Miniature display panel

Abstract

A micro LED display panel (220) includes: a micro LED chip (240) disposed at a first end of a flexible printed circuit (FPC) board (2203) and configured to provide a monochromatic image; and the connector (2205) is arranged at the second end of the FPC board (2203) and is used for communicating with the micro LED chip (2204) through the FPC board (2203).

Description

[0001] Cross-reference to related applications This disclosure claims priority to PCT application PCT / CN2023 / 123529, filed on October 9, 2023, which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to the field of micro LED displays, and more particularly to a micro display panel. Background Technology

[0003] Miniature LEDs (light-emitting diodes) with ultra-small area and higher resolution are becoming increasingly popular.

[0004] Micro-LED panels containing micro-LED arrays can be used to construct a variety of devices, such as camera modules, projection modules, display modules, virtual reality / augmented reality (VR / AR) optical modules, and so on.

[0005] Traditional microdisplay modules consist of three microdisplay panels and a small X-cube prism. The X-cube prism acts as a light combining unit, combining image light of different colors into full-color image light. The X-cube prism and the microdisplay panels facing the X-cube prism require a cage for support so that the light emitted by the microdisplay panels can be transmitted into the X-cube prism. Summary of the Invention

[0006] Embodiments of this disclosure provide a micro-display panel. The micro-LED display panel includes: a micro-LED chip disposed at a first end of a flexible printed circuit (FPC) board and used to provide a monochrome image; and a connector disposed at a second end of the FPC board and used to communicate with the micro-LED chip via the FPC board.

[0007] The many advantages and features of this disclosure will become more readily apparent from the following detailed description and accompanying drawings. Attached Figure Description

[0008] Embodiments and aspects of this disclosure will be set forth in the following detailed description and accompanying drawings. The various features shown in the figures are not drawn to scale.

[0009] Figure 1 A schematic diagram illustrating the light-combining principle of an X-cubic prism according to some embodiments of the present disclosure is shown.

[0010] Figure 2 A schematic diagram of the structure of a micro-display module according to some embodiments of the present disclosure is shown.

[0011] Figure 3 Some embodiments according to this disclosure are shown. Figure 2 An exploded view of the micro display module shown.

[0012] Figure 4 An exploded view of a micro-display module according to some embodiments of the present disclosure is shown. Detailed Implementation

[0013] Reference will now be made specifically to exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the drawings, where the same reference numerals in different figures denote the same or similar elements unless otherwise stated. The implementations set forth in the following description of the exemplary embodiments do not represent all implementations consistent with this disclosure. Rather, these implementations are merely examples of apparatuses and methods consistent with aspects of the disclosure recited in the appended claims. Specific aspects of this disclosure are described below in more detail. If any terminology and definitions provided herein conflict with those incorporated by reference, the terminology and definitions provided herein shall prevail.

[0014] The X-cube prism is composed of four triangular prisms with different reflective films, used to combine red, green and blue light beams to form a color image. Figure 1 A schematic diagram illustrating the light-combining principle of an X-cubic prism 100 according to some embodiments of the present disclosure is shown. For example... Figure 1 As shown, the X-cube 100 includes three surfaces for receiving monochromatic light and one surface for transmitting light formed by combining monochromatic light to create a color image. For example, red light passes through the first surface 110 of the X-cube 100 and is reflected by a red reflective film 150. Blue light passes through the second surface 120 of the X-cube 100 and is reflected by a blue reflective film 160. Green light passes through the third surface 130 of the X-cube 100 and can pass through the X-cube 100 without reflection. Therefore, light transmitted from the fourth surface 140 of the X-cube 100 can form a color image. For the X-cube 100, in order to display a color image, display panels are disposed on each side of the X-cube 100 via cages. The cages support the display panels and ensure that each display panel is aligned with the corresponding surface of the X-cube 100. Due to the use of cages, there is a certain space between each display panel and the surface of the X-cube 100, limiting further reduction in the size of the display module. This setup can cause light loss when light travels from the display panel to the X-cube prism.

[0015] The embodiments of this disclosure provide a compact micro-display module with high light transmittance. Figure 2 A schematic diagram of the structure of a micro-display module 200 according to some embodiments of the present disclosure is shown. Figure 3 An exploded view of a microdisplay module 200 according to some embodiments of the present disclosure is shown. (Reference) Figure 2 and Figure 3The micro-display module 200 includes an X-cube prism 210 and at least two micro-LED display panels 220. The X-cube prism 210 is used to combine two or more monochrome images into a multicolor image. The micro-LED display panels 220 are used to provide monochrome images. Each micro-LED display panel 220 is attached to one surface of the X-cube prism 210. Light emitted from the micro-LED display panels 220 can be transmitted through the X-cube prism 210. For example, a first micro-LED display panel 221 of the display panel 220 is attached to a first surface of the X-cube prism 210. A second micro-LED display panel 222 of the display panel 220 is attached to a second surface of the X-cube prism 210. A third micro-LED display panel 223 of the display panel 220 is attached to a third surface of the X-cube prism 210. The first micro-LED display panel 221, the second micro-LED display panel 222, and the third micro-LED display panel 223 are monochrome micro-LED display panels. Because the micro LED display panel 220 is attached to the surface of the X-cubic prism 210, the space between each micro LED display panel 220 and the corresponding surface of the X-cubic prism 210 is reduced. Therefore, the structure of the micro display module 200 is more compact.

[0016] In some embodiments, the microdisplay module 200 further includes a light shield 230 disposed on the sidewall of the corresponding microLED display panel 220. The light shield 230 is used to prevent light emitted from the corresponding microLED display panel from passing through the sidewall of the microLED display panel 220. In some embodiments, the light shield 230 includes two parts, which can be fitted onto the sidewall of the corresponding microLED display panel.

[0017] In some embodiments, the light shield 230 is attached to the sidewall of the corresponding micro-LED display panel 220. In some embodiments, the edge of the light shield 230 is located inside or aligned with the edge of the X-cubic prism 210. That is, the edge of the light shield 230 does not protrude beyond the X-cubic prism 210. In some embodiments, the light shield 230 includes a U-shaped structure with three sides for attachment to the corresponding micro-LED display panel 220. Each side of the light shield 230 matches the sidewall of the corresponding micro-LED display panel 220, except for the bottom sidewall. In some embodiments, the thickness of each side of the light shield 230 is equal to the thickness of the corresponding micro-LED display panel 220. In some embodiments, the light shield 230 can be detached from the corresponding micro-LED display panel 220.

[0018] In some embodiments, the light shield 230 is opaque and non-reflective, thereby preventing light leakage and light interference. For example, the light shield 230 may be black. In some embodiments, the light shield 230 is waterproof and chemically resistant.

[0019] In some embodiments, the sidewalls of the micro-LED display panel 220 are sealed by a light-shielding layer 270. In some embodiments, the light-shielding layer 270 is also attached to the portion of the surface of the X-cube prism not covered by the micro-LED display panel 220. In some embodiments, the light-shielding layer 270 is an anti-reflective coating. For example, the material of the light-shielding layer 270 can be a black photoresist. The light-shielding layer 270 can be a coating formed by spin coating on the sidewalls of the micro-LED display panel 220. In some embodiments, the light-shielding layer 270 is adhered to the surface of the sidewalls of the micro-LED display panel 220 by a sealant. In some embodiments, the sealant is opaque.

[0020] In some embodiments, a light-transmitting film is further formed on the surface of the X-cubic prism 210 facing the micro-LED display panel 220 to improve light transmittance. In some embodiments, the light-transmitting film has a transmittance of 99% or greater in the visible light range (typically, high transmittance means 95% or greater). The light-transmitting film is a thin film. In some embodiments, the thickness of the light-transmitting film is less than 10 µm. In some embodiments, the material of the light-transmitting film is selected from at least one of resins and adhesives, such as UV-curable adhesives.

[0021] In some embodiments, the micro-LED display panel 220 is adhered to the corresponding surface of the X-cube prism using optical adhesive. In some embodiments, the optical adhesive is applied to the edges of the micro-LED display panel 220 to adhere it to the corresponding surface of the X-cube prism 210. In some embodiments, the optical adhesive is an optically transparent adhesive (OCA) film. In some embodiments, the light transmittance of the optical adhesive is equal to or greater than 95%. In some embodiments, the light transmittance of the optical adhesive is equal to or greater than 99%. In some embodiments, an optical adhesive dispensing process is performed between each surface of the X-cube prism 210 facing the micro-LED display panel 220 and the corresponding micro-LED display panel 220.

[0022] In some embodiments, the microdisplay module 200 further includes a lens 240 disposed on a fourth surface of the X-cubic prism 210 for receiving combined light transmitted from the X-cubic prism 210. The microdisplay module 200 also includes a top cover 250 and a bottom support 260. The top cover 250 and the bottom support 260 are used to cover the top and bottom surfaces of the X-cubic prism 210, respectively. The materials of the top cover 250 and the bottom support 260 may be the same as the material of the light shield 230.

[0023] like Figure 3 As shown, the micro-LED display panel 220 also includes a micro-LED chip 2204 and a connector 2205. The micro-LED chip 2204 is disposed at a first end of the flexible printed circuit board (FPC) 2203 and configured to provide a monochrome image. The connector 2205 is disposed at a second end of the flexible printed circuit board 2203 and configured to communicate with the micro-LED chip 2204 via the flexible printed circuit board 2203. In some embodiments, the micro-LED chip 2204 and the flexible printed circuit board 2203 are electrically connected via gold wire. Specifically, a light shielding layer 270 encloses the sidewalls of the micro-LED chip 2204 of each micro-LED display panel 220. In some embodiments, the connector 2205 is also configured to communicate electrically with external signals. The connector 2205 can be used as an input / input (I / O) interface for communicating with external devices.

[0024] In some embodiments, the micro-LED display panel 220 further includes a first plate 2201 connected to a first end of the flexible printed circuit board 2203, and a second plate 2202 connected to a second end of the flexible printed circuit board 2203. The micro-LED display panel 220 has a front side facing the X-cubic prism 210 and a back side opposite to the front side. A micro-LED chip 2204 is disposed on the first plate 2201 and on the front side of the micro-LED display panel 220. A connector 2205 is disposed on the second plate 2202 and on the back side of the micro-LED display panel 220. The first plate 2201 and the second plate 2202 can provide rigid support for the micro-LED chip 2204 and the connector 2205. In some embodiments, the first plate 2201 is a steel plate, and the second plate 2202 is a flexible rigid plate, for example, a rigid-flexible printed circuit board. The flexible printed circuit board 2203 may include a wire as a ground wire coupled to the ground of a component connected to the flexible printed circuit board 2203. In some embodiments, the first board 2201, the flexible printed circuit board 2203, and the second board 2202 are integrated into a single structure.

[0025] In some embodiments, the micro LED chip 2204 is attached to the first board 2201 by an adhesive material (e.g., a die-attach material). The connector 2205 is attached to the second board 2202 by an adhesive material (e.g., a die-attach material).

[0026] In some embodiments, the micro-LED display panel 220 further includes a memory chip 2206 disposed on a second plate 2202, the memory chip 2202 being disposed on the front side of the micro-LED display panel 220. The memory chip 2206 is electrically coupled to the micro-LED chip 2204 and the connector 2205, and is configured to cache or store patterns for display on the micro-LED display panel 220, or instructions for displaying patterns, thereby reducing communication costs between the micro-LED display panel 220 and the signal source (e.g., GPU) and improving display efficiency. In some embodiments, the memory chip 2206 is attached to the second plate 2202 by an adhesive material (e.g., die-attach material).

[0027] Figure 4 An exploded view of a microdisplay module 300 according to some embodiments of the present disclosure is shown. Figure 4 As shown, the micro-display module 300 includes an X-cube prism 310 and at least two micro-LED display panels 320. The X-cube prism 310 is used to combine two or more monochrome images into a multicolor image. The micro-LED display panels 320 are used to provide monochrome images. Each micro-LED display panel 320 is attached to one surface of the X-cube prism 310. In some embodiments, three micro-LED display panels 320 are respectively disposed on the three surfaces of the X-cube prism 310. Figure 4 As shown, the three surfaces of the X-cubic prism 310 facing the three micro-LED display panels 320 are each partially covered by a shielding layer 311. The shielding layer 311 has openings 312 corresponding to the light-emitting areas of the corresponding micro-LED display panels 320 and exposing the X-cubic prism to receive light. In some embodiments, the openings 312 are rectangular or square. In some embodiments, the openings 312 are circular. The shape of the openings 312 can be determined according to the design of the micro-LED display panels 320 and is not limited thereto. In some embodiments, the shielding layer 311 is formed by screen printing.

[0028] The microdisplay module 300 also includes a lens 340 disposed on the fourth surface of the X-cubic prism 310 for receiving combined light transmitted from the X-cubic prism 310. The microdisplay module 300 further includes a housing 350 for connecting the lens 340 and the X-cubic prism 310. The housing 350 includes a top cover 351 and a lens connector 352. The housing 350 is integrally formed by the top cover 351 and the lens connector 352. When assembling the microdisplay module 300, the top cover 351 can cover the top surface of the X-cubic prism 310, and the X-cubic prism 310 and the lens 340 are connected via the lens connector 352.

[0029] The micro-display module disclosed herein uses micro-LED display panels adhered to the surface of an X-cubic prism using adhesive or other methods. This results in a more compact structure for the micro-display module. Since there is no space between each micro-LED display panel and the X-cubic prism, light leakage is eliminated, thereby improving light transmission efficiency.

[0030] It should be noted that relational terms such as “first” and “second” in this document are used only to distinguish one entity or operation from another, and do not require or imply any actual relationship or order between these entities or operations. Furthermore, the words “including,” “having,” “containing,” and “comprising,” as well as other similar forms, are intended to be equivalent in meaning and are open-ended; one or more items following any of these words do not imply an exhaustive list of such one or more items, or that they are limited to only one or more listed items.

[0031] Unless otherwise specified, the term "or" as used herein includes all possible combinations except where it is impractical. For example, if a database is declared to include A or B, then unless otherwise specified or impractical, the database may include A, or B, or A and B. A second example is if a database is declared to include A, B, or C, then unless otherwise specified or impractical, the database may include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C.

[0032] In the foregoing specification, numerous specific details have been described with reference to embodiments that may vary depending on the implementation. Certain adjustments and modifications may be made to the described embodiments. Other embodiments will be apparent to those skilled in the art in light of the specification and practice of the invention disclosed herein. The specification and embodiments are intended to be illustrative only, and the claims indicate the true scope and spirit of the invention. It is also intended that the order of steps shown in the figures be used for illustrative purposes only and is not intended to limit one to any particular order of steps. Therefore, those skilled in the art will understand that these steps may be performed in a different order when implementing the same method.

[0033] Exemplary embodiments have been disclosed in the accompanying drawings and description. However, many variations and modifications can be made to these embodiments. Therefore, although specific terms are used, they are used in a general and descriptive sense only and not for limiting purposes.

Claims

1. A miniature LED display panel, comprising: A micro LED chip, the micro LED chip being disposed at the first end of a flexible printed circuit (FPC) board and used to provide a monochrome image; as well as A connector is disposed at the second end of the FPC board and is used for communication between the FPC board and the micro LED chip.

2. The micro LED display panel of claim 1, wherein, The connector is also used for electrical communication with external signals.

3. The micro LED display panel of claim 1, wherein, The micro LED display panel also includes: A first board connected to the first end of the FPC, the microLED chip being disposed on the first board and on the front side of the microLED display panel; and A second board connected to the second end of the FPC board, wherein the connector is disposed on the second board and on the back side of the micro LED display panel.

4. The micro LED display panel according to claim 3, characterized in that, The micro LED chip is attached to the first board by an adhesive material.

5. The micro LED display panel according to claim 3, characterized in that, The connector is attached to the second plate by adhesive material.

6. The micro LED display panel according to claim 4 or 5, characterized in that, The adhesive material is a chip mounting (DA) material.

7. The micro LED display panel according to claim 3, characterized in that, The micro LED chip is electrically connected to the flexible printed circuit board via gold wires.

8. The micro LED display panel according to claim 3, characterized in that, The micro LED display panel also includes: The memory chip is disposed on the second board and on the front side of the micro LED display panel, and is electrically coupled to the micro LED chip and the connector.

9. The micro LED display panel according to claim 8, characterized in that, The memory chip is attached to the second board by adhesive material.

10. The micro LED display panel according to claim 9, characterized in that, The adhesive material is a chip mounting (DA) material.

11. The micro LED display panel according to claim 3, characterized in that, The first plate is a steel plate, and the second plate is a rigid-flexible plate.

12. The micro LED display panel according to claim 3, characterized in that, The first plate, the FPC plate, and the second plate are an integral structure.

Images