Driving backplane, manufacturing method thereof, and display device

Abstract

A driving backplane and a manufacturing method thereof, and a display device, wherein the driving backplane comprises: a substrate (10); the substrate (10) comprises: a light-emitting area and a binding area, the light-emitting area comprises: light-emitting units (P) arranged in an array, each light-emitting unit (P) comprises: a first signal line (32) and a pad (30) electrically connected to the first signal line (32); a first conductive layer, provided on one side of the substrate (10), comprises: the first signal line (32) and at least one signal detection line (11); a second conductive layer, provided on a side of the first conductive layer facing away from the substrate (10), comprises: a pad (30); the signal detection line (11) is electrically connected to the pad (30) of the light-emitting unit (P).

Description

Technical Field

[0001] The embodiments of the present disclosure relate to, but are not limited to, the field of display technology, and specifically to a driving backplane and a manufacturing method thereof, and a display device. Background Art

[0002] Semiconductor light-emitting diode (LED) technology has developed over the past three decades, from solid-state lighting power supplies to display backlights and finally LED displays, laying a solid foundation for its wider application. With the advancement of chip manufacturing and packaging technologies, backlights using submillimeter and even micron-scale micro-LEDs have gained widespread application.

[0003] The main structure of the backlight source based on LED technology includes a driving backplane and a control circuit. By fine-tuning the light-emitting diodes on the driving backplane through the control circuit, high dynamic range (HDR) image display can be achieved. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail in this disclosure. This overview is not intended to limit the scope of the claims.

[0005] In a first aspect, the present disclosure provides a driving backplane, comprising:

[0006] A substrate comprising: a light-emitting area and a binding area, wherein the light-emitting area comprises: light-emitting units arranged in an array, each light-emitting unit comprising: a first signal line and a pad electrically connected to the first signal line;

[0007] A first conductive layer, provided on one side of the substrate, comprising: a first signal line and at least one signal detection line;

[0008] The second conductive layer is provided on a side of the first conductive layer away from the substrate, and includes a pad; the signal detection line is electrically connected to the pad of the light emitting unit.

[0009] In some possible implementations, the device further includes: a binding terminal disposed on the substrate and located in the binding area, and a flexible circuit board electrically connected to the binding terminal;

[0010] The pad of the light emitting unit is electrically connected to the binding terminal through the signal detection line

[0011] In some possible implementations, the light-emitting area is divided into at least one light-emitting sub-area;

[0012] At least one signal detection line is electrically connected to a pad of at least one light-emitting unit in each light-emitting sub-region.

[0013] In some possible implementations, one of the at least one signal detection line is electrically connected to a pad of a light-emitting unit in each light-emitting sub-region.

[0014] In some possible implementations, one of the at least one signal detection lines is electrically connected to the pad of the light-emitting unit located in the kth column of the last row in each light-emitting sub-region; 1≤i≤m, where m is the total number of columns of light-emitting units in the light-emitting sub-region.

[0015] In some possible implementations, the driver backplane includes: at least two driver sub-backplanes;

[0016] Each driving sub-backplane includes at least one light-emitting sub-region.

[0017] In some possible implementations, for each light-emitting unit, an orthographic projection of the pad on the substrate partially overlaps with an orthographic projection of the first signal line on the substrate;

[0018] The orthographic projection of the signal detection line on the substrate partially overlaps with the orthographic projection of the pad connected to the signal detection line on the substrate.

[0019] In some possible implementations, the method further includes: a first insulating layer disposed between the substrate and the first conductive layer, a second insulating layer disposed between the first conductive layer and the second conductive layer, and a third insulating layer disposed on a side of the second conductive layer away from the substrate;

[0020] The second insulating layer is provided with a first via hole and a second via hole;

[0021] The first via hole exposes the first signal line, and the second via hole exposes the signal detection line.

[0022] In some possible implementations, the pad of the light-emitting unit is electrically connected to the first signal line through a first via hole, and is electrically connected to the signal detection line through a second via hole.

[0023] In some possible implementations, the first signal line extends along a first direction, and the light-emitting unit further includes: a second signal line, a third signal line, a fourth signal line, and a fifth signal line extending along the first direction; the first signal line and the second signal line are arranged along a second direction, the third signal line and the fourth signal line are arranged along the first direction, and the first direction and the second direction intersect; the first conductive layer further includes: a second signal line, a third signal line, a fourth signal line, and a fifth signal line;

[0024] The second signal line is located on one side of the first signal line, the third signal line and the fourth signal line are located on a side of the first signal line away from the second signal line, and the fifth signal line is located on a side of the third signal line away from the first signal line;

[0025] The signal detection line is provided between the third signal line and the first signal line in the light emitting unit where the first pad connection line connected to the signal detection line is located.

[0026] In some possible implementations, the first signal lines of the light-emitting units in the same column are the same signal line.

[0027] In some possible implementations, the light-emitting unit further includes: a first die-bonding region, a second die-bonding region, a third die-bonding region, a fourth die-bonding region, a first connecting line, a second connecting line, a third connecting line, a fourth connecting line, and a fifth connecting line; the pad includes: a first pad connecting line, a second pad connecting line, a third pad connecting line, a fourth pad connecting line, a first input terminal, a second input terminal, an output terminal, and a common voltage terminal; each die-bonding region includes: a first terminal and a second terminal spaced apart from each other, the first terminal and the second terminal being configured to connect two electrodes of the same light-emitting element;

[0028] The second conductive layer further includes: a first connecting line, a second connecting line, a third connecting line, a fourth connecting line and a fifth connecting line;

[0029] The first end of the first connecting wire is electrically connected to the second signal wire, the second end of the first connecting wire extends to the first die-bonding region and forms a first terminal in the first die-bonding region; the first end of the second connecting wire extends to the first die-bonding region and forms a second terminal in the first die-bonding region, the second end of the second connecting wire extends to the second die-bonding region and forms a first terminal in the second die-bonding region; the first end of the third connecting wire extends to the second die-bonding region and forms a second terminal in the second die-bonding region, the second end of the third connecting wire extends to the third die-bonding region and forms a first terminal in the third die-bonding region; the first end of the fourth connecting wire extends to the third die-bonding region and forms a second terminal in the third die-bonding region, the second end of the fourth connecting wire extends to the fourth die-bonding region and forms a first terminal in the fourth die-bonding region; the first end of the fifth connecting wire extends to the fourth die-bonding region and forms a first terminal in the fourth die-bonding region, and the second end of the fifth connecting wire is electrically connected to the third signal wire;

[0030] The first pad connection line and the second pad connection line are arranged along the second direction, the second pad connection line and the third pad connection line are arranged along the first direction, the third pad connection line and the fourth pad connection line are arranged along the second direction, and the fourth pad connection line and the first pad connection line are arranged along the first direction; the first pad connection line is located on a side of the second pad connection line close to the fifth signal line;

[0031] The first pad connection line is electrically connected to the common voltage terminal and the first signal line respectively, the second pad connection line is electrically connected to the first input terminal and the fourth signal line respectively, the third pad connection line is electrically connected to the second input terminal and the fifth signal line respectively, and the fourth pad connection line is electrically connected to the output terminal and the third signal line respectively;

[0032] The fifth connection line and the fourth pad connection line are provided separately, or the fifth connection line and the fourth pad connection line are the same signal line.

[0033] In some possible implementations, the second insulating layer is further provided with third to sixth via holes;

[0034] The third via hole exposes the second signal line, the fourth via hole exposes the fourth signal line, the fifth via hole exposes the fifth signal line, and the sixth via hole exposes the third signal line;

[0035] For each light-emitting unit, the first connecting line is electrically connected to the second signal line through the third via, the first pad connecting line is electrically connected to the first signal line through the first via, and is electrically connected to the signal detection line through the second via, the second pad connecting line is electrically connected to the fourth signal line through the fourth via, the third pad connecting line is electrically connected to the fifth signal line through the fifth via, and the fourth pad connecting line and the fifth connecting line are electrically connected to the third signal line through the sixth via.

[0036] In some possible implementations, the width of the first signal line is greater than the width of the second signal line;

[0037] The width of the second signal line is greater than the width of the fifth signal line;

[0038] The width of the fifth signal line is greater than the width of the third signal line;

[0039] The width of the fifth signal line is greater than the width of the fourth signal line;

[0040] The width of the signal detection line is smaller than the width of the fifth signal line;

[0041] The width of the signal detection line is approximately 0.5 mm to 1.5 mm.

[0042] In a second aspect, the present disclosure further provides a display device, comprising: the above-mentioned driving backplane.

[0043] In a third aspect, the present disclosure further provides a method for manufacturing a driver backplane, which is configured to manufacture the above-mentioned driver backplane, and the method comprises:

[0044] A substrate is provided, the substrate comprising: a light-emitting area and a binding area, the light-emitting area comprising: light-emitting units arranged in an array, each light-emitting unit comprising: a first signal line and a pad electrically connected to the first signal line;

[0045] A first conductive layer is formed on the substrate; the first conductive layer includes: a first signal line and at least one signal detection line;

[0046] A second conductive layer is formed on a side of the first conductive layer away from the substrate; the second conductive layer includes: a first pad connection line; and the signal detection line is electrically connected to the pad of the light emitting unit.

[0047] In some possible implementations, forming a first conductive layer on the substrate includes:

[0048] forming a first insulating layer on the substrate;

[0049] forming a first conductive layer on the first insulating layer, wherein the first conductive layer further comprises: a second signal line, a third signal line, a fourth signal line, and a fifth signal line;

[0050] forming a second conductive layer on a side of the first conductive layer away from the substrate;

[0051] forming a second insulating layer on the first conductive layer;

[0052] forming a second conductive layer on the third insulating layer, wherein the second conductive layer further comprises: a first connecting line, a second connecting line, a third connecting line, a fourth connecting line, and a fifth connecting line;

[0053] After forming the second conductive layer on a side of the first conductive layer away from the substrate, the method further includes:

[0054] A third insulating layer is formed on the second conductive layer.

[0055] Still other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] The accompanying drawings are used to provide an understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation to the technical solution of the present disclosure.

[0057] Figure 1 Schematic diagram of the planar structure of the drive backplane provided in the embodiment of the present disclosure Figure 1 ;

[0058] Figure 2 Schematic diagram of the planar structure of the drive backplane provided in the embodiment of the present disclosure Figure 2 ;

[0059] Figure 3 Schematic diagram of the structure of the drive backplane provided in the embodiment of the present disclosure Figure 1 ;

[0060] Figure 4 Schematic diagram of the structure of the drive backplane provided in the embodiment of the present disclosure Figure 2 ;

[0061] Figure 5 for Figure 3 Cross-section along AA direction;

[0062] Figure 6 is a schematic structural diagram of the first conductive layer;

[0063] Figure 7 is a schematic structural diagram of the second conductive layer;

[0064] Figure 8 A schematic diagram of the arrangement of the terminals of the pad;

[0065] Figure 9 A schematic diagram of a drive backplane provided by an exemplary embodiment Figure 3 ;

[0066] Figure 10 is a schematic diagram after forming the first conductive layer;

[0067] Figure 11 Schematic diagram after forming the third insulating layer Figure 1 ;

[0068] Figure 12 Schematic diagram after forming the third insulating layer Figure 2 ;

[0069] Figure 13 Schematic diagram after forming the second conductive layer Figure 1 ;

[0070] Figure 14 Schematic diagram after forming the second conductive layer Figure 2 . DETAILED DESCRIPTION

[0071] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Note that the embodiments can be implemented in a variety of different forms. A person of ordinary skill in the art can easily understand the fact that the methods and contents can be transformed into various forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.

[0072] In the drawings, the sizes of various components, layer thicknesses, or regions may be exaggerated for clarity. Therefore, one embodiment of the present disclosure is not necessarily limited to these dimensions, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate idealized examples, and one embodiment of the present disclosure is not limited to the shapes or numerical values ​​shown in the drawings.

[0073] In this specification, ordinal numbers such as “first”, “second” and “third” are provided to avoid confusion among constituent elements, and are not intended to limit the number.

[0074] In this specification, for convenience, words and phrases indicating orientation or positional relationships, such as "middle," "upper," "lower," "front," "back," "vertical," "horizontal," "top," "bottom," "inside," and "outside," are used to illustrate the positional relationships of constituent elements with reference to the accompanying drawings. This is merely for the purpose of facilitating the description of this specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present disclosure. The positional relationships of constituent elements may be appropriately changed depending on the direction in which each constituent element is described. Therefore, the present disclosure is not limited to the words and phrases described in the specification and may be appropriately replaced according to the circumstances.

[0075] In this specification, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, removable, or integral connections; mechanical or electrical connections; direct connections, indirect connections through intermediaries, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure.

[0076] In this specification, a transistor refers to a device that includes at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to the region through which current primarily flows.

[0077] In this specification, the first electrode can be a drain electrode and the second electrode can be a source electrode, or vice versa. The functions of "source electrode" and "drain electrode" may be interchanged when using transistors with opposite polarity or when the direction of current changes during circuit operation. Therefore, in this specification, "source electrode" and "drain electrode" may be interchanged.

[0078] In this specification, "electrically connected" includes components connected together via an element having some electrical function. There are no particular limitations on the "element having some electrical function" as long as it enables the transfer of electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0079] In this specification, "parallel" refers to a state where the angle formed by two straight lines is greater than -10° and less than 10°, and thus also includes a state where the angle is greater than -5° and less than 5°. Furthermore, "perpendicular" refers to a state where the angle formed by two straight lines is greater than 80° and less than 100°, and thus also includes a state where the angle is greater than 85° and less than 95°.

[0080] In this specification, the terms "film" and "layer" may be interchanged. For example, "conductive layer" may be replaced with "conductive film." Similarly, "insulating film" may be replaced with "insulating layer."

[0081] The term "about" in the present disclosure refers to a numerical value that is not strictly defined and allows for process and measurement errors.

[0082] Micro LEDs can include micro light emitting diodes (Micro LEDs) and sub-millimeter light emitting diodes (Mini LEDs). They have the advantages of small size and high brightness and can be widely used in the backlight modules of display devices. Display products using Micro LED backlights can achieve the same contrast as organic light-emitting diode (OLED) display products, allowing the products to retain the technical advantages of liquid crystal displays (LCDs), thereby improving the display effect and providing users with a better visual experience. In addition, Micro LED displays have gradually become a hot topic in display panels, mainly used in AR / VR, TV and outdoor display fields.

[0083] At present, micro-LED backlight sources are usually made by miniaturizing, arraying, and thin-filming LED chips using miniaturization process technology, and transferring the LED chips in batches to the driving backplane through mass transfer technology. The typical size (such as length) of Micro LED can be less than 100μm, for example, 10μm to 50μm. The typical size (such as length) of Mini LED can be about 100μm to 300μm, for example, 120μm to 260μm. The driving backplane usually includes a plurality of light-emitting units, each of which can include a plurality of micro-LEDs and a display driver integrated circuit (DDIC) arranged in series.

[0084] Micro LED backlights are equipped with common voltage lines, and the voltage drop of these lines is crucial to the electrical performance of the entire micro LED backlight. A large voltage drop in these lines can affect the current flowing into the light-emitting units, reducing the uniformity of their light emission, leading to poor display quality and a shorter lifespan.

[0085] Figure 1 Schematic diagram of the planar structure of the drive backplane provided in the embodiment of the present disclosure Figure 1 , Figure 2 Schematic diagram of the planar structure of the drive backplane provided in the embodiment of the present disclosure Figure 2 , Figure 3 Schematic diagram of the structure of the drive backplane provided in the embodiment of the present disclosure Figure 1 , Figure 4 Schematic diagram of the structure of the drive backplane provided in the embodiment of the present disclosure Figure 2 , Figure 5 for Figure 3 Cross-section along AA direction. Figures 1 to 5As shown, in a plane parallel to the driving backplane, the driving backplane provided by the embodiment of the present disclosure may include a substrate 10, a first conductive layer arranged on one side of the substrate 10, and a second conductive layer arranged on a side of the first conductive layer facing away from the substrate 10.

[0086] like Figures 1 to 3 As shown, the substrate includes: a light-emitting area and a binding area. The light-emitting area includes: light-emitting units P arranged in an array. Each light-emitting unit P includes: a first signal line 32 and a pad 30 electrically connected to the first signal line.

[0087] like Figure 3 As shown, the first conductive layer includes: a first signal line 32 and at least one signal detection line 11 .

[0088] like Figure 3 As shown, the second conductive layer includes: a pad 30; the signal detection line 11 is electrically connected to the pad 30 of the light emitting unit.

[0089] In an exemplary embodiment, the substrate 10 may be a rigid substrate or a flexible substrate, wherein the rigid substrate may be, but is not limited to, one or more of glass, metal foil, and polychlorinated biphenyl; the flexible substrate may be, but is not limited to, one or more of polyethylene terephthalate, polyethylene terephthalate, polyetheretherketone, polystyrene, polycarbonate, polyarylate, polyarylate, polyimide, polyvinyl chloride, polyethylene, and textile fiber.

[0090] In an exemplary embodiment, the first conductive layer is used to arrange various signal lines.

[0091] In one exemplary embodiment, the thickness of the first conductive layer is approximately 1.5 microns to 7 microns.

[0092] In an exemplary embodiment, the first conductive layer can be a single-layer structure or a multi-layer structure. For example, the single-layer structure can be made of copper. For another example, the multi-layer structure can be made of stacked MoNb / Cu / MoNb, or stacked MoNiTi / Cu / MoNiTi. For the stacked structure MoNb / Cu / MoNb, the bottom layer can be made of a molybdenum-niobium alloy MoNb to improve adhesion. The thickness of the molybdenum-niobium alloy MoNb can be about to For example The middle layer Cu is used to transmit electrical signals. The top layer is made of molybdenum-niobium alloy MoNb to prevent oxidation. The thickness of the molybdenum-niobium alloy MoNb can be about 100 to 300 angstroms, for example

[0093] In an exemplary embodiment, the second conductive layer is used to provide various pads, such as pads for mounting functional elements or pads for mounting functional element driver chips. The second conductive layer may also be provided with leads for connection.

[0094] In one exemplary embodiment, the second conductive layer has a thickness of approximately 5000 angstroms to 7000 angstroms.

[0095] In an exemplary embodiment, the second conductive layer can be a single-layer structure or a multi-layer structure. For example, the single-layer structure can be made of copper. For another example, the multi-layer structure can be made of stacked MoNb / Cu / CuNi. For the stacked structure MoNb / Cu / CuNi, the bottom layer can be made of a molybdenum-niobium alloy MoNb to improve adhesion. The thickness of the molybdenum-niobium alloy MoNb can be about to For example The middle layer Cu is used to transmit electrical signals. The top layer is made of copper-nickel alloy CuNi, which can take into account both anti-oxidation and solid crystal firmness. The thickness of the copper-nickel alloy CuNi can be about to

[0096] In an exemplary embodiment, the top layer may also be made of nickel Ni or indium tin oxide ITO, which is not limited in the present disclosure.

[0097] In an exemplary embodiment, the first signal line may be configured to provide a common voltage signal to the light emitting unit, and the common voltage signal may be a ground signal.

[0098] In an exemplary embodiment, the binding area may be located on one side of the light emitting area, or may be located on multiple sides of the light emitting area, such as Figure 1 and Figure 2 The description is given by taking the case where the binding area is located on one side of the luminous area as an example.

[0099] In an exemplary embodiment, the shape of the light-emitting area can be set according to actual needs. For example, the outline of the light-emitting area can be rectangular. The rectangular shape of the light-emitting area makes it easier to achieve zoning control of the backlight source.

[0100] In an exemplary embodiment, the shape of the light emitting unit can be determined according to actual needs. For example, the outline of the light emitting unit can be rectangular. Figure 1 and Figure 2 The light emitting unit is a rectangle. Figure 2 The rectangle is a tilted rectangle.

[0101] In an exemplary embodiment, the light-emitting units may be arranged in M ​​rows and N columns, where M is a positive integer greater than or equal to 1, and N is a positive integer greater than or equal to 1. For example, M may be 45, and N may be 80. The values ​​of M and N depend on the size of the driver backplane and process requirements, and are not limited in this disclosure.

[0102] In an exemplary embodiment, the number of signal detection lines 11 is determined according to actual needs, and the present disclosure does not impose any limitation on this.

[0103] The driving backplane provided by the embodiment of the present disclosure includes a substrate, the substrate includes: a light-emitting area and a binding area, the light-emitting area includes: light-emitting units arranged in an array, each light-emitting unit includes: a first signal line and a first pad connection line electrically connected to the first signal line; a first conductive layer, provided on one side of the substrate, includes: a first signal line and at least one signal detection line; a second conductive layer, provided on the side of the first conductive layer away from the substrate, includes: a pad; the signal detection line is electrically connected to the pad of the light-emitting unit. The signal detection line located in the first conductive layer provided in the present disclosure is electrically connected to the first signal line through the pad of the light-emitting unit. The first signal line can detect the voltage drop of the signal of the first signal line, so as to adjust the signal of the driving backplane according to the voltage drop of the first signal line, thereby improving the display effect of the driving backplane, extending the service life of the driving backplane, and improving the performance of the driving backplane.

[0104] like Figure 1 As shown, an exemplary embodiment provides a driving backplane further comprising: a binding terminal 42 disposed on the substrate and located in the binding area, and a flexible circuit board 50 electrically connected to the binding terminal 42 .

[0105] In an exemplary embodiment, the pad 30 of the light emitting unit is electrically connected to the binding terminal 42 via the signal detection line 11 .

[0106] like Figure 2 As shown, an exemplary embodiment of the driving backplane may further include: a plurality of leads 41 located in the binding area, wherein one end of at least one lead is connected to a signal line in at least one light emitting unit, and the other end is connected to a binding terminal 42 .

[0107] In an exemplary embodiment, the signal line may include: a first signal line.

[0108] like Figure 1 As shown, the driving backplane provided by an exemplary embodiment may further include a control circuit 60 . The control circuit 60 may be electrically connected to the binding terminal 42 via the flexible circuit board 50 .

[0109] In an exemplary embodiment, the control circuit 60 is configured to control the light emitting unit to emit light, and is further configured to receive a signal from a signal detection line, and control the light emitting unit to emit light according to the signal from the signal detection line.

[0110] In an exemplary embodiment, the light-emitting region may be divided into at least one light-emitting sub-region, and at least one signal detection line is electrically connected to a pad of at least one light-emitting unit in each light-emitting sub-region. Figure 1 The following description is made by taking four luminescent sub-regions as an example.

[0111] In an exemplary embodiment, Figure 1 As shown, one of the at least one signal detection line is electrically connected to a pad of a light-emitting unit in each light-emitting sub-region.

[0112] In an exemplary embodiment, one signal detection line 11 of the at least one signal detection line may be connected to at least one pad.

[0113] In an exemplary embodiment, one of the at least one signal detection line may be electrically connected to a pad of any row of light-emitting units in each light-emitting sub-region.

[0114] In an exemplary embodiment, one of the at least one signal detection lines is electrically connected to the pad of the light-emitting unit located in the kth column of the last row in each light-emitting sub-region; 1≤i≤m, where m is the total number of columns of light-emitting units in the light-emitting sub-region.

[0115] In an exemplary embodiment, one of the at least one signal detection line may be electrically connected to a pad of a light-emitting unit located in the last row and the last column in each light-emitting sub-region.

[0116] In the present disclosure, one of the at least one signal detection line is electrically connected to the pad of the light-emitting unit located in the last row and column k in each light-emitting sub-region, so that the voltage drop of the first signal line from the farthest end to the nearest end can be detected, thereby improving the detection accuracy. For example, the signal detection line can be electrically connected to the pad of the light-emitting unit in the last row of each light-emitting sub-region. Figure 3 is a schematic diagram of two adjacent light-emitting units except the last row, Figure 4 This is a schematic diagram of two adjacent light-emitting units in the last row, one of which is connected to a signal detection line.

[0117] In an exemplary embodiment, the number of signal detection lines connected to each light-emitting sub-region is determined according to the detection accuracy, and the present disclosure does not impose any limitation on this.

[0118] In an exemplary embodiment, the driving backplane may be a whole backplane, and all light-emitting sub-regions are arranged in one backplane.

[0119] In an exemplary embodiment, the driving backplane may include: at least two driving sub-backplanes, wherein different driving sub-backplanes are arranged at intervals, and each driving sub-backplane includes at least one light-emitting sub-region.

[0120] In an exemplary embodiment, for each light emitting unit, an orthographic projection of the pad on the substrate partially overlaps with an orthographic projection of the first signal line 32 on the substrate.

[0121] In an exemplary embodiment, the orthographic projection of the signal detection line 11 on the substrate partially overlaps with the orthographic projection of the pad to which the signal detection line 11 is connected on the substrate.

[0122] like Figure 4 As shown, in an exemplary embodiment, the driving backplane may further include: a first insulating layer 71 arranged between the substrate 10 and the first conductive layer, a second insulating layer 72 arranged between the first conductive layer and the second conductive layer, and a third insulating layer 73 arranged on the side of the second conductive layer away from the substrate.

[0123] In an exemplary embodiment, the first insulating layer 71 may be an inorganic insulating layer. The inorganic insulating layer may be one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multilayer, or a composite layer.

[0124] In one exemplary embodiment, the second insulating layer 72 may include a first organic insulating layer and a first inorganic insulating layer; the first organic insulating layer is disposed on a side of the first inorganic insulating layer closer to the substrate. The first organic insulating layer may be made of polyimide. The first inorganic insulating layer may be one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, multiple layers, or a composite layer.

[0125] In one exemplary embodiment, the third insulating layer 73 may include: a second organic insulating layer and a second inorganic insulating layer; the second organic insulating layer is disposed on a side of the second inorganic insulating layer closer to the substrate. The second organic insulating layer may be made of polyimide. The second inorganic insulating layer may be one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, multiple layers, or a composite layer.

[0126] In an exemplary embodiment, a first via hole and a second via hole are provided on the second insulating layer, wherein the first via hole exposes the first signal line, and the second via hole exposes the signal detection line.

[0127] In an exemplary embodiment, the first pad connection line 21 of the light emitting unit is electrically connected to the first signal line 32 through a first via hole, and is electrically connected to the signal detection line 11 through a second via hole.

[0128] In an exemplary embodiment, the first signal line 32 extends along a first direction.

[0129] Figure 6 is a schematic structural diagram of the first conductive layer, such as Figure 3 、 Figure 4 、 Figure 6As shown, in an exemplary embodiment, the light emitting unit may further include: a second signal line 31, a third signal line 33, a fourth signal line 34, and a fifth signal line 35 extending along the first direction. The second signal line 31 and the first signal line 32 are arranged along the second direction, and the third signal line 33 and the fourth signal line 34 are arranged along the first direction, and the first direction and the second direction intersect.

[0130] In an exemplary embodiment, the first conductive layer further includes a second signal line 31 , a third signal line 33 , a fourth signal line 34 and a fifth signal line 35 .

[0131] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the second signal line 31 is located on one side of the first signal line 32 , the third signal line 33 and the fourth signal line 34 are located on the side of the first signal line 32 away from the second signal line 31 , and the fifth signal line 35 is located on the side of the third signal line 33 away from the first signal line 32 .

[0132] In an exemplary embodiment, the second signal line 31 can be configured to provide a driving voltage signal to the light-emitting unit. The third signal line 33 outputs a driving signal and a relay signal. The driving signal can be a driving current for driving the light-emitting element to emit light. The relay signal can be an address signal provided to other light-emitting units. Other light-emitting units receive the relay signal as an input signal to obtain the address signal. The fourth signal line 34 can be configured to provide a first signal to the light-emitting unit. The first signal is, for example, an address signal, for selecting the light-emitting unit with the corresponding address. Among the multiple light-emitting units in the driving backplane, the addresses of different light-emitting units can be the same or different, and the address signal can be an 8-bit signal. The fifth signal line 35 can be configured to provide a second signal to the light-emitting unit. The second signal is, for example, a carrier signal and a duration signal. The carrier signal can provide electrical energy, and the duration signal can control the light-emitting duration of the light-emitting unit to control its visual light brightness.

[0133] In an exemplary embodiment, Figure 4 As shown, the signal detection line 11 is provided between the third signal line 33 and the first signal line 32 in the light emitting unit where the pad to which the signal detection line 11 is connected is located.

[0134] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the width of the first signal line 32 may be greater than the width of the second signal line 31 .

[0135] In an exemplary embodiment, the width of the first signal line 32 may be approximately 5 mm to 7 mm.

[0136] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the width of the second signal line 31 may be greater than the width of the fifth signal line 35 .

[0137] In an exemplary embodiment, the width of the second signal line 31 may be approximately 2 mm to 4 mm.

[0138] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the width of the fifth signal line 35 may be greater than the width of the third signal line 33 .

[0139] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the width of the fifth signal line 35 may be greater than the width of the fourth signal line 34 .

[0140] In an exemplary embodiment, the width of the fifth signal line 35 may be approximately 1.5 mm to 2 mm.

[0141] In an exemplary embodiment, the width of the third signal line 33 may be approximately 0.5 mm to 1.5 mm.

[0142] In an exemplary embodiment, the width of the fourth signal line 34 may be approximately 0.5 mm to 1.5 mm.

[0143] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the width of the signal detection line 11 may be smaller than the width of the fifth signal line 35.

[0144] In an exemplary embodiment, the width of the signal detection line 11 may be approximately 0.5 mm to 1.5 mm.

[0145] In an exemplary embodiment, the second insulating layer is provided with third to sixth via holes, wherein the third via hole exposes the second signal line, the fourth via hole exposes the fourth signal line, the fifth via hole exposes the fifth signal line, and the sixth via hole exposes the third signal line.

[0146] Figure 7 is a schematic structural diagram of the second conductive layer, such as Figure 3 、 Figure 4 and Figure 7 As shown, in an exemplary embodiment, the light-emitting unit may further include: a first die-bonding region L1, a second die-bonding region L2, a third die-bonding region L3, a fourth die-bonding region L4, a first connecting wire 51, a second connecting wire 52, a third connecting wire 53, a fourth connecting wire 54, and a fifth connecting wire 55. Each die-bonding region includes: a first terminal and a second terminal that are relatively spaced apart, and the first terminal and the second terminal are configured to connect two electrodes of the same light-emitting element.

[0147] In an exemplary embodiment, the second conductive layer may further include a first connecting line, a second connecting line, a third connecting line, a fourth connecting line, and a fifth connecting line.

[0148] In an exemplary embodiment, Figure 3 and Figure 4 As shown, a first end of the first connection line 51 is electrically connected to the second signal line 31 , and a second end of the first connection line 51 extends to the first die-bonding region L1 and forms a first terminal in the first die-bonding region L1 .

[0149] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the first end of the second connection line 52 extends to the first die-bonding region L1 and forms a second terminal in the first die-bonding region L1 , and the second end of the second connection line 52 extends to the second die-bonding region L2 and forms a first terminal in the second die-bonding region L2 .

[0150] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the first end of the third connection line 53 extends to the second die-bonding area L2 and forms a second terminal in the second die-bonding area L2, and the second end of the third connection line 53 extends to the third die-bonding area L3 and forms a first terminal in the third die-bonding area L3.

[0151] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the first end of the fourth connection line 54 extends to the third die-bonding region L3 and forms a second terminal in the third die-bonding region L3 , and the second end of the fourth connection line 54 extends to the fourth die-bonding region L4 and forms a first terminal in the fourth die-bonding region L4 .

[0152] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the first end of the fifth connection line 55 extends to the fourth die-bonding region L4 and forms a first terminal in the fourth die-bonding region L4 , and the second end of the fifth connection line 55 is electrically connected to the third signal line 33 .

[0153] In one exemplary embodiment, the first terminal and second terminal of the first die-bonding region L1 are spaced apart from each other, and the first terminal and the second terminal are configured to respectively connect two electrodes of the first light-emitting element to be subsequently transferred, thereby connecting the first light-emitting element to the driver backplane. The die-bonding region refers to the area that secures the electrodes of the light-emitting element.

[0154] In an exemplary embodiment, the first terminal and the second terminal of the second die-bonding region L2 are spaced apart from each other, and the first terminal and the second terminal are configured to respectively connect two electrodes of the second light-emitting element transferred subsequently, thereby connecting the second light-emitting element to the driving backplane.

[0155] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the first terminal and the second terminal of the third die-bonding area L3 are spaced apart relative to each other, and the first terminal and the second terminal are configured to respectively connect two electrodes of the subsequently transferred third light-emitting element to achieve connection between the third light-emitting element and the driving backplane.

[0156] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the first terminal and the second terminal of the fourth die-bonding area L4 are spaced apart from each other, and the first terminal and the second terminal are configured to respectively connect two electrodes of the fourth light-emitting element transferred subsequently, thereby achieving connection between the fourth light-emitting element and the driving backplane.

[0157] In one exemplary embodiment, the light emitting element may be a micro LED.

[0158] The present disclosure utilizes multiple connecting wires within a single light-emitting unit to accommodate four series-connected LEDs. In exemplary embodiments, a single light-emitting unit may be configured with multiple LEDs, such as four, five, six, or eight. The arrangement of the multiple light-emitting units may be arbitrary and is not limited by the present disclosure. Figure 3 and Figure 4 The following description is made by taking an example where four light emitting diodes are installed in one light emitting unit.

[0159] like Figure 1 、 Figure 3 and Figure 4 As shown, in an exemplary embodiment, the pads may include: a first pad connection line 21, a second pad connection line 22, a third pad connection line 23, a fourth pad connection line 24, a first input terminal Di, a second input terminal Pwr, an output terminal Out, and a common voltage terminal Gnd. The first pad connection line 21 and the second pad connection line 22 are arranged along the second direction, the second pad connection line 22 and the third pad connection line 23 are arranged along the first direction, the third pad connection line 23 and the fourth pad connection line 24 are arranged along the second direction, and the fourth pad connection line 24 and the first pad connection line 21 are arranged along the first direction. The first pad connection line 21 is located on the side of the second pad connection line 22 close to the fifth signal line.

[0160] In an exemplary embodiment, Figure 3 and Figure 4As shown, the orthographic projection of the first pad connection line 21 on the substrate partially overlaps with the orthographic projection of the second signal line 31 on the substrate.

[0161] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the orthographic projection of the second pad connection line 22 on the substrate partially overlaps with the orthographic projections of the first signal line 32 , the third signal line 33 and the fourth signal line 34 on the substrate.

[0162] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the orthographic projection of the third pad connection line 23 on the substrate partially overlaps with the orthographic projections of the first signal line 32 , the third signal line 33 and the fifth signal line 35 on the substrate.

[0163] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the orthographic projection of the fourth pad connection line 24 on the substrate partially overlaps with the orthographic projections of the first signal line 32 and the third signal line 33 on the substrate.

[0164] Figure 8 FIG. 1 is a schematic diagram showing the arrangement of terminals in a pad. In an exemplary embodiment, as shown in FIG. Figure 8 As shown, the first input terminal Di can be connected to the fourth signal line 34 and configured to receive the first signal provided by the fourth signal line 34. The first signal is, for example, an address signal, which is used to select the light-emitting unit of the corresponding address. The display driver integrated circuit can obtain the address to be transmitted by parsing the address signal. The second input terminal Pwr is connected to the fifth signal line 35 and configured to receive the second signal. The second signal is, for example, a carrier signal and a duration signal. The common voltage terminal Gnd is connected to the first signal line 32 and configured to receive a common voltage signal. The output terminal Out is connected to the third signal line 33 and configured to output a drive signal and a relay signal. The drive signal can be a drive current for driving the light-emitting element to emit light. The relay signal can be an address signal provided to other light-emitting units. The other light-emitting units receive the relay signal as an input signal to obtain the address signal.

[0165] In an exemplary embodiment, Figure 3 and Figure 4 As shown, the first pad connection line 21 is electrically connected to the common voltage terminal Gnd and the first signal line 32, the second pad connection line 22 is electrically connected to the first input terminal Di and the fourth signal line 34, respectively, the third pad connection line 23 is electrically connected to the second input terminal Pwr and the fifth signal line 35, respectively, and the fourth pad connection line 24 is electrically connected to the output terminal Out and the third signal line 33.

[0166] In an exemplary embodiment, Figure 3 and Figure 4 An opening area is provided on a side of the first signal line 32 close to the third signal line 33 .

[0167] like Figure 4 As shown, the first conductive layer is provided with a plurality of opening areas. The first conductive layer further includes a plurality of conductive islands 80, at least one of the opening areas has a conductive island 80, and there is a gap between the outer periphery of the conductive island 80 and the first signal line. The conductive island 80 and the first conductive layer are made of the same material. It can also be understood that an annular groove is dug in the first conductive layer to form a separate conductive area, namely the conductive island 80. The plurality of pad connection lines above the opening area with the conductive island 80 are located just above the conductive island 80. Since the plurality of pad connection lines are located above the conductive island 80 and there is a gap between the conductive island 80 and the first signal line, even if the plurality of pad connection lines are short-circuited with the conductive island 80, it will not affect the first signal line.

[0168] In an exemplary embodiment, for each light-emitting unit, the first connecting line 51 is electrically connected to the second signal line 31 through a third via, the first pad connecting line 21 is electrically connected to the first signal line 32 through a first via, and is electrically connected to the signal detection line 11 through a second via, the second pad connecting line 22 is electrically connected to the fourth signal line 34 through a fourth via, the third pad connecting line 23 is electrically connected to the fifth signal line 35 through a fifth via, and the fourth pad connecting line 24 and the fifth connecting line 55 are electrically connected to the third signal line 33 through a sixth via.

[0169] Figure 9 A schematic diagram of a drive backplane provided by an exemplary embodiment Figure 3 . Figure 9 The driving backplane provided in the embodiment includes two rows and two columns of light emitting units. Figure 9 As shown, in an exemplary embodiment of a driving backplane, the second signal lines 31 in the light emitting units in the same column can be the same signal line. The number of the second signal lines 31 can be N, where N is the total number of columns of light emitting units.

[0170] like Figure 9 As shown, in a driving backplane provided by an exemplary embodiment, the first signal lines 32 in the light-emitting units in the same column can be the same signal line.

[0171] like Figure 9 As shown, in a driving backplane provided by an exemplary embodiment, the fifth signal lines 35 in the light-emitting units located in the same column can be the same signal line.

[0172] like Figure 9As shown, in a driving backplane provided by an exemplary embodiment, the fourth signal line 34 in the light-emitting unit in the i-th row and j-th column can be the same signal line as the third signal line 33 in the light-emitting unit in the i+1-th row and j-th column.

[0173] like Figure 9 As shown, in a driving backplane provided by an exemplary embodiment, the fifth signal line in the light-emitting unit in the i-th row and k-th column and the fifth signal line in the light-emitting unit in the i-th row and k+1-th column can be the same signal line, 1≤i≤M-1, 1≤j≤N, k is an odd number greater than or equal to 1 and less than or equal to N, and M is the total number of rows of light-emitting units. The fifth signal line of the light-emitting unit in the first column and the fifth signal line of the light-emitting unit in the second column are the same signal line. The fifth signal line of the light-emitting unit in the third column and the fifth signal line of the light-emitting unit in the fourth column are the same signal line, and so on. The number of fifth signal lines 35 can be N / 2.

[0174] In a driving backplane provided by an exemplary embodiment, the light emitting units in the same column have the same structure, and the light emitting units in adjacent columns may have different structures, or may be different. Figure 9 The description is made by taking the different structures of the light emitting units in adjacent columns as an example.

[0175] In an exemplary embodiment, when the structures of the light emitting units in adjacent columns are different, the structure of the light emitting unit in the i-th row and j-th column is the same as the structure of the light emitting unit in the i-th row and j+2-th column.

[0176] like Figure 3 and Figure 4 As shown, in a driving backplane provided by an exemplary embodiment, the fifth connection line 55 and the fourth pad connection line 24 in the light emitting unit can be provided separately, or can be the same signal line. Figure 3 、 Figure 4 and Figure 9 The following example illustrates the arrangement of the fifth connection line 55 and the fourth pad connection line 24 of the light-emitting units in the first column, which are separately arranged, and the fifth connection line 55 and the fourth pad connection line 24 of the light-emitting units in the second column, which are the same signal line. The arrangement of the fifth connection line 55 and the fourth pad connection line 24 in the light-emitting units is determined by the layout of the signal lines of the light-emitting units.

[0177] In an exemplary embodiment, Figure 3 As shown, the first connection line 51 can be straight and extend along the second direction. The first end of the first connection portion is connected to the second signal line, and the second end of the first connection portion extends to the first die-bonding area and forms a first terminal in the first die-bonding area.

[0178] In an exemplary embodiment, Figure 3The second connection line 52 may include: a first connection portion, a second connection portion, and a third connection portion. The first connection portion extends along the first direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the first connection portion on the substrate. The first end of the first connection portion extends to the first solid crystal region and forms a second terminal in the first solid crystal region. The second end of the first connection portion is electrically connected to the first end of the second connection portion. The second connection portion extends along the second direction, and the orthographic projection of the second signal line on the substrate overlaps with the orthographic projection of the first signal line and the second signal line on the substrate. The second end of the second connection portion is electrically connected to the first end of the third connection portion. The third connection portion extends along the first direction, the orthographic projection of the second signal line on the substrate overlaps the orthographic projection of the third connection portion on the substrate. The second end of the third connection portion extends to the second solid crystal region and forms a first terminal in the second solid crystal region.

[0179] In an exemplary embodiment, Figure 3 As shown, the third connection line 53 may include: a first connection portion, a second connection portion and a third connection portion. The first connection portion extends along the second direction, and its orthographic projection on the substrate overlaps with the orthographic projections of the first signal line and the second signal line on the substrate. The first end of the first connection portion extends to the second solid crystal region, and forms a second terminal in the second solid crystal region, and the second end of the first connection portion is electrically connected to the first end of the second connection portion. The second connection portion extends along the first direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the second connection portion on the substrate, and the second end of the second connection portion is connected to the first end of the third connection portion. The third connection portion extends along the second direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the third connection portion on the substrate, and the second end of the third connection portion extends to the third solid crystal region, and forms a first terminal in the third solid crystal region.

[0180] In an exemplary embodiment, Figure 3 As shown, the orthographic projection of the first signal line 32 on the substrate overlaps the orthographic projection of the fourth connection line 54 on the substrate. The fourth connection line 54 may include: a first connection portion, a second connection portion, and a third connection portion. The first connection portion extends along the first direction, the first end of the first connection portion extends to the third die-bonding region, and forms a second terminal in the third die-bonding region, and the second end of the first connection portion is electrically connected to the first end of the second connection portion. The second connection portion extends along the second direction, the second end of the second connection portion is connected to the first end of the third connection portion. The third connection portion extends along the first direction, the second end of the third connection portion extends to the fourth die-bonding region, and forms a first terminal in the fourth die-bonding region.

[0181] In an exemplary embodiment, Figure 3As shown, the fifth connecting line 55 can be linear. The orthographic projection of the fifth connecting line on the substrate partially overlaps with the orthographic projections of the first and third signal lines on the substrate. The first end of the fifth connecting line extends to the fourth die-bonding region L4 and forms a second terminal therein. The second end of the fifth connecting line 55 is electrically connected to the third signal line 33.

[0182] In an exemplary embodiment, Figure 3 As shown, the first pad connection line 21 can be linear and extend along the second direction, and the orthographic projection of the first signal line 32 on the substrate covers the orthographic projection of the first pad connection line 21 on the substrate. The first pad connection line 21 is connected to the common voltage terminal GnD and the first signal line 32 respectively. Wherein, 1≤m≤M-1.

[0183] In an exemplary embodiment, Figure 4 As shown, the first pad connection line 21 may include a first connection portion and a second connection portion. The first connection portion extends along the second direction, and its orthographic projection on the substrate does not overlap with the orthographic projection of the first signal line on the substrate. The first connection portion is connected to the common voltage terminal GnD and the second connection portion, respectively. The second connection portion extends along the first direction, and its orthographic projection on the substrate partially overlaps with the orthographic projection of the first signal line on the substrate. The second connection portion is connected to the first signal line.

[0184] In an exemplary embodiment, Figure 3 As shown, the second pad connection line 22 may include: a first connection portion, a second connection portion, a third connection portion and a fourth connection portion. The first connection portion extends along the first direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the first connection portion on the substrate. The first connection portion is connected to the second connection portion and the first input terminal. The second connection portion extends along the second direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the second connection portion on the substrate. The second connection portion is connected to the third connection portion. The third connection portion extends along the first direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the third connection portion on the substrate. The third connection portion is connected to the fourth connection portion. The fourth connection portion extends along the second direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the first signal line, the third signal line and the fourth signal line on the substrate. The fourth connection portion is connected to the fourth signal line.

[0185] In an exemplary embodiment, Figure 3As shown, the third pad connection line 23 may include a first connection portion and a second connection portion. The first connection portion extends along a first direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the first connection portion on the substrate. The first connection portion is connected to the second connection portion and the second input terminal. The second connection portion extends along a second direction, and its orthographic projection on the substrate partially overlaps the orthographic projections of the first, third, and fifth signal lines on the substrate. The second connection portion is connected to the fifth signal line.

[0186] In an exemplary embodiment, Figure 3 As shown, the fourth pad connection line 24 can be linear, extending along the second direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the first signal line and the third signal line on the substrate. The fourth pad connection line 24 is connected to the output terminal Out and the third signal line 33 respectively.

[0187] In an exemplary embodiment, Figure 3 As shown, the first connecting line 51 may include: a first connecting portion and a second connecting portion. The first connecting portion extends along a first direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the first connecting portion on the substrate. The first end of the first connecting portion extends to the first die-bonding region and forms a first terminal in the first die-bonding region, and the second end of the first connecting portion is connected to the first end of the second connecting portion. The second connecting portion extends along a second direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the second signal line and the first signal line on the substrate. The second end of the second connecting portion is electrically connected to the second signal line 31.

[0188] In an exemplary embodiment, Figure 3 As shown, the second connecting line may include: a first connecting portion and a second connecting portion. The first connecting portion extends along the second direction, and its orthographic projection on the substrate overlaps with the orthographic projections of the first signal line and the second signal line on the substrate. The first end of the first connecting portion extends to the first solid crystal region and forms a second terminal in the first solid crystal region, and the second end of the first connecting portion is electrically connected to the first end of the second connecting portion. The second connecting portion extends along the first direction, and the orthographic projection of the second signal line on the substrate overlaps the orthographic projection of the second connecting portion on the substrate. The second end of the second connecting portion extends to the second solid crystal region and forms a first terminal in the second solid crystal region.

[0189] In an exemplary embodiment, Figure 3As shown, the third connection line may include: a first connection part, a second connection part and a third connection part. The first connection part extends along the first direction, and the orthographic projection of the second signal line on the substrate covers the orthographic projection of the first connection part on the substrate. The first end of the first connection part extends to the second solid crystal area, and forms a second terminal in the second solid crystal area, and the second end of the first connection part is electrically connected to the first end of the second connection part. The second connection part extends along the second direction, and the orthographic projection on the substrate partially overlaps with the orthographic projections of the first signal line and the second signal line on the substrate. The second end of the second connection part is connected to the first end of the third connection part. The third connection part extends along the first direction, and the orthographic projection of the first signal line on the substrate covers the orthographic projection of the third connection part on the substrate. The second end of the third connection part extends to the third solid crystal area, and forms a first terminal in the third solid crystal area.

[0190] In an exemplary embodiment, Figure 3 As shown, the orthographic projection of the first signal line on the substrate covers the orthographic projection of the fourth connection line on the substrate. The fourth connection line 54 may include: a first connection portion, a second connection portion, and a third connection portion. The first connection portion extends along the first direction. The first end of the first connection portion extends to the third solid crystal region and forms a second terminal in the third solid crystal region, and the second end of the first connection portion is electrically connected to the first end of the second connection portion. The second connection portion extends along the second direction. The second end of the second connection portion is connected to the first end of the third connection portion. The third connection portion extends along the first direction. The second end of the third connection portion extends to the fourth solid crystal region and forms a first terminal in the fourth solid crystal region.

[0191] In an exemplary embodiment, Figure 3 As shown, the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the fifth connecting line on the substrate. The fifth connecting line 55 may include: a first connecting portion and a second connecting portion. The first connecting portion extends along the second direction. The first end of the first connecting portion extends to the fourth die-bonding region and forms a second terminal in the fourth die-bonding region. The second end of the first connecting portion is electrically connected to the first end of the second connecting portion. The second connecting portion extends along the first direction. The second end of the second connecting portion is electrically connected to the fourth pad connecting line.

[0192] In an exemplary embodiment, Figure 3 As shown, the first pad connection line 21 can be straight and extend along the second direction, and the orthographic projection of the first signal line 32 on the substrate covers the orthographic projection of the first pad connection line 21 on the substrate. The first pad connection line 21 is connected to the common voltage terminal GnD and the first signal line 32 respectively.

[0193] In an exemplary embodiment, Figure 4As shown, the first pad connection line 21 may include a first connection portion, a second connection portion and a third connection portion. The first connection portion extends along the first direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the second signal line, the first signal line and the signal detection line on the substrate. The first connection portion extends along the first direction and is connected to the common voltage terminal GnD and the second connection portion. The second connection portion extends along the second direction, and the orthographic projection of the second signal line on the substrate covers the orthographic projection of the second connection portion on the substrate. The third connection portion extends along the first direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the second signal line, the first signal line and the signal detection line on the substrate. The third connection portion is connected to the first signal line and the signal detection line.

[0194] In an exemplary embodiment, Figure 3 As shown, the second pad connection line 22 can be a straight line and extends along the first direction. The orthographic projection of the second pad connection line 22 on the substrate partially overlaps with the orthographic projections of the first signal line 32 and the fourth signal line 34 on the substrate. The second pad connection line 22 is connected to the first input terminal Di and the fourth signal line 34, respectively.

[0195] In an exemplary embodiment, Figure 4 As shown, the second pad connection line 22 may include a first connection portion and a second connection portion. The first connection portion extends along the second direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the second signal line and the first signal line on the substrate. The first connection portion is connected to the first input terminal Di and the second connection portion. The second connection portion extends along the first direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the first signal line and the fourth signal line on the substrate. The second connection portion is connected to the fourth signal line.

[0196] In an exemplary embodiment, Figure 3 As shown, the third pad connection line 23 can be a straight line and extends along the first direction. The orthographic projection of the third pad connection line 23 on the substrate partially overlaps with the orthographic projections of the first signal line 32, the fourth signal line 34, and the fifth signal line 35 on the substrate. The third pad connection line 23 is connected to the second input terminal Pwr and the fifth signal line 35, respectively.

[0197] In an exemplary embodiment, Figure 3As shown, the third pad connection line 23 may include a first connection portion, a second connection portion, and a third connection portion. The first connection portion extends along the second direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the first connection portion on the substrate. The first connection portion is connected to the second input terminal and the second connection portion. The second connection portion extends along the first direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the second connection portion on the substrate. The second connection portion is connected to the third connection portion. The third connection portion extends along the second direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the first signal line, the fourth signal line, and the fifth signal line on the substrate. The third connection portion is connected to the fifth signal line.

[0198] In an exemplary embodiment, Figure 3 As shown, the orthographic projection of the fourth pad connection line on the substrate partially overlaps with the orthographic projections of the first signal line and the third signal line on the substrate. The fourth pad connection line may include: a first connection portion, a second connection portion, and a third connection portion. The first connection portion extends along the second direction, and the orthographic projection of the first signal line on the substrate covers the orthographic projection of the first connection portion on the substrate. The first connection portion is connected to the second connection portion of the fifth connection line and the second connection portion of the fourth pad connection line, respectively. The second connection portion extends along the first direction. And the orthographic projection of the first signal line on the substrate covers the orthographic projection of the second connection portion on the substrate. The second connection portion is connected to the third connection portion. The third connection portion extends along the second direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the first signal line and the third signal line on the substrate. The third connection portion is connected to the third signal line.

[0199] In an exemplary embodiment, Figure 4 As shown, the fourth pad connection line may include: a first connection portion, a second connection portion, a third connection portion, and a fourth connection portion. The first connection portion extends along the second direction, and the orthographic projection of the first signal line on the substrate overlaps the orthographic projection of the first connection portion on the substrate. The first connection portion is connected to the second connection portion of the fifth connection line and the second connection portion of the fourth pad connection line, respectively. The second connection portion extends along the first direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the first signal line and the second signal line on the substrate. The second connection portion is connected to the third connection portion. The third connection portion extends along the second direction, and the orthographic projection of the second signal line on the substrate overlaps with the orthographic projection of the third connection portion on the substrate. The third connection portion is connected to the fourth connection portion. The fourth connection portion extends along the first direction, and its orthographic projection on the substrate partially overlaps with the orthographic projections of the second signal line, the first signal line, the third signal line, and the signal detection line on the substrate. The fourth connection portion is connected to the third signal line.

[0200] In an exemplary embodiment, the shape of the first connecting line depends on the positional relationship of the four light-emitting elements in the light-emitting unit.

[0201] In an exemplary embodiment, the shape of the first pad connection line is determined according to the layout of the signal of the light emitting unit and the connection between the first pad connection line and the signal detection line in the light emitting unit.

[0202] In an exemplary embodiment, the shape of the second pad connection line is determined according to the layout of the signal of the light emitting unit and the connection between the first pad connection line and the signal detection line in the light emitting unit.

[0203] In an exemplary embodiment, the shape of the third pad connection line is determined according to the layout of the signal of the light emitting unit and the connection between the first pad connection line and the signal detection line in the light emitting unit.

[0204] In an exemplary embodiment, the shape of the fourth pad connection line is determined according to the layout of the signal of the light emitting unit and the connection between the first pad connection line and the signal detection line in the light emitting unit.

[0205] like Figure 4 As shown, in an exemplary embodiment, when the signal detection line 11 is electrically connected to the first pad connection line 21 of the last row of light-emitting units, the angle between the extension direction of the signal detection line 11 and the first direction is greater than or equal to 90 degrees and less than 180 degrees.

[0206] In an exemplary embodiment, the driving backplane may include a plurality of light-emitting unit groups, each of which includes a plurality of light-emitting units. In each light-emitting unit group, the first input terminal Di of the pad 30 in one light-emitting unit is connected to the fourth signal line 34 through a connecting line, and the first input terminal Di of other light-emitting units receives the relay signal output by the output terminal Out of the light-emitting unit in the same column of the previous row as the first input signal. In this way, for a light-emitting unit group, only one first signal (address signal) needs to be provided through one connecting line, so that all light-emitting units in the light-emitting unit group can obtain their respective address signals, which greatly reduces the number of signal lines, saves wiring space, and simplifies the control method.

[0207] In an exemplary embodiment, a light-emitting unit may employ a two-period driving scheme. During a first period, the light-emitting unit may output a relay signal via output terminal Out based on a first signal received at a first input terminal Di and a second signal received at a second input terminal Pwr. During a second period, the light-emitting unit may provide a drive signal to a plurality of light-emitting diodes connected in series via output terminal Out. For example, during the first period, output terminal Out outputs a relay signal, which is provided to other light-emitting units so that they receive an address signal. During the second period, output terminal Out outputs a drive signal, which is provided to the plurality of light-emitting diodes connected in series so that the light-emitting diodes emit light during the second period. In an exemplary embodiment, the first and second periods are different periods, and the first period may precede the second period. For example, the first period may be continuous with the second period, with the end of the first period coinciding with the start of the second period. Alternatively, there may be another period between the first and second periods. This additional period may be used to implement other desired functions, or it may simply be used to separate the first and second periods to prevent interference between the signals at output terminal Out in the first and second periods.

[0208] In an exemplary embodiment, the number and arrangement of the light-emitting unit groups on the driving backplane, the number and arrangement of multiple light-emitting units in the light-emitting unit group, the number and arrangement of multiple light-emitting diodes in the light-emitting unit, etc. can be set according to actual conditions, and the present disclosure does not limit them here.

[0209] The following is an illustrative explanation of the manufacturing process of the driving backplane. The "patterning process" mentioned in the present disclosure includes processes such as coating photoresist, mask exposure, development, etching, and stripping photoresist for metal materials, inorganic materials or transparent conductive materials, and includes processes such as coating organic materials, mask exposure and development for organic materials. Deposition can be carried out by any one or more of sputtering, evaporation, and chemical vapor deposition, coating can be carried out by any one or more of spraying, spin coating and inkjet printing, and etching can be carried out by any one or more of dry etching and wet etching, and the present disclosure does not limit this. "Thin film" refers to a thin film made by deposition, coating or other processes on a substrate of a certain material. If the "thin film" does not require a patterning process during the entire manufacturing process, the "thin film" can also be called a "layer". If the "thin film" requires a patterning process during the entire manufacturing process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern". The phrase "A and B are arranged in the same layer" in this disclosure means that A and B are formed simultaneously through the same patterning process, and the "thickness" of the film layer refers to the dimension of the film layer in a direction perpendicular to the driver backplane. In exemplary embodiments of this disclosure, "the orthographic projection of A includes the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary of the orthographic projection of A, or that the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0210] In an exemplary embodiment, the manufacturing process of the driving backplane may include the following operations.

[0211] (1) Forming a first conductive layer pattern. Forming the first conductive layer may include: sequentially depositing a first insulating film and a first metal film on a substrate, patterning the first metal film through a patterning process to form a first insulating layer disposed on the substrate 10, and a first conductive layer pattern disposed on the first insulating layer, wherein the first conductive layer pattern includes at least a second signal line 31, a first signal line 32, a third signal line 33, a fourth signal line 34, and a fifth signal line 35, as shown in FIG. Figure 6 and Figure 10 As shown, Figure 10 is a schematic diagram after forming the first conductive layer, Figure 6 The following example is taken as an example where two light-emitting units are not connected to the signal detection line. Figure 10 The description is made by taking an example in which one light emitting unit is not connected to the signal detection line and the other light emitting unit is connected to the signal detection line.

[0212] In an exemplary embodiment, Figure 6 As shown, when the two light emitting units are not connected to the signal detection line, the second signal line 31 , the first signal line 32 , the third signal line 33 , the fourth signal line 34 and the fifth signal line 35 extend along the first direction.

[0213] In an exemplary embodiment, the first insulating film may be deposited by chemical vapor deposition (CVD), and the first metal film may be deposited by magnetron sputtering.

[0214] In an exemplary embodiment, the first conductive layer may be a multi-layer composite structure, including a stacked first sublayer (bottom layer close to the substrate side), a second bottom layer (middle layer) and a third sublayer (top layer away from the substrate side). The first sublayer may be made of a molybdenum-niobium alloy MoNb to improve adhesion, the second sublayer may be made of copper Cu to reduce resistance, and the third sublayer may be made of MoNb to prevent oxidation, forming a stacked structure of MoNb / Cu / MoNb.

[0215] In an exemplary embodiment, this process can also be implemented as follows: a first insulating film is first deposited on a substrate to form a first insulating layer disposed on the substrate. A first sublayer serving as a seed layer is then formed on the first insulating layer to increase grain nucleation density. A second sublayer is then electroplated on the first sublayer via an electroplating process, and a third sublayer serving as an oxidation protection layer is then formed on the second sublayer. The first sublayer can be made of MoNiTi, the second sublayer can be made of copper (Cu), and the third sublayer can be made of MoNiTi.

[0216] In an exemplary embodiment, the process of forming the first conductive layer may use a negative photoresist.

[0217] (2) Forming a second insulating layer pattern. Forming the second insulating layer pattern may include: first depositing a second insulating film on the substrate on which the aforementioned pattern is formed to form a second insulating layer pattern covering the first conductive layer pattern, forming a second insulating layer, and patterning the second insulating layer 72 through a patterning process to form a plurality of via patterns, wherein the plurality of vias may include at least: a first via V1, a second via V2, a third via V3, a fourth via V4, a fifth via V5, and a sixth via V6, as shown in FIG. Figure 11 and Figure 12 As shown, Figure 11 Schematic diagram after forming the third insulating layer Figure 1 , Figure 12 Schematic diagram after forming the third insulating layer Figure 2 . Figure 11 The following example is taken as an example where two light-emitting units are not connected to the signal detection line. Figure 12 The description is made by taking an example in which one light emitting unit is not connected to the signal detection line and the other light emitting unit is connected to the signal detection line.

[0218] In an exemplary embodiment, the first via V1 exposes the first signal line 32, the second via V2 exposes the signal detection line 11, the third via V3 exposes the second signal line 31, the fourth via V4 exposes the fourth signal line 34, the fifth via V5 exposes the fifth signal line 35, and the sixth via V6 exposes the third signal line 33.

[0219] (3) Forming a second conductive layer pattern. In an exemplary embodiment, forming the second conductive layer pattern may include: depositing a second metal film on the substrate on which the aforementioned pattern is formed, patterning the second metal film through a patterning process, and forming a second conductive layer pattern on the second insulating layer, wherein the second conductive layer pattern includes at least: a first connecting line 51, a second connecting line 52, a third connecting line 53, a fourth connecting line 54, a fifth connecting line 55, a first pad connecting line 21, a second pad connecting line 22, a third pad connecting line 23, and a fourth pad connecting line 24, as shown in FIG. Figure 13 and Figure 14 As shown, Figure 13 Schematic diagram after forming the second conductive layer Figure 1 , Figure 14 Schematic diagram after forming the second conductive layer Figure 2 . Figure 13 The following example is taken as an example where two light-emitting units are not connected to the signal detection line. Figure 14 The description is made by taking an example in which one light emitting unit is not connected to the signal detection line and the other light emitting unit is connected to the signal detection line.

[0220] In an exemplary embodiment, for one column of light-emitting units, the first connecting line in the light-emitting unit is electrically connected to the second signal line in the light-emitting unit through a third via, the first solder pad connecting line in the light-emitting unit is electrically connected to the first signal line in the light-emitting unit through a second via, the second solder pad connecting line in the light-emitting unit is electrically connected to the fourth signal line in the light-emitting unit through a fourth via, the third solder pad connecting line in the light-emitting unit is electrically connected to the fifth signal line in the light-emitting unit through a fifth via, the fourth solder pad connecting line in the light-emitting unit is electrically connected to the third signal line in the light-emitting unit through a sixth via, and the fifth connecting line in the light-emitting unit is electrically connected to the third signal line in the light-emitting unit through a sixth via.

[0221] In an exemplary embodiment, the first connecting line in another column of light-emitting units is electrically connected to the second signal line in the light-emitting unit through a third via, the first pad connecting line in the light-emitting unit is electrically connected to the first signal line in the light-emitting unit through a second via, the second pad connecting line in the light-emitting unit is electrically connected to the fourth signal line in the light-emitting unit through a fourth via, the third pad connecting line in the light-emitting unit is electrically connected to the fifth signal line in the light-emitting unit through a fifth via, the fourth pad connecting line in the light-emitting unit is electrically connected to the third signal line in the light-emitting unit through a sixth via, and the first pad connecting line to which the signal detection line is connected is electrically connected to the signal detection line through the first via.

[0222] (4) Forming a third insulating layer pattern. Forming the third insulating layer pattern may include: depositing a third insulating film on the substrate on which the aforementioned pattern is formed, patterning the third insulating film through a patterning process, and forming the third insulating layer pattern on the second conductive layer.

[0223] At this point, the manufacturing process of the exemplary embodiment of the present disclosure is complete. The driving backplane includes a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, and a third insulating layer stacked on a substrate. The first conductive layer includes signal detection lines, first signal lines, second signal lines, third signal lines, fourth signal lines, and fifth signal lines; the second conductive layer includes first connecting lines, second connecting lines, third connecting lines, fourth connecting lines, fifth connecting lines, first pad connecting lines, second pad connecting lines, third pad connecting lines, and fourth pad connecting lines.

[0224] An embodiment of the present disclosure further provides a display device, comprising: a driving backplane provided by any one of the aforementioned embodiments.

[0225] In an exemplary embodiment, the display device may be a monitor, a television, a mobile phone, a tablet computer, a navigator, a digital photo frame, a wearable display product, or any product or component with a display function.

[0226] The present disclosure also provides a method for manufacturing a driver backplane, which is used to manufacture the driver backplane of the aforementioned exemplary embodiment. The method for manufacturing a driver backplane provided by the present disclosure may include:

[0227] Step S1: providing a substrate.

[0228] In an exemplary embodiment, the substrate includes a light-emitting area and a binding area. The light-emitting area includes light-emitting units arranged in an array. Each light-emitting unit includes a first signal line and a pad electrically connected to the first signal line.

[0229] In an exemplary embodiment, the substrate may be a rigid substrate or a flexible substrate, wherein the rigid substrate may be, but is not limited to, one or more of glass, metal foil, and polychlorinated biphenyls; the flexible substrate may be, but is not limited to, one or more of polyethylene terephthalate, polyethylene terephthalate, polyetheretherketone, polystyrene, polycarbonate, polyarylate, polyarylate, polyimide, polyvinyl chloride, polyethylene, and textile fiber.

[0230] Step S2: forming a first conductive layer on the substrate.

[0231] In an exemplary embodiment, the first conductive layer includes: a first signal line and at least one signal detection line.

[0232] Step S3: forming a second conductive layer on a side of the first conductive layer away from the substrate.

[0233] In an exemplary embodiment, the second conductive layer includes: a first pad connection line; and a signal detection line electrically connected to the pad of the light emitting unit.

[0234] In an exemplary embodiment, step S2 may include:

[0235] forming a first insulating layer on the substrate;

[0236] A first conductive layer is formed on the first insulating layer.

[0237] In an exemplary embodiment, the first conductive layer may further include a second signal line, a third signal line, a fourth signal line, and a fifth signal line.

[0238] In an exemplary embodiment, step S3 may include:

[0239] forming a second insulating layer on the first conductive layer;

[0240] A second conductive layer is formed on the third insulating layer.

[0241] In an exemplary embodiment, the second conductive layer may further include a first connecting line, a second connecting line, a third connecting line, a fourth connecting line, and a fifth connecting line.

[0242] In an exemplary embodiment, after step S3, the method for manufacturing the driving backplane may include:

[0243] A third insulating layer is formed on the second conductive layer.

[0244] The specific content of the manufacturing method of the driver backplane disclosed in the present invention has been described in detail in the aforementioned driver backplane manufacturing process and will not be repeated here.

[0245] Although the embodiments disclosed in this disclosure are as described above, the contents described are merely embodiments adopted to facilitate understanding of the disclosure and are not intended to limit the present invention. Any person skilled in the art may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope of the disclosure. However, the scope of patent protection of the present invention shall still be based on the scope defined by the appended claims.

Claims

1. A driving backplane, comprising: substrate; The substrate includes: a light-emitting area and a binding area, the light-emitting area is divided into at least one light-emitting sub-area, the light-emitting area includes: light-emitting units arranged in an array, each light-emitting unit includes: a first signal line and a pad electrically connected to the first signal line; a first insulating layer disposed between the substrate and the first conductive layer; A first conductive layer is provided on one side of the substrate, comprising: a first signal line and at least one signal detection line; the signal detection line detects a voltage drop of a signal of the first signal line to adjust the signal of the driving backplane according to the voltage drop of the first signal line; a second insulating layer disposed between the first conductive layer and the second conductive layer, wherein a first via hole and a second via hole are disposed on the second insulating layer, wherein the first via hole exposes the first signal line, and the second via hole exposes the signal detection line; A second conductive layer is provided on a side of the first conductive layer away from the substrate, comprising: a pad; the signal detection line is electrically connected to the pad of the light-emitting unit, the pad of the light-emitting unit is electrically connected to the first signal line through a first via hole, and is electrically connected to the signal detection line through a second via hole; a third insulating layer, disposed on a side of the second conductive layer away from the substrate; The driving backplane further comprises: a binding terminal provided on the substrate and located in the binding area, and a flexible circuit board electrically connected to the binding terminal, wherein the pad of the light-emitting unit is electrically connected to the binding terminal via a signal detection line; At least one signal detection line is electrically connected to a pad of at least one light-emitting unit in each light-emitting sub-region, wherein one signal detection line of the at least one signal detection line is electrically connected to a pad of one light-emitting unit in each light-emitting sub-region.

2. The driving backplane according to claim 1, wherein: One of the at least one signal detection line is electrically connected to the pad of the light-emitting unit located in the last row and kth column in each light-emitting sub-region; 1≤i≤m, m is the total number of columns of light-emitting units in the light-emitting sub-region.

3. The driving backplane according to claim 1, wherein: The driving backplane includes: at least two driving sub-backplanes; Each driving sub-backplane includes at least one light-emitting sub-region.

4. The driving backplane according to claim 1, wherein: For each light-emitting unit, the orthographic projection of the pad on the substrate partially overlaps with the orthographic projection of the first signal line on the substrate; The orthographic projection of the signal detection line on the substrate partially overlaps with the orthographic projection of the pad on the substrate.

5. The driving backplane according to claim 3, wherein: The first signal line extends along a first direction, and the light-emitting unit further includes: a second signal line, a third signal line, a fourth signal line, and a fifth signal line extending along the first direction; the first signal line and the second signal line are arranged along a second direction, and the third signal line and the fourth signal line are arranged along the first direction, and the first direction and the second direction intersect; the first conductive layer further includes: a second signal line, a third signal line, a fourth signal line, and a fifth signal line; The second signal line is located on one side of the first signal line, the third signal line and the fourth signal line are located on a side of the first signal line away from the second signal line, and the fifth signal line is located on a side of the third signal line away from the first signal line; The signal detection line is provided between the third signal line and the first signal line in the light emitting unit where the pad to which the signal detection line is connected is located.

6. The driving backplane according to claim 5, wherein: The first signal lines of the light emitting units in the same column are the same signal line.

7. The driving backplane according to claim 5, wherein: The light-emitting unit further includes: a first die-bonding region, a second die-bonding region, a third die-bonding region, a fourth die-bonding region, a first connecting line, a second connecting line, a third connecting line, a fourth connecting line, and a fifth connecting line; the pads include: a first pad connecting line, a second pad connecting line, a third pad connecting line, a fourth pad connecting line, a first input terminal, a second input terminal, an output terminal, and a common voltage terminal; each die-bonding region includes: a first terminal and a second terminal spaced apart from each other, the first terminal and the second terminal being configured to connect two electrodes of the same light-emitting element; The second conductive layer further includes: a first connecting line, a second connecting line, a third connecting line, a fourth connecting line and a fifth connecting line; The first end of the first connecting wire is electrically connected to the second signal wire, the second end of the first connecting wire extends to the first die-bonding region and forms a first terminal in the first die-bonding region; the first end of the second connecting wire extends to the first die-bonding region and forms a second terminal in the first die-bonding region, the second end of the second connecting wire extends to the second die-bonding region and forms a first terminal in the second die-bonding region; the first end of the third connecting wire extends to the second die-bonding region and forms a second terminal in the second die-bonding region, the second end of the third connecting wire extends to the third die-bonding region and forms a first terminal in the third die-bonding region; the first end of the fourth connecting wire extends to the third die-bonding region and forms a second terminal in the third die-bonding region, the second end of the fourth connecting wire extends to the fourth die-bonding region and forms a first terminal in the fourth die-bonding region; the first end of the fifth connecting wire extends to the fourth die-bonding region and forms a first terminal in the fourth die-bonding region, and the second end of the fifth connecting wire is electrically connected to the third signal wire; The first pad connection line and the second pad connection line are arranged along the second direction, the second pad connection line and the third pad connection line are arranged along the first direction, the third pad connection line and the fourth pad connection line are arranged along the second direction, and the fourth pad connection line and the first pad connection line are arranged along the first direction; the first pad connection line is located on a side of the second pad connection line close to the fifth signal line; The first pad connection line is electrically connected to the common voltage terminal and the first signal line respectively, the second pad connection line is electrically connected to the first input terminal and the fourth signal line respectively, the third pad connection line is electrically connected to the second input terminal and the fifth signal line respectively, and the fourth pad connection line is electrically connected to the output terminal and the third signal line respectively; The fifth connection line and the fourth pad connection line are provided separately, or the fifth connection line and the fourth pad connection line are the same signal line.

8. The driving backplane according to claim 7, wherein: The second insulating layer is further provided with third to sixth via holes; The third via hole exposes the second signal line, the fourth via hole exposes the fourth signal line, the fifth via hole exposes the fifth signal line, and the sixth via hole exposes the third signal line; For each light-emitting unit, the first connecting line is electrically connected to the second signal line through the third via, the first pad connecting line is electrically connected to the first signal line through the first via, and is electrically connected to the signal detection line through the second via, the second pad connecting line is electrically connected to the fourth signal line through the fourth via, the third pad connecting line is electrically connected to the fifth signal line through the fifth via, and the fourth pad connecting line and the fifth connecting line are electrically connected to the third signal line through the sixth via.

9. The driving backplane according to claim 5, wherein: The width of the first signal line is greater than the width of the second signal line; The width of the second signal line is greater than the width of the fifth signal line; The width of the fifth signal line is greater than the width of the third signal line; The width of the fifth signal line is greater than the width of the fourth signal line; The width of the signal detection line is smaller than the width of the fifth signal line; The width of the signal detection line is approximately 0.5 mm to 1.5 mm.

10. A display device comprising: A drive backplane according to any one of claims 1 to 9.

11. A method for manufacturing a driver backplane, configured to manufacture the driver backplane according to any one of claims 1 to 9, the method comprising: A substrate is provided, the substrate comprising: a light-emitting area and a binding area, the light-emitting area comprising: light-emitting units arranged in an array, each light-emitting unit comprising: a first signal line and a pad electrically connected to the first signal line; A first conductive layer is formed on the substrate; the first conductive layer includes: a first signal line and at least one signal detection line; A second conductive layer is formed on a side of the first conductive layer away from the substrate; the second conductive layer includes a pad; and the signal detection line is electrically connected to the pad of the light emitting unit.

12. The method according to claim 11, wherein The forming of a first conductive layer on the substrate comprises: forming a first insulating layer on the substrate; forming a first conductive layer on the first insulating layer, wherein the first conductive layer further comprises: a second signal line, a third signal line, a fourth signal line, and a fifth signal line; forming a second conductive layer on a side of the first conductive layer away from the substrate; forming a second insulating layer on the first conductive layer; forming a second conductive layer on the second insulating layer, wherein the second conductive layer further comprises: a first connecting line, a second connecting line, a third connecting line, a fourth connecting line, and a fifth connecting line; After forming the second conductive layer on a side of the first conductive layer away from the substrate, the method further includes: A third insulating layer is formed on the second conductive layer.

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