LED light source assembly, manufacturing method thereof and LED display screen

Abstract

The application relates to an LED light source assembly and a manufacturing method thereof and an LED display screen. Molecules of a black base material are sputtered and deposited on the front surface of a circuit substrate and the surface of each light emitting unit to form a black deposition layer. The process is no longer limited by the flatness of the area to be formed with the black deposition layer, so that the area to be formed with the black deposition layer is 100% covered, and the formed black deposition layer is uniform, the black chroma difference of each position of the black deposition layer is reduced, the contrast of the display screen made of the LED light source assembly is improved, and the mottling of the side view angle light emission of the display screen is avoided. Meanwhile, the sputtering process has low production control difficulty, high yield and low production cost.

Description

Technical Field

[0001] This invention relates to the field of light emission, and more particularly to an LED light source component and its manufacturing method, and an LED display screen. Background Technology

[0002] As pixel pitch decreases, the proportion of display area occupied by LED chips in COB (Chip On Board) LED (Light-Emitting Diode) displays or LED chip packages in POB (Package-on-Board) displays is increasing (for ease of understanding, these LED chips and LED chip packages are referred to as light-emitting units below). Coupled with the limitations of PCB (Printed Circuit Board) manufacturing processes, it is difficult to match the size of the pads on the PCB used to solder the light-emitting units to the size of the units themselves. Typically, after the light-emitting units are soldered to the PCB, a portion of the pads is not covered by the light-emitting units. During the soldering process, the solder paste melts and turns silver, covering the surface of the pads. Silver has reflective properties, causing the display to appear less black when at black, thus reducing the contrast and affecting the display effect.

[0003] To address this issue, existing technologies typically employ inkjet printing, black adhesive filling, and thermal lamination to create an opaque black ink or adhesive layer (hereinafter collectively referred to as the black layer) on the PCB board to enhance contrast. However, these processes are limited by the flatness of the PCB board after the light-emitting units are soldered, resulting in poor uniformity of the black layer at different locations. This can easily lead to coverage dead zones (for example, the formed black layer may not fully cover the sides of the light-emitting units), significant differences in black chromaticity, and consequently, reduced contrast of the display screen. Furthermore, the side-view illumination of the display screen is prone to numerous mottled patterns, resulting in poor display quality. Moreover, these processes suffer from high production control difficulties and low yield rates.

[0004] Therefore, how to solve the problem that the manufacturing process of the black layer on the PCB board of the existing display screen is limited by flatness, resulting in poor uniformity and consistency of the black layer, which easily leads to dead corners and poor contrast and display effect of the display screen, and how to solve the problem of high production control difficulty and low yield of the existing black layer manufacturing process are the technical problems that urgently need to be solved. Summary of the Invention

[0005] In view of the shortcomings of the above-mentioned related technologies, the purpose of this invention is to provide an LED light source component and its manufacturing method, and an LED display screen, aiming to solve the problems that the manufacturing process of the black layer on the PCB board of the existing display screen is limited by flatness, resulting in poor uniformity and consistency of the black layer, easy to have dead corners, and poor contrast and display effect of the display screen, as well as how to solve the problems of high production control difficulty and low yield in the existing black layer manufacturing process.

[0006] To address the aforementioned technical problems, this invention provides a method for manufacturing an LED light source assembly, comprising:

[0007] Several light-emitting units are arranged on the front side of the circuit board;

[0008] Molecules of a black substrate are sputtered onto the front side of the circuit board and the surface of each of the light-emitting units to form a black deposition layer covering the front side of the circuit board and the surface of each of the light-emitting units.

[0009] At least a portion of the black deposited layer on the positive light-emitting surface of each of the light-emitting units is removed, wherein the positive light-emitting surface of the light-emitting unit is the side of the light-emitting unit away from the circuit substrate;

[0010] A first encapsulation layer is formed on the front side of the circuit substrate, covering the black deposition layer and each of the light-emitting units. The first encapsulation layer is a light-transmitting layer.

[0011] Optionally, removing at least a portion of the black deposited layer on the positive light-emitting surface of each of the light-emitting units comprises:

[0012] At least a portion of the black deposited layer on the positive light-emitting surface of each of the light-emitting units is removed directly using a laser;

[0013] or,

[0014] Before removing at least a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units, the method further includes: forming a second encapsulation layer on the black deposition layer, wherein the second encapsulation layer is an adhesive layer;

[0015] Removing at least a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units includes: removing the second encapsulation layer on the positive light-emitting surface of each of the light-emitting units together with at least a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units; for example, the second encapsulation layer on the positive light-emitting surface of each of the light-emitting units can be removed together with at least a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units by means of, but not limited to, grinding or plasma etching processes.

[0016] Optionally, removing at least a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units can be described as removing all of the black deposition layer on the positive light-emitting surface of each of the light-emitting units.

[0017] Optionally, removing at least a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units means removing a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units, wherein the black deposition layer is a light-transmitting layer.

[0018] Optionally, the process of sputtering molecules of the black substrate onto the front side of the circuit substrate and the surface of each of the light-emitting units includes:

[0019] In a vacuum magnetic environment, ions are guided by a magnetic field to bombard a black substrate, and the molecules of the black substrate are uniformly sputtered onto the front side of the circuit board and the surface of each light-emitting unit.

[0020] or,

[0021] In a vacuum magnetic environment, ions are guided by a magnetic field to bombard at least two black substrates simultaneously, so that the molecules of the at least two black substrates are uniformly sputtered onto the front side of the circuit board and the surface of each of the light-emitting units.

[0022] or,

[0023] In a vacuum magnetic environment, ions are guided by a magnetic field to bombard at least two black substrates in sequence, thereby uniformly sputtering the molecules of the at least two black substrates onto the front side of the circuit board and the surface of each of the light-emitting units.

[0024] Optionally, the black substrate includes at least one of oxides, silicides, nitrides, and compounds, wherein the compound is a combination of at least two of the oxides, silicides, and nitrides.

[0025] Based on the same inventive concept, the present invention also provides an LED light source assembly, which is manufactured by the LED light source assembly manufacturing method described above, the LED light source assembly comprising:

[0026] Circuit board;

[0027] Several light-emitting units are disposed on the front side of the circuit board;

[0028] A black deposition layer is deposited on the front side of the circuit substrate and on the surface of each of the light-emitting units, and the first thickness of the black deposition layer on the front light-emitting surface of each of the light-emitting units is less than the second thickness of the black deposition layer at other locations;

[0029] A first encapsulation layer, which is disposed on the front side of the circuit substrate and covers the black deposition layer and each of the light-emitting units, is a light-transmitting layer.

[0030] Optionally, the second thickness is greater than or equal to 2 nanometers and less than or equal to 300 nanometers, and the first thickness is greater than or equal to 0 and less than the second thickness.

[0031] Optionally, the first thickness is greater than 0 and less than the second thickness, and the light transmittance of the black deposition layer in the second thickness region is greater than 30%.

[0032] Based on the same inventive concept, the present invention also provides an LED display screen, including a driving element and an LED light source assembly as described above, wherein the driving element is disposed on the back or front of the circuit board and is electrically connected to each of the light-emitting pixel units.

[0033] The LED light source assembly and its manufacturing method provided by this invention include: setting a plurality of light-emitting units on the front side of a circuit substrate; then sputtering molecules of a black substrate onto the front side of the circuit substrate and the surface of each light-emitting unit, so that the sputtered molecules are deposited to form a black deposition layer covering the front side of the circuit substrate and the surface of each light-emitting unit; this process allows the molecules of the black substrate to be sputtered to each location where a black deposition layer needs to be formed, no longer limited by the flatness of the area where the black deposition layer is to be formed, thus ensuring that the black deposition layer covers all areas without dead corners, that is, the area to be covered by the black deposition layer is 100% covered, for example, the sides of each light-emitting unit and the boundary area between the side and the front side of the circuit substrate can be covered; and the formed black deposition layer is uniform, which can reduce the black color difference at various locations of the black deposition layer, thereby improving the contrast of the display screen made using this LED light source assembly and avoiding the appearance of spots when the display screen emits light from the side, thus comprehensively improving the display effect of the display screen; at the same time, this sputtering process has low production control difficulty, high yield, and can reduce production costs;

[0034] In this invention, after forming the black deposition layer, at least a portion of the black deposition layer on the positive light-emitting surface of each light-emitting unit is removed, thereby ensuring the light emission efficiency of each light-emitting unit and improving the display brightness of the display screen made using the LED light source assembly, thereby ensuring the display effect of the display screen made using the LED light source assembly.

[0035] In this invention, a first encapsulation layer is formed on the front side of the circuit board, covering the black deposition layer and each light-emitting unit, and the first encapsulation layer is a light-transmitting layer; the first encapsulation layer can protect the black deposition layer and each light-emitting unit, thereby improving the protection performance and reliability of the LED light source assembly. Attached Figure Description

[0036] Figure 1-1 This is a schematic diagram of a display panel in related technologies;

[0037] Figure 1-2 This is a schematic diagram of a black layer formed by inkjet printing and black glue filling in related technologies.

[0038] Figure 1-3 for Figure 1-2 A cross-sectional schematic diagram of region A1 in the middle;

[0039] Figure 1-4 This is a schematic diagram illustrating the formation of a black layer using a thermal lamination process in related technologies;

[0040] Figure 1-5 for Figure 1-4 A schematic diagram of the black layer formed by the thermal lamination process in the process;

[0041] Figure 2 This is a schematic diagram of the LED light source component manufacturing process provided in an embodiment of the present invention;

[0042] Figure 3-1 A schematic diagram of the black sedimentary layer structure provided in an embodiment of the present invention;

[0043] Figure 3-2 Schematic diagram of the black deposition layer structure provided in the embodiments of the present invention Figure 2 ;

[0044] Figure 3-3 Schematic diagram three of the black sedimentary layer structure provided in the embodiments of the present invention;

[0045] Figure 4 A schematic diagram of the LED light source component manufacturing process provided in an embodiment of the present invention;

[0046] Figure 5 A schematic diagram of the LED light source component manufacturing process provided in this embodiment of the invention. Figure 2 ;

[0047] Figure 6 Schematic diagram three illustrating the manufacturing process of the LED light source component provided in this embodiment of the invention;

[0048] Figure 7 A schematic diagram of magnetron sputtering provided in an embodiment of the present invention;

[0049] Figure 8 A schematic diagram of magnetron sputtering provided for an embodiment of the present invention. Figure 2 ;

[0050] Figure 9 A schematic diagram of the LED light source component structure provided in an embodiment of the present invention;

[0051] Figure 10Schematic diagram of the LED light source component structure provided in the embodiments of the present invention Figure 2 ;

[0052] Figure 11 Schematic diagram three of the LED light source component structure provided in the embodiments of the present invention;

[0053] Figure 12 This is a schematic diagram of the LED display screen structure provided in an embodiment of the present invention. Detailed Implementation

[0054] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0056] In related technologies, after the light-emitting unit is soldered to the PCB board via pads, a portion of the pads is not covered by the light-emitting unit. During the soldering process, the solder paste melts and turns silver, covering the surface of the pads. Silver has reflective properties, causing the display screen to appear insufficiently black when at black, reducing the display's contrast and affecting the display effect. See, for example... Figure 1-1 As shown, after the light-emitting unit 102 is soldered onto the PCB board 101, the solder paste melts and turns silver, covering the surface of the pads to form a silver outer surface 1011. Because silver has reflective properties, the display screen made using the LED light source assembly shown in Figure 1 has low contrast and poor display effect. To address this problem, related technologies use inkjet printing, black glue filling, and thermal lamination processes to create an opaque black ink layer or black glue layer (hereinafter collectively referred to as the black layer) on the PCB board to improve contrast.

[0057] When forming a black layer using inkjet printing and black glue caulking, please refer to... Figures 1-2 to 1-3 As shown, where Figure 1-2 The diagram shows the distribution of the black layer 103 formed between each light-emitting pixel unit on the circuit board. Figure 1-3 for Figure 1-2 The area near the edge of the circuit board ( Figure 1-2The diagram shows a cross-sectional view of the black layer 103 between the light-emitting units 102 within the light-emitting pixel unit (as shown in Figure A1). The black layer is formed using inkjet printing and black glue filling technology. Liquid black ink or black glue is used to fill the gaps between the light-emitting pixel units and between the light-emitting units 102 within the light-emitting pixel unit, thereby covering the grayish front side and the silver outer surface 1011 of the circuit board. The liquid black ink or black glue can only be filled between the light-emitting pixel units using appropriate filling equipment. Then, utilizing its low viscosity and liquid properties, it flows to the gaps between the light-emitting units 102 within the light-emitting pixel unit to form an opaque black layer. In this process, the amount of liquid black ink or black glue used is difficult to control precisely, resulting in inconsistent thickness of the black layer in different areas. Furthermore, the liquid black ink or black glue can easily contaminate and cover the front light-emitting surface of the light-emitting unit during filling. Also, the thickness of the black layer can easily become inconsistent after the liquid black ink or black glue flows, especially due to the influence of flatness. For example, see [reference needed]. Figure 1-3 The black layers at positions A11, A12, and A13 are significantly inconsistent, resulting in large differences in the black chromaticity of the formed black layers. In addition, it is difficult to ensure that the black ink or black glue used for filling can fully cover the side of the light-emitting unit 2 or that the coverage area is different, which makes it easy for the side-view light emission of the display to show a lot of spots and poor display effect.

[0058] When using the thermal lamination process, see [reference needed]. Figures 1-4 to 1-5 As shown, where Figure 1-4 This is a schematic diagram of heating and pressing. Figure 1-5 This is a schematic diagram of the black layer obtained after lamination. Using a complete black adhesive film 104, the black adhesive film 104 is melted and extruded onto the side of the light-emitting unit 102 via a heat-laden lamination method, and then cured to form a black layer. This process also suffers from uneven black layer thickness (especially when the flatness is poor), and black adhesive residue may remain on the front light-emitting surface of the light-emitting unit 102 (see...). Figure 1-5 As shown in A2, there are uncovered blind spots on the side, and the manufacturing process has problems such as high difficulty in production control and low yield.

[0059] Based on this, the present invention aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in subsequent embodiments.

[0060] This embodiment provides a method for manufacturing an LED light source component, see [link to documentation]. Figure 2 As shown, it includes, but is not limited to:

[0061] S201: Several light-emitting units are arranged on the front side of the circuit board.

[0062] In this embodiment, the front side of the circuit board is provided with several pads for electrical connection with the electrodes of the light-emitting unit, and the distribution of each pad can be similar. Figure 1-1 The matrix distribution shown in the figure is similar to the distribution pattern when the light-emitting units are placed on the front side of the circuit board. Figure 1-1 As shown; of course, other distribution methods can also be set according to requirements, and this embodiment does not limit them. In some examples of this embodiment, the material of the pads can be, but is not limited to, copper, silver, gold, etc. In this embodiment, the pads on the front side of the circuit board can be used for, but are not limited to, electrical connection with the electrodes of the light-emitting unit, and the electrodes of the light-emitting unit can be electrically connected to the corresponding pads through, but is not limited to, solder, conductive glue. It should be noted that the light-emitting unit in this embodiment can be an LED chip, that is, this embodiment is applicable to the fabrication of COB LED displays and COG (Chip On Glass) LED displays; the light-emitting unit in this embodiment can also be an LED chip package (the LED chip package may include a package in which an encapsulation layer (which may include, but is not limited to, at least one of a light conversion layer and a transparent adhesive layer) is directly disposed on the surface of the LED chip), that is, this embodiment is also applicable to the fabrication of POB LED displays. In this embodiment, the LED chip, in terms of size classification, can include at least one of Mini LED chips, Micro LED chips, and ordinary LED chips with a size larger than Mini LED chips; in terms of the distribution of LED chip electrodes, it can include at least one of flip-chip LED chips, upright LED chips, and vertical LED chips; when the light-emitting unit is an LED chip, a flip-chip LED chip is preferred. Of course, it should also be understood that the LED light source assembly in this embodiment is not limited to the display field.

[0063] In this embodiment, the side opposite to the front of the circuit board is the back of the circuit board; it should be understood that the front and back of the circuit board in this embodiment are relative. It should also be understood that the circuit board in this embodiment can be made of a rigid material, such as, but not limited to, phenolic paper laminate, epoxy paper laminate, polyester glass mat laminate, epoxy glass cloth laminate, BT resin board, or glass board; the circuit board in this embodiment can also be made of a flexible material, such as, but not limited to, polyester film, polyimide film, or fluorinated ethylene propylene film. In some examples, corresponding circuits can be integrated into or on the surface of the circuit board according to application requirements, such as, but not limited to, circuits connected to the light-emitting unit and driving circuits.

[0064] In one application scenario of this embodiment, at least two light-emitting units can be configured to form a light-emitting pixel unit. The number and type (including the size and color of the light-emitting units) of the light-emitting units included in each light-emitting pixel unit can be the same, different, or partially the same and partially different, and can be flexibly set according to the specific application scenario. For example, in some examples, the light-emitting pixel unit may include three light-emitting units that emit red, blue, and green light respectively, namely, a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit arranged in sequence. In other examples, in addition to red, green, and blue light-emitting units, the light-emitting pixel unit may also include a white light-emitting unit. It should be understood that the specific arrangement of the light-emitting units in the light-emitting pixel unit in this embodiment can be a triangular arrangement, a linear arrangement, a centrally symmetrical arrangement, etc., and this embodiment does not limit it.

[0065] S202: Molecules (which may also be referred to as particles in this embodiment) of the black substrate are sputtered onto the front side of the circuit board and the surface of each light-emitting unit (that is, the front light-emitting surface of the light-emitting unit and its side surfaces are covered, the front light-emitting surface of the light-emitting unit is the side away from the front side of the circuit board, the back side of the light-emitting unit is the side close to the front side of the circuit board, and the side surfaces of the light-emitting unit are the surfaces between the front light-emitting surface and the back side), so as to form a black deposition layer (which may also be referred to as a black molecular layer in this embodiment) covering the front side of the circuit board and the surface of each light-emitting unit.

[0066] In this embodiment, molecules of the black substrate are sputtered onto the front side of the circuit board and the surface of each light-emitting unit. Therefore, it is no longer affected by the flatness of the front side of the circuit board and the overall flatness after the light-emitting units are placed on it. The sputtered molecules can deposit a uniformly thick black layer in the area where a black deposition layer needs to be formed, and the molecules can be sputtered to any area where a black deposition layer needs to be formed, so there are no dead corners. This ensures the consistency of the formed black deposition layer, reduces the black color difference at various locations of the black deposition layer, improves the contrast of the display screen made using this LED light source component, and avoids the appearance of spots when the display screen emits light from the side. At the same time, this sputtering process has low production control difficulty, high yield, and can reduce production costs.

[0067] For ease of understanding, this embodiment will be described below with examples of sputtering processes.

[0068] Example 1:

[0069] In a vacuum magnetic environment, ions are guided by a magnetic field to bombard a black substrate, uniformly sputtering the molecules of the black substrate onto the front side of the circuit board and the surface of each light-emitting unit, thereby depositing and forming a black deposition layer; an example structure of the black deposition layer formed in this example is shown below. Figure 3-1As shown. In this example, the black deposition layer 3 is formed by the deposition of the first molecule 31.

[0070] Example 2:

[0071] In a vacuum magnetic environment, ions guided by a magnetic field are simultaneously bombarded with at least two black substrates, uniformly sputtering molecules from the at least two black substrates onto the front side of the circuit board and the surface of each light-emitting unit, thereby depositing a black deposition layer. In this example, at least two black substrates are bombarded simultaneously, so the molecules of these at least two black substrates can be simultaneously sputtered to the area where a black deposition layer is needed, depositing a black layer comprising a mixture of multiple molecules. An example structure of the black deposition layer formed in this example is shown below. Figure 3-2 As shown. In this example, the black deposition layer 3 is formed by the simultaneous sputtering of a first molecule 31 (from a first black substrate) and a second molecule 32 (from a second black substrate) into a preset area. It should be understood that this example is not limited to sputtering molecules from two black substrates to form a black layer; it is also possible to sputter molecules from three or more black substrates to form a black layer as needed. This example will not elaborate on these possibilities.

[0072] Example 3:

[0073] In a vacuum magnetic environment, ions are guided by a magnetic field to sequentially bombard at least two types of black substrates, causing molecules from these substrates to be uniformly sputtered onto the front side of the circuit board and the surface of each light-emitting unit, thereby depositing a black deposition layer. In this example, at least two types of black substrates are bombarded sequentially, so the molecules of these substrates can be sequentially sputtered to the areas where a black deposition layer is needed, and a black layer comprising multiple molecules is deposited. An example structure of the black deposition layer formed in this example is shown below. Figure 3-3As shown in the example, in this example, ions guided by a magnetic field are first bombarded with the first black substrate during time period t1, uniformly sputtering the first molecule 31 of the first black substrate onto the front side of the circuit board and the surface of each light-emitting unit to form a first molecular sublayer. Then, during time period t2, ions guided by a magnetic field are bombarded with the third black substrate, uniformly sputtering the third molecule 33 of the third black substrate onto the front side of the circuit board and the surface of each light-emitting unit to form a second molecular sublayer. Finally, during time period t3, ions guided by a magnetic field are bombarded with the second black substrate, uniformly sputtering the second molecule 32 of the second black substrate onto the front side of the circuit board and the surface of each light-emitting unit to form a third molecular sublayer. It should be understood that this example is not limited to sequentially sputtering molecules from three black substrates to deposit a black layer; molecules from two or more black substrates can also be sequentially sputtered to deposit a black layer as needed. Furthermore, the molecular sublayers in this example can be arranged alternately, for example, the first molecule 31 and the second molecule 32 can alternately form corresponding molecular sublayers. This example will not elaborate further on these aspects. In addition, the replacement of different targets in this example can be done manually or automatically by equipment.

[0074] As can be seen from the examples above, the sputtering process in this embodiment can be, but is not limited to, magnetron sputtering. It simplifies the control of the consistency and coverage of the formed black deposition layer, resulting in a high yield of the black deposition layer, high efficiency, and low cost. Furthermore, the black deposition layer in this embodiment can be formed by the deposition of one type of molecule, or by the mixed deposition of two or more types of molecules (see, for example, [reference needed]). Figure 3-2 (as shown) or layered deposition (see, for example, see...) Figure 3-3 As shown in the figure, the black deposition layer can be flexibly configured according to the specific application scenario's requirements for light transmittance and blackness. In particular, the black deposition layer in Examples 2 and 3 above includes at least two types of molecules, so the blackness and light transmittance of the black deposition layer can be flexibly adjusted to meet application needs, thereby ensuring contrast while improving display effect.

[0075] At the same time, it should be understood that this embodiment is not limited to the use of magnetron sputtering process, and other sputtering processes that can achieve black deposition layers can also be used as equivalent replacements. This embodiment does not limit them.

[0076] The black substrate described in this embodiment can be flexibly selected. For example, in some examples, the black substrate in this embodiment may include, but is not limited to, at least one of oxides, silicides, nitrides, and composites. The composite in this embodiment may be, but is not limited to, a composite of at least two of oxides, silicides, and nitrides. For example, in some application scenarios, at least one of AZO substrates, SiO2 substrates, SiO substrates, SiC substrates, Si3N4 substrates, or composite substrates of at least two of the above substrates may be used. For example, in... Figure 3-2 The first molecule 31 in the black deposition layer 3 shown can be, but is not limited to, a molecule of one of the above-mentioned substrates, and the second molecule can be a molecule of another of the above-mentioned substrates. Figure 3-3 The first molecule 31, the second molecule 32, and the third molecule 33 in the black deposition layer 3 shown in the figure can be, but are not limited to, molecules of three of the above-mentioned substrates. Furthermore, the oxide substrate, silicide substrate, nitride substrate, and composite substrate in the examples above in this embodiment are all existing conventional materials, which are low in cost and have good versatility.

[0077] The thickness of the black deposition layer in this embodiment can be flexibly set according to the requirements for the light transmittance and blackness of the black deposition layer. For example, in some application examples, the thickness of the formed black deposition layer is greater than or equal to 2 nanometers and less than or equal to 300 nanometers. It can be seen that the black deposition layer in this example is an ultra-thin layer, so it will not significantly increase the overall thickness of the LED light source component, which is beneficial to the ultra-thinning of the LED light source component.

[0078] S203: Remove at least a portion of the black deposited layer on the positive light-emitting surface of each light-emitting unit.

[0079] In this embodiment, after forming the aforementioned black deposition layer, at least a portion of the black deposition layer on the front light-emitting surface of each light-emitting unit is removed to ensure the light emission efficiency of each light-emitting unit through its front light-emitting surface. When the LED light source assembly is made into a display screen, the display brightness of the display screen can be guaranteed. It should be understood that in this embodiment, whether all or only a portion of the black deposition layer on the front light-emitting surface of the light-emitting unit is removed, and how much is removed, can be flexibly set according to the specific application scenario requirements and the light transmittance of the black deposition layer. For example, when the black deposition layer is opaque (opaqueness in this embodiment is relative; for example, when the light transmittance of the black deposition layer is less than or equal to 20% or 10%, it can be considered opaque), then all the black deposition layer on the front light-emitting surface of each light-emitting unit can be removed; of course, even if the black deposition layer is translucent, all the black deposition layer on the front light-emitting surface of each light-emitting unit can be removed according to specific requirements. When the black deposition layer is transparent, if only a portion of the black deposition layer on the front light-emitting surface of each light-emitting unit is removed, for example, if the thickness of the black deposition layer before removal is d, and the thickness of the black deposition layer after removal is X*d, where the value of X is greater than or equal to 0 and less than 1, the specific value of X can be flexibly determined according to the current brightness requirements and the light transmittance, blackness and thickness of the black deposition layer itself. This embodiment does not impose specific restrictions on it.

[0080] In this embodiment, the area with the thickest black deposition layer has the lowest light transmittance, while the area with the thinnest black deposition layer has the highest light transmittance. The light transmittance of the area with the thickest black deposition layer can be set to be greater than 30%, and the specific value can be set according to application requirements. For example, in some application scenarios, its light transmittance can be set to be greater than or equal to 30% and less than or equal to 50%. This ensures that while improving contrast, the light transmittance efficiency requirement is met, thus guaranteeing the display effect.

[0081] Of course, in some application scenarios, it is possible to remove only a portion of the black deposited layer on the front light-emitting surface of some light-emitting units, while removing all the black deposited layer on the front light-emitting surface of other light-emitting units; or even to remove only a portion of the black deposited layer on the front light-emitting surface of some light-emitting units, remove all the black deposited layer on the front light-emitting surface of other light-emitting units, and leave the black deposited layer on the front light-emitting surface of the remaining light-emitting units untouched. Specific settings can be flexibly configured according to application requirements.

[0082] Of course, it should be understood that the method for removing the black deposition layer in this embodiment is not specifically limited. For example, in some application examples, after the formation of the aforementioned black deposition layer and before proceeding to the next step, the black deposition layer on the front light-emitting surface of each light-emitting unit can be directly removed. This removal can be performed using, but is not limited to, laser removal. Laser removal has advantages such as high efficiency and accuracy, mature technology, and low cost. In this application example, a laser can be used to directly remove at least a portion of the black deposition layer on the front light-emitting surface of each light-emitting unit. For example, a laser can be used to irradiate the black deposition layer on the front light-emitting surface of each light-emitting unit to remove at least a portion of the black deposition layer on the front light-emitting surface of each light-emitting unit.

[0083] For example, in another example, before removing at least a portion of the black deposited layer on the positive light-emitting surface of each light-emitting unit, the process may further include: forming a second encapsulation layer on the black deposited layer, the second encapsulation layer being an adhesive layer; in this application example, removing at least a portion of the black deposited layer on the positive light-emitting surface of each light-emitting unit may include: removing the second encapsulation layer on the positive light-emitting surface of each light-emitting unit together with at least a portion of the black deposited layer on the positive light-emitting surface of each light-emitting unit. In this application example, processes such as polishing or plasma etching may be used to remove the second encapsulation layer on the positive light-emitting surface of each light-emitting unit together with at least a portion of the black deposited layer on the positive light-emitting surface of each light-emitting unit. Polishing and plasma etching processes also have advantages such as high efficiency and accuracy, mature technology, and low cost.

[0084] Of course, it should be understood that in this embodiment, it is not limited to removing only at least a portion of the black deposited layer on the front light-emitting surface of each light-emitting unit. At least a portion of the black deposited layer in other areas can also be removed as needed, such as removing the black deposited layer on at least one side of the light-emitting unit.

[0085] It should be understood that, in this embodiment, when it is necessary to remove all the black deposition layer on the front light-emitting surface of each light-emitting unit, as an alternative process, a mask of a corresponding shape can be used to cover the front light-emitting surface of each light-emitting unit before step S202, exposing other areas where a black deposition layer needs to be formed to the mask. This results in a situation where, in step S203, a black deposition layer is not directly covering the front light-emitting surface of each light-emitting unit, and the black deposition layer removal step is no longer required in this alternative process. However, this mask-based method requires additional mask fabrication, which is costly and inefficient. Furthermore, the fabrication accuracy of the mask directly affects the coverage accuracy of the black deposition layer. Compared to directly forming a black deposition layer on the front light-emitting surface of each light-emitting unit first, and then removing it entirely or partially as needed, the accuracy control is more difficult. Of course, this alternative process cannot meet the requirement of forming a black deposition layer on the front light-emitting surface of each light-emitting unit, and its application scenarios are more limited.

[0086] S204: A first encapsulation layer is formed on the front side of the circuit board, covering the black deposition layer and each light-emitting unit. The first encapsulation layer is a light-transmitting layer.

[0087] It should be understood that the formation process and material of the first encapsulation layer in this embodiment can be flexibly set, and this embodiment does not limit them. For example, in some examples, the first encapsulation layer can be, but is not limited to, an adhesive layer, and its formation method can be, but is not limited to, coating, molding, printing, pre-made film and then mounted. The first encapsulation layer in this embodiment can protect the light-emitting pixel unit and the black deposition layer. For example, in some application examples, the first encapsulation layer can be a transparent encapsulation adhesive layer using transparent epoxy adhesive, thereby sealing and protecting the light-emitting pixel unit and the black deposition layer on the circuit board. In some application scenarios, at least one of the following can be added to the transparent epoxy adhesive as needed: white powder (e.g., including but not limited to SiO2 powder), melanin, light conversion particles (e.g., phosphor, quantum dots, etc.), light diffusion particles, etc., to further adjust the light emission effect of the LED light source component. In addition, the upper surface of the first encapsulation layer in this embodiment (i.e., the side of the first encapsulation layer away from the circuit board) can be set as a matte surface, glossy surface, frosted surface, matte surface, etc., as needed, thereby achieving different appearance effects and light emission effects, thereby further enriching the display effect and improving user experience satisfaction.

[0088] To facilitate understanding, the manufacturing process of the LED light source component provided in this embodiment will be illustrated below with reference to the accompanying drawings.

[0089] See the example of the fabrication process for an LED light source assembly. Figure 4 As shown, it includes, but is not limited to:

[0090] S301: Several light-emitting units 21 are arranged on the front side of the circuit board 1.

[0091] In this example, the circuit board 1 is a display board, and at least two light-emitting units 21 constitute a light-emitting pixel unit 2. For example, the light-emitting pixel unit 2 includes three light-emitting units 21 that emit red light, blue light and green light respectively.

[0092] S302: Molecules of a black substrate are sputtered onto the front side of the circuit board 1 and the surface of each light-emitting unit 21 to form a black deposition layer 3 covering the front side of the circuit board 1 and the surface of each light-emitting unit 21.

[0093] For example, see Figure 7As shown, this example uses a first black substrate J1 (e.g., SiC substrate) and a second black substrate J2 (Si3N4 substrate). In a vacuum environment, the first black substrate J1 and the second black substrate J2 are used as targets and placed on a platform. The front side of the circuit board 1 and the light-emitting units 21 disposed on its front side are positioned opposite the first black substrate J1 and the second black substrate J2. Ions K are guided to simultaneously bombard the first black substrate J1 and the second black substrate J2, causing the first molecules 31 and the second molecules 32 of the first black substrate J1 and the second black substrate J2 to be sputtered onto the front side of the circuit board 1 and the surface of each light-emitting unit 21, thereby forming a structure similar to... Figure 3-2 The black sedimentary layer 3 shown in the image.

[0094] S303: Remove all the black deposited layer 3 on the front light-emitting surface of each light-emitting unit 21. For example, but not limited to, laser removal can be used to remove all the black deposited layer 3 on the front light-emitting surface of each light-emitting unit 21, while the black deposited layer 3 in other areas is retained. Of course, in this example, when the black deposited layer 3 has light-transmitting properties, only a portion of the black deposited layer 3 on the front light-emitting surface of each light-emitting unit 21 can be removed according to specific application requirements.

[0095] S304: A first encapsulation layer 41 is formed on the front side of the circuit board 1, covering the black deposition layer 3 and each light-emitting unit 21.

[0096] For another example of the manufacturing process of an LED light source component, see [link to documentation]. Figure 5 As shown, it includes, but is not limited to:

[0097] S401: Several light-emitting units 21 are arranged on the front side of the circuit board 1.

[0098] In this example, the circuit board 1 is also a display board. At least two light-emitting units 21 constitute a light-emitting pixel unit 2. For example, the light-emitting pixel unit 2 includes three light-emitting units 21 that emit red light, blue light and green light respectively.

[0099] S402: Molecules of a black substrate are sputtered onto the front side of the circuit board 1 and the surface of each light-emitting unit 21 to form a black deposition layer 3 covering the front side of the circuit board 1 and the surface of each light-emitting unit 21.

[0100] For example, see Figure 8As shown, in this example, a third black substrate J3 (e.g., SiO substrate) is used. In a vacuum environment, the third black substrate J3 is placed on a platform as a target. The front side of the circuit board 1 and the light-emitting units 21 disposed on the front side are positioned opposite the third black substrate J3. Ions K are guided to bombard the third black substrate J3, causing the third molecules 33 of the third black substrate J3 to be sputtered onto the front side of the circuit board 1 and the surface of each light-emitting unit 21, thereby forming a structure similar to... Figure 3-1 The black sedimentary layer 3 shown in the image.

[0101] S403: A second encapsulation layer 42 is formed on the black deposition layer 3. In this example, the second encapsulation layer 42 can be made of the same material and formed by the first encapsulation layer 42 as described above, or other forming methods can be used, which will not be described in detail here.

[0102] S404: Remove the second encapsulation layer 42 on the front light-emitting surface of each light-emitting unit 21 along with the black deposition layer 3 above the front light-emitting surface of each light-emitting unit 21. For example, but not limited to, plasma etching can be used to remove the second encapsulation layer 42 on the front light-emitting surface of each light-emitting unit 21 along with the black deposition layer 3 above the front light-emitting surface of each light-emitting unit 21. Of course, in this example, when the black deposition layer 3 has light-transmitting properties, only a portion of the black deposition layer 3 on the front light-emitting surface of each light-emitting unit 21 can be removed according to specific application requirements. Furthermore, the above-mentioned plasma etching process can be replaced by grinding or laser removal processes as needed.

[0103] S405: A first encapsulation layer 41 is formed on the second encapsulation layer 42. The material and forming process of the first encapsulation layer 41 are described in the examples above and will not be repeated here.

[0104] For another example of the manufacturing process of an LED light source assembly, see [link to documentation]. Figure 6 As shown, it includes, but is not limited to:

[0105] S501: Several light-emitting units 21 are arranged on the front side of the circuit board 1.

[0106] S502: Molecules of a black substrate are sputtered onto the front side of the circuit board 1 and the surface of each light-emitting unit 21 to form a black deposition layer 3 covering the front side of the circuit board 1 and the surface of each light-emitting unit 21.

[0107] In this example, a first black substrate J1, a second black substrate J2, and a third black substrate J3 are used. Under vacuum conditions, the first black substrate J1 is first placed on a platform as a target. The front side of the circuit board 1 and the light-emitting units 21 disposed on its front side are positioned opposite the first black substrate J1. Ions K are guided to bombard the first black substrate J1, causing the first molecules 31 of the first black substrate J1 to sputter onto the front side of the circuit board 1 and the surfaces of each light-emitting unit 21. Then, the first black substrate J1 is replaced with the second black substrate J2, and the above steps are performed. Finally, the second black substrate J2 is replaced with the third black substrate J3, and the above steps are performed, resulting in a product similar to the one described above. Figure 3-3 The black sedimentary layer structure shown.

[0108] S503: A second encapsulation layer 42 is formed on the black deposition layer 3. In this example, the second encapsulation layer 42 can be made of the same material and formed by the first encapsulation layer 42 as described above, or other forming methods can be used, which will not be described in detail here.

[0109] S504: Remove the second encapsulation layer 42 on the front light-emitting surface of each light-emitting unit 21 along with a portion of the black deposition layer 3 above the front light-emitting surface of each light-emitting unit 21. For example, but not limited to, a polishing process can be used to remove the second encapsulation layer 42 on the front light-emitting surface of each light-emitting unit 21 along with a portion of the black deposition layer 3 above the front light-emitting surface of each light-emitting unit 21. Of course, in this example, the black deposition layer 3 has light-transmitting properties; see [link / reference]. Figure 6 In step S504, only a portion of the black deposition layer 3 on the front light-emitting surface of each light-emitting unit 21 is removed. Therefore, the first thickness of the black deposition layer 3 on the front light-emitting surface of each light-emitting unit 21 is less than the second thickness of the black deposition layer in other areas. Of course, if all the black deposition layer 3 on the front light-emitting surface of each light-emitting unit 21 is removed, the thickness of the black deposition layer 3 on the front light-emitting surface of each light-emitting unit 21 can be considered to be 0, which also satisfies the rule that the first thickness of the black deposition layer on the front light-emitting surface of each light-emitting unit 21 is less than the second thickness of the black deposition layer in other areas. Furthermore, it should be understood that the above polishing process can also be replaced by plasma etching or laser removal processes as needed. In this example, the transmittance of the black deposition layer in the second thickness region is assumed to be greater than 30%. Correspondingly, since the thickness of the first thickness region of the black deposition layer is less than the thickness of the second thickness region, the transmittance of the first thickness region is greater than the transmittance of the second thickness region, thus improving contrast while meeting the light extraction efficiency requirement and ensuring display effect.

[0110] S505: A first encapsulation layer 41 is formed on the second encapsulation layer 42. The material and forming process of the first encapsulation layer 41 are described in the above examples and will not be repeated here.

[0111] The above Figure 5 and Figure 6 In the manufacturing process shown, after a black deposition layer 3 is formed on the front light-emitting surface of each light-emitting unit 21, a second encapsulation layer 42 is formed on the black deposition layer 3, thereby providing stable support around each light-emitting unit 21 and obtaining a better overall encapsulation structure. Then, when the second encapsulation layer 42 on the front light-emitting surface of each light-emitting unit 21 is removed along with at least a portion of the black deposition layer 3 on the front light-emitting surface of each light-emitting unit 21, the second encapsulation layer provides support around the light-emitting unit 21, making it easier to operate using processes such as grinding and plasma etching, so that the light-emitting unit 21 is not easily detached, and the black deposition layer 3 on the surface of each light-emitting unit 21 is removed more uniformly.

[0112] This embodiment also provides an LED light source assembly, which is manufactured by, but not limited to, the methods for manufacturing LED light source assemblies in the above examples. The LED light source assembly includes:

[0113] A circuit board substrate includes several light-emitting units disposed on the front side of the circuit board substrate; a black deposition layer deposited on the front side of the circuit board substrate and the surface of each light-emitting unit, wherein the first thickness of the black deposition layer on the front light-emitting surface of each light-emitting unit is less than the second thickness of the black deposition layer elsewhere; and a light-transmitting first encapsulation layer disposed on the front side of the circuit board substrate, covering the black deposition layer and each light-emitting unit. In this embodiment, the second thickness of the black deposition layer can be greater than or equal to 2 nanometers and less than or equal to 300 nanometers, and the first thickness of the black deposition layer is greater than or equal to 0 and less than the second thickness. When the first thickness of the black deposition layer is equal to 0, the black deposition layer may be opaque or light-transmitting; when the first thickness of the black deposition layer is greater than 0, the black deposition layer is light-transmitting, and its transmittance can be flexibly set, for example, it can be set to, but not limited to, greater than or equal to 30% and less than or equal to 50%, to improve contrast while ensuring display brightness.

[0114] To facilitate understanding, this embodiment will be illustrated below with structural diagrams of several examples of LED light source components.

[0115] See Figure 9 The LED light source assembly shown can be, but is not limited to, […]. Figure 4The fabrication process shown includes a circuit board 1 with several pads on its front side. The electrodes of each light-emitting unit 21 are soldered to the corresponding pads by solder paste or electrically connected by conductive adhesive, and at least two light-emitting units 21 constitute a light-emitting pixel unit 2. The LED light source assembly also includes a black deposition layer 3 deposited on the front side of the circuit board 1 and on the surface of each light-emitting unit. In this example, the first thickness of the black deposition layer 3 on the front light-emitting surface of each light-emitting unit 21 is 0, and the second thickness of the black deposition layer 3 at other locations is 2 nanometers to 300 nanometers, for example, but not limited to 10 nanometers, 50 nanometers, 100 nanometers, 200 nanometers, 300 nanometers, etc. The LED light source assembly also includes a first encapsulation layer 41 disposed on the front side of the circuit board 1, covering the black deposition layer 3 and each light-emitting unit 21. In this example, the first encapsulation layer 41 is a transparent adhesive layer, or an adhesive layer mixed with at least one of melanin, light-diffusing particles, and light-converting particles (quantum dots and / or phosphors).

[0116] See Figure 10 The LED light source assembly shown is related to Figure 9 Compared to the LED light source assembly shown, the main difference lies in the fact that the first thickness of the black deposition layer 3 on the front light-emitting surface of each light-emitting unit 21 is greater than 0. Furthermore, the LED light source assembly in this example can also be, but is not limited to, the aforementioned... Figure 4 The process shown in the diagram is used to produce this product, but... Figure 4 When removing the black deposited layer 3 on the positive light-emitting surface of each light-emitting unit 21, only a portion needs to be removed, not all of it.

[0117] See Figure 11 Another example of an LED light source assembly is shown, which is related to Figure 9 Compared to the LED light source assembly shown, the main difference lies in the addition of a second encapsulation layer 42 between the black deposition layer 3 and the first encapsulation layer 41. The LED light source assembly in this example can be, but is not limited to, the above-described... Figure 5 The process shown is used to manufacture the product. In this example, the second encapsulation layer 42 can be a transparent adhesive layer, or an encapsulation layer containing at least one of melanin, light-diffusing particles, light-converting particles, etc. This embodiment does not impose any restrictions on it.

[0118] As can be seen, the black deposition layer in the LED light source assembly provided in this embodiment is formed by sputtering molecules of a black substrate onto the front side of the circuit board and the surface of each light-emitting unit and depositing them. This allows the molecules of the black substrate to be sputtered to each location where a black deposition layer needs to be formed, eliminating the limitation of the flatness of the area where the black deposition layer is to be formed, and achieving coverage without dead angles. Furthermore, the formed black deposition layer is uniform, which can reduce the difference in black color intensity at different locations of the black deposition layer. Therefore, it can improve the contrast of the display screen made using this LED light source assembly and avoid the appearance of spots when the display screen emits light from the side. Moreover, at least a portion of the black deposition layer on the front light-emitting surface of each light-emitting unit is removed, thereby ensuring the light emission efficiency of each light-emitting unit and improving the display brightness of the display screen made using this LED light source assembly, thus ensuring the display effect of the display screen made using this LED light source assembly. At the same time, this sputtering process has low production control difficulty, high yield, and can reduce production costs.

[0119] This embodiment also provides an LED display screen, which includes at least one LED light source component from the above embodiments. That is, the LED display screen in this embodiment is a direct-view LED display screen. It also includes a driving element, which is disposed on the back or front of the circuit board of the LED light source component and electrically connected to each light-emitting pixel unit. It should be understood that the driving element in this embodiment can use an AM (Active Matrix) driving method or a PM (Passive Matrix) driving method to drive the LED light source component. Furthermore, the LED display screen provided in this embodiment can be widely used in electronic devices with displays, such as vehicle terminals and advertising display terminals.

[0120] For ease of understanding, this embodiment will use an LED display screen as an example. Figure 9 The LED light source assembly shown is for illustrative purposes only; see [link / reference]. Figure 12 As shown, the driving element 5 of the LED display screen is disposed on the back side of the circuit board 1 and is electrically connected to each light-emitting pixel unit 2 (each light-emitting pixel unit 2 includes at least two light-emitting units 21) on the front side of the circuit board 1 to drive the light-emitting units 21 in each light-emitting pixel unit 2. In some application scenarios of this example, other electronic components besides the light-emitting units 21 can also be flexibly arranged on the front and / or back side of the circuit board 1. The electronic components may include, but are not limited to, resistors, capacitors, etc., and can be selected and arranged according to application requirements.

[0121] In this example, the electrodes of the light-emitting units 21 of each light-emitting pixel unit 2 can be electrically connected to the corresponding pads on the front side of the circuit board 1 using solder paste, but not limited to solder paste. The solder paste can be, but is not limited to, lead-containing solder alloys, such as tin-lead (Sn-Pb) alloys, tin-lead-bismuth (Sn-Pb-Bi) alloys, or tin-lead-silver (Sn-Pb-Ag) alloys; it can also be lead-free solder alloys, such as tin-silver (Sn-Ag) alloys, tin-bismuth (Sn-Bi) alloys, tin-zinc (Sn-Zn) alloys, tin-antimony (Sn-Sb), tin-silver-copper (Sn-Ag-Cu) alloys, or tin-bismuth-silver (Sn-Bi-Ag) alloys. It should also be understood that the solder paste in this embodiment can be equivalently replaced with conductive adhesive as needed, for example, it can be replaced with, but is not limited to, conductive silver paste.

[0122] In some application examples of this embodiment, to achieve color display, one light-emitting pixel unit in the LED light source assembly can be configured to emit red, green, and blue light. Therefore, in this example, at least some of the multiple light-emitting units 21 included in the light-emitting pixel unit 2 can emit red light, at least some can emit green light, and some can emit blue light. That is, the light-emitting unit 21 in this embodiment may include, but is not limited to, blue light-emitting units, red light-emitting units, and green light-emitting units. In other examples, all light-emitting units 21 in the light-emitting pixel unit 2 can be equivalently replaced with blue light-emitting units. To enable some of the light-emitting units to emit green and red light respectively, a corresponding light conversion layer can be provided on the light-emitting surface of these blue light-emitting units. It should be understood that the application of the present invention is not limited to the above examples. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A method for manufacturing an LED light source component, characterized in that, include: Several light-emitting units are arranged on the front side of the circuit board; Molecules of a black substrate are sputtered onto the front side of the circuit board and the surface of each of the light-emitting units to form a black deposition layer covering the front side of the circuit board and the surface of each of the light-emitting units. A second encapsulation layer is formed on the black deposition layer. The second encapsulation layer is an adhesive layer that covers the front light-emitting surface and the surrounding area of ​​the light-emitting unit. The second encapsulation layer on the positive light-emitting surface of each of the light-emitting units is removed together with at least a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units, wherein the positive light-emitting surface of the light-emitting unit is the side of the light-emitting unit away from the circuit board. A first encapsulation layer is formed on the front side of the circuit board, covering the second encapsulation layer and each of the light-emitting units. The first encapsulation layer is a light-transmitting layer.

2. The method for manufacturing an LED light source assembly as described in claim 1, characterized in that, Removing at least a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units constitutes removing all of the black deposition layer on the positive light-emitting surface of each of the light-emitting units.

3. The method for manufacturing an LED light source assembly as described in claim 1, characterized in that, Removing at least a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units means removing a portion of the black deposition layer on the positive light-emitting surface of each of the light-emitting units, wherein the black deposition layer is a light-transmitting layer.

4. The method for manufacturing an LED light source assembly as described in any one of claims 1-3, characterized in that, The process of sputtering molecules from a black substrate onto the front side of the circuit board and the surface of each of the light-emitting units includes: In a vacuum magnetic environment, ions are guided by a magnetic field to bombard a black substrate, and the molecules of the black substrate are uniformly sputtered onto the front side of the circuit board and the surface of each light-emitting unit. or, In a vacuum magnetic environment, ions are guided by a magnetic field to bombard at least two black substrates simultaneously, so that the molecules of the at least two black substrates are uniformly sputtered onto the front side of the circuit board and the surface of each of the light-emitting units. or, In a vacuum magnetic environment, ions are guided by a magnetic field to bombard at least two black substrates in sequence, thereby uniformly sputtering the molecules of the at least two black substrates onto the front side of the circuit board and the surface of each of the light-emitting units.

5. The method for manufacturing an LED light source assembly as described in any one of claims 1-3, characterized in that, The black substrate includes at least one of oxides, silicides, nitrides, and compounds, wherein the compound is a combination of at least two of the oxides, silicides, and nitrides.

6. An LED light source assembly, manufactured by the method for manufacturing an LED light source assembly as described in any one of claims 1-5, characterized in that, The LED light source assembly includes: Circuit board; Several light-emitting units are disposed on the front side of the circuit board; A black deposition layer is deposited on the front side of the circuit substrate and on the surface of each of the light-emitting units; and the first thickness of the black deposition layer on the front light-emitting surface of each of the light-emitting units is less than the second thickness of the black deposition layer at other locations; A first encapsulation layer is disposed on the front side of the circuit substrate, covering the black deposition layer and each of the light-emitting units. The first encapsulation layer is a light-transmitting layer. The second encapsulation layer is disposed between the black deposition layer and the first encapsulation layer, and covers the periphery of the light-emitting unit.

7. The LED light source assembly as described in claim 6, characterized in that, The second thickness is greater than or equal to 2 nanometers and less than or equal to 300 nanometers, and the first thickness is greater than or equal to 0 and less than the second thickness.

8. The LED light source assembly as described in claim 7, characterized in that, The first thickness is greater than 0 and less than the second thickness, and the light transmittance of the black deposition layer in the second thickness region is greater than 30%.

9. An LED display screen, characterized in that, It includes a driving element and an LED light source assembly as described in any one of claims 6-8, wherein the driving element is disposed on the back or front side of the circuit board and is electrically connected to each of the light-emitting units.

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