Chip mounting apparatus and control method, device thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHANGXIN MEMORY TECH INC
- Filing Date
- 2022-06-16
- Publication Date
- 2026-06-23
Smart Images
Figure CN115064467B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor packaging technology, and in particular to a chip mounting device and its control method and apparatus. Background Technology
[0002] The chip mounting station processes the wafers that have already been cut at the previous station. Traditional diamond cutting can completely separate each chip. However, with the introduction of laser stealth cutting technology and increasingly demanding process requirements, situations may arise where one or more chips cannot be separated. Summary of the Invention
[0003] This application provides a chip mounting device and its control method and apparatus for detecting undivided excess chips.
[0004] This application provides a chip mounting device, comprising: a gripping nozzle for picking up chips from a wafer and placing the picked-up chips on an intermediate stage; an intermediate stage for carrying the chips; and a bonding nozzle for picking up chips from the intermediate stage and bonding the picked-up chips onto a substrate.
[0005] The intermediate stage has a working area for supporting the chip and a detection area for detecting whether there are any extra chips that are not separated from the chip on its surface. The working area is located in the center of the intermediate stage, and the detection area is adjacent to the working area and located on the periphery of the working area. The detection area has a vacuum hole.
[0006] The chip mounting equipment also includes a main vacuum pipeline and a branch vacuum pipeline disposed inside or outside the intermediate stage. Each vacuum hole in the detection area is connected to one end of a branch vacuum pipeline, and the other end of each branch vacuum pipeline is connected to the main vacuum pipeline. Each branch vacuum pipeline is provided with a pressure detection device for detecting the internal pressure of the branch vacuum pipeline.
[0007] This embodiment of the application achieves the detection of undivided excess chips located in the detection area by means of vacuum holes in the detection area located around the working area on the intermediate stage of the chip mounting equipment, and each detection area (e.g., one detection area at the top, bottom, left, and right of the working area) having a vacuum hole connected to one end of a vacuum tube, the other end of each of the vacuum tubes being connected to the main vacuum tube, and each of the vacuum tubes being provided with a pressure detection device for detecting the internal pressure of the vacuum tube.
[0008] In some embodiments, a vacuum hole is provided on the working area;
[0009] The vacuum hole in the working area is connected to one end of a vacuum pipeline, and the other end of the vacuum pipeline is connected to the main vacuum pipeline.
[0010] In some embodiments, the distance between the innermost vacuum hole of any of the detection areas and the chip coverage area in the working area is greater than or equal to half the width of the wafer dicing track and a preset offset value.
[0011] In some embodiments, the offset value ranges from [40, 60] micrometers.
[0012] In some embodiments, the distance between the outermost vacuum hole of the detection area and the chip coverage area in the working area is less than or equal to the sum of the width of the wafer dicing channel and the chip length or width.
[0013] In some embodiments, the area occupied by the vacuum aperture group is smaller than the chip size in the same direction.
[0014] In some embodiments, the system further includes a vacuum pumping device connected to the main vacuum line.
[0015] In some embodiments, it also includes:
[0016] A chip mounting control device is used to control the gripping nozzle to pick up chips from the wafer and place the picked-up chips on the intermediate stage; to obtain the pressure value detected by the pressure detection device of the branch vacuum pipeline connected to the vacuum hole of the detection area; if the pressure value is greater than or equal to a preset threshold value, an alarm message is issued; otherwise, the device controls the bonding nozzle to pick up chips from the intermediate stage and bond the picked-up chips to the substrate.
[0017] In some embodiments, the chip mounting control device is further configured to:
[0018] During the process of the gripping nozzle picking up a chip from the wafer and placing the picked-up chip on the intermediate stage, the pressure value of the gripping nozzle is obtained;
[0019] If the pressure value of the gripping nozzle is greater than or equal to a preset threshold, the gripping nozzle continues to perform the operation of placing the picked-up chip onto the intermediate stage; otherwise, an alarm message is issued.
[0020] In some embodiments, it also includes:
[0021] A measuring lens is used to measure the position and angle of the chip in the working area of the intermediate stage when the working area of the stage carries the chip.
[0022] The chip mounting control module controls the adhesive nozzle to pick up the chip from the intermediate stage according to the chip's position and angle, and then attaches the picked-up chip to the substrate at a preset position and angle.
[0023] This application provides a method for controlling the chip mounting equipment to perform chip mounting, comprising:
[0024] The gripping nozzle is controlled to pick up chips from the wafer and place the picked-up chips on the intermediate stage;
[0025] Obtain the pressure value detected by the pressure detection device of the branch vacuum pipeline connected to the vacuum hole of the detection area;
[0026] If the pressure value is greater than or equal to the preset threshold, an alarm message is issued; otherwise, the adhesive nozzle is controlled to pick up the chip from the intermediate stage and attach the picked-up chip to the substrate.
[0027] In some embodiments, the method further includes:
[0028] During the process of the gripping nozzle picking up a chip from the wafer and placing the picked-up chip on the intermediate stage, the pressure value of the gripping nozzle is obtained;
[0029] If the pressure value of the gripping nozzle is greater than or equal to a preset threshold, the gripping nozzle continues to perform the operation of placing the picked-up chip onto the intermediate stage; otherwise, an alarm message is issued.
[0030] In some embodiments, the method further includes: obtaining the position and angle of the chip carried in the working area of the intermediate stage;
[0031] Controlling the adhesive nozzle to pick up a chip from the intermediate stage and attach the picked-up chip to the substrate includes:
[0032] Based on the position and angle of the chip, the adhesive nozzle is controlled to pick up the chip from the intermediate stage and attach the picked-up chip to the substrate according to the preset position and angle.
[0033] In some embodiments, when a vacuum hole is provided on the working area, the method further includes:
[0034] The pressure value detected by the pressure detection device of the branch vacuum pipeline connected to the vacuum hole of the working area is obtained. If the pressure value is less than the preset threshold, an alarm message is issued.
[0035] Another embodiment of this application provides a chip mounting control device, which includes a memory and a processor, wherein the memory is used to store program instructions, and the processor is used to call the program instructions stored in the memory and execute any of the methods described above according to the obtained program.
[0036] Furthermore, according to embodiments, for example, a computer program product for a computer is provided, which includes software code portions that, when the product is run on the computer, perform the steps of the methods defined above. The computer program product may include a computer-readable medium on which the software code portions are stored. Furthermore, the computer program product may be directly loaded into the computer's internal memory and / or sent via a network through at least one of an upload process, a download process, and a push process.
[0037] Another embodiment of this application provides a computer-readable storage medium storing computer-executable instructions for causing the computer to perform any of the methods described above. Attached Figure Description
[0038] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0039] Figure 1 This is a schematic diagram of a chip mounting device provided in an embodiment of this application;
[0040] Figure 2 This is a schematic diagram of an intermediate stage in a chip mounting device provided in an embodiment of this application;
[0041] Figure 3 A schematic diagram showing the connection relationship between the branch vacuum line, the main vacuum line, and the vacuum hole in the chip mounting equipment provided in this application embodiment;
[0042] Figure 4 A schematic diagram showing the positions of the innermost and outermost vacuum holes in the detection area on the intermediate stage provided in this application embodiment;
[0043] Figure 5 A schematic diagram showing a normal chip, a redundant chip, wafer dicing paths between chips, chip length, and width provided for embodiments of this application;
[0044] Figure 6 A schematic diagram of the overall process of a chip mounting control method provided in an embodiment of this application;
[0045] Figure 7 This is a schematic flowchart illustrating a chip mounting control method provided in an embodiment of this application.
[0046] Figure 8 This is a schematic flowchart illustrating a chip mounting control method provided in an embodiment of this application.
[0047] Figure 9 This is a schematic diagram of a chip mounting control device provided in an embodiment of this application. Detailed Implementation
[0048] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0049] This application provides a chip mounting device and its control method and apparatus for detecting undivided excess chips.
[0050] The method and apparatus are based on the same concept of the application. Since the methods and apparatus solve problems in similar ways, the implementation of the apparatus and methods can refer to each other, and the repeated parts will not be described again.
[0051] The terms "first," "second," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0052] The following examples and embodiments are to be understood as illustrative only. While this specification may refer to "a," "an," or "some" examples or embodiments in several places, this does not mean that every such reference relates to the same example or embodiment, nor does it mean that the feature applies only to a single example or embodiment. Individual features of different embodiments may also be combined to provide other embodiments. Furthermore, terms such as "comprising" and "including" should be understood not to limit the described embodiments to consisting only of those features mentioned; such examples and embodiments may also include features, structures, units, modules, etc., not specifically mentioned.
[0053] The various embodiments of this application will now be described in detail with reference to the accompanying drawings. It should be noted that the order in which the embodiments are presented in this application represents only a chronological order and does not represent the superiority or inferiority of the technical solutions provided by the embodiments.
[0054] See Figure 1 The chip mounting equipment provided in this application embodiment includes: a gripping nozzle 01 for picking up a chip 02 from a wafer 03 and placing the picked-up chip 02 on an intermediate stage 04; an intermediate stage 04 for carrying the chip 02; and an adhesive nozzle 06 for picking up the chip 02 from the intermediate stage 04 and attaching the picked-up chip 02 to a substrate 07.
[0055] Among them, see Figure 2 The intermediate stage 04 has a working area 08 for supporting the chip 02 (i.e., the chip 02 that needs to be mounted on the substrate 07, referred to as the normal chip) and a detection area 09 for detecting whether there are any extra chips that are not separated from the chip 02. The working area 08 is located in the center of the intermediate stage 04, and the detection area 09 is adjacent to the working area 08 and is located on the periphery of the working area 08. The detection area 09 is provided with a vacuum hole 05.
[0056] See Figure 3 The chip mounting equipment also includes a main vacuum line 10 and a branch vacuum line 11 disposed inside or outside the intermediate stage 04. The vacuum hole 051 of each detection area 09 is connected to one end of a branch vacuum line 11, and the other end of each branch vacuum line 11 is connected to the main vacuum line 10. Each branch vacuum line 11 is provided with a pressure detection device 12 (e.g., a pressure gauge) for detecting the internal pressure of the branch vacuum line 11.
[0057] Therefore, in this embodiment of the application, a detection area 09 is provided on the intermediate stage 04 for detecting whether there are extra chips that are not separated from the normal chips, and a vacuum hole 051 is provided on the detection area 09. The vacuum hole 051 is connected to the support vacuum line 11, so that the pressure at the vacuum hole 051 can be obtained by the pressure detection device 12 provided inside the support vacuum line 11. By judging whether the pressure at this point is normal, the detection of whether there are extra chips that are not separated from the normal chips on the intermediate stage 04 can be achieved.
[0058] If the chip 02 is designed with vacuum detection holes in all four directions (up, down, left, right), and connected to the main vacuum line 10 through the branch vacuum line 11, then the branch vacuum lines 11 of the four detection areas 09 are independent of each other, and can detect all kinds of redundant chips.
[0059] In some embodiments, see Figure 2 and Figure 3 Vacuum holes 052 are also provided on the working area 08;
[0060] The vacuum hole 052 on the working area 08 is connected to one end of a vacuum pipeline 11, and the other end of the vacuum pipeline 11 is connected to the main vacuum pipeline 10.
[0061] In other words, the detection area 09 and the working area 08 use vacuum pipelines independently. Therefore, in this embodiment, the pressure value inside the branch vacuum pipeline 11 connected to the vacuum hole 052 of the working area 08 can also be obtained. If the pressure value is greater than or equal to the preset threshold value, it indicates that it is normal (i.e., there is a normal chip) and no alarm is required. Otherwise, it indicates that it is abnormal and an alarm and shutdown are required.
[0062] It should be noted that, although Figure 2 The working area 08 and the surrounding detection area 09 shown are both provided with vacuum holes 05. However, the working area 08 may not be provided with vacuum holes 05, that is, it is not necessary to evacuate the area covered by the normal chip 02 on the intermediate stage 04, thereby saving computing power and making it easier to implement.
[0063] like Figure 2 , Figure 4 , Figure 5 As shown, in some embodiments, the distance (e.g., denoted by s) between the innermost vacuum hole 05 of the detection area 09 and the chip 02 coverage area in the working area 08 is greater than or equal to half the width of the wafer dicing channel and a preset offset value.
[0064] It should be noted that the number of vacuum holes in the detection area shown in the figure is different from the number of vacuum holes in the working area. In actual applications, the number, size, and position of vacuum holes in each area can be determined according to actual needs, and no restrictions are imposed in this embodiment.
[0065] The preset offset value is, for example, 50µm.
[0066] In other words, the distance s between the innermost vacuum hole 05 of the detection area 09 and the chip 02 coverage area in the working area 08 is greater than or equal to half the width of the wafer dicing channel and a preset offset value; wherein, the chip 02 coverage area is referred to as the chip 02 area, which is the specific placement area of the gripping nozzle 01 within the working area 08 according to preset movement control methods and parameters. That is to say, the working area 08 can be slightly larger than the chip 02 area, and the specific size can be determined according to actual needs.
[0067] In some embodiments, s is greater than the sum of the width of the wafer dicing channel and 50um, i.e., s > (width of wafer dicing channel + 50um).
[0068] Therefore, in this embodiment of the application, when the gripping nozzle 01 places the chip 02 on the intermediate stage 04 and a positional shift occurs (for example, a shift size of <50um in the horizontal or vertical direction), the detection of the extra chip 02 can still be performed correctly.
[0069] like Figure 2 , Figure 4 , Figure 5 As shown, in some embodiments, the distance (e.g., denoted by m) between the outermost vacuum hole 05 of the detection area 09 and the chip 02 coverage area in the working area 08 is less than or equal to the sum of the width of the wafer dicing channel and the length or width of the chip 02.
[0070] In other words, for example, see 2. Figure 4 , Figure 5 In the horizontal direction (i.e., detection direction 1), the distance m between the outermost vacuum hole 05 of the detection area 09 and the chip 02 coverage area in the working area 08 is less than or equal to the sum of the width of the wafer dicing channel and the length of the chip 02.
[0071] Similarly, in the longitudinal direction (i.e., detection direction 2), the distance m (not shown in the figure) between the outermost vacuum hole 05 of the detection area 09 and the chip 02 coverage area in the working area 08 is less than or equal to the sum of the width of the wafer dicing channel and the width of the chip 02.
[0072] In some embodiments, the setting of m may also take into account the offset value, i.e., m is less than or equal to the sum of the width of the wafer dicing track and the length or width of the chip 02, and the preset offset value.
[0073] In some embodiments, m is less than the sum of the width of the wafer dicing channel and the chip O2 size (length or width) in the detection direction, 50µm, i.e., m < (width of wafer dicing channel + chip O2 size (length or width) in the detection direction + 50µm).
[0074] For details, please refer to Figure 5 For example, in detection direction 1, m < (width of wafer dicing track + length of chip 02 + 50µm); in detection direction 2, m < (width of wafer dicing track + width of chip 02 + 50µm). Detection direction 1, which is parallel to the length of chip 02, can also be referred to as the transverse direction; detection direction 2, which is parallel to the width of chip 02, can also be referred to as the longitudinal direction.
[0075] Therefore, in this embodiment, even if a positional shift occurs (e.g., a shift of less than 50µm in the lateral or longitudinal direction) when the gripping nozzle 01 places the chip 02 on the intermediate stage 04, the detection of excess chips 02 can still be performed correctly. Furthermore, if excess chips 02 exist in any of the directions above, below, left, or right of the normal chip 02, these excess chips 02 can completely cover the area occupied by the vacuum holes 05 in the detection area 09 in that direction, thereby ensuring accurate pressure detection results in that area (no air leakage), improving the detection accuracy of excess chips 02, and accurately detecting the presence of excess chips 02.
[0076] In this embodiment, the offset accuracy in detection direction 1 and / or detection direction 2 is <50µm. This ensures that when the gripping nozzle 01 places the chip 02 on the intermediate stage 04, a positional offset occurs (the offset size in detection direction 1 and / or detection direction 2 is <50µm), and the detection of excess chips can still be performed correctly. Therefore, in some embodiments, the size of the above-mentioned detection area 09 needs to be calculated to account for the 50µm effect.
[0077] Of course, the specific values of each offset value are not limited in the embodiments of this application. The 50um mentioned is only an example. For example, the range of the offset value is [40, 60] micrometers. Furthermore, different offset values can be set in different directions as needed. For example, the offset values set in detection direction 1 and detection direction 2 are different.
[0078] like Figure 2 , Figure 4 , Figure 5 As shown, in some embodiments, the area occupied by the vacuum aperture 05 group is smaller than the chip size in the same direction.
[0079] For example, in detection direction 2, the size n of the area occupied by the vacuum hole 05 group in the detection area 09 on the left and right sides of the working area 08 is less than the chip width.
[0080] In other words, in some embodiments, the size of the area occupied by the vacuum hole group 05 in the same direction (e.g., horizontal or vertical) is smaller than the chip size (width or length). Therefore, if there is an extra chip in any of the above, below, left, or right directions of a normal chip, the extra chip can completely cover the area occupied by the vacuum hole group 05 in the detection area 09 in that direction, thereby making the pressure detection result in that area accurate (no leakage), improving the detection accuracy of the extra chip, and accurately detecting the presence of the extra chip.
[0081] In some embodiments, the chip 02 mounting equipment provided in this application further includes a vacuum pumping device (not shown in the figure) connected to the main vacuum pipeline 10, thereby realizing vacuum pumping of each of the above pipelines.
[0082] In some embodiments, the chip O2 mounting equipment provided in this application further includes:
[0083] A chip 02 mounting control device (not shown in the figure) is used to control the gripping nozzle 01 to pick up the chip 02 from the wafer 03 and place the picked-up chip 02 on the intermediate stage 04; to obtain the pressure value detected by the pressure detection device 12 of the branch vacuum line 11 connected to the vacuum hole 05 of the detection area 09; if the pressure value is greater than or equal to a preset threshold value, an alarm message is issued; otherwise, the bonding nozzle 06 is controlled to pick up the chip 02 from the intermediate stage 04 and bond the picked-up chip 02 onto the substrate 07.
[0084] In other words, when the gripping nozzle 01 grips the chip 02 from the wafer 03 and places it on the intermediate stage 04, under normal circumstances, there is no chip 02 in the detection area 09. The pressure value detected by the pressure gauge inside the branch vacuum pipeline 11, which is connected to the vacuum hole 05 of the detection area 09, is very small (almost 0). The specific threshold value can be set according to actual needs. If it is less than the threshold value, it is considered to be normal and no alarm is required.
[0085] When there are extra chips in the detection area 09 in any direction, the pressure value detected by the pressure gauge inside the branch vacuum pipe 11 connected to the vacuum hole 05 of the detection area 09 in that direction increases significantly (the specific threshold value can be set according to actual needs; if it exceeds the threshold value, it is considered that there are extra chips 02, and an alarm is triggered).
[0086] Thus, the chip 02 mounting control device enables control of the chip 02 mounting equipment, and detects abnormalities such as the presence of excess chips during the chip 02 mounting process.
[0087] In some embodiments, the chip 02 mounting control device is further configured to:
[0088] During the process of the gripping nozzle 01 picking up the chip 02 from the wafer 03 and placing the picked-up chip 02 on the intermediate stage 04, the pressure value of the gripping nozzle 01 is obtained.
[0089] If the pressure value of the gripping nozzle 01 is greater than or equal to the preset threshold value, the gripping nozzle 01 continues to perform the operation of placing the picked-up chip 02 onto the intermediate stage 04; otherwise, an alarm message is issued.
[0090] Thus, the chip 02 mounting control device enables control of the chip 02 mounting equipment, and realizes the detection of whether the gripping nozzle 01 has successfully gripped the chip 02 during the chip 02 mounting process. If it fails, it can promptly alarm and stop the machine.
[0091] In some embodiments, see Figure 1 The chip O2 mounting equipment provided in this application embodiment also includes:
[0092] A measuring lens is used to measure the position and angle of the chip 02 in the working area 08 of the intermediate stage 04 when the chip 02 is carried in the working area 08.
[0093] The chip 02 mounting control module controls the adhesive nozzle 06 to pick up the chip 02 from the intermediate stage 04 according to the position and angle of the chip 02, and then pastes the picked-up chip 02 onto the substrate 07 at a preset position and angle.
[0094] In other words, the measuring lens can measure parameters such as the position and angle of the chip 02 located in the working area 08 on the intermediate stage 04. This allows the chip 02 mounting control module to control the movement of the adhesive nozzle 06 based on these parameters, thereby achieving secondary compensation of the chip 02's position and angle, ensuring that the chip 02's mounting position and angle on the substrate 07 meet the requirements.
[0095] See Figure 6 This application provides a method for controlling the chip mounting equipment to perform chip mounting, comprising:
[0096] S101, Control the gripping nozzle 01 to pick up the chip 02 from the wafer 03 and place the picked-up chip 02 on the intermediate stage 04;
[0097] S102. Obtain the pressure value detected by the pressure detection device 12 of the branch vacuum pipeline 11 connected to the vacuum hole 05 of the detection area 09;
[0098] In this embodiment, the pressure gauges of different pipelines have their own numbers, so it can be known which specific pipeline has abnormal pressure, thereby determining which specific detection area 09 has redundant chips.
[0099] S103. If the pressure value is greater than or equal to the preset threshold value, an alarm message is issued; otherwise, the adhesive nozzle 06 is controlled to pick up the chip 02 from the intermediate stage 04 and attach the picked-up chip 02 to the substrate 07.
[0100] In some embodiments, see Figure 7 The method further includes:
[0101] During the process of the gripping nozzle 01 picking up the chip 02 from the wafer 03 and placing the picked-up chip 02 on the intermediate stage 04, the pressure value of the gripping nozzle 01 is obtained.
[0102] If the pressure value of the gripping nozzle 01 is greater than or equal to the preset threshold value, the gripping nozzle 01 continues to perform the operation of placing the picked-up chip 02 onto the intermediate stage 04; otherwise, an alarm message is issued.
[0103] In some embodiments, see Figure 8 The method further includes: obtaining the position and angle of the chip 02 carried by the working area 08 of the intermediate stage 04;
[0104] Controlling the adhesive nozzle 06 to pick up the chip 02 from the intermediate stage 04 and attach the picked-up chip 02 to the substrate 07 includes:
[0105] Based on the position and angle of the chip 02, the adhesive nozzle 06 is controlled to pick up the chip 02 from the intermediate stage 04 and attach the picked-up chip 02 to the substrate 07 according to the preset position and angle.
[0106] When a vacuum hole 05 is provided on the working area 08, the method further includes:
[0107] The pressure value detected by the pressure detection device 12 of the branch vacuum pipeline 11 connected to the vacuum hole 05 of the working area 08 is obtained. If the pressure value is less than the preset threshold, an alarm message is issued.
[0108] See Figure 9 This application provides a chip O2 mounting control device, comprising:
[0109] Processor 600 is used to read the program from memory 620 and execute the following procedures:
[0110] The gripping nozzle 01 is controlled to pick up the chip 02 from the wafer 03 and place the picked-up chip 02 on the intermediate stage 04;
[0111] The pressure value detected by the pressure detection device 12 of the branch vacuum line 11 connected to the vacuum hole 05 of the detection area 09 is obtained;
[0112] If the pressure value is greater than or equal to the preset threshold value, an alarm message is issued; otherwise, the adhesive nozzle 06 is controlled to pick up the chip 02 from the intermediate stage 04 and attach the picked-up chip 02 to the substrate 07.
[0113] In some embodiments, the processor 600 is further configured to read a program from the memory 620 and execute the following processes:
[0114] During the process of the gripping nozzle 01 picking up the chip 02 from the wafer 03 and placing the picked-up chip 02 on the intermediate stage 04, the pressure value of the gripping nozzle 01 is obtained.
[0115] If the pressure value of the gripping nozzle 01 is greater than or equal to the preset threshold value, the gripping nozzle 01 continues to perform the operation of placing the picked-up chip 02 onto the intermediate stage 04; otherwise, an alarm message is issued.
[0116] In some embodiments, the processor 600 is further configured to read a program from the memory 620 and execute the following process: obtaining the position and angle of the chip 02 carried by the working area 08 of the intermediate stage 04;
[0117] The processor 600 controls the adhesive nozzle 06 to pick up the chip 02 from the intermediate stage 04 and attach the picked-up chip 02 to the substrate 07, including:
[0118] Based on the position and angle of the chip 02, the adhesive nozzle 06 is controlled to pick up the chip 02 from the intermediate stage 04 and attach the picked-up chip 02 to the substrate 07 according to the preset position and angle.
[0119] When a vacuum hole 05 is provided on the working area 08, the processor 600 is also used to read the program in the memory 620 and execute the following process:
[0120] The pressure value detected by the pressure detection device 12 of the branch vacuum pipeline 11 connected to the vacuum hole 05 of the working area 08 is obtained. If the pressure value is less than the preset threshold, an alarm message is issued.
[0121] In some embodiments, a chip mounting control device provided in this application further includes a transceiver 610 for receiving and sending data under the control of a processor 600.
[0122] Among them, Figure 9 In this context, the bus architecture can include any number of interconnected buses and bridges, specifically linking various circuits together, represented by one or more processors (processor 600) and memory (memory 620). The bus architecture can also link together various other circuits such as peripheral devices, voltage regulators, and power management circuits, which are well known in the art and therefore will not be described further herein. The bus interface provides an interface. The transceiver 610 can be multiple elements, including a transmitter and a receiver, providing a unit for communicating with various other devices over a transmission medium.
[0123] In some embodiments, a user interface 630 is also included. The user interface 630 may be an interface that can connect to external or internal devices, including but not limited to keypads, displays, speakers, microphones, joysticks, etc.
[0124] The processor 600 is responsible for managing the bus architecture and general processing, while the memory 620 can store the data used by the processor 600 when performing operations.
[0125] In some embodiments, the processor 600 may be a CPU (Central Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a CPLD (Complex Programmable Logic Device).
[0126] As described above, the chip mounting control device provided in this application embodiment can be part of the chip mounting equipment or can be set up independently. The chip mounting control device is connected to related structural components (such as the gripping nozzle 01, the adhesive nozzle 06, the pressure detection device 12, the vacuum device, the measuring lens, etc., mentioned in the text, as well as some easily conceived components not mentioned) within the chip mounting equipment provided in this application embodiment (wired and / or wireless connection relationship), which is not shown in the figures and will not be described again in this application embodiment.
[0127] It should be noted that the division of units in the embodiments of this application is illustrative and only represents one logical functional division. In actual implementation, other division methods may be used. Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated units described above can be implemented in hardware or as software functional units.
[0128] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0129] This application provides a computing device, which may specifically be a desktop computer, portable computer, smartphone, tablet computer, personal digital assistant (PDA), etc. The computing device may include a central processing unit (CPU), memory, input / output devices, etc. Input devices may include a keyboard, mouse, touchscreen, etc., and output devices may include display devices, such as a liquid crystal display (LCD) or a cathode ray tube (CRT).
[0130] The memory may include read-only memory (ROM) and random access memory (RAM), and provides the processor with program instructions and data stored in the memory. In the embodiments of this application, the memory may be used to store the program of any of the methods provided in the embodiments of this application.
[0131] The processor executes any of the methods described in the embodiments of this application according to the program instructions stored in the memory.
[0132] This application also provides a computer program product or computer program that includes computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform any of the methods described in the above embodiments. The program product may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof.
[0133] This application provides a computer-readable storage medium for storing computer program instructions used in the apparatus provided in the above-described embodiments, including a program for performing any of the methods provided in the above-described embodiments. The computer-readable storage medium may be a non-transitory computer-readable medium.
[0134] The computer-readable storage medium can be any available medium or data storage device that a computer can access, including but not limited to magnetic storage (e.g., floppy disks, hard disks, magnetic tapes, magneto-optical disks (MOs), etc.), optical storage (e.g., CDs, DVDs, BDs, HVDs, etc.), and semiconductor storage (e.g., ROMs, EPROMs, EEPROMs, non-volatile memory (NAND flash), solid-state drives (SSDs)).
[0135] It should be understood that:
[0136] The access technology used by entities in a communication network to transmit traffic can be any suitable current or future technology, such as WLAN (Wireless Local Access Network), WiMAX (Microwave Access Global Interoperability), LTE, LTE-A, 5G, Bluetooth, infrared, etc.; in addition, embodiments may also apply wired technologies, such as IP-based access technologies, such as wired networks or fixed lines.
[0137] An embodiment suitable for implementation as software code or as part thereof and for operation using a processor or processing function is independent of the software code and can be specified using any known or future-developed programming language, such as high-level programming languages such as Objective-C, C, C++, C#, Java, Python, Javascript, other scripting languages, etc., or low-level programming languages such as machine language or assembler.
[0138] The implementation of the embodiments is hardware-independent and can be implemented using any known or future-developed hardware technology or any combination thereof, such as microprocessors or CPUs (central processing units), MOS (metal-oxide-semiconductor), CMOS (complementary MOS), BiMOS (bipolar MOS), BiCMOS (bipolar CMOS), ECL (emitter-coupled logic), and / or TTL (transistor-transistor logic).
[0139] The embodiments may be implemented as individual devices, apparatuses, units, components or functions, or in a distributed manner. For example, one or more processors or processing functions may be used or shared in the process, or one or more processing segments or processing portions may be used and shared in the process, wherein one or more physical processors may be used to implement one or more processing portions dedicated to a particular process as described.
[0140] The device can be implemented by a semiconductor chip, a chipset, or a (hardware) module that includes such a chip or chipset.
[0141] The implementation can also be implemented as any combination of hardware and software, such as ASIC (Application-Specific IC (Integrated Circuit)) components, FPGA (Field Programmable Gate Array) or CPLD (Complex Programmable Logic Device) components or DSP (Digital Signal Processor) components.
[0142] The embodiments can also be implemented as computer program products, including a computer-usable medium in which computer-readable program code is embodied, the computer-usable program code being adapted to perform the processes described in the embodiments, wherein the computer-usable medium may be a non-transitory medium.
[0143] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product implemented on one or more computer-usable storage media (including, but not limited to, disk storage and optical storage) containing computer-usable program code.
[0144] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.
[0145] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.
[0146] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.
[0147] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.
Claims
1. A chip mounting device, characterized in that, include: A gripping nozzle for picking up chips from a wafer and placing the picked-up chips on an intermediate stage; an intermediate stage for carrying the chips; and a bonding nozzle for picking up chips from the intermediate stage and attaching the picked-up chips to a substrate. The intermediate stage has a working area for supporting the chip and a detection area for detecting whether there are any extra chips that are not separated from the chip on its surface. The working area is located in the center of the intermediate stage, and the detection area is adjacent to the working area and located on the periphery of the working area. The detection area has a vacuum hole. The chip mounting equipment also includes a main vacuum pipeline and a branch vacuum pipeline disposed inside or outside the intermediate stage. Each vacuum hole in the detection area is connected to one end of a branch vacuum pipeline, and the other end of each branch vacuum pipeline is connected to the main vacuum pipeline. Each branch vacuum pipeline is provided with a pressure detection device for detecting the internal pressure of the branch vacuum pipeline.
2. The chip mounting equipment according to claim 1, characterized in that, The working area is provided with a vacuum hole; The vacuum hole in the working area is connected to one end of a vacuum pipeline, and the other end of the vacuum pipeline is connected to the main vacuum pipeline.
3. The chip mounting equipment according to claim 1, characterized in that, The distance between the innermost vacuum hole of any of the detection areas and the chip coverage area in the working area is greater than or equal to half the width of the wafer dicing track and a preset offset value.
4. The chip mounting equipment according to claim 3, characterized in that, The offset value ranges from [40, 60] micrometers.
5. The chip mounting equipment according to claim 1, characterized in that, The distance between the outermost vacuum hole of the detection area and the chip coverage area in the working area is less than or equal to the sum of the width of the wafer dicing channel and the length or width of the chip.
6. The chip mounting equipment according to claim 1, characterized in that, In the same direction, the area occupied by the vacuum aperture group is smaller than the chip size.
7. The chip mounting equipment according to claim 1, characterized in that, Also includes: A vacuum pumping device connected to the main vacuum pipeline.
8. The chip mounting equipment according to claim 1, characterized in that, Also includes: A chip mounting control device is used to control the gripping nozzle to pick up chips from the wafer and place the picked-up chips on the intermediate stage; The pressure value detected by the pressure detection device of the branch vacuum pipeline connected to the vacuum hole of the detection area is obtained; if the pressure value is greater than or equal to a preset threshold value, an alarm message is issued; otherwise, the adhesive nozzle is controlled to pick up the chip from the intermediate stage and adhesive the picked-up chip onto the substrate.
9. The chip mounting equipment according to claim 8, characterized in that, The chip mounting control device is also used for: During the process of the gripping nozzle picking up a chip from the wafer and placing the picked-up chip on the intermediate stage, the pressure value of the gripping nozzle is obtained; If the pressure value of the gripping nozzle is greater than or equal to a preset threshold, the gripping nozzle continues to perform the operation of placing the picked-up chip onto the intermediate stage; otherwise, an alarm message is issued.
10. The chip mounting equipment according to claim 8 or 9, characterized in that, Also includes: A measuring lens is used to measure the position and angle of the chip in the working area of the intermediate stage when the working area of the stage carries the chip. The chip mounting control module controls the adhesive nozzle to pick up the chip from the intermediate stage according to the chip's position and angle, and then attaches the picked-up chip to the substrate at a preset position and angle.
11. A method for controlling the chip mounting equipment of claim 1 to perform chip mounting, characterized in that, The method includes: The gripping nozzle is controlled to pick up chips from the wafer and place the picked-up chips on the intermediate stage; Obtain the pressure value detected by the pressure detection device of the branch vacuum pipeline connected to the vacuum hole of the detection area; If the pressure value is greater than or equal to the preset threshold, an alarm message is issued; otherwise, the adhesive nozzle is controlled to pick up the chip from the intermediate stage and attach the picked-up chip to the substrate.
12. The method according to claim 11, characterized in that, The method further includes: During the process of the gripping nozzle picking up a chip from the wafer and placing the picked-up chip on the intermediate stage, the pressure value of the gripping nozzle is obtained; If the pressure value of the gripping nozzle is greater than or equal to a preset threshold, the gripping nozzle continues to perform the operation of placing the picked-up chip onto the intermediate stage; otherwise, an alarm message is issued.
13. The method according to claim 11 or 12, characterized in that, The method further includes: obtaining the position and angle of the chip carried in the working area of the intermediate stage; Controlling the adhesive nozzle to pick up a chip from the intermediate stage and attach the picked-up chip to the substrate includes: Based on the position and angle of the chip, the adhesive nozzle is controlled to pick up the chip from the intermediate stage and attach the picked-up chip to the substrate according to the preset position and angle.
14. The method according to claim 11 or 12, characterized in that, When a vacuum hole is provided on the working area, the method further includes: The pressure value detected by the pressure detection device of the branch vacuum pipeline connected to the vacuum hole of the working area is obtained. If the pressure value is less than the preset threshold, an alarm message is issued.
15. A chip mounting control device, characterized in that, include: Memory, used to store program instructions; A processor is configured to invoke program instructions stored in the memory and execute the method according to any one of claims 11 to 14.