A multi-beam antenna without beamforming network

Abstract

The present invention discloses a multi-beam antenna that does not require a beamforming network, comprising an antenna layer, an adhesive layer, and a feed layer that are sequentially bonded together, the antenna layer being provided with a plurality of in-band full-duplex antenna units, the upper surface of the antenna layer being provided with a surface wave suppression unit, the in-band full-duplex antenna units being arranged along the length of the antenna layer, the upper surface of the feed layer being provided with a metal floor, the lower surface of the feed layer being provided with a first series feed network and a second series feed network, the first series feed network and the second series feed network being connected to the in-band full-duplex antenna units via vias, respectively. The present invention can generate four radiation beams with different directions, and can achieve the performance of a multi-beam antenna based on a Butler matrix beamforming network. Moreover, since there is no need to adopt a beamforming network, the structure can be significantly simplified, thereby significantly reducing the size of the entire antenna, making it more suitable for the high integration requirements of the next generation of mobile communication systems. The present invention is widely used in the field of antenna technology.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a multi-beam antenna that does not require a beamforming network. Background Art

[0002] With the advancement of wireless communication technology and the rise of various wireless applications, the demand for mobile communication transmission speeds has exploded. 5G mobile communication systems, with their high speeds, low latency, and massive connectivity, will become the foundation for the future interconnectedness of everything. Multi-beam antenna technology, a key technology in 5G mobile communication systems, achieves spatial coverage by generating multiple narrow beams with different directions. Multi-beam antennas not only increase gain and compensate for transmission path loss, but also enable spatial multiplexing, improving spectrum efficiency.

[0003] Existing multi-beam antennas are generally implemented in two ways: active and passive. Active multi-beam antennas typically use phased arrays. Phased arrays are implemented by equipping each antenna element with an independent RF link, which adjusts the amplitude and phase of each antenna element to adjust the direction of the composite beam. While phased arrays offer flexible beam steering, their application is often limited by high hardware costs and power consumption. Passive multi-beam antennas are primarily implemented using various methods, such as passive beamforming networks, lenses, reflector arrays, and transmission arrays. Compared to these other methods, multi-beam antennas based on passive beamforming networks can be manufactured using planar circuits, resulting in greater miniaturization and improved system integration. However, current passive beamforming networks suffer from drawbacks such as large size, which severely limits the application scenarios of these antennas. Summary of the Invention

[0004] In view of the technical problems of the current passive beamforming network technology, such as being too large, the object of the present invention is to provide a multi-beam antenna that does not require a beamforming network.

[0005] An embodiment of the present invention includes a multi-beam antenna that does not require a beamforming network, comprising an antenna layer, an adhesive layer, and a feed layer, wherein the antenna layer, the adhesive layer, and the feed layer are sequentially attached;

[0006] The antenna layer is provided with a plurality of in-band full-duplex antenna units, and a surface wave suppression unit is provided on the upper surface of the antenna layer, and the in-band full-duplex antenna units are arranged along the length direction of the antenna layer; wherein the upper surface of the antenna layer is the side away from the adhesive layer, and the lower surface of the antenna layer is the side facing the adhesive layer;

[0007] A metal floor is provided on the upper surface of the feed layer, and a first series feed network and a second series feed network are provided on the lower surface of the feed layer, and the first series feed network and the second series feed network are respectively connected to each of the in-band full-duplex antenna units through vias; wherein, the upper surface of the feed layer is the side facing the adhesive layer, and the lower surface of the feed layer is the side away from the adhesive layer.

[0008] Furthermore, the in-band full-duplex antenna unit includes a folded branch patch and a rectangular patch; the folded branch patch is located on the upper surface of the antenna layer, and the rectangular patch is located on the lower surface of the antenna layer; in the same in-band full-duplex antenna unit, the rectangular patch is located within the projection range of the folded branch patch.

[0009] Furthermore, in the same in-band full-duplex antenna unit, the folded branch patch and the rectangular patch are connected via a group of metallized connection vias; the metallized connection vias pass through the antenna layer.

[0010] Furthermore, the first series feed network includes a first microstrip line, a plurality of first branch lines are provided on the first microstrip line, each of the first branch lines corresponds to each of the folded branch patches, an end of each of the first branch lines is located within the projection range of the corresponding folded branch patch, and an end of each of the first branch lines is connected to the corresponding folded branch patch through a first metallized feed via; the first metallized feed via passes through the antenna layer, the adhesive layer, and the feed layer;

[0011] The second series feed network includes a second microstrip line, on which a plurality of second branch lines are provided, each of the second branch lines corresponding one-to-one to each of the folded branch patches, and the ends of each of the second branch lines are located within the projection range of the corresponding folded branch patches, and the ends of each of the second branch lines are connected to the corresponding folded branch patches through second metallized feed vias; the second metallized feed vias pass through the antenna layer, the adhesive layer and the feed layer.

[0012] Furthermore, in the upper surface of the feed layer, a circular area is provided around the position penetrated by the first metallized feed via or the second metallized feed via, and the circular area is formed by the missing portion of the metal floor, and the circular area and the surrounded first metallized feed via or the second metallized feed via have a common center.

[0013] Furthermore, one end of the first microstrip line serves as the first port of the multi-beam antenna, the other end of the first microstrip line serves as the second port of the multi-beam antenna, one end of the second microstrip line serves as the third port of the multi-beam antenna, and the other end of the second microstrip line serves as the fourth port of the multi-beam antenna.

[0014] Furthermore, the first series-fed network is provided with a plurality of first phase-shifting units, and the second series-fed network is provided with a plurality of second phase-shifting units, the number of the first phase-shifting units is the same as the number of the second phase-shifting units, and the phase-shifting characteristics of the first phase-shifting units are different from the phase-shifting characteristics of the second phase-shifting units.

[0015] Furthermore, the first phase shift unit is a U-shaped structure, and the second phase shift unit is an M-shaped structure.

[0016] Furthermore, the surface wave suppression unit includes two long strip patches, each of which is arranged on both sides of each in-band full-duplex antenna unit; each of the long strip patches extends along the length direction of the antenna layer; each of the long strip patches is provided with a metallized via array, and the metallized via array is arranged along the extension direction of the long strip patch; the metallized via array passes through the antenna layer and the adhesive layer, and the metallized via array is connected to the metal floor.

[0017] Furthermore, the material of the antenna layer is Rogers 5880, the material of the feed layer is Rogers 5880, the material of the adhesive layer is Rogers 4450F, and the adhesive layer is a prepreg.

[0018] The beneficial effects of the present invention are as follows: the multi-beam antenna in the embodiment that does not require a beamforming network uses two series-fed networks with different phase differences to excite a multi-unit in-band full-duplex antenna array. When signals are input from four ports respectively, the multi-beam antenna can generate four radiation beams with different directions respectively, and the performance is similar to that of a traditional multi-beam antenna based on a Butler matrix beamforming network; however, since there is no need to use a beamforming network, the structure of the multi-beam antenna in the embodiment can be significantly simplified, thereby significantly reducing the size of the entire antenna, which is more suitable for the high integration requirements of the next generation mobile communication system. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is an overall structural diagram of a multi-beam antenna without a beamforming network in an embodiment;

[0020] Figure 2 is a schematic diagram of the upper surface of the antenna layer in an embodiment;

[0021] Figure 3is a schematic diagram of the lower surface of the antenna layer in an embodiment;

[0022] Figure 4 is a schematic diagram of the upper surface side of the feed layer in an embodiment;

[0023] Figure 5 A schematic diagram of the lower surface of the feed layer in this embodiment;

[0024] Figure 6 is a schematic diagram of the adhesive layer in the embodiment;

[0025] Figure 7 Schematic diagram of simulation and test scattering parameters when the first port is excited in the embodiment;

[0026] Figure 8 Schematic diagram of simulation and test scattering parameters when the third port is excited in the embodiment;

[0027] Figure 9 Schematic diagram of simulation and test patterns when the first port to the fourth port are excited respectively in the embodiment;

[0028] Figure 10 Schematic diagram of simulation and test gain and simulation directivity when the first port and the third port are excited respectively in the embodiment;

[0029] Figure 11 Schematic diagram of simulation efficiency when the first port and the third port are excited respectively in the embodiment;

[0030] Reference numerals:

[0031] a——antenna layer; b——adhesive layer; c——feed layer; 1——in-band full-duplex antenna unit; 3——metal floor; 11——folded branch patch; 12a——first feed metallized via; 12b——second feed metallized via; 13——metallized connection via; 14——long strip patch; 15——metallized via array; 16——rectangular patch; 31——circular area; 310——first series feed network; 311——first phase shifter; 312——first microstrip line; 320——second series feed network; 321——second phase shifter; 322——second microstrip line; 35——first branch line; 36——second branch line. DETAILED DESCRIPTION

[0032] The Butler matrix is one of the most widely used passive beamforming networks. Traditional Butler matrices typically combine different passive microwave components. When different inputs are stimulated, different gradient phase differences are achieved at the output. For example, the most common 4×4 Butler matrix requires four couplers, two cross-junctions, and four phase shifters. Consequently, traditional multi-beam antennas based on Butler matrices are often oversized, typically exceeding 10λ. 2 This severely limits the application scenarios of this type of antenna. Particularly in the 5G millimeter wave frequency band, the excessively large antenna size significantly increases the difficulty of system integration. Therefore, while achieving multi-beam performance, simplifying or even eliminating the beamforming network is one of the most pressing issues facing current multi-beam antenna technology.

[0033] Based on the above principles, this embodiment provides a multi-beam antenna that does not require a beamforming network. Figure 1 , a multi-beam antenna without a beamforming network includes an antenna layer (a), an adhesive layer (b) and a feeding layer (c).

[0034] In this embodiment, the side of the antenna layer (a) away from the adhesive layer (b) (eg Figure 1 The side shown in FIG. 1 is called the upper surface of the antenna layer (a), and the other side of the antenna layer (a), that is, the side facing the adhesive layer (b), is called the lower surface of the antenna layer (a); the side of the feed layer (c) facing the adhesive layer (b) (e.g. Figure 1 The side shown in the figure is called the upper surface of the feed layer (c), and the other side of the feed layer (c), that is, the side away from the adhesive layer (b), is called the lower surface of the feed layer (c).

[0035] In this embodiment, the antenna layer (a) is made of Rogers 5880, with a thickness of 0.787mm; the feed layer (c) is made of Rogers 5880, with a thickness of 0.254mm; and the adhesive layer (b) is made of Rogers 4450F, with a thickness of 0.1mm. The adhesive layer (b) is a prepreg that provides adhesion. The antenna layer (a), adhesive layer (b), and feed layer (c) are tightly pressed together from top to bottom using a multi-layer PCB lamination process.

[0036] Figure 1 This is a schematic diagram of the overall structure of a multi-beam antenna without a beamforming network in this embodiment. Figure 1The antenna layer (a) is provided with a plurality of in-band full-duplex antenna units (1), the upper surface of the antenna layer (a) is provided with a surface wave suppression unit, and the in-band full-duplex antenna units (1) are arranged along the length direction of the antenna layer (a). The upper surface of the feed layer (c) is provided with a metal floor (3), and the lower surface of the feed layer (c) is provided with a first series feed network (310) and a second series feed network (320), and the first series feed network (310) and the second series feed network (320) are respectively connected to the in-band full-duplex antenna units (1) through vias.

[0037] Figure 2 is a schematic diagram of the upper surface of the antenna layer (a) in this embodiment. Figure 3 This is a schematic diagram of the lower surface of the antenna layer (a) in this embodiment. Figure 2 , the upper surface of the antenna layer (a) is made of four folded branch patches (11) using PCB technology, and the lower surface of the antenna layer (a) is made of four rectangular patches (16) using PCB technology. Figure 2 and Figure 3 For any folded branch patch (11), if it is projected onto the plane where the antenna layer (a) is located, there will be a rectangular patch (16) located within the projection range of this folded branch patch (11), that is, each folded branch patch (11) has a corresponding rectangular patch (16), and this folded branch patch (11) and the corresponding rectangular patch (16) constitute an in-band full-duplex antenna unit (1).

[0038] Reference Figure 1 、 Figure 2 and Figure 3 The four in-band full-duplex antenna units (1) form a linear array, and the four in-band full-duplex antenna units (1) are arranged along the length direction of the antenna layer (a). Since at an operating frequency of 28 GHz, when the wavelength is λ, the length corresponding to 0.61λ is 6.5 mm, the center distance between two adjacent in-band full-duplex antenna units (1) can be set to 6.5 mm in this embodiment.

[0039] Reference Figure 2 , an array of three metallized connection vias (13) is made in the center of each folded branch patch (11), the upper ends of the three metallized connection vias (13) are connected to the folded branch patch (11), and the metallized connection vias (13) pass through the antenna layer (a). Figure 3, the lower ends of the three metalized connection vias (13) are connected to the rectangular patch (16) corresponding to the folded branch patch (11). The folded branch patch (11), the three metalized connection vias (13) and the corresponding rectangular patch (16) constitute a fence-shaped structure as a whole, that is, an in-band full-duplex antenna unit (1). When the antenna operating frequency is around 28 GHz, the fence-shaped structure can be equivalent to a short circuit, which can enable the folded branch patch (11) to operate in half TM 12 model.

[0040] Reference Figure 1 and Figure 2 The surface wave suppression unit includes two long strip patches (14) printed on the upper surface of the antenna layer (a). The two long strip patches (14) are respectively arranged on both sides of each in-band full-duplex antenna unit (1) and extend along the length direction of the antenna layer (a). Each long strip patch (14) is provided with a metallized via array (15), and the metallized via array (15) is arranged along the extension direction of the long strip patch (14). The metallized via array (15) passes through the antenna layer (a) and the adhesive layer (b) and extends to connect with the metal floor (3), so that the surface wave suppression unit is connected to the metal floor (3) through the metallized via array (15). By providing the surface wave suppression unit, the surface wave on the upper surface of the antenna layer (a) can be suppressed.

[0041] Figure 4 is a schematic diagram of the upper surface side of the feed layer (c) in this embodiment, Figure 5 Schematic diagram of the lower surface of the feeding layer (c) in this embodiment.

[0042] Reference Figure 4 The upper surface of the feed layer (c) is made into a metal floor (3) through PCB process. Figure 5 A first series feed network (310) and a second series feed network (320) are manufactured on the lower surface of the feed layer (c) through a PCB process.

[0043] Reference Figure 5The main part of the first series feed network (310) is a first microstrip line (312). Four first branch lines (35) are provided on the first microstrip line (312). Each first branch line (35) corresponds to each folded branch patch (11) one by one. The end of each first branch line (35) is located within the projection range of the corresponding folded branch patch (11). For example, for any folded branch patch (11), if it is projected onto the plane where the feed layer (c) is located, then there will be an end of a first branch line (35) located within the projection range of this folded branch patch (11), that is, each folded branch patch (11) has a corresponding first branch line (35) end, and this folded branch patch (11) is connected to the corresponding first branch line (35) end through a first metallized feed via that sequentially penetrates the antenna layer (a), the adhesive layer (b) and the feed layer (c).

[0044] Similarly, refer to Figure 5 The main part of the second series feed network (320) is a second microstrip line (322). Four second branch lines (36) are provided on the second microstrip line (322). Each second branch line (36) corresponds to each folded branch patch (11) one by one. The end of each second branch line (36) is located within the projection range of the corresponding folded branch patch (11). For example, for any folded branch patch (11), if it is projected onto the plane where the feed layer (c) is located, then there will be an end of the second branch line (36) located within the projection range of this folded branch patch (11), that is, each folded branch patch (11) has a corresponding end of the second branch line (36). This folded branch patch (11) is connected to the end of the corresponding second branch line (36) through a second metallized feeding via that sequentially penetrates the antenna layer (a), the adhesive layer (b) and the feed layer (c).

[0045] Reference Figure 4 , a portion of the metal material is removed from the metal floor (3) on the upper surface of the feed layer (c), thereby forming eight circular areas (31), and the eight circular areas (31) respectively have the same center as the four first feed metallized vias (12a) and the four second feed metallized vias (12b). By providing the same number of circular areas (31) as the total number of the first feed metallized vias (12a) and the second feed metallized vias (12b), the first feed metallized vias (12a) and the second feed metallized vias (12b) are not directly electrically connected to the metal floor (3), so that the signal on the feed layer (c) can be transmitted to the antenna layer (a), feeding the four in-band full-duplex antenna units (1), thereby stimulating the in-band full-duplex antenna units (1) to generate radiation.

[0046] In this embodiment, one end of the first microstrip line (312) serves as the first port of the multi-beam antenna, the other end of the first microstrip line (312) serves as the second port of the multi-beam antenna, one end of the second microstrip line (322) serves as the third port of the multi-beam antenna, and the other end of the second microstrip line (322) serves as the fourth port of the multi-beam antenna.

[0047] In this embodiment, refer to Figure 5 In the four first branch lines (35) on the first series feed network (310), there is a first phase shift unit (311) between every two sections of the first branch lines (35), that is, the first series feed network (310) has a total of three first phase shift units (311). The first phase shift unit (311) adopts a U-shaped structure, and a phase shift effect is generated by increasing the signal transmission path in the first series feed network (310). Since the overall structure of the antenna is symmetrical, in this embodiment, when the signal is input from the first port, the phase difference of the signals on the four first branch lines (35) is 30°; when the signal is input from the second port, the phase difference of the signals on the four first branch lines (35) is -30°.

[0048] In this embodiment, refer to Figure 5 In the four second branch lines (36) on the second series feed network (320), there is a second phase shift unit (321) between every two sections of the second branch lines (36), that is, the second series feed network (320) has a total of three second phase shift units (321). The second phase shift unit (321) adopts an M-shaped structure, and a phase shift effect is generated due to the increase of the signal transmission path in the second series feed network (320). Since the overall structure of the antenna is symmetrical, in this embodiment, when the signal is input from the third port, the phase difference of the signals on the four second branch lines (36) is 145°; when the signal is input from the fourth port, the phase difference of the signals on the four second branch lines (36) (36) is -145°.

[0049] Figure 6 Schematic diagram of the adhesive layer (b) in this embodiment, wherein the circular holes represent the penetration positions formed in the adhesive layer (b) when the first feed metallized via (12a), the second feed metallized via (12b) and the metallized via array (15) and other vias penetrate the adhesive layer (b).

[0050] In this embodiment, the principle of the multi-beam antenna without a beamforming network is that two series feed networks with different phase differences (a first series feed network (310) and a second series feed network (320)) are used to excite a multi-unit in-band full-duplex antenna array. When signals are input from four ports (a first port, a second port, a third port and a fourth port) respectively, the multi-beam antenna can generate four radiation beams with different directions respectively, and the performance is similar to that of a traditional multi-beam antenna based on a Butler matrix beamforming network. However, since there is no need to use a beamforming network, the structure of the multi-beam antenna in this embodiment can be significantly simplified, thereby significantly reducing the size of the entire antenna, making it more suitable for the high integration requirements of the next generation mobile communication system.

[0051] Figure 7 and Figure 8 The simulated and tested scattering parameter curves for the first and third ports of this embodiment are shown, respectively. When the first port is excited, the antenna simulated operating frequency range is 25.8-29.7 GHz, the tested operating frequency range is 26-29.8 GHz, and the isolation between the four ports is greater than 13.7 dB. When the third port is excited, the antenna simulated operating frequency range is 26.2-29.5 GHz, the tested operating frequency range is 26.7-30 GHz, and the isolation between the four ports is greater than 12 dB. The overall overlapping bandwidth of the antenna is 26.7-29.8 GHz.

[0052] Figure 9 The following curves show the simulated and tested radiation patterns for this embodiment when ports 1 through 4 are excited separately. When ports 1 through 4 are excited separately, the simulated antenna beam points at -12°, 12°, 28°, and -29°, respectively, while the tested antenna beam points at -13°, 13°, 30°, and -30°, respectively.

[0053] Figure 10 The following are the simulated and tested gain and directivity curves for this embodiment, with the first and third ports excited. The maximum antenna gain during simulation is 11.43 dBi, and the maximum antenna gain during testing is 11.58 dBi. The antenna's maximum radiation efficiency within the operating frequency band is 85.6%.

[0054] Figure 11 is the simulation efficiency when the first port and the third port are excited respectively in the embodiment.

[0055] according to Figure 7-11 The simulation results shown confirm that the multi-beam antenna without a beamforming network in this embodiment has good performance.

[0056] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature, or it may be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, etc. used in this disclosure are only relative to the relative positional relationship of the components of the present disclosure in the accompanying drawings. The singular forms of "a", "said" and "the" used in this disclosure are also intended to include the plural forms, unless the context clearly indicates otherwise. In addition, unless otherwise defined, all technical and scientific terms used in this embodiment have the same meaning as those generally understood by those skilled in the art. The terms used in the description of this embodiment are only for describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this embodiment includes any combination of one or more related listed items.

[0057] It should be understood that, although the present disclosure may adopt the term first, second, third etc. to describe various elements, these elements should not be limited to these terms.These terms are only used to distinguish the elements of the same type from each other.For example, without departing from the scope of the present disclosure, the first element may also be referred to as the second element, and similarly, the second element may also be referred to as the first element.The use of any and all examples or exemplary language ("for example", "such as" etc.) provided by the present embodiment is only intended to better illustrate embodiments of the present invention, and unless otherwise required, the scope of the present invention will not be limited.

[0058] It should be appreciated that embodiments of the present invention can be implemented or practiced by computer hardware, a combination of hardware and software, or by computer instructions stored in a non-transitory computer-readable memory. The methods can be implemented in a computer program using standard programming techniques, including a non-transitory computer-readable storage medium configured with a computer program, wherein the storage medium so configured causes the computer to operate in a specific and predefined manner, according to the methods and figures described in the specific embodiments. Each program can be implemented in a high-level procedural or object-oriented programming language to communicate with the computer system. However, if desired, the program can be implemented in assembly or machine language. In any case, the language can be a compiled or interpreted language. In addition, the program can be run on a programmed application-specific integrated circuit for this purpose.

[0059] In addition, the operations of the processes described in this embodiment may be performed in any suitable order, unless otherwise indicated in this embodiment or otherwise clearly contradicted by the context. The processes described in this embodiment (or variations and / or combinations thereof) may be performed under the control of one or more computer systems configured with executable instructions, and may be implemented as code (e.g., executable instructions, one or more computer programs, or one or more applications) that is executed collectively on one or more processors, by hardware, or a combination thereof. The computer program includes a plurality of instructions that can be executed by one or more processors.

[0060] Furthermore, the methods can be implemented in any type of computing platform that is operably connected to a suitable computer, including but not limited to a personal computer, a minicomputer, a mainframe, a workstation, a network or distributed computing environment, a separate or integrated computer platform, or in communication with a charged particle tool or other imaging device, etc. Various aspects of the present invention can be implemented as machine-readable code stored on a non-transitory storage medium or device, whether removable or integrated into a computing platform, such as a hard disk, an optical read and / or write storage medium, RAM, ROM, etc., so that it can be read by a programmable computer, and when the storage medium or device is read by the computer, it can be used to configure and operate the computer to perform the processes described herein. In addition, the machine-readable code, or portions thereof, can be transmitted over a wired or wireless network. When such media includes instructions or programs that implement the steps described above in conjunction with a microprocessor or other data processor, the invention described in this embodiment includes these and other different types of non-transitory computer-readable storage media. When programmed according to the methods and techniques of the present invention, the present invention also includes the computer itself.

[0061] The computer program can be applied to input data to perform the functions described in the present embodiment, thereby converting the input data to generate output data that is stored in a non-volatile memory. The output information can also be applied to one or more output devices such as a display. In a preferred embodiment of the present invention, the converted data represents a physical and tangible object, including a specific visual depiction of the physical and tangible object produced on the display.

[0062] The above description is merely a preferred embodiment of the present invention. The present invention is not limited to the aforementioned embodiments. As long as the technical effects of the present invention are achieved by the same means, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention. Within the scope of protection of the present invention, various modifications and variations of the technical solutions and / or implementation methods are possible.

Claims

1. A multi-beam antenna without a beamforming network, characterized in that: The multi-beam antenna without a beamforming network comprises an antenna layer, an adhesive layer and a feed layer, wherein the antenna layer, the adhesive layer and the feed layer are sequentially attached; The antenna layer is provided with a plurality of in-band full-duplex antenna units, and a surface wave suppression unit is provided on the upper surface of the antenna layer, and the in-band full-duplex antenna units are arranged along the length direction of the antenna layer; wherein the upper surface of the antenna layer is the side away from the adhesive layer, and the lower surface of the antenna layer is the side facing the adhesive layer; A metal floor is provided on the upper surface of the feed layer, and a first series feed network and a second series feed network are provided on the lower surface of the feed layer, wherein the first series feed network and the second series feed network are respectively connected to each of the in-band full-duplex antenna units through vias; wherein the upper surface of the feed layer is a side facing the adhesive layer, and the lower surface of the feed layer is a side away from the adhesive layer; The in-band full-duplex antenna unit includes a folded branch patch and a rectangular patch; the folded branch patch is located on the upper surface of the antenna layer, and the rectangular patch is located on the lower surface of the antenna layer; in the same in-band full-duplex antenna unit, the rectangular patch is located within the projection range of the folded branch patch; The first series feed network includes a first microstrip line, wherein a plurality of first branch lines are provided on the first microstrip line, each of the first branch lines corresponds to each of the folded branch patches, and an end of each of the first branch lines is located within the projection range of the corresponding folded branch patch. The end of each of the first branch lines is connected to the corresponding folded branch patch via a first metallized feed via. The first metallized feed via passes through the antenna layer, the adhesive layer, and the feed layer. The second series feed network includes a second microstrip line, on which a plurality of second branch lines are provided, each of the second branch lines corresponding one-to-one to each of the folded branch patches, and the ends of each of the second branch lines are located within the projection range of the corresponding folded branch patches, and the ends of each of the second branch lines are connected to the corresponding folded branch patches through second metallized feed vias; the second metallized feed vias pass through the antenna layer, the adhesive layer and the feed layer.

2. The multi-beam antenna without a beamforming network according to claim 1, characterized in that In the same in-band full-duplex antenna unit, the folded branch patch and the rectangular patch are connected via a group of metallized connection vias; the metallized connection vias pass through the antenna layer.

3. The multi-beam antenna without a beamforming network according to claim 1, wherein: In the upper surface of the feed layer, a circular area is provided around the position penetrated by the first metallized feed via or the second metallized feed via, and the circular area is formed by the missing portion of the metal floor. The circular area and the surrounded first metallized feed via or the second metallized feed via have a common center.

4. The multi-beam antenna without a beamforming network according to claim 1, wherein: One end of the first microstrip line serves as the first port of the multi-beam antenna, the other end of the first microstrip line serves as the second port of the multi-beam antenna, one end of the second microstrip line serves as the third port of the multi-beam antenna, and the other end of the second microstrip line serves as the fourth port of the multi-beam antenna.

5. The multi-beam antenna without a beamforming network according to claim 1, wherein: The first series-fed network is provided with a plurality of first phase-shifting units, and the second series-fed network is provided with a plurality of second phase-shifting units. The number of the first phase-shifting units is the same as the number of the second phase-shifting units, and the phase-shifting characteristics of the first phase-shifting units are different from those of the second phase-shifting units.

6. The multi-beam antenna without a beamforming network according to claim 5, characterized in that The first phase shift unit has a U-shaped structure, and the second phase shift unit has an M-shaped structure.

7. The multi-beam antenna without a beamforming network according to claim 1, wherein: The surface wave suppression unit includes two long strip patches, each of which is arranged on both sides of each in-band full-duplex antenna unit; each of the long strip patches extends along the length direction of the antenna layer; each of the long strip patches is provided with a metallized via array, and the metallized via array is arranged along the extension direction of the long strip patch; the metallized via array passes through the antenna layer and the adhesive layer, and the metallized via array is connected to the metal floor.

8. The multi-beam antenna without a beamforming network according to any one of claims 1 to 7, characterized in that: The material of the antenna layer is Rogers 5880, the material of the feed layer is Rogers 5880, the material of the adhesive layer is Rogers 4450F, and the adhesive layer is a prepreg.

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