A device operation data accurate collection method, a computing device and a storage medium

Abstract

The application discloses a kind of equipment operation data accurate acquisition method, computing device and storage medium, it is related to fault monitoring technical field.Equipment includes multiple components, each component corresponds to a failure model respectively, method includes: for each component, according to the failure model corresponding to the component, to determine one or more monitoring indexes of the component;According to the failure model, determine the speed interval corresponding to the operating speed of the component, and determine the acquisition duration of the component according to the speed interval;Based on the acquisition duration of the component, the operating data of the component is collected;Based on the operating data of the component, the index value of one or more monitoring indexes of the component is calculated, so as to locate the fault of the equipment according to the index value of one or more monitoring indexes of each component.The equipment operation data accurate acquisition method according to the application can accurately and efficiently collect the effective operating data of each component of the equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of fault monitoring, and in particular to a device operation data accurate collection method, a computing device and a storage medium. BACKGROUND

[0002] The crown structure is complex, mainly including a crown, a main trolley, an auxiliary trolley and the like. Among them, the crown system mainly includes a main beam, a motor, a reduction box, a shaft coupling, a wheel and a guide and the like. The main lifting in the main trolley system mainly includes a motor, a reduction box, a shaft coupling, a winding drum, a fixed pulley, a steel wire rope and the like.

[0003] Since the crown has a large number of parts, and the failure modes corresponding to different structures of the parts may be different, the fault characteristics exhibited may be different, therefore, the indexes required to be monitored and calculated for different structural parts are different. The following lists several failure modes of the crown: the main lifting motor has rolling bearing and electrical faults, the main lifting reduction box has gear and rolling bearing faults, and the winding drum has rolling bearing faults, therefore, monitoring the motor requires calculating rolling bearing and electrical frequency related indexes, monitoring the reduction box requires calculating meshing frequency and rotation frequency sideband and the like related indexes representing gear damage and rolling bearing damage related indexes, and monitoring the winding drum requires calculating rolling bearing damage related indexes.

[0004] Secondly, the transmission relationship of each part of the crown is complex, and the running speeds between different shaft systems are different, for example, the rotation speed range between the motor, the reduction box and the winding drum in the main lifting system of the crown is large, among them, the running rotation speed of the motor and the input shaft of the reduction box is relatively high, and the rotation speed is generally greater than 600 rpm; the running rotation speed of the three shafts of the reduction box is generally 50-150 rpm; the running rotation speed of the output shaft of the reduction box and the winding drum is relatively low, and the rotation speed is generally less than 30 rpm.

[0005] From the perspective of fault diagnosis monitoring feasibility, each fault needs a certain length of running data, and for the same fault, a relatively long time domain waveform needs to be collected to locate for low speed components, and a relatively short time domain waveform needs to be collected for high speed components. For example, monitoring winding drum bearing retainer failure and motor bearing retainer failure requires significantly different time domain waveform lengths (if the rotation speeds of the motor and the winding drum are 600 rpm and 30 rpm respectively, monitoring a certain fault requires about 20S of time domain waveform at the winding drum, and only 1S of time domain waveform at the motor). It can be seen that the time domain waveform length required to locate the same fault for different rotation speed shaft systems is different, and the greater the rotation speed difference, the greater the difference in the required time domain waveform length, if the rotation speed is not distinguished, and the data is collected according to the time length required to monitor the winding drum bearing retainer, a large amount of redundant data will be generated. If the data is collected according to the time length required to monitor the motor bearing retainer failure, the reduction box output shaft and the winding drum bearing retainer failure will not be monitored.

[0006] In addition, the running law of the crown block is as follows: the crown block systems exist in the case of separate running and simultaneous running, for example, the main lifting system and the trolley running system can run separately or simultaneously. The running of each system of the crown block is controlled by human operation, and in the running process, it may be affected by obstacles and other factors, resulting in randomness and intermittence of the running law of each system of the crown block, and the length of the steady state in the running process of each system is unstable. Figure 1 The schematic diagram of the main lifting speed data (second level) of the crown block is shown. Figure 1 It can be seen that the main lifting of the crown block is intermittent running and has no obvious regularity, the length of the steady state in the running process is unstable, but in a single continuous work, there is a long time of continuous steady state working condition (the continuous steady state working condition can be a working condition of continuous running for more than 20s, see the continuous running time period of 20s marked by a dot in the figure Figure 1 ), and at least twice continuous long time running, and in each continuous running process, there is basically long data, and these long time steady state running data are the basis for monitoring various faults of each part of the crown block.

[0007] In summary, for different structural parts of the crown block, different indexes need to be monitored and calculated, and the length of the time domain waveform required for positioning faults is different for different speed shafts. In addition, the crown block has randomness and the length of the steady state in the running process is unstable, which greatly increases the difficulty of collecting the running data of the crown block.

[0008] According to the existing crown block state monitoring method, the same index is calculated for all structural parts without targeted calculation of the index for different structural parts, which will inevitably calculate redundant indexes. In addition, the required collection time is not set for different speed shafts, but a unified collection time is set for all speed shafts, which will result in collection of a large amount of redundant data and failure to cover the monitoring of faults. In addition, the existing crown block vibration data collection method is either continuous collection or timed collection. The former will collect effective length of the running data of the crown block, but at the same time, a large amount of useless data will be collected. The latter reduces the amount of useless data collected to a certain extent, but due to the randomness and instability of the length of the steady state in the running process of the crown block, it cannot ensure that the effective length of the running data of the crown block is collected.

[0009] Therefore, a device running data accurate collection method is needed to solve the problems in the above technical solutions. SUMMARY

[0010] Therefore, the present application provides a device running data accurate collection method to try to solve or at least alleviate the above problems.

[0011] According to an aspect of the present application, there is provided a method for accurate collection of device operation data, executed in a computing device, the device comprising a plurality of components, each component corresponding to a failure model, the method comprising: for each component, determining one or more to-be-monitored indicators of the component according to the failure model corresponding to the component; determining a rotation speed interval corresponding to a rotation speed of the component according to the failure model, and determining a collection time length of the component according to the rotation speed interval; collecting operation data of the component based on the collection time length of the component; and calculating an indicator value of the one or more to-be-monitored indicators of the component based on the operation data of the component, so as to locate a fault of the device according to the indicator value of the one or more to-be-monitored indicators of each component.

[0012] Optionally, in the method for accurate collection of device operation data according to the present application, before collecting the operation data of the component based on the collection time length of the component, the method comprises: listening to working condition data of the device, and determining whether a current working condition of the device is a preset working condition according to the working condition data; and if the current working condition is the preset working condition, collecting the operation data of the component based on the collection time length of the component.

[0013] Optionally, in the method for accurate collection of device operation data according to the present application, the computing device is in communication connection with a working condition sensor; and listening to the working condition data of the device, and determining whether the current working condition of the device is the preset working condition according to the working condition data, comprises: controlling the working condition sensor to listen to the working condition data of the device, and determining whether the current working condition of the device is the preset working condition according to the working condition data.

[0014] Optionally, in the method for accurate collection of device operation data according to the present application, the working condition sensor is adapted to generate a first collection instruction when it is determined that the current working condition of the device is the preset working condition; and collecting the operation data of the component based on the collection time length of the component, comprises: receiving the first collection instruction sent by the working condition sensor; and in response to the first collection instruction, collecting the operation data of the component based on the collection time length of the component.

[0015] Optionally, in the method for accurate collection of device operation data according to the present application, the working condition data comprises start-stop machine state data and rotation speed data; and the preset working condition comprises a steady-state operation working condition, wherein the steady-state operation working condition is a working condition of continuous operation for more than a predetermined time length.

[0016] Optionally, in the device operation data accurate collection method according to the present application, the computing device is in communication connection with the vibration sensor, and wherein, in response to the first collection instruction, the operation data of the component is collected based on the collection time length of the component, including: in response to the first collection instruction, the vibration sensor is controlled to collect the operation data of the component based on the collection time length of the component.

[0017] Optionally, in the device operation data accurate collection method according to the present application, the method further includes: according to the first collection instruction, judging whether the vibration sensor enters a data collection state; if the vibration sensor enters the data collection state, further judging whether the working condition of the device is a preset working condition; if the working condition is not the preset working condition, controlling the vibration sensor to stop data collection.

[0018] Optionally, in the device operation data accurate collection method according to the present application, the rotation speed interval includes a high-speed interval, a medium-speed interval and a low-speed interval; the high-speed interval corresponds to a first collection time length, the medium-speed interval corresponds to a second collection time length, and the low-speed interval corresponds to a third collection time length; wherein, the first collection time length is less than the second collection time length, and the second collection time length is less than the third collection time length.

[0019] Optionally, in the device operation data accurate collection method according to the present application, the device is a crown block; and the plurality of components include: a motor, a gear box and a winding drum.

[0020] According to an aspect of the present application, there is provided a computing device, comprising: at least one processor; and a memory storing program instructions, wherein the program instructions are configured to be adapted for execution by the at least one processor, and the program instructions include instructions for executing the device operation data accurate collection method as described above.

[0021] According to an aspect of the present application, there is provided a readable storage medium storing program instructions, which, when read and executed by a computing device, cause the computing device to perform the method as described above.

[0022] According to the technical scheme of the present application, a device operation data accurate collection method is provided, corresponding failure models are configured for different components, when device operation data needs to be collected for monitoring device failure, one or more to-be-monitored indexes required by each component are determined according to the corresponding failure model of each component, and the rotation speed interval corresponding to the operation rotation speed of each component is determined, and the collection time length required by the component is determined according to the rotation speed interval. Then, when collecting device operation data, the operation data of each component is collected based on the collection time length of each component, and the index value of one or more to-be-monitored indexes of each component is calculated based on the collected operation data, so as to locate the failure of the device according to the index value of one or more to-be-monitored indexes of each component. In this way, according to the technical scheme of the present application, not only can a certain length of operation data of each component of the device be collected, but also the operation data of each component is collected according to the collection time length required by different components, which not only avoids collecting a large amount of redundant data, but also covers the data required for monitoring device failure. Moreover, the index value is calculated according to the indexes required for monitoring different components, thereby greatly reducing the index calculation amount. It can be seen that according to the technical scheme of the present application, the operation data of each component of the device can be accurately and efficiently collected.

[0023] Further, according to the technical scheme of the present application, before collecting the operation data of the component based on the collection time length of the component, the working condition data of the device needs to be monitored, and whether the current working condition of the device is a preset working condition (steady-state operation working condition) is determined according to the working condition data of the device. In this way, it can be ensured that the effective operation data of each component of the device is collected.

[0024] In summary, according to the technical scheme of the present application, the effective operation data of each component of the device can be accurately and efficiently collected, a large amount of redundant data can be avoided, and the index calculation amount is reduced, which is beneficial to accurately locating the device failure.

[0025] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, the content of the specification can be implemented, and in order to make the above and other purposes, features and advantages of the present application more obvious, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to achieve the above and related purposes, certain illustrative aspects will be described herein in connection with the following description and drawings, which indicate various ways in which the principles disclosed herein can be practiced, and all aspects and equivalents thereof are intended to fall within the scope of the claimed subject matter. The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description, taken in conjunction with the accompanying drawings. Throughout the present disclosure, the same reference numerals generally refer to the same components or elements.

[0027] Figure 1 A diagram showing main hoist rotation speed data of a crown block is shown;

[0028] Figure 2 A diagram showing a computing device 200 according to one embodiment of the present application is shown;

[0029] Figure 3 A flow diagram showing a method 300 of accurate collection of equipment operation data according to one embodiment of the present application is shown;

[0030] Figure 4 A diagram showing a system 400 of collection of equipment operation data according to one embodiment of the present application is shown. DETAILED DESCRIPTION

[0031] Example embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings. While example embodiments of the present disclosure can be susceptible to various modifications and alternative forms, example embodiments of the present disclosure are shown by way of example in the drawings and will be described in detail hereinafter with reference to the drawings. It should be understood, however, that there is no intent to limit the present disclosure to the particular example embodiments disclosed. On the contrary, the present disclosure is to cover all modifications, equivalents, and alternatives falling within the scope of the present disclosure. Like numbers refer to like elements throughout the description of the figures.

[0032] Figure 2 A diagram showing a computing device 200 according to one embodiment of the present application is shown.

[0033] As Figure 2 shown in the basic configuration 202, the computing device 200 typically includes a system memory 206 and one or more processors 204. A memory bus 208 can be used for communicating between the processor 204 and the system memory 206.

[0034] Depending on the desired configuration, the processor 204 can be of any type, including but not limited to a microprocessor (μP), a microcontroller (μC), a digital signal processor (DSP), or any combination thereof. The processor 204 can include one or more levels of caching, such as a level one cache 210 and a level two cache 212, a processor core 214, and registers 216. The example processor core 214 can include an arithmetic logic unit (ALU), a floating point unit (FPU), a digital signal processing core (DSP Core), or any combination thereof. An example memory controller 218 can also be used with the processor 204, or in some implementations the memory controller 218 can be an internal part of the processor 204.

[0035] Depending on the desired configuration, the system memory 206 can be of any type including but not limited to volatile memory (such as RAM), non-volatile memory (such as ROM, flash memory, etc.) or any combination thereof. System memory 106 can include an operating system 220, one or more applications 222, and program data 224. Application 222 is loaded in the memory and executed by the processor 204 to cause the processing system to do useful work as described herein. In some embodiments, application 222 comprises a plurality of program instructions for directing the processor 204 to operate with program data 224.

[0036] The computing device 200 can also include a storage interface bus 234. The storage interface bus 234 enables communication between the storage devices 232 (e.g., removable storage 236 and non-removable storage 238) and the basic configuration 202 via the bus / interface controller 230. The operating system 220, the application programs 222, and the program data 224 can be stored on the removable storage 236 and / or the non-removable storage 238 as described above. In some embodiments, the application programs 222 are loaded into the system memory 206 and executed by the processing unit 204 to implement techniques for providing a user interface for a mobile device as described herein.

[0037] The computing device 200 can also include a bus / interface bus 240 that facilitates communication between various interface devices (e.g., output devices 242, peripheral interfaces 244, and communication devices 246) to the basic configuration 202 via the bus / interface controller 230. Example output devices 242 include graphical displays, such as for example, a monitor or touchscreen, and audio devices, such as for example, speakers, a remote control, or an on-screen display. Example peripheral interfaces 244 include a serial interface controller 254 or a parallel interface controller 256, which can be configured to facilitate communication from or to one or more external devices, such as input devices (e.g., a keyboard, a mouse, a pen, a microphone, a touch input device, etc.) or other peripheral devices (e.g., a printer, a scanner, etc.). An example communication device 246 includes a network controller 260, which can be arranged to facilitate communications with one or more other computing devices 262 over a network communication link.

[0038] The network communication link can be one example of a communication media. Communication media can typically be embodied by computer readable instructions, data structures, program modules, and the like in a modulated data signal, such as a carrier wave or other transport mechanism, and can include any information delivery media. A "modulated data signal" can be a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal. By way of example, and not limitation, communication media can include wired media such as a wired network or direct-wired connection, and wireless media such as acoustic, radio frequency (RF), microwave, infrared (IR) and other wireless media. The term computer readable media as used herein can include both storage media and communication media.

[0039] The computing device 200 can be implemented as a personal computer including both desktop and notebook configurations. Of course, the computing device 200 can also be implemented as part of small-sized portable (or mobile) electronic devices, which can be, for example, a cellular phone, a digital camera, a personal digital assistant (PDA), a personal media player device, a wireless web browsing device, a personal head-mounted device, an application-specific device, or a hybrid device that can include any of the above functions. It can even be implemented as a server, such as a file server, a database server, an application server, and a WEB server, etc. Embodiments of the present application are not limited in this regard.

[0040] In an embodiment according to the present application, the computing device 200 is configured to perform the device operation data accurate collection method 300 according to the present application. In this embodiment, the application 222 of the computing device 200 contains a plurality of program instructions for performing the device operation data accurate collection method 300 according to the present application, which can instruct the processor to perform the device operation data accurate collection method 300 according to the present application, so that the computing device 200 performs the device operation data accurate collection method 300 according to the present application.

[0041] By performing the device operation data accurate collection method 300 according to the present application, the computing device 200 can calculate the index values for different structural components according to the required monitoring indexes, set the collection time according to the running speed intervals of different shaft systems, and ensure that the operation data is collected under the steady operation condition of the device, so that the effective operation data of each component of the device can be accurately and efficiently collected.

[0042] Figure 3 A flowchart of the device operation data accurate collection method 300 according to an embodiment of the present application is shown. The method 300 is suitable for being performed in a computing device (for example, the aforementioned computing device 200). In an embodiment, the computing device 200 can be deployed in a collection station.

[0043] Figure 4A schematic diagram of the equipment operation data collection system 400 according to an embodiment of the present application is shown. As shown in the figure, Figure 4 The equipment operation data collection system 400 includes the computing device 200, the working condition sensor 410, and the vibration sensor 430. The working condition sensor 410 and the vibration sensor 430 can be respectively arranged on the equipment to be monitored, and can be communicatively connected to the computing device 200, for example, in a wired or wireless manner.

[0044] It should be noted that the present application does not specifically limit the type of the equipment to be monitored, which can be a crown block or other complex equipment including multiple components. In an embodiment of the present application, the multiple components of the equipment (for example, the crown block) can include a motor, a gear box, a drum, a reduction box, and the like.

[0045] It should be noted that in an embodiment of the present application, the equipment (i.e., the equipment to be monitored) can include multiple components (structural components), each of which can correspond to a failure model. In other words, different structural components correspond to different failure models.

[0046] In addition, the transmission relationship in each component of the equipment can be different, and the operating speed (operating rotational speed) between different shaft systems can be different. For example, the operating rotational speed of the motor and the input shaft of the reduction box is relatively high, which is generally greater than 600 rpm; the operating rotational speed of the three shafts of the reduction box is generally 50-150 rpm; and the operating rotational speed of the output shaft of the reduction box and the drum is relatively low, which is generally less than 30 rpm. Based on this, in an embodiment of the present application, multiple different rotational speed intervals can be set, and the collection time length of each component can be determined according to the rotational speed interval corresponding to the shaft system rotational speed in each component.

[0047] As shown in the figure, Figure 3 The method 300 includes steps 310-340.

[0048] In step 310, for each component, one or more to-be-monitored indexes of the component are determined according to the failure model corresponding to the component.

[0049] It should be noted that the to-be-monitored indexes of the component are indexes that need to be monitored and calculated for the component when the equipment failure needs to be monitored. Different structural components of the equipment can correspond to different failure models, wherein the failure model includes a failure mode, and one or more to-be-monitored indexes of the component can be determined according to the failure model (failure mode) corresponding to the component.

[0050] For example, the plurality of components of the device (a crown block) can include a motor, a gear box, a winding drum, etc. The failure modes of the motor include, for example, rolling bearing failure, electrical failure, and power frequency failure. Based on this, according to the failure model (failure mode) corresponding to the motor, a plurality of monitoring indicators of the motor can be determined to include a rolling bearing indicator, an electrical indicator, and a power frequency indicator. The failure modes of the gear box include, for example, rolling bearing failure, gear failure, and power frequency failure. Based on this, according to the failure model (failure mode) corresponding to the gear box, a plurality of monitoring indicators of the gear box can be determined to include a rolling bearing indicator, a gear indicator, and a power frequency indicator. The failure modes of the winding drum include, for example, rolling bearing failure and power frequency failure. Based on this, according to the failure model (failure mode) corresponding to the winding drum, a plurality of monitoring indicators of the winding drum can be determined to include a rolling bearing indicator and a power frequency indicator.

[0051] In step 320, for each component, a rotation speed interval corresponding to the running rotation speed (i.e., the rotation speed of the shaft system in the component) of the component is determined according to the failure model of the component, and the collection time length of the component is determined according to the rotation speed interval. The collection time length of the component determined here is the time length of the running data that needs to be collected for the component.

[0052] It should be noted that the failure model includes the failure mode and also includes the collection model corresponding to the failure mode. Thus, after determining one or more monitoring indicators of a component according to the failure mode of the failure model corresponding to the component, the rotation speed interval corresponding to the running rotation speed of the component can be further determined according to the collection model of the failure model, and the collection time length corresponding to the rotation speed interval is determined as the collection time length of the component.

[0053] In an embodiment, a plurality of different rotation speed intervals are pre-set, and the collection time length corresponding to each rotation speed interval is reasonably configured according to the relationship between the rotation speed and the collection time length. It should be noted that the running rotation speed and the collection time length are negatively correlated, that is, the higher the running rotation speed of the component, the shorter the collection time length required for collecting the running data; the lower the running rotation speed of the component, the longer the collection time length required for collecting the running data.

[0054] Specifically, the rotation speed interval includes, for example, a high-speed interval, a medium-speed interval, and a low-speed interval. The high-speed interval corresponds to a first collection time length, the medium-speed interval corresponds to a second collection time length, and the low-speed interval corresponds to a third collection time length. Among them, the first collection time length is less than the second collection time length, and the second collection time length is less than the third collection time length.

[0055] Based on this, when the collection time length of the component is determined according to the rotating speed interval corresponding to the operating rotating speed of the component, it can be specifically determined whether the operating rotating speed of the component corresponds to the high-speed interval, the medium-speed interval or the low-speed interval. If the rotating speed interval corresponding to the operating rotating speed of the component is the high-speed interval, the collection time length of the component is determined as the first collection time length. If the rotating speed interval corresponding to the operating rotating speed of the component is the medium-speed interval, the collection time length of the component is determined as the second collection time length. If the rotating speed interval corresponding to the operating rotating speed of the component is the low-speed interval, the collection time length of the component is determined as the third collection time length.

[0056] For example, according to the failure model (collection model) corresponding to the motor, it can be determined that the rotating speed interval corresponding to the operating rotating speed of the motor is the high-speed interval, so that the collection time length of the motor is determined as the relatively short first collection time length. According to the failure (collection model) corresponding to the winding drum, it can be determined that the rotating speed interval corresponding to the operating rotating speed of the winding drum is the low-speed interval, so that the collection time length of the winding drum is determined as the relatively long third collection time length.

[0057] Next, in step 330, for each component of the device, the operating data of the component can be collected based on the collection time length of the component. Specifically, the operating data can be vibration data. In an implementation manner, by deploying a vibration sensor 430 in communication connection with the computing device 200 on the component, the vibration data (operating data) of the component can be collected by using the vibration sensor 430.

[0058] Finally, in step 340, for each component of the device, the index value of one or more to-be-monitored indexes of the component can be calculated based on the operating data of the component. In this way, the faults of the components of the device can be located according to the index values of the one or more to-be-monitored indexes of each component. That is, the fault positions of the components in the device can be determined according to the index values of each to-be-monitored index of each component.

[0059] In this way, the device operating data accurate collection method 300 according to the present application not only can meet the collection of a certain length of operating data for each component of the device, but also can collect the operating data of different components according to the required collection time length, which not only avoids the collection of a large amount of redundant data, but also can cover the data required for monitoring the faults of the device. Moreover, the present application calculates the index values according to the indexes required to be monitored by different components, thereby reducing the calculation amount. It can be seen that the technical scheme according to the present application can realize the accurate and efficient collection of the operating data of each component of the device.

[0060] According to one embodiment of the present application, in order to ensure that valid operation data is collected, before step 330 is performed, i.e., before the operation data of the components is collected based on the collection time length of the components, the working condition data of the device is monitored, and it is determined whether the current working condition of the device is a preset working condition according to the working condition data of the device. Here, it should be noted that the preset working condition is a working condition in which valid operation data can be collected. By determining whether the current working condition of the device is the preset working condition, it can be determined whether the current working condition of the device meets the condition for collecting valid operation data.

[0061] If it is determined that the current working condition of the device is the preset working condition, it means that the current working condition of the device meets the condition for collecting valid operation data, and thus step 330 can be performed under the current working condition, i.e., the operation data of the components is collected based on the collection time length of each component. In this way, it can be ensured that valid operation data of each component of the device is collected.

[0062] In one embodiment, the working condition data includes start-stop state data and rotation speed data. The preset working condition includes a steady-state operation working condition. That is, if it is determined that the current working condition of the device is the steady-state operation working condition, the condition for collecting valid operation data is met, and the operation data of each component of the device can be collected under the current working condition (the steady-state operation working condition) to ensure that valid operation data (i.e., steady-state operation data) is collected.

[0063] In one embodiment, the steady-state operation working condition can specifically be a working condition in which the device is continuously operated for more than a predetermined time length. It can be understood that under the working condition in which the device is continuously operated for more than a predetermined time length (the steady-state operation working condition), it can be ensured that valid operation data (steady-state operation data) is collected for a valid time length. In one implementation, the predetermined time length is, for example, 20S.

[0064] In addition, in one embodiment, the steady-state operation working condition can be determined as a working condition in which the device is continuously operated for more than a predetermined time length at least twice. In this way, it can be further ensured that valid steady-state operation data is collected.

[0065] In one embodiment, the computing device 200 is in communication connection with the working condition sensor 410. The computing device 200 can control the working condition sensor 410 to monitor the working condition data of the device and determine whether the current working condition of the device is a preset working condition according to the working condition data.

[0066] Here, the working condition sensor 410 can be used to monitor the working condition data of the device in real time and determine the current working condition of the device according to the working condition data. The working condition includes, for example, start-stop state, operation rotation speed range, steady-state condition, etc.

[0067] In one embodiment, when the working condition sensor 410 determines that the current working condition of the device is the preset working condition, the working condition sensor 410 can generate a first collection instruction and send the first collection instruction to the computing device 200. When the computing device 200 receives the first collection instruction sent by the working condition sensor 410, the computing device 200 executes step 330 in response to the first collection instruction: collecting the operation data of each component based on the collection duration of each component.

[0068] In one embodiment, the working condition sensor 410 can be a motor working condition sensor, and the computing device 200 is communicatively connected with the motor working condition sensor, for example, can be communicatively connected in a wireless manner, so that the computing device 200 can control the motor working condition sensor to collect the motor working condition data of the device. It should be noted that the motor working condition sensor is self-provided with a start-stop machine judgment and rotation speed calculation module, by deploying the motor working condition sensor on the motor, the start-stop machine state and the rotation speed of the motor can be monitored in real time through the motor working condition sensor, and whether the current working condition of the device is the preset working condition can be determined based on the start-stop machine state and the rotation speed of the motor.

[0069] In one embodiment, by deploying the vibration sensor 430 on each component of the device, the computing device 200 is communicatively connected with the vibration sensor 430 deployed on the component, for example, can be communicatively connected in a wireless manner, so that the vibration sensor 430 can be used to collect the operation data (i.e., vibration data) of the component. Specifically, when the computing device 200 receives the first collection instruction sent by the working condition sensor 410, the computing device 200 can send a second collection instruction to the vibration sensor 430 in response to the first collection instruction, so that the vibration sensor 430 can be controlled to collect the operation data (vibration data) of the component based on the collection duration of the component.

[0070] In addition, in one embodiment, after the computing device 200 receives the first collection instruction sent by the working condition sensor 410, the computing device 200 can first determine whether the vibration sensor 430 enters a data collection state according to the first collection instruction.

[0071] If the vibration sensor 430 enters the data collection state, during the data collection process of the vibration sensor 430 on the component, the computing device 200 can further determine whether the working condition of the device is the preset working condition. Specifically, the computing device 200 can control the working condition sensor 410 to collect the working condition data, and determine whether the working condition of the device is the preset working condition according to the working condition data.

[0072] In addition, if the working condition of the device is not the preset working condition during the data collection process, the computing device 200 can control the vibration sensor 430 to stop the data collection, so as to stop collecting the operation data of the corresponding component.

[0073] In one implementation, the motor operating condition sensor is a wireless sensor. When collecting motor operating condition data, the sensor can employ continuous acquisition to determine the motor's start-stop status in real time and perform continuous second-level calculations of the rotational speed. Thus, the output motor operating speed is a second-level value. Specifically, within a predetermined time period for starting data acquisition, the motor operating condition sensor can continuously determine and calculate the start-stop status and rotational speed within that time period. After the predetermined time period, continuous second-level calculations cease. Here, the predetermined time can be, for example, 3 hours, 5 hours, etc. This invention does not limit the predetermined time; it can be set by those skilled in the art according to actual needs.

[0074] In addition, the motor condition sensor can also use a discontinuous acquisition method to collect motor condition data, without performing continuous second-level calculations on the motor start / stop status and speed. The vibration sensor 430 can be periodically woken up and actively communicates with the computing device 200. Before the vibration sensor 430 is woken up, the motor condition sensor can use a discontinuous acquisition method to judge and calculate the start / stop status data and speed value (motor condition data) before wake-up to determine whether the current operating condition of the equipment meets the preset operating condition. If it is determined that the current operating condition of the equipment is the preset operating condition, the motor condition sensor can generate a first acquisition command and send it to the computing device 200. After receiving the first acquisition command, the computing device 200 can first determine whether the vibration sensor 430 has entered the data acquisition state. If it is determined that the vibration sensor 430 has entered the data acquisition state, the motor condition sensor can then perform continuous second-level judgments and calculations on the motor start / stop status and speed.

[0075] It should be noted that during actual monitoring of equipment malfunctions and the collection of equipment operation data, continuous and non-continuous acquisition methods can be switched. Continuous acquisition allows for the acquisition of continuous rotational speed values ​​within a predetermined timeframe by issuing commands during equipment operation. However, continuous acquisition is a temporary action; during the collection of operational data, non-continuous acquisition is still the primary method.

[0076] It should be understood that by switching between continuous and non-continuous data acquisition, the battery power consumption of the operating condition sensor 410 is saved while ensuring sufficient operating condition data is collected.

[0077] In one implementation, the first acquisition command from the motor condition sensor (wireless sensor) to the computing device 200 includes two types: acquisition and sleep. The motor condition sensor can adopt a condition monitoring mode (corresponding to the acquisition of condition data). Specifically, the motor condition sensor can monitor the start-stop status of the motor at the second level and monitor the speed condition during the operation of the vibration sensor 430.

[0078] In addition, the high-density monitoring mode can also be adopted. Specifically, after the vibration sensor 430 is woken up in a regular monitoring mode (for example, the device can be woken up once every S minutes), whether to enter the high-density monitoring mode can be determined according to the current working condition of the device and the vibration data collection condition. Here, the high-density monitoring mode can be, for example, that the device is woken up once every N seconds, where N seconds is much smaller than S minutes, indicating that the high-density wake-up frequency is much higher than the regular wake-up frequency.

[0079] It should be noted that the wireless vibration data collection method in cooperation with the working condition monitoring mode and the high-density monitoring mode greatly improves the probability of capturing effective operation data, and saves the battery power consumption of the vibration sensor.

[0080] In other implementations, the motor working condition sensor and the vibration sensor 430 can both be wired sensors. The working condition data collection logic is as follows: the motor working condition sensor determines the motor start-stop state in real time, performs second-level speed calculation and generates a first collection instruction, and uploads the first collection instruction to the computing device 200. Subsequently, the computing device 200 determines whether the vibration sensor 430 enters the data collection state according to the first collection instruction. When it is determined that the vibration sensor 430 enters the data collection state, the motor working condition sensor can determine the motor start-stop state in seconds and calculate the speed in seconds. If there is a situation that does not meet the preset working condition during the data collection process, including stop, the vibration data collection is immediately stopped.

[0081] The vibration data collection logic is as follows: the vibration sensor 430 can communicate with the computing device 200 in real time and can receive the second collection instruction of the computing device 200. Here, in the case where the vibration sensor 430 does not receive the second collection instruction issued by the computing device 200, no vibration data is collected; when the vibration sensor 430 receives the second collection instruction issued by the computing device 200, the vibration sensor 430 collects the vibration data of the corresponding component according to the preset collection definition on the basis of the failure model in response to the second collection instruction.

[0082] The device operation data accurate collection method 300 according to the present application is configured with a corresponding failure model for different components, when device failure needs to be monitored and device operation data needs to be collected, first, according to the corresponding failure model of each component, one or more to-be-monitored indexes required by each component are determined, and the rotation speed interval corresponding to the rotation speed of each component is determined, and the collection time length required by the component is determined according to the rotation speed interval. Then, when collecting the device operation data, the operation data of each component is collected based on the collection time length of each component, and the index value of one or more to-be-monitored indexes of each component is calculated based on the collected operation data, so as to locate the failure of the device according to the index value of one or more to-be-monitored indexes of each component. In this way, according to the technical solution of the present application, not only can the operation data of length be collected for each component of the device, but also the operation data of each component can be collected according to the collection time length required by different components, which not only avoids collecting a large amount of redundant data, but also covers the data required for monitoring device failure. Moreover, the index value is calculated according to the indexes required for monitoring different components, thereby greatly reducing the index calculation amount. It can be seen that, according to the technical solution of the present application, the operation data of each component of the device can be accurately and efficiently collected.

[0083] Further, according to the technical solution of the present application, before the operation data of the component is collected based on the collection time length of the component, the working condition data of the device needs to be monitored, and whether the current working condition of the device is a preset working condition (steady-state operation working condition) is determined according to the working condition data of the device. In this way, it can be ensured that the effective operation data of each component of the device is collected.

[0084] In summary, according to the technical solution of the present application, the effective operation data of each component of the device can be accurately and efficiently collected, a large amount of redundant data can be avoided, and the index calculation amount is reduced, which is beneficial to accurately locating the failure of the device.

[0085] The various techniques described herein can be implemented in connection with hardware or software or, where appropriate, with a combination of hardware / software. Thus, the methods and apparatus of the present application, or certain aspects or portions thereof, can take the form of program code (i.e., instructions) embodied in tangible media, such as movable disks, USB, floppy disks, CD-ROMs, or any other machine-readable storage medium wherein, when the program code is loaded into an apparatus, such as a computer, the apparatus becomes an implementation of the present application for practicing the aspects of the present application.

[0086] In the case where the program code is executed on a programmable computer, the mobile terminal generally includes a processor, a storage medium readable by the processor (including volatile and non-volatile memory and / or storage elements), at least one input device, and at least one output device. The storage medium is configured to store program code, which is executed by the processor for carrying out the methods of the present application. The program code may

[0087] By way of example, and not limitation, a readable medium includes a readable storage medium and a communication medium. The readable storage medium stores information such as computer readable instructions, data structures, program modules or other data. The communication medium conveys program code, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media. Combinations of the any of the above are also included within the scope of readable media.

[0088] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application can be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been described in detail in order to not obscure the understanding of this description.

[0089] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application can be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been described in detail in order to not obscure the understanding of this description.

[0090] Similarly, it is to be understood that the above description is one example of inventive aspects of the present application and that not all of these aspects necessarily have to be implemented. Other implementations, uses and advantages of the application will be apparent to those skilled in the art from the description.

[0091] Those skilled in the art will understand that the modules, or units, or components of the devices in the examples disclosed herein can be arranged in a device as described in the examples, or alternatively can be located in one or more devices different from the devices in the examples. The modules in the foregoing examples can be combined into one module or further divided into multiple sub-modules.

[0092] Those skilled in the art will appreciate that the modules in the apparatuses in the embodiments can be adapted and placed in one or more apparatuses other than the embodiments. The modules or units or components in the embodiments can be combined into one module or unit or component, and furthermore can be divided into multiple sub-modules or sub-units or sub-components.

[0093] Furthermore, those skilled in the art will appreciate that the features of the various embodiments described herein are not mutually exclusive and can be combined in different embodiments.

[0094] Furthermore, some of the embodiments described herein are described as a method or combination of elements of a method implementable by a processor of a computer system or by other means of carrying out the function described by the method elements. Accordingly, a processor with the necessary instructions for carrying out such a method or element of a method forms a means for carrying out the method or element of a method. Furthermore, an element of a method described herein functionally implements a means for implementing the corresponding function that is performed by an element of the method for the purpose of carrying out the invention.

[0095] As used herein, the ordinal numbers "first", "second", "third" etc. to describe common objects merely mean different instances of similar objects and are not intended to imply that the objects described must have a given order in time, space, ranking or in any other manner, unless otherwise specified.

[0096] While the present application has been described in connection with a limited number of embodiments, those skilled in the art will appreciate that other embodiments are possible. For example, the application is not limited to the embodiments described above but can be used in other embodiments. Furthermore, it should be noted that the language used in the specification has been principally selected for readability and instructional purposes and can not have been selected to expressly convey all necessary elements of the application.

Claims

1. A method for accurately acquiring equipment operation data, executed in a computing device, wherein the equipment includes multiple components, each component corresponding to a failure model, the failure model including a failure mode and a corresponding acquisition model, the equipment being an overhead crane, and the multiple components including a motor, gearbox, drum, and reduction gearbox, the operating speeds of the various components differing, the method comprising: For each component, one or more monitoring indicators are determined based on the failure mode of the failure model corresponding to the component. Based on the acquisition model of the failure model, the speed range corresponding to the operating speed of the component is determined, and the acquisition duration of the component is determined based on the speed range. The speed range includes a high-speed range, a medium-speed range, and a low-speed range. The high-speed range corresponds to a first acquisition duration, the medium-speed range corresponds to a second acquisition duration, and the low-speed range corresponds to a third acquisition duration. The first acquisition duration is less than the second acquisition duration, and the second acquisition duration is less than the third acquisition duration. The system monitors the operating data of the device and determines whether the current operating condition of the device is a preset operating condition based on the operating data. If it is a preset operating condition, the system collects the operating data of the component based on the collection time of the component. The operating data includes start-stop status data and speed data. The preset operating condition is a steady-state operating condition, wherein the steady-state operating condition is an operating condition that has been running continuously for a predetermined time or more. Based on the operational data of the components, the index values ​​of one or more monitored indicators of the components are calculated in order to locate the faults of the equipment according to the index values ​​of one or more monitored indicators of each component.

2. The method as described in claim 1, wherein, The computing device is communicatively connected to the operating condition sensor; Monitoring the operating condition data of the device, and determining whether the current operating condition of the device is a preset operating condition based on the operating condition data, including: The operating condition sensor is controlled to monitor the operating condition data of the device, and the current operating condition of the device is determined based on the operating condition data to determine whether the current operating condition of the device is a preset operating condition.

3. The method as described in claim 2, wherein, The operating condition sensor is adapted to generate a first acquisition command when it determines that the current operating condition of the device is a preset operating condition; Based on the acquisition time of the component, the operating data of the component is acquired, including: Receive the first acquisition command sent by the operating condition sensor; In response to the first acquisition command, the operating data of the component is acquired based on the acquisition duration of the component.

4. The method according to any one of claims 1-3, wherein, The computing device is communicatively connected to the vibration sensor, wherein, in response to the first acquisition command, based on the acquisition duration of the component, the device acquires operational data of the component, including: In response to the first acquisition command, the vibration sensor is controlled to acquire the operating data of the component based on the acquisition duration of the component.

5. The method of claim 4, wherein, The method further includes: Based on the first acquisition command, it is determined whether the vibration sensor has entered the data acquisition state; If the device enters the data acquisition state, it is further determined whether the device's operating condition is the preset operating condition. If the operating conditions are not preset, the vibration sensor will be controlled to stop data acquisition.

6. A computing device, comprising: At least one processor; as well as A memory storing program instructions, wherein the program instructions are configured to be executed by the at least one processor, the program instructions including instructions for performing the method as described in any one of claims 1-5.

7. A readable storage medium storing program instructions that, when read and executed by a computing device, cause the computing device to perform the method as described in any one of claims 1-5.

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