A preparation method of low-binder mica tape using hot pressing molding

Abstract

The present invention discloses a preparation method of a low-resin mica tape by hot pressing. This method uses epoxy resin and hyperbranched polyester resin to prepare a sizing material, dilutes part of the sizing material to obtain a diluted sizing material, uses a silicon chloride-acetone solution to treat a reinforcing fiber fabric and reinforcing fiber filaments respectively to obtain a modified reinforcing fiber fabric and modified reinforcing fiber filaments, then adds silicon chloride to the diluted sizing material to impregnate the modified reinforcing fiber fabric to obtain a reinforcing material layer, and at the same time takes a base sizing material and adds modified reinforcing fiber filaments to obtain an adhesive; the adhesive is coated on one or both sides of a mica paper substrate to obtain an adhesive layer, the reinforcing material layer is laid flat on the surface of the adhesive layer, and after two roller pressings, it is dried, slit, and wound up to obtain a finished low-resin mica tape. The mica tape prepared by the method of the present invention has a low resin content and has better VPI process performance.

Description

Technical Field

[0001] The present invention relates to the field of insulating mica products, and particularly to a preparation method of a low-adhesive mica tape using hot pressing molding. Background Art

[0002] As a mica paper-based insulating material, the mica tape is a composite material composed of mica paper, a reinforcing fiber fabric layer, and an adhesive. It has excellent physical and chemical properties such as high insulation, corona resistance, acid and alkali resistance, radiation resistance, chemical stability, elasticity, high peelability, high shear resistance, and high tensile strength, and is widely used in industry as an insulating wrapping material for cables and large-scale electromechanical equipment.

[0003] In the field of high-voltage motors, the use of low-adhesive mica tape can effectively improve the heat resistance level of the insulating wrapping layer while ensuring the insulation grade of the equipment, thereby improving the performance of electrical equipment and achieving the purposes of increasing voltage, increasing capacitance, and reducing volume, so that the corresponding high-voltage motor equipment can operate reliably for a long time under harsh conditions such as high temperature and high load, and then reduce the operation and maintenance costs.

[0004] With the development of the power industry, modern power generation equipment and transmission equipment are gradually developing towards high voltage, large capacity, and integration, which puts forward higher requirements for the high-temperature tolerance, strength performance, and insulation performance of electrical insulating paper. The existing low-adhesive mica tapes in the prior art can no longer meet the growing demand for insulating materials. It is considered in the field that the performance of the insulation structure is jointly reflected after the mica tape is mixed with the impregnating resin, and the adhesive is an important component affecting the physical and chemical properties of the mica tape; in order to ensure that the high-thickness main insulating material can be quickly penetrated by the VPI resin, it is required that the low-adhesive mica tape has high air permeability and penetrability. Most of the commonly used low-adhesive mica tapes in the prior art are prepared by impregnating a reinforcing material with an adhesive solution of epoxy resin or linear polyester resin, then compounding mica paper, and then cutting the dried compound mica paper. The mica content in the mica tape is low. Although it can show a high heat resistance level externally, it has defects such as low thermal conductivity, insufficient bonding strength, and poor compatibility in actual use. This is because a large amount of the adhesive will penetrate into the mica paper during the above production process, and these adhesives will fill the gaps in the mica paper, resulting in a decrease in the air permeability of the low-adhesive mica tape. During the VPI treatment process, it affects the rapid penetration of the impregnating resin, resulting in an obstacle to the achievement of the above technical purposes during high-thickness wrapping, making it difficult for the main insulating material to be quickly penetrated by the VPI resin, and then affecting the overall performance and electrical performance of the insulation structure of related equipment, resulting in a decrease in the performance of the motor under the condition of large heat generation and inability to meet the growing performance requirements of the field industry. Summary of the Invention

[0005] The technical problem solved by the present invention is to provide a preparation method of low-resin mica tape using hot pressing molding, so as to solve the disadvantages in the above-mentioned background technology.

[0006] The technical problem solved by the present invention is realized by adopting the following technical solutions:

[0007] A preparation method of low-resin mica tape using hot pressing molding specifically includes the following operating steps:

[0008] S1 First, use epoxy resin and hyperbranched polyester resin as resin substrates to prepare a mixture sizing material, mix silica powder into the mixture sizing material and disperse it evenly to obtain a basic sizing material, and then dilute the basic sizing material with an organic solvent to obtain a diluted sizing material;

[0009] S2 Use acetone as a solvent to dissolve silicon chloride to obtain a silicon chloride-acetone solution, and use the silicon chloride-acetone solution to impregnate and modify the reinforced fiber fabric and the reinforced fiber monofilament respectively. After the modification is completed, take them out and dry them to obtain a modified reinforced fiber fabric and a modified reinforced fiber monofilament;

[0010] S3 Take the diluted sizing material and add silicon chloride to obtain an impregnating sizing material. Use the impregnating sizing material to impregnate the modified reinforced fiber fabric, and extrude the excess sizing material after the impregnation treatment to obtain a reinforcing material layer; Take the basic sizing material and add the modified reinforced fiber monofilament, and disperse it evenly to obtain an adhesive;

[0011] S4 Take mica paper as a substrate, coat an adhesive on one or both surfaces thereof to obtain an adhesive layer, then lay the reinforcing material layer flat on the surface of the adhesive layer, and perform the first rolling at room temperature to extrude the excess sizing material and obtain a mica tape blank paper at the same time;

[0012] S5 Heat the mica tape blank paper obtained in step S4 in a drying oven at a temperature of 50°C to 70°C. After the heat drying is completed, keep the temperature of the rolling surface at 90 to 110°C for the second rolling, and after the rolling is completed, perform drying, slitting, and winding in sequence to obtain a finished low-resin mica tape.

[0013] As a further limitation, the mixture sizing material includes 100 parts of epoxy resin, 15 to 20 parts of hyperbranched polyester resin, 10 to 15 parts of polyethyl methacrylate hydroxyethyl ester, 5 to 7 parts of organosiloxane, and 7 to 9 parts of functional filler according to the mass part ratio relationship; The hyperbranched polyester resin is a hyperbranched polyester resin with an average molecular weight of 30,000 to 50,000, and the organosiloxane contains silanol groups or phenyl groups or vinyl groups.

[0014] During preparation, first mix epoxy resin and hyperbranched polyester resin and then heat to 170 - 190 °C, hold for 10 - 15 min, then raise the temperature to 190 - 210 °C under continuous stirring and keep warm for 30 - 45 min. During this process, add functional filler and organosiloxane at the same time; among them, the functional filler is added once; the organosiloxane is added slowly and continuously, and the mixture rubber stock is kept in a state of continuous stirring and dispersion during the addition process of the organosiloxane and the heat preservation process; after the heat treatment is completed, keep stirring and cool. When cooled to 60 - 70 °C, add hydroxyethyl polymethacrylate, keep warm and stir for 8 - 15 min, and then continue to cool to room temperature to obtain the mixture rubber stock;

[0015] 2,4,6-tris-(dimethylaminomethyl)phenol is also added as an accelerator during the preparation of the mixture rubber stock, and the addition amount of the accelerator is 0.03 - 0.05 wt% of the mass of the basic rubber stock;

[0016] The functional filler is one or a combination of alumina powder, aluminum nitride powder, boron oxide, boron nitride, and silicon nitride with high thermal conductivity and physical strengthening effects.

[0017] As a further limitation, the organic solvent preferably used for diluting the basic rubber stock is an active diluent added with epoxy groups, and its preferred dilution ratio is 1:3 - 1:5.

[0018] As a further limitation, the content of silicon chloride in the silicon chloride - acetone solution is 25 - 30 wt%.

[0019] As a further limitation, before impregnating and modifying the reinforcing fiber fabric and reinforcing fiber monofilament with the silicon chloride - acetone solution, first immerse the corresponding reinforcing fiber fabric and reinforcing fiber monofilament in a silane coupling agent for pretreatment.

[0020] As a further limitation, the reinforcing fiber fabric is one of fiberglass mesh cloth, ceramic fiber mesh cloth, metal fiber mesh cloth, and carbon fiber mesh cloth; the reinforcing fiber monofilament is one of aramid fiber monofilament, fiberglass monofilament, ceramic fiber monofilament, metal fiber monofilament, and carbon fiber monofilament.

[0021] As a further limitation, the mass ratio of silicon chloride added to the impregnating rubber stock is 13 - 15 wt%.

[0022] As a further limitation, the mica paper used as the substrate is preferably synthetic fluorophlogopite paper or phlogopite paper.

[0023] As a further limitation, when performing two rolling operations, the rolling pressure of the second rolling is set to be 1.5 to 1.8 times that of the first rolling, and the rolling pressure of the second rolling is controlled to be 8 to 15 MPa.

[0024] Beneficial effects: The low-binder mica tape of the present invention is made of a binder compounded by a high molecular weight hyperbranched polyester resin and an epoxy resin, and the binder, the reinforcing fiber fabric, and the reinforcing fiber monofilament are respectively modified with silicon chloride and then compounded with a mica paper substrate to prepare a mica tape. The mica tape body prepared is soft and tough. Since silicon chloride volatilizes in the mica tape, a large number of cross-linked pores will be generated in the adhesive layer and on the surface of the adhesive layer. At the same time, the modified binder has better compatibility, and can greatly shorten the treatment time of the VPI process, improve the impregnation ratio and impregnation effect, and improve the insulation density when performing high thermal conductivity insulation impregnation in the VPI process, thereby improving the electrical performance and operation reliability of the motor. Specific embodiments

[0025] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0026] In the following embodiments, those skilled in the art of the present technology can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used here have the same meaning as the general understanding of those of ordinary skill in the art to which this application belongs. It should also be understood that terms such as those defined in a general dictionary should be understood to have a meaning consistent with the meaning in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless defined as here.

[0027] Example 1:

[0028] In Example 1, the low-binder mica tape is a single-sided mica tape, that is, a mica tape structure obtained by forming a reinforcing material layer on one side of a mica paper substrate. When preparing it, phlogopite paper is selected as the mica paper substrate; fiberglass mesh cloth is selected as the reinforcing fiber fabric; meta-aramid fiber monofilament is selected as the reinforcing fiber monofilament; nano-boron nitride powder is selected as the functional filler.

[0029] It is prepared by the following process:

[0030] First, prepare the basic rubber compound. When preparing the basic rubber compound, first weigh the following by mass: 100 parts of epoxy resin, 20 parts of hyperbranched polyester resin with an average molecular weight of 30,000 to 42,000, 12 parts of polyhydroxyethyl methacrylate, 7 parts of organosiloxane containing silanol groups, and 9 parts of functional filler. Mix the epoxy resin and hyperbranched polyester resin in the above components in a reactor and heat to 180°C for insulation for 14 minutes. After the insulation is completed, heat the reactor at a stirring speed of 120 rpm. During the heating process, the temperature in the reactor is raised to 210°C at a heating rate of 10°C / min.

[0031] The functional filler is added all at once at the beginning of the temperature rise, and the organosiloxane is added slowly and continuously at the same time, and the addition process continues until the temperature rise process is completed.

[0032] The reactor was heated to 210°C and maintained at this temperature for 40 min, with continuous stirring during the temperature maintenance process.

[0033] After the heat treatment in the reactor is completed, the stirring state is maintained and the reactor is naturally cooled. When it is cooled to 65°C, polyhydroxyethyl methacrylate is added, and the mixture is stirred for 15 minutes. Then the stirring device is turned off and the mixture is naturally cooled to room temperature to obtain a mixed rubber material; 3wt% of the silica powder is added to the mixed rubber material and dispersed evenly to obtain a basic rubber material. A part of the basic rubber material is reserved for use, and the other part is diluted with an active epoxy resin diluent containing epoxy groups at a dilution ratio of 1:5 to obtain a diluted rubber material. The reason for using the active epoxy resin diluent for dilution is that the epoxy groups in the active epoxy resin diluent can be used in the subsequent processing process to participate in the curing reaction and form three-dimensional crosslinking to achieve the effect of enhancing the strength of the adhesive system.

[0034] A silicon chloride-acetone solution is prepared, silicon chloride is dissolved in an acetone solution at room temperature to obtain a silicon chloride-acetone solution, and the content of silicon chloride in the acetone is controlled to be 25-27wt%. The silicon chloride-acetone solution is used to perform an impregnation modification treatment on a reinforcing fiber fabric and a reinforcing fiber monofilament. Before the impregnation modification treatment, the corresponding reinforcing fiber fabric and the reinforcing fiber monofilament are firstly subjected to a modification pretreatment using a silane coupling agent KH550, and then dried after the modification pretreatment is completed. After the drying is completed, the reinforcing fiber fabric and the reinforcing fiber monofilament are immersed in the silicon chloride-acetone solution for an immersion treatment, and the immersion treatment time is 90 minutes. After the treatment is completed, the reinforcing fiber fabric and the reinforcing fiber monofilament are obtained by taking out and drying.

[0035] Take the diluted sizing material and add silicon chloride to modify the diluted sizing material with silicon chloride to obtain an impregnating sizing material. Control the addition amount of silicon chloride in the impregnating sizing material to be 13 wt% of the mass of the impregnating sizing material. Put the modified reinforcing fiber fabric into the impregnating sizing material for impregnation treatment. After the impregnation treatment is completed, extrude the excess sizing material to obtain a reinforcing material layer.

[0036] Take the base sizing material and add the modified reinforcing fiber monofilaments obtained in the above steps into the base sizing material. After dispersing evenly, an adhesive is obtained.

[0037] Take mica paper as the base material, apply the above adhesive on one side of it to obtain an adhesive layer. Control the coating amount of the adhesive layer to be 20% of the mass of the mica paper. Then lay the reinforcing material layer flat on the surface of the adhesive layer and perform the first rolling at room temperature. Control the rolling pressure to be 9.3 MPa. Extrude the excess sizing material during the rolling process and obtain a mica tape blank paper. The resin content in the obtained mica tape blank paper is about 13%. Send the mica tape blank paper into a drying oven for hot drying. After the hot drying is completed, keep the temperature of the rolling surface at 110 °C and the rolling pressure at 15 MPa for the second rolling. After the second rolling is completed, the resin content in the mica tape blank paper is controlled to be 10.5% - 12%. Then dry and cut the obtained mica tape blank paper, and wind it up to obtain the corresponding finished product of low-resin mica tape. The corresponding resin content in this finished product of low-resin mica tape must be less than 15%, meeting the technical requirements of the low-resin mica tape.

[0038] In the above process, the above sizing material is obtained by thermally mixing epoxy resin and high-molecular-weight hyperbranched polyester resin. This sizing material system using epoxy resin as the base resin and high-molecular-weight hyperbranched polyester resin for toughening has better strength and stability, and can have better adhesion after dilution.

[0039] When using a silicon chloride - acetone solution to impregnate the reinforcing fiber fabric and the reinforcing fiber monofilaments, acetone can be used to assist in opening the fiber structure in the reinforcing fiber fabric and the reinforcing fiber monofilaments. And when the fiber structure of the reinforcing fiber fabric and the reinforcing fiber monofilaments is opened, silicon chloride is absorbed into the corresponding fiber structure. The reinforcing fiber fabric and the reinforcing fiber monofilaments that have inhaled silicon chloride are modified and have better compatibility. Specifically, when the corresponding diluted sizing material is added with silicon chloride, the diluted sizing material has better adhesion to the corresponding modified reinforcing fiber fabric. Compared with the impregnation treatment state of directly using the diluted sizing material and the reinforcing fiber fabric not modified by the silicon chloride - acetone solution, after curing and forming, the modified reinforcing fiber fabric can maintain a stable interfacial structure state in the diluted sizing material and is less likely to undergo interlayer peeling during subsequent use.

[0040] Meanwhile, since the corresponding reinforcing fiber filaments are also modified by the silicon chloride-acetone solution, when the modified reinforcing fiber filaments are uniformly dispersed into the base rubber compound and coated on the surface of the mica paper substrate, during the process of hot pressing when the modified reinforcing fiber fabric is formed into a reinforcing material layer and directly laid on the adhesive layer, due to the affinity characteristics between the modified reinforcing fiber fabric and the modified reinforcing fiber filaments, it is easier to help form a spatial cross-linked structure between the adhesive layer and the modified reinforcing fiber fabric. This spatial cross-linked structure can improve the structural stability of the connection between the adhesive layer and the reinforcing material layer after curing, and thus can reduce the amount of sizing while ensuring the overall structural strength of the mica tape, so as to ensure the electrical performance and heat dissipation performance of the corresponding equipment.

[0041] In addition, in the technical solution of this embodiment, due to the material characteristics of silicon chloride itself, it will partially vaporize when the temperature is higher than 70 °C, so that pores will be formed in the rubber layer due to the vaporization of silicon chloride during the warm roll pressing in the second roll pressing process and the subsequent drying operation. These pores will be partially compacted during the second roll pressing process, making the formed mica tape body softer and more ductile. Therefore, the mica tape prepared by the technical solution of this embodiment has the advantages of less adhesive content, good wrapping property and adhesion. At the same time, the pores formed by the vaporization of silicon chloride, combined with the rubber compound with better compatibility, can form favorable factors for the VPI process, enabling it to significantly shorten the processing time of the VPI process, improve the impregnation ratio and impregnation effect, and improve the insulation density when performing high thermal conductivity insulation impregnation. Combined with the filler with high thermal conductivity performance, it can effectively improve the electrical performance and operation reliability of the corresponding motor.

[0042] In another embodiment, the above process method can also be used to prepare a double-sided mica tape, that is, a mica tape form obtained by using mica paper as the substrate and forming reinforcing material layers on both sides thereof, namely Embodiment 2:

[0043] In Embodiment 2, when preparing the low-adhesive mica with the above double-sided mica tape structure, synthetic fluorophlogopite paper is selected as the mica paper substrate; ceramic fiber mesh cloth is selected as the reinforcing fiber fabric; carbon fiber filaments are selected as the reinforcing fiber filaments; a mixture powder with a mass ratio of 3:1:2 of nano-aluminum oxide powder, aluminum nitride powder, and boron nitride is selected as the functional filler.

[0044] It is specifically prepared by the following process:

[0045] First, prepare the basic rubber compound. When preparing the basic rubber compound, first weigh by mass: 100 parts of epoxy resin, 18 parts of hyperbranched polyester resin with an average molecular weight of 38,000 to 45,000, 13 parts of polyhydroxyethyl methacrylate, 6 parts of vinyl-containing organosiloxane, and 8 parts of functional filler. Mix the epoxy resin and hyperbranched polyester resin in the above components in a reactor and heat to 190°C at a heating rate of 45°C / min and keep warm for 12 minutes. After the insulation is completed, heat the reactor at a stirring speed of 90 rpm. During the heating process, the temperature in the reactor is raised to 200°C at a heating rate of 15°C / min.

[0046] At the beginning of heating, the functional filler is added at once, and 0.04wt% of 2,4,6-tris-(dimethylaminomethyl)phenol is added as a promoter, and the organosiloxane is added slowly and continuously, and the addition process continues until the heating process is completed.

[0047] The reactor was heated to 210°C and maintained at this temperature for 40 min, with continuous stirring during the temperature maintenance process.

[0048] After the heat treatment in the reactor is completed, the stirring state is continued to be maintained as the reactor cools naturally. When it cools to 70°C, polyhydroxyethyl methacrylate is added, and the mixture is stirred for 10 minutes at a warm temperature. Then, the stirring device is turned off and the reactor is cooled naturally to room temperature to obtain a mixed rubber material. Silica powder accounting for 4 wt% of the mass of the mixed rubber material is added to the mixed rubber material, and the base rubber material is obtained after being evenly dispersed.

[0049] A portion of the basic rubber compound is reserved for later use, while the other portion is diluted with an active epoxy resin diluent containing epoxy groups at a dilution ratio of 1:3 to obtain a diluted rubber compound.

[0050] A silicon chloride-acetone solution is prepared, silicon chloride is dissolved in an acetone solution at room temperature to obtain a silicon chloride-acetone solution, and the content of silicon chloride in the acetone is controlled to be 26-28wt%. The silicon chloride-acetone solution is used to perform an impregnation modification treatment on a reinforcing fiber fabric and a reinforcing fiber monofilament. Before the impregnation modification treatment, the corresponding reinforcing fiber fabric and the reinforcing fiber monofilament are firstly subjected to a modification pretreatment using a silane coupling agent KH550, and then dried after the modification pretreatment is completed. After the drying is completed, the reinforcing fiber fabric and the reinforcing fiber monofilament are immersed in the silicon chloride-acetone solution for an immersion treatment, and the immersion treatment time is 75 minutes. After the treatment is completed, the fabric is taken out and dried to obtain a modified reinforcing fiber fabric and a modified reinforcing fiber monofilament.

[0051] Take the diluted sizing material, add silicon chloride to it, and modify the diluted sizing material with silicon chloride to obtain the impregnating sizing material. Control the addition amount of silicon chloride in the impregnating sizing material to be 14 wt% of the mass of the impregnating sizing material. Put the modified reinforced fiber fabric into the impregnating sizing material for sizing treatment. After the sizing treatment is completed, extrude the excess sizing material to obtain the reinforcing material layer.

[0052] Take the base sizing material, add the modified reinforced fiber monofilaments obtained in the above steps into the base sizing material, and obtain the adhesive after being evenly dispersed.

[0053] Take mica paper as the base material, coat the above adhesive on both of its two surface energies respectively to obtain the adhesive layer. Control the coating amount of the single-sided adhesive layer to be 12% of the mass of the mica paper. Then lay the reinforcing material layer flat on the surface of the adhesive layer, and perform the first rolling at room temperature. Control the rolling pressure to be 10 MPa. Extrude the excess sizing material during the rolling process, and obtain the mica tape blank paper. The sizing content in the obtained mica tape blank paper is about 15%. Send the mica tape blank paper into the drying oven for heat drying. After the heat drying is completed, keep the temperature of the rolling surface at 105 °C and the rolling pressure at 15 MPa for the second rolling. After the second rolling is completed, the sizing content in the mica tape blank paper is controlled to be 13.2 - 14.5%. Then dry and cut the obtained mica tape blank paper, and wind it up to obtain the corresponding finished product of the low-sizing mica tape. The corresponding sizing content in the finished product of the low-sizing mica tape is less than 15%, meeting the technical requirements of the low-sizing mica tape.

[0054] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A preparation method of a mica tape with less glue using hot pressing molding, characterized in that, Specifically, it includes the following operation steps: S1 First, use epoxy resin and hyperbranched polyester resin as resin substrates to prepare a mixture rubber compound, mix silica powder into the mixture rubber compound and disperse it evenly to obtain a base rubber compound, and then dilute the base rubber compound with an organic solvent to obtain a diluted rubber compound; S2 Use acetone as a solvent to dissolve silicon chloride to obtain a silicon chloride-acetone solution, and use the silicon chloride-acetone solution to impregnate and modify the reinforced fiber fabric and the reinforced fiber monofilament respectively. After the modification is completed, take them out and dry to obtain the modified reinforced fiber fabric and the modified reinforced fiber monofilament; S3 Take the diluted rubber compound and add silicon chloride to obtain an impregnating rubber compound. Use the impregnating rubber compound to impregnate the modified reinforced fiber fabric. After the impregnation treatment is completed, extrude the excess rubber compound to obtain a reinforcing material layer; take the base rubber compound and add the modified reinforced fiber monofilament, and disperse evenly to obtain an adhesive; S4 Take mica paper as the substrate, coat the adhesive on one or both surfaces to obtain an adhesive layer, then lay the reinforcing material layer flat on the surface of the adhesive layer, and perform the first rolling at room temperature to extrude the excess rubber compound while obtaining a mica tape blank paper; S5 Heat the mica tape blank paper obtained in step S4 in a drying oven at a temperature of 50°C to 70°C, keep the temperature of the rolling surface at 90 to 110°C for the second rolling after the heat drying is completed, and perform drying, slitting, and winding in sequence after the rolling is completed to obtain the finished product of the low-resin mica tape.

2. The preparation method of low-resin mica tape using hot pressing according to claim 1, characterized in that The mixture rubber compound includes 100 parts of epoxy resin, 15 to 20 parts of hyperbranched polyester resin, 10 to 15 parts of poly (2-hydroxyethyl methacrylate), 5 to 7 parts of organosiloxane, and 7 to 9 parts of functional filler according to the mass ratio relationship; the hyperbranched polyester resin is a hyperbranched polyester resin with an average molecular weight of 30,000 to 50,000, and the organosiloxane contains silicon hydroxyl groups, phenyl groups, or vinyl groups; When preparing the mixture rubber compound, first mix the epoxy resin and the hyperbranched polyester resin and heat them to 170 to 190°C, keep it for 10 to 15 minutes, then raise the temperature to 190 to 210°C under continuous stirring and keep it warm for 30 to 45 minutes. During this process, add the functional filler and the organosiloxane together; among them, the functional filler is added once; the organosiloxane is added slowly and continuously, and the mixture rubber compound is kept in a continuously stirred and dispersed state during the addition process and the heat preservation process of the organosiloxane; after the heat treatment is completed, keep stirring and cool. When it is cooled to 60 to 70°C, add poly (2-hydroxyethyl methacrylate), keep stirring and warming for 8 to 15 minutes, and then continue to cool to room temperature to obtain the mixture rubber compound.

3. The preparation method of the mica tape with less adhesive using hot pressing according to claim 2, wherein During the preparation process of the mixture rubber compound, 2,4,6-tris(dimethylaminomethyl)phenol is also added as an accelerator, and the addition amount of the accelerator is 0.03 to 0.05 wt% of the mass of the base rubber compound.

4. The preparation method of the mica tape with less glue using hot pressing molding according to claim 2, characterized in that, The functional filler is one or a combination of alumina powder, aluminum nitride powder, boron oxide, boron nitride, and silicon nitride.

5. The preparation method of low-binder mica tape using hot pressing forming according to claim 1, characterized in that, The organic solvent used for diluting the base rubber compound is a reactive diluent, and an epoxy group capable of participating in the curing reaction is added to the reactive diluent; and the dilution ratio of diluting the base rubber compound with the reactive diluent is 1:3 to 1:

5.

6. The preparation method of the mica tape with less glue using hot pressing forming according to claim 1, characterized in that, The content of silicon chloride in the silicon chloride-acetone solution is 25 to 30 wt%; the mass ratio of silicon chloride added to the impregnating rubber compound is 13 to 15 wt%.

7. The method for preparing a mica tape with less glue by hot pressing according to claim 1, characterized in that, Before impregnating and modifying the reinforcing fiber fabric and the reinforcing fiber monofilament with the silicon chloride-acetone solution, the corresponding reinforcing fiber fabric and the reinforcing fiber monofilament are first impregnated in a silane coupling agent for pretreatment.

8. The method for preparing a mica tape with less adhesive by hot pressing according to claim 1, characterized in that, The reinforcing fiber fabric is one of a glass fiber mesh fabric, a ceramic fiber mesh fabric, a metal fiber mesh fabric, and a carbon fiber mesh fabric.

9. The preparation method of the mica tape with less adhesive using hot pressing according to claim 1, characterized in that The reinforcing fiber monofilament is one of an aramid fiber monofilament, a glass fiber monofilament, a ceramic fiber monofilament, a metal fiber monofilament, and a carbon fiber monofilament.

10. The method for preparing a mica tape with less glue by hot pressing according to claim 1, characterized in that, When performing two rolling operations, the rolling pressure of the second rolling is set to be 1.5 to 1.8 times that of the first rolling, and the rolling pressure of the second rolling is controlled to be 8 to 15 MPa.