Sensing system

Abstract

A sensing system comprising an emitter configured to emit electromagnetic radiation, a detector configured to detect the electromagnetic radiation, and an electronic component configured to interact with a circuit of the sensing system. The electronic component is at least partially located between the emitter and the detector. The electronic component reduces the amount of electromagnetic radiation that propagates from the emitter to the detector. The electronic component advantageously reduces undesired detection of electromagnetic radiation that would otherwise propagate directly from the emitter to the detector without leaving the sensing system, thereby reducing measurement noise and improving the accuracy of the sensing system. The sensing system may form part of a time of flight sensing system or a proximity sensing system. The sensing system may form part of an electronic device such as a mobile phone.

Description

Technical Field

[0001] The present disclosure relates to a sensing system applicable to electronic devices, and particularly, but not exclusively, to a time-of-flight sensing system or a proximity sensing system applicable to mobile phones. Background Art

[0002] exist Figure 1A and Figure 1B An example of a known sensing system 100 is shown in FIG. The known sensing system 100 includes an emitter 110 configured to emit electromagnetic radiation and a detector 120 configured to detect electromagnetic radiation. The emitter 110 is located on a first die 130 and the detector 120 is located on a second die 140. The first die 130 and the second die 140 are located on a substrate 160. The substrate 160 may form a portion of a printed circuit board (not shown) of an electronic device (not shown). The substrate 160 includes electrical contacts 170 for electrically connecting the substrate 160 to other circuits (e.g., the sensing system 100 and / or one or more processors of the electronic device). The die 130, 140 includes electrical contacts 150 for electrically connecting the die 130, 140 to the substrate 160 and other circuits (e.g., the processor of the electronic device). The known sensing system 100 includes a shield 180 located between the emitter 110 and the detector 120. The shield 180 is only used to block at least some electromagnetic radiation from propagating directly from the emitter 110 to the detector 120 to reduce noise in the detector signal. The known sensing system 100 also includes a first housing 182 and a second housing 184, which are substantially transparent to the operating wavelengths of the emitter 110 and the detector 120 (e.g., visible and / or infrared wavelengths of electromagnetic radiation). The first housing 182 is configured to protect the detector 120 and includes a lens 186 for capturing incident electromagnetic radiation and focusing the incident electromagnetic radiation onto the detector 120. The second housing 184 is configured to protect the emitter 110. The known sensing system 100 also includes a cap 190, which includes a first hole 192 and a second hole 194, the first hole 192 is configured to transmit electromagnetic radiation to the detector 120, and the second hole 194 is configured to allow electromagnetic radiation emitted by the emitter 110 to leave the sensing system 100. The shield 180 is typically made of plastic and is glued to the sensing system 100 before the first and second housings 182 , 184 and the cap 190 are mounted on the shield 180 .

[0003] It is an object of the present disclosure to provide a sensing system that solves one or more problems associated with known sensing systems, or at least provides a useful alternative. Summary of the invention

[0004] In general, the present invention relates to a sensing system comprising an emitter, a detector, and an electronic component configured to interact with a circuit of the sensing system. The electronic component is at least partially located between the emitter and the detector. The electronic component blocks (e.g., absorbs and / or redirects) a certain amount of electromagnetic radiation that would otherwise propagate directly from the emitter to the detector without leaving the sensing system. The electronic component advantageously not only performs its standard function of interacting with the circuit of the sensing system, but also blocks at least some electromagnetic radiation from traveling directly from the emitter to the detector. This eliminates the need for shielding of known sensing systems, which advantageously enables a more compact sensing system. The sensing system according to the present invention includes at least one less component than known sensing systems, thereby simplifying the manufacture of the sensing system and reducing the manufacturing cost of the sensing system. The size, shape, and / or position of the electronic component can be designed to at least partially block the line of sight from the emitter to the detector. The electronic component can include a material that is substantially opaque (e.g., blocks about 90% or more of the incident radiation) to the wavelength of the electromagnetic radiation emitted by the emitter and detected by the detector.

[0005] According to one aspect of the present disclosure, a sensing system is provided, which includes an emitter configured to emit electromagnetic radiation and a detector configured to detect electromagnetic radiation. The sensing system also includes an electronic component configured to interact with a circuit of the sensing system. The electronic component is at least partially located between the emitter and the detector. The electronic component reduces the amount of electromagnetic radiation propagating from the emitter to the detector.

[0006] A known sensing system includes a shield located between an emitter and a detector. The sole purpose of the shield is to reduce the detection of electromagnetic radiation that propagates directly from the emitter to the detector. The shield achieves this by blocking (e.g., redirecting and / or absorbing) at least some of the radiation that is incident on the electronic component. A known sensing system also includes an electronic component that is used only for its electronic function. By positioning the electronic component at least partially between the emitter and the detector, the electronic component not only performs its standard function of interacting with the circuitry of the sensing system, but also reduces the detection of electromagnetic radiation that propagates from the emitter to the detector without leaving the sensing system. This eliminates the need for a shield, which advantageously enables a more compact sensing system than known sensing systems. The sensing system includes at least one less component than known sensing systems, thereby simplifying the manufacture of the sensing system and reducing the manufacturing cost of the sensing system.

[0007] The electronic assembly can reduce the amount of electromagnetic radiation that propagates directly from the emitter to the detector. The electronic assembly can be configured to at least partially block the line of sight between the emitter and the detector. Reducing the detection of electromagnetic radiation that propagates directly from the emitter to the detector without leaving the sensing system advantageously improves the accuracy of measurements performed using the sensing system. This is because radiation that propagates directly from the emitter to the detector (i.e., does not leave the sensing system and interact with the object to be sensed) contributes to measurement noise. The detector is suitable for detecting electromagnetic radiation that leaves the emitter, leaves the sensing system via an optical aperture, interacts with one or more external objects (e.g., is reflected from one or more external objects), and returns to the detector for detection.

[0008] The sensing system may be a time-of-flight sensing system and / or a proximity sensing system.

[0009] The emitter may be any kind of electromagnetic radiation source suitable for incorporation into an electronic device such as a mobile phone. The emitter may be a diode or a laser such as a vertical cavity surface emitting laser (VCSEL).

[0010] The detector may be any form of photodetector suitable for incorporation into an electronic device such as a mobile phone.The detector may be a photodiode such as a single photon avalanche diode (SPAD).

[0011] Electronic components may be passive (eg, capacitors, inductors, resistors, transformers, transducers, etc.), active (eg, transistors, diodes, power supplies, electrostatic discharge devices, etc.), and / or electromechanical (eg, switches, piezoelectric devices, fuses, connectors, etc.).

[0012] The electronic component may include a capacitor configured to at least partially stabilize a voltage of the circuit and / or reduce the effects of a field acting on the circuit.

[0013] In known sensing systems, electronic components such as capacitors are typically not on the same die or substrate as the circuitry of the sensing system. The capacitors of the sensing system of the present invention advantageously provide at least two functions: reducing the amount of electromagnetic radiation that propagates directly from the transmitter to the detector, and at least partially stabilizing the voltage of the circuit and / or reducing the effects of fields acting on the circuit. The field may be an electric field. The field may be a magnetic field. The field may be an electromagnetic field. The field may be an external field, i.e. a field generated outside the sensing system. The field may be an internal field, such as a magnetic field generated by current passing through the circuit.

[0014] An electronic component may include an inductor configured to act as a filter for a circuit.

[0015] An electronic component may include a resistor configured to function as a pull-up resistor or a pull-down resistor for a circuit.

[0016] The electronic components may include resistors and capacitors configured to act as an RC filter for the circuit.

[0017] An electronic component may include a diode configured to reduce the effects of a field acting on the circuit.

[0018] The sensing system may include a die configured to house circuitry of the sensing system. Electronic components may be located on the die.

[0019] The die may include a CMOS component used as an integrated circuit. The die may be located on a substrate of a printed circuit board. The closer the capacitor is to the circuit with which it is configured to interact, the lower the resistance between the electronic component and the circuit, and the better the performance of the electronic component.

[0020] The circuit may include an integrated circuit of the sensing system.The die may house the integrated circuit.

[0021] Emitters and detectors may be located on the die.

[0022] The sensing system may include a substrate configured to provide an electrical connection between the die and a printed circuit board of the sensing system. The emitter may be located on the substrate. The detector may be located on the die. The emitter may be located on the die. The detector may be located on the substrate.

[0023] The closer the electronic component is to the circuit (e.g., the die and / or substrate housing the emitter and / or detector), the lower the resistance between the electronic component and the circuit. Reducing the resistance advantageously improves the performance of the electronic component. For example, if the electronic component includes a capacitor, the ability of the capacitor to stabilize the voltage of the circuit and / or reduce the effects of fields acting on the circuit can be improved by positioning the capacitor on the same die and / or substrate as the circuit.

[0024] The sensing system may include a filler disposed between the electronic component and the sensing system.

[0025] The filler may include ink. The filler may include glue configured to secure the electronic component to the sensing system. The filler may be substantially opaque to the wavelength of radiation emitted by the emitter and detected by the detector. The filler may advantageously further reduce the amount of electromagnetic radiation that propagates directly from the emitter to the detector.

[0026] The sensing system may include an electrode configured to receive the electronic component. The filler may include a conductive adhesive configured to attach the electronic component to the electrode.

[0027] The sensing system may include two electrodes configured to receive the electronic component. The electronic component may include two electrodes configured to connect to the electrodes of the sensing system.

[0028] The sensing system may include electrical contacts and a conductive connector configured to connect the electronic component to the electrical contacts. The filler may include a non-conductive adhesive configured to attach the electronic component to the sensing system. The sensing system may advantageously be less expensive to manufacture than other sensing systems.

[0029] The sensing system may be a time of flight sensing system.The sensing system may be a proximity sensing system.

[0030] The electronic device may include the sensing system. The electronic device may be a mobile electronic device, such as a mobile phone or a tablet computer. The electronic device may be an industrial electronic device, such as an automated manufacturing system or a robotic system, such as those used in the automotive industry. The electronic device may form part of an automation system for automating a house or building.

[0031] A method of emitting and detecting electromagnetic radiation may include using the sensing system.

[0032] According to a second aspect of the present disclosure, there is provided a method of manufacturing a sensing system, comprising providing an emitter configured to emit electromagnetic radiation, providing a detector configured to detect the electromagnetic radiation, providing an electronic component configured to interact with a circuit of the sensing system, and positioning the electronic component at least partially between the emitter and the detector. The electronic component reduces the amount of electromagnetic radiation propagating from the emitter to the detector.

[0033] Finally, the present sensing system disclosed herein utilizes a novel approach, at least in that an electronic component configured to interact with the circuitry of the sensing system is located at least partially between the emitter and the detector. The electronic component reduces the amount of electromagnetic radiation propagating from the emitter to the detector. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Some embodiments of the present disclosure will now be described, by way of example only, and with reference to the accompanying drawings, in which:

[0035] Figure 1A and Figure 1B schematically depicts a cross-sectional side view and exploded view of a known sensing system;

[0036] Figure 2 schematically depicts a view from above of a portion of a known printed circuit board including electronic components;

[0037] Figure 3A and Figure 3B schematically depicts a view from above and a cross-sectional view from the side of a sensing system according to an embodiment of the invention;

[0038] Figure 4A and Figure 4Bschematically depicts a view from above and a cross-sectional view from the side of an alternative sensing system according to an embodiment of the invention; and,

[0039] Figure 5 A method of manufacturing a sensing system according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0040] In general, the present disclosure provides a sensing system suitable for use in an electronic device. The sensing system includes an emitter configured to emit electromagnetic radiation and a detector configured to detect the electromagnetic radiation. The sensing system also includes an electronic component configured to interact with a circuit of the sensing system. The electronic component is at least partially located between the emitter and the detector. The electronic component prevents at least some radiation from propagating directly from the emitter to the detector without leaving the sensing system. The electronic component may at least partially block the line of sight between the emitter and the detector. The electronic component may completely block the line of sight between the emitter and the detector.

[0041] Some examples of solutions are given in the accompanying figures.

[0042] Figure 3A A view from above of a sensing system 300 according to an embodiment of the present invention is schematically depicted. Figure 3B Schematically depicts the Figure 3A 300 is a cross-sectional view of a side view of a sensing system 300. The sensing system 300 includes an emitter 310 and a detector 320. The emitter 310 is configured to emit electromagnetic radiation. The emitter 310 can be any kind of electromagnetic radiation source suitable for incorporation into an electronic device, such as a diode or a laser, such as a vertical cavity surface emitting laser (VCSEL). The detector 320 is configured to detect electromagnetic radiation. The detector 320 can be configured to detect the electromagnetic radiation after the electromagnetic radiation emitted by the emitter 310 has left the sensing system 300, interacted with an external object (e.g., reflected from an external object) and propagated back to the detector 320. The detector 320 can be any form of photodetector, such as a photodiode, such as a single photon avalanche diode (SPAD). The sensing system 300 can be a time-of-flight sensing system or a proximity sensing system. The sensing system 300 can be suitable for incorporation into an electronic device such as, for example, a mobile phone or a tablet computer.

[0043] The time-of-flight sensing system may involve an emitter 310 emitting electromagnetic radiation, and at least some of the electromagnetic radiation interacting with (e.g., reflecting from) one or more external objects before propagating back to the detector 320 for detection. The amount of time between the emitter 310 emitting the radiation and the detector 320 detecting the radiation may be measured, and the distance between the electronic device and the one or more external objects may be determined using the known speed of light. The time-of-flight sensing system may be used for relatively high accuracy measurements. For example, if the time-of-flight sensing system is incorporated into a mobile phone including a camera, the time-of-flight sensing system may be used to determine the distance between the camera and the external object in order to adjust the focus of the camera to achieve an improved image of the object. Alternative uses of the time-of-flight sensing system include uses in the automotive industry, robotics, manufacturing, and automation processes. In the case of a time-of-flight sensing system, the sensing system 300 may also include a second detector (not shown) located near the emitter 310. The second detector may be configured to provide a reference detection value of background electromagnetic radiation for the time-of-flight sensing system.

[0044] The sensing system 300 may alternatively be a proximity sensing system in which the emitter 310 emits electromagnetic radiation, at least some of which leaves the sensing system 300 and interacts with (e.g., reflects from) one or more external objects before being incident on the detector 320 for detection. The amount of radiation emitted by the emitter 310 may be compared with the amount of radiation detected by the detector 320 to determine the distance between the electronic device and the one or more external objects. The proximity sensing system may be used for measurements of relatively low accuracy. For example, if the proximity sensing system is incorporated into a mobile phone that includes a touch screen, the proximity sensing system may be used to determine whether the phone has been placed near the user's ear in order to change the input display on the touch screen to avoid unwanted input commands during a phone call.

[0045] The sensing system 300 also includes an electronic component 330 configured to interact with the circuit of the sensing system. The electronic component 330 may include passive components (e.g., capacitors, inductors, resistors, transformers, transducers, etc.), active components (e.g., transistors, diodes, power supplies, electrostatic discharge devices, etc.), and / or electromechanical components (e.g., switches, piezoelectric devices, fuses, connectors, etc.). For example, the electronic component 330 may include a capacitor configured to at least partially stabilize the voltage of the circuit. During the operation of the sensing system, unexpected changes in the voltage across the circuit may occur. Example sources of unexpected changes in voltage include undesirable power changes from the power supply, ripple voltage within the circuit, changes in the current consumption of the sensing system and / or changes in the current consumption of the electronic device of which the sensing system forms a part, and / or changes in the voltage across the circuit due to non-zero resistance and / or inductance within the circuit. The capacitor can generally act as a local voltage source and / or sink, so that changes in the current are at least partially offset by the capacitor. Alternatively and / or additionally, the capacitor can be configured to reduce the effects of fields (e.g., external and / or internal electromagnetic interference) acting on the circuit. That is, the capacitor can be configured to improve the electromagnetic compatibility of the sensing system 300 with its electromagnetic environment. For example, external magnetic fields may negatively affect the operation of the sensing system 300 by generating unwanted currents within the circuit. Alternatively or additionally, during operation, the circuit of the sensing system 300 may generate an internal magnetic field that may generate unwanted currents in the circuit. The capacitor can be used to at least partially offset the unwanted current acting on the circuit.

[0046] As another example, the electronic component 330 may include an inductor. The inductor may, for example, be configured to act as a filter for the circuit of the sensing system 300. For example, the inductor may be configured to filter out a frequency range of an alternating current to prevent certain frequencies from acting on certain parts of the circuit.

[0047] As another example, the electronic component 330 may include a resistor. The resistor may, for example, be configured to function as a pull-up resistor or a pull-down resistor for a circuit of the sensing system 300. That is, the resistor may be configured to provide a well-defined voltage at an input and / or output of the circuit.

[0048] As another example, the electronic components may include resistors and capacitors configured to act as a filter network (ie, an RC filter) for the circuitry of the sensing system 300 .

[0049] As another example, the electronic component 330 may include a diode. The diode may, for example, be configured to reduce the effects of fields (e.g., external and / or internal electromagnetic interference) acting on the circuit. That is, the diode may be configured to improve the electromagnetic compatibility of the sensing system 300 with its electromagnetic environment. The diode may be used to at least partially offset the effects of unwanted current acting on the circuit.

[0050] Reference again Figure 1A , Figure 1B , the known sensing system 100 comprises a shield 180 located between the emitter 110 and the detector 120. The sole purpose of the shield 180 is to at least partially block electromagnetic radiation from propagating directly from the emitter 110 to the detector 120.

[0051] Figure 2 Schematically depicts a view from above of a portion of a known printed circuit board 200 including a capacitor 230. The printed circuit board 200 may be Figure 1A and Figure 1B The known sensing systems shown share the same die 240 and / or the same substrate (not shown). The printed circuit board 200 includes an integrated circuit 210 having a plurality of signal inputs and outputs 220. First and second voltage source connections 260, 265, a ground connection 270 and a conductive path 250 allow power and signals to be provided to the integrated circuit 210. The capacitor 230 is disposed on the printed circuit board 200 and is provided between the sensing system ( Figure 2 The capacitor 230 is external to the integrated circuit 210 (not shown) and away from the sensing system. The capacitor 230 has the sole function of interacting with the integrated circuit 210 (e.g., to stabilize the voltage of the integrated circuit 210). The capacitor 230 can be separated from the integrated circuit 210 by a distance (e.g., about 300 μm) determined by manufacturing tolerances (e.g., the accuracy of the pick-and-place tools used to manufacture the printed circuit board 200).

[0052] Reference again Figure 3A and Figure 3BBy positioning the electronic assembly 330 at least partially between the emitter 310 and the detector 320, the electronic assembly 330 not only performs its standard function of interacting with the circuitry of the sensing system 300, but also reduces the amount of electromagnetic radiation that propagates directly from the emitter 310 to the detector 320. This eliminates the need for shielding of known sensing systems, which advantageously enables a more compact sensing system 300 compared to the known sensing system 100. The sensing system 300 according to the present invention includes at least one less component than the known sensing system 100, thereby simplifying the manufacture of the sensing system 300 and reducing the manufacturing cost of the sensing system 300. The electronic assembly 330 can be configured to at least partially block the line of sight between the emitter 310 and the detector 320. Reducing the amount of radiation that propagates directly from the emitter 310 to the detector 320 advantageously improves the accuracy of the sensing system 300 by removing unwanted noise from the detector signal.

[0053] Electronic assembly 330 may include one or more materials that are substantially opaque to radiation of wavelengths emitted by emitter 310 and detected by detector 320. For example, emitter 310 and detector 320 may be configured to emit and detect electromagnetic radiation of visible and / or infrared wavelengths, respectively. For example, emitter 310 and detector 320 may be configured to emit and detect radiation having a wavelength in the range of about 800 nm to about 1000 nm, respectively. In some embodiments, emitter 310 and detector 320 may preferably emit and detect radiation of non-visible wavelengths, such that the radiation used by sensing system 300 is not detectable to the naked eye.

[0054] The size, shape, and position of the electronic component 330 are designed to at least partially block radiation that would otherwise propagate directly from the emitter 310 to the detector 320. The size, shape, and position of the electronic component 330 can be designed to substantially block the entire line of sight or illumination field between the emitter 310 and the detector 320. Therefore, the size, shape, and position of the electronic component 330 can depend at least in part on the geometry of the sensing system 300. For example, the size, shape, and position of the electronic component 330 can be selected based on the size, shape, and position of the emitter 310; the size, shape, and position of the detector 320; and / or the space between the emitter 310 and the detector 320 through which the emitted radiation can propagate. It should be understood that the size and geometry of the various components of the sensing system 300 can vary greatly between different use cases. Generally, the size, shape, and position of the electronic component 330 are designed to at least partially block the radiation path from the emitter 310 to the detector 320. The electronic component 330 can be a standard electronic component with standard dimensions. For example, the electronic component may be a 0402 inch capacitor having a length of about 1.0 mm and a width of about 0.5 mm, or a 0201 inch capacitor having a length of about 0.6 mm and a width of about 0.3 mm.

[0055] The angular range over which radiation exits emitter 320 and / or the angular range over which radiation may enter detector 320 may also at least partially determine the size, shape, and position of electronic assembly 330. Typically, the height of electronic assembly 330 may be greater than the height of emitter 310.

[0056] Preferably, the size, shape, and location of the electronic component 330 are selected so that the electronic component 330 prevents electromagnetic radiation emitted by the emitter 310 that does not leave the sensing system 300 from reaching the detector 310. The sensing system 300 is generally configured so that a measured portion of the radiation emitted by the emitter 310 leaves the sensing system 300, interacts with the external environment (e.g., reflects from an object), and returns to the sensing system 300 to be detected by the detector 320. The electronic component 330 does not prevent the measured portion of the radiation from reaching the detector 320.

[0057] The sensing system 300 may include, for example, Figure 1A and Figure 1B A portion of the cap may be shaped to abut against an upper surface of the electronic component 330, thereby substantially preventing radiation from being directly transmitted from the emitter 310 to the detector 320. The sensing system 300 may also include a first housing and a second housing (not shown), such as Figure 1A and Figure 1B The first shell 182 and the second shell 184 are shown in FIG.

[0058] exist Figure 3A and Figure 3B In an example of, the electronic component 330, the emitter 310, and the detector 320 are located on a single die 340. The die 340 is configured to house the circuitry (e.g., an integrated circuit) of the sensing system 300. The die 340 may include a complementary metal oxide semiconductor (CMOS) circuit. The die 340 may be located on a substrate (not shown) of a printed circuit board (not shown). The closer the electronic component 330 is located to the circuitry (e.g., the die 340) of the sensing system 300, the lower the resistance between the electronic component 330 and the circuitry of the sensing system 300. This can improve the performance of the electronic component 330. By positioning the electronic component 330 on the same die 340 and / or substrate (not shown) as the circuitry of the sensing system 300, the length of the conductive path between the components is reduced compared to known sensing systems. This reduces the resistance associated with the conductive path compared to known sensing systems, which advantageously improves the performance of the electronic component 330 compared to known sensing systems.

[0059] It may be preferable to keep the die 340 relatively thin (e.g., less than about 2 mm) because the die can be a relatively expensive component to manufacture of the sensing system 300. Thus, it may be advantageous to position a larger electronic component 330 (e.g., a capacitor) at least partially between the emitter 310 and the detector 320 because smaller electronic components (e.g., a diode) can be incorporated into the die 340 without having to increase the thickness of the die 340 to accommodate the smaller components.

[0060] The die 340 includes electrical contacts 350 for electrically connecting the sensing system 300 to other electronic devices, such as a processor (not shown) of an electronic device incorporating the sensing system 300. The sensing system 300 includes a transmitter electrode 315 configured to receive the transmitter 310. The emitter electrode 315 is located on the die 340. The sensing system 300 also includes two electrodes 332, 334 configured to receive the electronic component 330. The electrodes 332, 334 are located on the die 340. The electrodes 332, 334 can increase the contact surface area between the electronic component 330 and the sensing system 300 compared to using a conductive connector such as a wire bond. This can advantageously improve the electrical connection between the electronic component 330 and the sensing system 300 compared to other ways of electrically connecting the electronic component 330 to the sensing system 300. The electrodes 332, 334 can, for example, include gold plates. The electronic component 330 itself may include two electrodes (not shown) for contacting the electrodes 332, 334 of the sensing system 300. The sensing system 300 may alternatively include two electrical contacts and two conductive connectors (such as Figure 4A and Figure 4B434 and first and second conductive connectors 436, 438) that connect the electronic component 330 to the electrical contacts.

[0061] Filler 338 may be disposed between electronic component 330 and sensing system 300. Filler 338 may be configured to further reduce electromagnetic radiation from propagating directly from emitter 310 to detector 320 without leaving sensing system 300. Filler 338 may include ink and / or glue configured to secure electronic component 330 to sensing system 300. Figure 3A and Figure 3B In the example of , filler 338 includes a conductive adhesive between electronic component 330 and electrodes 332, 334. The conductive adhesive advantageously provides multiple functions, such as attaching electronic component 330 to sensing system 300, providing a conductive path between electronic component 330 and electrodes 332, 334, and further reducing the detection of electromagnetic radiation that would otherwise propagate directly from emitter 310 to detector 320 without leaving sensing system 300.

[0062] Figure 4A and Figure 4B A view from above and a cross-sectional view from the side of an alternative sensing system 400 according to an embodiment of the invention are schematically depicted. Figure 4A and Figure 4B The sensing system 400 and Figure 3A and Figure 3B The sensing systems 300 share many common features. The sensing system 400 includes an emitter 410 and a detector 420. The emitter 410 is configured to emit electromagnetic radiation. The emitter 410 can be any kind of electromagnetic radiation source, such as a diode or a laser, such as a vertical cavity surface emitting laser (VCSEL). The detector 420 is configured to detect the electromagnetic radiation. The detector 420 can be configured to detect the electromagnetic radiation after the electromagnetic radiation emitted by the emitter 410 has interacted with (e.g., reflected from) an object to be sensed by the sensing system 400. The detector 420 can be any form of photodetector, such as a photodiode, such as a single photon avalanche diode (SPAD). The sensing system 400 is suitable for forming part of an electronic device such as a mobile phone or a tablet computer. The sensing system 400 can be a time-of-flight sensing system or a proximity sensing system as described above.

[0063] The sensing system 400 includes an electronic component 430 configured to interact with the circuit of the sensing system 400. The electronic component 430 can be a passive, active, and / or electromechanical element as described above. For example, the electronic component 430 can include a capacitor configured to at least partially stabilize the voltage of the circuit and / or reduce the effects of a field (e.g., external electromagnetic interference) acting on the circuit of the sensing system 400.

[0064] The electronic assembly 430 is at least partially located between the emitter 410 and the detector 420. By positioning the electronic assembly 430 at least partially between the emitter 410 and the detector 420, the electronic assembly 430 not only performs its standard function of interacting with the circuitry of the sensing system 400, but also reduces the detection of electromagnetic radiation that would otherwise propagate directly from the emitter 410 to the detector 420. This advantageously enables a more compact, simplified, and relatively inexpensive sensing system 400 compared to known sensing systems. The electronic assembly 430 can be configured to at least partially block the line of sight between the emitter 410 and the detector 420. The electronic assembly 430 is configured to completely block the line of sight between the emitter 410 and the detector 420.

[0065] As mentioned above, Figure 4A and Figure 4B The electronic components 430 of the sensing system 400 may be formed of different materials so as to render the electronic components 430 substantially opaque to radiation of the wavelengths emitted by the emitter 410 and detected by the detector 410 .

[0066] As described above, the size, shape, and / or position of the electronic assembly 430 may depend, at least in part, on the size, shape, and position of the emitter 410, the size, shape, and position of the detector 420, and the space between the emitter 410 and the detector 420 through which radiation may propagate. The size, shape, and / or position of the electronic assembly 430 is selected such that the amount of electromagnetic radiation that propagates directly from the emitter 410 to the detector 420 is reduced. That is, the electronic assembly 430 functions to absorb and / or redirect electromagnetic radiation that would otherwise propagate directly from the emitter 410 to the detector 420.

[0067] The sensing system 400 may include a cap ( Figure 4A and Figure 4B ), such as Figure 1A and 1B A portion of the cap may be shaped to abut the electronic assembly 430 and substantially prevent radiation from being transmitted directly from the emitter 410 to the detector 420. The sensing system 400 may also include first and second housings (not shown), such as Figure 1A and Figure 1B The first and second housings 182, 184 are shown in FIG.

[0068] exist Figure 4A and Figure 4B In the example of , electronic component 430 and detector 420 are located on a single die 440, and emitter 410 and die 440 are located on a single substrate 460. Having electronic component 430, emitter 410, and detector 420 on the same substrate keeps electronic component 430 close to the circuitry of sensing system 400. This advantageously reduces the resistance between electronic component 430 and the circuitry of sensing system 400, thereby improving the performance of electronic component 430. For example, if electronic component 430 includes a capacitor, the performance of the capacitor in stabilizing voltage and / or reducing the effects of fields (e.g., external or internal electromagnetic interference) acting on the circuitry of sensing system 400 can be improved.

[0069] exist Figure 4A and Figure 4B In the example of FIG. 4 , the sensing system 400 includes first and second electronic component contacts 432, 434 spaced apart from the electronic component 430 on the die 440 and first and second conductive connectors 436, 438 connecting the electronic component 430 to the electronic component contacts 432, 434. The sensing system 400 may alternatively include two electrodes (such as Figure 3A and Figure 3B ), which is configured to receive an electronic component 430, thereby eliminating the need for first and second conductive connectors 436, 438.

[0070] The sensing system 400 may include a filler (not shown) disposed between the electronic component 430 and the sensing system 400 to further prevent electromagnetic radiation from propagating directly from the emitter 410 to the detector 420. Figure 4A and Figure 4B In the example of FIG. 4 , the filler includes a non-conductive adhesive between the electronic component 430 and the sensing system 400 .

[0071] Die 440 includes electrical contacts 450 for electrically connecting sensing system 400 to electrical contacts 470 of substrate 460. Substrate 460 may include additional electrical contacts (not shown), for example on the bottom of substrate 460, to connect sensing system 400 to other electronic devices, such as an integrated circuit, for example a processor (not shown) of an electronic device. Substrate 460 includes transmitter electrodes 415 configured to receive transmitter 410.

[0072] Figure 5A method of manufacturing a sensing system according to an embodiment of the present invention is shown. A first step S1 of the method includes providing an emitter to emit electromagnetic radiation. A second step S2 of the method includes providing a detector to detect the electromagnetic radiation. A third step S3 of the method includes providing an electronic component to interact with the circuitry of the sensor. A fourth step S4 of the method includes positioning the electronic component at least partially between the emitter and the detector to reduce the amount of electromagnetic radiation emitted by the emitter that is detected by the detector.

[0073] The method may also include providing a die, providing a substrate, and attaching the die to the substrate. The die may include an emitter. The substrate may include an emitter. Electrical connections between the die and the substrate may be provided, for example, using wire bonding, and a detector and electronic components may be provided on the die. A first housing and a second housing for the detector and emitter may be provided, and a cap may be positioned to abut the electronic components. The cap may be glued to the sensing system to hold the housing in place.

[0074] Embodiments of the present disclosure may be employed in many different applications, including time-of-flight or proximity sensors in electronic devices, for example, in consumer products (e.g., mobile phones and tablet computers), home and building automation systems, manufacturing systems and product lines, robotics, automotive, and other industries.

[0075] Reference numerals list

[0076] 100 – Known sensor systems

[0077] 110 – Transmitter

[0078] 120 – Detector

[0079] 130 – First Grain

[0080] 140 – Second grain

[0081] 150 – electrical contacts (die)

[0082] 160–Substrate

[0083] 170 – electrical contact (substrate)

[0084] 180 – Shielding

[0085] 182–First Shell

[0086] 184–Second Shell

[0087] 186 – Lens

[0088] 190 – Cap

[0089] 192 – First Hole

[0090] 194 – Second hole

[0091] 200 – known printed circuit boards

[0092] 210 – Integrated Circuits

[0093] 220 – Input / Output

[0094] 230 – Capacitor

[0095] 240 – Grain

[0096] 250 – Conductive Path

[0097] 260 – First voltage source connection

[0098] 265 – Second voltage source connection

[0099] 270 – Ground connection

[0100] 300 – Sensing system

[0101] 310 – Transmitter

[0102] 315 – emitter electrode

[0103] 320 – Detector

[0104] 330 – Electronic components

[0105] 332 – First electrode

[0106] 334 – Second electrode

[0107] 338 – Filler

[0108] 340 – Grain

[0109] 350 – electrical contacts

[0110] 400 – Sensing System

[0111] 410 – Transmitter

[0112] 415 – Transmitter Electrode

[0113] 420 – Detector

[0114] 430 – Electronic components

[0115] 432 – First electronic component contact

[0116] 434 – Second electronic component contact

[0117] 436 – first conductive connector

[0118] 438 – Second conductive connector

[0119] 440 – Grain

[0120] 450 – electrical contacts (die)

[0121] 460–Substrate

[0122] 470 – electrical contact (substrate)

[0123] S1-S4 – First, second, third and fourth method steps

[0124] Those skilled in the art will appreciate that in the foregoing description and the appended claims, positional terms such as "above," "along," "side," etc., are made with reference to conceptual illustrations such as those shown in the accompanying drawings. These terms are used for ease of reference and are not intended to be limiting. Therefore, these terms should be understood to refer to an object when in an orientation as shown in the accompanying drawings.

[0125] Although the present disclosure has been described according to the preferred embodiments described above, it should be understood that these embodiments are illustrative only and the claims are not limited to those embodiments. Those skilled in the art will be able to make modifications and substitutions in view of the present disclosure, and these modifications and substitutions are considered to fall within the scope of the appended claims. Each feature disclosed or shown in this specification can be combined in any embodiment, either alone or in any appropriate combination with any other features disclosed or shown herein.

Claims

1. A sensing system, comprising: a transmitter configured to emit electromagnetic radiation; a detector configured to detect electromagnetic radiation; as well as an electronic component configured to interact with the circuitry of the sensing system, wherein the electronic component is at least partially located between the emitter and the detector, and wherein the electronic component reduces the amount of electromagnetic radiation that propagates from the emitter to the detector, wherein the electronic component comprises a capacitor configured to at least partially stabilize a voltage of the circuit and / or reduce the effects of a field acting on the circuit, or wherein the electronic component comprises an inductor configured to act as a filter for the circuit, or wherein the electronic component comprises a resistor configured to act as a pull-up resistor or a pull-down resistor of the circuit, or wherein the electronic components include a resistor and a capacitor configured to act as an RC filter for the circuit, or Wherein the electronic component includes a diode configured to reduce the effects of a field acting on the circuit. 2 . The sensing system of claim 1 , comprising a die configured to house the circuitry of the sensing system, wherein the electronic components are located on the die.

3. The sensing system of claim 2, wherein the emitter and the detector are located on the die.

4. The sensing system of claim 2, comprising a substrate configured to provide electrical connections between the die and a printed circuit board of the sensing system, wherein the emitter is located on the substrate and the detector is located on the die. 5 . The sensing system of claim 1 , comprising a filler disposed between the electronic component and the sensing system. 6 . The sensing system of claim 5 , comprising an electrode configured to receive the electronic component, wherein the filler comprises a conductive adhesive configured to attach the electronic component to the electrode.

7. The sensing system of claim 5, comprising electrical contacts and a conductive connector configured to connect the electronic component to the electrical contacts, wherein the filler comprises a non-conductive adhesive configured to attach the electronic component to the sensing system.

8. The sensing system of claim 1, wherein the sensing system is a time-of-flight sensing system.

9. The sensing system of claim 1, wherein the sensing system is a proximity sensing system.

10. An electronic device comprising the sensing system according to claim 1. The electronic device according to claim 10 , wherein the electronic device is a mobile phone.

12. A method of emitting and detecting electromagnetic radiation comprising using a sensing system according to claim 1.

13. A method of manufacturing a sensing system, comprising: providing a transmitter configured to transmit electromagnetic radiation; providing a detector configured to detect electromagnetic radiation; providing an electronic assembly configured to interact with the circuitry of the sensing system; as well as positioning the electronic assembly at least partially between the emitter and the detector, wherein the electronic assembly reduces an amount of electromagnetic radiation propagating from the emitter to the detector, wherein the electronic component comprises a capacitor configured to at least partially stabilize a voltage of the circuit and / or reduce the effects of a field acting on the circuit, or wherein the electronic component comprises an inductor configured to act as a filter for the circuit, or wherein the electronic component comprises a resistor configured to act as a pull-up resistor or a pull-down resistor of the circuit, or wherein the electronic components include a resistor and a capacitor configured to act as an RC filter for the circuit, or Wherein the electronic component includes a diode configured to reduce the effects of a field acting on the circuit.

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