less than that between the first flexible substrate and the first inorganic layer 300 in the second sub-region H. Since the first sub-region G is close to the edge 220 of the preset region F, the first flexible substrate in the first sub-region G can be rolled up. The rolled-up first flexible substrate separates from the first inorganic layer 300. Subsequently, the rolled-up first flexible substrate in the first sub-region G can be clamped to facilitate the peeling of the first flexible substrate.

[0124] For example, the power of the infrared laser in the preset region F can be gradually reduced from the edge 220 toward the center of the first flexible substrate 200, so that the adhesion between the first flexible substrate and the first inorganic layer 300 in the preset region F gradually decreases from the center toward the edge 220, so as to facilitate the peeling of the first flexible substrate in the preset region F.

[0125] S400, Cut the first flexible substrate along the edge of the preset area.

[0126] For example, the first flexible substrate 200 can be cut along the edge of the preset region F to separate the first flexible substrate with reduced adhesion to the first inorganic layer 300 within the preset region F from other portions of the first flexible substrate 200. For example, referring to... Figure 18 and Figure 19 An ultraviolet laser 1000 can be used to cut the first flexible substrate 200 along the edge of a preset region F. The ultraviolet laser can form a cutting line S between the first flexible substrate in the preset region F and other parts of the first flexible substrate 200, thus separating the first flexible substrate within the preset region F. For example, the wavelength of the ultraviolet laser can be 350–360 nm, such as 350 nm, 355 nm, or 360 nm. The power of the ultraviolet laser can be 1–2 W, such as 1 W, 1.5 W, or 2 W. An ultraviolet laser with a wavelength of 350–360 nm and a power of 1–2 W can cut the first flexible substrate 200 without damaging the first inorganic layer 300, ensuring the quality of the display panel.

[0127] S500: Peel off the first flexible substrate within the preset area so that the first flexible substrate forms an opening in the preset area.

[0128] refer to Figure 20 and Figure 21 After cutting the polyimide layer 200, the first flexible substrate in the preset region F is peeled off, thereby removing the first flexible substrate in the preset region F to form an opening 210 on the first flexible substrate 200.

[0129] For example, during the peeling process, a suction cup can be used to adsorb the first flexible substrate in the preset peeling area F, and then a pulling force can be applied to the first flexible substrate in the preset area F through the suction cup to pull the first flexible substrate in the preset area F away from the first inorganic layer 300.

[0130] For example, refer to Figure 20 When the first flexible substrate in the first sub-region G curls up, the first flexible substrate in the first sub-region G can be clamped using a chuck 1100 or tweezers. Then, the first flexible substrate in the first sub-region G drives the first flexible substrate in the second sub-region H to gradually separate from the first inorganic layer 300, thereby improving the convenience of peeling off the first flexible substrate.

[0131] In some implementations of this application, the first flexible substrate 200 includes an effective region M and a region to be cut E. The method for manufacturing the display panel further includes cutting away the first flexible substrate located in the region to be cut and the film layer located on the first flexible substrate. A first sub-region G is located within the region to be cut. A second sub-region H may be located within the effective region M. (See reference...) Figure 22 The display panel has a cutting area E on its periphery, and a first sub-region G located within the cutting area E. A first portion 310 may be located within the first sub-region G. A second portion 320 may be located within the second sub-region H. After the first flexible substrate within the preset area F is peeled off, cutting can be performed along the boundary line between the cutting area E and the effective area M, removing the first flexible substrate and other films on the first flexible substrate, while retaining the first flexible substrate within the effective area M and other films on the first flexible substrate, which can then serve as the final display panel. Since the first sub-region G is located within the cutting area E, removing the cutting area E allows for the removal of the films within the first sub-region G, thus eliminating the impact of the films within the first sub-region G on the performance of the display panel.

[0132] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A method for manufacturing a display panel, characterized in that, include: Provide a first flexible substrate; A first inorganic layer is formed on the first flexible substrate; An infrared laser is used to irradiate a preset area from the side of the first flexible substrate away from the first inorganic layer to reduce the adhesion between the first flexible substrate and the first inorganic layer within the preset area; wherein, the preset area includes a first sub-region near the edge of the preset area and a second sub-region connected to the first sub-region, and the power of the infrared laser in the first sub-region is greater than the power of the infrared laser in the second sub-region. The first flexible substrate is cut along the edge of the preset area; The first flexible substrate in the first sub-region is peeled off from the first inorganic layer. The first flexible substrate in the first sub-region drives the first flexible substrate in the second sub-region to gradually separate from the first inorganic layer, so that the first flexible substrate forms an opening in the preset region.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The opening is a non-closed opening that extends through the edge of the first flexible substrate to form a non-closed end of the non-closed opening, and at least a portion of the boundary of the first sub-region overlaps with the boundary of the non-closed end of the opening.

3. The method for manufacturing a display panel according to claim 2, characterized in that, The first flexible substrate includes an effective area and a region to be cut. After the first flexible substrate within the preset region is peeled off, it further includes: The first flexible substrate located in the area to be cut and the film layer located on the first flexible substrate are cut away. The first sub-region is located in the area to be cut, and the second sub-region is located in the effective area.

4. The method for manufacturing a display panel according to any one of claims 1-3, characterized in that, The first flexible substrate is a polyimide layer; the first inorganic layer is a silicon oxide layer.

5. The method for manufacturing a display panel according to claim 4, wherein the thickness of the silicon oxide layer is 4000~8000 Å.

6. The method for manufacturing a display panel according to any one of claims 1-3, characterized in that, The wavelength of the infrared laser is 9400~9800nm; the power of the infrared laser is 2~12W.

7. A display panel, characterized in that, The display panel is obtained by the manufacturing method according to any one of claims 1-6, and comprises: A first flexible substrate, wherein the first flexible substrate is provided with an opening; A first inorganic layer is located on one side of the first flexible substrate, and the first inorganic layer covers the opening; The first inorganic layer includes a first portion and a second portion connected together. The orthographic projections of the first portion and the second portion onto the first flexible substrate are located within the opening. The orthographic projection of the first portion onto the first flexible substrate overlaps with at least a portion of the boundary of the opening. The surface roughness of the first portion facing the opening is greater than the surface roughness of the second portion facing the opening.

8. The display panel according to claim 7, characterized in that, The opening is a non-closed opening, and the non-closed opening extends through the edge of the first flexible substrate to form the non-closed end of the non-closed opening; The first part is located between the second part and the non-closed end.

9. The display panel according to claim 8, characterized in that, The orthographic projection of the first portion onto the first flexible substrate overlaps with at least a portion of the boundary of the non-closed end.

10. The display panel according to claim 7 or 8, characterized in that, The opening includes a first opening, the display panel includes a first display area and a photosensitive element corresponding area, the light transmittance of the photosensitive element corresponding area is greater than the light transmittance of the first display area, and the first opening is located in the photosensitive element corresponding area.

11. The display panel according to claim 7 or 8, characterized in that, The opening includes a second opening, and the display panel includes a first non-bending area, a second non-bending area, and a bendable area located between the first non-bending area and the second non-bending area; the second opening is located in the bendable area.

12. The display panel according to claim 10, characterized in that, The area corresponding to the photosensitive element is the second display area.

13. The display panel according to claim 7, characterized in that, The display panel further includes: a second flexible substrate, a second inorganic layer, a driving array layer, and a light-emitting device layer, which are sequentially stacked on the side of the first inorganic layer away from the first flexible substrate and in a direction away from the first inorganic layer.

14. The display panel according to claim 7 or 8, characterized in that, The first part is more damaged by infrared laser than the second part.

15. The display panel according to claim 7 or 8, characterized in that, It also includes a region to be cut, which is located at the edge of the display panel, and the first part is located within the region to be cut.

16. A display device, characterized in that, include: The photosensitive element and the display panel as described in any one of claims 7-15, wherein the opening includes a first opening, and the photosensitive element is located on the side of the first opening away from the first inorganic layer.

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