Automatic orientation device for multi-specification semiconductor chips

Abstract

This invention relates to the field of semiconductor chip technology, and in particular to an automatic orientation device for multi-specification semiconductor chips. The device includes: a main body with a groove inside; a support column fixedly connected to the main body; and an orientation mechanism located inside the groove, movably connected to the main body. The orientation mechanism has a clamping block at its top, which is used to clamp the semiconductor chip under force. This device can adjust the clamping angle of the semiconductor chip inwards by the orientation mechanism. An external drive rod is inserted into a through-hole. As the drive rod moves upwards, an adjusting wheel at the top of the through-hole is pushed and rotates, causing the clamping block at the top of the orientation mechanism to unfold outwards from the worktable. This allows the device to adjust the unfolding angle of the clamping block by pushing the adjusting wheel through the internal drive rod, demonstrating that this device can simultaneously meet the automatic orientation function of commonly used chips of various specifications.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip technology, and in particular to an automatic orientation device for multi-specification semiconductor chips. Background Technology

[0002] Semiconductor chips: Semiconductor devices that perform a certain function are made by etching and wiring on semiconductor wafers; not only silicon chips, but also common semiconductor materials such as gallium arsenide and germanium;

[0003] Currently, there are many specifications of semiconductor chips. When chips are tested and packaged, it is necessary to orient the chips of various specifications.

[0004] A search revealed a clamping device for IC chip testing, published under publication number CN212159873U. This device includes a clamping platform with two sets of width-aligning clamping blocks and two sets of length-aligning clamping blocks. The width-aligning and length-aligning clamping blocks are slidably connected to the clamping platform, and their rear ends are connected to push blocks via elastic elements. A driving component for centering and clamping the push blocks is located inside the clamping platform. While the two sets of clamping blocks can clamp chips of different sizes, the device providing driving force to the clamping blocks requires a structure with four sets of lead screws, necessitating multiple driving devices to provide kinetic energy to the clamping blocks. Furthermore, using a motor drive requires an additional force control sensor to control the motor's output force, increasing the chip processing cost.

[0005] Currently, single-specification tooling is mostly used for orientation operations; when changing to a chip of another specification, the orientation tooling must also be changed. During the change, the machine needs to be stopped and the tooling needs to be readjusted, which is labor-intensive and time-consuming. Summary of the Invention

[0006] To address the aforementioned problems in the existing technology, an automatic orientation device for multi-specification semiconductor chips is provided.

[0007] The specific technical solution is as follows:

[0008] Design an automatic orientation device for multi-specification semiconductor chips, including:

[0009] The main body has a groove inside;

[0010] Support columns are fixedly connected to the main body;

[0011] An orientation mechanism is located inside the groove and is movably connected to the main body. A clamping block is provided on the top of the orientation mechanism, and the orientation mechanism is used to drive the clamping block to clamp the semiconductor chip under force.

[0012] Preferably, the orientation mechanism includes:

[0013] An adjusting wheel is movably connected to the directional mechanism, and the adjusting wheel is used to push the directional mechanism by force;

[0014] A rotating shaft is located inside the orientation mechanism, with the main body connecting the fixing plate passing through both sides of the rotating shaft. The rotating shaft is used to provide rotational limit for the orientation mechanism, and the fixing plate is used to limit the rotation of the rotating shaft.

[0015] An elastic element is connected to the orientation mechanism, and the end of the elastic element away from the orientation mechanism is connected to the support column.

[0016] Preferably, the support column has a through hole at its bottom, and the adjusting wheel is located above the through hole.

[0017] Preferably, a limiting hole is provided at the bottom of the main body, and the rotating shaft passes through the limiting hole.

[0018] Preferably, the orientation mechanism is symmetrically distributed.

[0019] Preferably, the top of the main body is provided with a worktable, which is located below the clamping block.

[0020] Preferably, the support column has a support groove on its outside, the support groove is symmetrically distributed, and the elastic element is located inside the support groove.

[0021] Preferably, the grooves inside the main body are interconnected.

[0022] Preferably, the bottom of the support column is fixedly connected to the base.

[0023] Preferably, the clamping block is fixedly connected to the orientation mechanism.

[0024] The above technical solution has the following advantages or beneficial effects:

[0025] 1. The main body is connected via an orientation mechanism. A clamping block is located at the top of the orientation mechanism, which is used to grip the semiconductor chip. This device features symmetrical clamping blocks. The clamping angle of the semiconductor chip can be adjusted inwards by the orientation mechanism. An external drive rod is inserted into the through-hole. As the drive rod moves upwards, the adjusting wheel at the top of the through-hole rotates under thrust, pushing the orientation mechanism outwards. This causes the clamping block at the top of the orientation mechanism to unfold outwards from the worktable. The device can adjust the unfolding angle of the clamping block by pushing the adjusting wheel through the internal drive rod, demonstrating that this device can simultaneously meet the automatic orientation function of various commonly used chip specifications.

[0026] 2. A rotating shaft is located inside the orientation mechanism, with fixed plates connecting the main body on both sides of the shaft. The fixed plates are used to limit the rotation of the shaft. Furthermore, a rotating shaft is set inside the orientation mechanism, which can connect the orientation mechanisms together and provide rotation limit for the orientation mechanism. When the adjusting wheel inside the orientation mechanism is pushed by force, the orientation mechanism rotates around the rotating shaft, which can adjust the clamping range of the top clamping block on the semiconductor chip.

[0027] 3. The orientation mechanism is connected via an elastic element. The end of the elastic element away from the orientation mechanism is connected to a support column. An elastic element is installed at the bottom of the orientation mechanism. When the orientation mechanism is subjected to force and rotates around the pivot, the elastic element contracts under force, cooperating with the unfolding of the top clamp. When the chip is placed on the worktable and the drive rod inside the through hole is moved out, so that the orientation mechanism is not subjected to force, the elastic element pushes the bottom of the orientation mechanism outward through its own elastic force, causing the clamping block at the top of the orientation mechanism to move inward to clamp the semiconductor chip. The bottom of the orientation mechanism uses an elastic element as the power source for clamping, which has high adaptability. Attached Figure Description

[0028] Embodiments of the invention will be described more fully with reference to the accompanying drawings. However, the drawings are for illustration and explanation only and do not constitute a limitation on the scope of the invention.

[0029] Figure 1 This is a schematic diagram of the structure of an automatic orientation device for multi-specification semiconductor chips proposed in this invention;

[0030] Figure 2 This is a bottom view of the structure of an automatic orientation device for multi-specification semiconductor chips proposed in this invention;

[0031] Figure 3 This is a side view of the structure of an automatic orientation device for multi-specification semiconductor chips proposed in this invention;

[0032] Figure 4 This is a schematic diagram of the grooves on both sides of an automatic orientation device for multi-specification semiconductor chips proposed in this invention;

[0033] Figure 5 This is a top view of the structure of an automatic orientation device for multi-specification semiconductor chips proposed in this invention;

[0034] Figure 6 This is a schematic diagram of the structure of the automatic orientation device for multi-specification semiconductor chips proposed in this invention, showing the removal of the orientation mechanism.

[0035] Figure 7 This is a top view of the orientation mechanism in an automatic orientation device for multi-specification semiconductor chips proposed in this invention;

[0036] Figure 8This is a schematic diagram of the orientation mechanism in an automatic orientation device for multi-specification semiconductor chips proposed in this invention.

[0037] The above-mentioned reference numerals indicate: 1. Main body; 2. Base; 3. Support column; 4. Orientation mechanism; 41. Adjustment wheel; 42. Rotating shaft; 43. Fixed plate; 44. Elastic element; 5. Clamping block; 6. Worktable; 7. Limiting hole; 8. Through hole; 9. Groove; 10. Support groove. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0040] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention.

[0041] Reference Figure 1-8 An automatic orientation device for multi-specification semiconductor chips includes: a main body 1, with a groove 9 inside the main body 1; a support column 3, fixedly connected to the main body 1; and an orientation mechanism 4, located inside the groove 9, movably connected to the main body 1, with a clamping block 5 on the top of the orientation mechanism 4, which is used to clamp the semiconductor chip by force driving the clamping block 5.

[0042] The orientation mechanism 4 includes: an adjusting wheel 41, which is movably connected to the orientation mechanism 4 and is used to push the orientation mechanism 4; a rotating shaft 42, located inside the orientation mechanism 4, with both sides of the rotating shaft 42 passing through the main body 1 and connected to a fixed plate 43, which provides rotational limit for the orientation mechanism 4, and the fixed plate 43 limits the rotation of the rotating shaft 42; and an elastic element 44 connected to the orientation mechanism 4, with one end of the elastic element 44 away from the orientation mechanism 4 connected to a support column 3. Furthermore, the rotating shaft 42 is further provided inside the orientation mechanism 4, allowing the orientation mechanisms 4 to be connected in series, providing rotational limit for the orientation mechanism 4, and causing the adjusting wheel 41 inside the orientation mechanism 4 to be pushed by force. When the orientation mechanism 4 is in operation, it rotates around the pivot 42, which can adjust the clamping range of the top clamping block 5 for the semiconductor chip. An elastic element 44 is provided at the bottom of the orientation mechanism 4. When the orientation mechanism 4 is subjected to force and rotates around the pivot 42, the elastic element 44 contracts under force to cooperate with the expansion of the top clamping device. When the chip is placed on the worktable 6 and the drive rod inside the through hole 8 is moved out, so that the orientation mechanism 4 is not subjected to force, the elastic element 44 pushes the bottom of the orientation mechanism 4 outward through its own elastic force, causing the clamping block 5 at the top of the orientation mechanism 4 to move inward to clamp the semiconductor chip. The bottom of the orientation mechanism 4 uses the elastic element 44 as the power source for clamping, which has high adaptability.

[0043] The support column 3 has a through hole 8 at its bottom. The adjusting wheel 41 is located above the through hole 8. The driving rod at the bottom can be inserted into the through hole 8 to push and compress the adjusting wheel 41 at the top.

[0044] A limiting hole 7 is provided at the bottom of the main body 1, and the rotating shaft 42 passes through the limiting hole 7. The limiting hole 7 is used to provide space for the rotating shaft 42 to rotate and limit.

[0045] The orientation mechanism 4 is symmetrically distributed, and there are four orientation mechanisms 4, which are used to clamp the semiconductor chip around its perimeter.

[0046] The top of the main body 1 is provided with a worktable 6, which is located below the clamping block 5. The worktable 6 is used to place the chip and support it.

[0047] The support column 3 has a support groove 10 on its outside. The support groove 10 is symmetrically distributed. The elastic element 44 is located inside the support groove 10. The support groove 10 is used to provide support points for the elastic element 44.

[0048] The grooves 9 inside the main body 1 are interconnected, and the interconnected grooves 9 can provide sliding space for the orientation mechanism 4.

[0049] The base 2 is fixedly connected to the bottom of the support column 3. The base 2 is used to connect external equipment.

[0050] The clamping block 5 is fixedly connected to the orientation mechanism 4. The clamping block 5 is located on top of the orientation mechanism 4 and is used to squeeze and clamp the chip.

[0051] Working principle: Example 1: When using this device, install it in the designated location, and then insert the external drive rod into the through hole 8. As the drive rod contacts the adjusting wheel 41, the adjusting wheel 41 rotates under force and pushes the orientation mechanism 4 outward. The orientation mechanism 4 rotates around the pivot 42 under force, causing the clamping block 5 at the top of the orientation mechanism 4 to move outward and protrude from the worktable 6. After placing the semiconductor chip on the top of the worktable 6, the drive rod can be pulled out at a constant speed. After the pushing force on the orientation mechanism 4 is removed, when the elastic member 44 at the bottom of the orientation mechanism 4 is no longer under force, it will push the bottom of the orientation mechanism 4 outward through its own elastic force, causing the orientation mechanism 4 to rotate around the pivot 42, which will cause the clamping block 5 at the top to clamp the semiconductor chip on the top of the worktable 6.

[0052] Example 2: When it is necessary to disassemble this device, pull the rotating shaft 42 out from the inside of the fixed plate 43, and then pull the orientation mechanism 4 out from the inside of the groove 9. The four orientation mechanisms 4 can be disassembled in sequence by following the above operation steps.

[0053] The above are merely preferred embodiments of the present invention and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should recognize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-specification semiconductor chip automatic orientation device, characterized by: include: The main body has a groove inside; Support columns are fixedly connected to the main body; An orientation mechanism is located inside the groove and is movably connected to the main body. A clamping block is provided on the top of the orientation mechanism, and the orientation mechanism is used to clamp the semiconductor chip by force driving the clamping block. The orientation mechanism includes: An adjusting wheel is movably connected to the directional mechanism, and the adjusting wheel is used to push the directional mechanism by force; A rotating shaft is located inside the orientation mechanism, with the main body connecting the fixing plate passing through both sides of the rotating shaft. The rotating shaft is used to provide rotational limit for the orientation mechanism, and the fixing plate is used to limit the rotation of the rotating shaft. An elastic element is connected to the orientation mechanism, and the end of the elastic element away from the orientation mechanism is connected to the support column; The support column has a through hole at its bottom, and the adjusting wheel is located above the through hole; A limiting hole is provided at the bottom of the main body, and the rotating shaft passes through the limiting hole; The orientation mechanism is symmetrically distributed. The main body is provided with a worktable on top, which is located below the clamping block; The support column has a support groove on its outside, the support groove is symmetrically distributed, and the elastic element is located inside the support groove; The grooves inside the main body are interconnected; The base is fixedly connected to the bottom of the support column; The clamp is fixedly connected to the orientation mechanism.

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