Substrate processing method and apparatus

Abstract

This invention relates to a substrate processing method and apparatus, and proposes a scheme for determining, through visual inspection, whether the position sensing sensor missenses or the substrate processing apparatus malfunctions while sensing the movement position of the processing container or nozzle of the substrate processing apparatus via a position sensing sensor, and for taking subsequent measures accordingly.

Description

Technical Field

[0001] The present invention relates to a substrate processing method and apparatus, and more specifically to a scheme for visually inspecting and determining false sensing by the position sensing sensor and malfunction of the substrate processing apparatus while sensing the movement position of the processing container or nozzle of the substrate processing apparatus by a position sensing sensor, and performing subsequent measures accordingly. Background Technology

[0002] To manufacture semiconductor devices or liquid crystal displays, various processes are performed on the substrate, including photolithography, ashing, ion implantation, thin film deposition, and cleaning. Among these, the cleaning process removes particles remaining on the substrate and is performed before or after each other in the manufacturing process.

[0003] The cleaning process removes foreign matter by supplying chemicals and organic solvents to the substrate using a substrate processing apparatus. This process involves loading and unloading the substrate, supplying different processing solutions, and simultaneously recovering the processing solutions used in the process. This is accompanied by processes that raise or lower the processing container to a set height, or rotate the nozzle to a standby position or a process position. Therefore, whether the processing container is properly raised or lowered to the set height and whether the nozzle is properly rotated to the process position are crucial factors for executing the respective processes.

[0004] Typically, a lifting unit is provided to raise or lower the processing container to a set height position, or a nozzle movement driver is provided to rotate the nozzle to a standby position or a process position. A position sensing sensor based on a magnetic sensor senses the height position of the processing container achieved by the lifting unit or the rotation position of the nozzle achieved by the nozzle movement driver, and determines whether the appropriate displacement of the corresponding device part has been achieved.

[0005] If the equipment unit is not properly moved to the position for performing the corresponding process, the process is interrupted along with an alert and a recovery operation is performed. Most of these alerts are caused by false sensing by the position sensing sensor. Such false sensing unnecessarily interrupts the process and requires recovery operations, thus reducing the overall process yield.

[0006] Furthermore, when the position sensing sensor detects a normal position even though the equipment has not been properly moved to the position for performing the corresponding processing, it can cause serious problems such as producing a large number of defective products or damaging equipment due to the execution of the processing.

[0007] Therefore, it is necessary to seek solutions to prevent false sensing by position sensing sensors.

[0008] Patent Document 0001: Korean Patent Publication No. 10-2015-0139018

[0009] Patent Document 0002: Korean Patent Publication No. 10-2018-0002101 Summary of the Invention

[0010] The present invention is proposed to solve the problems of the prior art as described above, and its purpose is to provide a solution that can more accurately determine whether the processing container or nozzle has moved to the appropriate position for the corresponding processing process.

[0011] In particular, its purpose is to solve the problem that false sensing by position sensors that sense the position of the processing container or nozzle leads to unnecessary interruptions in the processing process and the need for recovery operations, thereby reducing the overall process yield.

[0012] In addition, its purpose is to eliminate the following major problems: the position sensing sensor still senses the normal position even though the processing container or nozzle has not been moved to the proper position, resulting in the production of a large number of defective products or equipment damage during the processing.

[0013] The objectives of this invention are not limited to those described above, and other objectives and advantages of the invention not mentioned can be understood from the following description.

[0014] An embodiment of the substrate processing method according to the present invention may include: an apparatus moving step, wherein a processing container or nozzle is moved to a predetermined position according to the processing process of the substrate processing apparatus; a sensor sensing step, wherein the moving position of the processing container or the nozzle is sensed by a plurality of position sensing sensors; a visual inspection step, wherein the positional state of the processing container or the nozzle is inspected by a visual sensor; and an operating state determination step, wherein the sensing results obtained by the position sensing sensors and the inspection results obtained by the visual sensor are combined to determine whether the position sensing sensors are missensing or the substrate processing apparatus is malfunctioning.

[0015] Preferably, the sensor sensing step may involve sensing the moving position using multiple position sensing sensors configured according to a pre-defined location, and the visual inspection step may involve comparing the pre-stored normal state information of each position with the captured image of the moving position to check the position state.

[0016] As an example, the sensor sensing step may use multiple magnetic induction components arranged according to the height position of the processing container to sense magnets installed on the lifting units on both sides of the processing container, and the visual inspection step may compare the captured image taken from above the processing container with the pre-stored normal state information of each position of the processing container to check the positional state of the processing container.

[0017] As another example, the sensor sensing step may involve sensing a magnet on the other side of a nozzle support rod on one side of which the nozzle is located by a plurality of magnetic induction components arranged according to the rotational position of the nozzle, and the visual inspection step may involve checking the positional state of the nozzle by comparing an image taken from above the nozzle with pre-stored normal state information for each position of the nozzle.

[0018] Furthermore, the substrate processing method may further include a follow-up measures step, which involves performing follow-up measures based on the working state judgment result.

[0019] As an example, in the working state determination step, if the sensing result obtained by the position sensing sensor indicates an abnormal position, and the position state of the processing container or the nozzle is normal according to the position state check result obtained by the vision sensor, then it is determined that the position sensing sensor is missensing, and the subsequent steps continue to execute the processing process of the substrate processing apparatus.

[0020] As another example, in the working state determination step, when the sensing result of the position sensing sensor indicates an abnormal position, if the position state of the processing container or the nozzle is abnormal according to the position state check result of the vision sensor, then it is determined that the substrate processing device is malfunctioning, and the subsequent measures step interrupts the processing process of the substrate processing device.

[0021] Alternatively, the subsequent steps may provide fault information for the position sensing sensor based on the number of false sensing events.

[0022] As an example, in the working state determination step, when the sensing result of the position sensing sensor indicates a normal position, the sensing error of the position sensing sensor is determined based on the position state check result performed by the vision sensor. In the subsequent action step, when the sensing error of the position sensing sensor exceeds a reference value, the processing process of the substrate processing apparatus is interrupted.

[0023] Preferably, the subsequent steps may also include providing alert information related to a processing interruption of the substrate processing apparatus and performing automatic recovery.

[0024] Alternatively, one embodiment of the substrate processing apparatus according to the present invention may include: a substrate support unit for supporting a substrate; a processing container having an open process space at the top, wherein the substrate support unit is disposed in the process space and a recovery box for introducing and sucking up processing fluids from the processing process is provided; a lifting unit for raising and lowering the processing container to change the relative height of the processing container with respect to the substrate support unit; a processing container position sensing sensor for sensing the height position of the processing container based on the lifting and lowering movement of the processing container; a vision sensor for capturing an image of the position of the processing container from above; and a working state determination unit for checking the position state of the processing container based on the image captured by the vision sensor, and comparing the checking result of the position state of the processing container with the sensing result of the processing container position sensing sensor to determine whether the processing container position sensing sensor is missensing or whether the operating state of the substrate processing apparatus is related to malfunction.

[0025] Preferably, the processing container may be configured with multiple recovery boxes in a multi-level manner according to height, in order to independently introduce and extract various processing fluids from the processing process.

[0026] As an example, the lifting unit may include: a processing container movement driver, which is disposed correspondingly on both sides of the outer surface of the processing container, and has a linkage cylinder that causes a shaft with one end connected to the processing container to move vertically to change the height position of the processing container; the processing container position sensing sensor includes: a magnet disposed on the shaft; and a plurality of magnetic induction members configured according to a set height to sense the position of the magnet according to the lifting movement of the shaft.

[0027] As another example, the substrate processing apparatus may further include: a spraying unit having a nozzle that rotates between a standby position and a process position to supply processing fluid to the substrate; and a nozzle position sensing sensor that senses the rotational position of the nozzle based on the rotational movement of the nozzle, a vision sensor taking a picture of the position of the nozzle from above the nozzle, and an operating state determination unit checking the position state of the nozzle based on the image taken by the vision sensor, comparing the checking result of the position state of the nozzle with the sensing result of the nozzle position sensing sensor to determine whether the nozzle position sensing sensor is missensing or the substrate processing apparatus is malfunctioning.

[0028] Furthermore, the injection unit may include: a nozzle that rotates between a standby position and a process position to supply processing fluid to a substrate; a nozzle support rod that supports the nozzle by having the nozzle disposed on one side; and a nozzle movement driver that rotates the nozzle support rod with reference to the other side of the nozzle support rod to rotate and move the nozzle. The nozzle position sensing sensor includes: a magnet disposed on the other side of the nozzle support rod; and a plurality of magnetic induction members configured according to the rotation angle to sense the position of the magnet based on the rotational movement of the nozzle support rod.

[0029] Preferably, the substrate processing apparatus may further include: a control unit, which controls to change the relative height of the processing container or change the rotation position of the nozzle, and provides reminder information based on the judgment result of the working state judgment unit and performs interruption and resumption of the processing process of the substrate processing apparatus.

[0030] As an example, the working state determination unit may determine that the position of the processing container or the nozzle is abnormal when the sensing result obtained by the processing container position sensing sensor or the nozzle position sensing sensor is abnormal. If the position of the processing container or the nozzle is normal according to the position status check result obtained by the vision sensor, the control unit may determine that the position sensing sensor is malsensing. The control unit may then control the processing of the substrate processing apparatus to continue based on the working state determination result of the working state determination unit.

[0031] As another example, the working state determination unit may determine that the substrate processing apparatus is malfunctioning when the sensing result obtained by the processing container position sensing sensor or the nozzle position sensing sensor indicates an abnormal position. If the position state of the processing container or the nozzle is also abnormal according to the position state check result obtained by the vision sensor, the control unit may then control the processing of the substrate processing apparatus to be interrupted based on the working state determination result of the working state determination unit.

[0032] As another example, the working state determination unit may determine whether the sensing error of the position sensing sensor exceeds a reference value based on the position state check result of the processing container or the nozzle performed by the vision sensor when the sensing result of the processing container or the nozzle is determined to be in a normal position. When the sensing error of the position sensing sensor exceeds the reference value, the control unit interrupts the processing process of the substrate processing apparatus.

[0033] A preferred embodiment of the substrate processing method according to the present invention may include: an apparatus moving step, wherein a processing container is moved to a predetermined position according to the processing process of the substrate processing apparatus; a sensor sensing step, wherein a plurality of magnetic induction components arranged according to the height position of the processing container sense magnets provided on lifting units on both sides of the processing container; a visual inspection step, wherein the positional state of the processing container is checked by comparing an image taken from above the processing container with pre-stored normal state information of each position of the processing container; and a working state determination step, wherein when the sensing result by the position sensing sensor determines that the position is abnormal, the working state is determined based on the visual sensing... The system determines whether the position sensing sensor is missensing or whether the substrate processing device is in an malfunctioning state based on the position status check result performed by the device. When the position sensing sensor indicates a normal position, the system determines the operating state caused by the sensing error of the position sensing sensor based on the position status check result performed by the vision sensor. Subsequent steps include continuing the processing when the operating state determination result indicates a missensing by the position sensing sensor, and interrupting the processing and providing a warning message when the substrate processing device is in an malfunctioning state or the sensing error of the position sensing sensor exceeds a reference value.

[0034] According to this invention, while sensing the position of the processing container or nozzle by a position sensing sensor, additional inspection is performed by a vision sensor, thereby enabling the detection of false sensing by the position sensing sensor. This prevents unnecessary interruptions in the processing of the substrate processing apparatus and improves the process yield.

[0035] In particular, when the position sensing sensor detects a container or nozzle as being in the normal position even though it has not moved to the normal position, the abnormal position can be detected by the vision sensor. This can prevent major problems such as the production of a large number of defective products or equipment damage caused by the execution of the process.

[0036] The effects of the present invention are not limited to those mentioned above. Those skilled in the art to which this invention pertains will clearly understand other effects not mentioned from the following description. Attached Figure Description

[0037] Figure 1 An embodiment of the substrate processing apparatus according to the present invention is shown.

[0038] Figure 2 An embodiment of the substrate processing apparatus according to the present invention is shown, viewed from above.

[0039] Figure 3A structural diagram showing an embodiment of the main components of the substrate processing apparatus according to the present invention is provided.

[0040] Figure 4 A flowchart illustrating an embodiment of the substrate processing method according to the present invention is shown.

[0041] Figure 5 A flowchart illustrating an embodiment of the substrate processing method according to the present invention, from the position sensing process to the subsequent processing steps, is shown.

[0042] Figure 6 An embodiment of height position sensing based on the relative vertical movement of a processing container is shown in this invention.

[0043] Figure 7 An embodiment of the method for processing the height position sensing and inspection of a container in this invention is shown.

[0044] Figure 8 Another embodiment of the method for processing the height position sensing and inspection of a container in this invention is shown.

[0045] Figure 9 An embodiment of the sensing and inspection of the rotational position of the nozzle in this invention is shown.

[0046] Figure 10 Another embodiment of the sensing and inspection of the nozzle's rotational position is shown in this invention.

[0047] (Explanation of reference numerals in the attached diagram)

[0048] 10: Substrate processing apparatus

[0049] 100: Handling containers,

[0050] 200: Substrate support unit

[0051] 300: Injection unit,

[0052] 310: Nozzle support rod,

[0053] 320: Nozzle,

[0054] 340: Nozzle movement driver

[0055] 400: Processing fluid supply unit,

[0056] 500: Lifting unit,

[0057] 510a, 510b: Bracket,

[0058] 520a, 520b: Handling container removable drives,

[0059] 610, 610a, 610b: Processing container position sensing sensors,

[0060] 620a, 620b: Magnets,

[0061] 630a, 630b: Magnetic induction components,

[0062] 650: Nozzle position sensing sensor,

[0063] 660: Magnet,

[0064] 670: Magnetic induction component,

[0065] 690: Vision sensor,

[0066] 700: Working Status Judgment Department

[0067] 800: Control Department. Detailed Implementation

[0068] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to or restricted to the embodiments.

[0069] To illustrate the present invention, its advantages in operation, and the objectives achieved through its implementation, preferred embodiments of the present invention are illustrated below and described with reference thereto.

[0070] First, the terminology used in this application is merely for illustrating specific embodiments and is not intended to limit the invention. Singular expressions may also include plural expressions unless explicitly indicated otherwise in the context. Furthermore, in this application, terms such as "comprising" or "having" specify the presence of features, numbers, steps, operations, constituent elements, components, or combinations thereof described in the specification, and should be understood not to pre-exclude the presence or additional possibilities of one or more other features, numbers, steps, operations, constituent elements, components, or combinations thereof.

[0071] When describing the present invention, detailed descriptions of related well-known structures or functions are omitted if it is determined that such detailed descriptions may obscure the main points of the invention.

[0072] This invention discloses a scheme for visually inspecting and determining false sensing by the position sensing sensor and malfunction of the substrate processing device while sensing the movement position of the processing container or nozzle of the substrate processing device by the position sensing sensor, and then taking subsequent measures accordingly.

[0073] Figure 1 An embodiment of the substrate processing apparatus of the present invention is shown. Figure 2 An embodiment of the substrate processing apparatus of the present invention is shown, viewed from above. Figure 3 A main structural diagram of an embodiment of the substrate processing apparatus according to the present invention is shown.

[0074] Reference Figures 1 to 3 The substrate processing apparatus 10 includes a chamber 50, a processing container 100, a substrate support unit 200, a spraying unit 300, a processing liquid supply device 400, a lifting unit 500, a working status judgment unit 700, and a control unit 800.

[0075] Chamber 50 provides a sealed internal space. An airflow supply unit 51 is disposed above it. The airflow supply unit 51 creates a downward airflow inside chamber 50.

[0076] The airflow supply unit 51 filters the high-humidity external gas and supplies it into the chamber 50. The high-humidity external gas passes through the airflow supply unit 51 and is supplied into the chamber, forming a downward airflow. The downward airflow provides a uniform airflow above the substrate W, and pollutants generated during the treatment of the substrate W surface by the processing fluid are discharged together with the air through the recovery boxes 110, 120, and 130 of the processing container 100.

[0077] The chamber 50 is divided into a process area 56 and a maintenance area 58. The process area 56 houses the processing container 100 and the substrate support unit 200. The maintenance area 58 contains discharge lines and exhaust lines connected to the processing container 100, and a drive unit and supply lines connected to the spray unit 300. Furthermore, the processing container movement drives 520a and 520b of the lifting unit 500 extend from the maintenance area 58 into the process area 56. The maintenance area 58 is isolated from the process area 56.

[0078] The processing container 100 has a cylindrical shape with an open top, providing a process space for processing the substrate W. The open top of the processing container 100 provides channels for loading and unloading the substrate W. A substrate support unit 200 is provided in the process space. During processing, the substrate support unit 200 rotates the substrate W while supporting it.

[0079] The processing container 100 provides a lower space with an exhaust pipe (not shown) connected to its lower end to form forced exhaust. The processing container 100 is arranged in a multi-stage configuration such that processing liquids and gases scattered from the rotating substrate W flow into and are drawn into first to third recovery boxes 110, 120, and 130. The annular first to third recovery boxes 110, 120, and 130 have exhaust ports communicating with a common annular space.

[0080] Specifically, the first to third recycling bins 110, 120, and 130 each include an annular bottom surface and cylindrical sidewalls extending from the bottom surface. The second recycling bin 120 surrounds the first recycling bin 110 and is spaced apart from it. The third recycling bin 130 surrounds the second recycling bin 120 and is spaced apart from it.

[0081] The first to third recycling bins 110, 120, and 130 provide first to third recycling spaces into which an airflow containing processing liquid and fumes dispersed from the substrate W flows. The first recycling space is defined by the first recycling bin 110, the second recycling space is defined by the space between the first and second recycling bins, and the third recycling space is defined by the space between the second and third recycling bins.

[0082] The center portion of the top of each of the first to third recycling bins 110, 120, and 130 is open. The first to third recycling bins 110, 120, and 130 are formed as inclined surfaces with the distance from the corresponding bottom surface gradually increasing as one moves from the connected sidewall to the open portion. The treatment liquid that spills from the substrate W flows along the top of the first to third recycling bins 110, 120, and 130 into the recycling space and is discharged into the waste treatment liquid unit or the treatment liquid reuse unit.

[0083] On the other hand, the processing container 100 is coupled with a lifting unit 500 that changes the vertical position of the processing container 100. The lifting unit 500 causes the processing container 100 to move linearly in the up-down direction. Multiple lifting units 500 may be arranged spaced apart on both sides of the processing container 100 or along the perimeter of the processing container 100. As the processing container 100 moves up and down via the lifting unit 500, the relative height of the processing container 100 with respect to the substrate support unit 200 changes.

[0084] The lifting unit 500 includes supports 510a and 510b and processing container movement drivers 520a and 520b. Supports 510a and 510b are fixedly mounted on the outer wall of the processing container 100. The processing container movement drivers 520a and 520b may include linkage cylinders that vertically move shafts connected to supports 510a and 510b. When the substrate W is loaded or unloaded from the chuck stage 210, the processing container 100 descends, causing the chuck stage 210 to protrude upwards from the processing container 100. Furthermore, during the process, the height of the processing container 100 is adjusted corresponding to the first to third recovery boxes 110, 120, and 130, so that the processing liquid can flow into the designated recovery boxes 110, 120, and 130 according to the type of processing liquid supplied to the substrate W. By adjusting the height of the processing container 100, the types of recovered processing liquid and contaminated gases can be adjusted according to the first to third recovery spaces. Therefore, the lifting unit 500 changes the relative vertical position between the processing container 100 and the substrate support unit 200 by moving the processing container 100 vertically.

[0085] In order to control the height of the processing container 100 according to the processing process, a processing container position sensing sensor 610 is configured in the lifting unit 500 to sense the height position of the processing container based on the lifting and lowering movement of the processing container 100.

[0086] The processing container position sensing sensor 610 can be configured with the processing container movement drivers 520a and 520b corresponding to the lifting unit 500 to sense the height position of the processing container 100. The processing container position sensing sensors 610a and 610b include a magnet and a magnetic induction component.

[0087] As an example, magnets 620a and 620b are arranged at the lower ends of the shafts of the processing container moving drives 520a and 520b, and magnetic sensing members 630a and 630b are configured to sense the position of magnets 620a and 620b according to the lifting and lowering movement of the shaft.

[0088] Magnetic induction components 630a and 630b are respectively configured according to the processing container movement drivers 520a and 520b on both sides of the processing container 100. Magnetic induction components 631a, 632a, 633a, 631b, 632b, and 633b are configured at heights corresponding to the height positions of the processing container 100 used for loading or unloading the substrate W on the chuck stage 210 and the height positions of the first to third recycling boxes 110, 120, and 130, which are set in multiple levels.

[0089] The configuration position and quantity of magnets 620a, 620b and magnetic induction components 630a, 630b used to sense the movement position of the processing container 100 can be varied as needed.

[0090] Furthermore, a visual sensor 690 is disposed above the processing container 100 to capture images of the processing container 100 based on its moving position.

[0091] The processing container position sensing sensor 610 senses the position of the processing container 100 and provides the image of the movement position of the processing container 100 captured by the vision sensor 690 to the working state determination unit 700, whereby the working state determination unit 700 determines the position state of the processing container 100.

[0092] As an example, when the working state determination unit 700 determines that the sensing result of the processing container position sensing sensor 610 is an abnormal position, if the position state of the processing container 100 is normal according to the position state check result of the processing container 100 by the vision sensor 690, it determines that the processing container position sensing sensor 610 is a false sensing; if the position state of the processing container 100 is abnormal according to the position state check result of the processing container 100 by the vision sensor 690, it determines that the substrate processing device 10 is malfunctioning.

[0093] In addition, when the working status determination unit 700 determines that the sensing result of the processing container position sensing sensor 610 is a normal position, it calculates the sensing error of the processing container position sensing sensor 610 based on the position status check result of the processing container 100 performed by the vision sensor 690, and determines whether the sensing error exceeds the reference value.

[0094] The control unit 800 controls the lifting unit 500 to raise and lower the processing container 100, thereby changing the relative height. Furthermore, the control unit 800 executes subsequent measures based on the working status determination result of the working status determination unit 700.

[0095] If the operating state determination result of the operating state determination unit 700 is normal, the control unit 800 controls the continued execution of the substrate processing apparatus 10's processing technology; if the operating state determination result is abnormal, the control unit 800 controls the interruption of the processing technology. Furthermore, when the sensing error of the processing container position sensing sensor 610 exceeds a reference value, the control unit 800 interrupts the processing technology of the substrate processing apparatus 10.

[0096] Furthermore, the control unit 800 is configured to provide reminder information based on the judgment result of the working status judgment unit 700, and to perform automatic recovery when the processing of the substrate processing apparatus 10 is interrupted.

[0097] The substrate support unit 200 includes a rotating head 210, a rotating shaft 220, a drive unit 230, and a bottom nozzle assembly 240.

[0098] The rotating shaft 220 connected to the rotating head 210 rotates via the drive unit 230, thereby rotating the substrate W mounted on the rotating head 210. Furthermore, a bottom nozzle assembly 240, which passes through the rotating shaft 220, sprays a processing liquid onto the back surface of the substrate W. The rotating head 210 has a support member configured to support the substrate W in an upward-facing, spaced-apart state. The support member includes a plurality of chuck pins 211 that protrude at predetermined intervals from the upper edge of the rotating head 210, and a plurality of support pins 222 that protrude from the inner side of each chuck pin 211. The rotating shaft 220 is a hollow shaft connected to the rotating head 210, transmitting the rotational force of the drive unit 230 (described later) to the rotating head 210.

[0099] The injection unit 300 includes a nozzle support rod 310, a nozzle 320, a support shaft 330, and a nozzle movement driver 340. The treatment fluid supply unit 400 supplies treatment fluid to the injection unit 300.

[0100] Nozzle 320 is disposed on the bottom surface of one end of nozzle support rod 310. The other side of nozzle support rod 310 is connected to nozzle movement driver 340 via support shaft 330. Nozzle movement driver 340 rotates nozzle support rod 310 with reference to the other side of nozzle support rod 310, thereby rotating and moving nozzle 320 to a process position and a standby position. The process position is the position where nozzle 320 is positioned vertically above processing container 100, preferably a position corresponding to the center of substrate placed in substrate support unit 200. The standby position is the position where nozzle 320 is disengaged from vertically above processing container 100. Nozzle 320 supplies processing fluid to substrate W.

[0101] To sense the process position and standby position based on the rotational movement of the nozzle 320, a nozzle position sensing sensor 650 is configured. The nozzle position sensing sensor 650 includes a magnet and a magnetic induction element.

[0102] As an example, magnet 660 is disposed at the other end of nozzle support rod 310 on one side where nozzle 320 is disposed, and magnetic sensing member 670 is configured to sense the position of magnet 660 according to the rotational movement of nozzle support rod 310.

[0103] The magnetic induction component 670 is configured with multiple magnetic induction components 670a and 670b according to the rotation angle of the nozzle 320. For example, a magnetic induction component 670b is configured to correspond to the standby position of the nozzle 320 and a magnetic induction component 670a is configured to correspond to the process position of the nozzle 320.

[0104] The configuration position and quantity of the magnet 660 and the magnetic induction member 670 used to sense the position of the nozzle 320 can be varied as needed.

[0105] Furthermore, a vision sensor 690 is positioned above the nozzle 320 to capture the position of the nozzle 320. Here, the vision sensor 690 is configured to capture the position of the processing container 100 from the front, while also capturing the position of the nozzle 320.

[0106] The nozzle position sensing sensor 650 senses the position of the nozzle 320 and provides the image of the movement position of the nozzle 320 captured by the vision sensor 690 to the working state determination unit 700, whereby the working state determination unit 700 determines the position state of the nozzle 320.

[0107] As an example, when the working state determination unit 700 determines that the sensing result of the nozzle position sensing sensor 650 is an abnormal position, if the position state of the nozzle 320 is normal according to the position state check result of the visual sensor 690, it determines that the nozzle position sensing sensor 650 is a false sensing, and if the position state of the nozzle 320 is abnormal according to the position state check result of the visual sensor 690, it determines that the substrate processing device 10 is malfunctioning.

[0108] In addition, when the working status determination unit 700 determines that the sensing result of the nozzle position sensing sensor 650 is a normal position, it calculates the sensing error of the nozzle position sensing sensor 650 based on the position status check result of the nozzle 320 performed by the vision sensor 690, and determines whether the sensing error exceeds the reference value.

[0109] The control unit 800 controls the nozzle movement driver 340 to rotate the nozzle 320, thereby changing the position of the nozzle 320. Furthermore, the control unit 800 executes subsequent measures based on the operating status determination result of the operating status determination unit 700.

[0110] If the operating state determination result of the operating state determination unit 700 is normal, the control unit 800 controls the continued execution of the substrate processing apparatus 10's processing technology; if the operating state determination result is abnormal, the control unit 800 controls the interruption of the processing technology. Furthermore, when the sensing error of the nozzle position sensing sensor 650 exceeds a reference value, the control unit 800 interrupts the processing technology of the substrate processing apparatus 10.

[0111] Furthermore, the control unit 800 is configured to provide reminder information based on the judgment result of the working status judgment unit 700, and to perform automatic recovery when the processing of the substrate processing apparatus 10 is interrupted.

[0112] According to one embodiment of the substrate processing apparatus 10 of the present invention, when a process is executed, the displacement of the processing container 100 or the nozzle 320 can be sensed to determine the appropriate position state corresponding to the corresponding processing process, and subsequent measures based on the false sensing of the position sensing sensor and the malfunction of the substrate processing apparatus can be implemented.

[0113] Furthermore, the substrate processing method of the substrate processing apparatus according to the present invention described above is presented in this invention. Hereinafter, the substrate processing method according to the present invention will be described by way of examples.

[0114] Figure 4 A flowchart illustrating an embodiment of the substrate processing method according to the present invention is shown.

[0115] An embodiment of the substrate processing method according to the present invention includes: an apparatus moving step (S100) in which a processing container 100 or a nozzle 320 is moved to a predetermined position according to the processing process of the substrate processing apparatus 10; a sensor sensing step (S200) in which the moving position of the processing container 100 or the nozzle 320 is sensed by a plurality of position sensing sensors 610, 650; a visual inspection step (S300) in which the positional state of the processing container 100 or the nozzle 320 is checked by a visual sensor 690; and a working state judgment step (S400) in which the sensing results of the position sensing sensors 610, 650 and the inspection results of the visual sensor 690 are combined to determine whether the position sensing sensors 610, 650 are missensing or whether the substrate processing apparatus 10 is malfunctioning. The method may also include a follow-up action step (S500) in which subsequent actions are performed based on the working state judgment result.

[0116] pass Figure 5 The flowchart of the illustrated embodiment further illustrates the sensor sensing step (S200) to the subsequent action step (S500) in the substrate processing method according to the present invention.

[0117] The processing container 100 or nozzle 320 is sensed by the processing container position sensing sensor 610 or nozzle position sensing sensor 650 configured according to the set position (S210), and it is determined whether the processing container 100 or nozzle 320 has moved to the normal position (S230).

[0118] Additionally, the visual sensor 690 captures images of the position of the processing container 100 or nozzle 320 due to movement above the processing container 100 or nozzle 320 (S310), and checks the positional state of the processing container 100 or nozzle 320 (S330). Regarding the positional state check, the operating state determination unit 700 pre-stores normal state information for each position of the processing container 100 or nozzle 320, and compares the captured images of the movement of the processing container 100 or nozzle 320 with the normal state information for each position to check whether the positional state of the processing container 100 or nozzle 320 is normal.

[0119] For example, check the following positional status: store an image of the processing container 100 or nozzle 320 in a normal state in a specific position and compare it with the captured image to check whether the processing container 100 or nozzle 320 has been properly moved to the corresponding position or whether the specific part is misaligned or deviated.

[0120] As an example, when the working state determination unit 700 determines that the sensing result of the processing container position sensing sensor 610 or the nozzle position sensing sensor 650 is an abnormal position (S230), it determines whether the position state of the processing container 100 or the nozzle 320 is normal due to the false sensing of the processing container position sensing sensor 610 or the nozzle position sensing sensor 650 or the malfunction of the substrate processing device 10 (S450) based on the position state inspection result performed by the vision sensor 690.

[0121] For example, if the position of the processing container 100 or the nozzle 320 is determined to be normal (S450), the working state determination unit 700 determines the working state of the processing container position sensing sensor 610 or the nozzle position sensing sensor 650 (S550). If the position state check result performed by the vision sensor 690 is normal, but the sensing result performed by the processing container position sensing sensor 610 or the nozzle position sensing sensor 650 still senses an abnormal position, it is determined to be a false sensing by the processing container position sensing sensor 610 or the nozzle position sensing sensor 650.

[0122] Furthermore, if the operating status determination unit 700 determines that the position status of the processing container 100 or the nozzle 320 is abnormal (S450), it determines that the substrate processing apparatus 10 is malfunctioning. At this time, the position status inspection results performed by the vision sensor 690 can be used to determine whether the processing container movement drivers 520a, 520b, the nozzle support rod 310, or the nozzle movement driver 340 are malfunctioning.

[0123] Furthermore, based on the position status check result of the working status determination unit 700, the control unit 800 controls the substrate processing apparatus 10. If it is determined that the sensing result of the processing container position sensing sensor 610 or the nozzle position sensing sensor 650 is a false sensing, the control unit 800 continues the processing process of the substrate processing apparatus 10 (S570). If it is determined that the substrate processing apparatus 10 is malfunctioning, the control unit 800 interrupts the processing process of the substrate processing apparatus 10 (S520).

[0124] When the processing of the substrate processing apparatus 10 is interrupted, the control unit 800 can provide the administrator with information related to the position status check result of the working status determination unit 700 along with a reminder message. Furthermore, it can also perform automatic recovery (S530) on the part of the substrate processing apparatus 10 that has malfunctioned. Automatic recovery can be achieved by resetting the entire substrate processing apparatus 10 or the part that has malfunctioned.

[0125] Furthermore, the control unit 800 can also determine whether the container position sensing sensor 610 or the nozzle position sensing sensor 650 is faulty based on the number of false sensing events, and provide the manager with fault information accordingly.

[0126] As an example, when the working state determination unit 700 determines that the sensing result obtained by the processing container position sensing sensor 610 or the nozzle position sensing sensor 650 is a normal position, it calculates the position deviation caused by the misalignment or deviation of the processing container 100 or the nozzle 320 based on the position state check result obtained by the vision sensor 690 (S410), and calculates the sensing error of the processing container position sensing sensor 610 or the nozzle position sensing sensor 650 based on the determination that the calculated position deviation exceeds the reference value (S430).

[0127] Regarding the sensing error of the processing container position sensing sensor 610 or the nozzle position sensing sensor 650, the image of the normal state at a specific position of the processing container 100 or the nozzle 320 and the captured image can be compared, the positional deviation related to the degree of misalignment or deviation of the specific part can be calculated and compared with the reference value, thereby calculating the sensing error based on the sensing result of the processing container position sensing sensor 610 or the nozzle position sensing sensor 650.

[0128] Furthermore, the control unit 800 controls the substrate processing apparatus 10 based on the working state determination result of the working state determination unit 700. When the position deviation of the processing container 100 or the nozzle 320 determined by the working state determination unit 700 is within the reference value, the sensing error of the processing container position sensing sensor 610 or the nozzle position sensing sensor 650 is considered to be within the allowable range, and the control unit 800 continues to perform the processing process of the substrate processing apparatus 10 (S570). When the position deviation of the processing container 100 or the nozzle 320 determined by the working state determination unit 700 exceeds the reference value, the working state of the processing container position sensing sensor 610 or the nozzle position sensing sensor 650 is determined to be a fault (S510), and the control unit 800 interrupts the processing process of the substrate processing apparatus 10.

[0129] Furthermore, when the processing of the substrate processing apparatus 10 is interrupted, the control unit 800 can also provide the administrator with fault information caused by the sensing error of the processing container position sensing sensor 610 or the nozzle position sensing sensor 650 along with a reminder message.

[0130] The substrate processing method according to the present invention will be described in more detail below by means of a moving embodiment of the processing container 100 or the nozzle 320.

[0131] Figure 6 An embodiment of the movement position of the sensing processing container 100 according to the present invention is shown.

[0132] The Figure 6 (a) is the position of the processing container 100 when loading and unloading the substrate W. The processing container 100 is raised to a set position by the processing container movement drivers 520a and 520b arranged on both sides of the processing container 100. When the processing container 100 is lowered to the set position for loading and unloading the substrate W, the position of the lower end magnets 620a and 620b of the shaft is sensed by the magnetic sensing members 631a and 631b, which are among the plurality of magnetic sensing members 630a and 630b corresponding to the loading and unloading positions of the substrate W.

[0133] In addition, when the processing container 100 is raised to the corresponding position in order to introduce and draw in the processing fluid according to the type, the processing container 100 is raised to the set position by the processing container movement drivers 520a and 520b arranged on both sides of the processing container 100.

[0134] As described Figure 6As in (b), when the processing container 100 is raised to a set position in order to introduce and draw in the processing fluid through the third recycling box 130, the positions of the lower end magnets 620a and 620b are sensed by one of the plurality of magnetic induction members 632a and 632b corresponding to the introduction and drawing positions of the third recycling box 130.

[0135] Thus, when the processing container 100 is moved to a set position, the position of the processing container is sensed by the processing container position sensing sensor 610.

[0136] In this invention, the detection results from the container position sensing sensor 610 and the inspection results from the vision sensor 690 are combined to determine whether the container position sensing sensor 610 is missensing or whether the substrate processing device 10 is malfunctioning, and this is referred to... Figure 7 as well as Figure 8 Please provide an explanation.

[0137] As described Figure 7 As in (a), when the processing container 100 is raised to a set position in order to introduce and draw in the processing fluid through the third recycling box 130, the positions of the lower end magnets 620a and 620b are sensed by the magnetic induction members 632a and 632b of the plurality of magnetic induction members 630a and 630b that correspond to the introduction and drawing positions of the third recycling box 130.

[0138] Furthermore, as stated Figure 7 As in (b), the visual sensor 690 captures images of the state of the processing container 100 for introducing and pumping processing fluid through the third recycling box 130, and performs an inspection by comparing the captured images with pre-stored normal state information.

[0139] As an example, when as described Figure 7 As in (a), even though the processing container 100 is moved to its normal position to allow the third recovery box 130 to be introduced and the processing fluid to be drawn in, if the processing container position sensing sensor 610 still senses an abnormal position, as described above... Figure 7 If the position of the processing container 100 is checked by the vision sensor 690 and determined to be in a normal state, then it is determined to be a false sensing by the processing container position sensing sensor 610 and the processing process continues.

[0140] As another example, as described Figure 8As in (a), when the processing container 100 is raised to a predetermined position in order to introduce and draw in the processing fluid through the third recovery box 130, although some of the processing container movement drives 520a and 520b disposed on both sides of the processing container 100 work normally, some of the processing container movement drives 520b do not work normally, and therefore, when as described... Figure 8 As in (b), even though the processing container 100 is twisted and fails to move to the normal position, when the processing container position sensing sensor 610b, which is configured on the malfunctioning processing container movement driver 520b, still senses that the processing container is in the normal position, the position status of the processing container 100 is checked by the vision sensor 690, thereby enabling the malfunction of the processing container movement driver 520b to be detected.

[0141] Furthermore, in this invention, the sensing results from the nozzle position sensing sensor 650 and the inspection results from the vision sensor 690 are combined to determine whether the nozzle position sensing sensor 650 is missensing or whether the substrate processing device 10 is malfunctioning, and this is referred to... Figure 9 as well as Figure 10 Please provide an explanation.

[0142] When the nozzle 320 is in the standby position, the nozzle movement driver 340 rotates the nozzle support rod 310 on which the nozzle 320 is disposed, thereby causing the nozzle 320 to rotate and move toward the process position. The rotational movement of the nozzle 320 is sensed by the movement of the magnet 660 disposed on the nozzle support rod 310 by the magnetic induction members 670a and 670b arranged according to the rotation angle.

[0143] As described Figure 9 As in (a), when moving from the standby position of the nozzle 320 to the normal position of the process position, the magnet 660 disposed on the nozzle support rod 310 is sensed by the magnetic induction member 670a.

[0144] Furthermore, as stated Figure 9 As in (b), the position and status of the nozzle 320 are captured by the vision sensor 690, and the captured images and pre-stored normal status information are checked.

[0145] As an example, when as described Figure 9 As in (a), if the nozzle position sensing sensor 650 still senses an abnormal position even though the nozzle 320 has moved to the normal process position, then as described... Figure 9 If the position of the nozzle 320 is checked by the vision sensor 690 and determined to be in a normal state, then it is determined to be a false sensing by the nozzle position sensing sensor 650 and the processing continues.

[0146] As another example, as described Figure 10 In this way, since the nozzle movement driver 340 is not working properly, when the nozzle position sensing sensor 650 still senses the nozzle 320 as being in a normal position even though the nozzle 320 has not moved to the normal position corresponding to the process position C, the position status of the nozzle 320 can be checked by the vision sensor 690, thereby enabling the malfunction of the nozzle movement driver 340.

[0147] Thus, according to the present invention, while sensing the position of the processing container or nozzle by the position sensing sensor, additional inspection is performed by the vision sensor, thereby enabling the detection of false sensing by the position sensing sensor, thus preventing unnecessary interruptions in the processing of the substrate processing apparatus and improving the process yield.

[0148] In particular, when the position sensing sensor detects a container or nozzle as being in the normal position even though it has not moved to the normal position, the abnormal position can be detected by the vision sensor. This can prevent major problems such as the production of a large number of defective products or equipment damage caused by the execution of the process.

[0149] The above description is merely illustrative of the technical concept of the present invention. Those skilled in the art can make various modifications and variations without departing from the essential characteristics of the invention. Therefore, the embodiments described herein are not intended to limit the technical concept of the invention, but rather to provide an explanation. The technical concept of the invention is not limited to such embodiments. The scope of protection of the present invention should be interpreted through the appended claims, and all technical concepts within the same scope should be included within the scope of the claims.

Claims

1. A substrate processing method, characterized in that, include: The instrument movement step involves moving the processing container or nozzle to a predetermined position according to the processing technology of the substrate processing apparatus. The sensor sensing step involves sensing the movement position of the processing container or the nozzle using multiple position sensing sensors. The visual inspection step involves using a visual sensor to check the position and status of the processing container or the nozzle. as well as The working status judgment step combines the sensing results from the position sensing sensor and the inspection results from the vision sensor to determine whether the position sensing sensor is missensing or the substrate processing device is malfunctioning.

2. The substrate processing method according to claim 1, characterized in that, The sensor sensing step uses multiple position sensing sensors configured according to pre-defined positions to sense the movement position. The visual inspection step compares the pre-stored normal state information of each location with the captured images of the moving location to check the position status.

3. The substrate processing method according to claim 2, characterized in that, The sensor sensing step uses multiple magnetic induction components arranged according to the height position of the processing container to sense magnets installed on the lifting units on both sides of the processing container. The visual inspection step checks the positional status of the processing container by comparing an image taken from above the processing container with pre-stored normal status information for each location of the processing container.

4. The substrate processing method according to claim 2, characterized in that, The sensor sensing step uses multiple magnetic induction components arranged according to the rotational position of the nozzle to sense a magnet located on the other side of the nozzle support rod on one side of the nozzle. The visual inspection step checks the positional status of the nozzle by comparing an image taken from above the nozzle with pre-stored normal status information for each position of the nozzle.

5. The substrate processing method according to claim 1, characterized in that, The substrate processing method further includes a follow-up measure step, which involves performing follow-up measures based on the working status judgment result.

6. The substrate processing method according to claim 5, characterized in that, In the working state determination step, if the sensing result from the position sensing sensor indicates an abnormal position, but the position state of the processing container or the nozzle is normal according to the position state check result from the vision sensor, then it is determined that the position sensing sensor has missensed the position. The subsequent steps continue to execute the processing technology of the substrate processing apparatus.

7. The substrate processing method according to claim 5, characterized in that, In the operational status determination step, if the sensing result from the position sensing sensor indicates an abnormal position, and if the position status check result from the vision sensor indicates that the position status of the processing container or the nozzle is abnormal, then the substrate processing device is determined to be malfunctioning. The subsequent steps interrupt the processing of the substrate processing apparatus.

8. The substrate processing method according to claim 6, characterized in that, The subsequent steps provide fault information for the position sensing sensor based on the number of false sensing events.

9. The substrate processing method according to claim 5, characterized in that, In the working state determination step, when the sensing result from the position sensing sensor indicates a normal position, the sensing error of the position sensing sensor is determined based on the position state check result from the vision sensor. In the subsequent steps, when the sensing error of the position sensing sensor exceeds a reference value, the processing of the substrate processing apparatus is interrupted.

10. The substrate processing method according to claim 7 or 9, characterized in that, The follow-up steps provide alert information related to the interruption of the processing of the substrate processing apparatus and perform automatic recovery.

11. A substrate processing apparatus, characterized in that, include: Substrate support unit, supporting the substrate; The processing container provides an open process space above in which the substrate support unit is arranged, and is provided with a recovery box for the process fluid brought in and drawn out by the processing process. A lifting unit is used to raise and lower the processing container to change the relative height of the processing container with respect to the substrate support unit. A container position sensing sensor senses the height position of the processing container based on its vertical movement. A visual sensor captures the position of the processing container from above; as well as The working status determination unit checks the position status of the processing container based on the image captured by the vision sensor, and compares the check result of the position status of the processing container with the sensing result of the processing container position sensing sensor to determine whether the processing container position sensing sensor is missensing or the working status of the substrate processing device is related to malfunction.

12. The substrate processing apparatus according to claim 11, characterized in that, The processing container is equipped with multiple recovery boxes arranged in a multi-level configuration based on height, allowing for the independent introduction and extraction of various processing fluids from the processing process.

13. The substrate processing apparatus according to claim 11, characterized in that, The lifting unit includes: A processing container movement actuator is disposed correspondingly on both outer sides of the processing container, and includes a linkage cylinder that allows a shaft with one end connected to the processing container to move vertically to change the height position of the processing container. The processing container position sensing sensor includes: A magnet, disposed on the shaft; and Multiple magnetic sensing components are configured at a set height to sense the position of the magnet based on the lifting and lowering movement of the axis.

14. The substrate processing apparatus according to claim 11, characterized in that, The substrate processing apparatus further includes: The spraying unit includes a nozzle that rotates between a standby position and a process position to supply processing fluid to the substrate; and A nozzle position sensing sensor senses the rotational position of the nozzle based on its rotational movement. The vision sensor captures the position of the nozzle from above. The working state determination unit checks the position state of the nozzle based on the image captured by the vision sensor, and compares the check result of the nozzle position state with the sensing result of the nozzle position sensing sensor to determine whether the nozzle position sensing sensor is missensing or the substrate processing device is malfunctioning.

15. The substrate processing apparatus according to claim 14, characterized in that, The injection unit includes: The nozzle rotates and moves between a standby position and a process position to supply processing fluid to the substrate; A nozzle support rod, on one side of which the nozzle is disposed and supports the nozzle; and A nozzle movement driver rotates the nozzle support rod about one side of the nozzle support rod to rotate and move the nozzle. The nozzle position sensing sensor includes: A magnet is disposed on the other side of the nozzle support rod; and Multiple magnetic sensing components are configured according to rotation angles to sense the position of the magnet based on the rotational movement of the nozzle support rod.

16. The substrate processing apparatus according to claim 14, characterized in that, The substrate processing apparatus further includes: The control unit controls the relative height of the processing container or the rotation position of the nozzle, and provides reminder information based on the judgment result of the working state judgment unit, and performs interruption and resumption of the processing process of the substrate processing apparatus.

17. The substrate processing apparatus according to claim 16, characterized in that, The operating status determination unit determines that if the sensing result from the processing container position sensing sensor or the nozzle position sensing sensor indicates an abnormal position, and the position status of the processing container or the nozzle is normal according to the position status check result from the vision sensor, then it determines that the position sensing sensor is missensing. The control unit controls the continued execution of the substrate processing apparatus's processing technology based on the working status determination result of the working status determination unit.

18. The substrate processing apparatus according to claim 16, characterized in that, The operating status determination unit determines that the substrate processing apparatus is malfunctioning when the sensing results from the processing container position sensing sensor or the nozzle position sensing sensor indicate an abnormal position, and if the position status check results from the vision sensor indicate that the processing container or the nozzle is also in an abnormal state. The control unit controls the interruption of the substrate processing apparatus's processing technology based on the working status judgment result of the working status judgment unit.

19. The substrate processing apparatus according to claim 16, characterized in that, The operating status determination unit determines whether the sensing error of the position sensing sensor exceeds a reference value based on the position status check result of the processing container or nozzle performed by the vision sensor when the sensing result of the processing container or nozzle is determined to be in a normal position. When the sensing error of the position sensing sensor exceeds a reference value, the control unit interrupts the processing of the substrate processing apparatus.

20. A substrate processing method, characterized in that, include: The equipment movement step involves moving the processing container to a predetermined position according to the processing technology of the substrate processing apparatus. The sensor sensing step involves sensing magnets installed on lifting units on both sides of the processing container using multiple magnetic induction components arranged according to the height position of the processing container. The visual inspection step involves comparing an image taken from above the processing container with pre-stored normal state information for each position of the processing container to check the positional state of the processing container. The working status judgment step is as follows: when the sensing result of the magnetic sensing component is determined to be an abnormal position, the working status of the magnetic sensing component is determined to be either a false sensing or related to the malfunction of the substrate processing device based on the position status inspection result of the visual inspection step; when the sensing result of the magnetic sensing component is determined to be a normal position, the working status caused by the sensing error of the magnetic sensing component is determined based on the position status inspection result of the visual inspection step. as well as The subsequent steps are as follows: if the working status judgment result indicates that the magnetic sensing component is mis-sensing, the processing process continues; if the substrate processing device is malfunctioning or the sensing error of the magnetic sensing component exceeds the reference value, the processing process is interrupted and a reminder message is provided.

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