Display panel, preparation method thereof and display device

Abstract

The application discloses a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a first planarization layer, a first protective layer, a first partition layer and a first organic encapsulation layer. A gas-permeable opening is formed on the first protective layer, so that water vapor on one side of the first planarization layer can be discharged through the gas-permeable opening, thereby improving the problem that the first protective layer is prone to delamination due to the fact that water vapor on one side of the first planarization layer cannot be discharged. The first partition layer is arranged on the side of a pixel definition layer away from the substrate, and the first partition layer covers the gas-permeable opening, so as to partition the first planarization layer and the first organic encapsulation layer. The first partition layer improves the problem that the first planarization layer is prone to contact the first organic encapsulation layer through the first opening due to the first opening in the pixel definition layer, water vapor in the first planarization layer is prone to be released towards the first organic encapsulation layer, and dark spots are prone to occur in reliability tests. The display panel improves the display effect and use performance of the display panel.

Description

Technical Field

[0001] This application relates to the field of displays, specifically to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] In traditional display panel manufacturing, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision, high development costs, and long development cycles. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance aspects, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0005] This application provides a display panel, a method for manufacturing the same, and a display device, aiming to improve the performance of OLED display products.

[0006] A first aspect of this application provides a display panel having adjacent display areas and non-display areas. The display panel includes: a substrate; a first planarization layer located on one side of the substrate; a first protective layer located on the side of the first planarization layer facing away from the substrate, the first protective layer having a vent opening, the first planarization layer being exposed in the vent opening, the vent opening being located in the non-display area; a pixel definition layer located on the side of the first protective layer facing away from the substrate, the orthographic projection of the pixel definition layer onto the substrate covering at least a portion of the orthographic projection of the vent opening onto the substrate; a first partition layer located on the side of the pixel definition layer facing away from the substrate, at least a portion of the orthographic projection of the vent opening onto the substrate being within the orthographic projection of the first partition layer onto the substrate; and a first organic encapsulation layer located on the side of the first partition layer facing away from the substrate.

[0007] According to an embodiment of the first aspect of this application, the pixel definition layer includes at least one first opening, and the first opening and the vent opening are connected.

[0008] According to any of the foregoing embodiments of the first aspect of this application, among the plurality of ventilation openings, a portion of the ventilation openings are connected to a plurality of first openings, and another portion of the ventilation openings are located within the orthogonal projection of the pixel limiting portion onto the substrate.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a first inorganic encapsulation layer located between the pixel definition layer and the first organic encapsulation layer, and a portion of the first partition layer located between the first inorganic encapsulation layer and the first organic encapsulation layer.

[0010] According to any of the foregoing embodiments of the first aspect of this application, in the display area, a portion of the first partition layer is located between the first inorganic encapsulation layer and the first organic encapsulation layer.

[0011] According to any of the foregoing embodiments of the first aspect of this application, in the non-display area, a portion of the first partition layer is located between the pixel definition layer and the first organic encapsulation layer.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a second inorganic encapsulation layer located on the side of the first organic encapsulation layer away from the substrate.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the first partition layer and the second inorganic encapsulation layer are made of the same material.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the first partition layer is greater than or equal to the maximum thickness of the second inorganic encapsulation layer.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a second organic encapsulation layer located on the side of the second inorganic encapsulation layer facing away from the substrate; and a third inorganic encapsulation layer located on the side of the second organic encapsulation layer facing away from the substrate.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the first organic encapsulation layer and the second organic encapsulation layer are made of the same material.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the second inorganic encapsulation layer and the third inorganic encapsulation layer are made of the same material.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the first organic encapsulation layer is less than or equal to the maximum thickness of the second organic encapsulation layer.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the first protective layer includes an inorganic protective layer and a conductive protective layer, the conductive protective layer being located on the side of the inorganic protective layer away from the substrate, and the vent opening penetrating the conductive protective layer and the inorganic protective layer.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a plurality of light-emitting units, located in the display area and including a first electrode, a light-emitting structure and a second electrode arranged in sequence, the first electrode being located on the side of the pixel defining portion facing the substrate, at least a portion of the light-emitting structure being located in the pixel opening, and the second electrode being located on the side of the light-emitting structure facing away from the substrate.

[0021] According to any of the foregoing embodiments of the first aspect of this application, at least a portion of the first electrode is exposed through the pixel opening.

[0022] According to any of the foregoing embodiments of the first aspect of this application, at least a portion of the first electrode and the first protective layer are in the same layer.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a dam located on one side of the substrate and in the non-display area, and a first planarization layer located on the side of the dam facing the display area.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the thickness of the first partition layer is 0.4 μm to 1 μm.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: an isolation structure located on the side of the first protective layer away from the substrate, the isolation structure enclosing an isolation opening, and the pixel opening and the isolation opening being connected.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first layer and a second layer located on the side of the first layer away from the substrate, wherein the two sides of the second layer protrude toward the isolation opening compared to the first layer.

[0027] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third layer located on the side of the first layer facing the substrate, at least one side of the third layer protruding from the first layer towards the isolation opening.

[0028] A second aspect of this application provides a display panel having adjacent display areas and non-display areas. The display panel includes: a substrate; a first planarization layer located on one side of the substrate; a first protective layer located on the side of the first planarization layer facing away from the substrate, the first protective layer having a vent opening, the first planarization layer being exposed in the vent opening, the vent opening being located in the non-display area; a pixel definition layer located on the side of the first protective layer facing away from the substrate, the orthographic projection of the pixel definition layer onto the substrate covering at least a portion of the orthographic projection of the vent opening onto the substrate; an isolation structure located on the side of the first protective layer facing away from the substrate, the isolation structure enclosing to form an isolation opening, the pixel opening and the isolation opening being connected; a first partition layer located on the side of the pixel definition layer facing away from the substrate, at least a portion of the orthographic projection of the vent opening onto the substrate being within the orthographic projection of the first partition layer onto the substrate; a first organic encapsulation layer located on the side of the first partition layer facing away from the substrate; a first inorganic encapsulation layer located between the pixel definition layer and the first organic encapsulation layer, a portion of the first partition layer being located between the first inorganic encapsulation layer and the first organic encapsulation layer.

[0029] An embodiment of the third aspect of this application provides a method for manufacturing a display panel, the display panel having adjacent display areas and non-display areas, the method comprising:

[0030] A first planarization layer, a first protective layer, and a pixel definition layer are sequentially prepared on a substrate. A venting opening is formed on the first protective layer, and the first planarization layer is exposed in the venting opening. The venting opening is located in a non-display area, and the orthographic projection of the pixel definition layer on the substrate covers at least a portion of the orthographic projection of the venting opening on the substrate.

[0031] A first inorganic encapsulation layer is fabricated on the side of the pixel definition layer that faces away from the substrate;

[0032] A first barrier layer is prepared on the side of the first inorganic encapsulation layer away from the substrate, and at least a portion of the vent openings are located within the orthogonal projection of the first barrier layer onto the substrate.

[0033] A first organic encapsulation layer is prepared on the side of the first partition layer that is away from the substrate.

[0034] According to an embodiment of the third aspect of this application, after the step of preparing the first organic encapsulation layer on the side of the first partition layer facing away from the substrate, the method further includes:

[0035] A second inorganic encapsulation layer is prepared on the side of the first organic encapsulation layer that is away from the substrate.

[0036] According to any of the foregoing embodiments of the third aspect of this application, the first partition layer and the second inorganic encapsulation layer are made of the same material.

[0037] According to any of the foregoing embodiments of the third aspect of this application, the maximum thickness of the first partition layer is greater than or equal to the maximum thickness of the second inorganic encapsulation layer.

[0038] According to any of the foregoing embodiments of the third aspect of this application, after the step of preparing the second inorganic encapsulation layer on the side of the first organic encapsulation layer facing away from the substrate, the method further includes:

[0039] A second organic encapsulation layer and a third inorganic encapsulation layer are sequentially prepared on the side of the second inorganic encapsulation layer away from the substrate.

[0040] According to any of the foregoing embodiments of the third aspect of this application, the first organic encapsulation layer and the second organic encapsulation layer are made of the same material.

[0041] According to any of the foregoing embodiments of the third aspect of this application, the second inorganic encapsulation layer and the third inorganic encapsulation layer are made of the same material.

[0042] According to any of the foregoing embodiments of the third aspect of this application, the maximum thickness of the first organic encapsulation layer is greater than or equal to the maximum thickness of the second organic encapsulation layer.

[0043] An embodiment of the fourth aspect of this application provides a display device, which includes a display panel of any of the above embodiments or a display panel prepared by the preparation method of the display panel of any of the above embodiments.

[0044] According to an embodiment of this application, the display panel has adjacent display and non-display areas, with the display area used for light emission display. The display panel includes a substrate, a first planarization layer, a first protective layer, a first isolation layer, and a first organic encapsulation layer. A venting opening is provided on the first protective layer, allowing moisture from one side of the first planarization layer to escape through the venting opening, thus mitigating problems such as film peeling from the first protective layer due to moisture not escaping from the first planarization layer. A pixel definition layer defines the setting area of ​​each light-emitting structure, reducing color crosstalk between the light-emitting structures. A first isolation layer is provided on the side of the pixel definition layer facing away from the substrate, covering the venting opening to isolate the first planarization layer and the first organic encapsulation layer. This improves the problem of dark spots easily appearing in reliability tests due to the first opening in the pixel definition portion causing contact between the first planarization layer and the first organic encapsulation layer, resulting in moisture from the first planarization layer releasing towards the first organic encapsulation layer. This improves the display effect and performance of the display panel. Attached Figure Description

[0045] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0046] Figure 1 This is a top view schematic diagram of a display panel provided in an embodiment of this application;

[0047] Figure 2 This is a partial cross-sectional view of the non-display area of ​​a display panel provided in an embodiment of this application;

[0048] Figure 3 This is a partial cross-sectional view of the display area of ​​a display panel provided in an embodiment of this application;

[0049] Figure 4 This is a partial cross-sectional view of the non-display area of ​​the display panel in another embodiment;

[0050] Figure 5 This is a partial cross-sectional view of the non-display area of ​​the display panel in yet another embodiment;

[0051] Figure 6 This is a partial cross-sectional view of the non-display area of ​​the display panel in another embodiment;

[0052] Figure 7 This is a partial cross-sectional view of the non-display area of ​​the display panel in another embodiment;

[0053] Figure 8 This is a partial cross-sectional view of the display area of ​​the display panel in another embodiment;

[0054] Figure 9 This is a top view of the display panel in another embodiment;

[0055] Figure 10 This is a partial cross-sectional view of the display area of ​​the display panel in another embodiment;

[0056] Figure 11 This is a partial cross-sectional view of the display area of ​​the display panel in another embodiment;

[0057] Figure 12 This is a schematic diagram of a pixel circuit provided in an embodiment of this application;

[0058] Figure 13 This is a flowchart illustrating the fabrication process of a display panel according to an embodiment of this application.

[0059] Explanation of reference numerals in the attached figures:

[0060] 10. Display panel; AA, display area; NA, non-display area;

[0061] 100, Substrate; 110, First planarization layer; 120, First protective layer; 121, Inorganic protective layer; 122, Conductive protective layer; 123, Vent opening; 130, First isolation layer; 140, Dam;

[0062] 200. Isolation structure; 210. First layer; 220. Second layer; 230. Third layer; 240. Isolation opening;

[0063] 300, Light-emitting unit; 310, First electrode; 320, Light-emitting structure; 330, Second electrode;

[0064] 400, Pixel definition layer; 410, Pixel limiting part; 420, Pixel opening; 430, First opening;

[0065] 500, First inorganic encapsulation layer; 510, First organic encapsulation layer; 520, Second inorganic encapsulation layer; 530, Second organic encapsulation layer; 540, Third inorganic encapsulation layer;

[0066] 600, pixel circuit. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0068] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0069] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0070] For certain elements, terms like "above" or "over" are sometimes used when describing their location, while "below" or "under" is used when describing the location of an element in the opposite direction. Furthermore, when using terms like "above," "over," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only situations where the two elements are directly adjacent but also situations where they are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for descriptive distinction and should not be interpreted as indicating or implying relative importance.

[0071] This application provides a display panel 10, its manufacturing method, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel 10, its manufacturing method, and the display device.

[0072] This application provides a display panel 10, which may be an organic light-emitting diode (OLED) display panel 10.

[0073] The display panel 10 can be an organic light-emitting diode (OLED) display panel 10 or a quantum dot (QLED) electroluminescent display panel 10.

[0074] Please see Figure 1 , Figure 1 This is a top view schematic diagram of a display panel provided in an embodiment of this application.

[0075] like Figure 1 As shown, the display panel 10 includes a display area AA with display function and a non-display area NA.

[0076] The shape of the display area AA of the display panel 10 can be rectangular, square, circular, oval, or other shapes.

[0077] The display area AA includes a plurality of pixels arranged in a first direction and a second direction. Each pixel includes a plurality of sub-pixels that display different colors. In some embodiments, a pixel includes a first sub-pixel, a second sub-pixel, and a third sub-pixel; for example, the first sub-pixel is a blue sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a red sub-pixel. In some embodiments, in addition to including a first sub-pixel, a second sub-pixel, and a third sub-pixel, a pixel also includes a sub-pixel that emits white or other colored light.

[0078] A subpixel includes a pixel circuit and a light-emitting unit driven by the pixel circuit to emit light of the corresponding color. A first subpixel includes a first light-emitting unit, a second subpixel includes a second light-emitting unit, and a third subpixel includes a third light-emitting unit. One pixel circuit drives at least one light-emitting unit to emit light. For example, a display area AA includes a normal display area AA and a light-transmitting display area AA. The light-transmitting display area AA is a display area AA that corresponds to a sensor and has light-transmitting properties, while the normal display area AA is a display area AA that does not correspond to a sensor. In the normal display area AA, one pixel circuit drives one light-emitting unit to emit light, and in the light-transmitting display area AA, one pixel circuit drives one or more light-emitting units to emit light.

[0079] Please refer to the following: Figures 1 to 3 , Figure 2 This is a partial cross-sectional view of the non-display area of ​​a display panel provided in an embodiment of this application; Figure 3 This is a partial cross-sectional view of the display area of ​​a display panel provided in an embodiment of this application.

[0080] like Figures 1 to 3 As shown, a first aspect embodiment of this application provides a display panel 10, which has adjacent display areas AA and non-display areas NA. The display panel 10 includes: a substrate 100; a first planarization layer 110 located on one side of the substrate 100; a first protective layer 120 located on the side of the first planarization layer 110 facing away from the substrate 100, wherein the first protective layer 120 has a vent opening 123, the first planarization layer 110 is exposed in the vent opening 123, and the vent opening 123 is located in the non-display area NA; pixel positioning. A pixel definition layer 400 is located on the side of the first protective layer 120 opposite to the substrate 100, and the orthogonal projection of the pixel definition layer 400 onto the substrate 100 covers at least a portion of the orthogonal projection of the vent opening 123 onto the substrate 100; a first partition layer 130 is located on the side of the pixel definition layer 400 opposite to the substrate 100, and at least a portion of the orthogonal projection of the vent opening 123 onto the substrate 100 lies within the orthogonal projection of the first partition layer 130 onto the substrate 100; a first organic encapsulation layer 510 is located on the side of the first partition layer 130 opposite to the substrate 100.

[0081] Optionally, the pixel definition layer 400 includes at least one first opening 430, which is connected to the vent opening 123. According to an embodiment of this application, the display panel 10 has adjacent display areas AA and non-display areas NA, where the display areas AA are used for light emission display. The display panel 10 includes a substrate 100, a first planarization layer 110, a first protective layer 120, a first partition layer 130, and a first organic encapsulation layer 510. A vent opening 123 is provided on the first protective layer 120, allowing moisture on one side of the first planarization layer 110 to escape through the vent opening 123, thereby improving the problem of moisture not escaping from one side of the first planarization layer 110, which could cause film peeling from the first protective layer 120. The pixel definition layer 400 defines the setting area of ​​each light-emitting structure 320, reducing color crosstalk between the light-emitting structures 320. A first isolation layer 130 is provided on the side of the pixel definition layer 400 facing away from the substrate 100. The first isolation layer 130 covers the vent opening 123 to isolate the first planarization layer 110 and the first organic encapsulation layer 510. This improves the problem that when the pixel definition portion 410 has a first opening 430, the first planarization layer 110 and the first organic encapsulation layer 510 come into contact through the first opening 430, and moisture from the first planarization layer 110 is released toward the first organic encapsulation layer 510, which can easily cause dark spots in reliability tests. This improves the display effect and performance of the display panel 10.

[0082] The first opening 430 may be an over-etching of the pixel definition layer 400 caused by subsequent processes on the pixel definition portion 410.

[0083] Optionally, the pixel definition layer 400 includes a pixel defining portion 410 and a pixel opening 420 formed by the pixel defining portion 410. The pixel opening 420 is located in the display area AA, and the pixel defining portion 410 has a first opening 430 located in the non-display area NA.

[0084] Optionally, the material of the pixel limiting part 410 may include inorganic materials.

[0085] Optionally, the material of the first planarization layer 110 may include an organic material.

[0086] Optionally, the material of the first partition layer 130 may include inorganic materials.

[0087] Optionally, the material of the first inorganic encapsulation layer 500 may include inorganic materials.

[0088] Optionally, the material of the first organic encapsulation layer 510 may include organic materials.

[0089] In some alternative embodiments, a portion of the plurality of ventilation openings 123 are connected to a plurality of first openings 430, and another portion of the ventilation openings 123 are projected onto the substrate 100 within the projection of the pixel limiting portion 410 onto the substrate 100.

[0090] In these optional embodiments, a portion of the ventilation openings 123 correspond to first openings 430, which are covered by a first partition layer 130 to isolate the first planarization layer 110 and the first organic encapsulation layer 510. This mitigates the problem of moisture from the first planarization layer 110 releasing towards the first organic encapsulation layer 510 through the first opening 430 in the pixel defining portion 410, which could lead to dark spots during reliability testing. Another portion of the ventilation openings 123 are directly covered by the pixel defining portion 410 to further isolate the first planarization layer 110 and the first organic encapsulation layer 510.

[0091] Optionally, another portion of the ventilation openings 123 are projected onto the substrate 100 within the projection of the first partition layer 130 onto the substrate 100. The first partition layer 130 and the pixel defining portion 410 double-cover the ventilation openings 123 to further prevent the first planarization layer 110 and the first organic package from contacting each other through the ventilation openings 123.

[0092] In some optional embodiments, the display panel 10 further includes: a first inorganic encapsulation layer 500 located between the pixel definition layer 400 and the first organic encapsulation layer 510, and a portion of the first partition layer 130 located between the first inorganic encapsulation layer 500 and the first organic encapsulation layer 510.

[0093] In these alternative embodiments, after the formation of the first inorganic encapsulation layer 500 and between the formation of the first organic encapsulation layer 510, the first partition layer 130 is used to cover the first opening 430 at the location where the first opening 430 is formed, so as to prevent the first planarization layer 110 from contacting the first organic encapsulation layer 510 through the first opening 430.

[0094] Optionally, within the display area AA, a portion of the first partition layer 130 is located between the first inorganic encapsulation layer 500 and the first organic encapsulation layer 510.

[0095] Optionally, within the non-display area NA, a portion of the first partition layer 130 is located between the pixel definition layer 400 and the first organic encapsulation layer 510.

[0096] Please see Figure 4 and Figure 5 , Figure 4 This is a partial cross-sectional view of the non-display area of ​​the display panel in another embodiment; Figure 5 This is a partial cross-sectional view of the non-display area of ​​the display panel in another embodiment.

[0097] like Figure 4 and Figure 5 As shown, in some optional embodiments, the display panel 10 further includes a second inorganic encapsulation layer 520 located on the side of the first organic encapsulation layer 510 away from the substrate 100.

[0098] In these alternative embodiments, the first inorganic encapsulation layer 500, the first organic encapsulation layer 510, and the second inorganic encapsulation layer 520 form a three-layer thin film evaporator (TFE) to improve the encapsulation performance of the display panel 10.

[0099] In some alternative embodiments, the first partition layer 130 is made of the same material as the second inorganic encapsulation layer 520.

[0100] In these alternative embodiments, the first partition layer 130 and the second inorganic encapsulation layer 520 can be fabricated using the same process, and the first partition layer 130 and the second inorganic encapsulation layer 520 can share the same mask, which can reduce the development and use of the mask, reduce the fabrication cost, and simplify the fabrication process.

[0101] In some alternative embodiments, the maximum thickness of the first partition layer 130 is greater than or equal to the maximum thickness of the second inorganic encapsulation layer 520.

[0102] In these alternative embodiments, foreign matter may be generated during the fabrication of the pixel definition layer 400 or the first inorganic encapsulation layer 500. This foreign matter can cause a hole-like first opening 430 in the pixel definition portion 410, allowing the first planarization layer 110 and the first organic encapsulation layer 510 to contact. Therefore, a greater thickness is provided for the first partition layer 130 to ensure that it can cover the foreign matter, thereby mitigating encapsulation failure caused by the foreign matter.

[0103] Please see Figure 6 , Figure 6 This is a partial cross-sectional view of the non-display area of ​​the display panel in another embodiment.

[0104] like Figure 6 As shown, in some optional embodiments, the display panel 10 further includes: a second organic encapsulation layer 530 located on the side of the second inorganic encapsulation layer 520 away from the substrate 100; and a third inorganic encapsulation layer 540 located on the side of the second organic encapsulation layer 530 away from the substrate 100.

[0105] In these alternative embodiments, in addition to the three-layer encapsulation of the first inorganic encapsulation layer 500, the first organic encapsulation layer 510, and the second inorganic encapsulation layer 520, a second organic encapsulation layer 530 is additionally provided to further enhance the encapsulation effect and reduce the possibility of dark spots appearing in reliability tests.

[0106] Optionally, the material of the second inorganic encapsulation layer 520 may include inorganic materials.

[0107] Optionally, the material of the second organic encapsulation layer 530 may include organic materials.

[0108] Optionally, the material of the third inorganic encapsulation layer 540 may include inorganic materials.

[0109] In some alternative embodiments, the first organic encapsulation layer 510 and the second organic encapsulation layer 530 are made of the same material.

[0110] In these alternative embodiments, the first organic encapsulation layer 510 and the second organic encapsulation layer 530 can be fabricated using the same process, and the first organic encapsulation layer 510 and the second organic encapsulation layer 530 can share the same mask, simplifying the fabrication process.

[0111] In some alternative embodiments, the second inorganic encapsulation layer 520 and the third inorganic encapsulation layer 540 are made of the same material.

[0112] In these alternative embodiments, the second inorganic encapsulation layer 520 and the third inorganic encapsulation layer 540 can be fabricated using the same process, and the second inorganic encapsulation layer 520 and the third inorganic encapsulation layer 540 can share the same mask, simplifying the fabrication process.

[0113] In some alternative embodiments, the maximum thickness of the first organic encapsulation layer 510 is less than or equal to the maximum thickness of the second organic encapsulation layer 530.

[0114] In these alternative embodiments, foreign matter may be generated during the formation of the second inorganic encapsulation layer 520, which can lead to dark spots during reliability testing. Therefore, setting a greater thickness for the second organic encapsulation layer 530 ensures that the second organic encapsulation layer 530 can cover the foreign matter, thereby improving encapsulation failure caused by foreign matter.

[0115] Optionally, the thickness of the second inorganic encapsulation layer 520 is equal to the thickness of the third inorganic encapsulation layer 540. The second inorganic encapsulation layer 520 and the third inorganic encapsulation layer 540 can be prepared using the same process, simplifying the preparation process.

[0116] In some optional embodiments, the first protective layer 120 includes an inorganic protective layer 121 and a conductive protective layer 122, with the conductive protective layer 122 located on the side of the inorganic protective layer 121 away from the substrate 100, and the vent opening 123 penetrating through the conductive protective layer 122 and the inorganic protective layer 121.

[0117] In these optional embodiments, since the adhesion between the inorganic protective layer 121 and the first planarization layer 110 is greater than that between the conductive protective layer 122 and the first planarization layer 110, the inorganic protective layer 121 is disposed between the conductive protective layer 122 and the first planarization layer 110, acting as an adhesive to improve the problem of low adhesion between the conductive protective layer 122 and the first planarization layer 110, which easily leads to film peeling. Furthermore, the material of the first planarization layer 110 includes organic materials, which have even lower adhesion to the conductive protective layer 122 after absorbing water, making peeling more likely. Therefore, disposing of the inorganic protective layer 121 between the first planarization layer 110 and the conductive protective layer 122 can effectively improve the above-mentioned problems. Moreover, the conductive protective layer 122 can form a shield between signals near the substrate 100 and signals far from the substrate 100, thereby improving crosstalk between signals on both sides. After the material coating of the first planarization layer 110 is completed, the first planarization layer 110 needs to be baked and cured. Within two hours of curing, the inorganic protective layer 121 is coated to prevent the first planarization layer 110 from absorbing water, which would reduce the adhesion of the upper surface and cause peeling. During the preparation of the conductive protective layer 122, it needs to be baked. During baking, the internal moisture of the first planarization layer 110 can be released through the vent opening 123, thereby reducing the peeling problem caused by water absorption by the first planarization layer 110.

[0118] Optionally, the conductive protective layer 122 is connected to a fixed potential signal to further improve the shielding effect of the conductive protective layer 122.

[0119] like Figures 1 to 6 As shown, optionally, the display panel 10 further includes: a plurality of light-emitting units 300, located in the display area AA and including a first electrode 310, a light-emitting structure 320 and a second electrode 330 stacked in sequence. The first electrode 310 is located on the side of the pixel limiting portion 410 facing the substrate 100, at least a portion of the light-emitting structure 320 is located in the pixel opening 420, and the second electrode 330 is located on the side of the light-emitting structure 320 away from the substrate 100.

[0120] The first electrode 310 can be an anode, and the second electrode 330 can be a cathode. The first electrode 310 of each light-emitting unit 300 can be connected to the pixel circuit 600 through a first via, so that the pixel circuit 600 drives the light-emitting device to emit light.

[0121] Optionally, at least a portion of the first electrode 310 is exposed through the pixel opening 420.

[0122] In some alternative embodiments, at least a portion of the first electrode 310 and the first protective layer 120 are co-layered.

[0123] In these alternative embodiments, at least a portion of the first protective layer 120 can be fabricated simultaneously with the first electrode 310 to simplify the fabrication process.

[0124] Optionally, the conductive protective layer 122 of the first protective layer 120 is disposed in the same layer as the first electrode 310, and the conductive protective layer 122 and the first electrode 310 can be prepared simultaneously, simplifying the preparation process.

[0125] Please see Figures 1 to 7 , Figure 7 This is a partial cross-sectional view of the non-display area of ​​the display panel in another embodiment.

[0126] like Figures 1 to 7 In some alternative embodiments, the display panel 10 further includes: a dam 140 located on one side of the substrate 100 and in the non-display area NA, and a first planarization layer 110 located on the side of the dam 140 facing the display area AA.

[0127] In these optional embodiments, during the fabrication of the first organic encapsulation layer 510 and the second organic encapsulation layer 530, the dam 140 can block the first organic encapsulation layer 510 and the second organic encapsulation layer 530 to prevent them from overflowing to the side of the dam 140 away from the display area AA. Furthermore, the dam 140 can block water and oxygen on the side away from the display area AA and increase the water and oxygen intrusion path, thereby improving the performance of the display panel 10.

[0128] Optionally, the dam 140 and the first planarization layer 110 are set in the same layer, and the dam 140 and the first planarization layer 110 can be prepared simultaneously, simplifying the preparation process.

[0129] In some alternative embodiments, the thickness of the first partition layer 130 is 0.4 μm to 1 μm. For example, the thickness of the first partition layer 130 is 0.4 μm, 0.5 μm, 0.7 μm, 1 μm, etc.

[0130] In these optional embodiments, the thickness of the first partition layer 130 is greater than or equal to 0.4 μm, which can improve the problem that the first partition layer 130 has poor moisture barrier capability due to its small thickness, and that it is difficult for the first partition layer 130 to completely cover foreign objects, resulting in dark spots easily appearing on the display panel 10 after reliability testing. The thickness of the first partition layer 130 is less than or equal to 1 μm, which can improve the problem that the material cost of the first partition layer 130 is too high due to its large thickness, and that the overall film thickness of the display panel 10 is too large.

[0131] Optionally, the first partition layer 130 and the second inorganic encapsulation layer 520 are made of the same material, and the thickness of the first partition layer 130 is 0.4 μm to 1 μm. The first partition layer 130 and the second inorganic encapsulation layer 520 can be prepared using the same process, and the first partition layer 130 and the second inorganic encapsulation layer 520 can share the same mask, simplifying the preparation process. A thickness greater than or equal to 0.4 μm for the first partition layer 130 can mitigate the problem of poor moisture barrier properties and difficulty in completely encapsulating foreign matter, which can lead to dark spots on the display panel 10 after reliability testing, caused by an excessively thin first partition layer 130. A thickness less than or equal to 1 μm for the first partition layer 130 can mitigate the problem of excessive material cost and overall excessive film thickness of the display panel 10, caused by an excessively thick first partition layer 130.

[0132] Optionally, the first partition layer 130 and the second inorganic encapsulation layer 520 are made of the same material. The thickness of the first partition layer 130 is 0.4μm~1μm. The first protective layer 120 includes an inorganic protective layer 121 and a conductive protective layer 122. The conductive protective layer 122 is located on the side of the inorganic protective layer 121 away from the substrate 100. The vent opening 123 penetrates the conductive protective layer 122 and the inorganic protective layer 121.

[0133] In these optional embodiments, since the adhesion between the inorganic protective layer 121 and the first planarization layer 110 is greater than that between the conductive protective layer 122 and the first planarization layer 110, the inorganic protective layer 121 is disposed between the conductive protective layer 122 and the first planarization layer 110, acting as an adhesive to improve the problem of low adhesion between the conductive protective layer 122 and the first planarization layer 110, which easily leads to film peeling. Furthermore, the material of the first planarization layer 110 includes organic materials, which have even lower adhesion to the conductive protective layer 122 after absorbing water, making peeling more likely. Therefore, disposing of the inorganic protective layer 121 between the first planarization layer 110 and the conductive protective layer 122 can effectively improve the above-mentioned problems. Moreover, the conductive protective layer 122 can form a shield between signals near the substrate 100 and signals far from the substrate 100, thereby improving crosstalk between signals on both sides.

[0134] Optionally, the display panel 10 further includes: a first inorganic encapsulation layer 500 located between the pixel defining portion 410 and the first organic encapsulation layer 510, and a portion of the first partition layer 130 located between the first inorganic encapsulation layer 500 and the first organic encapsulation layer 510; a second organic encapsulation layer 530 located on the side of the second inorganic encapsulation layer 520 away from the substrate 100; and a third inorganic encapsulation layer 540 located on the side of the second organic encapsulation layer 530 away from the substrate 100. The thickness of the first partition layer 130 is greater than or equal to the thickness of the second inorganic encapsulation layer 520, the thickness of the second inorganic encapsulation layer 520 is equal to the thickness of the third inorganic encapsulation layer 540, and the thickness of the first organic encapsulation layer 510 is less than or equal to the thickness of the second organic encapsulation layer 530.

[0135] Please see 8 and Figure 9 , Figure 8 This is a partial cross-sectional view of the display area of ​​the display panel in another embodiment; Figure 9 This is a top view of the display panel in another embodiment.

[0136] like Figure 8 and Figure 9 As shown, in some optional embodiments, the display panel 10 further includes: an isolation structure 200 located on the side of the first protective layer 120 away from the substrate 100, the isolation structure 200 enclosing an isolation opening 240, and the pixel opening 420 and the isolation opening 240 being connected.

[0137] In these optional embodiments, when the luminescent material is prepared, a large drop is generated at the edge of the isolation structure 200, making it difficult for the luminescent material to connect at the edge of the isolation structure 200, thus causing it to break. The broken luminescent material forms mutually disconnected luminescent structures 320, thereby reducing crosstalk between charge carriers in the luminescent structures 320, improving the display effect of the display panel 10, and the preparation of the luminescent structure 320 does not require the use of a precision mask, which can reduce the development and use of precision masks and reduce the preparation cost.

[0138] In some alternative embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 located on the side of the first layer 210 facing away from the substrate 100, with both sides of the second layer 220 protruding toward the isolation opening 240 relative to the first layer 210.

[0139] In these optional embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 located on the side of the first layer 210 facing away from the substrate 100. The two sides of the second layer 220 protrude towards the isolation opening 240 compared to the first layer 210. When the light-emitting material is prepared, the light-emitting material has a large drop at the edge of the isolation structure 200, and the light-emitting material is difficult to connect at the edge of the isolation structure 200, thus causing it to break. The broken light-emitting material forms mutually disconnected light-emitting structures 320, thereby reducing crosstalk of charge carriers between the light-emitting structures 320, improving the display effect of the display panel 10, and the preparation of the light-emitting structure 320 can be carried out without the use of a precision mask, which can reduce the development and use of precision masks and reduce the preparation cost.

[0140] The width of the second layer 220 is greater than the width of the first layer 210. Therefore, the two ends of the second layer 220 protrude compared to the sides of the first layer 210; this shape of the isolation structure 12 is also referred to as a cantilever shape. The first layer 210 and the second layer 220 are made of different materials, and the etching rate of the second layer 220 is lower than that of the first layer 210. The material of the first layer 210 includes a conductive material, specifically including at least one of aluminum (Al), aluminum alloys, and aluminum alloys including at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The second layer 220 can be a single-layer structure or a multi-layer structure. If the second layer 220 is a single-layer structure, the material of the second layer 220 can include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. When the second layer 220 has a multi-layer structure, one layer of the second layer 220 is made of at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy or molybdenum-niobium alloy, and the other layer of the second layer 220 may be made of conductive oxide or inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0141] Please see Figure 10 , Figure 10 This is a partial cross-sectional view of the display area of ​​the display panel in another embodiment.

[0142] like Figure 10 As shown, optionally, the isolation structure 200 further includes a third layer 230 located on the side of the first layer 210 facing the substrate 100, with at least one side of the third layer 230 protruding from the first layer 210 towards the isolation opening 240. The material of the third layer 230 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0143] Optionally, the second electrode 330 and the isolation structure 200 are electrically connected.

[0144] In these optional embodiments, the isolation structure 200 separates the electrode material to form a plurality of spaced second electrodes 330. The spaced second electrodes 330 are electrically connected through the isolation structure 200 to form a full-surface electrode, ensuring the normal light emission of the light-emitting structure 320.

[0145] Optionally, the second electrode 330 is electrically connected to the first layer 210 and / or the third layer 230.

[0146] Optionally, the first inorganic encapsulation layer 500 includes a plurality of encapsulation portions located on the side of the second electrode 330 away from the substrate 100, and extending through the sidewall of the isolation structure 200 to the side of the isolation structure 200 away from the substrate 100.

[0147] Optionally, the first partition layer 130 extends to the side of the encapsulation portion away from the substrate 100 and is located between the encapsulation portion and the first organic encapsulation layer 510 to enhance the encapsulation effect within the display area AA.

[0148] Please see Figure 11 and Figure 12 , Figure 11 This is a partial cross-sectional view of the display area of ​​the display panel in another embodiment; Figure 12 This is a schematic diagram of a pixel circuit provided in an embodiment of this application.

[0149] like Figure 11 and Figure 12 As shown, the substrate 100 includes a pixel circuit 600 layer, which includes pixel circuits 600 for driving light-emitting devices to emit light. Figure 11 A transistor in pixel circuit 600 is shown, with first electrode 310 electrically connected to the transistor in pixel circuit 600 layer via a via. Furthermore, pixel circuit 600 layer includes at least one insulating layer, which may include at least one of inorganic and organic layers. Additionally, substrate 100 includes scan lines providing scan signal Scan and data lines providing data signal Data to pixel circuit 600.

[0150] The pixel circuit 600 includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to the data line that provides the data signal Data, the gate of the data transistor T2 is connected to the scan line that provides the scan signal Scan, and the drain of the data transistor T2 is connected to the gate of the driving transistor T1. The two ends of the storage capacitor C1 are respectively connected to the gate and the source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting unit 300. Figure 12 This is one embodiment of the pixel circuit 600, but the pixel circuit 600 of this application is not limited to... Figure 12 The pixel circuit 600 shown as 2T1C can also be other pixel circuits 600, such as 7T1C, 8T1C pixel circuits 600, etc.

[0151] like Figures 1 to 12 As shown, the plurality of isolation openings 240 include a plurality of first isolation openings, a plurality of second isolation openings, and a plurality of third isolation openings. A plurality of light-emitting units 300 are located on one side of the substrate 100, and each of the plurality of light-emitting units 300 includes a plurality of first light-emitting units, a plurality of second light-emitting units, and a plurality of third light-emitting units. The first light-emitting units are disposed corresponding to the first isolation openings, the second light-emitting units are disposed corresponding to the second isolation openings, and the third light-emitting units are disposed corresponding to the third isolation openings. In one embodiment, one light-emitting unit 300 is disposed corresponding to one isolation opening 240; for example, a one-to-one correspondence between the first light-emitting unit and the first isolation opening, a one-to-one correspondence between the second light-emitting unit and the second isolation opening, and a one-to-one correspondence between the third light-emitting unit and the third isolation opening. At least a portion of the first light-emitting unit is disposed within the corresponding first isolation opening, at least a portion of the second light-emitting unit is disposed within the corresponding second isolation opening, and at least a portion of the third light-emitting unit is disposed within the corresponding third isolation opening. In another embodiment, a plurality of light-emitting units 300 are disposed corresponding to one isolation opening 240; for example, a plurality of light-emitting units 300 emitting the same color are disposed corresponding to one isolation opening 240.

[0152] In one embodiment, an isolation structure 200 is disposed on a pixel definition layer 400. The pixel definition layer 400 has pixel openings 420 communicating with the isolation opening 240. Specifically, the pixel definition layer 400 has a first pixel opening 420 communicating with a first isolation opening, a second pixel opening 420 communicating with a second isolation opening, and a third pixel opening 420 communicating with a third isolation opening. The areas of the orthographic projections of the first pixel opening 420, the second pixel opening 420, and the third pixel opening 420 on the substrate 100 may be the same or different. The shapes of the orthographic projections of the pixel opening 420 and the corresponding isolation opening 240 on the substrate 100 may be the same or different. Generally, the area of ​​the orthographic projection of the isolation opening 240 on the substrate 100 is larger than the area of ​​the orthographic projection of the pixel opening 420 communicating with that isolation opening 240 on the substrate 100. The orthographic projections of the pixel openings 420 of the light-emitting unit 300 on the substrate 100 overlap with the orthographic projections of the isolation openings 240 on the substrate 100. The pixel definition layer 400 is made of an inorganic material, such as an inorganic insulating material formed by using at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0153] The first electrode 310 may include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, using silver, a metallic material with excellent light reflectivity. Each conductive oxide layer can be formed, for example, from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 330 is formed, for example, from a metallic material such as an alloy of magnesium and silver (MgAg).

[0154] The light-emitting structure 320 includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the substrate 100. The light-emitting structure 320 may include a single light-emitting material layer EML, or a stacked light-emitting structure 320 including multiple light-emitting material layers EML.

[0155] In order for the light-emitting structure 320 to emit light, a pixel voltage is provided to the first electrode 310 and a common voltage is provided to the second electrode 330, forming a potential difference between the first electrode 310 and the second electrode 330, causing the light-emitting structure 320 disposed between the first electrode 310 and the second electrode 330 to emit light. In one embodiment, if a potential difference is formed between the first electrode 310 and the second electrode 330 of the first light-emitting device, the light-emitting material layer EML of the light-emitting structure 320 emits blue light; if a potential difference is formed between the first electrode 310 and the second electrode 330 of the second light-emitting device, the light-emitting material layer EML of the light-emitting structure 320 emits green light; and if a potential difference is formed between the first electrode 310 and the second electrode 330 of the third light-emitting device, the light-emitting material layer EML of the light-emitting structure 320 emits red light.

[0156] In this configuration, the pixel voltage of the first electrode 310 is provided by the pixel circuit 600, and the common voltage of the second electrode 330 is provided by the isolation structure 200. Specifically, the second electrode 330 is electrically connected to the isolation structure 200, and the common voltage is supplied to the second electrode 330 by providing the isolation structure 200. That is, the isolation structure 200 has the function of supplying a common voltage to the second electrode 330.

[0157] The multiple packaging units include multiple first packaging units corresponding to multiple first light-emitting devices, multiple second packaging units corresponding to multiple second light-emitting devices, and multiple third packaging units corresponding to multiple third light-emitting devices. The first packaging unit is disposed on the side of the corresponding first light-emitting device away from the substrate 100, the second packaging unit is disposed on the side of the corresponding second light-emitting device away from the substrate 100, and the third packaging unit is disposed on the side of the corresponding third light-emitting device away from the substrate 100.

[0158] The materials of the first inorganic encapsulation layer 500, the second inorganic encapsulation layer 520, and the third inorganic encapsulation layer 540 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The first organic unencapsulated layer and the second organic unencapsulated layer are organic insulating materials, such as epoxy resin, acrylic resin, and other resin materials. The first organic encapsulation layer 510, the second inorganic encapsulation layer 520, the second organic encapsulation layer 530, and the third inorganic encapsulation layer 540 are continuously disposed at least on the entire display area AA, with a portion of them also disposed in the border area of ​​the non-display area NA.

[0159] The display panel 10 may also include at least one film layer such as a touch layer, a polarizer, a color filter substrate 100, and a protective cover. This film layer may also be bonded to the display panel 10 via an adhesive layer such as OCA (Optical Clear Adhesive).

[0160] like Figures 1 to 12As shown, a second aspect embodiment of this application provides a display panel 10, which has adjacent display areas AA and non-display areas NA. The display panel 10 includes: a substrate 100; a first planarization layer 110 located on one side of the substrate 100; a first protective layer 120 located on the side of the first planarization layer 110 facing away from the substrate 100, wherein the first protective layer 120 has a vent opening 123, the first planarization layer 110 is exposed in the vent opening 123, and the vent opening 123 is located in the non-display area NA; and a pixel definition layer 400 located on the side of the first protective layer 120 facing away from the substrate 100, wherein the orthographic projection of the pixel definition layer 400 onto the substrate 100 covers at least a portion of the orthographic projection of the vent opening 123 onto the substrate 100. The isolation structure 200 is located on the side of the first protective layer 120 away from the substrate 100, and the isolation structure 200 encloses and forms an isolation opening 240, which is connected to the pixel opening 420; the first partition layer 130 is located on the side of the pixel definition layer 400 away from the substrate 100, and at least part of the vent opening 123 is within the orthogonal projection of the first partition layer 130 onto the substrate 100; the first organic encapsulation layer 510 is located on the side of the first partition layer 130 away from the substrate 100; the first inorganic encapsulation layer 500 is located between the pixel definition layer 400 and the first organic encapsulation layer 510, and part of the first partition layer 130 is located between the first inorganic encapsulation layer 500 and the first organic encapsulation layer 510.

[0161] According to an embodiment of this application, the display panel 10 has adjacent display areas AA and non-display areas NA. The display areas AA are used for light emission display of the display panel 10. The display panel 10 includes a substrate 100, a first planarization layer 110, a first protective layer 120, a first partition layer 130, and a first organic encapsulation layer 510. A venting opening 123 is provided on the first protective layer 120, allowing moisture on one side of the first planarization layer 110 to escape through the venting opening 123, thereby improving the problem of moisture not being able to escape from one side of the first planarization layer 110, which could cause film peeling of the first protective layer 120. The pixel definition layer 400 defines the setting area of ​​each light-emitting structure 320, reducing color crosstalk between the light-emitting structures 320. A first isolation layer 130 is provided on the side of the pixel definition layer 400 facing away from the substrate 100. The first isolation layer 130 covers the vent opening 123 to isolate the first planarization layer 110 and the first organic encapsulation layer 510. This improves the problem that when the pixel definition portion 410 has a first opening 430, the first planarization layer 110 and the first organic encapsulation layer 510 come into contact through the first opening 430, and moisture from the first planarization layer 110 is released toward the first organic encapsulation layer 510, which can easily cause dark spots in reliability tests. This improves the display effect and performance of the display panel 10.

[0162] The structural design in this embodiment can be applied to other display panels 10. The specific choice can be made according to the actual situation, and this application does not impose any specific restrictions on it.

[0163] Please see Figure 13 , Figure 13 This is a flowchart illustrating the fabrication process of a display panel according to an embodiment of this application.

[0164] like Figures 1 to 13 As shown, an embodiment of the third aspect of this application also provides a method for manufacturing a display panel 10, the display panel 10 having adjacent display areas AA and non-display areas NA, the method comprising:

[0165] Step S01: A first planarization layer 110, a first protective layer 120, and a pixel definition layer 400 are sequentially prepared on a substrate 100. A venting opening 123 is formed on the first protective layer 120. The first planarization layer 110 is exposed in the venting opening 123. The venting opening 123 is located in the non-display area NA. The orthographic projection of the pixel definition layer 400 on the substrate 100 covers at least a portion of the orthographic projection of the venting opening 123 on the substrate 100.

[0166] Step S02: Prepare a first inorganic encapsulation layer 500 on the side of the pixel definition layer 400 facing away from the substrate 100;

[0167] Step S03: A first partition layer 130 is prepared on the side of the first inorganic encapsulation layer 500 opposite to the substrate 100, and at least part of the vent opening 123 is located within the orthogonal projection of the first partition layer 130 onto the substrate 100.

[0168] Step S04: Prepare a first organic encapsulation layer 510 on the side of the first partition layer 130 facing away from the substrate 100.

[0169] According to the manufacturing method of the display panel 10 of this application embodiment, a first planarization layer 110, a first protective layer 120, and a pixel definition layer 400 are sequentially prepared in step S01. A venting opening 123 is provided on the first protective layer 120, allowing moisture on one side of the first planarization layer 110 to escape through the venting opening 123, thereby improving the problem of moisture not escaping from one side of the first planarization layer 110, which could lead to film peeling of the first protective layer 120. A first inorganic encapsulation layer 500 is prepared in step S02. A first barrier layer 130 is prepared in step S03. A first organic encapsulation layer 510 is prepared in step S04. The pixel definition layer 400 defines the setting area of ​​each light-emitting structure 320, reducing color crosstalk between the light-emitting structures 320. A first isolation layer 130 is provided on the side of the pixel definition layer 400 facing away from the substrate 100. The first isolation layer 130 covers the vent opening 123 to isolate the first planarization layer 110 and the first organic encapsulation layer 510. This improves the problem that when the pixel definition portion 410 has a first opening 430, the first planarization layer 110 and the first organic encapsulation layer 510 come into contact through the first opening 430, and moisture from the first planarization layer 110 is released toward the first organic encapsulation layer 510, which can easily cause dark spots in reliability tests. This improves the display effect and performance of the display panel 10.

[0170] In some alternative embodiments, after the step of fabricating the first organic encapsulation layer 510 on the side of the first partition layer 130 facing away from the substrate 100, the method further includes:

[0171] A second inorganic encapsulation layer 520 is prepared on the side of the first organic encapsulation layer 510 that is away from the substrate 100.

[0172] In these alternative embodiments, the first inorganic encapsulation layer 500, the first organic encapsulation layer 510, and the second inorganic encapsulation layer 520 form a three-layer thin film evaporator (TFE) to improve the encapsulation performance of the display panel 10.

[0173] In some alternative embodiments, the first partition layer 130 and the second inorganic encapsulation layer 520 are made of the same material.

[0174] In these alternative embodiments, the first partition layer 130 and the second inorganic encapsulation layer 520 can be fabricated using the same process, and the first partition layer 130 and the second inorganic encapsulation layer 520 can share the same mask, which can reduce the development and use of the mask, reduce the fabrication cost, and simplify the fabrication process.

[0175] In some alternative embodiments, the maximum thickness of the first partition layer 130 is greater than or equal to the maximum thickness of the second inorganic encapsulation layer 520.

[0176] In these alternative embodiments, foreign matter may be generated during the fabrication of the pixel definition layer 400 or the first inorganic encapsulation layer 500. This foreign matter can cause a hole-like first opening 430 in the pixel definition portion 410, allowing the first planarization layer 110 and the first organic encapsulation layer 510 to contact. Therefore, a greater thickness is provided for the first partition layer 130 to ensure that it can cover the foreign matter, thereby mitigating encapsulation failure caused by the foreign matter.

[0177] In some alternative embodiments, after the step of fabricating the second inorganic encapsulation layer 520 on the side of the first organic encapsulation layer 510 facing away from the substrate 100, the method further includes:

[0178] A second organic encapsulation layer 530 and a third inorganic encapsulation layer 540 are sequentially prepared on the side of the second inorganic encapsulation layer 520 away from the substrate 100.

[0179] In these alternative embodiments, in addition to the three-layer encapsulation of the first inorganic encapsulation layer 500, the first organic encapsulation layer 510, and the second inorganic encapsulation layer 520, a second organic encapsulation layer 530 is additionally provided to further enhance the encapsulation effect and reduce the possibility of dark spots appearing in reliability tests.

[0180] In some alternative embodiments, the first organic encapsulation layer 510 and the second organic encapsulation layer 530 are made of the same material.

[0181] In these alternative embodiments, the first organic encapsulation layer 510 and the second organic encapsulation layer 530 can be fabricated using the same process, and the first organic encapsulation layer 510 and the second organic encapsulation layer 530 can share the same mask, which can reduce the development and use of the mask, reduce the fabrication cost, and simplify the fabrication process.

[0182] In some alternative embodiments, the second inorganic encapsulation layer 520 and the third inorganic encapsulation layer 540 are made of the same material.

[0183] In these alternative embodiments, the second inorganic encapsulation layer 520 and the third inorganic encapsulation layer 540 can be fabricated using the same process, and the second inorganic encapsulation layer 520 and the third inorganic encapsulation layer 540 can share the same mask, which can reduce the development and use of mask, reduce fabrication costs, and simplify the fabrication process.

[0184] In some alternative embodiments, the maximum thickness of the first organic encapsulation layer 510 is less than or equal to the maximum thickness of the second organic encapsulation layer 530.

[0185] In these alternative embodiments, foreign matter may be generated during the formation of the second inorganic encapsulation layer 520, which can lead to dark spots during reliability testing. Therefore, setting a greater thickness for the second organic encapsulation layer 530 ensures that the second organic encapsulation layer 530 can cover the foreign matter, thereby improving encapsulation failure caused by foreign matter.

[0186] Optionally, the first protective layer 120 includes an inorganic protective layer 121 and a conductive protective layer 122, with the conductive protective layer 122 located on the side of the inorganic protective layer 121 facing away from the substrate 100. The fabrication process of the inorganic protective layer 121 includes:

[0187] An inorganic protective material layer is deposited on the side of the first planarization layer 110 opposite to the substrate 100;

[0188] Photoresist is prepared on the side of the inorganic protective material layer away from the substrate 100 and the photoresist is patterned.

[0189] The inorganic protective material layer is etched to form the inorganic protective layer 121;

[0190] Remove the photoresist.

[0191] Optionally, before step S02, the method further includes:

[0192] An isolation material layer is prepared on the side of the pixel definition layer 400 away from the substrate 100, and the isolation material layer is patterned to form an isolation structure 200.

[0193] The isolation material layer includes a two- or three-layer structure. The patterning process of the isolation material layer includes coating with photoresist, patterning the photoresist, dry etching and wet etching of the isolation material layer to form the isolation structure 200, and finally removing the photoresist.

[0194] Optionally, the fabrication process for pixel definition layer 400 includes:

[0195] A pixel definition material layer is prepared on the side of the first protective layer 120 opposite to the substrate 100;

[0196] Photoresist is coated on the side of the pixel definition material layer facing away from the substrate 100 and the photoresist is patterned.

[0197] The pixel definition material layer is etched to form pixel definition layer 400;

[0198] Remove the photoresist.

[0199] Optionally, the plurality of isolation openings 240 include a plurality of first isolation openings, a plurality of second isolation openings, and a plurality of third isolation openings; after step S01, the method further includes:

[0200] A film layer for a first light-emitting unit is prepared, the film layer of the first light-emitting unit including a light-emitting structure layer and a second electrode layer of the first light-emitting unit;

[0201] A first encapsulation layer for the first light-emitting unit is prepared. Since the film layer and the first encapsulation layer of the first light-emitting unit are both prepared as a single layer, the film layer and the first encapsulation layer of the first light-emitting unit are present at the locations of the multiple first isolation openings, the multiple second isolation openings, and the multiple third isolation openings.

[0202] The film layer and the first encapsulation layer of the first light-emitting unit at the locations of multiple second isolation openings and multiple third isolation openings are etched away, thereby forming the light-emitting structure 320 and the second electrode 330 of the first light-emitting unit and the first encapsulation portion of the first light-emitting unit only at the locations of multiple first isolation openings.

[0203] Based on the above steps, the light-emitting structure 320 and the second electrode 330 of the second light-emitting unit and the first encapsulation part of the second light-emitting unit are respectively provided at the positions of multiple second isolation openings, and the light-emitting structure 320 and the second electrode 330 of the third light-emitting unit and the first encapsulation part of the third light-emitting unit are respectively provided at the positions of multiple third isolation openings.

[0204] The method further includes, after setting the light-emitting structure 320 of the third light-emitting unit and the second electrode 330, as well as the first encapsulation part of the third light-emitting unit, at the locations of multiple third isolation openings, and removing the photoresist, the method also includes:

[0205] A first isolation layer 130 is prepared on the side of the first encapsulation portion, the second encapsulation portion, and the third encapsulation portion away from the substrate 100.

[0206] In these alternative embodiments, the first partition layer 130 covers the first opening 430 to isolate the first planarization layer 110 and the first organic encapsulation layer 510. This improves the problem that when the first opening 430 appears in the pixel limiting portion 410, the first planarization layer 110 and the first organic encapsulation layer 510 come into contact through the first opening 430, and moisture from the first planarization layer 110 is released toward the first organic encapsulation layer 510, which can easily lead to dark spots in reliability testing. This improves the display effect and performance of the display panel 10.

[0207] An embodiment of the fourth aspect of this application also provides a display device, including a display panel 10 of any of the above embodiments or a display panel 10 prepared by the preparation method of the display panel 10 of any of the above embodiments. Since the display device provided by the embodiment of the fourth aspect of this application includes a display panel 10 of any of the above embodiments or a display panel 10 prepared by the preparation method of the display panel 10 of any of the above embodiments, the display device provided by the embodiment of the fourth aspect of this application has the beneficial effects of the display panel 10 of any of the above embodiments or the display panel 10 prepared by the preparation method of the display panel 10 of any of the above embodiments, which will not be elaborated further here.

[0208] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0209] The embodiments described above in this application are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to make good use of this application and modifications based on it. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, The display panel has adjacent display areas and non-display areas, and the display panel includes: Substrate; A first planarization layer is located on one side of the substrate; A first protective layer is located on the side of the first planarization layer opposite to the substrate. A vent opening is formed on the first protective layer, and the first planarization layer is exposed in the vent opening. The vent opening is located in the non-display area. A pixel definition layer is located on the side of the first protective layer opposite to the substrate. The orthographic projection of the pixel definition layer onto the substrate covers at least a portion of the orthographic projection of the vent opening onto the substrate. The pixel definition layer includes at least one first opening, which communicates with the vent opening. An isolation structure is located on the side of the first protective layer away from the substrate, and the isolation structure encloses and forms an isolation opening; A first isolation layer is located on the side of the pixel definition layer opposite to the substrate, at least a portion of the vent opening is located within the orthogonal projection of the first isolation layer onto the substrate, the first isolation layer covers the first opening, and the material of the first isolation layer includes inorganic materials. The first organic encapsulation layer is located on the side of the first partition layer that faces away from the substrate; A first inorganic encapsulation layer is located between the pixel definition layer and the first organic encapsulation layer. The first inorganic encapsulation layer includes a plurality of encapsulation portions. The encapsulation portions extend through the sidewall of the isolation structure to the side of the isolation structure opposite to the substrate. In the display area, a portion of the first isolation layer is located between the first inorganic encapsulation layer and the first organic encapsulation layer. The first isolation layer extends to the side of the encapsulation portion in the display area opposite to the substrate and is located between the encapsulation portion and the first organic encapsulation layer.

2. The display panel according to claim 1, characterized in that, Of the plurality of ventilation openings, a portion of the ventilation openings are connected to the plurality of the first openings, and another portion of the ventilation openings are located within the orthogonal projection of the pixel definition layer onto the substrate.

3. The display panel according to claim 1, characterized in that, Within the non-display area, a portion of the first partition layer is located between the pixel definition layer and the first organic encapsulation layer.

4. The display panel according to claim 1, characterized in that, The display panel also includes: The second inorganic encapsulation layer is located on the side of the first organic encapsulation layer that is away from the substrate.

5. The display panel according to claim 4, characterized in that, The first partition layer is made of the same material as the second inorganic encapsulation layer.

6. The display panel according to claim 4, characterized in that, The maximum thickness of the first partition layer is greater than or equal to the maximum thickness of the second inorganic encapsulation layer.

7. The display panel according to claim 4, characterized in that, The display panel also includes: The second organic encapsulation layer is located on the side of the second inorganic encapsulation layer that faces away from the substrate; The third inorganic encapsulation layer is located on the side of the second organic encapsulation layer that is away from the substrate.

8. The display panel according to claim 7, characterized in that, The first organic encapsulation layer and the second organic encapsulation layer are made of the same material.

9. The display panel according to claim 7, characterized in that, The second inorganic encapsulation layer and the third inorganic encapsulation layer are made of the same material.

10. The display panel according to claim 7, characterized in that, The maximum thickness of the first organic encapsulation layer is less than or equal to the maximum thickness of the second organic encapsulation layer.

11. The display panel according to claim 1, characterized in that, The first protective layer includes an inorganic protective layer and a conductive protective layer. The conductive protective layer is located on the side of the inorganic protective layer opposite to the substrate, and the venting opening penetrates through the conductive protective layer and the inorganic protective layer.

12. The display panel according to claim 1, characterized in that, The thickness of the first partition layer is 0.4μm~1μm.

13. A method for manufacturing a display panel, characterized in that, The display panel has adjacent display areas and non-display areas, and the method includes: A first planarization layer, a first protective layer, and a pixel definition layer are sequentially fabricated on a substrate. The first protective layer has a vent opening, and the first planarization layer is exposed in the vent opening. The vent opening is located in the non-display area. The orthographic projection of the pixel definition layer on the substrate covers at least a portion of the orthographic projection of the vent opening on the substrate. The pixel definition layer includes at least one first opening, and the first opening and the vent opening are in communication. An isolation structure is fabricated on the substrate, the isolation structure enclosing an isolation opening; A first inorganic encapsulation layer is prepared on the side of the pixel definition layer away from the substrate. The first inorganic encapsulation layer includes a plurality of encapsulation portions, which extend through the sidewall of the isolation structure to the side of the isolation structure away from the substrate. A first barrier layer is formed on the side of the first inorganic encapsulation layer opposite to the substrate, at least a portion of the vent opening is located within the orthogonal projection of the first barrier layer onto the substrate, the first barrier layer covers the first opening, and the material of the first barrier layer includes inorganic materials. A first organic encapsulation layer is prepared on the side of the first partition layer away from the substrate. In the display area, a portion of the first partition layer is located between the first inorganic encapsulation layer and the first organic encapsulation layer. The first partition layer extends to the encapsulation portion in the display area on the side away from the substrate and is located between the encapsulation portion and the first organic encapsulation layer.

14. The preparation method according to claim 13, characterized in that, After the step of fabricating the first organic encapsulation layer on the side of the first partition layer opposite to the substrate, the method further includes: A second inorganic encapsulation layer is prepared on the side of the first organic encapsulation layer that is away from the substrate.

15. A display device, characterized in that, This includes the display panel as described in any one of claims 1-12 or the display panel prepared by the method for preparing the display panel as described in any one of claims 13 or 14.

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