Display panel, display device, and method for manufacturing display panel

Abstract

This application provides a display panel, a display device, and a method for manufacturing the display panel. The display panel includes: a substrate; a first electrode layer disposed on one side of the substrate; the first electrode layer includes a second sub-layer and a third sub-layer stacked in a direction away from the substrate; wherein the materials of the second sub-layer and the third sub-layer both include a first metal and a second metal, and the volume ratio of the second metal in the second sub-layer is greater than the volume ratio of the second metal in the third sub-layer. The lower volume ratio of the second metal in the third sub-layer can improve the transmittance of the display panel and facilitate under-display integration of the photosensitive module.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] With the rapid development of electronic devices, users have increasingly higher requirements for screen ratio, making full-screen displays of electronic devices receive more and more attention from the industry.

[0003] Traditional electronic devices such as mobile phones and tablets need to integrate components such as front-facing cameras, earpieces, and infrared sensors. Current technology allows light to enter the photosensitive element located beneath the screen through notches or openings in the display panel. However, these devices are not truly full-screen displays and cannot display across the entire screen area; for example, the area corresponding to the front-facing camera cannot display an image. Furthermore, current displays have relatively low transmittance. Summary of the Invention

[0004] This application provides a display panel, a display device, and a method for manufacturing the display panel, with the aim of improving the transmittance of the display panel.

[0005] An embodiment of the first aspect of this application provides a display panel, including: a substrate, a first electrode layer disposed on one side of the substrate, the first electrode layer including a second sub-layer and a third sub-layer stacked in a direction away from the substrate, wherein the materials of the second sub-layer and the third sub-layer both include a first metal and a second metal, and the volume ratio of the second metal in the second sub-layer is greater than the volume ratio of the second metal in the third sub-layer, and the melting point of the second metal is higher than the melting point of the first metal.

[0006] According to an embodiment of the first aspect of this application, the first electrode layer further includes a first sublayer located on the side of the second sublayer opposite to the third sublayer, wherein the work function of the first sublayer material is less than the work function of the first metal and / or the second metal.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the work function of the material of the first sublayer is 2.2 eV to 4 eV.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the material of the first sublayer includes at least one of Yb, Li, Na, K, Ba, and Cs.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the second metal includes at least one of magnesium and aluminum.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the second metal is magnesium.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the volume percentage of the second metal in the second sublayer is 10% to 20%.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the volume percentage of the second metal in the third sublayer is greater than or equal to 0 and less than or equal to 10%.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the thickness of the second sublayer is 0.5 nm to 5 nm.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the thickness of the third sublayer is 5nm to 150nm.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the thickness of the first sub-layer is less than the thickness of the second sub-layer, and / or the thickness of the first sub-layer is less than the thickness of the third sub-layer.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the thickness of the first sublayer is 0.01 nm to 0.15 nm.

[0017] According to any of the foregoing embodiments of the first aspect of this application, it further includes:

[0018] The second electrode layer is located on the side of the first electrode layer facing the substrate;

[0019] The light-emitting layer is located between the second electrode layer and the first electrode layer.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the second electrode layer is an anode layer and the first electrode layer is a cathode layer.

[0021] The second aspect of this application also provides a display device, including the display panel of any of the first aspect embodiments described above.

[0022] The third aspect of this application also provides a method for manufacturing a display panel, comprising:

[0023] A second sublayer is disposed on the substrate. The material of the second sublayer includes a first metal and a second metal, wherein the melting point of the second metal is greater than that of the first metal.

[0024] A third sublayer is disposed on the side of the second sublayer away from the substrate so that the first sublayer, the second sublayer and the third sublayer are combined to form a first electrode layer. The third sublayer includes a first metal and a second metal, and the volume ratio of the second metal in the second sublayer is greater than the volume ratio of the second metal in the third sublayer.

[0025] According to an embodiment of the third aspect of this application, before the step of forming a second sublayer on the substrate, the method further includes forming a first sublayer on the substrate, wherein the work function of the first sublayer material is less than the work function of the first metal and / or the second metal;

[0026] In the step of setting a second sublayer on the substrate: a second sublayer is set on the side of the first sublayer away from the substrate.

[0027] In the display panel provided in this application embodiment, the display panel includes a substrate and a first electrode layer disposed on the substrate. The first electrode layer is used to drive the light-emitting unit of the display panel to emit light. The first electrode layer includes a second sub-layer and a third sub-layer disposed sequentially. Both the second and third sub-layers include a first metal and a second metal, which makes the second and third sub-layers have good electrical conductivity. The melting point of the second metal is higher than that of the first metal, which can improve the heat resistance of the first electrode layer, ensure that the first electrode layer has good thermal stability, and reduce the impact of the display panel emitting light and heat on the first electrode layer. In addition, the volume ratio of the second metal in the second sub-layer is greater than that in the third sub-layer, which can ensure that the second sub-layer has good electrical conductivity. The volume ratio of the second metal in the third sub-layer is lower, which can improve the transmittance of the third sub-layer, thereby improving the transmittance of the first electrode layer and the transmittance of the display panel, which facilitates the under-display integration of the photosensitive module. Attached Figure Description

[0028] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0029] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0030] Figure 2 This is a partial cross-sectional view of a display panel provided in an embodiment of this application;

[0031] Figure 3 It is a graph showing the light transmittance of different metal layers;

[0032] Figure 4 This is a schematic diagram of a method for manufacturing a display panel according to an embodiment of this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] 100, substrate; 110, substrate; 120, array substrate;

[0035] 200, First electrode layer; 210, First sublayer; 220, Second sublayer; 230, Third sublayer;

[0036] 300. Second electrode layer; 310. Pixel electrode;

[0037] 400, Emissive layer; 410, Pixel definition layer; 411, Isolation section; 412, Pixel opening; 420, Emissive unit;

[0038] AA1, First display area; AA2, Second display area Detailed Implementation

[0039] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0040] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0041] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0042] In electronic devices such as mobile phones and tablets, light-sensing components such as front-facing cameras, infrared light sensors, fingerprint recognition modules, and proximity sensors need to be integrated on one side of the display panel. In some embodiments, a light-transmitting display area can be provided on the aforementioned electronic device, with the light-sensing components placed behind the light-transmitting display area, achieving a full-screen display while ensuring the normal operation of the light-sensing components. However, since the display panel includes multiple stacked film layers, such as a cathode layer, the transmittance of these layers will significantly affect the overall transmittance of the display panel.

[0043] This application is proposed to solve the aforementioned technical problems. To better understand this application, the following is combined with... Figures 1 to 4 The display panel, display device, and method for manufacturing the display panel according to embodiments of this application will be described in detail.

[0044] Please see Figure 1 and Figure 2 , Figure 1 This is a top view of a display panel provided in an embodiment of this application. Figure 2 This is a partial cross-sectional view of a display panel provided in an embodiment of this application.

[0045] like Figure 1 and Figure 2 As shown, the display panel provided in this application includes: a substrate 100 and a first electrode layer. The first electrode layer 200 is disposed on one side of the substrate 100. The first electrode layer 200 includes a second sub-layer 220 and a third sub-layer 230 stacked in a direction away from the substrate 100. The materials of the second sub-layer 220 and the third sub-layer 230 both include a first metal and a second metal. The volume ratio of the second metal in the second sub-layer 220 is greater than the volume ratio of the second metal in the third sub-layer 230. The melting point of the second metal is higher than the melting point of the first metal.

[0046] In the second sublayer 220, the volume percentage of the second metal is the proportion of the second metal to the total volume of the material in the second sublayer 220. Similarly, in the third sublayer 230, the volume percentage of the second metal is the proportion of the third metal to the total volume of the material in the third sublayer 230.

[0047] In the display panel provided in this application embodiment, the display panel includes a substrate 100 and a first electrode layer 200 disposed on the substrate 100. The first electrode layer 200 is used to drive the light-emitting unit 420 of the display panel to emit light. The first electrode layer 200 includes a second sub-layer 220 and a third sub-layer 230 disposed sequentially. Both the second sub-layer and the third sub-layer 230 include a first metal and a second metal, which makes the second sub-layer 220 and the third sub-layer 230 have good electrical conductivity. The melting point of the second metal is higher than that of the first metal, which can improve the heat resistance of the first electrode layer 200, ensure that the first electrode layer 200 has good thermal stability, and reduce the impact of the display panel emitting light and heat on the first electrode layer 200. In addition, the volume ratio of the second metal in the second sub-layer 220 is greater than that of the second metal in the third sub-layer 230, which ensures that the second sub-layer 220 has good conductivity. The volume ratio of the second metal in the third sub-layer 230 is lower, which can improve the transmittance of the third sub-layer 230, thereby improving the transmittance of the first electrode layer 200 and the transmittance of the display panel, making it easier to achieve under-display integration of the photosensitive module.

[0048] Optionally, the volume ratio of the first metal in the third sublayer 230 is greater than that in the second sublayer 220, and the higher content of the first metal in the third sublayer 230 results in good light transmittance of the third sublayer 230.

[0049] Optional, please continue reading Figure 2 The display panel also includes a second electrode layer 300 and a light-emitting layer 400. The second electrode layer 300 is located on the side of the first electrode layer 200 facing the substrate 100, and the light-emitting layer 400 is located between the first electrode layer 200 and the second electrode layer 300. The second electrode layer 300 and the first electrode layer 200 are used to drive the light-emitting layer 400 to emit light.

[0050] Optionally, the light-emitting unit is disposed on the light-emitting layer 400. The light-emitting layer 400 includes an electron injection layer, an electron transport layer, a light-emitting material layer, a hole transport layer, and a hole injection layer, which are stacked in a direction away from the first electrode layer 200. The electron injection layer and the electron transport layer are adjacent to the first sub-layer 210 of the first electrode layer 200. The material of the first sub-layer 210 includes a low work function material, which can reduce the work function of the first sub-layer 210, reduce the energy level barrier between the first sub-layer 210 and the electron injection layer and the electron transport layer, increase the electron injection characteristics, and improve the device efficiency and lifetime.

[0051] Optionally, the second electrode layer 300 is a pixel electrode layer, comprising a plurality of pixel electrodes 310 arranged in an array. Optionally, the first electrode layer 200 is a common electrode layer. Optionally, during the light emission process of the display panel, the second electrode layer 300 serves as the anode and the first electrode layer 200 serves as the cathode.

[0052] Optional, please continue reading Figure 2 The light-emitting layer 400 includes a pixel definition layer 410 and a light-emitting unit 420. The pixel definition layer 410 includes an isolation portion 411 and a pixel opening 412 formed by the isolation portion 411. The light-emitting unit 420 is located within the pixel opening 412. Optionally, each pixel electrode 310 is correspondingly disposed with each pixel opening 412, and the pixel electrode 310 interacts with a common electrode to drive the light-emitting unit 420 to emit light.

[0053] In some optional embodiments, the first electrode layer 200 further includes a first sub-layer 210, which is located on the side of the second sub-layer 220 opposite to the third sub-layer 230. The work function of the first sub-layer is less than that of the first metal and / or the second metal. That is, the material of the first sub-layer 210 includes a low work function material, which can reduce the work function of the first electrode layer 200, reduce the energy level barrier between the first electrode layer 200 and the light-emitting unit, increase electron injection characteristics, and improve device efficiency and lifetime.

[0054] In this embodiment, the distances between the first sub-layer 210, the second sub-layer 220, and the third sub-layer 230 and the light-emitting unit 420 gradually increase. The material of the first sub-layer 210 includes a low work function material, which can reduce the energy level barrier between the first electrode layer 200 and the light-emitting unit. The second sub-layer 220 is closer to the light-emitting unit 420 than the third sub-layer 230. When the light-emitting unit 420 emits light, it generates heat, making the second sub-layer 220 more susceptible to damage from heat. This embodiment improves the heat resistance of the second sub-layer 220 and the thermal stability of the first electrode layer 200 by increasing the volume percentage of the second metal in the second sub-layer 220 compared to the third sub-layer 230, thereby increasing the service life of the first electrode layer 200.

[0055] The substrate 100 can be configured in various ways. For example, the substrate 100 includes a substrate 110 and an array substrate 120 disposed on the substrate 110, the array substrate 120 including a pixel driving circuit. Optionally, the array substrate 120 includes a first conductive layer, a second conductive layer, and a third conductive layer disposed on one side of the substrate 110 and stacked thereon. An insulating material layer is disposed between adjacent conductive layers. Exemplarily, the pixel driving circuit disposed on the array substrate 120 includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source, and a drain. The storage capacitor includes a first electrode and a second electrode. As an example, the gate and the first electrode can be located on the first conductive layer, the second electrode can be located on the second conductive layer, and the source and drain can be located on the third conductive layer.

[0056] In some optional embodiments, the work function of the material of the first sublayer 210 is 2.2 eV to 4 eV. When the work function of the material of the first sublayer 210 is within the above range, it can improve the electron injection characteristics between the second sublayer 220 and the first sublayer 210 caused by the low work function of the first sublayer 210 material; it can also improve the electron injection characteristics between the first sublayer 210 and the electron injection layer and electron transport layer caused by the high work function of the first sublayer 210 material.

[0057] Optionally, the material of the first sublayer 210 may include at least one of Yb, Li, Na, K, Ba, and Cs. These materials have low work functions that meet the requirements of the first sublayer 210, and their fabrication processes are mature, which can reduce the manufacturing cost of the display panel.

[0058] There are several ways to set the thickness of the first sublayer 210. Optionally, the thickness of the first sublayer 210 is 0.01nm to 0.15nm. When the thickness of the first sublayer 210 is within the above range, it can improve the conductivity of the first electrode layer 200 caused by the excessive thickness of the first sublayer 210, and it can also improve the electron injection characteristics between the first sublayer 210 and the electron injection layer and electron transport layer caused by the insufficient thickness of the first sublayer 210.

[0059] Optionally, the thickness of the first sub-layer 210 is less than the thickness of the second sub-layer 220. When the thickness of the first sub-layer 210 is less than the thickness of the second sub-layer 220, on the one hand, the thicker second sub-layer 220 can ensure that the first electrode layer 200 has better conductivity, and on the other hand, the thinner first sub-layer 210 can improve the conductivity of the first electrode layer 200.

[0060] Optionally, the thickness of the first sub-layer 210 is less than the thickness of the third sub-layer 230. When the thickness of the first sub-layer 210 is less than the thickness of the third sub-layer 230, on the one hand, the third sub-layer 230 can ensure that the first electrode layer 200 has good conductivity, and on the other hand, the thinner first sub-layer 210 can improve the conductivity of the first electrode layer 200.

[0061] Alternatively, in some other embodiments, the thickness h1 of the first sublayer 210, the thickness h2 of the second sublayer 220, and the thickness h3 of the third sublayer 230 satisfy: h1 < h2 < h3.

[0062] In these optional embodiments, when the thickness h1 of the first sub-layer 210, the thickness h2 of the second sub-layer 220, and the thickness h3 of the third sub-layer 230 satisfy the above relationship, the thickness of the third sub-layer 230 is the largest, and the volume ratio of the third sub-layer 230 in the entire first electrode layer 200 is the largest, which can effectively improve the light transmittance of the first electrode layer 200.

[0063] In some alternative embodiments, the second metal includes at least one of magnesium and aluminum.

[0064] In these alternative embodiments, on the one hand, the melting points of metals such as magnesium and aluminum are higher than those of the first metal, so as to improve the problem of easy deformation and damage of the first electrode layer 200 when heated; on the other hand, the manufacturing processes of these metals are mature, which can effectively reduce the manufacturing cost of the display panel.

[0065] Optionally, the volume percentage of the first metal in the second sublayer is x%, and the volume percentage of the second metal in the second sublayer is 1-x%. The volume percentage of the first metal in the third sublayer is y%, and the volume percentage of the second metal in the second sublayer is 1-y.

[0066] Optionally, the second metal is magnesium, meaning that both the second sublayer 220 and the third sublayer 230 are made of the first metal and magnesium, and both the second sublayer 220 and the third sublayer 230 are magnesium and the first metal alloy layer. In these optional embodiments, both the second sublayer 220 and the third sublayer 230 are magnesium and the first metal alloy layer, which ensures that the first electrode layer 200 has good conductivity, has a mature manufacturing process, and facilitates the fabrication and shaping of the second sublayer 220 and the third sublayer 230.

[0067] like Figure 3 As shown, Figure 3 The graph shows the light transmittance curves for different metal layers. Figure 3 The horizontal axis represents the wavelength of light that can pass through the magnesium-silver alloy. Figure 3 The vertical axis represents transmittance. Figure 3 In the diagram, S1 represents the transmittance curve of an 11nm thick magnesium-silver alloy layer, S2 represents the transmittance curve of a 9.5nm thick magnesium-silver alloy layer, S3 represents the transmittance curve of an 11nm thick silver metal layer, and S4 represents the transmittance curve of a 9.5nm thick silver metal layer.

[0068] The inventors discovered through research that, for example Figure 3 As shown, by comparing S1 and S3, and S2 and S4, it can be seen that the metal layer has low transmittance in the near-infrared band, and the transmittance decreases with increasing Mg content. This results in low transmittance in the infrared band for the entire display panel. Transmittance refers to the amount of light that can be transmitted; infrared transmittance refers to the amount of light transmitted in the infrared band. Under the same incident light intensity, the lower the transmittance, the less light is transmitted.

[0069] In the display panel provided in this application embodiment, the volume ratio of the second metal in the second sub-layer 220 is greater than that in the third sub-layer 230, that is, the Mg content in the second sub-layer 220 is higher, which can ensure that the first electrode layer 200 has good heat resistance and good thermal stability; while the Mg content in the third sub-layer 230 is lower, which can effectively improve the transmittance of the first electrode layer 200, thereby improving the transmittance of the display panel.

[0070] In some optional embodiments, the volume percentage of the second metal in the second sublayer 220 is 10% to 20%.

[0071] In these alternative embodiments, when the volume ratio of the second metal in the second sub-layer 220 is within the above range, it can improve the heat resistance performance of the second sub-layer 220 due to the low volume ratio of the second metal, and also improve the light transmittance performance of the display panel due to the high volume ratio of the second metal.

[0072] In some optional embodiments, the volume percentage of the second metal in the third sublayer 230 is greater than or equal to 0 and less than or equal to 10%. For example, the volume percentage of the second metal in the third sublayer 230 is greater than 0 and less than or equal to 10%.

[0073] In these alternative embodiments, when the volume ratio of the second metal in the third sublayer 230 is within the above range, it can improve the heat resistance performance of the third sublayer 230 due to the low volume ratio of the second metal, and also improve the light transmittance performance of the display panel due to the high volume ratio of the second metal.

[0074] In some alternative embodiments, the thickness of the second sublayer 220 is less than the thickness of the third sublayer 230.

[0075] In these optional embodiments, the volume percentage of the second metal in the second sub-layer 220 is greater than that of the second metal in the third sub-layer 230, meaning the second metal has a higher volume percentage in the second sub-layer 220, resulting in a lower transmittance of the second sub-layer 220 compared to the third sub-layer 230. When the thickness of the second sub-layer 220 is less than the thickness of the third sub-layer 230, the transmittance of the display panel can be improved by thinning the second sub-layer 220 and thickening the third sub-layer 230.

[0076] Optionally, the thickness of the second sub-layer 220 is 0.5nm to 5nm. When the thickness of the second sub-layer 220 is within the above range, it can both improve the conductivity of the second electrode layer 300 due to the thickness of the second sub-layer 220 being too small, and improve the transmittance of the second electrode layer 300 due to the thickness of the second sub-layer 220 being too large, thus affecting the transmittance of the display panel.

[0077] Optionally, the thickness of the third sublayer 230 is 5nm to 150nm. When the thickness of the third sublayer 230 is within the above range, it can both improve the conductivity of the second electrode layer 300 due to the thickness of the third sublayer 230 being too small, and improve the transmittance of the second electrode layer 300 due to the thickness of the third sublayer 230 being too large, thus affecting the transmittance of the display panel.

[0078] In any of the above embodiments, the first sub-layer 210, the second sub-layer 220 and the third sub-layer 230 can be disposed in the entire display area of ​​the display panel to improve the overall transmittance of the display panel.

[0079] In other embodiments, the display panel includes a first display area AA1 and a second display area AA2, wherein the transmittance of the first display area AA1 is greater than that of the second display area AA2, and a first sub-layer 210, a second sub-layer 220, and a third sub-layer 230 are located in the first display area AA1. For example, the second electrode layer 300 includes a first portion located in the first display area AA1 and a second portion located in the second display area AA2, wherein the first portion includes the aforementioned first sub-layer 210, second sub-layer 220, and third sub-layer 230.

[0080] In the display panel provided in this application embodiment, the transmittance of the first display area AA1 is greater than that of the second display area AA2. Therefore, the transmittance requirement of the first display area AA1 is relatively high. The first display area AA1 can be used to realize under-display integration of the photosensitive module. Setting the first sub-layer 210, the second sub-layer 220 and the third sub-layer 230 in the first display area AA1 can improve the transmittance of the first display area AA1.

[0081] The second aspect of this application also provides a display device, including the display panel of any of the first aspect embodiments described above. Since the display device provided in the second aspect of this application includes the display panel of any of the first aspect embodiments described above, it has the beneficial effects of the display panel of any of the first aspect embodiments described above, which will not be elaborated further here.

[0082] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0083] Optionally, the display device may also include a photosensitive module, located on the non-display side of the display panel. The photosensitive module may include, but is not limited to, a camera, an infrared sensor, or a fingerprint recognition module.

[0084] Please see Figure 4 , Figure 4 This is a schematic diagram of a method for manufacturing a display panel according to an embodiment of this application.

[0085] like Figure 4 and combined Figure 1 and Figure 2 The third aspect of this application also provides a method for manufacturing a display panel, comprising:

[0086] Step S01: A second sublayer 220 is formed on the substrate 100. The material of the second sublayer 220 includes a first metal and a second metal, and the melting point of the second metal is greater than that of the first metal.

[0087] Optionally, when the first electrode layer 200 includes a first sublayer, a first sublayer 210 is also formed on the substrate 100 before step S01. The first sublayer 210 includes a low work function material, for example, the work function of the low work function material included in the low work function material layer is 2.2 eV to 4 eV. Optionally, the low work function material included in the low work function material layer is at least one of Yb, Li, Na, K, Ba, and Cs. Then, in step S01, a second sublayer 220 can be formed on the side of the first sublayer 210 facing away from the substrate 100.

[0088] Step S02: A third sublayer 230 is provided on the side of the second sublayer 220 away from the substrate 100 so that the second sublayer 220 and the third sublayer 230 are combined to form the first electrode layer 200. The third sublayer 230 includes a first metal and a second metal, and the volume ratio of the second metal in the second sublayer 220 is greater than the volume ratio of the second metal in the third sublayer 230.

[0089] In the display panel prepared according to the embodiments of this application, both the second sub-layer 220 and the third sub-layer 230 include a first metal and a second metal, which gives the second sub-layer 220 and the third sub-layer 230 good conductivity. The melting point of the second metal is higher than that of the first metal, which can improve the impact of the temperature rise during the display panel's light emission on the first electrode layer 200. In addition, the volume ratio of the second metal in the second sub-layer 220 is greater than that in the third sub-layer 230, which can ensure that the second sub-layer 220 has good conductivity. The volume ratio of the second metal in the third sub-layer 230 is lower, which can improve the transmittance of the third sub-layer 230, thereby improving the transmittance of the first electrode layer 200 and the transmittance of the display panel, which facilitates the under-display integration of the photosensitive module.

[0090] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate, a first electrode layer disposed on one side of the substrate, the first electrode layer comprising a second sub-layer and a third sub-layer stacked in a direction away from the substrate, wherein the materials of the second sub-layer and the third sub-layer both comprise a first metal and a second metal, and the volume fraction of the second metal in the second sub-layer is greater than the volume fraction of the second metal in the third sub-layer, and the melting point of the second metal is higher than the melting point of the first metal.

2. The display panel of claim 1, wherein wherein the first electrode layer further comprises a first sub-layer on the side of the second sub-layer away from the third sub-layer, and the work function of the material of the first sub-layer is less than the work function of the first metal and / or the second metal.

3. The display panel of claim 2, wherein, The work function of the material of the first sub-layer is 2.2eV-4eV.

4. The display panel of claim 2, wherein, The material of the first sub-layer comprises at least one of Yb, Li, Na, K, Ba, and Cs.

5. The display panel of claim 1, wherein, The second metal comprises at least one of magnesium and aluminum.

6. The display panel of claim 5, wherein, The second metal is magnesium.

7. The display panel of claim 1, wherein the volume fraction of the second metal in the second sub-layer is 10%-20%, and / or the volume fraction of the second metal in the third sub-layer is greater than 0 and less than or equal to 10%.

8. The display panel of claim 1, wherein, The thickness of the second sub-layer is less than the thickness of the third sub-layer.

9. The display panel of claim 8, wherein, The thickness of the second sub-layer is 0.5nm-5nm.

10. The display panel of claim 8, wherein, The thickness of the third sub-layer is 5nm-150nm.

11. The display panel of any one of claims 2-4, wherein, The thickness of the first sub-layer is less than the thickness of the second sub-layer, and / or the thickness of the first sub-layer is less than the thickness of the third sub-layer.

12. The display panel of claim 11, wherein, The thickness of the first sub-layer is 0.01nm-0.15nm.

13. The display panel of any one of claims 1 to 10, wherein, Further comprising: a second electrode layer on the side of the first electrode layer facing the substrate; a light-emitting layer between the second electrode layer and the first electrode layer.

14. The display panel of claim 13, wherein, The second electrode layer is an anode layer, and the first electrode layer is a cathode layer.

15. A display device comprising: The display panel of any one of claims 1-14.

16. A method for manufacturing a display panel, characterized by, The display panel comprises: disposing a second sub-layer on a substrate, the material of the second sub-layer comprising a first metal and a second metal, and the melting point of the second metal being greater than the melting point of the first metal; disposing a third sub-layer on the side of the second sub-layer away from the substrate to form a first electrode layer in combination with the second sub-layer, the third sub-layer comprising the first metal and the second metal, and the volume fraction of the second metal in the second sub-layer being greater than the volume fraction of the second metal in the third sub-layer.

17. The method of claim 16, wherein the method further comprises, Before the step of disposing the second sub-layer on the substrate, further comprising: disposing a first sub-layer on the substrate, the work function of the material of the first sub-layer being less than the work function of the first metal and / or the second metal; In the step of disposing the second sub-layer on the substrate: disposing the second sub-layer on the side of the first sub-layer away from the substrate.

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