Display panel and its manufacturing method

Abstract

This application provides a display panel and its manufacturing method, relating to the field of display technology. The display panel includes a display area and a non-display area, and further includes a substrate, a conductive layer, a first encapsulation layer, a second encapsulation layer, and a filler layer. The conductive layer is stacked on the substrate and includes at least one conductive line, with the conductive line located within the non-display area and having grooves on its sidewalls. The first encapsulation layer and the second encapsulation layer are sequentially stacked on the side of the conductive layer facing away from the substrate. The filler layer is located within the non-display area and between the conductive layer and the second encapsulation layer, filling at least a portion of the grooves in the at least one conductive line. In this manner, the problem of display black spots caused by encapsulation failure in the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and its manufacturing method. Background Technology

[0002] With the development of display technology, display panels have been widely used. However, during use, it has been found that cracks can easily appear in the encapsulation layer of display panels, allowing the organic light-emitting materials to come into contact with water and oxygen. This can lead to the failure of the organic light-emitting materials, resulting in black spots on the display and reducing display quality. Summary of the Invention

[0003] A first aspect of this application provides a display panel including a display area and a non-display area. The display panel further includes a substrate, a conductive layer, a first encapsulation layer, a second encapsulation layer, and a fill layer. The conductive layer is stacked on the substrate and includes at least one conductive line located within the non-display area, with grooves on the sidewalls of the conductive line. The first encapsulation layer and the second encapsulation layer are sequentially stacked on the side of the conductive layer facing away from the substrate. The fill layer is located within the non-display area and between the conductive layer and the second encapsulation layer, filling at least a portion of the grooves in the at least one conductive line.

[0004] In the above solution, the filling layer fills at least a portion of the groove of at least one conductor, so that when the first or second encapsulation layer is formed, it will not be affected by the filled groove to form a thinner film that is recessed compared to other parts. This reduces the risk of the first or second encapsulation layer breaking under high temperature and high humidity conditions, thereby improving the problem of black spots appearing on the display when the first and / or second encapsulation layers fail.

[0005] In conjunction with the first aspect, in some embodiments, the filler layer fills all the grooves on the sidewalls of the conductor.

[0006] In the above scheme, all the grooves on the sidewall of the conductor are filled with a filler layer, which prevents the first or second encapsulation layer from becoming significantly thinner at the sidewall of the conductor during film formation, further reducing the risk of encapsulation layer breakage.

[0007] In conjunction with the first aspect, in some embodiments, the orthographic projection of the upper surface of the filler layer away from the substrate onto the substrate lies within the orthographic projection of the lower surface of the filler layer towards the substrate onto the substrate.

[0008] In the above scheme, the filler layer can extend the film formation path of the first encapsulation layer or the second encapsulation layer, improve the film formation quality of the first encapsulation layer or the second encapsulation layer, thereby reducing the risk of cracks on the first encapsulation layer or the second encapsulation layer.

[0009] In conjunction with the first aspect, in some embodiments, the entire filler layer is located within the groove.

[0010] In the above solution, the filling layer does not increase the film thickness in the non-display area of ​​the display panel, thus improving the problem of display black spots without affecting the thinness of the display panel.

[0011] In conjunction with the first aspect, in some embodiments, the first encapsulation layer and the second encapsulation layer are inorganic film layers, and the filler layer is an organic film layer.

[0012] In the above scheme, the filling layer utilizes the fluidity of organic matter to effectively fill the grooves on the sidewalls of the wires, improving the filling effect and efficiency, thereby saving production costs.

[0013] In conjunction with the first aspect, in some embodiments, the display panel further includes a third encapsulation layer located between the first and second encapsulation layers, and this third encapsulation layer is located in the display area and is an organic film layer. Further, the organic film layer is made of a polymer.

[0014] In the above scheme, the third encapsulation layer, as an organic film layer, releases the stress on the inorganic film layers of the first and second encapsulation layers. Furthermore, the third encapsulation layer not only effectively covers foreign matter generated during the encapsulation process, preventing punctures to the inorganic film layers in the display panel, but also effectively extends the moisture intrusion channel, thereby delaying the failure time of the display panel components.

[0015] In conjunction with the first aspect, in some embodiments, the filler layer is located between the first encapsulation layer and the second encapsulation layer.

[0016] In the above scheme, the position of the filler layer allows it to be manufactured in the same layer and with the same process as the third encapsulation layer between the first and second encapsulation layers, thereby saving processes and reducing production costs.

[0017] In conjunction with the first aspect, in some embodiments, the material of the filler layer is the same as the material of the third encapsulation layer.

[0018] In the above scheme, the filling layer and the third encapsulation layer use the same material, which can improve the processing efficiency of the display panel and save production costs.

[0019] In conjunction with the first aspect, in some embodiments, the display panel further includes a display function layer located in the display area, the substrate includes a driving circuit layer located in the display area, the driving circuit layer is used to drive the display function layer, and the wires are electrically connected to the driving circuit layer.

[0020] In conjunction with the first aspect, in some embodiments, the area of ​​the non-display area far from the display area includes a bend area, and the conductor is located between the display area and the bend area.

[0021] A second aspect of this application provides a method for fabricating a display panel. The method includes providing a substrate, the substrate including a display area and a non-display area. A conductive layer is formed on the substrate, the conductive layer including at least one conductive wire located in the non-display area, and a groove is formed on the sidewall of the conductive wire. Within the non-display area, a filling layer is formed on the side of the conductive layer opposite to the substrate, the filling layer filling at least a portion of the groove of the conductive wire.

[0022] In conjunction with the second aspect, in some embodiments, the method for manufacturing the display panel further includes forming an encapsulation layer on the side of the conductive layer facing away from the substrate. The encapsulation layer includes a first encapsulation layer, a third encapsulation layer, and a second encapsulation layer sequentially formed on the substrate. The first and second encapsulation layers are inorganic film layers, and the third encapsulation layer is an organic film layer. Further, the filler layer is an organic film layer.

[0023] In conjunction with the second aspect, in some embodiments, the filler layer and the third encapsulation layer are formed in the same layer and from the same material. Furthermore, the filler layer and the third encapsulation layer are formed by inkjet printing. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the planar structure of a portion of a display panel according to an embodiment of this application.

[0025] Figure 2 This is a cross-sectional view of a portion of a display panel according to an embodiment of this application, which includes... Figure 1 The diagram shows a cross-sectional view of the display panel along M1N1.

[0026] Figure 3 This application Figure 1 The diagram shows a cross-sectional view of the display panel along M2N2.

[0027] Figure 4A This is a schematic diagram of the structure of the first signal line in an ideal design according to an embodiment of this application.

[0028] Figure 4B This is a schematic diagram of the actual structure of the first signal line according to an embodiment of this application.

[0029] Figure 5 yes Figure 3 An enlarged view of the S area of ​​the display panel.

[0030] Figure 6 This is a schematic diagram of the planar structure of a portion of the display panel according to another embodiment of this application.

[0031] Figure 7 This is a cross-sectional view of a portion of a display panel according to an embodiment of this application, which includes... Figure 6 The diagram shows a cross-sectional view of the display panel along M1N1.

[0032] Figure 8 This is a cross-sectional view of a portion of a display panel according to an embodiment of this application, which includes... Figure 6 The diagram shows a cross-sectional view of the display panel along M2N2.

[0033] Figure 9 This is a cross-sectional view of a portion of a display panel according to another embodiment of this application, which includes... Figure 6 The diagram shows a cross-sectional view of the display panel along M2N2.

[0034] Figure 10 This is a cross-sectional view of a portion of a display panel according to another embodiment of this application, which includes... Figure 6 The diagram shows a cross-sectional view of the display panel along M2N2.

[0035] Figure 11 This is a cross-sectional view of a portion of a display panel according to another embodiment of this application, which includes... Figure 6 The diagram shows a cross-sectional view of the display panel along M2N2.

[0036] Figure 12 This is a flowchart of a method for preparing a display panel according to one embodiment of this application.

[0037] Figure 13 This is a flowchart of another method for preparing a display panel according to one embodiment of this application. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0039] In the manufacturing process of display panels, conductive layers can be deposited on the surface of a substrate using processes such as chemical vapor deposition or magnetron sputtering. The conductive layer includes at least two metal layers with different corrosion resistance. Therefore, when the patterned conductive layer forms at least one wire, grooves will be formed on the sidewalls of the wire due to the different corrosion resistance of the metal layers contained in the wire layer. In other words, the metal layer with lower corrosion resistance will be corroded away more.

[0040] Furthermore, to improve the quality and lifespan of display panels, thin-film encapsulation (TFE) is typically used to encapsulate them. The encapsulation layer formed using TFE includes inorganic and organic layers. The inorganic layer acts as a barrier against moisture and oxygen, while the organic layer relieves stress and flattens the inorganic layer. Specifically, methods for preparing inorganic layers include plasma-enhanced chemical vapor deposition (PECVD), magnetron sputtering, and atomic layer deposition (ALD). For example, in production practice, PECVD is commonly used to deposit inorganic layers such as silicon nitride, silicon oxynitride, and silicon oxide at low temperatures (e.g., <90°C) to form the inorganic layer. The groove on the sidewall of at least one conductor in the conductive layer cannot be blocked by a metal mask during the inorganic film fabrication process. This will affect the deposition of the inorganic film, making the film thickness at the groove thinner. This also makes the inorganic film at this location prone to breakage in high temperature and high humidity environments, thus causing encapsulation failure and resulting in black spots on the display.

[0041] This application provides a display panel that reduces the impact of the grooves on the thickness of the inorganic film layer by providing a filling layer that fills at least part of the grooves on the sidewalls of the conductors, thereby reducing the risk of encapsulation failure and the probability of black spots appearing on the display.

[0042] This application provides a display panel, such as... Figure 1 As shown, the display panel includes a display area AA and a non-display area DA. Figure 2 and Figure 3As shown, the display panel further includes a substrate 1, a conductive layer 2, a filler layer 3, a first encapsulation layer 4, and a second encapsulation layer 5. The conductive layer 2 is stacked on the substrate 1 and includes at least one conductive line 21 located within the non-display area DA. The sidewall of the conductive line 21 has a groove 22. The first encapsulation layer 4 and the second encapsulation layer 5 are sequentially stacked on the side of the conductive layer 2 facing away from the substrate 1. The filler layer 3 is located within the non-display area DA and between the conductive layer 2 and the second encapsulation layer 5, filling at least a portion of the groove 22 of the at least one conductive line 21. By filling at least a portion of the groove 22 of at least one conductor 21 with the filling layer 3, the influence of the groove 22 on the sidewall of the conductor 21 on the film formation of the first encapsulation layer 4 and / or the second encapsulation layer 5 is reduced. When the first encapsulation layer 4 and / or the second encapsulation layer 5 pass through the filled groove 22 during film formation, the film thickness is not affected by the groove 22, forming a thinner, recessed film that is relatively thinner than other parts. This reduces the risk of the first encapsulation layer 4 and / or the second encapsulation layer 5 breaking under high temperature and high humidity conditions, thereby improving the problem of display black spots caused by the failure of the first encapsulation layer 4 and / or the second encapsulation layer 5.

[0043] For example, regarding the structure of the wire, for instance, Figure 4A and 4B As shown, the conductive wire 21 includes a first metal layer 211, a second metal layer 212, and a third metal layer 213 stacked sequentially. For example, the first metal layer 211 and the third metal layer 213 are made of the same material, titanium (Ti), while the second metal layer 212 is made of a different material than the other metal layers, namely aluminum (Al). Ideally, the conductive wire 21 formed on the substrate 1 is as follows... Figure 4A As shown, the three metal layers, namely the Ti-Al-Ti metal layers, are flush with the edges of the conductor 21. However, in actual production, during the patterning of the conductive layer, the film layer containing the conductor 21 will be corroded, and different metals have different corrosion resistance; for example, Ti has greater corrosion resistance than Al. Therefore, the actual structure of the conductor is as follows. Figure 4B As shown, due to the length of corrosion of the second metal layer 212 ( Figure 4B (As shown by the dashed line) are respectively compared to the length of the first metal layer 211 that has been corroded ( Figure 4B (shown by the dashed line) and the length of corrosion of the third metal layer 213 ( Figure 4B As shown by the dashed line, the length of the conductor (the length of the conductor) creates a groove 22 on the side wall.

[0044] Specifically, the analysis of the influence of the grooves on the sidewalls of the conductors on the film formation quality of the first and second encapsulation layers is as follows. For example... Figure 3 and Figure 5As shown, grooves 22 are formed on the left and right sidewalls, respectively, along the extension direction of the conductor 21. No filling layer 3 is provided on the left sidewall of the conductor 21 to fill the grooves 22 thereon. Figure 5 As shown, the first encapsulation layer 4 and the second encapsulation layer 5 are affected by the shape of the groove 22 on the left side wall. During film formation, the film thickness is relatively thinner than in other locations, especially the second encapsulation layer 5, which is more significantly affected, with the film thickness at the groove 22 being thinner than at other locations. Therefore, the first encapsulation layer 4 and especially the second encapsulation layer 5 at the groove 22 are prone to breakage, leading to encapsulation failure and water and oxygen intrusion, causing black spots to appear on the display. Figure 3 As shown, the groove 22 on the right side wall of the conductor 21 is filled by the filling layer 3. Correspondingly, the film thickness of the first encapsulation layer 4 and the second encapsulation layer 5 is not affected by the groove 22 filled on the right side wall of the conductor 21.

[0045] It should be understood that the structure of the conductive lines is not limited to a three-layer Ti-Al-Ti structure; multi-layer structures can also be made using other metallic materials, such as using molybdenum to create at least one metal layer. The filler layer can be single-layer or multi-layer. The substrate includes the substrate itself and other film layers, such as an insulating layer disposed between the substrate and the conductive lines. The appropriate conductive line structure can be selected based on the requirements of the display panel and the manufacturing process.

[0046] Based on the above analysis, it is clear that the recessed morphology formed by the grooves on the sidewalls of the conductors directly affects the film thickness of the first encapsulation layer and / or the second encapsulation layer. Therefore, in some embodiments, a filler layer fills all the grooves on the sidewalls of the conductors. This prevents the grooves on the sidewalls of the conductors from affecting the film quality of the first encapsulation layer and / or the second encapsulation layer, further reducing the risk of failure of the first encapsulation layer and / or the second encapsulation layer, and thus reducing the probability of display black spots appearing on the display panel.

[0047] For example, such as Figure 6 , Figure 7 and Figure 8 As shown, the conductive layer 2 of the display panel includes two conductive lines 21, both located within the non-display area of ​​the display panel. All grooves on the sidewalls of each conductive line 21, specifically the left and right sidewalls opposite each other in its extension direction, are filled with a filling layer 3. This prevents significant thinning of the film thickness at the left and right sidewalls of the two conductive lines 21 during the formation of the first encapsulation layer 4 and the second encapsulation layer 5. This further reduces the risk of breakage at the sidewalls of the conductive lines 21, thereby further improving the problem of display black spots caused by the failure of the first encapsulation layer 4 and / or the second encapsulation layer 5.

[0048] It should be understood that the number of conductors included in the conductive layer of the display panel, the direction of each conductor, and the distribution between the conductors are not limited to... Figure 1 and Figure 6 The solutions shown can all be designed according to the requirements of the display panel. Furthermore, the structure of the filling layer is not limited to... Figure 6 The scheme shown allows the filling layers on the sidewalls of different conductors to be either separate independent films or the same film. Alternatively, the filling layers on the left and right sidewalls of each conductor can be either separate independent films or the same film. These options can be selected based on production requirements and process conditions, and will not be elaborated upon here.

[0049] In addition to improving the display black spot problem by reducing the risk of breakage of the first and / or second encapsulation layers, the problem can also be improved by increasing the film formation quality of the first and second encapsulation layers. In some embodiments, the orthographic projection of the upper surface of the filler layer away from the substrate onto the substrate lies within the orthographic projection of the lower surface of the filler layer towards the substrate onto the substrate. The sidewalls of the filler layer extend the film formation path of the first and / or second encapsulation layers, facilitating film formation of the first or second encapsulation layers and improving the film formation quality of the first and / or second encapsulation layers, thereby reducing the risk of cracks on the first and / or second encapsulation layers and further improving the display black spot problem caused by encapsulation failure.

[0050] For example, such as Figure 9 As shown, all grooves on the left side wall of each conductor 21 are filled with filling layer 31, and all grooves on the right side wall of each conductor are filled with filling layer 32. The structures of the filling layer 31 on the left side wall and the filling layer 32 on the right side wall are different. Specifically, the orthographic projection of the filling layer 31 on the substrate 1 away from the upper surface of the substrate 1 completely coincides with the orthographic projection of the filling layer 31 on the substrate 1 towards the lower surface of the substrate 1. The orthographic projection of the filling layer 32 on the right side wall away from the upper surface of the substrate 1 lies within the orthographic projection of the filling layer 32 on the substrate 1 towards the lower surface of the substrate 1. In other words, the side connecting the upper and lower surfaces of the filling layer 32 on the right side wall away from the groove direction is a slope. Compared to the filling layer 31 on the left side wall, this extends the film formation path of the first encapsulation layer 4 and / or the second encapsulation layer 5, improves the film formation quality of the first encapsulation layer 4 and / or the second encapsulation layer 5, and reduces the risk of breakage of the first encapsulation layer 4 and / or the second encapsulation layer 5.

[0051] It should be understood that the structure of the filling layer corresponding to the left and right walls of each conductor can be the same or different, and... Figure 9In the structure of the filling layer corresponding to the right side wall of the conductor shown, the angle between the side connecting the upper and lower surfaces of the filling layer and the surface where the substrate is located can be either an obtuse angle or an acute angle. These can be selected according to the requirements of the display panel and actual production, and will not be elaborated here.

[0052] Besides improving the display panel's competitiveness by addressing the black spots caused by encapsulation layer failure, other aspects can also be considered to enhance the display panel's competitiveness. In some embodiments, such as... Figure 10 As shown, the filling layer 3 is entirely located within the groove. The filling layer 3 does not extend outside the groove, meaning that the orthographic projection of the filling layer 3 on the substrate 1 completely coincides with the orthographic projection of the groove on the sidewall of the conductor 21 on the substrate 1. In other words, the filling layer 3 will not extend to the surface of the substrate 1 facing the conductor 21 to form a film. Therefore, after the first encapsulation layer 4 and the second encapsulation layer 5 are formed directly along the sidewall of the conductor, they will be formed directly on the surface of the substrate 1 facing the conductor 21. The thickness of the film layer in the non-display area of ​​the display panel will not increase due to the filling layer 3. Thus, while improving the problem of display black spots, it does not affect the thinness of the display panel, thereby improving the market competitiveness of the display panel.

[0053] It should be understood that the ideal structural design is for the filling layer to be completely located within the groove on the sidewall of the conductor. However, due to limitations in the manufacturing process or within the allowable error range in production, a small portion of the organic layer may extend out of the groove onto the substrate surface facing the conductor 21.

[0054] Furthermore, this embodiment also considers improving the filling effect and efficiency. In some embodiments, the first and second encapsulation layers are inorganic film layers, and the filling layer is an organic film layer. Utilizing the fluidity of organic materials, the filling layer can efficiently and effectively fill the grooves on the sidewalls of the wires, saving production costs.

[0055] Regarding the common thin-film encapsulation used in display panels, the encapsulation layer formed includes, in addition to a first encapsulation layer and a second encapsulation layer formed by inorganic film layers, an organic film layer. In some embodiments, such as... Figure 7 As shown, the display panel also includes a third encapsulation layer 6, which is located between the first encapsulation layer 4 and the second encapsulation layer 5. This third encapsulation layer 6 is located in the display area AA and is an organic film layer. Furthermore, the material of the organic film layer is a polymer. As an organic film layer, the third encapsulation layer 6 utilizes the good plasticity of the polymer to release stress on the inorganic film layer. On the other hand, the organic film layer 6 with a certain thickness can not only effectively cover foreign matter generated during the display panel manufacturing process, preventing the inorganic film layer in the display panel from being punctured, but also effectively extend the moisture intrusion channel, thereby delaying the failure time of the display panel components.

[0056] Based on the display panel's packaging structure and process, in order to improve the packaging layer failure problem while saving production costs, this embodiment also provides a different approach. Figures 6-10 The illustrated filling layer 3 is located between the substrate 1 and the first encapsulation layer 4. In some embodiments, such as... Figure 11 As shown, the filler layer 3 is located between the first encapsulation layer 4 and the second encapsulation layer 5. Figure 5 It is known that the groove on the sidewall of the conductor 21 has a greater impact on the film thickness and quality of the second encapsulation layer 5 at the sidewall of the conductor 21 than on the film thickness and quality of the first encapsulation layer 4 at the sidewall of the conductor 21. Furthermore, whether the second encapsulation layer 5 breaks has a significant impact on the overall encapsulation effect of the display panel. Therefore, the filler layer 3 provided between the first encapsulation layer 4 and the second encapsulation layer 5 can improve the film quality of the second encapsulation layer 5, enhance the water and oxygen resistance of the encapsulation layer of the display panel, and thus effectively improve the display black spot problem caused by encapsulation failure. In addition, the filler layer 3, as an organic film layer, is also located between the first encapsulation layer 4 and the second encapsulation layer 5, and in a different area of ​​the display panel, similar to the third encapsulation layer 6. It can be prepared using the same process as the organic film layer of the third encapsulation layer 6, saving processes and reducing production costs.

[0057] Based on the design that the third encapsulation layer is an organic film layer and is located within the display area, in at least one embodiment, the display panel further includes a barrier dam to prevent the third encapsulation layer from overflowing into the non-display area.

[0058] For example, such as Figure 1 and Figure 6 As shown, the display panel includes two barrier dams 7, and the height of the barrier dam 7 closer to the display area AA in the direction away from the substrate 1 is smaller than the height of the barrier dam 7 farther from the display area AA in the direction away from the substrate 1. The barrier dams 7 can prevent liquid from overflowing into the non-display area AA or the display area DA during the fabrication of the organic film layer in the display area AA or the non-display area DA, thereby improving the processing efficiency of the display panel. Furthermore, [the following text appears to be incomplete and requires further context: "made by..."] Figure 1 and Figure 6 It can be seen that the sidewalls of the conductors 21 in the non-display area DA of the display panel are provided with filling layers 3 to fill the grooves on the sidewalls of the conductors, which are not affected by the blocking dam 7.

[0059] It should be understood that the location and number of barrier dams, as well as the parameters of each barrier dam such as height and width, are not limited to the solution provided in this embodiment. Appropriate technical solutions can be designed and selected according to the functional requirements of the display panel and the processing conditions.

[0060] In addition to saving display panel costs by using the same layer and process for the filler layer and the third encapsulation layer, in some embodiments, the filler layer is made of the same material as the third encapsulation layer. Using the same material for both the filler layer and the third encapsulation layer eliminates the need for material design for the filler layer and eliminates the need to replace the raw materials for the filler layer during the display panel manufacturing process, thus improving processing efficiency and saving production costs.

[0061] It should be understood that the material of the filler layer is not limited to the same material as the third encapsulation layer. It can be doped with the material of the third encapsulation layer as a base to meet the new functional requirements of the display panel.

[0062] Regarding the role of wires located in non-display areas within the display panel, in some embodiments, such as... Figure 2 The display panel shown also includes a display function layer located in the display area AA. The substrate 1 includes a driving circuit layer 2 located in the display area. The conductive layer 2 is part or all of the film layer of the driving circuit layer. The driving circuit layer 2 is used to drive the display function layer 8. The wires 21 are electrically connected to the driving circuit layer 2. Multiple display electrodes of the driving circuit layer 2 extend to the non-display area DA and are electrically connected to multiple wires 21. The wires 21 are also electrically connected to the leads of the driving chip that controls the light emission of the display function layer 8.

[0063] It should be understood that the display functional layer includes a pixel defining layer, an organic light-emitting layer, and a second electrode, which are sequentially stacked on the substrate in a direction away from the substrate. The driving circuit layer includes an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, a source / drain electrode, and a conductive layer, which are sequentially stacked on the substrate in a direction away from the substrate. Multiple wires are electrically connected to the source / drain electrode and the gate electrode.

[0064] The display panel can also be flexible and bendable. For example... Figure 1 and Figure 6 As shown, in some embodiments, the area of ​​the non-display area DA that is far from the display area AA includes the bending area BB, and the wire 21 is located between the display area AA and the bending area BB.

[0065] It should be understood that the choice of substrate material is crucial to whether a display panel has flexible bending capabilities. When the display panel does not have flexible bending capabilities, the substrate can be made of at least one material, such as glass or plastic. When the display panel has flexible bending capabilities, the substrate can be made of a flexible polyimide material. Furthermore, the substrate can be made of a transparent material, and when the display panel is a front-emitting type, the substrate can be made of an opaque material. The appropriate material can be selected to prepare the substrate according to production requirements.

[0066] This application also provides a display device. The display device includes any of the display panels provided in the first aspect described above.

[0067] For example, in some embodiments, the display device includes a display area, a non-display area, and a bent area located in the non-display area away from the display area, and a filling layer is disposed in a groove on the sidewall of a wire disposed between the display area and the bent area.

[0068] For example, at least one embodiment of the display device provided in this application further includes a touch sensor, a touch chip, and a flexible circuit board for implementing touch control. To achieve a thinner and lighter touch display panel, the touch sensor is disposed in the encapsulation layer of the display panel, the touch chip is disposed on the flexible circuit board, and signals are transmitted to the touch sensor via touch signal lines.

[0069] For example, the display device in the embodiments of this application can be any product or component with display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, navigator, circular wearable product, etc.

[0070] This application also provides a method for manufacturing a display panel, such as... Figure 12 As shown, the manufacturing method of this display panel specifically includes the following steps.

[0071] S01: Provide a substrate, which includes a display area and a non-display area.

[0072] S02: A conductive layer is formed on a substrate. The conductive layer includes at least one wire, which is located in a non-display area and has a groove formed on its sidewall.

[0073] S03: In the non-display area, a filling layer is formed on the side of the conductive layer away from the substrate, and the filling layer fills at least a portion of the groove of at least one wire.

[0074] Specifically, the filling layer is an organic film layer.

[0075] S04: An encapsulation layer is formed on the side of the conductive layer away from the substrate. The encapsulation layer includes a first encapsulation layer, a third encapsulation layer and a second encapsulation layer formed sequentially on the substrate. The first encapsulation layer and the second encapsulation layer are inorganic film layers located in the display area and the non-display area. The third encapsulation layer is an organic film layer located in the display area.

[0076] This application also provides another method for manufacturing a display panel, such as... Figure 13 As shown, the manufacturing method of this display panel specifically includes the following steps.

[0077] S001: Provide a substrate, which includes a display area and a non-display area.

[0078] S002: A conductive layer is formed on a substrate. The conductive layer includes at least one wire located in a non-display area, and a groove is formed on the sidewall of the wire.

[0079] S003: A first encapsulation layer is formed on the side of the conductive layer away from the substrate. The first encapsulation layer is an inorganic film layer and is located in the display area and non-display area.

[0080] S004: A third encapsulation layer is formed on the side of the first encapsulation layer away from the substrate. The third encapsulation layer is an organic film layer and is located in the display area. At the same time, a filling layer is formed on the side of the first encapsulation layer away from the substrate. The filling layer is located in the non-display area and fills the groove on the sidewall of the conductor.

[0081] Specifically, the filler layer and the third encapsulation layer are organic film layers, and the filler layer and the third encapsulation layer are formed in the same layer and of the same material. Furthermore, the filler layer and the third encapsulation layer are formed by inkjet printing.

[0082] S005: A second encapsulation layer is formed on the side of the third encapsulation layer away from the substrate, and the second encapsulation layer is located in the display area and the non-display area.

[0083] It should be understood that the manufacturing method of the display panel is not limited to the exemplary schemes described above. The manufacturing method can be adjusted according to the position of the filler layer, the functional requirements of the display panel, and the actual production conditions. For example, in a scheme where the filler layer is not located between the first and second encapsulation layers, the formation process of the filler layer can be set as an independent step, but it can still be formed using the same materials and processes as the organic film layer of the third encapsulation layer, which will not be elaborated upon here.

[0084] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display panel, characterized by, The display panel comprises a display area and a non-display area, and further comprises: a substrate; a conductive layer stacked on the substrate, comprising at least one conductive wire, the conductive wire being located in the non-display area, and a side wall of the conductive wire having a groove; a first encapsulation layer and a second encapsulation layer stacked in sequence on a side of the conductive layer away from the substrate, the first encapsulation layer and the second encapsulation layer being inorganic film layers; and a filling layer located in the non-display area and between the first encapsulation layer and the second encapsulation layer, filling at least part of the groove of the at least one conductive wire, the filling layer being an organic film layer, a top surface of the filling layer away from the substrate being projected on the substrate within a projection of a bottom surface of the filling layer toward the substrate on the substrate, and a side surface connecting the top surface of the filling layer and the bottom surface of the filling layer being at an obtuse angle or an acute angle with a plane on which the substrate is located.

2. The display panel of claim 1, wherein, The filling layer fills all the grooves on the side wall of the conductive wire.

3. The display panel of claim 2, wherein, The filling layer is entirely located in the groove.

4. The display panel of any one of claims 1-3, wherein, Further comprising a third encapsulation layer located between the first encapsulation layer and the second encapsulation layer, the third encapsulation layer being located in the display area and being an organic film layer.

5. The display panel of claim 4, wherein, The material of the filling layer is the same as that of the third encapsulation layer.

6. The display panel of claim 1, wherein, Further comprising a display functional layer located in the display area, the substrate comprising a driving circuit layer located in the display area, the driving circuit layer being used to drive the display functional layer, and the conductive wire being electrically connected with the driving circuit layer.

7. The display panel of claim 1, wherein, The area of the non-display area away from the display area comprises a bending area, and the conductive wire is located between the display area and the bending area.

8. A method for manufacturing a display panel, characterized by, The method comprises: providing a substrate, the substrate comprising a display area and a non-display area; forming a conductive layer on the substrate, the conductive layer comprising at least one conductive wire, the conductive wire being located in the non-display area, and a side wall of the conductive wire having a groove; forming an encapsulation layer on a side of the conductive layer away from the substrate, the encapsulation layer comprising a first encapsulation layer, a third encapsulation layer and a second encapsulation layer formed in sequence on the substrate, the first encapsulation layer and the second encapsulation layer being inorganic film layers, and the third encapsulation layer being an organic film layer; forming a filling layer on a side of the conductive layer away from the substrate in the non-display area, the filling layer filling at least part of the groove of the conductive wire, the filling layer being an organic film layer, a top surface of the filling layer away from the substrate being projected on the substrate within a projection of a bottom surface of the filling layer toward the substrate on the substrate, and a side surface connecting the top surface of the filling layer and the bottom surface of the filling layer being at an obtuse angle or an acute angle with a plane on which the substrate is located.

9. The method of manufacturing a display panel according to claim 8, wherein, The filling layer is formed in the same layer and with the same material as the third encapsulation layer.

10. The method of manufacturing a display panel according to claim 9, wherein, The filling layer and the third encapsulation layer are formed by inkjet printing.

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