A method of manufacturing an ear sleeve for a headphone
By using high-frequency hot melting and die-cutting processes, combined with the bonding of TPU, PETG and plastic parts, the problem of easily damaged ear tips for headphones has been solved, achieving an efficient and durable ear tip manufacturing method.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DONGGUAN LEXING ELECTRONIC CO LTD
- Filing Date
- 2023-02-23
- Publication Date
- 2026-07-10
AI Technical Summary
The earcups of existing headphones are made of leather, which makes them prone to peeling, breakage, and natural wear, affecting their appearance and comfort. In addition, the manufacturing process is inefficient.
Employing high-frequency hot melt technology and die-cutting process, combined with the bonding of TPU, PETG and plastic parts, a durable and efficient ear cover manufacturing method is formed through multiple processes, including pressing TPU into the hole of the outer skin, stretching the skin, pressing PETG into the frog skin, sponge glue application, plastic part glue application, and edge binding.
It effectively prevents glue separation damage and natural wear, improves processing efficiency and quality, and ensures the durability and overall appearance quality of the ear tips.