System-in-package module and design method thereof

Abstract

This application discloses a system-in-package (SiP) module and its design method, belonging to the field of semiconductor packaging technology. The SiP module includes: a substrate, an analog front-end circuit, and external solder joints. The analog front-end circuit is disposed on the substrate and is used to receive and amplify externally input human body signals. The external solder joints are disposed on the substrate and connected to the analog front-end circuit. The external solder joints are used to output the amplified signal generated by the analog front-end circuit to an external circuit for processing before inputting it back to the analog front-end circuit. By encapsulating the analog front-end circuit in the SiP module, this application avoids the performance differences caused by the need to change the layout and wiring of the analog front-end circuit each time the circuit design is based on different products, as is common in the prior art. This improves the integration and consistency of the analog circuit and reduces signal quality differences.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to system-in-package modules and their design methods. Background Technology

[0002] Human bioelectric signals are weak signals with very low amplitude and distributed in different frequency ranges. Therefore, when acquiring signals, it is necessary to amplify different types of signals to different degrees and set bandpass filters for effective signals in the signal frequency range.

[0003] Currently, in order to acquire weak signals, it is necessary to build an analog front-end circuit using instrumentation amplifiers and power amplifiers. In order to adapt to different needs, many peripheral circuits also need to be built around the analog front-end circuit to form a front-end analog signal acquisition and amplification module.

[0004] However, due to the different designs of different products, existing technologies require a large layout area to be reserved when designing circuits. Furthermore, since the instrumentation amplifiers and power amplifiers in the analog front-end circuits vary with each layout and routing, the performance indicators of the analog front-end circuits of different products will also differ, resulting in significant differences in signal quality. Summary of the Invention

[0005] The main objective of this application is to provide a system-in-package module and its design method, which aims to reduce the layout area of ​​analog circuits, improve the integration and consistency of analog circuits, and reduce signal quality differences.

[0006] To achieve the above objectives, this application provides a system-in-package module, characterized in that the system-in-package module includes: a substrate, an analog front-end circuit, and external solder joints;

[0007] The analog front-end circuit is laid on the substrate and is used to receive externally input human body signals and amplify the human body signals.

[0008] The external solder joint is disposed on the substrate and is connected to the analog front-end circuit. The external solder joint is used to output the amplified signal generated by the analog front-end circuit to an external circuit for processing before inputting it back to the analog front-end circuit.

[0009] Optionally, the external solder joints include: analog signal solder joints and digital signal solder joints;

[0010] The analog signal solder joint is connected to the analog front-end circuit, and the analog signal solder joint is used to connect to an external analog circuit.

[0011] The digital signal solder joint is connected to the analog front-end circuit, and the digital signal solder joint is used to connect to external digital circuits;

[0012] The analog signal solder joints and the digital signal solder joints are located on different sides of the substrate to avoid signal interference between the external analog circuit and the external digital circuit.

[0013] Optionally, the analog signal solder joints include: input solder joints, filter solder joints, amplification solder joints, and output solder joints; the external analog circuit includes a human body signal input module, an external filter module, a multiplier adjustment module, and a human body signal output module.

[0014] The input solder joint is used to connect to the human body signal input module;

[0015] The filter solder joints are used to connect the external filter module;

[0016] The magnified solder joint is used to connect the magnification adjustment module;

[0017] The output solder joints are used to connect to the human body signal output module.

[0018] Optionally, the analog front-end circuit includes: an instrumentation amplifier and an operational amplifier;

[0019] The instrumentation amplifier is connected to the input solder joint and the filter solder joint. The instrumentation amplifier is used to receive human signals from the human signal input module through the input solder joint, amplify the human signal once to obtain an amplified signal, and output the amplified signal to the external filter module through the filter solder joint.

[0020] The operational amplifier is connected to the filter solder joint, the amplification solder joint, and the output solder joint. The operational amplifier is used to receive the filtered signal generated by the external filtering module based on the primary amplified signal through the filter solder joint, amplify the filtered signal a second time to obtain a secondary amplified signal, and output the secondary amplified signal to the human body signal output module through the output solder joint.

[0021] Optionally, the instrumentation amplifier and the operational amplifier are mounted on a single substrate, and the system-in-package module further includes:

[0022] A shielding cover is connected to the substrate, and the internal space formed by the shielding cover and the substrate includes the analog front-end circuit. The shielding cover is used to isolate the analog front-end circuit from signal interference between it and the external environment.

[0023] Optionally, the instrumentation amplifier and the operational amplifier are mounted on two substrates, and the system-in-package module further includes:

[0024] A support plate, wherein the support plate is disposed between two substrates;

[0025] A shielding cover is connected to a substrate. The internal space formed by the shielding cover and the substrate includes another substrate, the analog front-end circuit, and the support plate. The shielding cover is used to isolate the analog front-end circuit from signal interference from the external environment.

[0026] The external solder joints are located on the substrate connected to the shield.

[0027] Furthermore, to achieve the above objectives, this application also provides a design method for a system-in-package (SIP) module, which is applied to the SIP module described above. The design method includes:

[0028] Integrate the instrumentation amplifier and power amplifier into an analog front-end circuit;

[0029] The layout of the analog front-end circuit is designed to obtain the design results;

[0030] Based on the design results, the analog front-end circuit is packaged into a system-in-package module.

[0031] Optionally, the step of packaging the analog front-end circuit into a system-in-package module based on the design results includes:

[0032] The analog front-end circuit is laid on the substrate;

[0033] External solder joints are provided on different sides of the substrate;

[0034] Connect the analog front-end circuit to the external solder joint;

[0035] A shielding cover is added to the surface of the substrate on which the analog front-end circuit has been laid;

[0036] The shield is filled with adhesive to complete the encapsulation.

[0037] Optionally, the design results include: tiling design results;

[0038] The step of designing the layout of the analog front-end circuit to obtain the design result includes:

[0039] The instrumentation amplifier and the power amplifier are deployed on the same substrate, and external solder joints are set on different sides of the substrate. The instrumentation amplifier and the power amplifier are connected to the external solder joints to obtain the tiled design result.

[0040] Optionally, the design results include: stack-type design results;

[0041] The step of designing the layout of the analog front-end circuit to obtain the design result further includes:

[0042] The instrumentation amplifier is deployed on a first substrate. A support plate is added to one side of the first substrate where the instrumentation amplifier is deployed. A second substrate is added to the support plate. A power amplifier is deployed on the second substrate. External solder joints are set on different sides of the first substrate. The instrumentation amplifier and the power amplifier are connected to the external solder joints to obtain the stacked design result.

[0043] This application proposes a system-in-package (SiP) module and its design method. The SiP module includes a substrate, an analog front-end circuit, and external solder joints. The analog front-end circuit is disposed on the substrate and is used to receive and amplify externally input human body signals. The external solder joints are disposed on the substrate and connected to the analog front-end circuit. The external solder joints are used to output the amplified signal generated by the analog front-end circuit to an external circuit for processing before inputting it back to the analog front-end circuit. By encapsulating the analog front-end circuit in the SiP module, this application fixes the layout and wiring of the analog front-end circuit, thereby stabilizing its performance. When processing different types of human body signals, only the external circuit connected to the SiP module needs to be adjusted to adapt to different usage scenarios. This avoids the performance differences caused by changing the layout and wiring of the analog front-end circuit each time it is designed for different products, as is the case in the prior art. This improves the integration and consistency of the analog circuit and reduces signal quality differences. This system-in-package module has a high degree of integration, highly integrating the various amplifier circuits and their peripheral devices in the analog front-end circuit; the system-in-package module has good consistency, and the internal routing of the analog front-end circuit is optimized, which can effectively isolate noise and signal interference between different types of signals. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only a part of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of the structure of a system-in-package module provided in one embodiment of this application;

[0046] Figure 2This application provides a schematic diagram illustrating an application scenario where a system-in-package module is connected to an external circuit, according to an embodiment of this application.

[0047] Figure 3 A schematic diagram of a tiled layout of a system-in-package module provided in one embodiment of this application;

[0048] Figure 4 A schematic diagram of a stacked layout of a system-in-package module provided in one embodiment of this application;

[0049] Figure 5 This is a flowchart illustrating a design method for a system-in-package module according to an embodiment of this application. Detailed Implementation

[0050] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that the embodiments of this application can also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the embodiments of this application with unnecessary detail.

[0051] It should be noted that although a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than that shown in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0052] It should also be understood that references to "one embodiment" or "some embodiments" in the specification of embodiments of this application mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0053] Human bioelectric signals are weak signals with very low amplitude and distributed in different frequency ranges. Therefore, when acquiring signals, it is necessary to amplify different types of signals to different degrees and set bandpass filters for effective signals in the signal frequency range.

[0054] Currently, in order to acquire weak signals, it is necessary to build an analog front-end circuit using instrumentation amplifiers and power amplifiers. In order to adapt to different needs, many peripheral circuits also need to be built around the analog front-end circuit to form a front-end analog signal acquisition and amplification module.

[0055] However, due to the different designs of different products, existing technologies require a large layout area to be reserved when designing circuits. Furthermore, since the instrumentation amplifiers and power amplifiers in the analog front-end circuits vary with each layout and routing, the performance indicators of the analog front-end circuits of different products will also differ, resulting in significant differences in signal quality.

[0056] Based on this, this application provides a system-in-package (SiP) module and its design method. The SiP module includes a substrate, an analog front-end circuit, and external solder joints. The analog front-end circuit is disposed on the substrate and is used to receive externally input human body signals and amplify them. The external solder joints are disposed on the substrate and connected to the analog front-end circuit. The external solder joints are used to output the amplified signal generated by the analog front-end circuit to an external circuit for processing before inputting it back to the analog front-end circuit. By encapsulating the analog front-end circuit in the SiP module, this application fixes the layout and wiring of the analog front-end circuit, thereby stabilizing its performance indicators. When processing different types of human body signals, only the external circuit connected to the SiP module needs to be adjusted to adapt to different usage scenarios. This avoids the performance differences caused by changing the layout and wiring of the analog front-end circuit each time a different product is designed, as is the case in the prior art. This improves the integration and consistency of the analog circuit and reduces signal quality differences. This system-in-package module has a high degree of integration, highly integrating the various amplifier circuits and their peripheral devices in the analog front-end circuit; the system-in-package module has good consistency, and the internal routing of the analog front-end circuit is optimized, which can effectively isolate noise and signal interference between different types of signals.

[0057] The system-in-package module and its design method provided in this application are specifically illustrated through the following embodiments. First, the system-in-package module in this application is described.

[0058] This application provides a system-level packaging module, referring to... Figure 1 , Figure 1 This is a schematic diagram of the structure of a system-in-package module provided in one embodiment of this application, as shown below. Figure 1 As shown, the system-in-package module provided in this embodiment includes: a substrate 10, an analog front-end circuit 20, and external solder joints 30;

[0059] The analog front-end circuit 20 is laid on the substrate 10. The analog front-end circuit 20 is used to receive externally input human body signals and amplify the human body signals.

[0060] The external solder joint 30 is disposed on the substrate 10 and is connected to the analog front-end circuit 20. The external solder joint 30 is used to output the amplified signal generated by the analog front-end circuit 20 to an external circuit for processing and then input it back to the analog front-end circuit 20.

[0061] It should be noted that the system-in-package module provided in this embodiment is used to connect with external circuits to realize human body signal acquisition in different usage scenarios. The human body signal input into the system-in-package module is amplified once by the analog front-end circuit 20 and then output to the external circuit through the external solder joint 30 for processing before being sent back to the analog front-end circuit 20 for secondary amplification. Different usage scenarios can be adapted simply by adjusting the external circuit connected to the system-in-package module. This avoids the performance index differences caused by the need to change the layout and wiring of the analog front-end circuit each time a different product is designed, which is a problem in the prior art. It improves the integration and consistency of the analog circuit and reduces the difference in signal quality.

[0062] In this embodiment, the connection method between the system-in-package module and the external circuit can be combined. Figure 2 To understand, by Figure 2 It is understood that the external circuit connected to the SIP (System In Package) module includes a human signal input module 100, an external adjustment module 200, a human signal output module 300, a power supply module 400, and a logic control module 500. The analog front-end circuit 20 is packaged in the SIP module and is connected to the human signal input module 100, the external adjustment module 200, the human signal output module 300, the power supply module 400, and the logic control module 500 respectively through the external solder points 30 of the SIP module. In each external circuit, the human signal input module 100 is used to collect human signals; the external adjustment module 200 is used to filter the first-stage amplified signal of the analog front-end circuit 20 and adjust the second-stage amplification factor of the analog front-end circuit 20; the human signal output module 300 is used to output the second-stage amplified signal from the analog front-end circuit 20; the power supply module 400 is used to supply power to the SIP module; and the logic control module 500 is used to adjust the input and output logic of the SIP module.

[0063] It should be noted that in this embodiment, considering the very weak human biosignals, a high common-mode rejection ratio (CMRR) amplification is required in the first stage through the instrumentation amplifier circuit in the analog front-end circuit 20. To improve performance consistency, this instrumentation amplifier circuit can be fully integrated into the SIP module. Depending on the characteristics of different human biosignals, a filtering circuit is needed to perform high-pass, low-pass, or band-pass filtering on the amplified signal. Therefore, this filtering circuit can be placed outside the SIP module for easy configuration by the user. After filtering, a second-stage high-gain amplification is required through the operational amplifier circuit in the analog front-end circuit 20 to adapt to the subsequent ADC (analog to analog signal processing) amplification. The input is a digital converter (analog-to-digital converter), while the gain adjustment module can change the amplification factor of the operational amplifier circuit. Therefore, the operational amplifier circuit can be fully integrated inside the SIP module, while the gain adjustment module can be placed outside the SIP module for easy configuration by the user as needed. Thus, it is only necessary to encapsulate the instrumentation amplifier circuit and the operational amplifier circuit inside the SIP module to form the analog front-end circuit 20, and reserve an interface, i.e., external solder joint 30, on the SIP module for connecting the analog front-end circuit 20 to the external circuit. This allows the SIP module with stable performance indicators to adapt to different application scenarios.

[0064] For example, by adjusting parameters through the external adjustment module 200, the system-in-package module can be adapted to different human biosignal acquisition scenarios, such as EMG (electromyography) signals, ECG (electrocardiography) signals, and EEG (electroencephalography) signals. Since different forms of biosignals have different main frequency bandwidth ranges, such as EMG from 20 to 500 Hz and EEG from 0 to 50 Hz, the bandpass external filter module 201 is placed outside the SIP to allow users to configure it freely according to their application scenarios. Similarly, since different forms of biosignals have different signal amplitude ranges, such as EMG from 0 to 5 mV and EEG from 0 to 500 uV, the multiplier adjustment module 202 is placed outside the SIP to allow users to configure it freely according to their application scenarios.

[0065] Furthermore, in some feasible embodiments, the external solder joint 30 includes: analog signal solder joints and digital signal solder joints;

[0066] The analog signal solder joint is connected to the analog front-end circuit 20, and the analog signal solder joint is used to connect to an external analog circuit.

[0067] The digital signal solder joint is connected to the analog front-end circuit 20, and the digital signal solder joint is used to connect to external digital circuits;

[0068] The analog signal solder joints and the digital signal solder joints are located on different sides of the substrate 10 to avoid signal interference between the external analog circuit and the external digital circuit.

[0069] In this embodiment, combined with Figure 1 and Figure 2 It can be seen that the external solder joints connecting the analog front-end circuit 20 to the human body signal input module 100, the external adjustment module 200, and the human body signal output module 300 are analog signal solder joints, and the external solder joints connecting the analog front-end circuit 20 to the power supply module 400 and the logic control module 500 are digital signal solder joints. When designing the circuit, the analog circuit section and the digital circuit section should be spatially isolated as much as possible, i.e., ... Figure 2 As shown, the external solder joints of the two parts are respectively located on the upper and lower sides of the SIP module.

[0070] Furthermore, combined Figure 1 and Figure 2 In some feasible embodiments, the analog signal solder joints include: input solder joints, filter solder joints, amplification solder joints, and output solder joints; the external analog circuit includes a human body signal input module 100, an external filter module 201, a multiplier adjustment module 202, and a human body signal output module 300;

[0071] The input solder joint is used to connect to the human body signal input module 100;

[0072] The filter solder joints are used to connect the external filter module 201;

[0073] The magnified solder joint is used to connect the magnification adjustment module 202;

[0074] The output solder joints are used to connect to the human body signal output module 300.

[0075] In this embodiment, the right-side solder joint on the SIP module used to connect to the human body signal input module 100 is the input solder joint; the upper external solder joint on the SIP module used to connect to the multiplier adjustment module 202 in the external adjustment module 200 is the amplification solder joint; the upper external solder joint on the SIP module used to connect to the external filter module 201 in the external adjustment module 200 is the filter solder joint; and the left-side solder joint on the SIP module used to connect to the human body signal output module 300 is the output solder joint. The input solder joint and the output solder joint are arranged opposite to each other on the left and right sides of the SIP module, and the positions of the input solder joint and the output solder joint are closer to the upper solder joint and farther away from the lower solder joint.

[0076] It should be noted that placing the external solder joints for input and output signals on opposite sides of the SIP module can reduce the chance of wiring errors and also prevent self-interference of analog signals from a spatial perspective. At the same time, since the human body signal input module 100 and the human body signal output module 300 are also part of the analog circuit according to their functions, the analog circuit part and the digital circuit part should be spatially isolated as much as possible during circuit design. Therefore, the input and output solder joints should be placed closer to the upper solder joint and farther away from the lower solder joint.

[0077] Furthermore, combined Figure 1 and Figure 2 In some feasible embodiments, the analog front-end circuit 20 includes: an instrumentation amplifier (INA) and an operational amplifier (OPA);

[0078] The instrumentation amplifier INA is connected to the input solder joint and the filter solder joint. The instrumentation amplifier INA is used to receive human signals from the human signal input module 100 through the input solder joint, amplify the human signal once to obtain an amplified signal, and output the amplified signal to the external filter module 201 through the filter solder joint.

[0079] The operational amplifier (OPA) is connected to the filter solder joint, the amplification solder joint, and the output solder joint. The OPA is used to receive the filtered signal generated by the external filter module 201 based on the primary amplified signal through the filter solder joint, amplify the filtered signal a second time to obtain a secondary amplified signal, and output the secondary amplified signal to the human body signal output module 300 through the output solder joint.

[0080] In this embodiment, the external filtering module 201 is connected to the output terminal of the instrumentation amplifier INA and the positive input terminal of the operational amplifier OPA through two different filtering solder joints. The external filtering module 201 is used to filter the first-stage amplified signal from the instrumentation amplifier INA and output the filtered first-stage amplified signal to the operational amplifier OPA. The multiplier adjustment module 202 is connected to the inverting input terminal and the output terminal of the operational amplifier OPA through two different amplification solder joints. The multiplier adjustment module 202 is used to adjust the second-stage amplification factor of the operational amplifier OPA.

[0081] Understandably, when the instrumentation amplifier INA receives a human signal from the human signal input module 100, it will suppress common-mode interference and perform initial amplification. Then, the instrumentation amplifier INA sends the first-stage amplified signal to the external filter module 201 in the external adjustment module 200 for filtering. The external filter module 201 then sends the filtered first-stage amplified signal to the operational amplifier OPA for second-stage amplification. At this point, the user can adjust the gain of the second-stage amplification through the gain adjustment module 202 in the external adjustment module 200 according to actual needs. Finally, the operational amplifier OPA sends the second-stage amplified signal to the signal output module 300 for use by other subsequent signal processing circuits or signal processing equipment.

[0082] Furthermore, combined Figures 1 to 3 In some feasible embodiments, the instrumentation amplifier and the operational amplifier are mounted on a single substrate, and the system-in-package module further includes:

[0083] A shielding cover is connected to the substrate, and the internal space formed by the shielding cover and the substrate includes the analog front-end circuit. The shielding cover is used to isolate the analog front-end circuit from signal interference between it and the external environment.

[0084] In this embodiment, the instrumentation amplifier INA and operational amplifier OPA in the analog front-end circuit 20 are laid on the same substrate, and a shielding cover is placed on top of the substrate to isolate the analog front-end circuit 20 from the outside. The corresponding SIP layout can be regarded as a tiled layout. Figure 3 The upper half is a plan view of a flat-layout SIP, and the lower half is a cross-sectional view. Figure 3 It can be seen that this layout has a larger overall area, but the SIP is relatively thin. All components are laid flat on a single substrate, with the spacing between components minimized while ensuring performance. This layout spatially isolates the analog and digital circuits, isolating interference from digital signals. Input and output signals are located on the left and right sides of the SIP, respectively, avoiding self-interference from analog signals. The right side of the SIP is the signal acquisition input section, which undergoes common-mode interference suppression and initial amplification via an INA filter. The amplified signal is output above the SIP to the outside of the module, where it can be connected to a bandpass filter circuit before entering the OPA input inside the SIP. After passing through the internal circuitry of the OPA and combined with an external amplification factor adjustment module, the signal is amplified a second time and output from the left side of the SIP. The power supply and logic control sections are located below the SIP, spatially away from the analog circuitry as much as possible.

[0085] For example, in a SIP, a certain number of res resistors and cap capacitors can be configured as peripheral circuits for each amplifier to facilitate the adjustment of the performance parameters of each amplifier.

[0086] Furthermore, combined Figure 1 , Figure 2 and Figure 4 In some feasible embodiments, the instrumentation amplifier and the operational amplifier are disposed on two substrates, and the system-in-package module further includes:

[0087] A support plate, wherein the support plate is disposed between two substrates;

[0088] A shielding cover is connected to a substrate. The internal space formed by the shielding cover and the substrate includes another substrate, the analog front-end circuit, and the support plate. The shielding cover is used to isolate the analog front-end circuit from signal interference from the external environment.

[0089] The external solder joints are located on the substrate connected to the shield.

[0090] In this embodiment, the instrumentation amplifier INA and operational amplifier OPA in the analog front-end circuit 20 are laid on two substrates, and the two substrates can overlap in the vertical direction. A support plate is added above one substrate to place the other substrate. The top of the shield is higher than the surface of the substrate on the support plate where the circuit has been laid, thus isolating the analog front-end circuit 20 from the outside. The corresponding SIP layout can be regarded as a stacked layout. Figure 4 The upper half is a plan view of the stacked layout, and the lower half is a cross-sectional view. This layout maximizes the overall planar area of ​​the SIP module, making it slightly thicker than a tiled layout. This layout achieves a tower distribution, with the OPA circuit at the top and the INA circuit at the bottom. The middle substrate has a shielding layer, which can effectively isolate self-interference signals between the OPA and INA circuits. The solder joints on the right side of the SIP on the substrate are the input solder joints. After the signal enters the module through the input solder joints, it passes through the INA to suppress common-mode interference and undergoes preliminary amplification. After amplification, the signal is output to the outside of the module. The upper filter solder joints connect to an external filter module. After the signal is output from the external filter module, it enters the OPA input in the upper sub-substrate of the SIP. After passing through the internal circuit of the OPA and combined with the multiplier adjustment module of the external circuit, the signal is amplified a second time and output from the OPA circuit on the upper layer of the SIP through the output solder joints on the left side of the substrate. The digital signal solder joints used to connect the power supply and logic control sections are located on the lower side of the SIP, as far away from the analog circuits as possible.

[0091] For example, in a SIP, a certain number of res resistors and cap capacitors can also be configured for each amplifier as peripheral circuitry to facilitate the adjustment of the performance parameters of each amplifier.

[0092] This embodiment proposes a system-in-package (SiP) module. By encapsulating the analog front-end circuit within the SiP module, the layout and routing of the analog front-end circuit are fixed, thereby stabilizing its performance. When processing different types of human body signals, only the external circuitry of the analog front-end circuit needs to be adjusted to adapt to different application scenarios. This avoids the performance differences caused by the need to change the layout and routing of the analog front-end circuit for each design based on different products, as is present in existing technologies. This improves the integration and consistency of the analog circuit and reduces signal quality variations. The SiP module has a wide range of applications and flexible configurations, and can be used for front-end amplification of signals such as EMG / ECG / EEG, with flexible configuration of amplification factor and filtering range. The SiP module has high integration, highly integrating the various amplification circuits and peripheral devices of the analog front-end. The SiP module also exhibits good consistency, with optimized internal routing, effectively isolating noise by increasing the spatial distance between different signals.

[0093] This application provides a design method for a system-level packaging module, referring to... Figure 5 , Figure 5 This application provides a flowchart illustrating a design method for a system-in-package (SIP) module according to an embodiment of the present application. This SIP module design method is used to fabricate the SIP module in any of the above embodiments, such as... Figure 5 As shown, the design method of the system-in-package module provided in this embodiment includes steps S10 to S30.

[0094] Step S10: Integrate the instrumentation amplifier and the power amplifier into an analog front-end circuit;

[0095] In this embodiment, to avoid the performance differences caused by changing the layout and routing of the analog front-end circuit each time a different product is designed, which is a problem in the prior art, this embodiment improves the integration and consistency of the analog circuit and reduces signal quality differences. This embodiment fixes the layout and routing of each amplifier in the analog front-end circuit, thereby keeping its performance indicators in a stable state.

[0096] Step S20: Perform layout design on the analog front-end circuit to obtain the design result;

[0097] In this embodiment, in terms of layout design, in order to minimize the layout area, while meeting the requirements, the smallest possible analog front-end die is selected. Based on the principle of keeping analog circuits as far away from digital circuits and power supply parts as possible, the layout area is minimized. After the layout design is completed, the packaging design can be carried out based on the layout design results.

[0098] For example, considering the requirements of both area and thickness, this embodiment can provide two layout design methods for analog front-end circuits, namely, tiled layout and stacked layout, and the corresponding design results include tiled design results and stacked design results.

[0099] In some feasible embodiments, the design result includes a tiling design result, and step S20 above includes:

[0100] Step S21: Deploy the instrumentation amplifier and the power amplifier on the same substrate, set external solder joints on different sides of the substrate, and connect the instrumentation amplifier and the power amplifier to the external solder joints to obtain the tiled design result.

[0101] Reference Figure 3 , Figure 3 The upper half shows a plan view of the flat-layout design, while the lower half shows a cross-sectional view. This layout results in a larger overall area, but the SIP is relatively thin. All components are laid flat on the entire substrate, with the spacing between components minimized while ensuring performance. This layout spatially isolates the analog and digital circuits, isolating interference from digital signals. Input and output signals are located on the left and right sides of the SIP, respectively, avoiding self-interference from analog signals. The right side of the SIP houses the signal acquisition input, which undergoes common-mode interference suppression and initial amplification via an INA (instrumentation amplifier). The amplified signal is output from the top of the SIP to the outside of the module, where it can be connected to a bandpass filter circuit before entering the OPA (operational amplifier) ​​inside the SIP. After secondary amplification via the OPA's internal circuitry and an external amplification adjustment module, the signal is output from the left side of the SIP. The power supply and logic control sections are located below the SIP, spatially away from the analog circuitry.

[0102] For example, in a SIP, a certain number of res resistors and cap capacitors can also be configured for each amplifier as peripheral circuitry to facilitate the adjustment of the performance parameters of each amplifier.

[0103] In some feasible embodiments, the design result includes a stack-type design result, and step S20 above includes:

[0104] Step S22: Deploy the instrumentation amplifier on the first substrate, add a support plate on the side of the first substrate where the instrumentation amplifier is deployed, add a second substrate on the support plate, deploy a power amplifier on the second substrate, set external solder joints on different sides of the first substrate, and connect the instrumentation amplifier and the power amplifier to the external solder joints to obtain the stacked design result.

[0105] Reference Figure 4 , Figure 4 The upper half is a plan view of the stacked design result, and the lower half is a cross-sectional view. This layout maximizes the overall planar area, making it slightly thicker than the flat layout. This layout achieves a tower distribution, with the top layer being the OPA circuit and the bottom layer being the INA circuit. The middle substrate has a shielding layer, which can effectively isolate self-interference signals between the OPA and INA circuits. The right side of the SIP on the substrate is the signal acquisition input section. After common-mode interference is suppressed by the INA and preliminary amplification is performed, the amplified signal is output to the outside of the module. It can be connected to a bandpass filter circuit and then enter the OPA input in the upper sub (Substrate) of the SIP. After passing through the internal circuit of the OPA and combined with the external amplification factor adjustment module, the signal is amplified a second time and then output from the OPA circuit on the upper layer of the SIP through the left side of the substrate. The power supply and logic control section is located in the lower part of the upper and lower parts of the SIP, which is spatially as far away from the analog circuit as possible.

[0106] Understandable, Figure 4 The substrate in the middle corresponds to the first substrate, and the sub corresponds to the second substrate.

[0107] For example, in a SIP, a certain number of res resistors and cap capacitors can also be configured for each amplifier as peripheral circuitry to facilitate the adjustment of the performance parameters of each amplifier.

[0108] Step S30: Based on the design results, the analog front-end circuit is packaged into a system-in-package module.

[0109] Understandably, after the analog front-end circuit is packaged, the system-in-package module can be obtained simply by connecting the corresponding external solder points to the corresponding functional modules.

[0110] Furthermore, in some feasible embodiments, step S30 above includes:

[0111] Step S31: Lay the analog front-end circuit on the substrate;

[0112] Step S32: External solder joints are provided on different sides of the substrate;

[0113] Step S33: Connect the analog front-end circuit to the external solder joint;

[0114] Step S34: Add a shielding cover to the surface of the substrate on which the analog front-end circuit has been laid;

[0115] Step S35: Fill the shielding cover with adhesive to complete the encapsulation.

[0116] In this embodiment, the substrate adopts a design of at least 3 layers. The bottom layer is grounded to shield external signals from interfering with the circuit. The middle layer carries signal lines and uses ground to isolate signals. The top layer is grounded to shield signals and traces within the SIP from mutual interference. The outer perimeter is covered with a metal shield and grounded to isolate interference information from the inside and outside of the SIP. Finally, moisture-proof, insulating, and curing adhesive is poured into the internal space of the SIP to protect the internal modules and circuits from corrosion and damage caused by sweat / water stains caused by prolonged wear.

[0117] This embodiment provides a design method for a system-in-package (SiP) module. Based on this method, the SiP module provided in the above embodiment can be fabricated. This embodiment encapsulates the analog front-end circuit within the SiP module, fixing the layout and routing of the analog front-end circuit, thereby stabilizing its performance. When processing different types of human body signals, only the external circuitry of the analog front-end circuit needs to be adjusted to adapt to different usage scenarios. This avoids the performance differences caused by the need to change the layout and routing of the analog front-end circuit each time it is designed for different products, as is common in existing technologies. It improves the integration and consistency of the analog circuit and reduces signal quality variations. This SiP module has high integration, highly integrating the various amplifier circuits and their peripheral devices in the analog front-end circuit; it also has good consistency, with optimized internal routing of the analog front-end circuit, effectively isolating noise and signal interference between different types of signals.

[0118] The above is a detailed description of the preferred embodiments of this application. However, the embodiments of this application are not limited to the above-described implementation methods. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the embodiments of this application. All such equivalent modifications or substitutions are included within the scope defined by the claims of the embodiments of this application.

Claims

1. A system-in-package module, characterized in that, The system-in-package module includes: a substrate, analog front-end circuitry, and external solder joints; The analog front-end circuit is laid on the substrate and is used to receive externally input human body signals and amplify the human body signals. The external solder joint is disposed on the substrate and is connected to the analog front-end circuit. The external solder joint is used to output the amplified signal generated by the analog front-end circuit to an external circuit for processing before inputting it back to the analog front-end circuit.

2. The system-in-package module as described in claim 1, characterized in that, The external solder joints include: analog signal solder joints and digital signal solder joints; The analog signal solder joint is connected to the analog front-end circuit, and the analog signal solder joint is used to connect to an external analog circuit. The digital signal solder joint is connected to the analog front-end circuit, and the digital signal solder joint is used to connect to external digital circuits; The analog signal solder joints and the digital signal solder joints are located on different sides of the substrate to avoid signal interference between the external analog circuit and the external digital circuit.

3. The system-in-package module as described in claim 2, characterized in that, The analog signal solder joints include: input solder joints, filter solder joints, amplification solder joints, and output solder joints; the external analog circuit includes a human body signal input module, an external filter module, a multiplier adjustment module, and a human body signal output module. The input solder joint is used to connect to the human body signal input module; The filter solder joints are used to connect the external filter module; The magnified solder joint is used to connect the magnification adjustment module; The output solder joints are used to connect to the human body signal output module.

4. The system-in-package module as described in claim 3, characterized in that, The analog front-end circuit includes: an instrumentation amplifier and an operational amplifier; The instrumentation amplifier is connected to the input solder joint and the filter solder joint. The instrumentation amplifier is used to receive human signals from the human signal input module through the input solder joint, amplify the human signal once to obtain an amplified signal, and output the amplified signal to the external filter module through the filter solder joint. The operational amplifier is connected to the filter solder joint, the amplification solder joint, and the output solder joint. The operational amplifier is used to receive the filtered signal generated by the external filtering module based on the primary amplified signal through the filter solder joint, amplify the filtered signal a second time to obtain a secondary amplified signal, and output the secondary amplified signal to the human body signal output module through the output solder joint.

5. The system-in-package module as described in claim 4, characterized in that, The instrumentation amplifier and the operational amplifier are mounted on a single substrate, and the system-in-package module further includes: A shielding cover is connected to the substrate, and the internal space formed by the shielding cover and the substrate includes the analog front-end circuit. The shielding cover is used to isolate the analog front-end circuit from signal interference between it and the external environment.

6. The system-in-package module as described in claim 4, characterized in that, The instrumentation amplifier and the operational amplifier are mounted on two substrates, and the system-in-package module further includes: A support plate, wherein the support plate is disposed between two substrates; A shielding cover is connected to a substrate. The internal space formed by the shielding cover and the substrate includes another substrate, the analog front-end circuit, and the support plate. The shielding cover is used to isolate the analog front-end circuit from signal interference from the external environment. The external solder joints are located on the substrate connected to the shield.

7. A design method for a system-level packaged module, characterized in that, The system-in-package module design method is used to prepare a system-in-package module as described in any one of claims 1 to 6, wherein the system-in-package module design method includes: Integrate the instrumentation amplifier and power amplifier into an analog front-end circuit; The layout of the analog front-end circuit is designed to obtain the design results; Based on the design results, the analog front-end circuit is packaged into a system-in-package module.

8. The design method of the system-in-package module as described in claim 7, characterized in that, The step of packaging the analog front-end circuit into a system-in-package module based on the design results includes: The analog front-end circuit is laid on the substrate; External solder joints are provided on different sides of the substrate; Connect the analog front-end circuit to the external solder joint; A shielding cover is added to the surface of the substrate on which the analog front-end circuit has been laid; The shield is filled with adhesive to complete the encapsulation.

9. The design method of the system-in-package module as described in claim 7, characterized in that, The design results include: tiling design results; The step of designing the layout of the analog front-end circuit to obtain the design result includes: The instrumentation amplifier and the power amplifier are deployed on the same substrate, and external solder joints are set on different sides of the substrate. The instrumentation amplifier and the power amplifier are connected to the external solder joints to obtain the tiled design result.

10. The design method of the system-in-package module as described in claim 7, characterized in that, The design results include: stack-type design results; The step of designing the layout of the analog front-end circuit to obtain the design result further includes: The instrumentation amplifier is deployed on a first substrate. A support plate is added to one side of the first substrate where the instrumentation amplifier is deployed. A second substrate is added to the support plate. A power amplifier is deployed on the second substrate. External solder joints are set on different sides of the first substrate. The instrumentation amplifier and the power amplifier are connected to the external solder joints to obtain the stacked design result.

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