Display panel manufacturing method and processing equipment thereof

Abstract

The embodiments of the present application disclose a method for preparing a display panel and a processing device thereof, wherein the method for preparing a display panel includes: providing a carrier substrate; disposing a flexible device layer on the carrier substrate; disposing a functional layer on the flexible device layer, the functional layer including an effective portion and an auxiliary peeling portion connected to each other, the auxiliary peeling portion being located outside the effective portion, and the effective portion covering the flexible device layer; moving the auxiliary peeling portion and the effective portion in a direction away from the carrier substrate in sequence along the direction of the auxiliary peeling portion toward the effective portion, so that the flexible device layer is synchronously peeled off from the carrier substrate under the drive of the functional layer; removing the auxiliary peeling portion to obtain a display panel. The method for preparing a display panel and the processing device thereof provided in the present application can non-destructively peel the flexible device layer from the carrier substrate while ensuring that the display device and the functional layer on the flexible device layer are not damaged.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a display panel and a processing device thereof. Background Art

[0002] With the continuous improvement of manufacturing processes and technologies, the display quality and production yield of flexible display panels are constantly improving. In the existing flexible display panel manufacturing process, it is necessary to first attach a flexible device layer to a rigid carrier substrate to prepare the display device, and then peel the flexible device layer carrying the display device from the carrier substrate to obtain the flexible display panel.

[0003] In existing technology, stripping equipment begins stripping the flexible device layer and carrier substrate from the end face of the flexible device layer. At the starting point, the peeling angle between the flexible device layer and the carrier substrate approaches 90°. Using the end face of the flexible device layer as the starting point for stripping results in the end face of the flexible device layer experiencing the greatest peeling angle and the strongest peeling stress, which can easily tear and damage the flexible device layer, damaging the display device and reducing production yield. Summary of the Invention

[0004] The embodiments of the present application provide a method for preparing a display panel and a processing device thereof, so as to non-destructively peel a flexible device layer from a carrier substrate while ensuring that the display device and the functional layer on the flexible device layer are not damaged.

[0005] The present invention provides a method for manufacturing a display panel, including:

[0006] providing a carrier substrate;

[0007] providing a flexible device layer on the carrier substrate;

[0008] Disposing a functional layer on the flexible device layer, the functional layer comprising an effective portion and an auxiliary peeling portion connected to each other, the auxiliary peeling portion being located outside the effective portion, and the effective portion covering the flexible device layer;

[0009] Moving the auxiliary peeling portion and the effective portion in sequence in a direction away from the carrier substrate along a direction from the auxiliary peeling portion toward the effective portion, so as to peel the flexible device layer from the carrier substrate;

[0010] The auxiliary peeling portion is removed to obtain the display panel.

[0011] Optionally, in some embodiments of the present application, the distance between the end surface of the auxiliary stripping portion away from the effective portion and the effective portion is in the range of 22 cm to 55 cm.

[0012] Optionally, in some embodiments of the present application, when the auxiliary peeling portion and the effective portion are sequentially moved in a direction away from the carrier substrate, a peeling angle of the end surface of the flexible device layer is controlled to be less than 75°.

[0013] Optionally, in some embodiments of the present application, the functional layer is a polarizer or a protective film.

[0014] Optionally, in some embodiments of the present application, after the step of setting a functional layer on the flexible device layer and before the step of sequentially moving the auxiliary peeling part and the effective part in a direction away from the carrier substrate, it also includes: making the bonding force between the flexible device layer and the carrier substrate smaller than the bonding force between the flexible device layer and the functional layer.

[0015] Optionally, in some embodiments of the present application, the step of making the bonding force between the flexible device layer and the carrier substrate smaller than the bonding force between the flexible device layer and the functional layer includes: performing laser scanning on the interface between the flexible device layer and the carrier substrate to destroy the bonding force between the flexible device layer and the carrier substrate.

[0016] Optionally, in some embodiments of the present application, a first adhesive layer is provided between the carrier substrate and the flexible device layer, and a second adhesive layer is provided between the flexible device layer and the functional layer, wherein the adhesion force of the first adhesive layer is less than the adhesion force of the second adhesive layer, so that the adhesion force between the flexible device layer and the carrier substrate is less than the adhesion force between the flexible device layer and the functional layer.

[0017] Optionally, in some embodiments of the present application, the carrier substrate is disposed on the working platform, and at least a portion of the auxiliary peeling portion is connected to the working platform. The step of sequentially moving the auxiliary peeling portion and the effective portion in a direction away from the carrier substrate includes:

[0018] Connecting the auxiliary peeling portion to the rotating assembly using a rotating assembly;

[0019] At least one of the working platform and the rotating assembly is moved or rotated to sequentially peel the auxiliary peeling portion and the effective portion from the carrier substrate, thereby driving the flexible device layer to be peeled from the carrier substrate.

[0020] Optionally, in some embodiments of the present application, the rotating component has a rotatable adsorption surface, and a plurality of adsorption holes are provided on the adsorption surface. The step of connecting the auxiliary peeling part to the rotating component using the rotating component includes: contacting the adsorption surface with the surface of the auxiliary peeling part so that the plurality of adsorption holes are opposite to the auxiliary peeling part; forming a negative pressure in the plurality of adsorption holes opposite to the auxiliary peeling part, so that the auxiliary peeling part is adsorbed and fixed on the adsorption surface.

[0021] Optionally, in some embodiments of the present application, the rotating component has a rotatable adsorption surface, the adsorption surface includes a curved surface, a plurality of adsorption holes are provided on the adsorption surface, and the plurality of adsorption holes are arrayed on the adsorption surface. The step of connecting the auxiliary peeling part to the rotating component using the rotating component includes: contacting the adsorption surface with the surface of the auxiliary peeling part so that the column direction of the plurality of adsorption holes is parallel to the edge line of the auxiliary peeling part away from the flexible device layer; forming a negative pressure in a column of the adsorption holes opposite to the edge line of the auxiliary peeling part, so that the end of the auxiliary peeling part away from the effective part is fixedly connected to the adsorption surface.

[0022] Optionally, in some embodiments of the present application, the step of moving or rotating at least one of the working platform and the rotating component to sequentially peel the auxiliary peeling portion and the effective portion from the carrier substrate includes: rotating the adsorption surface to sequentially form negative pressure in each column of adsorption holes opposite to the functional layer, so that the functional layer is gradually adsorbed and fixed on the adsorption surface from the auxiliary peeling portion to the effective portion; the adsorption surface drives the auxiliary peeling portion and the effective portion to gradually move away from the carrier substrate through rotation, so that the flexible device layer is peeled from the carrier substrate.

[0023] Optionally, in some embodiments of the present application, after the flexible device layer is peeled off from the carrier substrate, the rotating assembly is used to attach a support film to the flexible device layer.

[0024] Optionally, in some embodiments of the present application, the rotating component has a rotatable adsorption surface, and a plurality of adsorption holes are provided on the adsorption surface. The step of using the rotating component to attach the support film to the flexible device layer includes: forming a negative pressure in the plurality of adsorption holes opposite to the functional layer, so that the functional layer is adsorbed and fixed on the adsorption surface, and the flexible device layer is located on the surface of the functional layer away from the rotating component; moving or rotating the rotating component to make the flexible device layer contact with the support film, moving or rotating at least one of the working platform and the rotating component, and successively eliminating the negative pressure in the adsorption holes facing the support film, so that the functional layer gradually separates from the adsorption surface until the flexible device layer is completely attached to the support film.

[0025] The embodiment of the present application also provides a processing device for a display panel, which can be used to prepare a display panel using the above preparation method. The processing device includes: a working platform for carrying a carrier substrate, on which a flexible device layer to be peeled off and a functional layer are sequentially stacked, the functional layer including an effective portion and an auxiliary peeling portion connected to each other, the auxiliary peeling portion being located outside the effective portion, and the effective portion covering the flexible device layer; a rotating assembly, the rotating assembly being located above the working platform, the rotating assembly being used to move the auxiliary peeling portion and the effective portion in a direction away from the carrier substrate in sequence along the direction from the auxiliary peeling portion toward the effective portion, so that the flexible device layer is synchronously peeled off from the carrier substrate under the drive of the functional layer.

[0026] The present application provides a method for preparing a display panel, wherein the functional layer provided on the flexible device layer includes an effective portion and an auxiliary peeling portion that are interconnected, wherein the auxiliary peeling portion is located outside the effective portion, and the effective portion completely covers the flexible device layer. Along the direction of the auxiliary peeling portion toward the effective portion, the auxiliary peeling portion and the effective portion are sequentially moved in a direction away from the carrier substrate, so that the flexible device layer is synchronously peeled off from the carrier substrate under the drive of the functional layer; the auxiliary peeling portion is removed to obtain a display panel. By setting the starting peeling position at an auxiliary peeling portion on the functional layer that does not overlap with the flexible device layer, the excessive peeling angle and peeling stress generated at the starting peeling position are avoided and will not damage the flexible device layer. By moving the auxiliary peeling portion of the functional layer so that the flexible device layer is synchronously peeled off from the carrier substrate under the drive of the functional layer, the peeling angle and peeling stress at the end face of the flexible device layer can be reduced, thereby peeling the flexible device layer without damage. Since the auxiliary peeling portion will be removed in the subsequent process, the device layer and the functional layer above the flexible device layer will not be damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 is a flow chart of a first embodiment of a method for manufacturing a display panel provided in the present application;

[0029] Figure 2 A schematic diagram showing a display panel from which a carrier substrate is to be peeled off;

[0030] Figure 3 yes Figure 2 A top view of the display panel is shown in FIG.

[0031] Figure 4 A schematic diagram showing a first embodiment of a processing device;

[0032] Figure 5 Shown Figure 4 Flowchart of the processing equipment for preparing a display panel;

[0033] Figure 6 Shown Figure 4 A schematic structural diagram of a rotating assembly of a processing device;

[0034] 7A to 7C yes Figure 4 Schematic diagram of the processing equipment during the stripping stage;

[0035] Figures 8A to 8D is a schematic diagram corresponding to the stripping stage of the second embodiment of the processing equipment provided by the present application;

[0036] Figure 9 is a flow chart of a second embodiment of a method for manufacturing a display panel provided by the present application;

[0037] Figure 10 This is a flow chart of a third embodiment of the method for manufacturing a display panel provided in this application.

[0038] Description of reference numerals:

[0039] 1: carrier substrate; 2: flexible device layer; 3: functional layer; 31: effective part; 32: auxiliary peeling part; 4: processing equipment; 41: working platform; 42: rotating component; 421: adsorption surface; 422: adsorption hole; α: peeling angle. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0041] like Figures 1 to 6 As shown, the present application provides a first embodiment of a method for manufacturing a display panel, comprising:

[0042] B1. Provide a carrier substrate 1.

[0043] B2. Disposing a flexible device layer 2 on the carrier substrate 1 .

[0044] B3. A functional layer 3 is provided on the flexible device layer 2. The functional layer 3 includes an effective portion 31 and an auxiliary peeling portion 32 connected to each other. The auxiliary peeling portion 32 is located outside the effective portion 31. The effective portion 31 covers the flexible device layer 2.

[0045] B4. Move the auxiliary peeling portion 32 and the effective portion 31 in sequence in the direction away from the carrier substrate 1 along the direction of the auxiliary peeling portion 32 toward the effective portion 31, so that the flexible device layer 2 is synchronously peeled off from the carrier substrate 1 driven by the functional layer 3.

[0046] B5. Remove the auxiliary peeling portion 32 to obtain a display panel.

[0047] The flexible display panel includes a flexible device layer 2 and a functional layer 3 which are sequentially stacked on a carrier substrate 1 .

[0048] In step B1, the carrier substrate 1 is a hard substrate. Specifically, the carrier substrate 1 is a glass substrate.

[0049] In step B2, the flexible device layer 2 includes a flexible substrate and a device layer provided on the flexible substrate. The steps of providing the flexible device layer 2 on the carrier substrate 1 include:

[0050] A flexible substrate is provided on the carrier substrate 1. Specifically comprising:

[0051] A solution comprising one or more organic materials selected from polyethersulfone, polyacrylate, polyimide, polyethylene naphthalate and polyethylene terephthalate is coated on the entire surface of the carrier substrate 1 .

[0052] The carrier substrate 1 coated with the solution is placed in a vacuum environment for high-temperature drying to rapidly evaporate and remove most of the solvent in the solution.

[0053] The carrier substrate 1 after high-temperature drying is further heated at a high temperature in an infrared oven to further remove the solvent while cross-linking and curing the organic material to obtain a flexible substrate with uniform thickness.

[0054] A device layer is provided on the flexible substrate. The device layer includes a barrier layer, thin-film transistors, a pixel definition layer, a light-emitting layer, and an encapsulation layer. The specific hierarchical structure and preparation process of the device layer have been described in detail in the prior art and will not be repeated here.

[0055] In step B3, the step of providing the functional layer 3 on the flexible device layer 2 includes:

[0056] The carrier substrate 1 provided with the flexible device layer 2 is placed on a vacuum platform.

[0057] The alignment of the processing device 4 and the carrier substrate 1 is completed by the image sensor.

[0058] The functional layer 3 is attached to the flexible device layer 2 .

[0059] The flexible device layer 2 has the same size as the carrier substrate 1 , and the flexible device layer 2 completely covers the carrier substrate 1 . The functional layer 3 has a larger size than the flexible device layer 2 .

[0060] Specific, combined Figure 2 and Figure 3 The functional layer 3 includes an effective portion 31 and an auxiliary peeling portion 32 that are interconnected. The auxiliary peeling portion 32 is located outside the effective portion 31. The effective portion 31 is opposite to the flexible device layer 2. The effective portion 31 can completely cover the flexible device layer 2. The auxiliary peeling portion 32 is formed in the area where the functional layer 3 exceeds the flexible device layer 2. The distance P between the end surface of the auxiliary peeling portion 32 away from the effective portion 31 and the effective portion 31 is in the range of 22 to 55 cm, ensuring that the auxiliary peeling portion 32 has sufficient length to reduce the peeling angle α at the end surface of the flexible device layer 2, while not causing waste of the functional layer raw material and inconvenience in preparation due to excessive length. The distance P between the end surface of the auxiliary peeling portion 32 away from the effective portion 31 and the effective portion 31 can be 25 cm, 30 cm, 38 cm, 45 cm or 50 cm.

[0061] Optionally, the functional layer 3 is a polarizer. Figure 3In the example shown, the total length of the polarizer is approximately 50 to 100 mm longer than the length of the flexible device layer 2 and the carrier substrate 1, resulting in a width P of the auxiliary peeling portion 32 on one side of the flexible device layer 2 ranging from 25 to 50 cm. Optical adhesive is applied to the surface of the active portion 31 of the polarizer to ensure its securement to the surface of the device layer 3. Optical adhesive is not applied to the auxiliary peeling portion 32, facilitating the transfer of the flexible device during subsequent manufacturing processes and preventing unnecessary adhesion or pulling between the auxiliary peeling portion 32 and the handling equipment 4.

[0062] Optionally, the functional layer 3 may also be a protective film that isolates water and oxygen or prevents scratches. Specifically, the functional layer 3 may be made of organic insulating materials such as polyimide (PI) and / or polyethylene terephthalate (PET) that can isolate water vapor and oxygen.

[0063] Optionally, the functional layer 3 may also be a process protection film that is peeled off in a subsequent process, which is not specifically limited here.

[0064] The processing device 4 is used to complete step B4. Specifically, Figure 4 and Figure 5 The processing device 4 includes a work platform 41 and a rotating assembly 42 located above the work platform 41. The work platform 41 is used to support the carrier substrate 1; the rotating assembly 42 is used to move the auxiliary peeling section 32 and the effective section 31 in a direction away from the carrier substrate 1, along the direction from the auxiliary peeling section 32 toward the effective section 31, so that the flexible device layer 2 is synchronously peeled from the carrier substrate 1 under the influence of the functional layer 3. The processing device 4 also includes a negative pressure generating assembly (not shown in the figure). The rotating assembly 42 has a rotatable suction surface 421. The suction surface 421 includes a curved surface.

[0065] Step B4 also includes: connecting the auxiliary peeling portion 32 of the functional layer 3 to the processing equipment 4 .

[0066] Optionally, the step of connecting the auxiliary stripping portion 32 of the functional layer 3 to the processing device 4 further includes:

[0067] B41 . Fix the carrier substrate 1 on the working platform 41 .

[0068] B42. Connect the auxiliary peeling part 32 of the functional layer 3 to the rotating component 42.

[0069] In step B41 , a plurality of fixing holes are provided on the surface of the working platform 41 , and a negative pressure forming assembly is connected to the fixing holes. The negative pressure forming assembly forms a negative pressure in the fixing holes to fix the carrier substrate 1 .

[0070] The negative pressure generating component includes but is not limited to a vacuum pump.

[0071] Specifically, the steps of fixing the carrier substrate 1 on the working platform 41 include:

[0072] The carrier substrate 1 is placed on the working platform 41 so that the auxiliary peeling portion 32 of the functional layer 3 contacts the working platform 41 .

[0073] Negative pressure is formed in the plurality of fixing holes opposite to the carrier substrate 1 , so that the carrier substrate 1 is fixed on the working platform 41 .

[0074] In step B42, combine Figure 6 The rotating assembly 42 has a rotatable suction surface 421. The suction surface 421 is provided with a plurality of suction holes 422. The negative pressure generating assembly is connected to the suction holes 422. During the peeling process of the flexible device layer 2 from the carrier substrate 1, the negative pressure generating assembly generates negative pressure within the plurality of suction holes 422 to connect the auxiliary peeling portion 32 of the functional layer 3 to the rotating assembly 42.

[0075] Specifically, the steps of connecting the auxiliary peeling portion 32 of the functional layer 3 to the rotating assembly 42 include:

[0076] The suction surface 421 is brought into contact with the surface of the auxiliary peeling portion 32 of the functional layer 3 so that the plurality of suction holes 422 face the auxiliary peeling portion 32 .

[0077] Negative pressure is generated in the plurality of adsorption holes 422 facing the auxiliary peeling portion 32 , so that the auxiliary peeling portion 32 of the functional layer 3 is adsorbed and fixed on the adsorption surface 421 .

[0078] Optionally, before step B42 , the functional layer 3 and the rotating assembly 42 are aligned by alignment marks provided on the carrier substrate 1 , the flexible device layer 2 or the functional layer 3 .

[0079] In step B4, combine Figure 4 The auxiliary peeling portion 32 moves the auxiliary peeling portion 32 and the effective portion 31 in sequence in a direction away from the carrier substrate 1 along the direction of the auxiliary peeling portion 32 toward the effective portion 31, so that the flexible device layer 2 is synchronously peeled off from the carrier substrate 1 under the drive of the functional layer 3, including the following steps:

[0080] At least one of the working platform 41 and the rotating assembly 42 is moved or rotated to peel the flexible device layer 2 from the carrier substrate 1 .

[0081] It can be understood that the rotation axis around which the rotation component 42 rotates can be set inside or on the rotation component, or can be set outside the rotation component, which is not specifically limited here.

[0082] The schematic diagram corresponding to the stripping stage of the first embodiment of the processing device 4 provided in this application is as follows 7A to 7CAs shown. The adsorption surface 421 includes a curved surface. Figure 6 The adsorption surface 421 is cylindrical. A plurality of adsorption holes 422 are distributed in an array on the adsorption surface 421. The column direction of the plurality of adsorption holes 422 is parallel to the edge line of the auxiliary peeling portion 32 away from the flexible device layer 2. The column direction of the plurality of adsorption holes 422 is perpendicular to the two end surfaces of the cylindrical adsorption surface 421. Figure 7C In the illustrated embodiment, the peeling angle α is the angle between the tangent direction of the adsorption surface 421 at the peeling position and the horizontal plane where the working platform 41 is located.

[0083] Furthermore, when the adsorption surface 421 is cylindrical and the flexible device layer 2 is roughly rectangular, the end faces of the adsorption surface 421 enclose a circle, one-third of the circumference of which is equal to the length of the diagonal of the flexible device layer 2. Theoretically, the larger the diameter of the circle enclosed by the end faces of the cylindrical adsorption surface 421, the smaller the peeling angle and peeling stress between the end face of the flexible device layer 2 and the carrier substrate 1. However, in actual production, the power consumption and layout of the processing equipment must be taken into consideration, and the size of the adsorption surface 421 of the rotating assembly 42 cannot be too large. The circumference of the circle enclosed by the end faces of the adsorption surface 421 is greater than the length of the flexible device layer 2 along the peeling direction to prevent the adsorption surface 421 from being too small and being completely wrapped during operation. However, if the cylindrical adsorption surface 421 is too covered, the portion initially adsorbed to the functional layer 3 will loosen and detach, affecting subsequent peeling. After testing, it was found that when the circumference of the circle formed by the end faces of the cylindrical adsorption surface 421 is three times the length of the diagonal of the flexible device layer 2, it can not only prevent the adsorption surface 421 from being completely wrapped and causing loosening, but also increase the diameter within a certain range to reduce the peeling angle and stress, and also take into account the actual production cost, assembly difficulty and other industrial needs.

[0084] In step B4, the step of connecting the auxiliary peeling portion 32 of the functional layer 3 to the processing device 4 includes:

[0085] The adsorption surface 421 is brought into contact with the surface of the auxiliary peeling portion 32 of the functional layer 3 , so that the column direction of the plurality of adsorption holes 422 is parallel to the edge of the auxiliary peeling portion 32 away from the flexible device layer 2 .

[0086] Negative pressure is formed in a row of adsorption holes 422 opposite to the edge of the auxiliary peeling portion 32 , so that the end of the auxiliary peeling portion 32 away from the effective portion 31 is fixedly connected to the adsorption surface 421 .

[0087] In step B4, the auxiliary peeling portion 32 and the effective portion 31 are sequentially moved away from the carrier substrate 1 along the direction of the auxiliary peeling portion 32 toward the effective portion 31, so that the flexible device layer 2 is synchronously peeled from the carrier substrate 1 under the drive of the functional layer 3, including the following steps:

[0088] The adsorption surface 421 is rotated to sequentially generate negative pressure in each row of adsorption holes 422 facing the functional layer 3 , so that the functional layer 3 is gradually adsorbed and fixed on the adsorption surface 421 from the auxiliary peeling portion 32 to the effective portion 31 .

[0089] The adsorption surface 421 drives the auxiliary peeling portion 32 of the functional layer 3 to gradually move away from the carrier substrate 1 , so that the flexible device layer 2 is peeled off from the carrier substrate 1 .

[0090] Specifically, a carrier substrate 1 with a flexible device layer 2 and a functional layer 3 is placed on a work platform 41. A vacuum pump is activated, creating negative pressure through the exhaust pipes within the multiple fixing holes on the work platform 41 opposite the carrier substrate 1, thereby adsorbing and securing the carrier substrate 1 to the surface of the work platform 41. The CCD is then used to align the peeling alignment marks, and the rotating assembly 42 is moved and / or rotated to compensate for alignment errors. The rotating assembly 42 is then lowered vertically until it contacts the auxiliary peeling portion 32 of the functional layer 3.

[0091] The vacuum pump is turned on to form negative pressure in the row of adsorption holes 422 on the rotating assembly 42 facing the auxiliary peeling part 32 , so that the area of ​​the auxiliary peeling part 32 facing the row of adsorption holes 422 is adsorbed and fixed on the adsorption surface 421 .

[0092] As the rotating assembly 42 rotates, the suction surface 421 rotates. The multiple rows of suction holes 422 on the rotating assembly 42 rotate sequentially until they face the functional layer 3. Accordingly, as each row of suction holes 422 rotates to face the functional layer 3, a vacuum pump creates a negative pressure within that row of suction holes 422, causing the area of ​​the functional layer 3 corresponding to that row of suction holes 422 to be adsorbed and fixed to the suction surface 421. This negative pressure within the suction holes 422 is maintained until the flexible device layer 2 is completely separated from the carrier substrate 1.

[0093] Optionally, in step B4, the work platform 41 moves at a speed of 1 to 2 mm / s toward the rotating assembly 42. The rotation speed of the rotating assembly 42 matches the movement speed of the work platform 41. The work platform 41 moves horizontally, and the rotating assembly 42 rotates in coordination until the flexible device layer 2 is completely separated from the carrier substrate 1.

[0094] In this embodiment, the flexible device layer 2 completely separated from the carrier substrate 1 is adsorbed and fixed on the cylindrical adsorption surface 421, and the carrier substrate 1 remains on the working platform 41. This linear operation method is conducive to the layout and design of the processing equipment.

[0095] In addition, since there is no optical adhesive layer on the surface of the auxiliary peeling portion 32 of the functional layer 3, the auxiliary peeling portion 32 will not adhere to the working platform 41. The edge of the auxiliary peeling portion 32 rests on the working platform 41, which is convenient for the execution of the subsequent step B42.

[0096] In steps B4 and B5 of this embodiment, the rotating assembly 42 rotates and the working platform 41 moves horizontally to separate the flexible device layer 2 from the carrier substrate 1. It is understood that in other specific embodiments of the present application, the rotating assembly 42 may be stationary or move horizontally, while the working platform 41 rotates relative to the rotating assembly 42 to separate the flexible device layer 2 from the carrier substrate 1.

[0097] The schematic diagram corresponding to the second embodiment of the processing device 4 provided in this application during the stripping stage is as follows Figures 8A to 8D As shown. The adsorption surface 421 is a plane. A plurality of adsorption holes 422 are provided on the adsorption surface 421. The adsorption surface 421 can rotate relative to the working platform 41 along the X1 direction. Figure 8B In the illustrated embodiment, the peeling position is located at the end surface of the flexible device layer. The peeling angle α, defined as the angle between the suction surface 421 and the work platform 41, is significantly smaller than the 90° peeling angle used in conventional techniques. Therefore, the design of this embodiment effectively reduces the peeling angle α and peeling stress at the end surface of the flexible device layer.

[0098] In step B4, the step of connecting the auxiliary peeling portion 32 of the functional layer 3 to the processing device 4 includes:

[0099] The adsorption surface 421 is placed face to face with the surface of the auxiliary peeling portion 32 of the functional layer 3 .

[0100] Negative pressure is formed in the adsorption holes 422 , so that the auxiliary peeling portion 32 is adsorbed and fixed on the adsorption surface 421 .

[0101] In step B4, the auxiliary peeling portion 32 and the effective portion 31 are sequentially moved away from the carrier substrate 1 along the direction of the auxiliary peeling portion 32 toward the effective portion 31, so that the flexible device layer 2 is synchronously peeled from the carrier substrate 1 under the drive of the functional layer 3, including the following steps:

[0102] The adsorption surface 421 is rotated to drive the auxiliary peeling portion 32 of the functional layer 3 to gradually move away from the carrier substrate 1 , so that the flexible device layer 2 is peeled off from the carrier substrate 1 .

[0103] Specifically, the carrier substrate 1 provided with the flexible device layer 2 and the functional layer 3 is placed on the work platform 41. The vacuum pump is turned on, and a negative pressure is generated in the multiple fixing holes on the work platform 41 opposite to the carrier substrate 1 through the exhaust pipe, thereby adsorbing and fixing the carrier substrate 1 to the surface of the work platform 41.

[0104] Then, the peeling alignment mark is aligned by the CCD, and the rotating assembly 42 is moved and / or rotated to compensate for the alignment error. The rotating assembly 42 is vertically lowered to contact the auxiliary peeling portion 32 of the functional layer 3.

[0105] The vacuum pump is turned on to form negative pressure in the plurality of adsorption holes 422 on the rotating assembly 42 facing the auxiliary peeling portion 32 , so that the area of ​​the auxiliary peeling portion 32 facing the adsorption holes is adsorbed and fixed on the adsorption surface 421 .

[0106] Rotate the rotating assembly 42 in the X1 direction. The suction surface 421 rotates accordingly in the X1 direction. Driven by the suction surface 421, the auxiliary peeling portion 32 gradually moves away from the carrier substrate 1. Maintain the negative pressure in the suction hole until the flexible device layer 2 is completely separated from the carrier substrate 1.

[0107] Optionally, in step B4, Figure 8B and Figure 8C The work platform 41 moves in the X2 direction, approaching the rotating assembly 42, at a speed of 1-2 mm / s. The rotation speed of the rotating assembly 42 matches the movement speed of the work platform 41. The work platform 41 moves in the X2 direction, and the rotating assembly 42 rotates in the X1 direction until the flexible device layer 2 is completely separated from the carrier substrate 1.

[0108] It is understandable that if Figure 8D As shown, the flexible device layer 2 and the carrier substrate 1 can also be separated by keeping the rotating assembly 42 stationary or moving horizontally and rotating the working platform 41 relative to the rotating assembly 42 along the X3 direction.

[0109] Between step B4 and step B5 , that is, after the flexible device layer 2 is peeled off from the carrier substrate 1 , the method for preparing the display panel further includes: attaching a support film to a side of the flexible device layer 2 away from the functional layer 3 using a processing device 4 .

[0110] Specifically, the steps of attaching the support film to the flexible device layer 2 using the processing device 4 as shown in the figure include:

[0111] The supporting film is fixed on the working platform 41. The specific fixing method of the supporting film is similar to that of step B41 and will not be repeated here.

[0112] In step B4, negative pressure is generated in the plurality of adsorption holes 422 opposite to the functional layer 3, so that the functional layer 3 is adsorbed and fixed on the adsorption surface 421. The flexible device layer 2 is located on the surface of the functional layer 3 away from the rotating assembly 42.

[0113] The rotating assembly 42 is moved to bring the flexible device layer 2 into contact with the supporting film.

[0114] At least one of the working platform 41 and the rotating assembly 42 is moved or rotated to sequentially eliminate the negative pressure in the adsorption holes 422 facing the support film, so that the functional layer 3 gradually separates from the adsorption surface 421 until the flexible device layer 2 is completely attached to the support film.

[0115] Specifically, the support film is fixed to the work platform 41 by suction. The CCD captures the alignment mark, and at least one of the work platform 41 and the rotating assembly 42 is moved and / or rotated to compensate for alignment errors. The rotating assembly 42 applies a vertical downward pressure of 0.1 to 0.4 MPa, bringing the flexible device layer 2, fixed to the suction surface 421, into contact with the support film and compressing the film to ensure a secure connection between the flexible device 2 and the support film.

[0116] Optionally, the work platform 41 is controlled to move at a speed of 1 to 2 mm / s. The rotation speed of the rotating assembly 42 matches the movement speed of the work platform 41. The work platform 41 moves horizontally, and the rotating assembly 42 rotates in coordination until the flexible device layer 2 is separated from the rotating assembly 42 and completely adheres to the support film.

[0117] In step B5, removing the auxiliary peeling portion 32 to obtain a display panel includes:

[0118] The functional layer 3 is cut using a laser to remove the auxiliary peeling portion 32, thereby obtaining a display panel. Therefore, the starting peeling position of the processing device 4 is set within the auxiliary peeling portion 32. Even if the processing device 4 damages the functional layer 3 at the starting peeling position due to excessive peeling angle or excessive peeling stress, it will not affect the display effect of the display panel.

[0119] It is worth noting that, before step B4, the method for preparing the display panel further includes ensuring that the bonding force between the functional layer 3 and the flexible device layer 2 is greater than the bonding force between the flexible device layer 2 and the carrier substrate 1. This ensures that during the peeling process in steps B4 and B5, the rotating assembly 42 connected to the functional layer 3 can drive the flexible device layer 2 to separate from the carrier substrate 1 through the functional layer 3.

[0120] Specifically, the present application provides a second embodiment of a method for manufacturing a display panel, such as Figure 9 Shown, including:

[0121] B01 . Provide a carrier substrate 1 , and arrange a first adhesive layer on the carrier substrate 1 .

[0122] B02. Dispose a flexible device layer 2 on the first adhesive layer.

[0123] B03. A second adhesive layer is provided on the flexible device layer 2. The adhesive strength of the first adhesive layer is reduced by selecting materials to be less than that of the second adhesive layer. A functional layer 3 is provided on the second adhesive layer. Functional layer 3 includes an interconnected active portion 31 and an auxiliary peeling portion 32. The auxiliary peeling portion 32 is located outside the active portion 31. The active portion 31 covers the flexible device layer 2. This ensures that the bonding strength between the flexible device layer 2 and the carrier substrate 1 is less than that between the flexible device layer 2 and the functional layer 3.

[0124] B4. Move the auxiliary peeling portion 32 and the effective portion 31 in sequence in the direction away from the carrier substrate 1 along the direction of the auxiliary peeling portion 32 toward the effective portion 31, so that the flexible device layer 2 is synchronously peeled off from the carrier substrate 1 driven by the functional layer 3.

[0125] B5. Remove the auxiliary peeling portion 32 to obtain a display panel.

[0126] In step B01, the first adhesive layer is a release layer. The step of providing the first adhesive layer on the carrier substrate 1 includes:

[0127] Materials for preparing the release layer, such as graphene solution and carbon nanotube solution, are sprayed in a mist-like manner to form a release layer liquid film on the carrier substrate 1 .

[0128] The release layer liquid film on the carrier substrate 1 is dried to form a solid release layer sub-film on the carrier substrate 1 .

[0129] Repeat the above steps 3 to 5 times to form 3 to 5 stacked release layer sub-films, thereby obtaining a release layer with a multi-layer composite structure.

[0130] In step B02, a flexible device layer 2 is provided on the first adhesive layer to connect the flexible device layer 2 to the first adhesive layer. The flexible device layer 2 is fixed to the carrier substrate 1 via the first adhesive layer.

[0131] In step B03, the second adhesive layer is an optical adhesive layer, which may be OCA adhesive, UV adhesive, etc.

[0132] In this embodiment, when the release layer having a multi-layer composite structure is separated from the flexible device layer 2 and the carrier substrate 1, the interface between the release layer sub-films breaks and falls off, so that a portion of the release layer remains on the carrier substrate 1, while the other portion of the release layer adheres to the flexible device layer 2.

[0133] Because the bonding force between the release layer sub-films is very weak, ranging from 0.1 to 0.5 N / cm, the optical adhesive layer has a strong adhesive force, resulting in a bonding force between the functional layer 3 and the flexible device layer 2 far exceeding 0.5 N / cm. Therefore, in the subsequent peeling step, the flexible device layer 2 is easily peeled off from the carrier substrate 1. In this embodiment, the material selection ensures that the adhesion of the first adhesive layer is less than that of the second adhesive layer, thereby reducing the bonding force between the flexible device layer 2 and the carrier substrate 1 to less than that between the flexible device layer 2 and the functional layer 3.

[0134] In summary, this embodiment discloses a method for manufacturing a display panel using a mechanical peeling process.

[0135] Specifically, the present application provides a third embodiment of a method for manufacturing a display panel, such as Figure 10As shown, including:

[0136] B1. Provide a carrier substrate 1.

[0137] B2. Disposing a flexible device layer 2 on the carrier substrate 1 .

[0138] B3. A functional layer 3 is provided on the flexible device layer 2. The functional layer 3 includes an effective portion 31 and an auxiliary peeling portion 32 connected to each other. The auxiliary peeling portion 32 is located outside the effective portion 31. The effective portion 31 covers the flexible device layer 2.

[0139] B04 . Perform laser scanning on the interface between the flexible device layer 2 and the carrier substrate 1 to destroy the bonding force between the flexible device layer 2 and the carrier substrate 1 .

[0140] B4. Move the auxiliary peeling portion 32 and the effective portion 31 in sequence in the direction away from the carrier substrate 1 along the direction of the auxiliary peeling portion 32 toward the effective portion 31, so that the flexible device layer 2 is synchronously peeled off from the carrier substrate 1 driven by the functional layer 3.

[0141] B5. Remove the auxiliary peeling portion 32 to obtain a display panel.

[0142] In step B04, the step of performing laser scanning on the interface between the flexible device layer 2 and the carrier substrate 1 to destroy the bonding force between the flexible device layer 2 and the carrier substrate 1 includes:

[0143] The flexible device layer 2 is fixed face down on the laser scanning platform.

[0144] The CCD is aligned with the laser scanning alignment mark provided on the carrier substrate 1 or the flexible device layer 2 .

[0145] A high-energy excimer laser is used to generate a laser beam, which is focused on the interface between the flexible substrate and the carrier substrate 1 through the carrier substrate 1 .

[0146] The flexible device layer 2 is scanned as a whole to separate the carrier substrate 1 from the flexible device layer 2 .

[0147] Flexible substrate materials are typically made of polyimide (PI). Because polyimide's viscosity changes significantly after exposure to laser light of a specific wavelength, laser lift-off (LLO) can be used to break the bond between the flexible device layer and the carrier substrate (partial adhesion still exists). Mechanical peeling can then be used to completely separate the flexible display device from the supporting glass substrate.

[0148] After the flexible substrate material absorbs laser energy, the bond between the flexible substrate and the carrier substrate 1 is destroyed. The flexible substrate decomposes and carbonizes, releasing a small amount of gas. This causes the flexible substrate in the flexible device layer 2 near the carrier glass 1 to separate from the carrier glass 1, but not completely detach. At this point, the adhesion between the flexible device layer 2 and the carrier glass 1 is very weak. In this embodiment, laser scanning separates the flexible device layer 2 and the carrier glass 1, ensuring that the bonding between the functional layer 3 and the flexible device layer 2 is greater than the bonding between the flexible device layer 2 and the carrier substrate 1.

[0149] In summary, this embodiment discloses a method for manufacturing a display panel using a laser lift-off process.

[0150] Through the preparation method of the display panel provided in the present application, a polarizer or protective film larger than the flexible device layer 2 is used as the functional layer. On the one hand, it can assist the transfer of the flexible device layer 2, and the auxiliary peeling part 32 of the processing equipment 4 adsorbs the edge of the functional layer 3 for adsorption transfer, and no adsorption marks are caused on the flexible device layer 2; on the other hand, it can also assist the peeling process. The processing equipment starts separation from the auxiliary peeling part 32 on the periphery of the functional layer 3, and drives the flexible display device layer 2 located in the effective part of the functional layer 3 to be peeled off from the carrier substrate 1 through the auxiliary peeling part 32, which can significantly reduce the peeling angle α and peeling stress between the end of the flexible device layer 2 and the carrier substrate 1, which is beneficial to protecting the flexible device and improving the yield of the peeling process.

[0151] Specifically, in the present application, the peeling angle α between the flexible device layer 2 and the carrier substrate 1 can be adjusted by controlling the angle between the auxiliary peeling portion 32 and the working platform 41. When the auxiliary peeling portion 32 drives the end surface of the flexible device layer 2 to peel from the carrier substrate 1, the peeling angle α of the end surface of the flexible device layer 2 is controlled to be less than 75°. In some specific embodiments, when the auxiliary peeling portion 32 drives the end surface of the flexible device layer 2 to peel from the carrier substrate 1, the peeling angle α of the end surface of the flexible device layer 2 is controlled to be less than 45°.

[0152] In the present embodiment, a film stripping or lamination process is performed by rotating a rotating assembly 42 and moving a work platform 41, with the rotational speed of the rotating assembly 42 and the movement speed of the work platform 41 being matched. Using the same equipment structure to perform both lamination and film stripping processes simplifies the equipment and process, shortening process cycles and improving equipment utilization in assembly line operations.

[0153] The present embodiment also provides a method for peeling a flexible device layer 2 from a carrier substrate 1 by adsorption. A functional layer 3 having an auxiliary peeling portion 32 is combined with a zone-controllable roller-shaped rotating assembly 42 to peel the flexible device layer 2 from the carrier substrate 1. The roller-shaped rotating assembly 42 is first fixed to the auxiliary peeling portion 32 of the functional layer 3 by adsorption. The auxiliary peeling portion 32 of the functional layer 3 is then used to gradually move the flexible device layer 2 within the effective portion 31 away from the carrier substrate 1. This method helps reduce the initial stress during peeling of the flexible device layer 2 from the carrier substrate 1 and improves process reliability.

[0154] The present application provides a method for manufacturing a display panel, wherein a functional layer disposed on a flexible device layer includes an interconnected effective portion and an auxiliary peeling portion, wherein the auxiliary peeling portion is located outside the effective portion and completely covers the flexible device layer. The auxiliary peeling portion of the functional layer is connected to a processing device, which drives the auxiliary peeling portion of the functional layer away from the carrier substrate, thereby peeling the flexible device layer from the carrier substrate. By setting the starting peeling position of the processing device at the auxiliary peeling portion on the functional layer that does not overlap with the flexible device layer, the excessive peeling angle and peeling stress generated at the starting peeling position are avoided and damage to the flexible device layer is prevented. Because the peeling angle is determined by the angle between the plane on which the adsorption surface or the tangent direction at the adsorption position corresponding to the adsorption surface is located and the plane on which the work platform is located, by moving the auxiliary peeling portion of the functional layer, the flexible device layer is simultaneously peeled from the carrier substrate under the drive of the functional layer, the peeling angle and peeling stress at the end surface of the flexible device layer can be reduced, thereby non-destructively peeling the flexible device layer. Since the auxiliary peeling portion will be removed in subsequent processes, the processing device will not damage the device layer and functional layer above the flexible device layer.

[0155] The above is a detailed introduction to a method for preparing a display panel and its processing equipment provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for preparing a display panel, characterized in that: include: providing a carrier substrate; providing a flexible device layer on the carrier substrate; Disposing a functional layer on the flexible device layer, the functional layer comprising an effective portion and an auxiliary peeling portion connected to each other, the auxiliary peeling portion being located outside the effective portion, and the effective portion covering the flexible device layer; Moving the auxiliary peeling portion and the effective portion in sequence in a direction away from the carrier substrate along the direction of the auxiliary peeling portion toward the effective portion, so that the flexible device layer is synchronously peeled off from the carrier substrate under the drive of the functional layer; removing the auxiliary peeling portion to obtain the display panel; The carrier substrate is disposed on a working platform, and at least a portion of the auxiliary peeling portion is connected to the working platform. The step of sequentially moving the auxiliary peeling portion and the effective portion in a direction away from the carrier substrate comprises: Connecting the auxiliary peeling portion to the rotating assembly using a rotating assembly; Moving or rotating at least one of the working platform and the rotating assembly to sequentially peel the auxiliary peeling portion and the effective portion from the carrier substrate, thereby driving the flexible device layer to be peeled from the carrier substrate; The rotating assembly has a rotatable adsorption surface, the adsorption surface is a plane, and a plurality of adsorption holes are provided on the adsorption surface. The step of connecting the auxiliary peeling part to the rotating assembly by using the rotating assembly includes: bringing the adsorption surface into contact with the surface of the auxiliary peeling portion so that the plurality of adsorption holes face the auxiliary peeling portion; and forming a negative pressure in the plurality of adsorption holes opposite to the auxiliary peeling portion, so that the auxiliary peeling portion is adsorbed and fixed on the adsorption surface; During peeling, the rotating component rotates along the X1 direction, the adsorption surface rotates accordingly along the X1 direction, the working platform remains stationary or moves toward the X2 direction close to the rotating component; or, the rotating component remains stationary or moves horizontally, and the working platform rotates relative to the rotating component along the X3 direction.

2. The method for manufacturing a display panel according to claim 1, wherein: The distance between the end surface of the auxiliary peeling portion away from the effective portion and the effective portion is 22 to 55 cm.

3. The method for manufacturing a display panel according to claim 1, wherein: When the auxiliary peeling portion and the effective portion are moved in sequence in a direction away from the carrier substrate, the peeling angle of the end surface of the flexible device layer is controlled to be less than 75°.

4. The method for manufacturing a display panel according to claim 1, wherein: The functional layer is a polarizer or a protective film.

5. The method for manufacturing a display panel according to claim 1, wherein: After the step of providing a functional layer on the flexible device layer and before the step of sequentially moving the auxiliary peeling portion and the effective portion in a direction away from the carrier substrate, the method further includes: The bonding force between the flexible device layer and the carrier substrate is made smaller than the bonding force between the flexible device layer and the functional layer.

6. The method for manufacturing a display panel according to claim 5, wherein: The step of making the bonding force between the flexible device layer and the carrier substrate smaller than the bonding force between the flexible device layer and the functional layer comprises: Laser scanning is performed on an interface between the flexible device layer and the carrier substrate to destroy the bonding force between the flexible device layer and the carrier substrate.

7. The method for manufacturing a display panel according to claim 1, wherein: A first adhesive layer is provided between the carrier substrate and the flexible device layer, and a second adhesive layer is provided between the flexible device layer and the functional layer, wherein the adhesion force of the first adhesive layer is smaller than the adhesion force of the second adhesive layer, so that the adhesion force between the flexible device layer and the carrier substrate is smaller than the adhesion force between the flexible device layer and the functional layer.

8. The method for manufacturing a display panel according to claim 1, wherein: After the flexible device layer is peeled off from the carrier substrate, the support film is attached to the flexible device layer using the rotating assembly.

9. The method for manufacturing a display panel according to claim 8, wherein: The step of attaching the support film to the flexible device layer using the rotating assembly includes: forming a negative pressure in the plurality of adsorption holes opposite to the functional layer, so that the functional layer is adsorbed and fixed on the adsorption surface, and the flexible device layer is located on a surface of the functional layer away from the rotating assembly; Moving or rotating the rotating component to bring the flexible device layer into contact with the supporting film; Move or rotate at least one of the working platform and the rotating assembly to sequentially eliminate the negative pressure in the adsorption holes facing the support film, so that the functional layer gradually separates from the adsorption surface until the flexible device layer is completely attached to the support film.

10. A processing device for preparing a display panel, characterized in that: The display panel can be manufactured using the method for manufacturing a display panel as claimed in any one of claims 1 to 9, wherein the processing equipment comprises: A working platform is used to support a carrier substrate, on which a flexible device layer to be peeled and a functional layer are sequentially stacked, wherein the functional layer includes an effective portion and an auxiliary peeling portion connected to each other, wherein the auxiliary peeling portion is located outside the effective portion, and the effective portion covers the flexible device layer; A rotating assembly is located above the working platform and is used to move the auxiliary peeling portion and the effective portion in sequence in a direction away from the carrier substrate along the direction of the auxiliary peeling portion toward the effective portion, so that the flexible device layer is synchronously peeled off from the carrier substrate under the drive of the functional layer; the rotating assembly has a rotatable adsorption surface, which is a plane and has a plurality of adsorption holes.

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