Display panel, display device and manufacturing method of display panel

Abstract

Embodiments of the present application disclose a display panel, a display device and a manufacturing method of the display panel. The display panel comprises a substrate, a first binding portion and a second binding portion are protruded from a first side of the substrate, a conductive layer comprises a first conductive portion and a second conductive portion, the sum of the thickness of the first conductive portion and the first binding portion is less than the sum of the thickness of the second conductive portion and the second binding portion; a light emitting element comprises a first sub light emitting element and a second sub light emitting element, the thickness of the first sub light emitting element is greater than the thickness of the second sub light emitting element, and the height of the first sub light emitting element relative to the substrate is equal to the height of the second sub light emitting element relative to the substrate. The present application adjusts the relationship between the sum of the thickness of the first conductive portion and the first binding portion and the sum of the thickness of the second conductive portion and the second binding portion, so that the height of the first sub light emitting element and the second sub light emitting element with different thicknesses relative to the substrate is the same, thereby helping to improve the uniformity of the overall display of the display panel.

Description

Technical Field

[0001] This application relates to the field of displays, specifically to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] With the development of display technology, display panels have become increasingly diversified. Among them, Micro-LED has gained popularity due to its high resolution and color accuracy, low power consumption, and thinner profile. However, in the transfer process of existing Micro-LEDs, the different thicknesses of the LEDs create step differences. This leads to uneven stress on the LEDs during transfer and soldering, or the surfaces of the LEDs not being on the same plane, resulting in dark spots and other phenomena, ultimately causing uneven display on the display panel. Summary of the Invention

[0003] This application provides a display panel, a display device, and a method for manufacturing a display panel, which can solve the problem of uneven display caused by the difference in step between light-emitting elements in existing display panels.

[0004] This application provides a display panel, including:

[0005] The substrate has a first side and a second side opposite to each other, and at least a first bonding portion and a second bonding portion that are electrically connected to the substrate are protruding on the first side.

[0006] The conductive layer includes a first conductive portion and a second conductive portion, wherein the first conductive portion is electrically connected to the side of the first bonding portion opposite to the first side, and the second conductive portion is electrically connected to the side of the second bonding portion opposite to the first side; the sum of the thicknesses of the first conductive portion and the first bonding portion is less than the sum of the thicknesses of the second conductive portion and the second bonding portion.

[0007] The light-emitting element includes a first sub-light-emitting element and a second sub-light-emitting element, wherein the first sub-light-emitting element is electrically connected to the side of the first conductive portion opposite to the first side, and the second sub-light-emitting element is electrically connected to the side of the second conductive portion opposite to the first side.

[0008] The thickness of the first sub-light-emitting element is greater than the thickness of the second sub-light-emitting element; the height of the side of the first sub-light-emitting element facing away from the first side relative to the first side is equal to the height of the side of the second sub-light-emitting element facing away from the first side relative to the first side.

[0009] Optionally, in some embodiments of this application, the thickness of the first conductive portion is less than the thickness of the second conductive portion.

[0010] Optionally, in some embodiments of this application, the first conductive part includes a plurality of first conductive particles, and the second conductive part includes a plurality of second conductive particles, wherein the particle size of the first conductive particles is smaller than the particle size of the second conductive particles.

[0011] Optionally, in some embodiments of this application, the thickness of the first binding portion is less than the thickness of the second binding portion.

[0012] Optionally, in some embodiments of this application, the first binding part includes a first support part and a first welding part arranged sequentially in a direction away from the first side, and the second binding part includes a second support part and a second welding part arranged sequentially in a direction away from the first side.

[0013] The thickness of the first support portion is less than the thickness of the second support portion; and / or,

[0014] The thickness of the first welded part is less than the thickness of the second welded part.

[0015] Optionally, in some embodiments of this application, a third bonding portion is further protruding on the first side; the conductive layer includes a third conductive portion, which is electrically connected to the side of the third bonding portion away from the first side; the light-emitting element includes a third sub-light-emitting element, which is electrically connected to the side of the third conductive portion away from the first side.

[0016] The thickness of the third sub-light-emitting element is less than the thickness of the second sub-light-emitting element; the height of the side of the third sub-light-emitting element away from the first side relative to the first side is equal to the height of the side of the second sub-light-emitting element away from the first side relative to the first side.

[0017] Accordingly, this application also provides a display device, which includes the display panel described in any of the above claims.

[0018] Accordingly, this application also provides a method for manufacturing a display panel, the method comprising:

[0019] A substrate is provided, the substrate having opposing first and second sides;

[0020] A first bonding portion and a second bonding portion electrically connected to the substrate are formed on the first side surface;

[0021] A first conductive portion is formed on the side of the first bonding portion away from the first side, and a second conductive portion is formed on the side of the second bonding portion away from the first side, such that the sum of the thicknesses of the first conductive portion and the first bonding portion is less than the sum of the thicknesses of the second conductive portion and the second bonding portion; the first conductive portion and the second conductive portion constitute a conductive layer;

[0022] A light-emitting element is provided, the light-emitting element comprising a first sub-light-emitting element and a second sub-light-emitting element, wherein the thickness of the first sub-light-emitting element is greater than the thickness of the second sub-light-emitting element;

[0023] The first sub-light-emitting element is moved to the side of the first conductive portion that is away from the first side, and the second sub-light-emitting element is moved to the side of the second conductive portion that is away from the first side, so that the height of the side of the first sub-light-emitting element away from the first side relative to the first side is equal to the height of the side of the second sub-light-emitting element away from the first side relative to the first side.

[0024] The light-emitting elements are pressed together to electrically connect the first sub-light-emitting element and the second sub-light-emitting element to the substrate.

[0025] Optionally, in some embodiments of this application, forming a first bonding portion and a second bonding portion electrically connected to the substrate on the first side includes:

[0026] A first support portion and a second support portion are formed on the first side, such that the thickness of the first support portion is less than the thickness of the second support portion;

[0027] A first welding portion is formed on the first support portion, and a second welding portion is formed on the second support portion, so that the first welding portion and the second welding portion are electrically connected to the substrate; the first support portion and the first welding portion constitute a first bonding portion, and the second support portion and the second welding portion constitute a second bonding portion.

[0028] Optionally, in some embodiments of this application, forming a first conductive portion on the side of the first binding portion opposite to the first side and forming a second conductive portion on the side of the second binding portion opposite to the first side includes:

[0029] A first conductive adhesive is applied to the side of the first bonding portion opposite to the first side. The first conductive adhesive includes a plurality of first conductive particles, and the plurality of first conductive particles form a first conductive portion.

[0030] A second conductive adhesive is applied to the side of the second bonding portion opposite to the first side. The second conductive adhesive includes a plurality of second conductive particles, which form a second conductive portion. The particle size of the second conductive particles is larger than that of the first conductive particles.

[0031] In this embodiment, the display panel includes a substrate, a conductive layer, and light-emitting elements arranged sequentially. A first bonding portion and a second bonding portion protrude from a first side of the substrate. The conductive layer includes a first conductive portion electrically connected to the first bonding portion and a second conductive portion electrically connected to the second bonding portion. The sum of the thicknesses of the first conductive portion and the first bonding portion is less than the sum of the thicknesses of the second conductive portion and the second bonding portion. The light-emitting element includes a first sub-light-emitting element electrically connected to the first conductive portion and a second sub-light-emitting element electrically connected to the second conductive portion. The thickness of the first sub-light-emitting element is greater than the thickness of the second sub-light-emitting element. The height of the first sub-light-emitting element relative to the substrate is equal to the height of the second sub-light-emitting element relative to the substrate. This application, by adjusting the relationship between the sum of the thicknesses of the first conductive portion and the first bonding portion and the sum of the thicknesses of the second conductive portion and the second bonding portion, makes the heights of the first sub-light-emitting elements and the second sub-light-emitting elements of different thicknesses relative to the substrate the same, thereby helping to improve the overall uniformity of the display panel. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0034] Figure 2 This is a schematic diagram of another display panel structure provided in an embodiment of this application.

[0035] Figure 3 This is a top view of the structure of a display panel provided in an embodiment of this application;

[0036] Figure 4 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0037] Figure 5 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0038] Figure 6 This is one of the embodiments provided in this application. Figure 5 A schematic diagram of the structure of step S200;

[0039] Figure 7 This is another embodiment provided in this application. Figure 5 A schematic diagram of the structure of step S200;

[0040] Figure 8 This is yet another embodiment provided in this application. Figure 5 A schematic diagram of the structure of step S200;

[0041] Figure 9 This is one of the embodiments provided in this application. Figure 5 Schematic diagram of the structure of step S300;

[0042] Figure 10 This is another embodiment provided in this application. Figure 5 Schematic diagram of the structure of step S300;

[0043] Figure 11 This is one of the embodiments provided in this application. Figure 5 Top view of the structure of step S300.

[0044] Explanation of reference numerals in the attached figures:

[0045]

[0046] Detailed Implementation

[0047] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0048] This application provides a display panel, a display device, and a display panel, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0049] First, this application provides a display panel, such as... Figure 1 and Figure 2As shown, the display panel 100 includes a substrate 110. The substrate 110 has a first side 111 and a second side 112 facing each other. At least a first bonding portion 120 and a second bonding portion 130 that are electrically connected to the substrate 110 are protruding on the first side 111. The first bonding portion 120 and the second bonding portion 130 are used to connect with subsequent devices to realize the electrical connection between the subsequent devices and the substrate 110.

[0050] The substrate 110 includes a substrate layer and a driving circuit layer arranged sequentially along the second side 112 toward the first side 111. The driving circuit layer includes a plurality of driving structures arranged in an array. The first bonding portion 120 and the second bonding portion 130 are electrically connected to the corresponding driving structures. By regulating the driving signals on the driving structures, the control of subsequent devices connected to the first bonding portion 120 and the second bonding portion 130 can be realized.

[0051] The display panel 100 includes a conductive layer 150, which includes a first conductive portion 151 and a second conductive portion 152. The first conductive portion 151 is electrically connected to the side of the first bonding portion 120 opposite to the first side surface 111, and the second conductive portion 152 is electrically connected to the side of the second bonding portion 130 opposite to the first side surface 111. In addition to its conductive function, the conductive layer 150 also serves an adhesive function, facilitating effective connection and conduction between subsequent devices and the first bonding portion 120 and the second bonding portion 130, thereby enabling conduction between the subsequent devices and the driving structure in the substrate 110.

[0052] The sum of the thicknesses of the first conductive part 151 and the first binding part 120 is less than the sum of the thicknesses of the second conductive part 152 and the second binding part 130, that is, there is a difference between the sum of the thicknesses of the first conductive part 151 and the first binding part 120 and the sum of the thicknesses of the second conductive part 152 and the second binding part 130.

[0053] Due to the differences in the types of subsequent components, such as the light-emitting element 160, there are thickness differences between different types of light-emitting elements 160 during the manufacturing process, i.e., there are step differences. Setting the sum of the thicknesses of the first conductive part 151 and the first bonding part 120 to be different from the sum of the thicknesses of the second conductive part 152 and the second bonding part 130 helps to ensure that after the light-emitting element 160 is connected to the first conductive part 151 and the second conductive part 152, the side of the light-emitting element 160 away from the first side 111 is on the same plane, thereby improving the display uniformity of the display panel 100.

[0054] The display panel 100 includes light-emitting elements 160, such as... Figures 1 to 3As shown, the light-emitting element 160 includes a first sub-light-emitting element 161 and a second sub-light-emitting element 162. The first sub-light-emitting element 161 is electrically connected to the side of the first conductive portion 151 opposite to the first side surface 111, and the second sub-light-emitting element 162 is electrically connected to the side of the second conductive portion 152 opposite to the first side surface 111, so as to realize the electrical connection between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 and the substrate 110.

[0055] It should be noted that, since the first sub-light-emitting element 161 and the second sub-light-emitting element 162 emit different colors, their thicknesses will differ during the manufacturing process. In this embodiment, the first sub-light-emitting element 161 represents a first type of sub-light-emitting element 160, and the second sub-light-emitting element 162 represents a second type of sub-light-emitting element 160. That is, the light-emitting element 160 may include multiple first sub-light-emitting elements 161 and multiple second sub-light-emitting elements 162, with the multiple first sub-light-emitting elements 161 having the same thickness and the multiple second sub-light-emitting elements 162 having the same thickness.

[0056] In this design, the thickness of the first sub-light-emitting element 161 is greater than the thickness of the second sub-light-emitting element 162. Simultaneously, the height of the side of the first sub-light-emitting element 161 facing away from the first side 111 relative to the first side 111 is the same as the height of the side of the second sub-light-emitting element 162 facing away from the first side 111 relative to the first side 111. That is, the sum of the thicknesses of the first sub-light-emitting element 161, the first conductive portion 151, and the first bonding portion 120 is equal to the sum of the thicknesses of the second sub-light-emitting element 162, the second conductive portion 152, and the second bonding portion 130. In other words, the side of the light-emitting element 160 facing away from the first side 111 is a plane relative to the first side 111, and the light-emitting element 160 is electrically connected to the driving structure in the substrate 110, thereby ensuring the display uniformity of the display panel 100.

[0057] It should be noted that the first sub-light-emitting element 161 and the second sub-light-emitting element 162 have connection terminals that are electrically connected to the first conductive part 151 and the second conductive part 152 respectively on the side facing the first side 111. In the embodiments of this application, the thickness of the first sub-light-emitting element 161 and the second sub-light-emitting element 162 is described, including the corresponding connection terminals, that is, the thickness value is the maximum thickness value of the first sub-light-emitting element 161 and the second sub-light-emitting element 162.

[0058] The distance between the light-emitting element 160 and the substrate 110 is the sum of the thicknesses of the corresponding bonding portion and the conductive portion. Since the thicknesses of the first sub-light-emitting element 161 and the second sub-light-emitting element 162 are different, the sum of the thicknesses of the first bonding portion 120 and the first conductive portion 151 is also different from the sum of the thicknesses of the second bonding portion 130 and the second conductive portion 152. By adjusting the thickness relationship between the first bonding portion 120 and the second bonding portion 130 and the thickness relationship between the first conductive portion 151 and the second conductive portion 152, the light-emitting element 160 can be effectively electrically connected to the substrate 110 while ensuring the flatness of the overall surface of the light-emitting element 160. This avoids dark spots and other phenomena in the display panel 100 and improves the display uniformity of the display panel 100.

[0059] In this embodiment, the first sub-light-emitting element 161 is electrically connected to the substrate 110 using the first conductive part 151 and the first bonding part 120, and the second sub-light-emitting element 162 is electrically connected to the substrate 110 using the second conductive part 152 and the second bonding part 130. By adjusting the sum of the thicknesses of the first conductive part 151 and the first bonding part 120 and the sum of the thicknesses of the second conductive part 152 and the second bonding part 130, although the thicknesses of the first sub-light-emitting element 161 and the second sub-light-emitting element 162 are different, their heights relative to the substrate 110 are consistent. This avoids the phenomenon of dark spots appearing on the display panel 100 due to the step difference between the first sub-light-emitting element 161 and the second sub-light-emitting element 162, thereby improving the display uniformity of the display panel 100.

[0060] Optional, such as Figure 1 and Figure 9 As shown, the thickness of the first conductive portion 151 is less than the thickness of the second conductive portion 152. When the first conductive portion 151 and the second conductive portion 152 are respectively formed on the first binding portion 120 and the second binding portion 130, the thickness of the first conductive portion 151 can be set to be less than the thickness of the second conductive portion 152, so that the sum of the thicknesses of the first conductive portion 151 and the first binding portion 120 is less than the sum of the thicknesses of the second conductive portion 152 and the second binding portion 130, while the sum of the thicknesses of the first sub-light-emitting element 161, the first conductive portion 151 and the first binding portion 120 is equal to the sum of the thicknesses of the second sub-light-emitting element 162, the second conductive portion 152 and the second binding portion 130.

[0061] The thickness of the first binding part 120 can be equal to the thickness of the second binding part 130, or the thickness of the first binding part 120 can be less than the thickness of the second binding part 130, or the thickness of the first binding part 120 can be greater than the thickness of the second binding part 130. The specific setting relationship can be adjusted according to the actual design and usage requirements, and no special restrictions are imposed here.

[0062] Optionally, the conductive layer 150 can be made of conductive adhesive containing conductive particles. When the light-emitting element 160 is transferred to the substrate 110, the light-emitting element 160 mainly achieves electrical connection with the corresponding bonding part through the conductive particles in the conductive layer 150, thereby realizing the electrical connection between the light-emitting element 160 and the substrate 110.

[0063] The first conductive part 151 includes a plurality of first conductive particles 1511, and the second conductive part 152 includes a plurality of second conductive particles 1521. The particle size of the first conductive particles 1511 is smaller than that of the second conductive particles 1521, so that the distance between the first sub-light-emitting element 161 and the first bonding part 120 is smaller than the distance between the second sub-light-emitting element 162 and the second bonding part 130, so that the side of the first sub-light-emitting element 161 facing away from the first side 111 and the side of the second sub-light-emitting element 162 facing away from the first side 111 are on the same plane, thereby ensuring the display uniformity of the display panel 100.

[0064] It should be noted that the conductive particles in the conductive layer 150 are covered with an insulating layer. When the light-emitting element 160 is transferred to the substrate 110, pressure needs to be applied to the side of the light-emitting element 160 away from the first side 111 for hot pressing, so that the insulating layer on the surface of the conductive particles will break under the pressure, thereby realizing the conduction between the light-emitting element 160 and the corresponding bonding part, and thus realizing the conduction between the light-emitting element 160 and the substrate 110.

[0065] At this time, if the thickness of the first bonding part 120 is equal to the thickness of the second bonding part 130, then the absolute value of the difference in particle size between the first conductive particle 1511 and the second conductive particle 1521 is equal to the absolute value of the difference in thickness between the first sub-light-emitting element 161 and the second sub-light-emitting element 162. This arrangement makes there only one variable between the conductive part and the bonding part, which helps to simplify the structural design and manufacturing process of the display panel 100.

[0066] If the thickness of the first bonding portion 120 is less than the thickness of the second bonding portion 130, and the thickness difference between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 remains unchanged, it helps to reduce the size difference between the first conductive particles 1511 and the second conductive particles 1521, thereby helping to reduce the difference in the electrical connection effect between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 and the corresponding bonding portion.

[0067] If the thickness of the first binding portion 120 is greater than the thickness of the second binding portion 130, the particle size difference between the first conductive particle 1511 and the second conductive particle 1521 will be greater. While keeping the particle size of the second conductive particle 1521 unchanged, the particle size of the first conductive particle 1511 can be further reduced, thereby helping to improve the dispersion uniformity of the multiple first conductive particles 1511 in the first conductive portion 151.

[0068] The first conductive particle 1511 and the second conductive particle 1521 are made of the same material. For example, if the first conductive particle 1511 and the second conductive particle 1521 are gold spheres, using conductive particles of the same material helps to ensure the consistency of the electrical connection effect between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 and the corresponding bonding part.

[0069] It should be noted that the first conductive particle 1511 and the second conductive particle 1521 can have a certain elasticity, so that when pressure is applied to the side of the first sub-light-emitting element 161 and the second sub-light-emitting element 162 away from the first side 111, the first conductive particle 1511 and the second conductive particle 1521 can be squeezed and deformed to increase the contact area between the light-emitting element 160 and the corresponding bonding part, and improve the electrical connection effect between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 and the substrate 110.

[0070] Optional, such as Figure 2 As shown, the thickness of the first bonding portion 120 is less than the thickness of the second bonding portion 130. When the first bonding portion 120 and the second bonding portion 130 are formed on the first side surface 111 of the substrate 110, the thickness of the first bonding portion 120 can be set to be less than the thickness of the second bonding portion 130, so that the sum of the thicknesses of the first conductive portion 151 and the first bonding portion 120 is less than the sum of the thicknesses of the second conductive portion 152 and the second bonding portion 130, while the sum of the thicknesses of the first sub-light-emitting element 161, the first conductive portion 151 and the first bonding portion 120 is equal to the sum of the thicknesses of the second sub-light-emitting element 162, the second conductive portion 152 and the second bonding portion 130.

[0071] The thickness of the first conductive part 151 can be equal to the thickness of the second conductive part 152, that is, the particle size of the first conductive particle 1511 and the second conductive particle 1521 is equal. Alternatively, the thickness of the first conductive part 151 can be less than the thickness of the second conductive part 152, or the thickness of the first conductive part 151 can be greater than the thickness of the second conductive part 152. The specific arrangement can be adjusted according to the actual design and usage requirements, and no special restrictions are imposed here.

[0072] Optional, such as Figure 8As shown, the first binding part 120 includes a first support part 121 and a first welding part 122 arranged sequentially in a direction away from the first side 111, and the second binding part 130 includes a second support part 131 and a second welding part 132 arranged sequentially in a direction away from the first side 111. The first welding part 122 and the second welding part 132 are used to electrically connect with the corresponding first sub-light-emitting element 161 and the second sub-light-emitting element 162. The first support part 121 and the second support part 131 are respectively used to adjust the distance between the first welding part 122 and the first sub-light-emitting element 161 and between the second welding part 132 and the second sub-light-emitting element 162.

[0073] It should be noted that the first support portion 121 and the second support portion 131 can be inorganic film layers added to the first side surface 111 of the substrate 110 after the substrate 110 is fabricated. The first support portion 121 and the second support portion 131 can be formed using the same photomask. At the same time, the first support portion 121 and the second support portion 131 are provided with openings to facilitate the electrical connection between the first welding portion 122 and the second welding portion 132 and the substrate 110.

[0074] In some embodiments, the thickness of the first support portion 121 is less than the thickness of the second support portion 131, and the thickness of the first welding portion 122 is equal to the thickness of the second welding portion 132. That is, when adjusting the thickness difference between the first bonding portion 120 and the second bonding portion 130, it is mainly achieved by adjusting the thickness difference between the first support portion 121 and the second support portion 131. This arrangement makes the thickness of the first welding portion 122 and the second welding portion 132 used for electrical connection consistent, which helps to reduce the difference in electrical connection effect between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 and the substrate 110.

[0075] In other embodiments, the thickness of the first welding portion 122 is less than the thickness of the second welding portion 132, and the thickness of the first support portion 121 is equal to the thickness of the second support portion 131. That is, when adjusting the thickness difference between the first bonding portion 120 and the second bonding portion 130, it is mainly achieved by adjusting the thickness difference between the first welding portion 122 and the second welding portion 132. This arrangement makes the distance between the first welding portion 122 and the second welding portion 132 and the internal film layer of the substrate 110 the same, which is helpful for the electrical connection design between the first welding portion 122 and the second welding portion 132 and the internal film layer of the substrate 110.

[0076] In some other embodiments, the thickness of the first support portion 121 is less than the thickness of the second support portion 131, and the thickness of the first welding portion 122 is less than the thickness of the second welding portion 132. That is, when adjusting the thickness difference between the first binding portion 120 and the second binding portion 130, the thickness difference between the first support portion 121 and the second support portion 131 and the thickness difference between the first welding portion 122 and the second welding portion 132 are also adjusted simultaneously, so as to avoid the thickness difference corresponding to a single part being too large and affecting the connection effect between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 and the substrate 110.

[0077] It should be noted that, since the distance between the first sub-light-emitting element 161 and the substrate 110 includes the first conductive part 151 and the first bonding part 120, and the distance between the second sub-light-emitting element 162 and the substrate 110 includes the second conductive part 152 and the second bonding part 130, when adjusting the distance between the light-emitting element 160 and the substrate 110, the thickness difference between the first conductive part 151 and the second conductive part 152, as well as the thickness difference between the first bonding part 120 and the second bonding part 130, can be adjusted simultaneously, or only the thickness difference of some of the structures can be adjusted. The specific adjustment objects and adjustment methods can be adjusted according to design requirements, and no special restrictions are imposed here.

[0078] Among them, such as Figure 7 As shown, the first binding part 120 may only include the first welding part 122, and the second binding part 130 may include both the second support part 131 and the second welding part 132. The thicknesses of the first welding part 122 and the second welding part 132 are equal, and the thicknesses of the first conductive part 151 and the second conductive part 152 are equal. In this case, the absolute value of the thickness difference between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 is equal to the thickness value of the second support part 131.

[0079] Furthermore, the first bonding portion 120 may include only the first welding portion 122, and the second bonding portion 130 may include only the second welding portion 132. If the thicknesses of the first conductive portion 151 and the second conductive portion 152 are equal, then the absolute value of the thickness difference between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 is equal to the absolute value of the thickness difference between the first welding portion 122 and the second welding portion 132.

[0080] Optionally, a third bonding portion 140 is also provided on the first side surface 111, the conductive layer 150 includes a third conductive portion 153, the third conductive portion 153 is electrically connected to the side of the third bonding portion 140 away from the first side surface 111, and the light-emitting element 160 includes a third sub-light-emitting element 163, the third sub-light-emitting element 163 is electrically connected to the side of the third conductive portion 153 away from the first side surface 111.

[0081] The thickness of the third sub-light-emitting element 163 is less than that of the second sub-light-emitting element 162. The height of the side of the third sub-light-emitting element 163 facing away from the first side 111 relative to the first side 111 is equal to the height of the side of the second sub-light-emitting element 162 facing away from the first side 111 relative to the first side 111. That is, the light-emitting element 160 includes three sub-light-emitting elements of different thicknesses. In order to ensure the uniformity of the overall display of the display panel 100, the thickness of the third conductive part 153 and the third bonding part 140 needs to be adjusted so that the sides of the first sub-light-emitting element 161, the second sub-light-emitting element 162, and the third sub-light-emitting element 163 facing away from the first side 111 are on the same plane.

[0082] It should be noted that, as Figure 9 and Figure 10 As shown, the third conductive part 153 includes a third conductive particle 1531. The design method of the thickness difference between the third conductive part 153 and the second conductive part 152 or the first conductive part 151 can refer to the design method of the thickness difference between the second conductive part 152 and the first conductive part 151. That is, the design method of the particle size difference between the third conductive particle 1531 and the second conductive particle 1521 or the first conductive particle 1511 can refer to the design method of the particle size difference between the second conductive particle 1521 and the first conductive particle 1511. It will not be described in detail here. It is only necessary to ensure the flatness of the overall surface of the light-emitting element 160 to achieve the purpose of improving the display uniformity of the display panel 100.

[0083] Similarly, such as Figure 8 As shown, the third binding part 140 includes a third support part 141 and a third welding part 142 arranged sequentially in a direction away from the first side 111. The design method of the thickness difference between the third binding part 140 and the second binding part 130 or the first binding part 120 can refer to the design method of the thickness difference between the second binding part 130 and the first binding part 120 described above. It will not be described in detail here. It is only necessary to ensure the flatness of the overall surface of the light-emitting element 160 in order to improve the display uniformity of the display panel 100.

[0084] Optionally, the light-emitting element 160 in this embodiment includes a red sub-light-emitting element 160, a blue sub-light-emitting element 160, and a green sub-light-emitting element 160. In actual manufacturing, the thickness of the red sub-light-emitting element 160 is greater than the thickness of the blue sub-light-emitting element 160, and the thickness of the blue sub-light-emitting element 160 is greater than the thickness of the green sub-light-emitting element 160. Therefore, in this embodiment, the first sub-light-emitting element 161 can correspond to the red sub-light-emitting element 160, the second sub-light-emitting element 162 can correspond to the blue sub-light-emitting element 160, and the third sub-light-emitting element 163 can correspond to the green sub-light-emitting element 160.

[0085] It should be noted that the thickness relationship of the first sub-light-emitting element 161, the second sub-light-emitting element 162 and the third sub-light-emitting element 163 in the embodiments of this application only indicates their relative size and is not limited to specific referents. When the thickness relationship of the sub-light-emitting elements 160 of different colors changes, the corresponding referents can also change accordingly.

[0086] Secondly, this application embodiment also provides a display device, which includes a display panel. The specific structure of the display panel is as described in the above embodiments. Since this display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0087] like Figure 4 As shown, the display device 10 includes a display panel 100, a control circuit 200, and a housing 300. The housing 300 is connected to the display panel 100 to support and fix the display panel 100. The control circuit 200 is disposed inside the housing 300 and is electrically connected to the display panel 100 to control the display panel 100 to display images.

[0088] The display panel 100 can be fixed to the housing 300, forming an integral whole. The display panel 100 and the housing 300 form a sealed space to house the control circuit 200. The control circuit 200 can be the mainboard of the display device 10. Furthermore, the control circuit 200 can integrate one or more functional components such as a battery, antenna structure, microphone, speaker, headphone jack, universal serial bus interface, camera, proximity sensor, ambient light sensor, and processor, enabling the display device 10 to adapt to various application fields.

[0089] It should be noted that the display device 10 is not limited to the above-mentioned components. It may also include other components, such as a camera, an antenna structure, a fingerprint unlocking module, etc., to expand its application scope. No restrictions are imposed here.

[0090] The display device 10 in this application embodiment has a wide range of applications, including flexible displays such as televisions, computers, mobile phones, foldable and rollable displays, and lighting, as well as wearable devices such as smart bracelets and smartwatches, all of which fall within the application field of the display device 10 in this application embodiment.

[0091] Finally, this application also provides a method for manufacturing a display panel, which can be used to manufacture the display panel described in the above embodiments. Figure 5 As shown, the manufacturing method of the display panel mainly includes the following steps:

[0092] S100, a substrate 110 is provided, the substrate 110 having opposing first side surface 111 and second side surface 112.

[0093] When manufacturing the display panel 100, a substrate 110 is first required. The substrate 110 has a first side 111 and a second side 112 facing each other. The substrate 110 includes a substrate layer and a driving circuit layer sequentially disposed along the second side 112 toward the first side 111. The driving circuit layer includes a plurality of driving structures arranged in an array. The driving structures are used to make electrical connections with subsequent devices. By regulating the driving signals on the driving structures, the subsequent devices can be controlled, thereby realizing the regulation of the display mode of the display panel 100.

[0094] S200, a first bonding portion 120 and a second bonding portion 130 that are electrically connected to the substrate 110 are formed on the first side surface 111.

[0095] like Figures 6 to 8 As shown, after the substrate 110 is fabricated, a first bonding portion 120 and a second bonding portion 130 that are electrically connected to the substrate 110 are formed on the first side 111 of the substrate 110. The first bonding portion 120 and the second bonding portion 130 are used to connect with subsequent devices and can also be used to position the subsequent devices so as to realize the electrical connection between the subsequent devices and the substrate 110.

[0096] S300, a first conductive portion 151 is formed on the side of the first binding portion 120 away from the first side surface 111, and a second conductive portion 152 is formed on the side of the second binding portion 130 away from the first side surface 111, such that the sum of the thicknesses of the first conductive portion 151 and the first binding portion 120 is less than the sum of the thicknesses of the second conductive portion 152 and the second binding portion 130; the first conductive portion 151 and the second conductive portion 152 constitute a conductive layer 150.

[0097] like Figures 9 to 11 As shown, after the fabrication of the first bonding portion 120 and the second bonding portion 130 is completed, a first conductive portion 151 is formed on the side of the first bonding portion 120 opposite to the first side surface 111, and a second conductive portion 152 is formed on the side of the second bonding portion 130 opposite to the first side surface 111. The first conductive portion 151 and the second conductive portion 152 constitute a conductive layer 150. In addition to its conductive function, the conductive layer 150 also has an adhesive function, so as to facilitate the effective connection and conduction between subsequent devices and the first bonding portion 120 and the second bonding portion 130, thereby realizing the conduction between subsequent devices and the driving structure in the substrate 110.

[0098] The sum of the thicknesses of the first conductive part 151 and the first binding part 120 is less than the sum of the thicknesses of the second conductive part 152 and the second binding part 130, that is, there is a difference between the sum of the thicknesses of the first conductive part 151 and the first binding part 120 and the sum of the thicknesses of the second conductive part 152 and the second binding part 130.

[0099] Due to the differences in the types of subsequent components, such as the light-emitting element 160, there are thickness differences between different types of light-emitting elements 160 during the manufacturing process, i.e., there are step differences. Setting the sum of the thicknesses of the first conductive part 151 and the first bonding part 120 to be different from the sum of the thicknesses of the second conductive part 152 and the second bonding part 130 helps to ensure that after the light-emitting element 160 is connected to the first conductive part 151 and the second conductive part 152, the side of the light-emitting element 160 away from the first side 111 is on the same plane, thereby improving the display uniformity of the display panel 100.

[0100] S400, a light-emitting element 160 is provided, the light-emitting element 160 includes a first sub-light-emitting element 161 and a second sub-light-emitting element 162, the thickness of the first sub-light-emitting element 161 is greater than the thickness of the second sub-light-emitting element 162.

[0101] When fabricating the substrate 110, the first bonding portion 120, the second bonding portion 130, and the conductive layer 150, the fabrication and preparation of the light-emitting element 160 can be carried out simultaneously, thereby saving the overall fabrication time of the display panel 100. The light-emitting element 160 includes a first sub-light-emitting element 161 and a second sub-light-emitting element 162, and the thickness of the first sub-light-emitting element 161 is greater than the thickness of the second sub-light-emitting element 162.

[0102] It should be noted that, since the first sub-light-emitting element 161 and the second sub-light-emitting element 162 emit different colors, their thicknesses will differ during the manufacturing process. In this embodiment, the first sub-light-emitting element 161 represents a first type of sub-light-emitting element 160, and the second sub-light-emitting element 162 represents a second type of sub-light-emitting element 160. That is, the light-emitting element 160 may include multiple first sub-light-emitting elements 161 and multiple second sub-light-emitting elements 162, with the multiple first sub-light-emitting elements 161 having the same thickness and the multiple second sub-light-emitting elements 162 having the same thickness.

[0103] S500, the first sub-light-emitting element 161 is transferred to the side of the first conductive part 151 that is away from the first side surface 111, and the second sub-light-emitting element 162 is transferred to the side of the second conductive part 152 that is away from the first side surface 111, so that the height of the side of the first sub-light-emitting element 161 that is away from the first side surface 111 relative to the first side surface 111 is equal to the height of the side of the second sub-light-emitting element 162 that is away from the first side surface 111 relative to the first side surface 111.

[0104] After the light-emitting element 160 is prepared, the first sub-light-emitting element 161 is transferred to the side of the first conductive part 151 that is away from the first side 111, and the second sub-light-emitting element 162 is transferred to the side of the second conductive part 152 that is away from the first side 111. The height of the side of the first sub-light-emitting element 161 that is away from the first side 111 relative to the first side 111 is equal to the height of the side of the second sub-light-emitting element 162 that is away from the first side 111 relative to the first side 111.

[0105] The distance between the light-emitting element 160 and the substrate 110 is the sum of the thicknesses of the corresponding bonding portion and the conductive portion. Since the thicknesses of the first sub-light-emitting element 161 and the second sub-light-emitting element 162 are different, the sum of the thicknesses of the first bonding portion 120 and the first conductive portion 151 is also different from the sum of the thicknesses of the second bonding portion 130 and the second conductive portion 152. By adjusting the thickness relationship between the first bonding portion 120 and the second bonding portion 130 and the thickness relationship between the first conductive portion 151 and the second conductive portion 152, the flatness of the overall surface of the light-emitting element 160 can be ensured, thereby avoiding dark spots and other phenomena in the display panel 100 and improving the display uniformity of the display panel 100.

[0106] S600, the light-emitting element 160 is pressed together so that the first sub-light-emitting element 161 and the second sub-light-emitting element 162 are electrically connected to the substrate 110.

[0107] After the transfer of the light-emitting element 160 is completed, pressure is applied to the side of the light-emitting element 160 away from the first side 111 to thermally press the light-emitting element 160 as a whole with the substrate 110, so that the first sub-light-emitting element 161 and the second sub-light-emitting element 162 are electrically connected to the substrate 110.

[0108] Since the height of the side of the first sub-light-emitting element 161 facing away from the first side 111 relative to the first side 111 is equal to the height of the side of the second sub-light-emitting element 162 facing away from the first side 111 relative to the first side 111, the force on the first sub-light-emitting element 161 and the second sub-light-emitting element 162 is more uniform when pressure is applied. This can prevent dark spots from appearing on the display panel 100, while also ensuring the overall flatness of the surface of the light-emitting element 160 and improving the display uniformity of the display panel 100.

[0109] Optionally, in step S200 of this application embodiment, when forming the first bonding portion 120 and the second bonding portion electrically connected to the substrate 110 on the first side surface 111, the main contents include the following:

[0110] First, a first support portion 121 and a second support portion 131 are formed on the first side surface 111, such that the thickness of the first support portion 121 is less than the thickness of the second support portion 131. Then, a first welding portion 122 is formed on the first support portion 121, and a second welding portion 132 is formed on the second support portion 131, so that the first welding portion 122 and the second welding portion 132 are electrically connected to the substrate 110. The first support portion 121 and the first welding portion 122 constitute a first bonding portion 120, and the second support portion 131 and the second welding portion 132 constitute a second bonding portion 130.

[0111] Specifically, when forming the first support portion 121 and the second support portion 131 on the first side surface 111, an inorganic layer can be deposited on the first side surface 111 of the substrate 110 first, and then the inorganic layer can be patterned to form the first support portion 121 and the second support portion 131, and the thickness of the first support portion 121 can be less than the thickness of the second support portion 131.

[0112] The first support portion 121 and the second support portion 131 can be formed simultaneously using a single photomask; alternatively, two inorganic layers can be sequentially formed on the substrate 110 and then photomasked to form the first support portion 121 and the second support portion 131. Furthermore, while forming the first support portion 121 and the second support portion 131, openings need to be formed on both to facilitate electrical connection between subsequent structures and the substrate 110.

[0113] After the fabrication of the first support portion 121 and the second support portion 131 is completed, a metal layer is deposited on the first support portion 121 and the second support portion 131, and then the metal layer is patterned to form the first welding portion 122 and the second welding portion 132. The first welding portion 122 and the second welding portion 132 are electrically connected to the substrate 110 through the openings on the first support portion 121 and the second support portion 131, respectively.

[0114] It should be noted that the thickness relationship between the first support portion 121 and the second support portion 131, as well as the thickness relationship between the first welding portion 122 and the second welding portion 132, can refer to the relevant description of the structure of the display panel 100 in the above embodiments. It is only necessary to ensure that the sum of the thicknesses of the first conductive portion 151 and the first bonding portion 120 is less than the sum of the thicknesses of the second conductive portion 152 and the second bonding portion 130. No special restrictions are imposed here.

[0115] Optionally, in step S300 of this embodiment, when the first conductive portion 151 is formed on the side of the first bonding portion 120 opposite to the first side surface 111, and the second conductive portion 152 is formed on the side of the second bonding portion 130 opposite to the first side surface 111, the following main contents are included:

[0116] First, a first conductive adhesive is applied to the side of the first bonding portion 120 opposite to the first side surface 111. The first conductive adhesive includes a plurality of first conductive particles 1511, which are used to form the first conductive portion 151. Then, a second conductive adhesive is applied to the side of the second bonding portion 130 opposite to the first side surface 111. The second conductive adhesive includes a plurality of second conductive particles 1521, which are used to form the second conductive portion 152. The particle size of the second conductive particles 1521 is larger than that of the first conductive particles 1511.

[0117] Specifically, when applying the first and second conductive adhesives, a dispensing method can be used to distribute conductive adhesives containing conductive particles of different sizes onto the first bonding portion 120 and the second bonding portion 130. The conductive particles are coated with an insulating layer. When transferring the light-emitting element 160 to the substrate 110, pressure is applied to the side of the light-emitting element 160 away from the first side surface 111 for thermo-pressing. This causes the insulating layer on the surface of the conductive particles to rupture under pressure, thereby achieving conductivity between the light-emitting element 160 and the corresponding bonding portion, and ultimately achieving conductivity between the light-emitting element 160 and the substrate 110.

[0118] It should be noted that the first conductive particle 1511 and the second conductive particle 1521 are made of the same material. For example, if the first conductive particle 1511 and the second conductive particle 1521 are gold spheres, using conductive particles of the same material helps to ensure the consistency of the electrical connection effect between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 and the corresponding bonding part.

[0119] The first conductive particle 1511 and the second conductive particle 1521 are elastic, so that when pressure is applied to the side of the first sub-light-emitting element 161 and the second sub-light-emitting element 162 away from the first side 111, the first conductive particle 1511 and the second conductive particle 1521 can be squeezed and deformed to increase the contact area between the light-emitting element 160 and the corresponding bonding part, and improve the electrical connection effect between the first sub-light-emitting element 161 and the second sub-light-emitting element 162 and the substrate 110.

[0120] It should be noted that the particle size relationship between the first conductive particle 1511 and the second conductive particle 1521 in this embodiment can be adjusted according to actual design requirements. It is not limited to the particle size of the second conductive particle 1521 being larger than that of the first conductive particle 1511. The specific setting method can refer to the relevant description of the structure of the display panel 100 in the above embodiment. It is only necessary to ensure that the sum of the thicknesses of the first conductive part 151 and the first bonding part 120 is less than the sum of the thicknesses of the second conductive part 152 and the second bonding part 130. No special restrictions are imposed here.

[0121] The above provides a detailed description of a display panel, display device, and method for manufacturing the display panel according to embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display panel, characterized in that, include: The substrate has a first side and a second side opposite to each other. At least a first binding part and a second binding part are protruding on the first side and electrically connected to the substrate, and are spaced apart. The first binding part and the second binding part are respectively electrically connected to the corresponding driving structure. The conductive layer includes a first conductive portion and a second conductive portion. The first conductive portion is electrically connected to the side of the first bonding portion opposite to the first side, and the second conductive portion is electrically connected to the side of the second bonding portion opposite to the first side. The sum of the thicknesses of the first conductive portion and the first bonding portion is less than the sum of the thicknesses of the second conductive portion and the second bonding portion. The first conductive portion includes a plurality of first conductive particles, and the second conductive portion includes a plurality of second conductive particles. The particle size of the first conductive particles is smaller than the particle size of the second conductive particles. The light-emitting element includes a first sub-light-emitting element and a second sub-light-emitting element. The first sub-light-emitting element is electrically connected to the side of the first conductive portion away from the first side, and the second sub-light-emitting element is electrically connected to the side of the second conductive portion away from the first side. Both the first sub-light-emitting element and the second sub-light-emitting element are Micro LEDs. The thickness of the first sub-light-emitting element is greater than the thickness of the second sub-light-emitting element. The particle size difference between the first conductive particle and the second conductive particle is configured to compensate for the thickness difference between the first sub-light-emitting element and the second sub-light-emitting element. The height of the side of the first sub-light-emitting element away from the first side relative to the first side is equal to the height of the side of the second sub-light-emitting element away from the first side relative to the first side, so that the light-emitting surfaces of the first sub-light-emitting element and the second sub-light-emitting element are flush.

2. The display panel according to claim 1, characterized in that, The thickness of the first conductive part is less than the thickness of the second conductive part.

3. The display panel according to claim 1, characterized in that, The thickness of the first binding part is less than the thickness of the second binding part.

4. The display panel according to claim 3, characterized in that, The first binding part includes a first support part and a first welding part arranged sequentially in a direction away from the first side; the second binding part includes a second support part and a second welding part arranged sequentially in a direction away from the first side. The thickness of the first support portion is less than the thickness of the second support portion; and / or, The thickness of the first welded part is less than the thickness of the second welded part.

5. The display panel according to claim 1, characterized in that, The first side surface is further provided with a third bonding portion; the conductive layer includes a third conductive portion, which is electrically connected to the side of the third bonding portion away from the first side surface; the light-emitting element includes a third sub-light-emitting element, which is electrically connected to the side of the third conductive portion away from the first side surface. The thickness of the third sub-light-emitting element is less than the thickness of the second sub-light-emitting element; the height of the side of the third sub-light-emitting element away from the first side relative to the first side is equal to the height of the side of the second sub-light-emitting element away from the first side relative to the first side.

6. A display device, characterized in that, The display device includes the display panel according to any one of claims 1 to 5.

7. A method for manufacturing a display panel, characterized in that, The method includes: A substrate is provided, the substrate having opposing first and second sides; A first bonding portion and a second bonding portion are formed on the first side surface and are electrically connected to the substrate, and are spaced apart. The first bonding portion and the second bonding portion are respectively electrically connected to the corresponding driving structure. A first conductive portion is formed on the side of the first bonding portion opposite to the first side, and a second conductive portion is formed on the side of the second bonding portion opposite to the first side, such that the sum of the thicknesses of the first conductive portion and the first bonding portion is less than the sum of the thicknesses of the second conductive portion and the second bonding portion; the first conductive portion includes a plurality of first conductive particles, and the second conductive portion includes a plurality of second conductive particles, wherein the particle size of the first conductive particles is smaller than the particle size of the second conductive particles; the first conductive portion and the second conductive portion constitute a conductive layer. A light-emitting element is provided, the light-emitting element including a first sub-light-emitting element and a second sub-light-emitting element, the thickness of the first sub-light-emitting element being greater than the thickness of the second sub-light-emitting element, the particle size difference between the first conductive particle and the second conductive particle being configured to compensate for the thickness difference between the first sub-light-emitting element and the second sub-light-emitting element, and both the first sub-light-emitting element and the second sub-light-emitting element being Micro LEDs. The first sub-light-emitting element is moved to the side of the first conductive portion away from the first side, and the second sub-light-emitting element is moved to the side of the second conductive portion away from the first side, so that the height of the side of the first sub-light-emitting element away from the first side relative to the first side is equal to the height of the side of the second sub-light-emitting element away from the first side relative to the first side, so that the light-emitting surfaces of the first sub-light-emitting element and the second sub-light-emitting element are flush. The light-emitting elements are pressed together to electrically connect the first sub-light-emitting element and the second sub-light-emitting element to the substrate.

8. The method for manufacturing a display panel according to claim 7, characterized in that, The first bonding portion and the second bonding portion, which are electrically connected to the substrate, are formed on the first side surface, including: A first support portion and a second support portion are formed on the first side, such that the thickness of the first support portion is less than the thickness of the second support portion; A first welding portion is formed on the first support portion, and a second welding portion is formed on the second support portion, so that the first welding portion and the second welding portion are electrically connected to the substrate; the first support portion and the first welding portion constitute a first bonding portion, and the second support portion and the second welding portion constitute a second bonding portion.

9. The method for manufacturing a display panel according to claim 7, characterized in that, The method of forming a first conductive portion on the side of the first binding portion opposite to the first side and forming a second conductive portion on the side of the second binding portion opposite to the first side includes: A first conductive adhesive is applied to the side of the first bonding portion opposite to the first side. The first conductive adhesive includes a plurality of first conductive particles, and the plurality of first conductive particles form a first conductive portion. A second conductive adhesive is applied to the side of the second bonding portion opposite to the first side. The second conductive adhesive includes a plurality of second conductive particles, and the plurality of second conductive particles form a second conductive portion.

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