Display panel and display device

Abstract

The display panel and the display device provided by the present disclosure comprise: an array substrate and an opposite substrate, the array substrate is provided with a grounding terminal in a binding area extending out of the opposite substrate; the opposite substrate comprises a black matrix facing the array substrate and a transparent conductive layer away from the array substrate; the black matrix comprises a first part, a second part and an isolation groove, the first part, the isolation groove and the second part are arranged in sequence in the direction from the display area to the binding area, and the isolation groove separates the first part and the second part; conductive glue connects the grounding terminal and the transparent conductive layer, part of the conductive glue is filled between the array substrate and the opposite substrate, and the orthographic projection of the part of the conductive glue on the array substrate and the orthographic projection of the first part on the array substrate do not overlap with each other; a blocking structure is filled between the array substrate and the opposite substrate, the blocking structure is in contact with the part of the conductive glue, and is used for blocking the conductive glue before curing from overflowing to the area where the first part is located.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to the technical field of display, and in particular, to a display panel and a display device. BACKGROUND

[0002] Liquid Crystal Display (LCD) has the advantages of light weight, low power consumption, low radiation and convenient carrying, and is widely used in modern information equipment, such as display, television, mobile phone and digital product. SUMMARY

[0003] Embodiments of the present disclosure provide a display panel and a display device, and the specific solutions are as follows:

[0004] In one aspect, the present disclosure provides a display panel, comprising:

[0005] An array substrate comprising a display area and a frame area located around the display area, at least part of the frame area on one side of the display area serving as a binding area, the array substrate being provided with a grounding terminal in the binding area;

[0006] A counter substrate opposite to the array substrate, the orthographic projection of the counter substrate on the array substrate and the binding area not overlapping each other; the counter substrate comprising a black matrix provided on the side facing the array substrate and a transparent conductive layer provided on the side away from the array substrate; wherein the black matrix comprises a first part, a second part and an isolation groove, the first part, the isolation groove and the second part being arranged in sequence in the direction from the display area to the binding area, the isolation groove separating the first part and the second part;

[0007] Conductive glue connecting the grounding terminal and the transparent conductive layer, part of the conductive glue being filled between the array substrate and the counter substrate, the orthographic projection of the part of the conductive glue on the array substrate and the orthographic projection of the first part on the array substrate not overlapping each other;

[0008] A blocking structure filled between the array substrate and the counter substrate, the blocking structure being in contact with the part of the conductive glue, the blocking structure being used to block the conductive glue before solidification from overflowing to the area where the first part is located.

[0009] Optionally, in the display panel provided by the embodiments of the present disclosure, the counter substrate comprises a first side surface adjacent to the binding area;

[0010] The isolation groove comprises a first isolation sub-groove parallel to the first side surface, and a second isolation sub-groove and a third isolation sub-groove extending from both ends of the first isolation sub-groove to the first side surface.

[0011] Optionally, in the display panel provided by the embodiment of the present disclosure, the orthogonal projection of the blocking structure on the array substrate covers at least the orthogonal projection of the first isolation sub-tank on the array substrate.

[0012] Optionally, in the display panel provided by the embodiment of the present disclosure, the orthogonal projection of the blocking structure on the array substrate covers the orthogonal projection of the part of the second isolation sub-tank adjacent to the first isolation sub-tank and the orthogonal projection of the part of the third isolation sub-tank adjacent to the first isolation sub-tank on the array substrate.

[0013] Optionally, in the display panel provided by the embodiment of the present disclosure, the orthogonal projection of the blocking structure on the array substrate covers the orthogonal projection of the edge of the second part adjacent to the first isolation sub-tank on the array substrate.

[0014] Optionally, in the display panel provided by the embodiment of the present disclosure, the orthogonal projection of the blocking structure on the array substrate covers the orthogonal projection of the edge of the first part adjacent to the first isolation sub-tank on the array substrate.

[0015] Optionally, in the display panel provided by the embodiment of the present disclosure, further comprising: a frame glue surrounding the display area.

[0016] The isolation tank is located on the side of the frame glue close to the binding area.

[0017] Optionally, in the display panel provided by the embodiment of the present disclosure, the frame glue serves as the blocking structure.

[0018] Optionally, in the display panel provided by the embodiment of the present disclosure, the frame glue and the first isolation sub-tank satisfy the following relationship:

[0019] C > A - (1-i)*W / 2;

[0020] Wherein, the opposite substrate comprises a first side surface adjacent to the binding area, A is the distance between the orthogonal projection of the middle line of the frame glue in the direction parallel to the first side surface on the array substrate and the orthogonal projection of the first side surface on the array substrate, W is the preset width of the frame glue in the direction perpendicular to the first side surface, C is the distance between the first isolation sub-tank and the first side surface, and i is the glue width fluctuation coefficient of the frame glue, which ranges from ±10%.

[0021] Optionally, in the display panel provided by the embodiment of the present disclosure, the blocking structure is located on the side of the frame glue close to the binding area, and the blocking structure and the frame glue have a gap therebetween.

[0022] Optionally, in the display panel provided in the embodiments of the present disclosure, the blocking structure and the first isolation sub-tank satisfy the following relationship:

[0023] a≤C;a+(1+i’)*W’ / 2<D;a-(1+i’)*W’ / 2>0;e≥E;

[0024] wherein the opposite substrate comprises a first side surface adjacent to the binding area, a is a distance between a normal projection of a middle line of the blocking structure in a direction parallel to the first side surface on the array substrate and a normal projection of the first side surface on the array substrate, C is a distance between the first isolation sub-tank and the first side surface, D is a distance between the normal projection of the blocking structure on the array substrate and the normal projection of the first side surface on the array substrate, E is a length of the first isolation sub-tank in a direction parallel to the first side surface, W’ is a preset width of the blocking structure in a direction perpendicular to the first side surface, i’ is a width fluctuation coefficient of the blocking structure, which ranges from ±10%, and e is a length of the blocking structure in a direction parallel to the first side surface.

[0025] Optionally, in the display panel provided in the embodiments of the present disclosure, the opposite substrate comprises a first side surface adjacent to the binding area, the isolation groove is arranged at two edges of the first side surface, and the isolation groove is located between the display area and the binding area.

[0026] Optionally, in the display panel provided in the embodiments of the present disclosure, further comprising a liquid crystal layer, the liquid crystal layer is located in the display area, and the liquid crystal layer is sealed between the opposite substrate and the array substrate.

[0027] Optionally, in the display panel provided in the embodiments of the present disclosure, the array substrate further comprises a common electrode layer and a pixel electrode layer located in the display area, the common electrode layer and the pixel electrode layer are arranged in a stack and are insulated from each other.

[0028] Optionally, in the display panel provided in the embodiments of the present disclosure, further comprising a planar layer, the planar layer is arranged on a side of the black matrix facing the array substrate.

[0029] Optionally, in the display panel provided in the embodiments of the present disclosure, the conductive adhesive is a conductive silver adhesive.

[0030] In another aspect, the embodiments of the present disclosure also provide a display device comprising the display panel provided in the embodiments of the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 A schematic diagram of the principle of the conductive silver adhesive causing the black matrix to be charged in the related art.

[0032] Figure 2 A schematic structural diagram of a display panel provided in an embodiment of the present disclosure;

[0033] Figure 3 for Figure 2 Schematic diagram of the enlarged structure of the middle Z region;

[0034] Figure 4 A schematic diagram showing the position calculation of the frame sealant and the first isolation sub-groove;

[0035] Figure 5 For the Figure 4 Schematic diagram of the cross-sectional structure along line I-II;

[0036] Figure 6 A schematic diagram of another structure of a display panel provided in an embodiment of the present disclosure;

[0037] Figure 7 for Figure 6 A schematic diagram of an enlarged structure of the Z' region;

[0038] Figure 8 for Figure 7 Schematic diagram of the position calculation of the middle blocking structure and the first isolation sub-groove;

[0039] Figure 9 For the Figure 8 Schematic diagram of the cross-sectional structure along line III-IV;

[0040] Figure 10 for Figure 6 Another enlarged structural diagram of the Z' region;

[0041] Figure 11 for Figure 10 Schematic diagram of the position calculation of the middle blocking structure and the first isolation sub-groove;

[0042] Figure 12 For the Figure 11 Schematic diagram of the cross-sectional structure along the V-VI line;

[0043] Figure 13 for Figure 6 Another enlarged structural diagram of the Z' region;

[0044] Figure 14 for Figure 13 Schematic diagram of the position calculation of the middle blocking structure and the first isolation sub-groove;

[0045] Figure 15 For the Figure 14 Schematic diagram of the cross-sectional structure along line VII-VIII;

[0046] Figure 16A cross-sectional structure diagram of a sub-pixel in a display panel is provided for the embodiments of the present disclosure. DETAILED DESCRIPTION

[0047] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. It should be noted that the sizes and shapes of the figures in the drawings do not reflect the true proportions, but only serve to illustrate the present disclosure. And the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present disclosure.

[0048] Unless otherwise defined, technical terms or scientific terms used herein should be understood as having the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first", "second" and similar words of comparison in the specification and claims of this disclosure does not indicate any order, number or importance, but is only used to distinguish different components. "Include" or "contain" and similar words mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "In", "out", "up", "down" and the like are only used to represent relative positional relationships, which may change accordingly when the absolute position of the described object changes.

[0049] At present, liquid crystal display panels are mainly divided into twisted nematic (TN), vertical alignment (VA), in-plane switching (IPS) and advanced super dimension switch (ADS) according to display modes. Among them, the liquid crystal display panel of ADS mode is to form a multi-dimensional electric field by the electric field generated by the edge of the same plane electrode and the electric field generated between the strip-shaped electrode layer and the plate-shaped electrode layer, so that all liquid crystal molecules between the electrodes and directly above the electrodes rotate. In order to shield the influence of external electric field on liquid crystal, a layer of indium tin oxide (ITO) is coated on the back of the counter substrate (also known as color filter substrate, CF substrate), and the ITO film layer is grounded to achieve the purpose of shielding external electric field.

[0050] In order to achieve the purpose of grounding the back ITO film layer, silver glue is usually used to connect the ITO film layer on the back of the CF substrate and the ground circuit on the array substrate (i.e. the TFT substrate). Under the support of the sealant, there is a gap between the TFT substrate and the CF substrate, and the silver glue before curing will seep into the gap, so that the black matrix (BM) is charged, which increases the voltage difference between the black matrix and the electrode on the array substrate, causing the liquid crystal to deflect, the pixel to light up, and the green pixel to light up obviously, so that the product quality is seriously affected. In order to avoid this situation, as shown in the prior art, the BM near the silver glue coating point is grooved to isolate the silver glue coating area. However, in the actual production process, the silver glue still penetrates to the BM beyond the isolation area, resulting in green screen of the product and reducing the yield. Figure 1

[0051] In order to at least solve the above technical problems existing in the related art, the embodiments of the present disclosure provide a display panel, as shown in Figures 2 to 9 The display panel can include:

[0052] The array substrate 01 includes a display area AA and a frame area BB around the display area AA, at least part of the frame area BB on one side of the display area AA as a binding area b, and the array substrate 01 is provided with a ground terminal 101 in the binding area b;

[0053] The opposite substrate 02 is arranged opposite to the array substrate 01, and the orthographic projection of the opposite substrate 02 on the array substrate 01 does not overlap with the binding area b, that is, the binding area b of the array substrate 01 extends out of the opposite substrate 02; the opposite substrate 02 can include a black matrix 201 arranged on the side facing the array substrate 01, and a transparent conductive layer 202 arranged on the side away from the array substrate 01; wherein the black matrix 201 includes a first part 2011, a second part 2012 and a separation groove 2013, the first part 2011, the separation groove 2013 and the second part 2012 are arranged in sequence in the direction Y from the display area AA to the binding area b, and the separation groove 2013 separates the first part 2011 and the second part 2012;

[0054] The conductive glue 03 connects the ground terminal 101 and the transparent conductive layer 202, and part of the conductive glue 03 is filled between the array substrate 01 and the opposite substrate 02, and the orthographic projection of the part of the conductive glue 03 on the array substrate 01 does not overlap with the orthographic projection of the first part 2011 on the array substrate 01;

[0055] The blocking structure 04 is filled between the array substrate 01 and the opposite substrate 02, the blocking structure 04 is in contact with the part of the conductive glue 03, and the blocking structure 04 is used to block the overflow of the conductive glue 03 before curing to the area where the first part 2011 is located.

[0056] ​In the display panel provided in the embodiments of the present disclosure, the blocking structure 04 filled between the array substrate 01 and the opposite substrate 02 is configured to block the conductive adhesive 03 before curing from overflowing to the area where the first part 2011 is located, so that the orthogonal projection of the conductive adhesive 03 between the array substrate 01 and the opposite substrate 02 on the array substrate 01 and the orthogonal projection of the first part 2011 on the array substrate 01 do not overlap each other in the final product, thereby avoiding the conductive adhesive 03 penetrating into the first part 2011 to cause the black matrix 201 to be charged, and thus the problem of the display panel emitting green light can be effectively solved, and the product yield can be improved.

[0057] Optionally, in the display panel provided in the embodiments of the present disclosure, as shown in Figure 3 、 Figure 7 and Figure 10 indicate that the opposite substrate 02 can include a first side S adjacent to the binding area b; in order to achieve the effect of separating the first part 2011 and the second part 2012, the isolation groove 2013 can include a first isolation sub-groove 31 parallel to the first side S, and a second isolation sub-groove 32 and a third isolation sub-groove 33 extending from both ends of the first isolation sub-groove 31 to the first side S.

[0058] In some embodiments, the second isolation sub-groove 32 and the third isolation sub-groove 33 can be perpendicular to the first side S; in other embodiments, the included angle between the second isolation sub-groove 32, the third isolation sub-groove 33 and the first side S can be a non-right angle, that is, the second isolation sub-groove 32 and the third isolation sub-groove 33 can be inclined relative to the first side S.

[0059] It should be noted that, in order to avoid peripheral dark state light leakage, the boundary of the black matrix 201 can be flush with the boundary of the opposite substrate 02. In this case, the second isolation sub-groove 32 and the third isolation sub-groove 33 are flush with the first side S of the opposite substrate 02 adjacent to the binding area b. However, it should be understood that in some embodiments, the boundary of the black matrix 201 can be recessed relative to the boundary of the opposite substrate 02, at this time, the second isolation sub-groove 32 and the third isolation sub-groove 33 will have a certain distance from the first side S, but as long as the second part 2012 can be isolated from the black matrix 201, therefore, the relative arrangement mode between the second isolation sub-groove 32, the third isolation sub-groove 33 and the first side S can be selected according to actual needs from the above two cases.

[0060] Optionally, in the display panel provided in the embodiments of the present disclosure, as shown in Figure 3 、 Figure 4 、 Figure 7 and Figure 8As shown in FIG. 1, the normal projection of the blocking structure 04 on the array substrate 01 can cover at least the normal projection of the first isolation sub-groove 31 on the array substrate 01, so as to prevent the conductive adhesive 03 between the array substrate 01 and the opposite substrate 02 from overflowing to the region where the first portion 2011 is located before curing through the first isolation sub-groove 31, thereby preventing the conductive adhesive 03 from penetrating into the first portion 2011, and further improving the green panel defect caused by the electrification of the black matrix 201.

[0061] Optionally, in the display panel provided by the embodiments of the present disclosure, as shown in FIG. 1, Figure 3 、 Figure 4 、 Figure 7 and Figure 8 , the normal projection of the blocking structure 04 on the array substrate 01 can also cover the normal projection of the part of the second isolation sub-groove 32 adjacent to the first isolation sub-groove 31 and the part of the third isolation sub-groove 33 adjacent to the first isolation sub-groove 31 on the array substrate 01.

[0062] After the conductive adhesive 03 is intercepted by the blocking structure 04 covering the first isolation sub-groove 31, the conductive adhesive 03 will flow along the blocking structure 04 to both ends of the first isolation sub-groove 31. Therefore, by setting the blocking structure 04 to cover the part of the second isolation sub-groove 32 adjacent to the first isolation sub-groove 31 and the part of the third isolation sub-groove 33 adjacent to the first isolation sub-groove 31, the conductive adhesive 03 between the array substrate 01 and the opposite substrate 02 can be prevented from flowing to the region where the first portion 2011 is located at both ends of the first isolation sub-groove 31 through the second isolation sub-groove 32 and the third isolation sub-groove 33 before curing, thereby avoiding the penetration of the conductive adhesive 03 into the first portion 2011, and further improving the green panel defect caused by the electrification of the black matrix 201.

[0063] Optionally, in the display panel provided by the embodiments of the present disclosure, as shown in FIG. 1, Figures 10 to 12 , the normal projection of the blocking structure 04 on the array substrate 01 can only cover the normal projection of the edge of the second portion 2012 adjacent to the first isolation sub-groove 31 on the array substrate 01, so as to limit the conductive adhesive 03 between the array substrate 01 and the opposite substrate 02 within the isolation region surrounded by the isolation sub-groove 201. In addition, it is usually necessary to expose the binding area b by cutting off the region of the opposite substrate 02 corresponding to the binding area b. When the blocking structure 04 only coincides with the edge of the second portion 2012 adjacent to the first isolation sub-groove 31, the part of the opposite substrate 02 corresponding to the binding area b can be ensured to be the same as the structure of the related art, so that when the existing cutting process is used for cutting, the cutting yield can be comparable, in other words, the cutting yield will not be affected by the presence of the blocking structure 04.

[0064] Of course, in specific implementation, as shown in Figures 13 to 15As shown in FIG. 1, the normal projection of the blocking structure 04 on the array substrate 01 can cover the normal projection of the edge of the first part 2011 adjacent to the first isolation sub-groove 31 on the array substrate 01, so as to intercept the conductive adhesive 03 away from the first part 2011 on the array substrate 01, thereby avoiding the conductive adhesive 03 penetrating into the first part 2011, and further improving the panel green failure caused by the black matrix 201 charging.

[0065] Optionally, in the display panel provided in the embodiments of the present disclosure, as shown in FIG. 1, Figures 3 to 5 , Figures 7 to 9 As shown in FIG. 1, the normal projection of the blocking structure 04 on the array substrate 01 can cover the normal projection of the edge of the first part 2011 adjacent to the first isolation sub-groove 31 on the array substrate 01, so as to intercept the conductive adhesive 03 away from the first part 2011 on the array substrate 01, thereby avoiding the conductive adhesive 03 penetrating into the first part 2011, and further improving the panel green failure caused by the black matrix 201 charging.

[0066] Of course, in specific implementation, as shown in FIG. 1, Figures 3 to 5 , Figures 7 to 9 As shown in FIG. 1, the normal projection of the blocking structure 04 on the array substrate 01 can cover the normal projection of the edge of the first part 2011 adjacent to the first isolation sub-groove 31 on the array substrate 01, so as to intercept the conductive adhesive 03 away from the first part 2011 on the array substrate 01, thereby avoiding the conductive adhesive 03 penetrating into the first part 2011, and further improving the panel green failure caused by the black matrix 201 charging.

[0067] Optionally, in the display panel provided in the embodiments of the present disclosure, as shown in FIG. 1, Figure 2 and Figure 6 As shown in FIG. 1, the normal projection of the blocking structure 04 on the array substrate 01 can cover the normal projection of the edge of the first part 2011 adjacent to the first isolation sub-groove 31 on the array substrate 01, so as to intercept the conductive adhesive 03 away from the first part 2011 on the array substrate 01, thereby avoiding the conductive adhesive 03 penetrating into the first part 2011, and further improving the panel green failure caused by the black matrix 201 charging.

[0068] Optionally, in the display panel provided in the embodiments of the present disclosure, as shown in FIG. 1, Figures 3 to 5 As shown in FIG. 1, the normal projection of the blocking structure 04 on the array substrate 01 can cover the normal projection of the edge of the first part 2011 adjacent to the first isolation sub-groove 31 on the array substrate 01, so as to intercept the conductive adhesive 03 away from the first part 2011 on the array substrate 01, thereby avoiding the conductive adhesive 03 penetrating into the first part 2011, and further improving the panel green failure caused by the black matrix 201 charging. Figure 3 In FIG. 1, 04' represents the boundary of the blocking structure 04 close to the binding area b, and 05' represents the boundary close to the binding area b.

[0069] Considering the width fluctuation of the sealant 05 in actual production, the isolation groove 2013 needs to be designed in the non-sealant width fluctuation area. As shown in Figure 4 , the substrate 02 opposite to the binding area 02 includes a first side surface S adjacent to the binding area 02, A is the distance between the normal projection of the center line M1 of the sealant 05 in the direction parallel to the first side surface S on the array substrate 01 and the normal projection of the first side surface S on the array substrate 01; W is the preset width of the sealant 05 in the direction perpendicular to the first side surface S (i.e. the Y direction); C is the distance between the first isolation groove 31 and the first side surface S; D is the distance between the normal projection of the sealant 05 on the array substrate 01 and the normal projection of the first side surface S on the array substrate 01; i is the sealant width fluctuation coefficient of the sealant 05, which ranges from ±10%; in order to ensure that the isolation groove 2013 falls in the area where the sealant 05 is located, C > Dmax, D = A-(1-i)*W / 2, and C > A-(1-i)*W / 2 can be obtained. That is, the distance between the normal projection of the blocking structure 04 on the array substrate 01 and the normal projection of the first side surface S on the array substrate 01 needs to be less than the distance between the normal projection of the first isolation groove 31 on the array substrate 01 and the normal projection of the first side surface S on the array substrate 01.

[0070] It should be noted that the sealant width fluctuation coefficient i of the sealant 05 is related to the sealant coating equipment. Different sealant coating equipment has different sealant width fluctuation coefficients i, and the specific adjustment needs to be made by the technical personnel according to the actual use of the sealant coating equipment, which is not limited here.

[0071] Optionally, in the above display panel provided by the embodiments of the present disclosure, as shown in Figures 6 to 15 , in the case that the blocking structure 04 is not reused with the sealant 05, the blocking structure 04 can be located on the side of the sealant 05 close to the binding area b, and a gap needs to be reserved between the blocking structure 04 and the sealant 05 to prevent the blocking structure 04 from contacting and overlapping with the sealant 05, so as to cause the inconsistent box thickness of the panel edge and affect the product yield.

[0072] In some embodiments, the blocking structure 04 can be in the same layer and same material as the sealant 05, so as to save the process of separately manufacturing the blocking structure 04 and improve the production efficiency. At this time, the blocking structure 04 can be called a dummy seal.

[0073] In the case of separately manufacturing the blocking structure 04, as shown in Figure 8 , Figure 11 , and Figure 14As shown, the opposite substrate 02 includes a first side S adjacent to the bonding area 02, A is the distance between the normal projection of the middle line M1 of the sealant 05 in the direction parallel to the first side S on the array substrate 01 and the normal projection of the first side S on the array substrate 01; W is the preset width of the sealant 05 in the direction perpendicular to the first side S (i.e. Y direction); C is the distance between the first isolation sub-tank 31 and the first side S; D is the distance between the normal projection of the sealant 05 on the array substrate 01 and the normal projection of the first side S on the array substrate 01; i' is the width fluctuation coefficient of the blocking structure 04, which ranges from ±10%; in the case that the blocking structure 04 is in the same layer and same material as the sealant 05, i' = i; E is the length of the first isolation sub-tank 31 in the direction parallel to the first side S, W' is the width of the blocking structure 04 in the direction perpendicular to the first side S, e is the length of the blocking structure 04 in the direction parallel to the first side S; a is the distance between the normal projection of the middle line M1 of the blocking structure 04 in the direction parallel to the first side S on the array substrate 01 and the normal projection of the first side S on the array substrate 01; d is the distance between the normal projection of the blocking structure 04 on the array substrate 01 and the normal projection of the first side S on the array substrate 01; e is the length of the blocking structure 04 in the direction parallel to the first side S. In order to effectively block the conductive adhesive 03 and not interfere with the sealant 05, the following conditions need to be met:

[0074] ①, the first isolation sub-tank 31 falls in the area where the blocking structure 04 is located, then a≤C needs to be met;

[0075] ②, the blocking structure 04 and the sealant 05 do not interfere with each other, then d+W'<D needs to be met;

[0076] ③, the blocking structure 04 does not exceed the opposite substrate 02, then d>0 needs to be met;

[0077] ④, when the blocking structure 04 fluctuates to the maximum value (i.e. d=a-(1+i')*W' / 2), conditions ② and ③ need to be met at the same time;

[0078] ⑤, the length of the blocking structure 04 is greater than or equal to the length of the first isolation sub-tank 31, then e≥E needs to be met;

[0079] The above formula conversion can be obtained: a≤C; a+(1+i')*W' / 2<D; a-(1+i')*W' / 2>0; e≥E;

[0080] Therefore, by simultaneously meeting the above formula, the purpose of effectively blocking the conductive adhesive 03 and not interfering with the sealant 05 can be achieved.

[0081] It should be noted that, since Figure 8 , Figure 11 and Figure 14The blocking structure 04 and the sealant 05 in the display panel are independently arranged, and have a gap between them. Therefore, based on the above Figure 8 For similar reasons, Figure 11 And Figure 14 The blocking structure 04 and the first isolation sub-tank 31 in the display panel also satisfy the above formula.

[0082] Optionally, in the display panel provided by the embodiments of the present disclosure, as shown in Figure 2 And Figure 6 The facing substrate 02 includes a first side S adjacent to the bonding area 02, and the isolation groove 2013 can be arranged at the two edges of the first side S, and the isolation groove 2013 is located between the display area AA and the bonding area b. Of course, in specific implementation, the position and number of the isolation groove 203 can also be flexibly arranged according to the contact point of the conductive adhesive 03 and the ground terminal 101, as long as the effect of isolating the conductive adhesive 03 coating area can be achieved, which is not specifically limited here.

[0083] Optionally, in the display panel provided by the embodiments of the present disclosure, the conductive adhesive 03 can be a conductive silver adhesive with good conductivity.

[0084] Optionally, in the display panel provided by the embodiments of the present disclosure, as shown in Figure 16 It can also include a liquid crystal layer 06, the liquid crystal layer 06 is located in the display area AA, and the liquid crystal layer 06 is sealed between the facing substrate 02 and the array substrate 01. The array substrate 01 can also include a common electrode layer 102 and a pixel electrode layer 103 located in the display area AA, and the common electrode layer 102 and the pixel electrode layer 103 are arranged in layers and insulated from each other. In some embodiments, as shown in Figure 16 The common electrode layer 102 can be located on the side of the pixel electrode layer 103 close to the liquid crystal layer 06; in some embodiments, the common electrode layer 102 can also be located on the side of the pixel electrode layer 103 away from the liquid crystal layer 06, which is not specifically limited here.

[0085] In addition, as shown in Figure 16 The array substrate 01 can also include a first substrate 104, a transistor 105, an optical shielding layer 106, a buffer layer 107, a gate insulating layer 108, an interlayer dielectric layer 109, a resin layer 110, an insulating layer 111, etc. The facing substrate 02 can also include a planar layer 203, a second substrate 204 and a color resistance 205, wherein the planar layer 203 is arranged on the side of the black matrix 201 facing the array substrate 01, and the color resistance 205 can include a red color resistance R, a green color resistance G and a blue color resistance B.

[0086] For other components in the display panel known to those skilled in the art (such as an alignment layer, a polarizer, etc.), reference can be made to related technologies, which are not specifically introduced here.

[0087] Based on the same inventive concept, the embodiments of the present disclosure further provide a display device comprising the display panel provided by the embodiments of the present disclosure. Since the principle of solving problems of the display device is similar to that of the display panel, the implementation of the display device provided by the embodiments of the present disclosure can be referred to the implementation of the display panel, and the repeated parts will not be described herein.

[0088] In some embodiments, the display device can be any product or component with display function, such as mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator, smart watch, fitness wristband, personal digital assistant, etc. The display device comprises but is not limited to radio frequency unit, network module, audio output unit, input unit, sensor, display unit, user input unit, interface unit, memory, processor, power supply and the like. In addition, those skilled in the art can understand that the above structure does not constitute a limitation on the display device provided by the embodiments of the present disclosure, in other words, the display device provided by the embodiments of the present disclosure can comprise more or less components, or combine certain components, or different component arrangement.

[0089] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if these modifications and variations of the embodiments of the present disclosure belong to the scope of the claims of the present disclosure and the equivalent technologies thereof, the present disclosure also intends to include these modifications and variations.

Claims

1. A display panel, wherein: include: An array substrate comprises a display area and a frame area surrounding the display area, wherein at least a portion of the frame area on one side of the display area serves as a binding area, and the array substrate is provided with a ground terminal in the binding area; an opposite substrate disposed opposite to the array substrate, wherein an orthographic projection of the opposite substrate on the array substrate does not overlap with the binding area; the opposite substrate comprises: a black matrix disposed on a side facing the array substrate, and a transparent conductive layer disposed on a side facing away from the array substrate; wherein the black matrix comprises a first portion, a second portion, and an isolation groove, wherein the first portion, the isolation groove, and the second portion are arranged in sequence in a direction from the display area to the binding area, and the isolation groove separates the first portion from the second portion; Conductive adhesive connecting the ground terminal and the transparent conductive layer, wherein a portion of the conductive adhesive is filled between the array substrate and the opposite substrate, and an orthographic projection of the portion of the conductive adhesive on the array substrate does not overlap with an orthographic projection of the first portion on the array substrate; a blocking structure filled between the array substrate and the opposing substrate, the blocking structure being in contact with the portion of the conductive adhesive and configured to prevent the conductive adhesive before curing from overflowing to the area where the first portion is located; the opposing substrate including a first side surface adjacent to the binding area; The isolation trench comprises a first isolation sub-trench parallel to the first side surface, and a second isolation sub-trench and a third isolation sub-trench extending from both ends of the first isolation sub-trench to the first side surface; The invention also includes: a frame sealing glue, wherein the frame sealing glue surrounds the display area; The isolation groove is located on a side of the frame sealant close to the binding area; The blocking structure and the frame sealant are made of the same layer and material. The blocking structure is a virtual sealant. The blocking structure only overlaps with the edge of the second portion adjacent to the first isolation sub-groove.

2. The display panel according to claim 1, wherein: The blocking structure is located on a side of the frame sealing adhesive close to the binding area, and a gap is provided between the blocking structure and the frame sealing adhesive.

3. The display panel according to claim 2, wherein: The blocking structure and the first isolating sub-groove satisfy the following relationship: a≤C; a+(1+i')*W' / 2<D; a-(1+i')*W' / 2>0; e≥E; In which, the opposing substrate includes a first side surface adjacent to the binding area, a is the distance between the orthographic projection of the midline of the blocking structure in a direction parallel to the first side surface on the array substrate and the orthographic projection of the first side surface on the array substrate, C is the distance between the first isolation sub-groove and the first side surface, D is the distance between the orthographic projection of the blocking structure on the array substrate and the orthographic projection of the first side surface on the array substrate, E is the length of the first isolation sub-groove in a direction parallel to the first side surface, W' is the preset width of the blocking structure in a direction perpendicular to the first side surface, i' is the width fluctuation coefficient of the blocking structure, which ranges from ±10%, and e is the length of the blocking structure in a direction parallel to the first side surface.

4. The display panel according to any one of claims 1 to 3, wherein: The opposite substrate includes a first side surface adjacent to the binding area. The isolation groove is disposed at two edges of the first side surface, and the isolation groove is located between the display area and the binding area.

5. The display panel according to any one of claims 1 to 3, wherein: Also includes: A liquid crystal layer is located in the display area and is sealed between the opposite substrate and the array substrate.

6. The display panel according to any one of claims 1 to 3, wherein: The array substrate further includes a common electrode layer and a pixel electrode layer located in the display area. The common electrode layer and the pixel electrode layer are stacked and insulated from each other.

7. The display panel according to any one of claims 1 to 3, wherein: Also includes: A planar layer is entirely disposed on a side of the black matrix facing the array substrate.

8. The display panel according to any one of claims 1 to 3, wherein: The conductive glue is conductive silver glue.

9. A display device, wherein: The display panel comprises the display panel according to any one of claims 1 to 8.

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