Integrated processing method of chip integrated communication sensor signal based on plating structure

Abstract

The present invention discloses a chip integrated communication sensor signal integrated processing method based on a coating structure, wherein a voltage-sensitive two-dimensional layered material coating is coated on the surface of a chip integrated waveguide and a modulation voltage carrying a high-speed communication signal is applied, and the communication signal loading of the transmission light field is realized by adjusting the refractive index of the chip integrated waveguide by changing the free carrier concentration; the low-frequency sensing signal is loaded on the high-frequency communication signal using the all-optical communication signal as a carrier and the environmental variable sensitive two-dimensional layered material coating as a carrier; the sensing signal and the communication signal are demodulated respectively, thus realizing the integrated processing of the communication sensing signal. The present invention makes full use of the performance advantages of the coating structure in high-performance electro-optical modulation and high-sensitivity environmental sensing, effectively expands the functional scope of a single chip integrated optical circuit, and provides a solution for miniaturized, tightly coupled communication sensing integrated equipment.

Description

Technical Field

[0001] The present invention belongs to the interdisciplinary field of integrated optics, optical communication, optical sensing and microwave photonics, and specifically refers to a communication sensing signal integrated processing method that realizes communication signal encoding by adjusting the refractive index of a chip integrated waveguide through the change of free carrier concentration generated by a two-dimensional layered material coating such as transition metal sulfide under the action of an external voltage, realizes sensor signal loading by utilizing the response of the coating to an external physical quantity, and respectively demodulates the communication signal carrying the sensor signal, and more particularly relates to a chip integrated communication sensing signal integrated processing method, system and storage medium based on a coating structure. Background Art

[0002] Chip-integrated optical circuits can be used to construct optoelectronic information systems such as optical communication systems, optical computing systems, optical phased arrays, and microwave photon signal processing systems. Compared with traditional free-space optical circuits and all-fiber optical circuits, they have many advantages such as small size, low power consumption, low cost, easy integration, relatively stable performance, and mass production. The comprehensive performance of chip-integrated optoelectronic information systems is highly dependent on the performance of each discrete device. They are composed of a series of active and passive devices. Common active devices include micro-lasers, nanowire detectors, optical modulators, tunable filters, tunable attenuators, etc.; common passive devices include directional couplers, optical beam splitters, wavelength division multiplexers, polarization beam splitters, etc.

[0003] As an important active device, optical modulator plays an important role in all-optical signal encoding and decoding, optical interference, optical switching and other applications. The electro-optical signal conversion achieved by electro-optical modulator is an important bridge connecting the electrical domain and the optical domain in microwave photonic systems. On the other hand, two-dimensional layered materials represented by graphene and transition metal sulfides are sensitive to environmental variables such as temperature, light, and electromagnetic radiation, and can be used as important carriers to realize various high-sensitivity sensing functions. Summary of the invention

[0004] Based on the problems of the prior art, the technical problem to be solved by the present invention is how to coat the surface of the transmission waveguide with a voltage-sensitive two-dimensional layered material coating and grow an external electrode, load the communication signal on the coating in the form of a modulated voltage, change the free carrier concentration, adjust the refractive index of the chip integrated waveguide, and realize the electro-optical phase modulation of the transmission light field, that is, realize all-optical communication signal modulation; coat the surface of the transmission waveguide with a two-dimensional layered material coating that is sensitive to environmental variables, the environmental variables will cause the free carrier concentration to change, adjust the refractive index of the chip integrated waveguide, and realize the secondary modulation of the all-optical communication signal, that is, realize the loading of the sensor signal; demodulate the signals carrying communication and sensor information separately, that is, realize the integrated processing of communication and sensor signals with two functions in one link.

[0005] In view of the defects existing in the prior art, the purpose of the present invention is to provide an integrated processing method of chip-integrated communication sensor signals based on a coating structure, which fully utilizes the electro-optical modulation and sensor detection efficiency of the two-dimensional layered material coating, connects the optical domain and other physical domains, and provides a solution for the chip-integrated microwave photonic system to simultaneously realize communication sensing functions.

[0006] In order to achieve the above-mentioned effect, the present invention provides an integrated processing method for chip-integrated communication sensor signals based on a coating structure, which is executed by a system consisting of an optical beam splitter and a light intensity detector. The pulse optical carrier is separated into two optical paths in equal proportion by the optical beam splitter, and the chip-integrated waveguide corresponding to one of the optical paths is coated with a voltage-sensitive two-dimensional layered material coating. The voltage-sensitive two-dimensional layered material coating is coated on the surface of the chip-integrated waveguide and a modulation voltage carrying a high-speed communication signal is applied. The refractive index of the chip-integrated waveguide is adjusted by changing the free carrier concentration to realize the loading of the communication signal of the transmitted light field. The all-optical communication signal is used as the carrier and the environmental variable sensitive two-dimensional layered material coating is used as the carrier to load the low-frequency sensor signal on the high-frequency communication signal. The signal carrying both communication and sensor data is transmitted to the demodulation end to demodulate the sensor signal and the communication signal respectively, thereby realizing the integrated processing of the communication sensor signal.

[0007] Preferably, the above method specifically includes:

[0008] S101, the pulse optical carrier is separated into two optical paths in equal proportion by an optical beam splitter, a voltage-sensitive two-dimensional layered material coating is coated on the chip integrated waveguide corresponding to one of the optical paths, a communication signal coded 01000111 is loaded on the coating structure by an external voltage to realize phase modulation, and an intensity-modulated non-return-to-zero all-optical communication signal is output through a Mach-Zehnder interferometer structure;

[0009] S102, covering the all-optical communication signal output waveguide with an environmental variable sensitive two-dimensional layered material coating, wherein within a time window corresponding to an 8-bit communication code, a temperature change from low to high will cause a phase change from positive to negative of the all-optical communication signal;

[0010] S103. The signal carrying the dual data of communication and sensing is transmitted to the demodulation end. The signal can be separated into two optical paths by an optical beam splitter, one of which can be directly detected by a light intensity detector to realize the demodulation of the communication signal, and the other can be detected by a light intensity detector after interfering with the reference light of the same repetition rate to realize the demodulation of the sensing signal.

[0011] Preferably, in the above method, under the premise of adjusting the optical path structure and replacing environmental variable sensitive materials, communication signals and sensor signals can also be loaded on other optical degrees of freedom.

[0012] Preferably, the above method uses the same optical system to load the sensing signal onto the all-optical communication signal, and the communication signal and the sensing signal are compiled on different optical degrees of freedom.

[0013] Preferably, the above method comprises:

[0014] S1. Loading of communication signals: Loading the communication signals onto the voltage-sensitive two-dimensional layered material coating through external electrodes, adjusting the refractive index of the chip integrated waveguide by changing the free carrier concentration and realizing electro-optical phase modulation of the transmitted light field, and generating an all-optical communication signal whose intensity replicates the electrical signal through structures such as interferometers;

[0015] S2, loading of sensing signals, passing the all-optical communication signals through a chip integrated waveguide covered with a two-dimensional layered material coating that is sensitive to environmental variables, and the change in environmental variables causes the free carriers to cause the refractive index to change. At this time, the phase of the all-optical communication signal will carry the sensing information;

[0016] S3. The communication signal and the sensor signal are demodulated separately, and the communication signal is analyzed by an intensity detector and the sensor signal is analyzed by a phase detector, so as to realize the integrated processing of the communication and sensor signals with two functions on the same chip, the same carrier, the same link.

[0017] Preferably, the above method comprises:

[0018] Step 1: Prepare the transmission waveguide required for electro-optical modulation and sensing detection, and optimize the cross-sectional structure;

[0019] Step 2: non-destructively transfer the two-dimensional layered material coating to the waveguide surface by chemical vapor deposition or other methods, and optimize the design of the voltage-sensitive coating thickness;

[0020] Step 3: Load the sensing signal onto the all-optical communication signal, and demodulate them separately using the chip integrated optical circuit to achieve integrated processing of communication and sensing signals.

[0021] Preferably, the above step 1 is optimized to make the transmission loss low and the waveguide refractive index change sensitively, the waveguide length for electro-optical modulation needs to be optimized to take into account both low transmission loss and large modulation depth, and the spatial arrangement needs to be optimized to make the coating structure as accurately covered as possible and easy to grow external electrodes with low contact resistance.

[0022] Preferably, the above step 2 is optimized to maximize the free carrier concentration per unit voltage and minimize the dissipation time. The thickness of the environmental variable sensitive coating needs to be optimized to maximize the dynamic range of free carrier concentration per unit physical quantity and minimize the switching time. The coating can fit tightly to the upper and side surfaces of the waveguide or only to the upper surface. The voltage sensitive coating material needs to be insensitive to the environmental variables to be measured.

[0023] A system for realizing the above-mentioned integrated chip integrated communication sensor signal processing method based on the coating structure includes a system composed of an optical beam splitter and a light intensity detector, and also includes a communication signal loading module, a sensor signal loading module, a communication signal demodulation module and a sensor signal demodulation module, wherein:

[0024] The communication signal loading module is used to load the communication signal onto the voltage-sensitive two-dimensional layered material coating through an external electrode, adjust the refractive index of the chip integrated waveguide by changing the free carrier concentration and realize the electro-optical phase modulation of the transmitted light field, and generate an all-optical communication signal whose intensity replicates the electrical signal through structures such as an interferometer;

[0025] The communication signal demodulation module and the sensor signal demodulation module are used to analyze the communication signal using the intensity detector and analyze the sensor signal using the phase detector, so as to realize the integrated processing of the communication and sensor signals with two functions on the same chip, the same carrier and the same link.

[0026] A computer-readable storage medium stores a computer program, which implements the above method when executed by a processor.

[0027] A computer program product comprises a computer program / instruction, which implements the steps of the above method when executed by a processor.

[0028] Compared with the prior art, the present invention has the following advantages:

[0029] 1. The present invention can solve the problem of silicon-based electro-optical modulation through the coating structure, improve the free carrier dissipation speed, increase the modulation depth and modulation bandwidth, and prevent waveguide breakdown caused by excessive modulation voltage;

[0030] 2. The present invention can realize high-sensitivity perception of environmental variables such as temperature and electromagnetic radiation through the coating structure, providing an important idea for information conversion from multi-physical fields to optical fields;

[0031] 3. The integrated communication sensor signal processing method proposed in the present invention can realize two functions simultaneously based on a set of chips and a link, and points out the direction for multifunctional information terminals based on chip-integrated microwave photonic systems;

[0032] 4. The system described in the present invention has a simple structure, reliable performance, and is highly compatible with existing preparation processes. It is particularly suitable for realizing hybrid integrated optoelectronic systems with large system scale, complex structure and functions, a large number of devices, and support for multiple functions. It also plays an important role in promoting integrated optics. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the following briefly introduces the drawings required for use in the embodiment of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 A schematic diagram showing the working principle of integrated processing of chip-integrated communication sensor signals based on a plating structure of the present invention is shown. DETAILED DESCRIPTION

[0035] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and Examples. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0037] The present invention provides an embodiment of a chip-integrated communication sensor signal integrated processing method based on a coating structure, which is executed by a system consisting of an optical beam splitter and a light intensity detector. A pulse optical carrier is proportionally separated into two optical paths by the optical beam splitter, wherein a chip-integrated waveguide corresponding to one of the optical paths is coated with a voltage-sensitive two-dimensional layered material coating, the voltage-sensitive two-dimensional layered material coating is coated on the surface of the chip-integrated waveguide and a modulation voltage carrying a high-speed communication signal is applied, and the refractive index of the chip-integrated waveguide is adjusted by changing the free carrier concentration to realize the loading of the communication signal of the transmission light field, using an all-optical communication signal as a carrier and an environmental variable-sensitive two-dimensional layered material coating as a carrier, a low-frequency sensor signal is loaded on a high-frequency communication signal, and a signal carrying both communication and sensor data is transmitted to a demodulation end to demodulate the sensor signal and the communication signal respectively, thereby realizing the integrated processing of the communication sensor signal.

[0038] In some embodiments, the chip integrated waveguide can be prepared by a standard chip integrated optical path process, has a certain degree of freedom in structural design, can efficiently and losslessly transmit light fields, and can produce a change in refractive index under the action of free carriers. The material platform used for the chip integrated waveguide includes but is not limited to silicon on insulator, hydrogenated amorphous silicon, silicon nitride, silicon carbide, chalcogenide glass, high refractive index quartz, III-V aluminum gallium arsenide, III-V indium phosphide, etc., and can adopt a single material integration method or a multi-material hybrid integration method;

[0039] In some embodiments, the coating can control parameters through the growth process, can be losslessly transferred to the surface of the chip integrated waveguide through standard processes and achieve close fitting, and can accurately control electro-optical parameters with crystal structure and layer thickness as degrees of freedom; the voltage-sensitive two-dimensional layered material coating can serve as a substrate to stably grow electrodes and produce physical responses such as changes in free carrier concentration under the action of external voltage; the environmental variable-sensitive two-dimensional layered material coating can produce physical responses under the action of environmental variables, and the physical response can cause changes in the optical refractive index. The coating materials include but are not limited to graphene, molybdenum disulfide, tungsten sulfide, perovskite, etc., and the specific structural parameters and preparation process are not limited.

[0040] In some embodiments, the integrated processing of communication and sensing signals utilizes the same optical system to load the sensing signals onto the all-optical communication signals. The communication signals and sensing signals are compiled on different optical degrees of freedom. The coding degrees of freedom include but are not limited to intensity, polarization, phase, mode, etc., and are not limited to waveguide structure parameters, external electrode structure and process, specific structure of the encoding and decoding system, detection method, specific communication coding protocol, and specific sensing environment variables.

[0041] like Figure 1 As shown, the present invention provides an embodiment of a chip integrated communication sensor signal integrated processing method based on a plating structure, comprising:

[0042] S101, the pulse optical carrier is separated into two optical paths in equal proportion by an optical beam splitter, a voltage-sensitive two-dimensional layered material coating is coated on the chip integrated waveguide corresponding to one of the optical paths, a communication signal coded 01000111 is loaded on the coating structure by an external voltage to realize phase modulation, and an intensity-modulated non-return-to-zero all-optical communication signal is output through a Mach-Zehnder interferometer structure;

[0043] S102, covering the all-optical communication signal output waveguide with a two-dimensional layered material coating that is sensitive to environmental variables (such as temperature), and within a time window corresponding to an 8-bit communication code, a change in temperature from low to high will cause a change in the all-optical communication signal phase from positive to negative;

[0044] S103. The signal carrying the dual data of communication and sensing is transmitted to the demodulation end. The signal can be separated into two optical paths by an optical beam splitter, one of which can be directly detected by a light intensity detector to realize the demodulation of the communication signal, and the other can be detected by a light intensity detector after interfering with the reference light of the same repetition rate to realize the demodulation of the sensing signal.

[0045] Figure 1 Only one integrated processing method of communication signal intensity modulation and sensor signal phase modulation is demonstrated. In some embodiments, communication signals and sensor signals can also be loaded on other optical degrees of freedom under the premise of adjusting the optical path structure and replacing environmental variable sensitive materials.

[0046] The present invention provides an embodiment of a chip integrated communication sensor signal integrated processing method based on a plating structure, comprising:

[0047] S1. Loading of communication signals: Loading the communication signals onto the voltage-sensitive two-dimensional layered material coating through external electrodes, adjusting the refractive index of the chip integrated waveguide by changing the free carrier concentration and realizing electro-optical phase modulation of the transmitted light field, and generating an all-optical communication signal whose intensity replicates the electrical signal through structures such as interferometers;

[0048] S2, loading of sensing signals, passing the all-optical communication signals through a chip integrated waveguide covered with a two-dimensional layered material coating that is sensitive to environmental variables, and the change in environmental variables causes the free carriers to cause the refractive index to change. At this time, the phase of the all-optical communication signal will carry the sensing information;

[0049] S3. The communication signal and the sensor signal are demodulated separately, and the communication signal is analyzed by an intensity detector and the sensor signal is analyzed by a phase detector, so as to realize the integrated processing of the communication and sensor signals with two functions on the same chip, the same carrier, the same link.

[0050] The present invention provides an embodiment of a chip integrated communication sensor signal integrated processing method based on a plating structure, comprising:

[0051] Step 1: Prepare the transmission waveguide required for electro-optical modulation and sensing detection, and optimize the cross-sectional structure;

[0052] Step 2: non-destructively transfer the two-dimensional layered material coating to the waveguide surface by chemical vapor deposition or other methods, and optimize the design of the voltage-sensitive coating thickness;

[0053] Step 3: Load the sensing signal onto the all-optical communication signal, and demodulate them separately using the chip integrated optical circuit to achieve integrated processing of communication and sensing signals.

[0054] In some embodiments, step one optimizes the design so that the transmission loss is low and the waveguide refractive index changes sensitively. The waveguide length for electro-optical modulation needs to be optimized to take into account both low transmission loss and large modulation depth. The spatial arrangement needs to be optimized to make the coating structure as accurately covered as possible and easy to grow external electrodes with low contact resistance.

[0055] In some embodiments, the step 2 is optimized to maximize the free carrier concentration per unit voltage and minimize the dissipation time. The thickness of the environmental variable sensitive coating needs to be optimized to maximize the dynamic range of free carrier concentration per unit physical quantity and minimize the switching time. The coating can fit tightly to the upper and side surfaces of the waveguide or just the upper surface. The voltage sensitive coating material needs to be insensitive to the environmental variables to be measured.

[0056] The present invention provides a system embodiment for realizing the above-mentioned chip integrated communication sensor signal integrated processing method based on the coating structure, comprising a system composed of an optical beam splitter and a light intensity detector, and also comprising a communication signal loading module, a sensor signal loading module, a communication signal demodulation module and a sensor signal demodulation module, wherein:

[0057] The communication signal loading module is used to load the communication signal onto the voltage-sensitive two-dimensional layered material coating through an external electrode, adjust the refractive index of the chip integrated waveguide by changing the free carrier concentration and realize the electro-optical phase modulation of the transmitted light field, and generate an all-optical communication signal whose intensity replicates the electrical signal through structures such as an interferometer;

[0058] The communication signal demodulation module and the sensor signal demodulation module are used to analyze the communication signal using the intensity detector and analyze the sensor signal using the phase detector, so as to realize the integrated processing of the communication and sensor signals with two functions on the same chip, the same carrier and the same link.

[0059] The present invention also provides an embodiment of a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, the above method is implemented.

[0060] The present invention also provides an embodiment of a computer program, which implements the above method when executed by a processor.

[0061] Compared with the prior art, the present invention has the following advantages:

[0062] Firstly, the present invention can solve the problem of silicon-based electro-optical modulation through the coating structure, improve the free carrier dissipation speed, increase the modulation depth and modulation bandwidth, and prevent waveguide breakdown caused by excessive modulation voltage;

[0063] Secondly, the present invention can achieve high-sensitivity perception of environmental variables such as temperature and electromagnetic radiation through the coating structure, providing an important reference for the information conversion from multi-physical fields to optical fields;

[0064] Furthermore, the integrated communication sensor signal processing method proposed in the present invention can realize two functions simultaneously based on a set of chips and a link, and points out the direction for multifunctional information terminals based on chip-integrated microwave photonic systems;

[0065] In addition, the system described in the present invention has a simple structure, reliable performance, and is highly compatible with existing preparation processes. It is particularly suitable for realizing hybrid integrated optoelectronic systems with large system scale, complex structure and functions, a large number of devices, and support for multiple functions. It also plays an important role in promoting integrated optics.

[0066] For the convenience of description, the above device is described in various units according to their functions. Of course, when implementing the present application, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0067] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0068] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0069] The present application may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0070] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0071] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0072] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0073] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0074] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0075] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0076] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0077] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A method for integrated processing of chip integrated communication sensor signals based on a coating structure, which is executed by a system consisting of an optical beam splitter and a light intensity detector. The pulse optical carrier is proportionally separated into two optical paths by the optical beam splitter, and a chip integrated waveguide corresponding to one of the optical paths is coated with a voltage-sensitive two-dimensional layered material coating. The voltage-sensitive two-dimensional layered material coating is coated on the surface of the chip integrated waveguide and a modulation voltage carrying a high-speed communication signal is applied. The refractive index of the chip integrated waveguide is adjusted by changing the free carrier concentration to realize the communication signal loading of the transmission light field. The all-optical communication signal is used as a carrier and the environmental variable sensitive two-dimensional layered material coating is used as a carrier. The low-frequency sensor signal is loaded on the high-frequency communication signal, and the signal carrying both communication and sensor data is transmitted to the demodulation end to demodulate the sensor signal and the communication signal respectively, so as to realize the integrated processing of the communication sensor signal. The environmental variable includes temperature or electromagnetic radiation. The environmental variable sensitive two-dimensional layered material coating is coated on the all-optical communication signal output waveguide. In the time window corresponding to the 8-bit communication code, the change of temperature from low to high will cause the phase of the all-optical communication signal to change from positive to negative.

2. The integrated processing method for chip integrated communication sensor signals based on the plating structure according to claim 1 is characterized in that: The method specifically comprises: S101, the pulse optical carrier is separated into two optical paths in equal proportion by an optical beam splitter, a voltage-sensitive two-dimensional layered material coating is coated on the chip integrated waveguide corresponding to one of the optical paths, a communication signal coded 01000111 is loaded on the coating structure by an external voltage to realize phase modulation, and an intensity-modulated non-return-to-zero all-optical communication signal is output through a Mach-Zehnder interferometer structure; S102, covering the all-optical communication signal output waveguide with an environmental variable sensitive two-dimensional layered material coating, wherein within a time window corresponding to an 8-bit communication code, a temperature change from low to high will cause a phase change from positive to negative of the all-optical communication signal; S103. The signal carrying the dual data of communication and sensing is transmitted to the demodulation end. The signal can be separated into two optical paths by an optical beam splitter, one of which can be directly detected by a light intensity detector to realize the demodulation of the communication signal, and the other can be detected by a light intensity detector after interfering with the reference light of the same repetition rate to realize the demodulation of the sensing signal.

3. The integrated processing method for chip integrated communication sensor signals based on the coating structure according to claim 2 is characterized in that: The method can load communication signals and sensor signals onto other optical degrees of freedom under the premise of adjusting the optical path structure and replacing environmental variable sensitive materials.

4. The integrated processing method for chip integrated communication sensor signals based on a plating structure according to claim 1 or 2, characterized in that: The method uses the same optical system to load the sensing signal onto the all-optical communication signal, and the communication signal and the sensing signal are compiled on different optical degrees of freedom.

5. The integrated processing method for chip integrated communication sensor signals based on the plating structure according to claim 1 is characterized in that: The method comprises: S1. Loading of communication signals: Loading the communication signals onto the voltage-sensitive two-dimensional layered material coating through external electrodes, adjusting the refractive index of the chip integrated waveguide by changing the free carrier concentration and realizing electro-optical phase modulation of the transmitted light field, and generating an all-optical communication signal whose intensity replicates the electrical signal through an interferometer; S2, loading of sensing signals, passing the all-optical communication signals through a chip integrated waveguide covered with a two-dimensional layered material coating that is sensitive to environmental variables, and the change in environmental variables causes the free carriers to cause the refractive index to change. At this time, the phase of the all-optical communication signal will carry the sensing information; S3. The communication signal and the sensor signal are demodulated separately, and the communication signal is analyzed by an intensity detector and the sensor signal is analyzed by a phase detector, so as to realize the integrated processing of the communication and sensor signals with the same chip, the same carrier, the same link and two functions.

6. The integrated processing method for chip integrated communication sensor signals based on a plating structure according to claim 1 is characterized in that: The method comprises: Step 1: Prepare the transmission waveguide required for electro-optical modulation and sensing detection, and optimize the cross-sectional structure; Step 2: non-destructively transfer the two-dimensional layered material coating to the waveguide surface by chemical vapor deposition, and optimize the design of the voltage-sensitive coating thickness; Step 3: Load the sensing signal onto the all-optical communication signal, and demodulate them separately using the chip integrated optical circuit to achieve integrated processing of communication and sensing signals.

7. The integrated processing method for chip integrated communication sensor signals based on the plating structure according to claim 6 is characterized in that: The step 1 is to optimize the design so that the transmission loss is low and the waveguide refractive index changes sensitively. The waveguide length for electro-optical modulation needs to be optimized to take into account both low transmission loss and large modulation depth. The spatial arrangement needs to be optimized to make the coating structure as accurately covered as possible and easy to grow external electrodes with low contact resistance.

8. The integrated processing method for chip integrated communication sensor signals based on a plating structure according to claim 6 is characterized in that: The optimization design of step 2 makes the free carrier concentration generated per unit voltage maximum and the dissipation time shortest. The thickness of the environmental variable sensitive coating needs to be optimized to make the dynamic range of the free carrier concentration generated per unit physical quantity maximum and the switching time shortest. The coating can be tightly attached to the upper surface and side surface of the waveguide or only to the upper surface. The voltage sensitive coating material needs to be insensitive to the environmental variables to be measured.

9. A system for implementing the integrated processing method of chip integrated communication sensor signals based on the coating structure as claimed in claims 1-8, comprising a system consisting of an optical beam splitter and a light intensity detector, and also comprising a communication signal loading module, a sensor signal loading module, a communication signal demodulation module and a sensor signal demodulation module, wherein: The communication signal loading module is used to load the communication signal onto the voltage-sensitive two-dimensional layered material coating through an external electrode, adjust the refractive index of the chip integrated waveguide by changing the free carrier concentration and realize the electro-optical phase modulation of the transmission light field, and generate an all-optical communication signal whose intensity replicates the electrical signal through the interferometer structure; The communication signal demodulation module and the sensor signal demodulation module are used to analyze the communication signal using the intensity detector and analyze the sensor signal using the phase detector, so as to realize the integrated processing of the communication and sensor signals with the same chip, the same carrier, the same link and two functions.

10. A computer-readable storage medium having a computer program stored thereon, wherein the program, when executed by a processor, implements the method according to any one of claims 1 to 8.

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