Display panel, display device and preparation method of display panel

Abstract

The application discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate and an insulating layer arranged on the substrate. The insulating layer comprises a groove located in a frame area. The groove is located on a side of the insulating layer away from the substrate and is used for arranging a metal layer. A sealing frame glue is arranged on a side of the metal layer away from the substrate. The sealing frame glue is located in the frame area and is sintered to be bonded with the insulating layer, so as to realize packaging of the metal layer. A normal projection of the groove on the substrate is located in a normal projection of the sealing frame glue on the substrate. A packaging range of the sealing frame glue covers the groove, so that the sealing frame glue has a good packaging effect on the groove. The metal layer in the frame area is completely located in the groove. When the sealing frame glue is sintered, the metal layer is also protected by the insulating layer. Electrostatic is difficult to enter and damage the metal layer through a hollow or other bubbles at an interface between the sealing frame glue and a conductive wire, so that a black screen problem of the display panel is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the display field, and in particular to a display panel, a display device and a preparation method of the display panel. BACKGROUND

[0002] With the rapid development of electronic devices, users have higher and higher requirements for display effects, so that the screen display of electronic devices has attracted more and more attention in the industry.

[0003] In order to improve the reliability of the screen of the electronic device, the display panel is subjected to static electricity test when the screen of the electronic device is prepared in the prior art. However, in the process of the static electricity test on the display panel, the static electricity enters from the pores of the encapsulation layer and damages the metal trace, resulting in a black screen of the display panel. SUMMARY

[0004] Embodiments of the present application provide a display panel, a display device and a preparation method of the display panel, aiming to solve the problem of the black screen of the display panel.

[0005] The first aspect of the present application provides a display panel, the display panel comprising a display area and a frame area surrounding at least part of the display area, the display panel comprising: a substrate; an insulating layer located on the substrate, the insulating layer comprising a groove located in the frame area, the groove being located on a side of the insulating layer away from the substrate; a metal layer located on a side of the insulating layer away from the substrate, the metal layer located in the frame area being completely located in the groove; a frame sealant located on a side of the metal layer away from the insulating layer, the frame sealant being located in the frame area, and the groove being located within the projection of the frame sealant on the substrate in the projection of the substrate.

[0006] According to the embodiment of the first aspect of the present application, at least part of the frame sealant and the insulating layer are in contact.

[0007] According to any one of the preceding embodiments of the first aspect of the present application, the distance between the edge of the frame sealant and the groove is in the range of 50-100 μm.

[0008] According to any one of the preceding embodiments of the first aspect of the present application, the display panel further comprises an encapsulation cover plate located on a side of the frame sealant away from the substrate.

[0009] According to any one of the preceding embodiments of the first aspect of the present application, the display panel further comprises a gate metal layer, a plate metal layer, a source-drain metal layer and an interlayer metal layer which are sequentially stacked, the metal layer is provided in the same layer as the gate metal layer, or the metal layer is provided in the same layer as the interlayer metal layer.

[0010] According to any one of the preceding embodiments of the first aspect of the present application, the metal layer is provided in the same layer as the gate metal layer, and the depth of the groove is 200-300 nm, or the metal layer is provided in the same layer as the interlayer metal layer, and the depth of the groove is 750-850 nm.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the groove is annular and is arranged around the display area.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the metal layer and the interlayer metal layer are arranged in the same layer, and the insulating layer includes a first insulating layer, a second insulating layer and a third insulating layer which are stacked, the first insulating layer is located between the gate metal layer and the substrate, the second insulating layer is located between the gate metal layer and the plate metal layer, and the third insulating layer is located between the plate metal layer and the source and drain metal layer.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the first insulating layer, the second insulating layer and the third insulating layer are all made of inorganic materials.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the metal layer located in the border area is the same as the depth of the groove.

[0015] An embodiment of the second aspect of the present application provides a display device, which includes the display panel of any of the above embodiments.

[0016] According to a third aspect of the present application, there is provided a method for manufacturing a display panel, wherein the display panel includes a display area and a frame area surrounding at least a portion of the display area. The method includes:

[0017] An inorganic material layer is prepared on a substrate, and the inorganic material layer is patterned to obtain an insulating layer, wherein the insulating layer includes a groove located in a frame area, and the groove is located on a side of the insulating layer away from the substrate;

[0018] A first metal material layer is prepared on a side of the insulating layer facing away from the substrate, and the first metal material layer is patterned to obtain a metal layer, wherein the metal layer located in the frame area is completely located in the groove;

[0019] A frame sealant is prepared on the side of the metal layer facing away from the substrate. The frame sealant is located in the frame area, and the orthographic projection of the groove on the substrate is located within the orthographic projection of the frame sealant on the substrate.

[0020] According to the display panel of the embodiment of the present application, the display panel includes a substrate and an insulating layer arranged on the substrate, the insulating layer includes a groove located in the frame area, the groove is located on the side of the insulating layer away from the substrate, and is used to set the metal layer. A frame sealant is provided on the side of the metal layer away from the substrate, the frame sealant is located in the frame area, and the frame sealant is sintered to bond with the insulating layer to achieve the encapsulation of the metal layer. The orthographic projection of the groove on the substrate is located within the orthographic projection of the frame sealant on the substrate, and the encapsulation range of the frame sealant covers the groove to ensure that the frame sealant has a good encapsulation effect on the groove. The metal layer in the frame area is completely located in the groove, so that when the frame sealant is sintered, the frame sealant encapsulates the insulating layer and the metal layer, and the metal layer is also protected by the insulating layer. It is difficult for static electricity to enter and damage the metal layer through the voids or other bubbles at the junction of the frame sealant and the conductive wire, so as to improve the problem of black screen of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0022] Figure 1 This is a schematic structural diagram of a display panel provided by an embodiment of the first aspect of the present application;

[0023] Figure 2 yes Figure 1 Partial cross-sectional view at NA;

[0024] Figure 3 is a partial cross-sectional view of another embodiment of a display panel;

[0025] Figure 4 is a partial cross-sectional view of another embodiment of a display panel;

[0026] Figure 5 is a partial cross-sectional view of yet another embodiment of a display panel;

[0027] Figure 6 This is a flow chart of a method for preparing a display panel provided in an embodiment of the third aspect of the present application.

[0028] Description of reference numerals:

[0029] 10. Display panel;

[0030] 100. Substrate;

[0031] 200, insulating layer; 201, groove; 210, first insulating layer; 220, second insulating layer; 230, third insulating layer;

[0032] 300, metal layer; 301, conductive line; 310, gate metal layer; 320, plate metal layer; 330, source and drain metal layer; 340, interlayer metal layer;

[0033] 400, frame sealing glue;

[0034] 500, packaging cover;

[0035] 600, cover plate;

[0036] AA, display area; NA, border area. DETAILED DESCRIPTION

[0037] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0038] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0039] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0040] To improve the reliability of electronic devices such as mobile phones and tablets, electrostatic reliability testing is typically performed on the display panels during production. However, during this testing, static electricity can enter the screen through metal components such as the housing and midframe. Gaps in the sealant allow static electricity to enter through these gaps, damaging the internal conductive wires. This in turn affects the sealant, causing it to curl and other undesirable phenomena, leading to package failure and a black display.

[0041] To improve the light transmittance of display panels, some related technologies add copper foil to the back of the display panel. During electrostatic reliability testing, the copper foil conducts static electricity to the ground. Alternatively, gap glue is applied to the narrow gaps around the frame sealant to prevent static electricity from entering the screen through the gaps.

[0042] However, when the frame sealant is sintered, due to the difference in faults between the frame sealant and the conductive wire, the cross-section of the conductive wire may not be covered by the frame sealant. At the same time, because bubbles will exist when the frame sealant is sintered, the anti-static ability will also be weakened.

[0043] To solve the above problems, embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. Hereinafter, various embodiments of the display panel, the display device, and the method for manufacturing a display panel will be described with reference to the accompanying drawings.

[0044] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0045] See also Figure 1 and Figure 2 , Figure 1 This is a schematic structural diagram of a display panel provided by an embodiment of the first aspect of the present application; Figure 2 yes Figure 1 Partial cross-sectional view at NA.

[0046] like Figure 1 and Figure 2As shown, an embodiment of the first aspect of the present application provides a display panel 10, the display panel 10 includes a display area AA and a frame area NA surrounding at least part of the display area AA, the display panel 10 includes: a substrate 100, an insulating layer 200, a metal layer 300 and a frame sealant 400, the insulating layer 200 is located on the substrate 100, the insulating layer 200 includes a groove 201 located in the frame area NA, the groove 201 is located on the side of the insulating layer 200 away from the substrate 100; the metal layer 300 is located on the side of the insulating layer 200 away from the substrate 100, and the metal layer 300 located in the frame area NA is completely located in the groove 201; the frame sealant 400 is located on the side of the metal layer 300 away from the insulating layer 200, the frame sealant 400 is located in the frame area NA, and the orthographic projection of the groove 201 on the substrate 100 is located within the orthographic projection of the frame sealant 400 on the substrate 100.

[0047] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100 and an insulating layer 200 disposed on the substrate 100. The insulating layer 200 includes a groove 201 located in the frame area NA. The groove 201 is located on the side of the insulating layer 200 away from the substrate 100 and is used to dispose the metal layer 300. A frame sealant 400 is provided on the side of the metal layer 300 away from the substrate 100. The frame sealant 400 is located in the frame area NA. The frame sealant 400 is sintered to bond with the insulating layer 200 to achieve encapsulation of the metal layer 300 in the frame area NA. The orthographic projection of the groove 201 on the substrate 100 is located within the orthographic projection of the frame sealant 400 on the substrate 100. The encapsulation range of the frame sealant 400 covers the groove 201 to ensure that the frame sealant 400 has a good encapsulation effect on the groove 201. The metal layer 300 of the frame area NA is completely located in the groove 201, so that when the frame sealing glue 400 is sintered, the frame sealing glue 400 encapsulates the insulating layer 200 and the metal layer 300, while the metal layer 300 is also protected by the insulating layer 200. It is difficult for static electricity to enter and damage the metal layer 300 through the voids or other bubbles at the junction of the frame sealing glue 400 and the metal layer 300, thereby improving the black screen problem of the display panel 10.

[0048] There are many ways to configure the substrate 100. For example, the substrate 100 may include a substrate and an array substrate 100 disposed on the substrate. Alternatively, the substrate 100 is the substrate. Alternatively, the substrate 100 may include a buffer layer and a support plate on a side facing away from the substrate.

[0049] Please continue reading Figure 2 In some optional embodiments, at least a portion of the frame sealant 400 is in contact with and connected to the insulating layer 200 .

[0050] In these optional embodiments, the frame sealing glue 400 is in contact with the insulating layer 200 so that the frame sealing glue 400 can be bonded to the insulating layer 200 after sintering, and the contact parts are in close contact, which can better encapsulate the conductive wire 301. It is difficult for static electricity to enter through the voids or other bubbles at the junction of the frame sealing glue 400 and the metal layer 300 and damage the metal layer 300.

[0051] In some optional embodiments, according to the implementation of the first aspect of the present application, the distance between the edge of the frame sealant 400 and the groove 201 is in the range of 50 μm-100 μm.

[0052] In these optional embodiments, when the distance between the edge of the sealant 400 and the groove 201 is greater than or equal to 50 μm, the problem of the air bubbles or holes existing after the sealant 400 is sintered being close to the metal layer 300 can be improved, making it difficult for static electricity to enter and damage the metal layer 300 through the voids or other air bubbles existing at the junction of the sealant 400 and the metal layer 300, thereby improving the black screen problem of the display panel 10. When the distance between the edge of the sealant 400 and the groove 201 is less than or equal to 100 μm, on the one hand, the problem of the distance being too large causing the edge of the sealant 400 to protrude beyond the insulating layer 200 and making it difficult for the sealant 400 to bond well with the insulating layer 200 during sintering can be improved. On the other hand, the problem of the high number of consumables and increased cost of the sealant 400 can be improved.

[0053] See also Figure 3 , Figure 3 This is a partial cross-sectional view of another embodiment of a display panel.

[0054] like Figure 3 As shown, in some optional embodiments, the display panel 10 further includes a packaging cover plate 500 , and the packaging cover plate 500 is located on a side of the sealing glue 400 facing away from the substrate 100 .

[0055] In these optional embodiments, the encapsulation cover plate 500 is disposed on the frame sealant 400. When the frame sealant 400 is sintered, the side close to the substrate 100 is bonded to the insulating layer 200, and the side away from the substrate 100 is bonded to the frame sealant 600. The encapsulation cover plate 500 not only encapsulates the entire display panel 10, but also improves the strength and toughness of the display panel 10, providing better protection.

[0056] See also Figure 4 , Figure 4 This is a partial cross-sectional view of another embodiment of a display panel.

[0057] like Figure 4 As shown, optionally, the display panel 10 further includes a cover plate 600 , which is located on a side of the package cover plate 500 facing away from the substrate 100 , to further enhance protection of the display panel 10 .

[0058] Please refer to Figure 5 , Figure 5 FIG. 1 is a partial cross-sectional view of another embodiment of a display panel.

[0059] In some alternative embodiments, the display panel 10 further comprises a gate metal layer 310, a plate metal layer 320, a source-drain metal layer 330, and an interlayer metal layer 340, which are sequentially stacked. The metal layer 300 is disposed in the same layer as the gate metal layer 310, or the metal layer 300 is disposed in the same layer as the interlayer metal layer 340.

[0060] In these alternative embodiments, the metal layer 300 and the gate metal layer 310 can be prepared simultaneously, or the metal layer 300 and the interlayer metal layer 340 can be prepared simultaneously, thereby simplifying the preparation process of the display panel 10.

[0061] Optionally, the metal layer 300 comprises a conductive wire 301, and the conductive wire 301 is located in the groove 201.

[0062] In some alternative embodiments, the metal layer 300 is disposed in the same layer as the gate metal layer 310, and the depth of the groove 201 is 200-300 nm, or the metal layer 300 is disposed in the same layer as the interlayer metal layer 340, and the depth of the groove 201 is 750-850 nm.

[0063] The gate metal layer 310 is usually a single-layer metal material layer with a small thickness. Therefore, when the metal layer 300 is disposed in the same layer as the gate metal layer 310, the depth of the groove 201 is set to be small in order to dispose the conductive wire 301.

[0064] The interlayer metal layer 340 is a multi-layer metal layer, for example, the interlayer metal layer 340 comprises a titanium-aluminum-titanium three-layer metal material layer, and the thickness of the interlayer metal layer 340 is large. Therefore, when the metal layer 300 is disposed in the same layer as the interlayer metal layer 340, the depth of the groove 201 is set to be large in order to dispose the conductive wire 301.

[0065] In these alternative embodiments, when the metal layer 300 is disposed in the same layer as the gate metal layer 310, the depth of the groove 201 is greater than or equal to 200 nm, which improves the problem that the conductive wire 301 cannot be completely embedded in the groove 201 due to the small depth of the groove 201, so that the conductive wire 301 does not protrude from the groove 201, and no gap is generated between the conductive wire 301 and the frame sealant 400, and static electricity is difficult to enter and damage the metal wire through the pores existing at the junction of the frame sealant 400 and the conductive wire 301; and the depth of the groove 201 is less than or equal to 300 nm, which avoids the problem that the conductive wire 301 cannot be stably disposed in the groove 201 due to the large depth of the groove 201, so that the conductive wire 301 is difficult to move in the groove 201 and thus wears the conductive wire 301 or even damages the insulating layer 200 and the frame sealant 400.

[0066] Similarly, when the metal layer 300 and the interlayer metal layer 340 are arranged in the same layer, the depth of the groove 201 is greater than or equal to 750nm to avoid the conductive wire 301 being unable to be completely embedded therein due to the groove 201 being too small, so that the conductive wire 301 does not protrude from the groove 201, and no gap is generated between the conductive wire 301 and the frame sealant 400, and static electricity is difficult to enter through the pores at the junction of the frame sealant 400 and the conductive wire 301 and damage the metal wiring; the depth of the groove 201 is less than or equal to 850nm to avoid the conductive wire 301 being unable to be stably set in the groove 201 due to the groove 201 being too deep, so that the conductive wire 301 is difficult to move in the groove 201, thereby wearing the conductive wire 301 or even damaging the insulating layer 200 and the frame sealant 400.

[0067] It is worth noting that the display panel 10 further includes a pixel electrode layer. The interlayer metal layer 340 may be disposed between the pixel electrode layer and the source / drain metal layer 330 to electrically connect the pixel electrode to the source / drain metal layer 330 .

[0068] In some optional embodiments, the groove 201 is annular and is disposed around the display area AA.

[0069] In these optional embodiments, the groove 201 is arranged in a ring around the display area AA, so that the conductive lines 301 in all directions of the display panel 10 can be buried in the groove 201, thereby protecting the conductive lines 301 in the border area NA from being damaged by static electricity.

[0070] Optionally, the frame sealant 400 is annular and disposed around the display area AA. The frame sealant 400 is also disposed around the display area AA, so that the conductive wires 301 in all directions of the display panel 10 can be encapsulated and protected by the frame sealant 400. Static electricity is less likely to enter through cavities or other bubbles at the junction of the frame sealant 400 and the conductive wires 301 and damage the conductive wires 301, thereby improving the black screen problem of the display panel 10.

[0071] The film layer located in the frame area NA can usually be made of the same material as the film layer located in the display area AA, for example. Figure 5 As shown, in some optional embodiments, the metal layer 300 and the interlayer metal layer 340 are arranged in the same layer, and the insulating layer 200 includes a first insulating layer 210, a second insulating layer 220 and a third insulating layer 230 that are stacked. The first insulating layer 210 is located between the gate metal layer 310 and the substrate 100, the second insulating layer 220 is located between the gate metal layer 310 and the plate metal layer 320, and the third insulating layer 230 is located between the plate metal layer 320 and the source and drain metal layer 330.

[0072] In these optional embodiments, an insulating layer 200 is disposed between the metal layers in the display area AA to insulate the metal layers from each other, prevent short circuits and other adverse phenomena, and ensure normal light emission of the display panel 10. Portions of the first insulating layer 210, the second insulating layer 220, and the third insulating layer 230 extending beyond the display area AA are stacked together in the border area NA, and the stacked insulating layers 200 are patterned to form grooves 201 of a certain depth for accommodating the conductive lines 301.

[0073] In some optional embodiments, the first insulating layer 210 , the second insulating layer 220 , and the third insulating layer 230 are all made of inorganic materials.

[0074] In these optional embodiments, the three insulating layers 200 are all made of inorganic materials, the conductive wires 301 are wrapped by the inorganic materials, the materials are tight, and static electricity is difficult to enter. The insulating layers 200 made of inorganic materials have better protection performance for the conductive wires 301.

[0075] In order to better protect the conductive line 301 , in some optional embodiments, the thickness of the metal layer 300 located in the border area NA is the same as the depth of the groove 201 .

[0076] In these optional embodiments, the conductive line 301 is consistent in depth with the metal layer 300 of the border area NA, so that the metal layer 300 of the border area NA can be exactly buried in the groove 201. While ensuring that the metal layer 300 of the border area NA is difficult to be damaged by static electricity, the metal layer 300 of the border area NA is stably set in the groove 201, making it difficult for the metal layer 300 of the border area NA to move in the groove 201, thereby wearing the metal layer 300 of the border area NA or even damaging the insulating layer 200 and the frame sealing glue 400.

[0077] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made based on actual conditions. This application does not impose any specific restrictions on it.

[0078] The embodiment of the second aspect of the present invention further provides a display device, comprising the display panel 10 according to any of the above-mentioned embodiments of the first aspect. Since the display device provided by the embodiment of the second aspect of the present invention comprises the display panel 10 according to any of the above-mentioned embodiments of the first aspect, the display device provided by the embodiment of the second aspect of the present invention has the beneficial effects of the display panel 10 according to any of the above-mentioned embodiments of the first aspect, and no further details are given here.

[0079] The display device in the embodiment of the present invention includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0080] See also Figure 6 , Figure 6 1 is a flow chart of a method for manufacturing a display panel according to an embodiment of the third aspect of the present application. The display panel 10 can be any of the display panels 10 provided in the embodiment of the first aspect.

[0081] Please also refer to Figures 1 to 5 The display panel 10 shown includes a display area AA and a frame area NA surrounding at least a portion of the display area AA. The method for manufacturing the display panel 10 includes:

[0082] Step S01 : preparing an inorganic material layer on a substrate 100 and patterning the inorganic material layer to obtain an insulating layer 200 . The insulating layer 200 includes a groove 201 located in the frame area NA. The groove 201 is located on a side of the insulating layer 200 away from the substrate 100 .

[0083] Step S02 : preparing a first metal material layer on the side of the insulating layer 200 facing away from the substrate 100 , and patterning the first metal material layer to obtain a metal layer 300 , wherein the metal layer 300 includes a conductive line 301 , and the metal layer 300 located in the border area NA is completely located in the groove 201 .

[0084] Step S03 : preparing a sealant 400 on the side of the metal layer 300 facing away from the substrate 100 . The sealant 400 is located in the frame area NA, and the orthographic projection of the groove 201 on the substrate 100 is located within the orthographic projection of the sealant 400 on the substrate 100 .

[0085] According to the method for preparing the display panel 10 of the embodiment of the present application, first, an insulating layer 200 is prepared in step S01. The insulating layer 200 includes a groove 201 located in the frame area NA. The groove 201 is located on the side of the insulating layer 200 away from the substrate 100 and is used to set the metal layer 300. Then, the metal layer 300 is prepared in step S02. Finally, in step S03, a frame sealant 400 is prepared on the side of the metal layer 300 away from the substrate 100. The frame sealant 400 is located in the frame area NA. The frame sealant 400 is sintered to bond with the insulating layer 200 to achieve encapsulation of the metal layer 300. The groove 201 is located within the orthographic projection of the frame sealant 400 on the substrate 100. The encapsulation range of the frame sealant 400 covers the groove 201, ensuring that the frame sealant 400 has a good encapsulation effect on the groove 201. The metal layer 300 of the frame area NA is completely located in the groove 201, so that when the frame sealing glue 400 is sintered, the frame sealing glue 400 encapsulates the insulating layer 200 and the metal layer 300, while the metal layer 300 is also protected by the insulating layer 200. It is difficult for static electricity to enter and damage the metal layer 300 through the voids or other bubbles at the junction of the frame sealing glue 400 and the metal layer 300, thereby improving the black screen problem of the display panel 10.

[0086] It is worth noting that the display panel 10 also includes a gate metal layer 310, a plate metal layer 320, a source and drain metal layer 330, and an interlayer metal layer 340 that are stacked in sequence. The metal layer 300 is arranged on the same layer as the gate metal layer 310, or the metal layer 300 is arranged on the same layer as the interlayer metal layer 340.

[0087] The insulating layer 200 includes a first insulating layer 210, a second insulating layer 220 and a third insulating layer 230 that are stacked together. The first insulating layer 210 is located between the gate metal layer 310 and the substrate 100, the second insulating layer 220 is located between the gate metal layer 310 and the plate metal layer 320, and the third insulating layer 230 is located between the plate metal layer 320 and the source and drain metal layer 330.

[0088] When the metal layer 300 and the interlayer metal layer 340 are provided in the same layer, before step S01 , the preparation method further includes:

[0089] A second metal material layer is prepared on the substrate 100 , and the second metal material layer is patterned to obtain a gate metal layer 310 .

[0090] When the metal layer 300 and the interlayer metal layer 340 are provided on the same layer, in step S01 , the preparation method further includes:

[0091] A first inorganic material layer is formed on a side of the gate metal layer 310 facing away from the substrate 100 , and the first inorganic material layer is patterned to obtain a first insulating layer 210 .

[0092] After the step of preparing a first inorganic material layer on the side of the gate metal layer 310 facing away from the substrate 100 and patterning the first inorganic material layer to obtain the first insulating layer 210 , the preparation method further includes:

[0093] A third metal material layer is prepared on a side of the first insulating layer 210 facing away from the substrate 100 , and the third metal material layer is patterned to obtain a plate metal layer 320 .

[0094] When the metal layer 300 and the interlayer metal layer 340 are provided on the same layer, in step S01 , the preparation method further includes:

[0095] A second inorganic material layer is prepared on the side of the electrode metal layer 320 facing away from the substrate 100 , and the second inorganic material layer is patterned to obtain the second insulating layer 220 .

[0096] After the step of preparing a second inorganic material layer on the side of the electrode metal layer 320 facing away from the substrate 100 and patterning the second inorganic material layer to obtain the second insulating layer 220 , the preparation method further includes:

[0097] A fourth metal material layer is formed on a side of the second insulating layer 220 facing away from the substrate 100 , and the fourth metal material layer is patterned to obtain a source-drain metal layer 330 .

[0098] When the metal layer 300 and the interlayer metal layer 340 are provided on the same layer, in step S01 , the preparation method further includes:

[0099] A third inorganic material layer is formed on a side of the source / drain metal layer 330 facing away from the substrate 100 , and the third inorganic material layer is patterned to obtain a third insulating layer 230 .

[0100] After the step of preparing a third inorganic material layer on the side of the source / drain metal layer 330 facing away from the substrate 100 and patterning the third inorganic material layer to obtain the third insulating layer 230 , the preparation method further includes:

[0101] A first metal material layer is formed on a side of the third insulating layer 230 facing away from the substrate 100 , and the first metal material layer is patterned to obtain an interlayer metal layer 340 and a metal layer 300 .

[0102] While preparing the interlayer metal layer 340 in the display area AA, the first metal material layer located in the frame area NA is patterned to obtain the metal layer 300. The metal layer 300 located in the frame area NA is completely located in the groove 201 and is protected by the insulating layer 200. It is difficult for static electricity to enter through the voids or other bubbles at the junction of the frame sealant 400 and the metal layer 300 and damage the metal wiring, thereby improving the black screen problem of the display panel 10.

[0103] While the embodiments described above are not exhaustive, they do not limit the invention to the specific embodiments described. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a frame area surrounding at least a portion of the display area, and further includes: substrate; an insulating layer, located on the substrate, the insulating layer comprising a groove located in the frame area, the groove being located on a side of the insulating layer away from the substrate; a metal layer, located on a side of the insulating layer facing away from the substrate, wherein the metal layer located in the frame area is completely located in the groove; The frame sealant is located on a side of the metal layer facing away from the insulating layer. The frame sealant is located in the frame area. The orthographic projection of the groove on the substrate is located within the orthographic projection of the frame sealant on the substrate.

2. The display panel according to claim 1, wherein: At least a portion of the frame sealing adhesive is in contact with and connected to the insulating layer.

3. The display panel according to claim 2, wherein: The distance between the edge of the frame sealant and the groove is in the range of 50 μm to 100 μm.

4. The display panel according to claim 2, wherein: The display panel further includes a packaging cover plate, and the packaging cover plate is located on a side of the frame sealing adhesive facing away from the substrate.

5. The display panel according to claim 1, wherein: The display panel further includes a gate metal layer, a plate metal layer, a source / drain metal layer, and an interlayer metal layer stacked in sequence. The metal layer is arranged on the same layer as the gate metal layer, or the metal layer is arranged on the same layer as the interlayer metal layer.

6. The display panel according to claim 5, wherein: The metal layer is provided on the same layer as the gate metal layer, and the depth of the groove is 200nm-300nm. Alternatively, the metal layer and the interlayer metal layer are provided in the same layer, and the groove depth is 750nm-850nm.

7. The display panel according to claim 1, wherein: The groove is annular and is arranged around the display area.

8. The display panel according to claim 5, wherein: The metal layer is arranged in the same layer as the interlayer metal layer, and the insulating layer includes a first insulating layer, a second insulating layer and a third insulating layer which are stacked. The first insulating layer is located between the gate metal layer and the substrate, the second insulating layer is located between the gate metal layer and the plate metal layer, and the third insulating layer is located between the plate metal layer and the source and drain metal layer.

9. The display panel according to claim 8, wherein: The first insulating layer, the second insulating layer and the third insulating layer are all made of inorganic materials.

10. The display panel according to claim 1, wherein The thickness of the metal layer in the border area is the same as the depth of the groove.

11. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 10.

12. A method for preparing a display panel, characterized in that: The display panel includes a display area and a frame area surrounding at least a portion of the display area, and the preparation method includes: An inorganic material layer is prepared on a substrate, and the inorganic material layer is patterned to obtain an insulating layer, wherein the insulating layer includes a groove located in the frame area, and the groove is located on a side of the insulating layer away from the substrate; preparing a first metal material layer on a side of the insulating layer facing away from the substrate, and patterning the first metal material layer to obtain a metal layer, wherein the metal layer located in the frame area is completely located in the groove; A frame sealant is prepared on a side of the metal layer facing away from the substrate. The frame sealant is located in the frame area, and the orthographic projection of the groove on the substrate is located within the orthographic projection of the frame sealant on the substrate.

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