Display panel, display device, and method for manufacturing display panel

Abstract

This application discloses a display panel, a display device, and a method for manufacturing the display panel. The display panel includes a substrate and pins, a planarization layer, and a protective layer disposed on the substrate. The substrate, planarization layer, and protective layer are stacked sequentially in the thickness direction. The pins include a first pin and a second pin located around the first pin. The planarization layer includes a planar portion located between adjacent pins. The protective layer is located on the side of the planar portion away from the substrate, reducing the possibility of water or oxygen entering the substrate and causing corrosion. The protective layer includes a first protective portion and a second protective portion, which are separated from each other. This mitigates the problem of protective layer peeling from the substrate gradually extending to various locations, leading to screen functionality defects. The first protective portion is disposed around the first pin, and the second protective portion is disposed around the second pin, making it difficult for protective layer peeling from the first pin to extend to the second pin.

Description

Technical Field

[0001] This application relates to the field of displays, specifically to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] With the rapid development of display technology, more and more products are equipped with organic light-emitting diode (OLED) display panels, such as OLED mobile phones, televisions and other common electronic products.

[0003] Currently, in OLED display panels, the various film layers in the bonding area are bonded together by the adhesive forces between the film layers. Bonding is achieved by connecting the flexible circuit board and the screen. However, due to the pressing between the flexible circuit board and the screen, as reliability testing time increases, the film layers at the bonding locations of the flexible circuit board are prone to detachment. Summary of the Invention

[0004] This application provides a display panel, a display device, and a method for manufacturing the display panel, aiming to improve the problem of film layer peeling in the bonding area.

[0005] The first aspect of this application provides a display panel, which includes: a substrate; pins disposed on the substrate, the pins including a first pin and a second pin located around the first pin; a planarization layer disposed on the substrate and including a planar portion located between adjacent pins; and a protective layer disposed on the side of the planar portion away from the substrate, the protective layer including a first protective portion and a second protective portion separated from each other, the second protective portion being disposed around the first pin and the first protective portion being disposed around the second pin.

[0006] According to an embodiment of the first aspect of this application, the display panel further includes an isolation portion disposed on the protective layer and located between the first pin and the second pin, the isolation portion being located between the first protective portion and the second protective portion.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the isolation portion includes a first groove disposed in the protective layer.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the isolation portion further includes a second groove located in the flat portion, and the second groove communicates with the first groove.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the isolation portion includes an isolation pillar located on the side of the flat portion away from the substrate.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the protective layer further includes a third protective portion located on the side of the isolation column opposite to the flat portion.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the isolation column includes a top surface opposite to the flat portion and a side surface connected to the top surface and extending toward the flat portion, wherein the side surface is recessed inward to form a recessed portion.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the second pin includes an input pin and an output pin, the input pin and the output pin being located on opposite sides of the first pin in a first direction.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the pin includes multiple metal layers stacked sequentially.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the substrate includes a multilayer metal layer structure, and the metal layer of at least a portion of the pins is disposed in the same layer as the metal layer of at least a portion of the substrate.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the substrate further includes a gate metal layer, an electrode metal layer, a source / drain electrode metal layer and a pixel electrode layer stacked sequentially, and the pin includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer, wherein the first metal layer and the electrode metal layer are disposed on the same layer, the second metal layer and the source / drain electrode metal layer are disposed on the same layer, and the third metal layer and the pixel electrode layer are disposed on the same layer.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a touch layer, the touch layer including a first touch metal layer and a second touch metal layer located on the side of the first touch metal layer away from the substrate, and a fourth metal layer is disposed on the same layer as the second touch metal layer.

[0017] An embodiment of the second aspect of this application provides a display device including a display panel of any of the above embodiments.

[0018] According to any of the foregoing embodiments of the second aspect of this application, the display device includes:

[0019] An integrated circuit, at least a portion of which is located on the side of the protective layer away from the substrate, includes a support portion and a conductive block, at least a portion of which is connected to a first pin, and at least a portion of which is connected to a second pin;

[0020] An adhesive layer, located between the display panel and the integrated circuit, is used to bond the display panel and the integrated circuit.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the conductive block includes a first conductive block and a second conductive block, the first conductive block and the second conductive block are respectively located on both sides of the support portion in a first direction, the first conductive block is connected to the input terminal pin, and the second conductive block is connected to the output terminal pin.

[0022] An embodiment of the third aspect of this application provides a method for manufacturing a display panel, comprising:

[0023] A pin is fabricated on a substrate, the pin including a first pin and a second pin located on the periphery of the first pin;

[0024] A first insulating material layer is prepared on a substrate, and the first insulating material layer is patterned to form a planarization layer. The planarization layer includes a planar portion located between adjacent pins.

[0025] A second insulating material layer is prepared on the side of the planarization layer away from the substrate, and the second insulating material layer is patterned to form a protective layer. The protective layer includes a first protective portion and a second protective portion that are separated from each other. The first protective portion is disposed around the second pin, and the second protective portion is disposed around the first pin.

[0026] According to any of the foregoing embodiments of the third aspect of this application, the step of preparing a second insulating layer on the side of the planarization layer away from the substrate and patterning the insulating material layer to form a protective layer includes:

[0027] The protective layer is patterned to form a first groove, which is used to separate the first protective part and the second protective part from each other.

[0028] According to any of the foregoing embodiments of the third aspect of this application, the step of preparing a second insulating layer on the side of the planarization layer away from the substrate and patterning the insulating material layer to form a protective layer further includes:

[0029] The flat portion is patterned to form a second groove, which is connected to the first groove.

[0030] According to any of the foregoing embodiments of the third aspect of this application, before preparing a second insulating layer on the side of the planarization layer facing away from the substrate and before patterning the insulating material layer to form a protective layer, the method further includes:

[0031] A third insulating material layer is prepared on the side of the planarization layer away from the substrate, and the third insulating material layer is patterned to form isolation pillars, which are located on the planarization portion.

[0032] The step of preparing a second insulating layer on the side of the planarization layer away from the substrate and patterning the insulating material layer to form a protective layer further includes:

[0033] A second insulating layer is prepared on the side of the isolation pillar and the planarization layer away from the substrate, and the insulating material layer is patterned to form a protective layer. The first protective part and the second protective part are disposed on both sides of the isolation pillar.

[0034] According to any of the foregoing embodiments of the third aspect of this application, the protective layer further includes a third protective portion located on the side of the isolation column away from the flat portion.

[0035] According to any of the foregoing embodiments of the third aspect of this application, the step of fabricating a pin on a substrate, wherein the pin includes a first pin and a second pin located around the periphery of the first pin, includes:

[0036] A multilayer metal material layer is fabricated on a substrate and patterned to form a multilayer metal layer, which together form the pin.

[0037] According to an embodiment of this application, the display panel includes a substrate and pins, a planarization layer, and a protective layer disposed on the substrate. The substrate, planarization layer, and protective layer are stacked sequentially in the thickness direction. The pins include a first pin and a second pin located around the first pin. The planarization layer includes a planar portion located between adjacent pins, which facilitates the molding of the protective layer. The protective layer is located on the side of the planar portion facing away from the substrate, reducing the possibility of water or oxygen entering the substrate and causing corrosion. The protective layer includes a first protective portion and a second protective portion, which are separated from each other. This mitigates the problem of protective layer detachment from the substrate gradually extending to various locations, leading to screen functionality defects. The first protective portion surrounds the second pin, and the second protective portion surrounds the first pin, making it difficult for detachment of the protective layer from the substrate at the first pin to extend to the second pin. Attached Figure Description

[0038] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0039] Figure 1 This is a top view of a display panel provided in the first aspect embodiment of this application;

[0040] Figure 2 yes Figure 1 Sectional view at point AA;

[0041] Figure 3 In yet another embodiment Figure 1 Sectional view at point AA;

[0042] Figure 4 In another embodiment Figure 1 Sectional view at point AA;

[0043] Figure 5 In another embodiment Figure 1 Sectional view at point AA;

[0044] Figure 6 In another embodiment Figure 1 Sectional view at point AA;

[0045] Figure 7 This is a top view of a display panel provided in another embodiment;

[0046] Figure 8 This is a schematic flowchart of a method for manufacturing a display panel according to a third aspect embodiment of this application.

[0047] Explanation of reference numerals in the attached figures:

[0048] 100. Substrate;

[0049] 200, pin; 210, first pin; 220, second pin; 221, input pin; 222, output pin;

[0050] 300. Flattening layer; 310. Flattening section;

[0051] 400. Protective layer; 410. First protective layer; 420. Second protective layer; 430. Third protective layer;

[0052] 500, Isolation section; 510, First groove; 520, Second groove; 530, Isolation post; 531, Recess;

[0053] 600. Integrated circuit; 610. Support part; 620. Conductive block; 621. First conductive block; 622. Second conductive block;

[0054] X, the first direction; Y, the second direction. Detailed Implementation

[0055] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0056] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0057] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0058] In electronic devices such as mobile phones and tablets, display panels typically include display and non-display areas. Within the non-display area, there is a bonding area used for electrical connections between integrated circuits (ICs) and the lead metal layers. Flexible circuit boards (PCBs) have conductive blocks in the bonding area. These conductive blocks connect to the leads on the lead metal layers. The connection between the conductive blocks and the leads creates a pressing force on the substrate. Over time, peeling gradually occurs between the film layers on the substrate.

[0059] Generally, flexible circuit boards (PCBs) incorporate virtual conductive blocks for support and transmission conductive blocks for data transfer. Film peeling from the substrate first occurs at the pins connected to the virtual conductive blocks. Over time, the film peeling around the pins connected to the virtual conductive blocks gradually extends towards the pins connected to the transmission conductive blocks.

[0060] To address the aforementioned problems, this application provides a display panel, a display device, and a method for manufacturing the display panel. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, display device, and method for manufacturing the display panel.

[0061] This application provides a display panel, which may be an organic light-emitting diode (OLED) display panel.

[0062] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a top view of a display panel provided in the first aspect embodiment of this application. Figure 2 yes Figure 1 Sectional view at point AA.

[0063] like Figure 1 and Figure 2 As shown, the display panel provided in the first aspect embodiment of this application includes: a substrate 100, pins 200, a planarization layer 300, and a protective layer 400. Pins 200 are disposed on the substrate 100, and each pin 200 includes a first pin 210 and a second pin 220 located around the first pin 210. The planarization layer 300 is located on the substrate 100, and includes a planar portion 310 located between adjacent pins 200. The protective layer 400 is located on the side of the planar portion 310 facing away from the substrate 100, and includes a first protective portion 410 and a second protective portion 420 separated from each other. The second protective portion 420 is disposed around the first pin 210, and the first protective portion 410 is disposed around the second pin 220.

[0064] The flat portion 310 is located between adjacent pins 200. It can be located between adjacent first pins 210 and second pins 220, or between two adjacent second pins 220 or between two adjacent first pins 210.

[0065] The first pin 210 can be a virtual pin, which supports the integrated circuit 600 when pin 200 is connected to it. The second pin 220 can be a transmission pin used for signal transmission when connected to the integrated circuit 600.

[0066] According to an embodiment of this application, the display panel includes a substrate 100 and pins 200, a planarization layer 300, and a protective layer 400 disposed on the substrate 100. The substrate 100, the planarization layer 300, and the protective layer 400 are stacked sequentially in the thickness direction. The pins 200 include a first pin 210 and a second pin 220 located around the first pin 210. The first pin 210 is used to connect to the support portion 610 of the integrated circuit 600, and the second pin 220 is used to connect to the conductive block 620 of the integrated circuit 600. The planarization layer 300 includes a planar portion 310 located between adjacent pins 200. The planar portion 310 makes it easier to form the protective layer 400. The protective layer 400 is located on the side of the planar portion 310 away from the substrate 100, reducing the possibility of water or oxygen entering the substrate 100 and causing corrosion. The protective layer 400 includes a first protective portion 410 and a second protective portion 420. The first protective portion 410 and the second protective portion 420 are separated from each other, which can improve the problem that the peeling of the protective layer 400 from the substrate 100 will gradually extend to various places, thus causing the screen to malfunction. The first protective portion 410 is arranged around the second pin 220, and the second protective portion 420 is arranged around the first pin 210, making it difficult for the peeling of the protective layer 400 located at the first pin 210 from the substrate 100 to extend in the direction of the second pin 220.

[0067] Please refer to the following: Figures 2 to 5 . Figure 3 In yet another embodiment Figure 1 Sectional view at point AA; Figure 4 In another embodiment Figure 1 Sectional view at point AA; Figure 5 In another embodiment Figure 1 Sectional view at point AA.

[0068] In order to separate the first protective portion 410 and the second protective portion 420, in some optional embodiments, the display panel further includes an isolation portion 500 disposed on the protective layer 400 and located between the first pin 210 and the second pin 220, the isolation portion 500 being located between the first protective portion 410 and the second protective portion 420.

[0069] In these optional embodiments, the isolation portion 500 is disposed between the first protective portion 410 and the second protective portion 420, such that the first protective portion 410 and the second protective portion 420 are disconnected from each other by the isolation portion 500. When the film layer detaches from the first protective portion 410, the detachment is unlikely to extend to the second protective portion 420. Similarly, when the film layer detaches from the second protective portion 420, the detachment is unlikely to extend to the first protective portion 410, thereby improving the problem of mutual interference caused by film layer detachment at different locations in the bonding area.

[0070] There are many ways to arrange the isolation section 500. For example, the isolation section 500 is arranged around the first pin 210 and extends through the protective layer 400, separating the first protective section 410 and the second protective section 420. There are also many ways to arrange the number of isolation sections 500. For example, the isolation section 500 corresponds one-to-one with the first pin 210, with one isolation section 500 corresponding to one first pin 210, and each isolation section 500 is arranged around each first pin 210; or, the isolation section 500 is integrated and arranged around multiple first pins 210.

[0071] Please continue reading. Figure 2 The structure of the isolation portion 500 can also be varied. In some optional embodiments, the isolation portion 500 includes a first groove 510 disposed in the protective layer 400. The protective layer 400 is recessed through the protective layer 400 between the first protective portion 410 and the second protective portion 420 to form the first groove 510, thereby isolating the first protective portion 410 and the second protective portion 420 through the first groove 510, so that the extension of film layer detachment between the first protective portion 410 and the second protective portion 420 does not occur, thereby improving the problem of film layer detachment in the bonding area.

[0072] like Figure 3 As shown, optionally, the isolation portion 500 also includes a second groove 520 located in the flat portion 310. The first groove 510 and the second groove 520 are connected to each other, which avoids the possible partial connection between the first protective portion 410 and the second protective portion 420 due to incomplete patterning during the manufacturing process. This completely disconnects the first protective portion 410 and the second protective portion 420, preventing the extension of film detachment between the first protective portion 410 and the second protective portion 420, thereby further improving the problem of film detachment in the bonding area.

[0073] Please see Figure 4 In some optional embodiments, the isolation portion 500 includes isolation pillars 530 located on the side of the planar portion 310 facing away from the substrate 100. When the protective layer 400 is fabricated, the portion of the protective layer 400 located on the isolation pillars 530 is deposited on the isolation pillars 530, while the remaining portion is deposited on the planar portion 310 or the substrate 100. Due to the height difference between the isolation pillars 530 and the planar portion 310, the portion of the protective layer 400 on the isolation pillars 530 and the portion of the protective layer 400 on the planar portion 310 are separated from each other, i.e., the protective layer 400 is separated at the location of the isolation pillars 530, forming a first protective portion 410 and a second protective portion 420. Due to the presence of the isolation pillars 530, no film peeling extension occurs between the first protective portion 410 and the second protective portion 420, thereby further improving the problem of film peeling in the bonding area.

[0074] like Figure 5As shown, optionally, the protective layer 400 further includes a third protective portion 430, which is located on the side of the isolation pillar 530 opposite to the flat portion 310. When the protective layer 400 is prepared, the portion of the protective layer 400 located on the isolation pillar 530 is deposited on the isolation pillar 530, and the portion of the protective layer 400 deposited on the isolation pillar 530 forms the third protective portion 430. The third protective portion 430 is located on the isolation pillar 530, such that the first protective portion 410 and the third protective portion 430 are disconnected, and the second protective portion 420 and the third protective portion 430 are disconnected. Since the isolation post 530 is located between the first protective part 410 and the second protective part 420, the orthographic projection of the third protective part 430 on the substrate 100 is located between the orthographic projection of the first protective part 410 on the substrate 100 and the orthographic projection of the second protective part 420 on the substrate 100. This causes the first protective part 410 and the second protective part 420 to be disconnected at the position of the third protective part 430, and no film peeling extension will occur between the first protective part 410 and the second protective part 420, thereby further improving the problem of film peeling in the bonding area.

[0075] Please refer to the following: Figure 4 and Figure 5 During the preparation process, the protective layer 400 is deposited on the isolation pillar 530 and other locations to create a barrier. In order to make the barrier complete, in some optional embodiments, the isolation pillar 530 includes a top surface opposite to the flat portion 310 and a side surface connected to the top surface and extending toward the flat portion 310, with the side surface recessed inward to form a recess 531.

[0076] In these alternative embodiments, the isolation post 530 has an inwardly recessed portion 531 on its side, such that during the preparation process, the third protective portion 430 of the protective layer 400 deposited on the isolation post 530 and the first protective portion 410 or the second protective portion 420 deposited at other locations are completely separated on the side, thereby making the first protective portion 410 and the second protective portion 420 completely separated at the position of the third protective portion 430, and preventing the extension of film peeling between the first protective portion 410 and the second protective portion 420, thereby further improving the problem of film peeling in the bonding area.

[0077] Please see Figure 6 , Figure 6 In another embodiment Figure 1 Sectional view at point AA.

[0078] In the bonding area of ​​the display panel, there is often more than one type of second pin 220. In some embodiments, the second pin 220 includes an input pin 221 and an output pin 222, which are located on both sides of the first pin 210 in the first direction X.

[0079] In these optional embodiments, a first protective portion 410 is disposed around the input pin 221 and the output pin 222, and a second protective portion 420 is disposed around the first pin 210. Since the input pin 221 and the output pin 222 are located on both sides of the first pin 210, when the protective layer 400 peels off at the first pin 210, the peeling is unlikely to extend simultaneously to both the input pin 221 and the output pin 222. When the protective layer 400 peels off at either the input pin 221 or the output pin 222, the two pins are less likely to interfere with each other, thereby further improving the problem of film peeling in the bonding area.

[0080] In some alternative embodiments, pin 200 includes multiple metal layers stacked sequentially.

[0081] In these alternative embodiments, the pin 200 has a multi-layer structure, which facilitates the fabrication of the pin 200. The multi-layer metal stacking enhances the stability and reliability of the pin 200.

[0082] Optionally, the substrate 100 includes multiple metal layers, and at least a portion of the metal layer of the pins 200 and at least a portion of the metal layer of the substrate 100 are disposed in the same layer, so that at least a portion of the metal layer of the pins 200 and at least a portion of the metal layer of the substrate 100 can be formed in the same process step, simplifying the display panel manufacturing process.

[0083] Optionally, the substrate 100 further includes a gate metal layer, a plate metal layer, a source / drain electrode metal layer and a pixel electrode layer stacked sequentially, and the pin 200 includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer, wherein the first metal layer is disposed on the same layer as the plate metal layer, the second metal layer is disposed on the same layer as the source / drain electrode metal layer, and the third metal layer is disposed on the same layer as the pixel electrode layer.

[0084] In these alternative embodiments, the first metal layer and the electrode metal layer can be fabricated simultaneously, the second metal layer and the source / drain electrode metal layer can be fabricated simultaneously, and the third metal layer and the pixel electrode layer can be fabricated simultaneously, simplifying the display panel fabrication process.

[0085] Optionally, the display panel includes a touch layer, which comprises a first touch metal layer and a second touch metal layer located on the side of the first touch metal layer away from the substrate. A fourth metal layer is disposed on the same layer as the second touch metal layer. This allows the fourth metal layer and the second touch metal layer to be fabricated simultaneously, simplifying the display panel fabrication process.

[0086] Optionally, the touch layer also includes an insulating layer located between the first touch metal layer and the second touch metal layer, with the insulating layer and the protective layer 400 disposed on the same layer. This allows the insulating layer and the protective layer 400 to be fabricated simultaneously, simplifying the display panel fabrication process.

[0087] Please continue reading. Figure 6 A second aspect of the present invention also provides a display device, including a display panel, an integrated circuit 600, and an adhesive layer 700 as described in any of the first aspects of the present invention. At least a portion of the integrated circuit 600 is located on the side of the protective layer 400 facing away from the substrate 100. The integrated circuit 600 includes a support portion 610 and a conductive block 620. At least a portion of the support portion 610 is connected to a first pin 210, and at least a portion of the conductive block 620 is connected to a second pin 220. The adhesive layer 700 is located between the display panel and the integrated circuit 600 for bonding the display panel and the integrated circuit 600.

[0088] After the integrated circuit 600 is connected to the second pin 220, an adhesive layer 700 is provided between the integrated circuit 600 and the protective layer 400 to enhance the adhesion between the adhesive layer 700 and the protective layer 400 and improve the film peeling of the protective layer 400. Generally, the adhesive layer 700 includes anisotropic conductive film (ACF).

[0089] When the isolation portion 500 includes the first groove 510, a portion of the adhesive layer 700 is located within the first groove 510, which enhances the bonding force between the adhesive layer 700 and the planarization layer 300, thereby better reducing the film peeling of the protective layer 400. When the isolation portion 500 also includes the second groove 520, a portion of the adhesive layer 700 is located within the second groove 520, further enhancing the bonding force between the adhesive layer 700 and the planarization layer 300, thereby reducing the film peeling of the protective layer 400.

[0090] In these optional embodiments, the integrated circuit 600 and the substrate 100 are connected via pins 200 and conductive blocks 620 to achieve signal processing and transmission. When the integrated circuit 600 is pressed onto the pins 200 via the conductive blocks 620, the support portion 610 is connected to the first pin 210 and provides support for the integrated circuit 600. The support portion 610 will generate a pressing force on the first pin 210. Therefore, the protective layer 400 around the first pin 210 is prone to film peeling. Since the first protective portion 410 and the second protective portion 420 are separated from each other, the film peeling will not extend to the second pin 220 over time, thereby further improving the problem of film peeling in the bonding area.

[0091] like Figure 6 As shown, in some optional embodiments, the conductive block 620 includes a first conductive block 621 and a second conductive block 622. The first conductive block 621 and the second conductive block 622 are respectively located on both sides of the support portion 610 in the first direction X. The first conductive block 621 is connected to the input terminal pin 221, and the second conductive block 622 is connected to the output terminal pin 222.

[0092] In these optional embodiments, the input pin 221 is connected to the first conductive block 621 to realize signal input from the substrate 100 to the integrated circuit 600, and the output pin 222 is connected to the second conductive block 622 to realize signal output from the integrated circuit 600 to the substrate 100. The support portion 610, the first conductive block 621, and the second conductive block 622 disperse the pressing force of the integrated circuit 600 on the pin 200, improving the film layer peeling of the protective layer 400.

[0093] There are several ways to arrange the pins 200. For example, when the first direction X is a column direction, the first pins 210 are arranged in a row in the second direction Y, with multiple first pins 210 spaced apart within the same row. The input pins 221 and output pins 222 are located on both sides of the first pins 210 in the first direction X. Alternatively, the input pins 221 are arranged in a row in the second direction Y, with multiple input pins 221 spaced apart within the same row, and the output pins 222 are arranged in a row in the second direction Y, with multiple output pins 222 spaced apart within the same row. When the first direction X is a row direction, the first pins 210 are arranged in a column in the second direction Y, with the input pins 221 and output pins 222 located on both sides of the first pin 210 in the first direction X. The input pins 221 and output pins 222 are arranged in a column in the second direction Y.

[0094] Please see Figure 7 , Figure 7 This is a top view of a display panel provided in another embodiment.

[0095] Optionally, the output pins 222 are arranged in rows and columns on the substrate 100.

[0096] Optionally, the number relationship between pins 200 and conductive blocks 620 can be varied, as long as the conductive blocks on the integrated circuit 600 and the support portion 610 can both have corresponding pins 200 connected to them on the substrate 100. For example, the number of first pins 210 and support portions 610 are the same, the number of input pins 221 and first conductive blocks 621 is the same, and the number of output pins 222 and second conductive blocks 622 is the same, so that the first pins 210 and support portions 610, the input pins 221 and first conductive blocks 621, and the output pins 222 and second conductive blocks 622 can all be connected exactly to each other; or, the number of first pins 210 and support portions 610 is the same, the number of input pins 221 and first conductive blocks 621 is the same, and the number of output pins 222 is greater than that of second conductive blocks 622; or, the number of first pins 210 and support portions 610 is the same, the number of input pins 221 is greater than that of first conductive blocks 621, and the number of output pins 222 is the same as that of second conductive blocks 622; or, the number of first pins 210 and support portions 610 is the same, the number of input pins 221 is greater than that of first conductive blocks 621, and the number of output pins 222 is greater than that of second conductive blocks 622.

[0097] The accompanying drawings in this application only illustrate the correspondence between the number and position of pins 200 and the conductive block 620 and the support portion 610, that is, the arrangement of pins 200 is the same as the arrangement of the support portion 610 and the conductive block 620. The pin 200 arrangement diagram and the arrangement diagram of the support portion 610 and the conductive block 620 are consistent with... Figure 1 or Figure 7 Same. But not limited to this.

[0098] Since the display device provided in the second aspect embodiment of the present invention includes the display panel of any of the embodiments of the first aspect described above, the display device provided in the second aspect embodiment of the present invention has the beneficial effects of the display panel of any of the embodiments of the first aspect described above, which will not be repeated here.

[0099] The display devices in the embodiments of the present invention include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0100] Please see Figure 8 , Figure 8 This is a schematic flowchart illustrating a method for manufacturing a display panel according to a third aspect embodiment of this application. The display panel can be any of the display panels provided in the first aspect embodiment described above.

[0101] like Figure 8 Please refer to the following as well. Figures 1 to 7 The display panel shown is manufactured using a method comprising:

[0102] Step S01: Prepare pins 200 on substrate 100. Pins 200 include a first pin 210 and a second pin 220 located on the periphery of the first pin 210.

[0103] Step S02: A first insulating material layer is prepared on the substrate 100, and the first insulating material layer is patterned to form a planarization layer 300. The planarization layer 300 includes a planar portion 310, which is located between adjacent pins 200.

[0104] The flat portion 310 is located between adjacent pins 200. It can be located between adjacent first pins 210 and second pins 220, or between two adjacent second pins 220 or between two adjacent first pins 210.

[0105] Step S03: A second insulating material layer is prepared on the side of the planarization layer 300 away from the substrate 100, and the second insulating material layer is patterned to form a protective layer 400. The protective layer 400 includes a first protective portion 410 and a second protective portion 420 that are separated from each other. The first protective portion 410 is disposed around the second pin 220, and the second protective portion 420 is disposed around the first pin 210.

[0106] According to a third aspect of this application, a method for manufacturing a display panel includes step S01, which involves fabricating a first pin 210 and a second pin 220 on a substrate 100 for connecting an integrated circuit 600. Step S02 involves fabricating a planarization layer 300, which includes a planar portion 310 located between adjacent pins 200, facilitating the molding of a protective layer 400. Step S03 involves fabricating a protective layer 400, which includes a first protective portion 410 and a second protective portion 420. The substrate 100, the planarization layer 300, and the protective layer 400 are sequentially stacked in the thickness direction. The planarization layer 300 and the protective layer 400 reduce the possibility of water or oxygen entering the substrate 100 and causing corrosion. The first protective portion 410 and the second protective portion 420 are separated from each other, mitigating the problem of peeling from the protective layer 400 to the substrate 100 gradually extending to various locations, leading to screen malfunction. The first protective portion 410 is disposed around the second pin 220, and the second protective portion 420 is disposed around the first pin 210, making it difficult for the protective layer 400 located at the first pin 210 to detach from the substrate 100 and extend to the second pin 220.

[0107] In some optional embodiments, step S03 includes: patterning the protective layer 400 to form a first groove 510, the first groove 510 being used to separate the first protective portion 410 and the second protective portion 420 from each other.

[0108] Optionally, the first groove 510 can be configured in various ways. For example, the first groove 510 can be configured around the first pin 210, extending through the protective layer 400, and separating the first protective part 410 and the second protective part 420.

[0109] There are many ways to set the number of first grooves 510. For example, the first grooves 510 correspond one-to-one with the first pins 210, with one first groove 510 corresponding to one first pin 210, and each first groove 510 is set around each first pin 210; or, the first grooves 510 are set as a whole, and the first grooves 510 are set around the entire first pin 210.

[0110] Optionally, there may be multiple first grooves 510. Multiple first grooves 510 separate the protective layer 400, so that the film layer does not extend and peel off between different parts of the protective layer 400, thereby further improving the problem of film layer peeling off in the bonding area.

[0111] In these alternative embodiments, the protective layer 400 is recessed between the first protective portion 410 and the second protective portion 420 to form a first groove 510, thereby isolating the first protective portion 410 and the second protective portion 420 through the first groove 510, so that no film layer detachment extension occurs between the first protective portion 410 and the second protective portion 420, thereby improving the problem of film layer detachment in the bonding area.

[0112] Optionally, step S03 further includes: patterning the flat portion 310 to form a second groove 520, the second groove 520 being connected to the first groove 510. The connection between the first groove 510 and the second groove 520 avoids potential partial connection between the first protective portion 410 and the second protective portion 420 during the fabrication process due to incomplete patterning, ensuring complete disconnection between the first protective portion 410 and the second protective portion 420. This prevents film detachment extension between the first protective portion 410 and the second protective portion 420, thereby further improving the problem of film detachment in the bonding area.

[0113] In some optional embodiments, the method for fabricating the display panel includes, prior to step S03,: fabricating a third insulating material layer on the side of the planarization layer 300 facing away from the substrate 100, and patterning the third insulating material layer to form isolation pillars 530, the isolation pillars 530 being located on the planarization portion 310.

[0114] Optionally, the isolation pillar 530 can be configured in many ways. For example, the isolation pillar 530 can be disposed around the first pin 210, penetrating the protective layer 400, and separating the first protective part 410 and the second protective part 420; or, the isolation pillar 530 can correspond one-to-one with the first pin 210, with one isolation pillar 530 corresponding to one first pin 210, and each isolation pillar 530 can be disposed around each first pin 210; or, the isolation pillar 530 can be disposed as a single unit, and the isolation pillar 530 can be disposed around the entire first pin 210.

[0115] Optionally, there may be multiple isolation pillars 530. Multiple isolation pillars 530 isolate the protective layer 400, so that the film layer does not extend and peel off between different parts of the protective layer 400, thereby further improving the problem of film layer peeling off in the bonding area.

[0116] Step S03 further includes: preparing a second insulating layer on the side of the isolation pillar 530 and the planarization layer 300 away from the substrate 100, and patterning the insulating material layer to form a protective layer 400, wherein the first protective part 410 and the second protective part 420 are respectively disposed on both sides of the isolation pillar 530.

[0117] In these optional embodiments, the isolation pillar 530 is located on the side of the planar portion 310 facing away from the substrate 100. When the protective layer 400 is fabricated, the portion of the protective layer 400 located on the isolation pillar 530 is deposited on the isolation pillar 530, while the remaining portion is deposited on the planar portion 310 or the substrate 100. This achieves a separation of the protective layer 400 at the location of the isolation pillar 530, forming a first protective portion 410 and a second protective portion 420. Due to the presence of the isolation pillar 530, no film peeling extension occurs between the first protective portion 410 and the second protective portion 420, thereby further improving the problem of film peeling in the bonding area.

[0118] Optionally, the protective layer 400 further includes a third protective portion 430, which is located on the side of the isolation pillar 530 opposite to the flat portion 310. When the protective layer 400 is prepared, the portion of the protective layer 400 located on the isolation pillar 530 is deposited on the isolation pillar 530, and the portion of the protective layer 400 deposited on the isolation pillar 530 forms the third protective portion 430. The third protective portion 430 is located on the isolation pillar 530, such that the first protective portion 410 and the third protective portion 430 are disconnected, and the second protective portion 420 and the third protective portion 430 are disconnected. Since the isolation post 530 is located between the first protective part 410 and the second protective part 420, the orthographic projection of the third protective part 430 on the substrate 100 is located between the orthographic projection of the first protective part 410 on the substrate 100 and the orthographic projection of the second protective part 420 on the substrate 100. This causes the first protective part 410 and the second protective part 420 to be disconnected at the position of the third protective part 430, and no film peeling extension will occur between the first protective part 410 and the second protective part 420, thereby further improving the problem of film peeling in the bonding area.

[0119] During the preparation process, the protective layer 400 is deposited on the isolation pillar 530 and other locations to create a barrier. In order to make the barrier complete, in some optional embodiments, the isolation pillar 530 includes a top surface opposite to the flat portion 310 and a side surface connected to the top surface and extending toward the flat portion 310, with the side surface recessed inward to form a recess 531.

[0120] In these alternative embodiments, the isolation post 530 has an inwardly recessed portion 531 on its side, such that during the preparation process, the third protective portion 430 of the protective layer 400 deposited on the isolation post 530 and the first protective portion 410 or the second protective portion 420 deposited at other locations are completely separated on the side, thereby making the first protective portion 410 and the second protective portion 420 completely separated at the position of the third protective portion 430, and preventing the extension of film peeling between the first protective portion 410 and the second protective portion 420, thereby further improving the problem of film peeling in the bonding area.

[0121] In some optional embodiments, step S01 includes:

[0122] A multilayer metal material layer is prepared on the substrate 100 and patterned to form a multilayer metal layer. The multilayer metal layers together form the pin 200.

[0123] In these alternative embodiments, pin 200 includes multiple metal layers stacked sequentially. The multi-layered structure of pin 200 facilitates its fabrication, and the stacked metal layers enhance its stability and reliability.

[0124] As described above, the substrate 100 includes a first metal layer, a second metal layer, a third metal layer, and a fourth metal layer, wherein the first metal layer and the second metal layer are disposed in the same layer, the second metal layer and the third metal layer are disposed in the same layer, and the third metal layer and the fourth metal layer are disposed in the same layer. In step S01, the first metal layer, the second metal layer, and the third metal layer of the pin 200 can be fabricated simultaneously when the second metal layer, the third metal layer, and the fourth metal layer are fabricated.

[0125] As described above, when the fourth metal layer is disposed on the same layer as the second touch metal layer, in step S01, the fourth metal layer of the pin 200 can also be prepared simultaneously when the second touch metal layer is prepared.

[0126] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate; a pin disposed on the substrate, the pin comprising a first pin and a second pin located on the periphery of the first pin; a flat layer located on the substrate and comprising a flat portion located between adjacent pins; a protective layer located on the side of the flat portion away from the substrate, the protective layer comprising a first protective portion and a second protective portion separated from each other, the second protective portion being disposed around the first pin, and the first protective portion being disposed around the second pin; an isolation portion disposed on the protective layer and located between the first pin and the second pin, the isolation portion being located between the first protective portion and the second protective portion; the isolation portion comprises an isolation column located on the side of the flat portion away from the substrate.

2. The display panel of claim 1, wherein, The protective layer further comprises a third protective portion located on the side of the isolation column away from the flat portion.

3. The display panel of claim 1, wherein, The isolation column comprises a top surface away from the flat portion and a side surface connected to the top surface and extending towards the flat portion, the side surface being recessed inward to form a recessed portion.

4. The display panel of claim 1, wherein, The second pin comprises an input terminal pin and an output terminal pin, the input terminal pin and the output terminal pin being located on both sides of the first pin in a first direction.

5. The display panel of claim 1, wherein, The pin comprises a plurality of metal layer structures disposed in sequence.

6. The display panel of claim 5, wherein, The substrate comprises a plurality of metal layer structures, and at least part of the metal layers of the pin and at least part of the metal layers of the substrate are disposed in the same layer.

7. The display panel of claim 6, wherein, The substrate further comprises a gate metal layer, a plate metal layer, a source-drain electrode metal layer and a pixel electrode layer disposed in sequence, the pin comprises a first layer metal layer, a second layer metal layer, a third layer metal layer and a fourth layer metal layer, and the first layer metal layer is disposed in the same layer as the plate metal layer, the second layer metal layer is disposed in the same layer as the source-drain electrode metal layer, and the third layer metal layer is disposed in the same layer as the pixel electrode layer.

8. The display panel of claim 7, wherein, The display panel further comprises a touch layer, the touch layer comprising a first touch metal layer and a second touch metal layer located on the side of the first touch metal layer away from the substrate, and the fourth layer metal layer is disposed in the same layer as the second touch metal layer.

9. A display device, characterized by comprising: The display panel comprises: The display panel of any one of claims 1-8.

10. The display device of claim 9, further comprising: an integrated circuit, at least part of the integrated circuit being located on the side of the protective layer away from the substrate, the integrated circuit comprising a support portion and a conductive block, at least part of the support portion being connected to the first pin, and at least part of the conductive block being connected to the second pin; an adhesive layer located between the display panel and the integrated circuit, for bonding the display panel and the integrated circuit.

11. The display device according to claim 10, wherein The conductive block comprises a first conductive block and a second conductive block, the first conductive block and the second conductive block being located on both sides of the support portion in a first direction, the first conductive block being connected to the input terminal pin, and the second conductive block being connected to the output terminal pin.

12. A method for manufacturing a display panel, characterized by, The display panel comprises: preparing a pin on a substrate, the pin comprising a first pin and a second pin located on the periphery of the first pin; forming a first insulating material layer on the substrate, and performing a patterning process on the first insulating material layer to form a flat layer, the flat layer comprising a flat portion between the pins; forming a second insulating material layer on the side of the flat layer away from the substrate, and performing a patterning process on the second insulating material layer to form a protection layer, the protection layer comprising a first protection portion and a second protection portion separated from each other, the first protection portion surrounding the second pin, and the second protection portion surrounding the first pin; before forming the second insulating layer on the side of the flat layer away from the substrate and performing a patterning process on the insulating material layer to form the protection layer, the method further comprises: forming a third insulating material layer on the side of the flat layer away from the substrate, and performing a patterning process on the third insulating material layer to form an isolation column on the flat portion; before forming the second insulating layer on the side of the flat layer away from the substrate and performing a patterning process on the insulating material layer to form the protection layer, the method further comprises: forming a second insulating layer on the side of the isolation column and the flat layer away from the substrate, and performing a patterning process on the insulating material layer to form the protection layer, the first protection portion and the second protection portion being arranged on both sides of the isolation column.

13. The method of claim 12, wherein, The protection layer further comprises a third protection portion on the side of the isolation column away from the flat portion.

14. The method of claim 12, wherein, In the step of forming pins on a substrate, the pins comprising a first pin and a second pin arranged on the side of the first pin, the method comprises: forming a plurality of metal material layers on the substrate, and performing a patterning process to form a plurality of metal layers, the plurality of metal layers collectively forming the pins.

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