Display panel, preparation method thereof, and display device

Abstract

An embodiment of the present invention provides a display panel, a manufacturing method thereof, and a display device. The display panel includes a substrate and a display layer located on one side of the substrate; the display layer includes: a plurality of patterned first electrodes; a pixel defining layer located on the side of the first electrode away from the substrate, the pixel defining layer includes openings and defining portions, the defining portions are located between adjacent openings, and the openings expose the first electrodes; an isolation column located on the side of the defining portion away from the substrate, and the material of the isolation column includes an inorganic material; an organic functional layer located on the side of the pixel defining layer and the isolation column away from the substrate, the organic functional layer includes a first part and a second part connected to each other, the first part is deposited in the opening and located on the side of the first electrode away from the substrate, and the second part surrounds the first part; wherein, a part of the second part is disconnected at the edge of the isolation column. The present invention can prevent lateral leakage in the organic functional layer, improve the problem of light stealing of the light-emitting device, and enhance the display effect.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and in particular, to a display panel, a preparation method thereof, and a display device. Background Art

[0002] In the organic self-luminous display technology, a display panel includes an organic functional layer. The organic functional layer is not made by using a fine metal mask plate, but by using an open mask plate so that the organic functional layer is formed in the entire display area. As a common layer of light-emitting devices in the display area, the areas corresponding to adjacent light-emitting devices in the organic functional layer are interconnected. When the light-emitting devices emit light, the organic functional layer with high conductivity may have leakage current to the organic functional layer corresponding to the adjacent light-emitting device. This leakage current is called lateral leakage current, and the lateral leakage current will cause adjacent light-emitting devices to steal light and affect the display effect. Summary of the Invention

[0003] Embodiments of the present invention provide a display panel, a preparation method thereof, and a display device to solve the problem that the lateral leakage current causes adjacent light-emitting devices to steal light in the prior art.

[0004] In a first aspect, an embodiment of the present invention provides a display panel, which includes a substrate and a display layer located on one side of the substrate; the display layer includes:

[0005] a plurality of patterned first electrodes;

[0006] a pixel defining layer located on the side of the first electrode away from the substrate, the pixel defining layer includes openings and defining parts, the defining parts are located between adjacent openings, and the openings expose the first electrodes;

[0007] an isolation column located on the side of the defining part away from the substrate, and the material of the isolation column includes an inorganic material;

[0008] an organic functional layer located on the side of the pixel defining layer and the isolation column away from the substrate, the organic functional layer includes a first part and a second part that are interconnected, the first part is deposited in the opening and located on the side of the first electrode away from the substrate, and the second part surrounds the first part; wherein, part of the second part is disconnected at the edge of the isolation column.

[0009] In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides a display device, which includes the display panel provided in any embodiment of the present invention.

[0010] In a third aspect, based on the same inventive concept, an embodiment of the present invention further provides a preparation method of a display panel, the display panel includes a substrate and a display layer located on one side of the substrate; the display layer includes:

[0011] a plurality of patterned first electrodes;

[0012] A pixel defining layer located on the side of the first electrode away from the substrate, the pixel defining layer includes an opening and a defining portion, the defining portion is located between adjacent openings, and the opening exposes the first electrode;

[0013] An isolation column located on the side of the defining portion away from the substrate, and the material of the isolation column includes an inorganic material;

[0014] An organic functional layer located on the side of the pixel defining layer and the isolation column away from the substrate, the organic functional layer includes a first part and a second part connected to each other, the first part is deposited in the opening and located on the side of the first electrode away from the substrate, and the second part surrounds the first part; wherein, a part of the second part is disconnected at the edge of the isolation column; The preparation method includes:

[0015] Manufacture the isolation column after the process of the pixel defining layer, wherein, it includes:

[0016] Manufacture a patterned peelable adhesive layer, the patterned peelable adhesive layer has a first opening, in a direction perpendicular to the plane of the substrate, the first opening overlaps with the defining portion; at least one side wall of the first opening forms an obtuse angle with the plane parallel to the substrate and facing into the first opening;

[0017] Use a low-temperature chemical vapor deposition process to manufacture an inorganic layer, the inorganic layer fills the first opening and covers the patterned peelable adhesive layer on the side away from the pixel defining layer;

[0018] Perform patterning on the inorganic layer, and at least retain the inorganic layer located in the first opening to form an isolation column;

[0019] Peel off the patterned peelable adhesive layer.

[0020] The display panel, its preparation method and display device provided by the embodiments of the present invention have the following beneficial effects: An isolation column is provided on the side of the defining portion away from the substrate, and the organic functional layer between adjacent light-emitting devices is locally partitioned by the isolation column, thereby preventing lateral leakage in the organic functional layer, improving the problem of light stealing of the light-emitting device, and enhancing the display effect. In addition, the material of the isolation column includes an inorganic material, and a conventional patterning process can be used to manufacture the isolation column, without the need to develop new materials to manufacture the isolation column, and the isolation column made of inorganic materials has high reliability, has no special requirements for equipment during manufacturing, and the process is relatively simple. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those skilled in the art, without creative efforts, other drawings can also be obtained according to these drawings.

[0022] Figure 1 Schematic diagram of a display panel provided by an embodiment of the present invention;

[0023] Figure 2 Another partial schematic diagram of a display panel provided by an embodiment of the present invention;

[0024] Figure 3 Is Figure 1 An enlarged view at the position of area Q1 in

[0025] Figure 4 Another schematic diagram of a display panel provided by an embodiment of the present invention;

[0026] Figure 5 Another schematic diagram of a display panel provided by an embodiment of the present invention;

[0027] Figure 6 Another schematic diagram of a display panel provided by an embodiment of the present invention;

[0028] Figure 7 Another schematic diagram of a display panel provided by an embodiment of the present invention;

[0029] Figure 8 Is Figure 7 A cross-sectional schematic diagram at the position of the tangent line A-A' in

[0030] Figure 9 Schematic diagram of a display device provided by an embodiment of the present invention;

[0031] Figure 10 Flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0032] Figure 11 Another flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0033] Figure 12 Another flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0034] Figure 13 Another flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0035] Figure 14 Another flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0036] Figure 15 Another flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention. Detailed implementation manners

[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0038] The terms used in the embodiments of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The singular forms "a", "said", and "the" used in the embodiments of the present invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0039] To solve the problems existing in the prior art, an embodiment of the present invention provides a display panel. In the display panel, isolation columns including inorganic materials are provided, and the organic functional layer is locally partitioned by the isolation columns between adjacent light-emitting devices, thereby preventing lateral leakage in the organic functional layer and improving the problem of light stealing of the light-emitting devices.

[0040] Figure 1 A schematic diagram of a display panel provided by an embodiment of the present invention is as Figure 1 shown. The display panel includes a substrate 10 and a display layer 20 on one side of the substrate 10. The display layer 20 includes:

[0041] A plurality of patterned first electrodes 21; a pixel defining layer 22 on the side of the first electrode 21 away from the substrate 10. The pixel defining layer 22 includes an opening K and a defining portion 221. The defining portion 221 is located between adjacent openings K. The defining portion 221 and the opening K share a sidewall, and the opening K exposes the first electrode 21. Among them, the material of the pixel defining layer 22 includes an organic material.

[0042] Isolation columns 30 on the side of the defining portion 221 away from the substrate 10. The material of the isolation columns 30 includes an inorganic material. The materials of the isolation columns 30 and the pixel defining layer 22 are different, and the two need to be fabricated in different process processes.

[0043] An organic functional layer 23 on the side of the pixel defining layer 22 and the isolation columns 30 away from the substrate 10. During fabrication, the organic functional layer 23 is fabricated using an open mask plate, and the openings of the mask plate correspond to the entire display area. Among them, the organic functional layer 23 includes a first organic functional layer 23-1 and a second organic functional layer 23-2.

[0044] The display layer 20 further includes a light-emitting material layer 24 and a second electrode 25. The first organic functional layer 23-1 is located on the side of the light-emitting material layer 24 close to the first electrode 21, the second organic functional layer 23-2 is located on the side of the light-emitting material layer 24 away from the first electrode 21, and the second electrode 25 is located on the side of the second organic functional layer 23-2 away from the light-emitting material layer 24. The first electrode 21, the first organic functional layer 23-1, the light-emitting material layer 24, the second organic functional layer 23-2, and the second electrode 25 stacked in the display layer 20 along a plane e perpendicular to the substrate 10 form a light-emitting device P. A sub-pixel in the display panel includes one light-emitting device P. The second electrode 25 is a common electrode, and the second electrodes 25 at corresponding positions of multiple light-emitting devices P are electrically connected to each other. In some embodiments, as Figure 1 shown, the second electrode 25 is a continuous structure at the edge position of the isolation column 30. In other words, the isolation column 30 does not cut off the second electrode 25. Such a setting can ensure that the resistance of the common electrode formed by the second electrode 25 is relatively low, which is beneficial to reducing the voltage drop and ensuring the voltage uniformity in the entire display area.

[0045] In some embodiments, according to the different light-emitting material layers 24 in the light-emitting device P, the light-emitting device P includes a red light-emitting device, a blue light-emitting device, and a green light-emitting device. During manufacturing, the light-emitting material layer 24 is fabricated using a fine metal mask plate. The light-emitting material layers 24 of the same color light-emitting devices are fabricated in the same evaporation process. Among them, the light-emitting material layer 24 is deposited in the opening K and partially extends outside the opening K.

[0046] Among them, the first electrode 21 is a reflective electrode, the second electrode 25 is a transmissive electrode, and the second electrodes 25 of multiple light-emitting devices P are connected to each other to form a whole-layer electrode structure. In one embodiment, the first electrode 21 is an anode, the second electrode 25 is a cathode, the first organic functional layer 23-1 includes at least one of a hole injection layer and a hole transport layer, and the second organic functional layer 23-2 includes at least one of an electron injection layer and an electron transport layer.

[0047] As Figure 1 shown, both the first organic functional layer 23-1 and the second organic functional layer 23-2 respectively include a first part 23a and a second part 23b connected to each other. The first part 23a is deposited in the opening K and is located on the side of the first electrode 21 away from the substrate 10, and the second part 23b surrounds the first part 23a; among them, part of the second part 23b is disconnected at the edge of the isolation column 30. Figure 1It is only a schematic cross-sectional view of the display panel. It can be understood that the organic functional layer 23 is fabricated using an open mask plate, and the organic functional layer 23 is a common layer for the light-emitting device P. The first part 23a is the organic functional layer 23 in the light-emitting device P, and the second part 23b is the organic functional layer 23 between adjacent light-emitting devices P. That is, the organic functional layer 23 between adjacent light-emitting devices P is locally partitioned by the spacer column 30.

[0048] Taking the first organic functional layer 23-1 as an example, the first part 23a deposited in the opening K and the second part 23b surrounding the first part 23a are in contact and connected to each other. However, due to the presence of the spacer column 30, part of the second part 23b is discontinuous at the edge position of the spacer column 30, that is, the spacer column 30 locally partitions the organic functional layer 23 between adjacent light-emitting devices P. Although part of the second part 23b is discontinuous at the edge position of the spacer column 30, from the overall view of the display area, the second part 23b is still electrically connected, and the first part 23a and the second part 23b still form an electrically connected common layer.

[0049] In addition, the display panel further includes an array layer and a packaging layer. The array layer is located between the display layer 20 and the substrate 10, and the array layer includes a plurality of pixel circuits for driving the light-emitting device P to emit light. The packaging layer is located on the side of the display layer 20 away from the substrate 10, and the packaging layer is used to isolate water and oxygen to ensure the service life of the light-emitting device P.

[0050] In the display panel provided by the embodiment of the present invention, the spacer column 30 is disposed on the side of the defining portion 221 away from the substrate 10, and the organic functional layer 23 between adjacent light-emitting devices P is locally partitioned by the spacer column 30, thereby preventing the lateral leakage current in the organic functional layer 23, improving the problem of light stealing of the light-emitting device P, and enhancing the display effect. In addition, the material of the spacer column 30 includes an inorganic material, and the spacer column 30 can be fabricated using a conventional patterning process without developing a new material for fabricating the spacer column 30. Moreover, the spacer column 30 fabricated from the inorganic material has high reliability and has no special requirements for the equipment during fabrication, and the process is relatively simple.

[0051] Figure 1 It is shown that there are two spacer columns 30 disposed between adjacent light-emitting devices P. In some embodiments, there is one spacer column 30 disposed between adjacent light-emitting devices P. In other embodiments, there are three spacer columns 30 disposed between adjacent light-emitting devices P. The number of spacer columns 30 disposed between adjacent light-emitting devices P can be reasonably set according to specific requirements and factors such as the available space between adjacent light-emitting devices P.

[0052] In some embodiments, Figure 2 It is a partial schematic view of another display panel provided by the embodiment of the present invention. Figure 2It is a top view schematic diagram. Figure 2 It shows that the light-emitting device P includes a first-color light-emitting device P1, a second-color light-emitting device P2, and a third-color light-emitting device P3. The first-color light-emitting device P1, the second-color light-emitting device P2, and the third-color light-emitting device P3 are respectively one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device. Figure 2 The top view in it shows that an isolation column 30 is arranged along the circumference of the light-emitting device P to form a non-closed figure. Among them, at least part of the structure of the light-emitting device P is deposited in the opening K, that is, one opening K corresponds to one light-emitting device P. Therefore, in the embodiments of the present invention, it is equivalent to that the isolation column 30 is arranged along the direction around the opening K to form a non-closed figure. Figure 2 The arrow in it indicates that the position of the opening area of the isolation column 30 of the non-closed figure. In the opening area, the second part of the organic functional layer 23 is not blocked to ensure that the organic functional layer 23 is electrically connected to each other as a whole.

[0053] In some embodiments, as Figure 2 shown, the opening areas of the isolation columns 30 corresponding to adjacent light-emitting devices P are not adjacent. Such a setting can effectively prevent the lateral leakage current in the organic functional layer 23 and improve the problem of uneven brightness of the light-emitting device P.

[0054] It should be noted that Figure 2 the top view shape of the isolation column 30 in it is only for schematic representation and is not a limitation to the present invention. In addition, Figure 2 the arrangement manner of the light-emitting device P in it is also only for schematic representation. The embodiments of the present invention can be applied to any arrangement manner of the light-emitting device P. When applying, the isolation column 30 can be arranged in the circumferential direction around the light-emitting device P according to the position of the light-emitting device P.

[0055] In some embodiment modes, Figure 3 It is Figure 1 the enlarged view of the position of the area Q1 in it. As Figure 3 shown, the isolation column 30 includes a bottom surface M1 and at least one first side surface M2. The bottom surface M1 is the surface of the isolation column 30 close to the limiting part 221. The first side surface M2 is connected to the bottom surface M1. The included angle θ formed by the first side surface M2 and the plane parallel to the plane where the substrate 10 is located and facing the inside of the isolation column 30 is an obtuse angle. From Figure 3 it can be seen that the included angle θ formed between the bottom surface M1 and the first side surface M2 is an inverted cut angle. When manufacturing, the organic functional layer 23 is made by evaporation coating process. Due to the setting of the inverted cut angle, the evaporated organic film layer will not be deposited on the first side surface M2, so that the organic functional layer 23 can be blocked at the edge position of the isolation column 30, realizing the local block of the second part 23b in the organic functional layer 23.

[0056] Figure 3In the first side surface M2 is shown as a plane. In the actual product, since the isolation column 30 is fabricated by an etching process, the side surface of the isolation column 30 is approximately a plane, but actually may have a certain curvature.

[0057] As Figure 3 shown, the isolation column 30 has a groove C, and the groove C is recessed from the side of the isolation column 30 away from the defining portion 221 toward the inside of the isolation column 30; the isolation column 30 includes a first sub-portion 31 and a second sub-portion 32, and the first sub-portion 31 is located on the side of the second sub-portion 32 close to the defining portion 221; the second sub-portion 32 surrounds the groove C, and the second sub-portion 32 shares a side wall with the groove C; wherein, at least one side wall of the first sub-portion 31 is the first side surface M2. The bottom of the groove C exposes the first sub-portion 31. The organic functional layer 23 is deposited in the groove C and extends to the side of the second sub-portion 32 away from the substrate 10. Since the first sub-portion 31 has the first side surface M2, the organic functional layer 23 fabricated by the evaporation process can be blocked at the edge positions of the first sub-portion 31 and the second sub-portion 32.

[0058] In the embodiment of the present invention, as Figure 3 shown, the first sub-portion 31 and the second sub-portion 32 are integrally connected to form a single structure. That is to say, the first sub-portion 31 and the second sub-portion 32 are formed simultaneously when the isolation column 30 is fabricated.

[0059] In some embodiments, as Figure 3 shown, the edge of the second sub-portion 32 on the side away from the groove C extends out of the edge of the first sub-portion 31 to form a step. Such a setting ensures that in the process of evaporating the organic functional layer 23, no film layer is deposited on the first side surface M2 and on the surface M3 of the second sub-portion 32 on the side close to the substrate 10, so that the organic functional layer 23 is disconnected at the step position formed by the second sub-portion 32 and the first sub-portion 31, realizing local blocking of the organic functional layer 23 to prevent the organic functional layer 23 from stealing light due to lateral leakage.

[0060] In some embodiments, as Figure 3 shown, the distance by which the edge of the second sub-portion 32 on the side away from the groove C extends out of the edge of the first sub-portion 31 is d, and d is not greater than 0.5 μm. Optionally, d is approximately 0.1 μm. In the embodiment of the present invention, setting d not to be too large ensures the structural stability of the isolation column 30 and avoids the part of the second sub-portion 32 extending out of the first sub-portion 31 from breaking, which affects the performance of blocking the organic functional layer 23.

[0061] In some other embodiments, Figure 4 is a schematic diagram of another display panel provided by the embodiment of the present invention. As Figure 4As shown, the edge of the second sub - part 32 on the side away from the groove C is flush with the edge of the first sub - part 31. Since the first sub - part 31 is on the side of the second sub - part 32 close to the substrate 10, and the included angle θ between the first side surface M2 of the first sub - part 31 and the plane parallel to the plane where the substrate 10 is located and facing the inside of the isolation column 30 is an obtuse angle, in the process of vapor - depositing the organic functional layer 23, no film layer will be deposited on the first side surface M2. Thus, the organic functional layer 23 is disconnected at the edge positions of the second sub - part 32 and the first sub - part 31, realizing the partial partition of the organic functional layer 23 to prevent the lateral leakage current in the organic functional layer 23 from causing the light - emitting device to have a stolen light phenomenon.

[0062] In some other embodiments, Figure 5 is another schematic diagram of the display panel provided by the embodiment of the present invention. As Figure 5 shown, the isolation column 30 includes a top surface M4. The top surface M4 is the surface of the isolation column 30 on the side away from the defining part 221. The top surface M4 is a plane, and the area of the top surface M4 is larger than the area of the bottom surface M1. In this embodiment, the top surface M4 is substantially parallel to the bottom surface M1, and the included angle θ formed between the bottom surface M1 and the first side surface M2 is an inverted chamfer angle. Due to the setting of the inverted chamfer angle, the vapor - deposited organic film layer will not be deposited and formed on the first side surface M2. Thus, the organic functional layer 23 can be partitioned at the edge position of the isolation column 30, realizing the partial partition of the second branch 23b in the organic functional layer 23.

[0063] In some other embodiments, Figure 6 is another schematic diagram of the display panel provided by the embodiment of the present invention. Figure 6 only shows the structure at the position where the isolation column 30 is located. As Figure 6 shown, a separation layer 40 is covered on the surface of the first side surface M2. During the production of the display panel, the separation layer 40 is used to assist the mutual peeling between the peelable adhesive layer and the first side surface M2, so as to facilitate the formation of the special - structured isolation column 30 in the embodiment of the present invention. The function of the separation layer 40 will be described in the following embodiments of the preparation method.

[0064] In another embodiment, Figure 7 is another schematic diagram of the display panel provided by the embodiment of the present invention. Figure 8 is Figure 7 a cross - sectional schematic diagram at the position of the tangent line A - A' in Figure 7 shown, the display panel further includes a support column 50. The support column 50 is located on the side of the pixel defining layer 22 away from the substrate 10. As Figure 8As shown, the included angle α formed by the side surface of the support pillar 50 and the direction parallel to the plane where the substrate 10 is located and facing the inside of the support pillar 50 is an acute angle, and the second part 23b of the organic functional layer 23 is deposited on the side surface of the support pillar 50 to form a continuous structure. The support pillar 50 is used to support a fine mask plate in the process of vapor-depositing a light-emitting material layer, so as to improve the vapor-deposition yield. Among them, in the direction e perpendicular to the plane where the substrate 10 is located, the height of the support pillar 50 is greater than the height of the isolation pillar 30.

[0065] In some embodiments, the material of the support pillar 50 is the same as that of the pixel defining layer 22.

[0066] In some embodiments, the support pillar 50 and the pixel defining layer 22 are an integral structure, that is, the support pillar 50 and the pixel defining layer 22 can be simultaneously fabricated in the same manufacturing process.

[0067] Figure 7 The setting of the support pillar 50 in the figure is only for illustrative purposes, and the present invention does not limit the setting density, size, etc. of the support pillar 50.

[0068] Based on the same inventive concept, an embodiment of the present invention further provides a display device. Figure 9 Schematic diagram of the display device provided by the embodiment of the present invention. As Figure 9 shown, the display device includes the display panel 100 provided by any embodiment of the present invention. The structure of the display panel 100 has been described in the above embodiments and will not be repeated here. The display device provided by the embodiment of the present invention is, for example, any display device such as a mobile phone, a tablet computer, a notebook computer, a television, etc.

[0069] Based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing a display panel, which can be used to manufacture the display panel provided by the embodiment of the present invention. When understanding the present invention, the embodiments of the display panel and the embodiments of the manufacturing method can be understood with reference to each other.

[0070] Figure 10 Flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention. As Figure 10 shown, the manufacturing method includes:

[0071] Step S101: Provide a substrate 10, fabricate a plurality of patterned first electrodes 21 on one side of the substrate 10, and fabricate a pixel defining layer 22 after the process of the first electrode 21. The pixel defining layer 22 includes an opening K and a defining portion 221. The defining portion 221 is located between adjacent openings K, and the opening K exposes the first electrode 21.

[0072] Fabricate an isolation pillar 30 after the process of the pixel defining layer 22, wherein it includes:

[0073] Step S102: Fabricate a patterned peelable adhesive layer 01. The patterned peelable adhesive layer 01 has a first opening K1. In the direction e perpendicular to the plane of the substrate 10, the first opening K1 overlaps with the defining portion; at least one side wall of the first opening K1 forms an obtuse angle θ' with the plane parallel to the plane of the substrate 10 and facing the inside of the first opening K1. In an embodiment of the present invention, the peelable adhesive layer 01 is a positive photoresist, so the angle θ' of the first opening K1 formed after exposure and development of the peelable adhesive layer 01 is an obtuse angle.

[0074] Step S103: Fabricate an inorganic layer 02 using a low-temperature chemical vapor deposition process. The inorganic layer 02 fills the first opening K1 and covers the patterned peelable adhesive layer 01 on the side away from the pixel defining layer 22. In some embodiments, the process temperature is T, and T ≤ 90°. In other embodiments, T is approximately 60°. In this step, the inorganic layer 02 is fabricated using a low-temperature chemical vapor deposition process, avoiding a high-temperature preparation environment, and preventing the already fabricated patterned peelable adhesive layer 01 from curing in a high-temperature environment and being unable to be peeled off in subsequent steps.

[0075] Step S104: Pattern the inorganic layer 02, and at least retain the inorganic layer located within the first opening K1 to form an isolation pillar 30. That is to say, at least part of the structure of the isolation pillar 30 is formed within the first opening K1 of the patterned peelable adhesive layer 01. Then, the inorganic layer 02 in contact with the bottom of the first opening K1 forms the bottom surface M1 of the isolation pillar 30, and the inorganic layer 02 in contact with the side surface of the first opening K1 forms the first side surface M2 of the isolation pillar 30. The bottom surface M1 and the first side surface M2 are connected, and the first side surface M2 forms an angle θ with the plane parallel to the plane of the substrate 10 and facing the inside of the isolation pillar 30, which is equal to the angle θ', that is, the angle θ is an obtuse angle. That is, the angle θ formed between the bottom surface M1 and the first side surface M2 of the isolation pillar 30 is an inverted chamfer.

[0076] Step S105: Peel off the patterned peelable adhesive layer 01.

[0077] Step S106: Fabricate an organic functional layer 23. The organic functional layer 23 includes a first part 23a and a second part 23b that are connected to each other. The first part 23a is deposited within the opening K and on the side of the first electrode 21 away from the substrate 10, and the second part 23b surrounds the first part 23a; wherein, part of the first part 23a is disconnected at the edge of the isolation pillar 30. Due to the inverted chamfer structure of the isolation pillar 30, the evaporated organic functional layer 23 will not deposit and form a film on the first side surface M2. Thus, the organic functional layer 23 can be separated at the edge position of the isolation pillar 30, realizing the local separation of the second part 23b in the organic functional layer 23.

[0078] Using the preparation method provided by the embodiments of the present invention, first, a patterned peelable adhesive layer 01 is fabricated, and then an isolation pillar 30 including an inorganic material is fabricated. By using the first opening K1 of the patterned peelable adhesive layer 01, an isolation pillar 30 with an inverted chamfer can be formed. The inorganic layer 02 forming the isolation pillar 30 is fabricated by a low-temperature chemical vapor deposition process, which can avoid the high-temperature curing of the patterned peelable adhesive layer 01. Thus, after the isolation pillar 30 is fabricated, the patterned peelable adhesive layer 01 can be removed. After removing the patterned peelable adhesive layer 01, the organic functional layer 23 is locally partitioned by the isolation pillar 30 with an inverted chamfer. The embodiments of the present invention do not require the development of new materials to fabricate the isolation pillar 30, and the isolation pillar 30 fabricated from an inorganic material has high reliability, has no special requirements for equipment during fabrication, and the process is relatively simple.

[0079] In some embodiments, step S102 of fabricating the patterned peelable adhesive layer includes: fabricating the patterned peelable adhesive layer 01 using a first positive photoresist. Then, the included angle θ' of the first opening K1 formed after exposure and development of the patterned peelable adhesive layer 01 is an obtuse angle.

[0080] In some embodiments, Figure 11 is a flowchart of another method for fabricating a display panel provided by the embodiments of the present invention. As Figure 11 shown, fabricating the patterned peelable adhesive layer using a first positive photoresist includes:

[0081] Step S1021: Coating a first positive photoresist 010 on the pixel defining layer 22;

[0082] Step S1022: Performing an exposure process on the first positive photoresist 010 using a first mask 03. Among them, the first mask 03 has a second opening K2, and in the direction e perpendicular to the plane of the substrate 10, the second opening K2 overlaps with the defining portion 221.

[0083] Step S1023: Removing the first positive photoresist 010 at the exposed positions with a developer, and the first positive photoresist 010 at the unexposed positions forms the patterned peelable adhesive layer 01. After removing the first positive photoresist 010 at the exposed positions, the formed patterned peelable adhesive layer 01 has a first opening K1, and at least one sidewall of the first opening K1 forms an obtuse angle θ' with the plane parallel to the plane of the substrate 10 and facing inward of the first opening K1.

[0084] In some embodiments, Figure 12 is a flowchart of another method for fabricating a display panel provided by the embodiments of the present invention. As Figure 12 shown, step S104 of patterning the inorganic layer includes:

[0085] Step S1041: Coat a second photoresist 04 on the side of the inorganic layer 02 away from the patterned peelable adhesive layer 01;

[0086] Step S1042: Pattern the second photoresist 04 to form a patterned second photoresist layer 041, and the patterned second photoresist layer 041 covers at least the inorganic layer 02 located within the first opening K1;

[0087] Step S1043: Etch away the inorganic layer 02 not covered by the unpatterned second photoresist layer 041, and the unetched inorganic layer 02 forms the isolation pillar 30.

[0088] In some embodiments, the material of the second photoresist layer 041 is different from that of the patterned peelable adhesive layer 01, and the two need to be peeled off separately. Figure 13 It is a flowchart of another method for manufacturing a display panel provided by an embodiment of the present invention. As Figure 13 shown, the manufacturing method further includes:

[0089] After step S1043, step S1044 is performed: Peel off the patterned second photoresist layer 041 using a first stripping solution.

[0090] After step S1044, step S105 is performed: Peel off the patterned peelable adhesive layer 01 using a second stripping solution. Among them, at least one component of the first stripping solution and the second stripping solution is different.

[0091] For the manufacturing method provided by the embodiment of the present invention, when the material of the second photoresist layer 041 is different from that of the patterned peelable adhesive layer 01, before peeling off the patterned peelable adhesive layer 01, the patterned second photoresist layer 041 is peeled off. This avoids the adverse effect of the stripping solution used to peel off the patterned second photoresist layer 041 on the chamfered shape of the isolation pillar 30.

[0092] In some embodiments, the material of the second photoresist layer 041 is the same as that of the patterned peelable adhesive layer 01. Figure 14 It is a flowchart of another method for manufacturing a display panel provided by an embodiment of the present invention. As Figure 14 shown,

[0093] After step S1043, step S1045 is performed,

[0094] Step S1045 includes: Peel off the patterned peelable adhesive layer 01 using a stripping solution, and at the same time peel off the patterned second photoresist layer 041.

[0095] When the second photoresist layer 041 and the patterned peelable adhesive layer 01 are made of the same material, the second photoresist layer 041 and the patterned peelable adhesive layer 01 can be removed simultaneously in a single stripping process, which can simplify the process and improve the yield.

[0096] In some embodiments, Figure 15 is a flowchart of another method for manufacturing a display panel provided by an embodiment of the present invention. As Figure 15 shown, the manufacturing method further includes:

[0097] After step S102, step S106 is performed. Step S106 includes: forming a spacer layer 40 at least on the sidewalls of the first opening K1. Then, after step S106, step S103 is performed.

[0098] In this embodiment, the spacer layer 40 is formed before the inorganic layer 02 is formed. The spacer layer 40 prevents the inorganic layer 02 formed in the first opening K1 from contacting the side surface of the patterned peelable adhesive layer 01, facilitating the subsequent peeling of the patterned peelable adhesive layer 01, so that the finally formed isolation column 30 has a complete chamfered shape.

[0099] In some embodiments, Figure 15 after step S103 in the embodiment, step S104 in the above Figure 10 embodiment is performed. When the patterned peelable adhesive layer 01 is peeled in the above step S105, a stripping solution is used to peel the patterned peelable adhesive layer 01, and at the same time, the spacer layer 40 is peeled. In this embodiment, the spacer layer 40 can be removed together with the patterned peelable adhesive layer 01, and the finally manufactured display panel does not include the spacer layer 40.

[0100] In other embodiments, the material of the spacer layer 40 has significantly different physical and chemical properties from the material of the patterned peelable adhesive layer 01, and the spacer layer 40 cannot be peeled off together with the patterned peelable adhesive layer 01. Therefore, the finally manufactured display panel retains the spacer layer 40, as shown in the above Figure 6 embodiment.

[0101] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the scope of protection of the present invention.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel, characterized in that, The display panel includes a substrate and a display layer located on one side of the substrate; the display layer includes: A plurality of patterned first electrodes; A pixel defining layer located on the side of the first electrode away from the substrate, the pixel defining layer includes an opening and a defining portion, the defining portion is located between adjacent openings, and the opening exposes the first electrode; An isolation column located on the side of the defining portion away from the substrate, and the material of the isolation column includes an inorganic material; An organic functional layer located on the side of the pixel defining layer and the isolation column away from the substrate, the organic functional layer includes a first part and a second part connected to each other, the first part is deposited in the opening and located on the side of the first electrode away from the substrate, and the second part surrounds the first part; wherein, a part of the second part is disconnected at the edge of the isolation column; The isolation column is arranged in a non-closed pattern along the direction surrounding the opening, the non-closed pattern has an opening area, and the opening areas corresponding to adjacent non-closed patterns are not adjacent.

2. The display panel according to claim 1, wherein The isolation column includes a bottom surface and at least one first side surface, the bottom surface is the surface of the isolation column close to the defining portion, the first side surface is connected to the bottom surface, and the included angle between the first side surface and the plane parallel to the plane where the substrate is located and facing the inside of the isolation column is an obtuse angle.

3. The display panel according to claim 2, wherein The isolation column has a groove, and the groove is recessed from the side of the isolation column away from the defining portion towards the inside of the isolation column; The isolation column includes a first sub-part and a second sub-part, the first sub-part is located on the side of the second sub-part close to the defining portion; the second sub-part surrounds the groove and the second sub-part shares a side wall with the groove; wherein, at least one side wall of the first sub-part is the first side surface.

4. The display panel according to claim 3, wherein The first sub-part and the second sub-part are connected as an integral structure.

5. The display panel according to claim 3, wherein The edge of the second sub-part away from the groove extends out of the edge of the first sub-part to form a step.

6. The display panel according to claim 3, wherein The edge of the second sub-part away from the groove is flush with the edge of the first sub-part.

7. The display panel according to claim 2, wherein The isolation column includes a top surface, the top surface is the surface of the isolation column away from the defining portion, the top surface is a plane, and the area of the top surface is larger than the area of the bottom surface.

8. The display panel according to claim 3, wherein A separation layer is covered on the surface of the first side surface, and the separation layer is used to assist in film peeling.

9. The display panel according to claim 1, wherein The material of the pixel defining layer includes an organic material.

10. A display device, characterized in that, A display panel including any one of claims 1 to 9.

11. A method for preparing a display panel, characterized in that, The display panel includes a substrate and a display layer located on one side of the substrate; the display layer includes: A plurality of patterned first electrodes; A pixel defining layer located on the side of the first electrode away from the substrate. The pixel defining layer includes openings and defining portions. The defining portions are located between adjacent openings, and the openings expose the first electrodes; Isolation pillars located on the side of the defining portion away from the substrate. The material of the isolation pillars includes inorganic materials; An organic functional layer located on the side of the pixel defining layer and the isolation pillars away from the substrate. The organic functional layer includes a first part and a second part connected to each other. The first part is deposited in the opening and located on the side of the first electrode away from the substrate, and the second part surrounds the first part; wherein, a part of the second part is disconnected at the edge of the isolation pillar; the isolation pillars are arranged in a direction surrounding the opening to form a non-closed figure, the non-closed figure has an opening area, and the opening areas corresponding to adjacent non-closed figures are not adjacent; The manufacturing method includes: Manufacturing the isolation pillars after the process of the pixel defining layer, wherein, it includes: Manufacturing a patterned peelable adhesive layer. The patterned peelable adhesive layer has a first opening. In a direction perpendicular to the plane of the substrate, the first opening overlaps with the defining portion; at least one side wall of the first opening forms an obtuse angle with the plane parallel to the substrate plane and facing into the first opening; Manufacturing an inorganic layer by a low-temperature chemical vapor deposition process. The inorganic layer fills the first opening and covers the patterned peelable adhesive layer on the side away from the pixel defining layer; Performing a patterning process on the inorganic layer, and at least retaining the inorganic layer located in the first opening to form the isolation pillars; Peeling off the patterned peelable adhesive layer.

12. According to the manufacturing method described in claim 11, characterized in that, Manufacturing the patterned peelable adhesive layer includes: manufacturing the patterned peelable adhesive layer using a first positive photoresist.

13. According to the manufacturing method described in claim 12, characterized in that, Manufacturing the patterned peelable adhesive layer using a first positive photoresist includes: Coating a first positive photoresist on the pixel defining layer; Performing an exposure process on the first positive photoresist using a first mask plate. The first mask plate has a second opening. In a direction perpendicular to the plane of the substrate, the second opening overlaps with the defining portion; Removing the first positive photoresist at the exposed position with a developer, and the first positive photoresist at the unexposed position forms the patterned peelable adhesive layer.

14. According to the manufacturing method described in claim 11, characterized in that, Manufacturing the inorganic layer by a low-temperature chemical vapor deposition process includes: the process temperature is T, and T≤90°.

15. According to the manufacturing method described in claim 11, characterized in that, Performing a patterning process on the inorganic layer includes: Coating a second photoresist on the side of the inorganic layer away from the patterned peelable adhesive layer; The second photoresist is patterned to form a patterned second photoresist layer, and the patterned second photoresist layer covers at least the inorganic layer located within the first opening; The inorganic layer not covered by the patterned second photoresist layer is etched away.

16. The preparation method according to claim 15, wherein: The preparation method further includes: before peeling off the patterned peelable adhesive layer, peeling off the patterned second photoresist layer.

17. The preparation method according to claim 15, wherein: Peeling off the patterned peelable adhesive layer includes: Using a stripping solution to peel off the patterned peelable adhesive layer while peeling off the patterned second photoresist layer.

18. The preparation method according to claim 11, wherein: Before fabricating the inorganic layer by a low-temperature chemical vapor deposition process, the preparation method further includes: fabricating a separation layer at least on the sidewalls of the first opening, and the separation layer is used to assist in film peeling.

19. The preparation method according to claim 18, wherein: Peeling off the patterned peelable adhesive layer includes: Using a stripping solution to peel off the patterned peelable adhesive layer while peeling off the separation layer.

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