System and method for manufacturing and assembling a packaged electronic module

Abstract

A system and method of manufacturing and / or assembling a packaged electronic module for a smart card is disclosed. The packaged electronic module can include one or more contact pads, one or more printed circuits, and / or value added components, such as a display.

Description

[0001] Copyright Notice

[0002] This patent document contains copyrighted material. The copyright holder does not object to the reproduction of any related material in this patent document or in the U.S. Patent and Trademark Office documents, but all copyrights are reserved in any such instance.

[0003] Cross-references to related applications

[0004] This application is a continuation in part of U.S. Patent Application 16 / 299,037, which is a continuation in part of U.S. Patent Application 15 / 645,234 (now U.S. Patent 10,268,942), all of which are incorporated herein by reference for all purposes. Technical Field

[0005] This invention relates to electronic modules, including systems and methods for manufacturing and / or assembling electronic modules for use in smart cards. Background Technology

[0006] Smart cards, chip cards, or integrated circuit cards (ICCs) typically consist of credit card-sized cards with embedded integrated circuit (IC) chips and other components. Smart cards are commonly used to control access to resources such as bank or credit card accounts for financial transactions, providing personal identification, authentication, data storage, application processing, and other purposes.

[0007] Many smart cards include a pattern of metal contacts (e.g., a contact plate) to provide electrical connections to an internal chip (e.g., via a card reader).

[0008] Current processes for manufacturing and / or assembling chips, contact plates, and other components within the card require numerous steps and are therefore time-consuming, expensive, and prone to problems.

[0009] Therefore, there is a need for a process for manufacturing and / or assembling packaged electronic modules for use in smart cards that reduces the number of steps, the time required for the process, the cost of the process, and the potential problems. Attached Figure Description

[0010] Various other objects, features, and accompanying advantages of the invention will be fully understood when considered in conjunction with the accompanying drawings, wherein the same reference numerals denote the same or similar parts in multiple views, and wherein:

[0011] Figure 1 Aspects of packaged electronic modules according to exemplary embodiments herein are illustrated;

[0012] Figure 2A Aspects of a contact plate according to exemplary embodiments herein are shown;

[0013] Figure 2B Aspects of a printed circuit according to exemplary embodiments herein are shown;

[0014] Figure 3-9 Aspects of packaged electronic modules according to exemplary embodiments herein are illustrated;

[0015] Figure 10 Aspects of a contact plate strip according to exemplary embodiments herein are shown;

[0016] Figure 11 Aspects of a printed circuit strip according to exemplary embodiments herein are shown;

[0017] Figure 12-13 Aspects of packaged electronic modules according to exemplary embodiments herein are shown; and

[0018] Figure 14 An aspect of an etched contact plate configured with packaged electronic modules according to exemplary embodiments herein is shown. Detailed Implementation

[0019] Typically, and according to exemplary embodiments herein, the present invention includes systems and methods for manufacturing and / or assembling packaged electronic modules that can then be integrated into value-added smart cards (e.g., value-added credit cards, value-added debit cards, etc.).

[0020] In some embodiments, the system and method require only the use of standardized equipment and / or machinery, thereby minimizing the need to develop or purchase new equipment.

[0021] Furthermore, the system and method can use standardized parts (e.g., ISO 7816 contact plates) and procedures to allow existing certifications and / or quality labels to be used on the final product (e.g., Mastercard COM labels for ICM). However, note that other parts that can be standardized and / or non-standardized can also be used.

[0022] Therefore, the present invention provides a system and method for manufacturing and / or assembling integrated packaged electronic modules that are practical, cost-effective and scalable for industrial production.

[0023] Now for reference Figure 1-14 The invention according to exemplary embodiments described herein will be described in more detail. It will be understood that... Figure 1-14 The elements shown may be displayed to scale or not to scale, or may be displayed relative to each other at actual scale.

[0024] Figure 1A general representation of a contact plate 100 electrically configured with printed circuit 200 to form a packaged electronic module 300 is depicted. Contact plate 100 includes a top 102 and a bottom 104, and printed circuit 200 includes a top 202 and a bottom 204. In some embodiments, printed circuit 200 includes electronic components 208 and value-added components 210. In some embodiments, value-added components 210 may include a display, a fingerprint sensor, an LED device, any other type of value-added component, and any combination thereof.

[0025] In some embodiments, the contact plate 100 and the printed circuit 200 are electrically connected via an electrical connector EC. It is understood that... Figure 1 For illustrative purposes only and does not represent the number, architecture, or location of the electrical connectors EC, nor does the number represent the relative size and shape of the contact plate 100, printed circuit 200, or electrical connector EC. In some embodiments, the electrical connector EC includes electrical elements configured with the contact plate 100, electrical elements configured with the printed circuit 200, and / or any combination thereof.

[0026] Two-part assembly #1

[0027] Figure 2A The top 102 and bottom 104 of the contact plate 100 are shown. In one exemplary embodiment herein, the contact plate 100 includes one or more electrical connectors 106 on one surface (e.g., on the bottom 104 of the contact plate 100) and one or more corresponding electrical contacts 108 on an opposite surface (e.g., on the top 102 of the contact plate 100). Each electrical connector 106 is preferably electrically coupled to one or more associated contacts 108, depending on the pin assignment of the packaged electronics module 300.

[0028] Other types of components, such as electronic components 208, one or more antennas, and / or other devices, may also be configured on the lower side 104 of the contact plate 100. In some embodiments, a corresponding area on the printed circuit 200 may be prepared to receive the electronic components 208 when the contact plate 100 and the printed circuit 200 are electrically mated. In other embodiments, devices configured on the lower side 104 of the contact plate 100 may be mounted within a gap formed between the contact plate 100 and the printed circuit when the plate 100 and the circuit 200 are mated. This will be described in other sections.

[0029] In one embodiment shown, the contact plate 100 includes five electrical connectors 106. In other embodiments, the contact plate 100 may include other numbers of electrical connectors 106. For example, if the contact plate 100 includes an antenna or other elements on its underside, the contact plate 100 may include seven electrical connectors 106 (two additional electrical connectors 106 for the antenna). Any other number of electrical connectors 106 may also be used.

[0030] In some embodiments, the contact plate 100 conforms to the ISO 7816 contact plate specification. However, it should be understood that other types of contact plates 100 conforming to other standards may also be used, and the scope of the system 10 is not limited by any type of contact plate 100 that may be used.

[0031] In some embodiments, the electrical connector 106 is formed together with the contact plate 100 during the manufacturing process of the contact plate 100. In other embodiments, the electrical connector 106 is attached to the contact plate 100 using surface mount technology (SMT), conductive adhesive bonding (ACF bonding) with anisotropic conductive adhesive / film, soldering, wire bonding, other attachment techniques, or any combination thereof.

[0032] Figure 2B The top 202 and bottom 204 of the printed circuit 200 are shown. In one exemplary embodiment herein, the printed circuit 202 includes one or more electrical connectors 206 on one surface (e.g., on the top 202 of the printed circuit 202) that are directed to associated electrical components 208 on which the printed circuit 200 is configured, according to the pin assignment of the packaged electronics module 300. In one embodiment shown, the printed circuit 200 includes five electrical connectors 206. However, it should be understood that the printed circuit 200 may include any number of electrical connectors 206.

[0033] In some embodiments, the electrical connector 206 is formed together with the printed circuit 200 during the manufacturing process of the printed circuit 200. In other embodiments, the electrical connector 206 is attached to the printed circuit 200 using surface mount technology (SMT), conductive adhesive bonding (ACF bonding) with anisotropic conductive adhesive / film, soldering, wire bonding, other attachment techniques, or any combination thereof.

[0034] In one exemplary embodiment of the present invention, such as Figure 3As shown, when the contact plate 100 is aligned with the plane above the printed circuit 200 and the electrical connectors 106 of the contact plate face the electrical connectors 206 of the printed circuit, one or more electrical connectors 106 on the contact plate 100 are aligned with at least one of one or more electrical connectors 206 on the printed circuit 200. In a preferred embodiment, one or more electrical connectors 106 on the contact plate 100 are aligned with each corresponding electrical connector 206 on the printed circuit 200. For example, in a preferred embodiment, five electrical connectors 106 on the contact plate (in...) Figure 2A (best seen in the middle) five electrical connectors 206 corresponding to the printed circuit (in Figure 2B (To best see the alignment)

[0035] like Figure 4 As shown, during planar alignment, the contact plate 100 and the printed circuit 200 are engaged such that the desired electrical connector 106 on the contact plate 100 electrically mates with the corresponding electrical connector 206 on the printed circuit 200. This assembles the contact plate 100 and the printed circuit 200 to form an encapsulated electronic module 300. Conductive grease (electroplasty) can be used to mate the electrical connectors 106 and 206 respectively to reduce contact resistance, provide moisture protection, inhibit corrosion, and prevent static electricity buildup. Other mating techniques may also be used.

[0036] In one exemplary embodiment herein, the electronic component 208 is not damaged or harmed in any way by the interaction between the contact plate 100 and the printed circuit 200. In one embodiment, the height of the electronic component 208 (along...) Figure 4 The height of the gap between the contact plate 100 and the printed circuit 200 formed by the mating of the contact plate 100 and the circuit 200 is less than the height of the gap between the contact plate 100 and the printed circuit 200. In one embodiment, the height of the combined electrical connectors 106 and 206 forms a gap between the plate 100 and the circuit 200 that securely houses the electronic components 208.

[0037] In such Figure 5 In one embodiment shown, the cavity formed between the contact plate 100 and the printed circuit 200 in the assembled packaged electronic module 300 can be potted with thermoplastic 302, polyurethane, silicone rubber gel, or other suitable potting materials. This binds the contact plate 100 to the printed circuit 200, helps prevent damage to the module 300 from shock and vibration, and excludes moisture and / or corrosive elements.

[0038] Two-part assembly #2

[0039] In such Figure 6In one exemplary embodiment shown, the electrical connectors 206 of the printed circuit mate with their corresponding electrical connectors 106 on the contact plate 100 before being configured with the printed circuit 200. In this way, the electrical connectors 206 of the printed circuit can serve as extensions of the electrical connectors 106 of the contact plate. In this embodiment, a corresponding region 207 on the printed circuit 200 (e.g., on the top 202 of the printed circuit 200) is adapted to receive the electrical connectors 206. The corresponding region 207 is preferably free of obstructions and ready to receive the electrical connectors 206 when the contact plate 100 and the printed circuit 200 are electrically mated. The corresponding region 207 may include electrical contacts that electrically mate with the electrical connectors 206 to electrically connect the electrical connectors 206 to electrical components 208 and other elements.

[0040] In one embodiment, the combined electrical connectors 106 and 206 can be replaced by a single electrical connector 106, which may include a length substantially equal to that of the combined electrical connectors 106, 206. In this way, by extending from the lower side 104 of the contact plate 100 to a corresponding region 207 on the printed circuit 200 (e.g., on the top 202 of the printed circuit 200), the single (longer) electrical connector 106 can provide the same or similar results as the combined electrical connectors 106, 206.

[0041] Other types of components, such as electronic components 208, one or more antennas, and / or other devices, may also be configured on the lower side 104 of the contact plate 100. In some embodiments, corresponding areas on the printed circuit 200 may be prepared to receive electronic components 208 when the contact plate 100 and the printed circuit 200 are electrically mated. In other embodiments, devices configured on the lower side 104 of the contact plate 100 may be mounted within the gap formed between the contact plate 100 and the printed circuit when the plate 100 and the circuit 200 are mated. This will be described in other sections.

[0042] like Figure 6 As shown, when the contact plate 100 is aligned with the plane above the printed circuit 200 and the electrical connector 106 of the contact plate is configured with an electrical connector 206 of the printed circuit facing the surface of the printed circuit 200, one or more combined electrical connectors 106, 206 on the contact plate 100 are preferably aligned with at least some of the corresponding regions 207 of the electrical connectors 206 on the printed circuit 200 that are ready to receive the printed circuit. In a preferred embodiment, one or more combined electrical connectors 106, 206 on the contact plate 100 are aligned with each corresponding region 207 of the printed circuit 200 that is ready to receive the electrical connectors 206. For example, in a preferred embodiment, five combined electrical connectors 106, 206 on the contact plate 100 (e.g., in a case where...) Figure 2A (as shown in the diagram) and the electrical connector 206 (in which the printed circuit board is prepared to receive the circuit board) Figure 2B The five corresponding regions 207 of the printed circuit in the pattern are aligned.

[0043] like Figure 7 As shown, during planar alignment, the contact plate 100 and the printed circuit 200 are joined, and the desired combination of electrical connectors 106, 206 on the contact plate 100 electrically engages with corresponding areas 207 on the printed circuit 200 ready to receive electrical connector 206. This assembles the contact plate 100 and the printed circuit 200 together to form the packaged electronic module 300.

[0044] In some embodiments, the electrical connector 206 is attached to the following corresponding area 207 on the printed circuit 200: prepared to receive the connector 206 using surface mount technology (SMT), conductive adhesive bonding with anisotropic conductive adhesive / film (ACF bonding), soldering, wire bonding, other attachment techniques or any combination thereof.

[0045] As in other embodiments, the electronic component 208 will not be damaged or harmed in any way by the interaction between the contact plate 100 and the printed circuit 200. In one embodiment, the height of the electronic component 208 (along...) Figure 7 The height of the gap between the contact plate 100 and the printed circuit 200 formed by the engagement of the contact plate 100 and the circuit 200 is less than the height of the gap between the contact plate 100 and the printed circuit 200. In one embodiment, the heights 106 and 206 of the combined electrical connectors form a gap between the plate 100 and the circuit 200 that securely houses the electronic components 208.

[0046] As in other embodiments, the cavity formed between the contact plate 100 and the printed circuit 200 in the assembled packaged electronic module 300 can be potted with thermoplastic, polyurethane, silicone rubber gel, or other suitable potting materials. This binds the contact plate 100 to the printed circuit 200, helps prevent damage to the module 300 from shock and vibration, and excludes moisture and / or corrosive elements.

[0047] N-Part Assembly

[0048] In such Figure 8 In one exemplary embodiment shown, the packaged electronic module 300 may include two or more printed circuits 200A, 200B, ... 200N (which, when combined, form the entire printed circuit 200) and a contact plate 100. For example, the contact plate 100 and... Figure 8 The combination of printed circuit 200A and printed circuit 200B can form Figure 9 The packaged electronic module 300. Although Figure 8Electronic component 208 is depicted as typically disposed on the bottom surface of printed circuit 200A and the top surface of printed circuit 200B. However, it should be understood that electronic component 208 may also be disposed on the upper surface of printed circuit 200A, the lower surface of printed circuit 200B and / or any other surface of printed circuit 200A and / or any surface of printed circuit 200B.

[0049] In one embodiment, the printed circuit 200 (e.g., printed circuit 200A) directly disposed below the contact plate 200 includes electrical connectors 206A aligned with at least some of the electrical connectors 106 on the contact plate. In this way, when the contact plate 100 is configured with the printed circuit 200A, the electrical connectors 206A on the circuit board can electrically engage with the electrical connectors 106 aligned on the contact plate 200.

[0050] In some embodiments, at least some electrical connectors 206A on the top of the printed circuit 200A pass through the printed circuit 200A and are accessible to the lower printed circuit board 200 (e.g., 200B). In some embodiments, the top of the lower printed circuit 200B includes a corresponding region 207 adapted to receive the electrical connectors 206A passing through the printed circuit 200A. The corresponding region 207 is preferably unobstructed and ready to receive the electrical connectors 206A when the upper printed circuit 200A and the lower printed circuit 200B are electrically mated. The corresponding region 207 may include electrical contacts that electrically mate with the electrical connectors 206A to electrically connect the electrical connectors 206A to electrical components 208 and other elements.

[0051] In some embodiments, the upper printed circuit 200A includes an electrical connector 206B that does not pass through the printed circuit 200A but is configured together with the lower surface of the printed circuit 200A, and is adapted to mate with a corresponding region 207 on the lower printed circuit 200A when the printed circuits 200A and 200B are electrically mated. The corresponding region 207 may include electrical contacts that electrically mate with the electrical connector 206B to electrically connect the electrical connector 206B to electrical components 208 and other elements.

[0052] It should be understood that electrical connectors 200A and 200B may be adapted to electrically connect one or more electrical components 208 (configured with printed circuits 200A and / or 200B) to contact plate 100.

[0053] As in other embodiments, the electronic component 208 (included on printed circuits 200A and / or 200B) will not be damaged or harmed in any way by the cooperation of printed circuits 200A and 200B to form printed circuit 200 or by the cooperation of printed circuits 200, 200A and / or 200B with contact plate 100. In one embodiment, the height of the electronic component 208 (along...) Figure 9 The height of the gap in which the component 208 can reside is less than the height of the gap between printed circuits 200A and 200B. For example, the height of the electronic component 208 disposed in the gap between printed circuits 200A and 200B may be less than the height of the gap between printed circuits 200A and 200B. In one embodiment, the height of the electrical connector 206 between circuits 200A and 200B forms a gap between circuits 200A and 200B that securely accommodates the electronic component 208.

[0054] In another example, the height of any electronic component 208 disposed within the gap between the printed circuit 200A and the contact plate 100 may be less than the height of the gap between the printed circuit 200A and the contact plate 100. In one embodiment, the combined electrical connector 106 (on the lower surface of the contact plate 100) and electrical connector 206 (on the upper surface of the printed circuit 200A) form a gap between the plate 100 and the circuit 200A that securely accommodates the electronic component 208.

[0055] As in other embodiments, in the assembled packaged electronic module 300, the cavity formed between the contact plate 100 and the printed circuit 200A, as well as the cavity formed between circuits 200A and 200B, can be potted with thermoplastic, polyurethane, silicone rubber gel, or other suitable potting materials. This binds the contact plate 100 to the printed circuit 200A and the printed circuit 200A to the printed circuit 200B, helping to prevent damage to the module 300 from shock and vibration and to exclude moisture and / or corrosive elements.

[0056] It should be understood that, although the above is about Figure 8 and Figure 9 The described example depicts two printed circuits 200A and 200B configured with contact plate 100 to form packaged electronic module 300; however, any number of printed circuits 200N can be combined with contact plate 100 to form packaged electronic module 300. It should also be understood that the details described above regarding printed circuits 200A and 200B can also relate to any other printed circuits 200N that can be configured together with printed circuits 200A and 200B to form integral printed circuit 200 and / or packaged electronic module 300. It should also be understood that the scope of system 10 is not in any way limited by the number of printed circuits 200N that can be configured with contact plate 100 to form packaged electronic module 300.

[0057] Forming contact plates and / or printed circuits

[0058] In one exemplary embodiment herein, the contact plate 100 and the printed circuit 200 (whether a single printed circuit 200 or a printed circuit 200 including two or more printed circuits 200N) are each formed separately and then combined as described above to form the packaged electronic module 300.

[0059] In such Figure 10 In one exemplary embodiment shown herein, each contact plate 100 is formed as part of a strip 400 comprising a plurality of portions. In some embodiments, the plurality of portions may be identical (e.g., identical contact plates 100), while in other embodiments, these portions may be different or any combination thereof.

[0060] In such Figure 11 In one exemplary embodiment shown herein, each printed circuit 200 is formed as part of a strip 500 comprising a plurality of portions. In some embodiments, the plurality of portions may be identical (e.g., identical printed circuit 200), while in other embodiments, these portions may be different or any combination thereof.

[0061] Although Figure 10 A strip 400 is shown, comprising two rows of side-by-side contact plates 100, and Figure 11 A strip 500 comprising two rows of side-by-side printed circuits 200 is shown; however, it should be understood that strip 400 may include any number of contact plates 100 in any form, and strip 500 may include any number of printed circuits 200 in any form. Preferably, the number and configuration of contact plates 100 included in strip 400 generally match the number and configuration of printed circuits 200 included in strip 500, but this may not be necessary.

[0062] In one exemplary embodiment of this document, the strip 400 of the contact plate 100 may be cut to extract each individual contact plate 100 from the strip 400. In one exemplary embodiment of this document, the strip 500 of the printed circuit 200 may be cut to extract each individual printed circuit 200 from the strip 500. In some embodiments, the strips 400, 500 may each include weakened die-cut lines that define the perimeters of the contact plate 100 and the printed circuit 200, respectively, which may facilitate breaking the strips 400, 500 along the weakened die-cut lines to extract each component 100, 200. In other embodiments, a die-cutting tool or any other type of tool or process may be used to extract individual components from the strips 400 and 500.

[0063] Once the contact plate 100 and the printed circuit 200 are extracted from the strips 400 and 500 respectively, the plate 100 and the circuit 200 can be configured as described in the other sections. It should be understood that any number of printed circuits 200N can be formed on and extracted from any number of strips 500N, and subsequently combined with the contact plate 100.

[0064] In such Figure 12 and 13 In one exemplary embodiment shown herein, the strip 400 of the contact plate 100 is aligned and electrically coupled with the strip 500 of the printed circuit 200 to form a combined strip 600 for encapsulating the electronic module 300. This may be referred to as a roll-to-roll production method for assembling components 100, 200.

[0065] In one exemplary embodiment of this document, the details described in other sections regarding the cooperation of a single contact plate 100 with a single printed circuit 200 (whether a single printed circuit 200 or a printed circuit 200 comprising two or more printed circuits) to form a single packaged electronic module 300 also apply to the band 600 of this embodiment regarding the cooperation of multiple contact plates 100 (as part of band 400) with multiple printed circuits 200 (as part of band 500) to form a corresponding plurality of packaged electronic modules 300.

[0066] It should also be understood that, although the above references Figure 10-13 The described example depicts a combination of two strips (strip 400 of contact plate 100 and strip 500 of printed circuit 200) to form a combined strip 600 of packaged electronic module 300, but any number of strips can be combined to form a combined strip of packaged electronic module 300. For example, strip 400 of contact plate 100 can be combined with a first printed circuit strip 500-1 and a second printed circuit strip 500-2 to form a combined strip 600 of packaged electronic module 300. It should be understood that strip 400 of contact plate 100 can be combined with any number of printed circuit strips 500-N to form strip 600 of packaged electronic module 300.

[0067] In one exemplary embodiment of this document, the resulting strip 600 of the packaged electronic module 300 can be cut to extract each individual packaged electronic module 300 from the strip 600. In some embodiments, strips 400, 500, and 600 may each include a weakened die-cut line defining the perimeter of the packaged electronic module 300, which may facilitate breaking the combined strip 600 along the weakened die-cut line to extract each module 300. In other embodiments, a die-cutting tool or any other type of tool or process may be used to extract the individual packaged electronic modules 300 from the strip 600.

[0068] In one exemplary embodiment of this document, tapes 400 and 500 comprise an industry-standard 35mm width. However, it should be understood that tapes 400 and 500 of any width and of any type can be used.

[0069] Etched contact plate

[0070] In one exemplary embodiment herein, contact plate 100 is etched onto a surface of printed circuit 200. In one embodiment, the etching of contact plate 100 onto printed circuit 200 may be performed during the manufacturing process of printed circuit 200.

[0071] In one embodiment, a mask can be applied to a circuit laminate to protect the copper (or other metal) in the desired contact plate area. The mask can then typically facilitate contact plate formation during the etching process. Once the contact plate is formed, the mask can be removed. Figure 14 The diagram shows the resulting contact plate 100 etched onto the (upper) surface of the printed circuit 200. Note that the contact plate 100 can also be etched into the lower surface of the printed circuit 200, and onto any surface of any circuit board 200N.

[0072] Additional Information

[0073] In any embodiment herein, the printed circuit 200 may include any type of substrate, including but not limited to PI (polyimide), FR-4 (glass fiber), any other type of substrate, and any combination thereof.

[0074] In any embodiment herein, the attachment and / or connection of electronic connector 106 to electrical connector 206 may include the use of SMT, ACF, soldering, wire bonding, any other applicable techniques, and any combination thereof.

[0075] In any embodiment herein, attachment and / or connection of electrical connector 106 and / or electrical connector 206 to corresponding regions 207 adapted to receive electrical connector 106, 206 on a printed circuit may include the use of SMT, ACF, soldering, wire bonding, any other applicable techniques and any combination thereof.

[0076] In any embodiment herein, the attachment and / or connection of electronic component 208 to printed circuits 200, 200A, 200B, ... 200N may include the use of SMT, ACF, soldering, wire bonding, any other applicable techniques, and any combination thereof.

[0077] In any embodiment herein, the physical footprint (size and shape) of the printed circuit 200 may be smaller, substantially the same as, larger than, or in any proportion to the physical footprint (size and shape) of the contact plate 100.

[0078] In any embodiment herein, the contact plate 100 may include a 6-pin design, an 8-pin design, and / or any other number of pins (n-pin) design.

[0079] In any embodiment herein, the augmentation component 210 of the resulting packaged electronic module 300 may be on the same side of the packaged electronic module 300 as the contact plate 100, on the opposite side of the packaged electronic module 300, or on any other side of the packaged electronic module 300.

[0080] In any embodiment herein, printed circuits 200, 200A, 200B, ..., 200N may include an antenna and / or an electronic connector that communicates electrically with an antenna embedded in the smart card body.

[0081] It should be understood that any details, components, elements and / or aspects described with respect to any embodiment herein may also be applied to any other embodiments described herein.

[0082] Those skilled in the art will understand after reading this specification that the embodiments described herein may provide different and / or other advantages, and not all embodiments or implementations need to have all the advantages.

[0083] During the description herein, those skilled in the art will understand that the process can operate without any user intervention. In another embodiment, the process includes some human intervention (e.g., a step performed by a person or with human assistance).

[0084] As used herein, the phrase "at least some" means "one or more," and includes the case of only one. Thus, for example, the phrase "at least some ABCs" means "one or more ABCs," and includes the case of only one ABC.

[0085] As used herein, including in the claims, the term "at least one" should be understood to mean "one or more," and therefore includes two embodiments comprising one or more components. Furthermore, dependent claims referencing an independent claim describing a feature as "at least one" have the same meaning when that feature is referred to as "the at least one" and "the at least one."

[0086] As used in this specification, the term "part" means some or all. Therefore, for example, "part of X" can include some or all of "X". In the context of a dialogue, the term "part" means part or all of the dialogue.

[0087] As used herein, including in the claims, the phrase “use” means “at least use” and is not exclusive. Thus, for example, the phrase “use X” means “at least use X”. Unless specifically stated by the use of the word “only”, the phrase “use X” does not mean “use only X”.

[0088] As used herein, including in the claims, the phrase “based on” means “partially based on” or “at least partially based on”, and is not exclusive. Thus, for example, the phrase “based on factor X” means “partially based on factor X” or “at least partially based on factor X.” Unless specifically stated by the word “only,” the phrase “based on X” does not mean “based solely on X.”

[0089] Generally, as used herein, included in the claims, the word “only” should not be read into the phrase unless it is specifically used in the phrase.

[0090] As used herein, including in the claims, the phrase "different" means "at least partially different". Unless otherwise stated, different does not mean completely different. Thus, for example, the phrase "X is different from Y" means "X is at least partially different from Y", not "X is completely different from Y". Therefore, as used herein, including in the claims, the phrase "X is different from Y" means that X is different from Y at least in some respects.

[0091] It should be understood that the words “first,” “second,” etc., in the specification and claims are used for distinction or identification and are not intended to indicate a sequence or numerical limitation. Similarly, letter labels (e.g., “(A)”, “(B)”, “(C)”, etc., or “(a)”, “(b)”, etc.) and / or numbers (e.g., “(i)”, “(ii)”, etc.) are used to aid readability and to help distinguish and / or identify, and are not intended to otherwise limit or impose or imply any sequence or numerical limitation or order. Similarly, words such as “particular,” “specific,” “definite,” and “given” in the specification and claims, if used, are for distinction or identification and are not intended to otherwise limit.

[0092] As used herein, including in the claims, the terms "a plurality of" and "majority" mean "two or more," and include the case of "two." Thus, for example, the phrase "a plurality of ABCs" means "two or more ABCs," and includes "two ABCs." Similarly, for example, the phrase "a plurality of PQRs" means "two or more PQRs," and includes "two PQRs."

[0093] The present invention also covers precise terms, features, values ​​and ranges, etc., if such terms, features, values ​​and ranges are used with words such as about, approximately, generally, substantially, substantially, at least, etc. (i.e., “about 3” or “approximately 3” should also cover exactly 3 or “substantially constant” should also cover completely constant).

[0094] As used herein, including in the claims, the singular form of a term should be interpreted to also include the plural form, and vice versa, unless the context otherwise indicates. Therefore, it should be noted that, as used herein, the singular forms “a,” “an,” and “the” include plural references unless the context expressly specifies otherwise.

[0095] Throughout the specification and claims, the terms “comprising,” “including,” “having,” and “containing,” and variations thereof, shall be understood to mean “including but not limited to,” and are not intended to exclude other components unless otherwise stated.

[0096] It should be understood that variations can be made to embodiments of the invention while still falling within the scope of the invention. Unless otherwise stated, alternative features serving the same, equivalent, or similar purpose may replace the features disclosed in the specification. Therefore, unless otherwise stated, each disclosed feature represents an example of a range of general, equivalent, or similar features.

[0097] The present invention also covers precise terms, features, values ​​and ranges, etc., if such terms, features, values ​​and ranges are used with terms such as about, approximately, generally, substantially, substantially, at least etc. (i.e., "about 3" should also cover exactly 3 or "substantially constant" should also cover completely constant).

[0098] The use of exemplary language, such as “for instance,” “such as,” “for example,” etc., is intended only to better illustrate the invention and is not intended to limit the scope of the invention unless specifically claimed.

[0099] Although the invention has been described in conjunction with embodiments that are now considered to be the most practical and preferred, it should be understood that the invention is not limited to the disclosed embodiments, but rather is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A method for assembling a packaged electronic module for a smart card, the method comprising the following steps: (A) Provides a first contact plate including a first electrical connector, the first electrical connector being configured with a first surface of the first contact plate; (B) Provides a first printed circuit including a second electrical connector, wherein the second electrical connector is configured with a first surface of the first printed circuit; (C) The contact plate is joined to the printed circuit so that the first electrical connector and the second electrical connector are electrically mated to form an encapsulated electronic module; The first printed circuit includes one or more electronic components, and a first electrical connector of the first printed circuit is electrically connected to at least one of the one or more electronic components; In (C), the electrical engagement of the first electrical connector and the second electrical connector forms a gap between the first surface of the first contact plate and the first surface of the first printed circuit, and wherein at least one of the one or more electronic components is mounted within the gap.

2. The method according to claim 1, wherein, The first surface of the first contact plate includes the bottom of the first contact plate, and the first surface of the first printed circuit includes the top of the first printed circuit.

3. The method according to claim 1, wherein, The first contact plate includes one or more contact points, and a first electrical connector of the first contact plate is electrically connected to at least one of the one or more contact points.

4. The method according to claim 1, wherein, The first printed circuit includes one or more value-added components selected from the group consisting of a display and a fingerprint sensor.

5. The method according to claim 1, wherein, The first contact plate and / or the first printed circuit is configured with an antenna.

6. The method according to claim 1, wherein, The first contact plate is included in the first contact plate strip.

7. The method according to claim 1, wherein, The first printed circuit is included in the first printed circuit strip.

8. A method for assembling and packaging an electronic module according to any one of claims 1 to 7, comprising: A strip containing multiple contact plates is combined with a strip containing multiple printed circuits to form a combined strip of corresponding multiple packaged electronic modules.

9. A method for assembling a packaged electronic module for a smart card, the method comprising the following steps: (A) A first contact plate including a first electrical connector is provided, wherein the first electrical connector is configured with a first surface of the first contact plate; (B) A first printed circuit is provided, which includes a second electrical connector disposed on a first surface of the first printed circuit and a third electrical connector disposed on the second surface of the printed circuit; (C) A second printed circuit is provided, which includes a first contact area on a first surface on which the second printed circuit is disposed; (D) Electrically mating the first electrical connector with the second electrical connector and electrically mating the third electrical connector with the first contact area to form an encapsulated electronic module.

10. The method according to claim 9, wherein, The first surface of the first contact plate includes the bottom of the first contact plate, the first surface of the first printed circuit includes the top of the first printed circuit, the second surface of the first printed circuit includes the bottom of the first printed circuit, and the first surface of the second printed circuit includes the top of the second printed circuit.

11. The method according to claim 9, wherein, The second electrical connector is electrically connected to the third electrical connector.

12. The method according to claim 9, wherein, The first printed circuit includes one or more first electronic components, and a first electrical connector of the first printed circuit is electrically connected to at least one of the one or more first electronic components.

13. The method according to claim 9, wherein, The first contact plate and / or the first printed circuit and / or the second printed circuit are configured with an antenna.

14. The method according to claim 12, wherein, In (D), the electrical engagement of the first electrical connector and the second electrical connector forms a first gap between a first surface of the first contact plate and a first surface of the first printed circuit, and wherein at least one of one or more first electronic components is mounted within the first gap.

15. The method according to claim 9, wherein, The second printed circuit includes one or more second electronic components, and a first contact area of ​​the second printed circuit is electrically connected to at least one of the one or more second electronic components.

16. The method according to claim 15, wherein, In (D), the electrical engagement of the third electrical connector with the first contact area forms a second gap between the second surface of the first printed circuit and the first surface of the second printed circuit, and at least one of one or more second electronic components is mounted within the second gap.

17. The method according to claim 9, wherein, The second printed circuit includes one or more value-added components selected from the group consisting of a display and a fingerprint sensor.

18. The method according to claim 9, wherein, The first contact area includes a fourth electrical connector.

19. The method according to any one of claims 9 to 18, comprising: A strip containing multiple contact plates is combined with a strip containing multiple printed circuits to form a combined strip of corresponding multiple packaged electronic modules.

20. The method according to any one of claims 9 to 18, comprising: The contact plate strip is combined with the first printed circuit strip and the second printed circuit strip to form a combined strip for packaging electronic modules.

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