Display panel, preparation method thereof and display device

Abstract

This application discloses a display panel and its fabrication method, as well as a display device, including a substrate. The substrate includes multiple device regions arranged in an array and a transparent region located between two adjacent device regions. A driving layer is disposed in the device regions, and a light-emitting element is disposed on the driving layer. A light-shielding portion is disposed between the driving layer and the light-emitting element, and the orthographic projection of the light-shielding portion on the substrate is located in the device regions. The transmittance of the display panel is improved by creating holes in the panel. By utilizing a BM (microwave diaphragm) light-shielding portion to cover the sides of the recesses, reflectivity is reduced while simultaneously blocking metal traces to minimize color shift.

Description

Technical Field

[0001] This application generally relates to the field of display technology, and specifically to a display panel and its manufacturing method, and a display device. Background Technology

[0002] In recent years, Micro LED display technology has gradually developed, and its performance has been significantly improved compared with OLED and LCD technologies. It has a series of advantages such as high contrast, high brightness, wide color gamut, and fast response speed.

[0003] Meanwhile, transparent display devices have recently seen active research and development. When closed, a transparent display panel resembles a piece of transparent glass; images are displayed, or users can view objects on the other side of the device (through the device). When operational, viewers can see not only the content displayed on the panel but also objects behind it. Therefore, transparent display panels require not only ultra-high transmittance but also excellent display effects. The advantages of transparent display devices lie in better utilization of space, internal design, and other applications.

[0004] Variations in the transmittance of transparent display devices have a significant impact on their display performance. Currently, the transmittance of existing transparent display devices is relatively low, typically around 62%, with a maximum nominal value of 75%. Improving the transmittance of transparent display devices has become an important research direction for those skilled in the art. Summary of the Invention

[0005] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a display panel and its manufacturing method, as well as a display device, which can improve the transmittance of transparent display devices.

[0006] In a first aspect, this application provides a display panel, including:

[0007] The substrate includes a plurality of device regions arranged in an array and a transparent region located between two adjacent device regions;

[0008] A driving layer is disposed in the device region, and a light-emitting element is disposed on the driving layer;

[0009] A light-shielding portion is provided between the driving layer and the light-emitting element, and the orthographic projection of the light-shielding portion on the substrate is located in the device region.

[0010] Optionally, the driving layer includes a first upper surface away from the substrate and a first side surface having an angle with the substrate, the light-shielding portion extending from the first upper surface to the first side surface, and the light-shielding portion at least covering a portion of the first side surface.

[0011] Optionally, it further includes an organic layer disposed between the driving layer and the light-shielding portion, wherein the orthogonal projection of the organic layer on the substrate is located in the device region.

[0012] Optionally, the driving layer includes a first upper surface away from the substrate and a first side surface having an angle with the substrate, the organic layer extending from the first upper surface to the first side surface, and the light-shielding portion completely covering the first side surface.

[0013] Optionally, the organic layer includes a second upper surface away from the substrate and a second side surface at an angle to the substrate, the light-shielding layer extends from the second upper surface to the second side surface, and the light-shielding portion at least covers a portion of the second side surface.

[0014] Optionally, it may also include a transparent film layer located in the transparent area.

[0015] Secondly, this application provides a method for manufacturing a display panel, used to manufacture a display panel as described in any of the above, comprising:

[0016] A driving layer is formed on the substrate;

[0017] A light-shielding material layer is formed on the side of the driving layer away from the substrate, and a light-shielding portion is patterned thereon. The orthogonal projection of the light-shielding portion on the substrate is located in the device region.

[0018] Optionally, before forming the light-shielding material layer, the method further includes forming an organic film layer on the side of the driving layer away from the substrate and forming the light-shielding material layer on the side of the organic film layer away from the substrate.

[0019] Optionally, the method further includes:

[0020] The organic film layer and the light-shielding material layer are patterned to form the organic layer and the light-shielding portion, and the orthogonal projection of the organic layer and the light-shielding portion on the substrate is located in the device region.

[0021] Thirdly, this application provides a display device including a display panel as described in any of the above.

[0022] The technical solutions provided by the embodiments of this application may include the following beneficial effects:

[0023] The display panel provided in this application improves the transmittance of the display panel by drilling holes in the display panel. By using the BM light-shielding part to cover the side surface of the driving layer in a conformal manner, the reflectivity is reduced while blocking the metal traces and reducing color shift. By setting an organic layer, the step difference between the device area and the transparent area can be reduced, preventing the light-shielding part from remaining at the step difference and reducing the transmittance of the panel. The thickness of the light-shielding part covering the side surface of the organic layer is increased to prevent insufficient light-shielding ability from affecting the transparent display effect. Attached Figure Description

[0024] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0025] Figure 1 A schematic diagram of the structure of a display panel provided for an embodiment of this application;

[0026] Figure 2 A top view of a display panel provided for an embodiment of this application;

[0027] Figure 3 A top view of another display panel provided for an embodiment of this application;

[0028] Figure 4 A schematic diagram of another display panel structure provided for an embodiment of this application;

[0029] Figure 5 A flowchart illustrating a method for manufacturing a display panel, provided as an embodiment of this application;

[0030] Figure 6 A schematic diagram of the structure of a display panel provided for an embodiment of this application;

[0031] Figure 7 A schematic diagram of the structure of a display panel provided for an embodiment of this application;

[0032] Figure 8 This is a schematic diagram of the structure of a display panel provided for an embodiment of this application. Detailed Implementation

[0033] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0034] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0035] Please see details. Figure 1 This application provides a display panel, including:

[0036] Substrate 1, the substrate 1 includes a plurality of device regions D1 arranged in an array and a transparent region D2 located between two adjacent device regions D1;

[0037] A driving layer 2 is disposed in the device region D1, and a light-emitting element 3 is disposed on the driving layer 2;

[0038] A light-shielding part 6 is provided between the driving layer 2 and the light-emitting element 3, and the orthogonal projection of the light-shielding part 6 on the substrate 1 is located in the device region D1.

[0039] In the embodiments of this application, the light-emitting element 3 can be a light-emitting diode, for example, a small light-emitting diode or a micro light-emitting diode (Micro LED). The description is based on the example of a Micro LED as the light-emitting element 3, but this application is not limited to this. Depending on the device and the application scenario, this application can use different light-emitting elements 3.

[0040] In one embodiment of this application, no film layer is provided on the substrate 1 corresponding to the transparent area D2, and the transmittance of the display panel is improved by forming an opening in the transparent area D2. However, this application is not limited to this. In different embodiments, depending on the transparency requirements of the display panel, the transparent area D2 can also be filled with transparent material. The choice is made according to the device and application scenario, and this application does not limit this.

[0041] In this embodiment, the driving layer 2 includes at least one thin film transistor (TFT). Specifically, the driving layer 2 may include an active layer 23, an interlayer dielectric layer 22, a gate layer 24, a gate insulating layer 25, a source / drain electrode layer 26, and a planarization layer 27 sequentially formed on a substrate 1. The TFT in the driving layer 2 can be either a top-gate or bottom-gate type, and this embodiment is not limited thereto.

[0042] In one embodiment of this application, the driving layer 2 includes a first upper surface 8 away from the substrate 1 and a first side surface 9 forming an angle with the substrate 1. The light-shielding portion 6 extends from the first upper surface 8 to the first side surface 9, and the light-shielding portion 6 at least covers a portion of the first side surface 9. Exemplarily, the light-shielding portion 6 is disposed on a planarization layer 27 of the driving layer 2 and conformally covers a portion of the first side surface 9 on the driving layer 2. The coverage area of ​​the light-shielding portion 6 on the first side surface 9 at least blocks the metal traces on the driving layer 2.

[0043] The metal traces in the driving layer 2 include one or more of the following: gate, source, drain 14, power line 15, and pixel electrode of a thin-film transistor. The orthogonal projection of the metal traces on the substrate 1 falls entirely within the device region D1. Therefore, the coverage area of ​​the light-shielding portion 6 on the first side surface 9 is related to the area of ​​the metal traces and the size of the device region D1. In different embodiments, the coverage area of ​​the light-shielding portion 6 on the first side surface 9 is set according to requirements.

[0044] In another embodiment of this application, a transparent film layer is disposed on the substrate 1 corresponding to the transparent area D2. For example, at the location corresponding to the transparent area D2, the display panel includes a substrate 1 stacked thereon and a planarization layer 27 disposed on the substrate 1. In this embodiment, the light-shielding portion 6 conformally covers the entire first side surface 9 of the driving layer 2 on top of the planarization layer 27, and the coverage area of ​​the light-shielding portion 6 on the first side surface 9 of the transparent area D2 at least blocks the metal traces on the driving layer 2.

[0045] It is worth noting that, in different embodiments, the area of ​​the first side surface 9 of the driving layer 2 varies depending on whether a film layer is provided on the transparent area D2. When no film layer is provided on the transparent area D2, the first side surface 9 refers to the surface extending from the first upper surface 8 of the driving layer 2 to the substrate 1. When a transparent film layer is provided on the transparent area D2, the first side surface 9 refers to the surface extending from the first upper surface 8 of the driving layer 2 to the surface of the transparent film layer on the transparent area D2.

[0046] In one embodiment of this application, the driving layer 2 forms an opening at a position corresponding to the transparent area. The cross-sectional shape of the opening in a plane perpendicular to the substrate is an inverted trapezoid, with the side of the inverted trapezoid farther from the substrate being larger than the side closer to the substrate. That is, the first side surface 9 and the substrate 1 are set at an acute angle, where the acute angle is the angle on the side closer to the driving layer 2. In this embodiment of the application, by setting the first side surface 9 at an acute angle to the substrate 1, the light-shielding part 6 can conformally cover the first side surface 9. The material of the light-shielding part 6 is an opaque material, such as black resin material, black metal material, etc.

[0047] It should be noted that the light-shielding part 6 blocks the light at the first side surface 9. When ambient light shines on the first side surface 9 of the driving layer 2, the light-shielding part 6 can absorb the light at the first side surface 9, preventing reflected light. This prevents light from affecting the TFT performance and also prevents crosstalk between adjacent light-emitting elements 3.

[0048] It should be noted that the arrangement of device areas D1 is not limited in this embodiment. Device areas D1 can be arranged continuously, and the transparent areas D2 between device areas D1 can be arranged independently, such as... Figure 2 As shown; device area D1 can also be set independently, and the transparent area D2 between device areas D1 can be set continuously, such as... Figure 3 As shown. In different embodiments, the selection is made according to the transmittance requirements of the device.

[0049] In this embodiment of the application, the light-emitting element 3 Micro LED includes an LED chip and two pins (positive electrode 12 and negative electrode 13), wherein the positive electrode 12 of the Micro LED is connected to the second electrode of the transistor, and the negative electrode 13 of the Micro LED is connected to the power line 15.

[0050] Furthermore, for designs where no film layer is provided in the transparent area D2, the significant positional difference between the transparent area D2 and the device area D1 results in residue at the higher position during the fabrication of the light-shielding portion 6. This means that light-shielding portion 6 residue will remain at the bottom of the transparent area D2, thus affecting transmittance. Additionally, the inverted trapezoidal opening formed in the driving layer at the corresponding transparent area position results in a thinner thickness of the light-shielding portion 6 covering the first side surface 9, leading to insufficient light-shielding capability and consequently affecting the display performance of the display device.

[0051] It should be noted that this application does not limit the thickness of the light-shielding part 6 on the first side surface 9. Those skilled in the art can make corresponding settings for the light-shielding part 6 according to actual needs, so as to achieve the design principle of absorbing side-emitted light.

[0052] Figure 4 This is a cross-sectional structural diagram of another display panel provided in an embodiment of the present invention. The display panel includes an organic layer 7, which is disposed between the driving layer 2 and the light-shielding portion 6. The orthographic projection of the organic layer 7 on the substrate 1 is located in the device region D1. That is, the organic layer 7 is located on the side of the driving layer 2 away from the substrate 1. The organic layer 7 extends from the first upper surface 8 of the driving layer 2 to the first side surface 9 of the driving layer 2.

[0053] In this embodiment, the driving layer 2 further includes a connection electrode layer disposed on the planarization layer 27, wherein, for example, the connection electrode layer is used to form a first connection electrode 10 and a second connection electrode 11. The first connection electrode 10 transmits a first signal from the drain 14 of the thin-film transistor to the positive electrode 12 of the light-emitting element 3, and the second connection electrode 11 transmits a second signal from the power line 15 to the negative electrode 13 of the light-emitting element 3 through electrode traces. The light-emitting element 3 operates under the action of the first and second signals, and the operation of the light-emitting element 3 is controlled by the first and second signals, such as whether it emits light and the light intensity. For example, the first signal is a high voltage signal, and the second signal is a low voltage signal.

[0054] In this embodiment, the organic layer 7 conformally and completely covers the first side surface 9 of the driving layer 2 on the connection electrode layer. The organic layer 7 includes a second upper surface 4 away from the substrate 1 and a second side surface 5 forming an angle with the substrate 1. The light-shielding portion 6 extends from the second upper surface 4 to the second side surface 5, and the light-shielding portion 6 covers at least a portion of the second side surface 5. Furthermore, the coverage area of ​​the light-shielding portion 6 on the corresponding second side surface 5 at least blocks the metal traces on the driving layer 2. Exemplarily, the light-shielding portion 6 completely covers the first side surface 9.

[0055] In this embodiment, by using an organic layer 7 to cover the first side surface 9 of the driving layer 2, and allowing it to adhere more tightly to the light-shielding portion 6, the light leakage prevention effect is further improved. Furthermore, during fabrication, the organic layer 7 can cover the transparent area D2 on the substrate 1, and then the light-shielding layer is applied to the transparent area D2 and placed on top of the organic layer 7. This reduces the step difference between the transparent area D2 and the device area D1 during the fabrication of the light-shielding layer, preventing the residue of the bottom light-shielding portion 6 caused by the high step difference in the transparent area D2, and preventing a decrease in transmittance. Additionally, reducing the step difference in the transparent area D2 also increases the thickness of the light-shielding portion 6 in the area covered on the first side surface 9 in the direction perpendicular to the first side surface 9, improving the light-shielding capability and enhancing the display effect of the display device.

[0056] like Figure 5 As shown, this application provides a method for manufacturing a display panel, used to manufacture a display panel as described above, comprising:

[0057] S02, Form a driving layer 2 on substrate 1;

[0058] S04. A light-shielding material layer is formed on the side of the driving layer 2 away from the substrate 1, and a light-shielding part 6 is patterned to form a light-shielding part 6. The orthogonal projection of the light-shielding part 6 on the substrate 1 is located in the device region D1.

[0059] In this embodiment, forming a driving layer 2 on a substrate 1 specifically includes: providing a substrate 1; then sequentially forming an active layer 23, an interlayer dielectric layer 22, a gate layer 24, and a gate insulating layer 25 on the substrate 1, wherein the gate layer 24 forms a gate and a power line 15 through a patterning process; forming a first via and a second via penetrating the gate insulating layer 25 and the interlayer dielectric layer 22 through an etching process; then forming a source / drain electrode layer 26 on the gate insulating layer 25, patterning source / drain electrodes and electrode traces, wherein the source / drain electrodes are electrically connected to the active layer 23 through the first via, and the electrode traces are connected to the power line 15 through the second via; then forming a planarization layer 27 on the patterned source / drain electrode layer 26; forming a third via in the planarization layer 27 through an etching process; and forming a connection electrode layer above the planarization layer 27, wherein the connection electrode layer is electrically connected to the source / drain electrode layer 26 through the third via.

[0060] It should be noted that in the embodiments of this application, "same-layer setting" means that two layers, components, elements or parts are located on the same horizontal plane. In the embodiments of this application, the lower surfaces of the two layers (i.e., the side surface 9 near the substrate 1) are on the same horizontal plane.

[0061] In the embodiments of this application, the "patterning" process generally includes steps such as photoresist coating, exposure, development, etching, and photoresist stripping. An opening is formed in the transparent area D2 through the patterning process.

[0062] In this embodiment of the application, before forming the light-shielding material layer light-shielding portion 6 in step S04, the method further includes:

[0063] S03, an organic film layer is formed on the side of the driving layer 2 away from the substrate 1, and a light-shielding material layer is formed on the side of the organic film layer away from the substrate 1, such as... Figure 6 As shown.

[0064] It should be noted that, in the embodiments of this application, before preparing the light-shielding material layer, a thicker organic film layer is formed on the transparent area D2, which reduces the step difference between the transparent area D2 and the device area D1. This is beneficial for the preparation of the light-shielding part 6 covering the second side surface 5, and can also prevent the light-shielding part 6 residue on the bottom of the transparent area D2 from causing a decrease in transmittance.

[0065] It should be noted that, in this embodiment, the height of the organic film layer on the corresponding transparent area D2 of the substrate 1 (the height to the surface of the substrate 1) is determined by the coverage area of ​​the light-shielding part 6 on the second side surface 5, and the height of the light-shielding material layer formed on the transparent area D2 is equal to the height of the patterned light-shielding part 6 on the side surface 9 of the transparent area D2 (the height to the first upper surface 8).

[0066] In this embodiment, as Figure 7 As shown, the light-shielding material layer fills the transparent area D2, meaning that the surface of the light-shielding part 6 at the device area D1 is flush with the surface at the transparent area D2, or the distance from the surface of the light-shielding part 6 at the device area D1 to the substrate 1 is the same as the distance from the surface of the light-shielding part 6 at the transparent area D2 to the substrate 1. This arrangement allows for an increase in the thickness of the light-shielding part 6 in the direction perpendicular to the second side surface 5, thereby improving its light-shielding capability and enhancing the display effect of the display device, during the patterning and forming of the light-shielding part 6.

[0067] Optionally, the method further includes:

[0068] S06. Pattern the organic film layer and the light-shielding material layer to form the organic layer 7 and the light-shielding portion 6. The orthogonal projections of the organic layer 7 and the light-shielding portion 6 on the substrate 1 are located in the device region D1. By controlling the patterning process, the shape of the preset opening, the coverage area of ​​the light-shielding portion 6 on the side surface 9 of the driving layer 2, and the thickness of the light-shielding portion 6 in the direction perpendicular to the side surface 9 at the coverage area of ​​the side surface 9 are formed, such as... Figure 8 As shown.

[0069] In this embodiment of the application, the method further includes:

[0070] S08. After forming the organic layer 7 and the light-shielding part 6, the light-emitting element 3 is finally transferred to the driving layer 2 by stamping or other transfer methods to form a display panel.

[0071] This application provides a display device, including a display panel as described in any of the above descriptions.

[0072] This application does not impose specific limitations on the applicability of the display device, which can be any product or component with display function, such as a television, laptop computer, tablet computer, wearable display device (such as a smart bracelet, smartwatch, etc.), mobile phone, virtual reality device, augmented reality device, vehicle display, advertising light box, etc.

[0073] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0074] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0075] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for descriptive purposes only and is not intended to limit the invention. Terms such as “set” appearing herein can refer to either a component being directly attached to another component or a component being attached to another component via an intermediary. A feature described in one embodiment herein may be applied, alone or in combination with other features, to another embodiment, unless that feature is not applicable in that other embodiment or is otherwise stated.

[0076] The present invention has been described through the above embodiments; however, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit the present invention to the described embodiments. Those skilled in the art will understand that many variations and modifications can be made based on the teachings of the present invention, and all such variations and modifications fall within the scope of protection claimed by the present invention.

Claims

1. A display panel, characterized by, include: The substrate includes a plurality of device regions arranged in an array and a transparent region located between two adjacent device regions; A driving layer is disposed in the device region, and a light-emitting element is disposed on the driving layer; A light-shielding portion is provided between the driving layer and the light-emitting element, and the orthogonal projection of the light-shielding portion on the substrate is located in the device region; The driving layer includes a first upper surface away from the substrate and a first side surface having an angle with the substrate, the light-shielding portion extends from the first upper surface to the first side surface, and the light-shielding portion at least covers a portion of the first side surface; The orthographic projection of the light-shielding part on the substrate does not overlap with the orthographic projection of the light-emitting element on the substrate; It also includes an organic layer disposed between the driving layer and the light-shielding portion, wherein the orthogonal projection of the organic layer on the substrate is located in the device region; wherein the organic layer is used to cover the transparent area on the substrate during fabrication, and the light-shielding portion covers the transparent area and is located on top of the organic layer.

2. The display panel of claim 1, wherein, The driving layer includes a first upper surface away from the substrate and a first side surface at an angle to the substrate, the organic layer extends from the first upper surface to the first side surface, and the light-shielding portion completely covers the first side surface.

3. The display panel according to claim 2, characterized in that, The organic layer includes a second upper surface away from the substrate and a second side surface at an angle to the substrate, the light-shielding layer extends from the second upper surface to the second side surface, and the light-shielding portion covers at least a portion of the second side surface.

4. The display panel according to claim 1, characterized in that, It also includes a transparent film layer located in the transparent area.

5. A method for manufacturing a display panel, characterized in that, For manufacturing a display panel as described in any one of claims 1-4, comprising: A driving layer is formed on the substrate; A light-shielding material layer is formed on the side of the driving layer away from the substrate, and a light-shielding portion is patterned thereon. The orthogonal projection of the light-shielding portion on the substrate is located in the device region.

6. The method according to claim 5, characterized in that, Before forming the light-shielding material layer, the method further includes forming an organic film layer on the side of the driving layer away from the substrate and forming the light-shielding material layer on the side of the organic film layer away from the substrate.

7. The method according to claim 6, characterized in that, The method further includes: The organic film layer and the light-shielding material layer are patterned to form the organic layer and the light-shielding portion, and the orthogonal projection of the organic layer and the light-shielding portion on the substrate is located in the device region.

8. A display device, characterized in that, Includes the display panel as described in any one of claims 1-4.

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