board splitter

Abstract

The application discloses a board separating machine, which comprises a rack provided with a conveying station and a cutting station, a material conveying device arranged at the conveying station and used for conveying a PCB, a bearing device arranged at the rack and reciprocally moving between the conveying station and the cutting station, a mounting seat of a cutting device arranged at the cutting station, a cutting driving element arranged at the mounting seat and having an installation end and a connecting end arranged oppositely, a cutting knife connected to the connecting end, and a supporting structure fixedly connected to the installation end and the rack and located at the lower part of the mounting seat. The board separating machine can greatly avoid the situation that the cutting knife and the cutting driving element are upwardly warped during the cutting of the PCB, so that the cutting knife can cut the PCB to the preset depth, thereby improving the cutting effect of the PCB.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing technology, and in particular to a board separation device and a board separation machine. Background Technology

[0002] PCB (Printed Circuit Board), or simply PCB, is a crucial component of the electronics industry. Almost every electronic device, from small items like watches and calculators to large systems like computers, communication devices, and military weaponry, relies on PCBs for electrical interconnection with integrated circuits and other electronic components. PCBs are extremely widely used in the manufacturing of electronic products. Consequently, to meet market demands, PCB production is becoming increasingly automated, and the production process often requires the use of depaneling machines to separate sheets of PCB material.

[0003] In related technologies, when a PCB depaneling machine uses a cutter to cut a PCB board, the reaction force from the PCB board may cause incomplete cutting, affecting the depaneling effect. Summary of the Invention

[0004] The main objective of this invention is to provide a PCB depaneling machine that improves the depaneling effect on PCB boards.

[0005] To achieve the above objectives, the present invention proposes a PCB depaneling machine, which is applied to PCB boards and includes:

[0006] The frame is equipped with a conveyor station and a cutting station;

[0007] A material transfer device is provided at the transfer station for transferring the PCB board;

[0008] A carrying device, disposed on the frame, reciprocates between the conveying station and the cutting station; and

[0009] A cutting device includes a mounting base, a cutting drive, a cutter, and a support structure. The mounting base is located at the cutting station, and the cutting drive is located on the mounting base and has a mounting end and a connecting end that are arranged opposite to each other. The connection trajectory line of the mounting end and the connecting end is set at a 90° angle with the cutting direction. The cutter is connected to the connecting end and is located on the upper part of the bearing device. The support structure is fixedly connected to the mounting end and the frame and is located on the lower part of the mounting base.

[0010] Optionally, the support structure includes a limiting protrusion and a limiting seat. The limiting seat is fixedly connected to the frame and extends along the cutting direction of the cutter. The limiting seat is provided with a limiting mounting groove, and the limiting protrusion is embedded in the limiting mounting groove.

[0011] Optionally, the cutting drive includes a cutting linear module and a lowering cylinder. The cutting linear module is mounted on the mounting base, the lowering cylinder is driven to the cutting linear module, and the cutter is driven to the output end of the lowering cylinder.

[0012] Optionally, the cutter includes a blade body, a first blade holder, a second blade holder, and a rotary drive component. The first blade holder is throttle-connected to the lower blade cylinder, the rotary drive component is mounted on the first blade holder, the second blade holder is rotatably connected to the first blade holder and throttle-connected to the rotary drive component, and the blade body is rotatably connected to the second blade holder.

[0013] Optionally, the material transfer device includes a loading dock, a gripping component, and a unloading conveyor belt arranged sequentially at intervals on the frame. The gripping component moves between the loading dock and the unloading conveyor belt to grip the PCB board from the loading dock or to grip the PCB board to one side of the unloading conveyor belt.

[0014] Optionally, the material gripping component includes a material gripping linear module, a mounting frame, a feeding nozzle, and a discharging nozzle. The material gripping linear module is disposed at the conveying station, the mounting frame is drivenly connected to the material gripping linear module, and the feeding nozzle and the discharging nozzle are detachably connected to the mounting frame. The feeding nozzle is adjacent to the side of the feeding dock, and the discharging nozzle is adjacent to the side of the discharging conveyor belt.

[0015] Optionally, the mounting frame includes a frame body, a first mounting rod, a second mounting rod, a first connector, and a second connector. The frame body is connected to the material gripping linear module and has a fixing hole. The fixing hole extends along the moving direction of the bearing device. The first mounting rod has a first mounting hole and a first oblong hole, and the second mounting rod has a second oblong hole.

[0016] The first connector passes through the first mounting hole and the fixing hole to connect the first mounting rod and the frame. The second connector passes through the second waist-shaped hole and the first waist-shaped hole to connect the second mounting rod and the first mounting rod. The feeding nozzle and the unloading nozzle are fixed to the second mounting rod.

[0017] Optionally, the material conveying device further includes a waste trough, which is located at the conveying station and inclined toward the lower part of the frame, and is located below the discharge suction nozzle.

[0018] Optionally, the bearing device includes a bearing drive, a carrier plate, and a pressure plate. The bearing drive is disposed on the frame, the carrier plate is drivenly connected to the bearing drive, and the pressure plate can move toward or away from the carrier plate to press a portion of the PCB board onto the carrier plate.

[0019] Optionally, the pressure plate includes a plate body and a pressing drive component. The pressing drive component is disposed on the carrier plate, and the plate body is throttle-connected to the pressing drive component. The pressing drive component drives the plate body to reciprocate toward or away from the carrier plate.

[0020] In the technical solution of the present invention, the PCB depaneling machine includes a frame with a conveying station and a cutting station. A material conveying device is located at the conveying station for conveying PCB boards. A carrying device is located at the frame and reciprocates between the conveying station and the cutting station. The mounting base of the cutting device is located at the cutting station. The cutting drive is located at the mounting base and has a mounting end and a connecting end that are arranged opposite to each other. The cutter is connected to the connecting end. The support structure is fixedly connected to the mounting end and the frame and is located at the lower part of the mounting base.

[0021] The working principle of the PCB depaneling machine of this invention is as follows: In the initial position, the carrier device is located at the conveying station. The PCB board to be cut is conveyed to the carrier device by the material transfer device. The carrier device moves to the cutting station, where the cutting drive moves the cutter towards the carrier device to cut the PCB board. After cutting, the carrier device moves back to the conveying station, and the material transfer device conveys the cut PCB board to the next station. This cycle repeats, resulting in high depaneling efficiency. Simultaneously, in this invention, the cutter is connected to the connecting end of the cutting drive. The connection trajectory line formed by the connecting end and the mounting end is perpendicular to the cutting direction of the cutter. Furthermore, the support structure is fixedly connected to the mounting end and the frame, and is located at the lower part of the mounting base. Force analysis reveals that when the cutter cuts the PCB board, the connecting end of the cutting drive component experiences a reaction force from the PCB board, in the opposite direction to the downward cutting direction. At this time, the cutting drive component and the cutter tend to tilt upwards. The force at the mounting end acts on the support structure along the downward cutting direction, and the support structure, in turn, acts on the connecting end. That is, the support structure abuts against the lower part of the mounting base and is located away from the connecting end. This largely prevents the cutter and the cutting drive component from tilting upwards during the cutting process of the PCB board, allowing the cutter to cut the PCB board to the preset depth, thereby improving the cutting effect of the PCB board. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of an embodiment of the depaneling machine of the present invention;

[0024] Figure 2 for Figure 1 The diagram shown is a schematic of the internal structure of the PCB separator.

[0025] Figure 3 for Figure 2 The front view of the depaneling machine is shown below;

[0026] Figure 4 for Figure 2 The diagram shown is a structural schematic of the PCB splitter.

[0027] Figure 5 for Figure 4 Enlarged detail view of point A in the middle;

[0028] Figure 6 This is a partial structural side view of the cutting device of the present invention;

[0029] Figure 7 for Figure 6 The front view of the cutting device shown;

[0030] Figure 8 This is a partial structural schematic diagram of the bearing device of the present invention;

[0031] Figure 9 This is a schematic diagram of the cutting device of the present invention from one perspective;

[0032] Figure 10 This is a structural schematic diagram of the cutting device of the present invention from another perspective.

[0033] Explanation of icon numbers:

[0034] label name label name 1 PCB Separating Machine 30 Load-bearing device 2 PCB board 31 Load-bearing drive components 10 frame 32 carrier board 11 Conveyor station 32a Dust passage 12 Cutting station 33 pressure plate 13 vacuuming platform 331 plate body 14 Adjustable support feet 332 Suppression drive component 15 swivel wheels 41 Mounting base 16 shell 42 Cutting drive components 20 Material conveying device 42a Installation end 21 Feeding dock 42b Connection end 221 Material handling linear module 421 Cutting linear modules 222 Mounting rack 422 Lowering cylinder 2221 Frame 43 Cutter 2221a Fixing hole 431 blade 2222 First mounting rod 432 First Knife Stand 2222a First mounting hole 433 Second knife holder 2222b First oblong hole 434 Rotary drive 2223 Second mounting rod 44 Support structure 2223a Second oblong hole 441 Limiting protrusion 223 Feeding nozzle 442 Limit seat 224 Feeding nozzle 442a Limiting mounting slot 23 Material feeding conveyor belt 45 Visual positioning camera 24 Waste trough 46 Height detection sensor

[0035] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0037] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0038] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0039] Reference Figures 1 to 8 This invention proposes a board splitting machine 1.

[0040] In this embodiment of the invention, the depaneling machine 1 is used to divide contiguous PCB boards 2, thereby improving depaneling efficiency and the depaneling effect of the PCB boards 2. The depaneling machine 1 includes: a frame 10, which is formed by splicing metal profiles with screws or welding. The bottom of the frame 10 is provided with adjustable support feet 14 and casters 15. The adjustable support feet 14 can rotate relative to the frame 10, thereby adjusting the height of the frame 10 off the ground and the flatness when placed. The casters 15 make it convenient for users to move the depaneling machine 1 under different environmental conditions. The frame 10 is covered by a shell 16, which is made of sheet metal. The protective cavity formed by the shell 16 can ensure the cleanliness of the various mechanisms and electronic components of the depaneling machine 1 to a large extent, extend the service life of the depaneling machine 1, and avoid the impact of impurities in the external environment on the depaneling process, thereby improving the depaneling yield. The conveying station 11 and the cutting station 12 formed by the rack 10 are pre-set spatial areas of the rack 10. That is, the conveying station 11 is used to convey the PCB board 2, and the cutting station 12 is used to cut the PCB board 2.

[0041] A material transfer device 20 is located at the conveying station 11 and is used to transfer PCB boards 2. A carrying device 30 is located on the frame 10 and reciprocates between the conveying station 11 and the cutting station 12. The cutting device (not shown) includes a mounting base 41, a cutting drive 42, a cutter 43, and a support structure 44. The mounting base 41 is located at the cutting station 12, and the cutting drive 42 is located on the mounting base 41 and has a mounting end 42a and a connecting end 42b arranged opposite to each other. The connection trajectory line of the mounting end 42a and the connecting end 42b is set at a 90° angle with the downward cutting direction. The cutter 43 is connected to the connecting end 42b and is located on the upper part of the carrying device 30. The support structure 44 is fixedly connected to the mounting end 42a and the frame 10 and is located on the lower part of the mounting base 41.

[0042] The working principle of the PCB depaneling machine 1 of the present invention is as follows: In the initial position, the carrier device 30 is located at the conveying station 11. The PCB board 2 to be cut is conveyed to the carrier device 30 by the material transfer device 20. The carrier device 30 moves to the cutting station 12. Under the drive of the cutting drive component 42, the cutter 43 moves toward the carrier device 30 to cut the PCB board 2. After the cutting is completed, the carrier device 30 moves back to the conveying station 11. The material transfer device 20 conveys the cut PCB board 2 to the next station. The cycle repeats. In this way, the depaneling efficiency of the PCB depaneling machine 1 is high.

[0043] Please see Figure 6 and Figure 7 In this invention, the cutter 43 is connected to the connecting end 42b of the cutting drive 42. The connecting trajectory line formed by the connecting end 42b and the mounting end 42a is perpendicular to the cutting direction of the cutter 43. The support structure 44 is fixedly connected to the mounting end 42a and the frame 10 and is located at the lower part of the mounting base 41. Force analysis shows that when the cutter 43 cuts the PCB board 2, the connecting end 42b of the cutting drive 42 is subjected to a reaction force F1 from the PCB board 2, in the opposite direction to the downward cutting direction. At this time, the cutting drive 42 and the cutter 43 tend to tilt upward. The force F2 of the mounting end 42a acts on the support structure 44 in the downward cutting direction, while the reaction force F3 of the support structure 44 acts on the connecting end 42b. That is, the support structure 44 abuts against the lower part of the mounting base 41 and is far away from the connecting end 42b. This can largely prevent the cutter 43 and the cutting drive 42 from tilting upward during the cutting of the PCB board 2, so that the cutter 43 can cut the PCB board 2 to the preset depth, thereby improving the cutting effect of the PCB board 2.

[0044] Specifically, in the embodiments of the present invention, the support structure 44 includes a limiting protrusion 441 and a limiting seat 442. The workbench surface of the frame 10 is provided with a gantry fixing structure. The limiting seat 442 is fixedly connected to the gantry fixing structure by screws. The limiting seat 442 extends along the cutting direction of the cutter 43 and is formed by machining with a limiting mounting groove 442a. The cross-sectional shape of the limiting mounting groove 442a is a dovetail groove. The shape of the limiting protrusion 441 is adapted to the shape of the dovetail groove and is fixedly connected to the lower part of the mounting seat 41 by screws. The limiting protrusion 441 is slidably embedded in the limiting mounting groove 442a. The limiting protrusion 441 and limiting seat 442 in this invention not only provide good support for the mounting base 41 located at its upper end, preventing it from tilting upwards when subjected to force, but also the limiting protrusion 441 and limiting seat 442 are detachably slidably connected. In this way, during the specific installation and maintenance process, users can easily replace the limiting protrusion 441 of different heights according to actual needs, so that the depaneling machine 1 can better adapt to the production of different PCB boards 2.

[0045] Please see Figure 2 and Figure 3 In one embodiment of the present invention, the cutting drive 42 includes a cutting linear module 421 and a lowering cylinder 422. The cutting linear module 421 is mounted on the mounting base 41, the lowering cylinder 422 is throttle-connected to the cutting linear module 421, and the cutter 43 is throttle-connected to the output end of the lowering cylinder 422.

[0046] Specifically, the cutting linear module 421 is fixed to the mounting base 41 by screws and is located at the cutting station 12. The cutting cylinder 422 is connected to the cutting linear module 421. The cutter 43 is rotatably connected to the telescopic rod of the cutting cylinder 422 and is located above the support device 30. Driven by the cutting cylinder 422, the cutter 43 reciprocates toward the support device 30 to cut the PCB board 2 placed on its surface.

[0047] Please see Figure 9 and Figure 10 Furthermore, in this embodiment, the cutter 43 includes a cutter body 431, a first cutter holder 432, a second cutter holder 433, and a rotary drive component 434. The rotary drive component 434 includes a servo motor and a transmission component. The first cutter holder 432 is tractively connected to the telescopic rod of the lower cutter cylinder 422. The servo motor is mounted on the first cutter holder 432. The second cutter holder 433 is rotatably connected to the first cutter holder 432. The transmission component is connected to the first cutter holder 432 and the servo motor. The cutter body 431 is rotatably connected to the second cutter holder 433. Driven by the servo motor, the transmission component drives the cutter body 431 to rotate relative to the first cutter holder 432, so that the cutter body 431 presents a certain angle with the PCB board 2 to be cut, thereby adapting to the production of different PCB boards 2.

[0048] For example, in one embodiment, the PCB board 2 to be cut needs to be cut longitudinally and laterally. When the PCB board 2 is placed on the carrier device 30, the servo motor drives the cutter 43 to rotate 90 degrees, so that the blade of the cutter body 431 is aligned with the movement direction of the carrier device 30. Driven by the lowering cylinder 422, the cutter body 431 moves downward to a preset position. During the process of the carrier device 30 moving from the conveying station 11 to the cutting station 12, the cutter body 431 abuts against the surface of the PCB board 2 and cuts it longitudinally. Then the cutter body 431 is lifted upward, and the servo motor drives the cutter body 431 to rotate 90 degrees again, so that the blade of the cutter body 431 is aligned with the movement direction of the cutting linear module 421. After rotating to the correct position, the cutter body 431 moves downward and abuts against the surface of the PCB board 2 again. Driven by the cutting linear module 421, the cutter body 431 rolls laterally on the surface of the PCB board 2 to cut it. Thus, without needing to replace PCB board 2, the cutting device can cut PCB board 2 in at least two directions, resulting in higher board separation efficiency and better compatibility for the board separator 1.

[0049] In another embodiment, the cutting trajectory of the PCB board 2 to be cut forms a 45-degree angle with the movement trajectory of the support device 30, that is, the cutter 43 needs to cut the PCB board 2 in an inclined direction. At this time, driven by the servo motor, the blade 431 rotates 45 degrees, so that the blade edge coincides with the trajectory to be cut. The blade 431 moves downward and abuts against the surface of the PCB board 2. At this time, the support device 30 and the cutting linear module 421 move simultaneously, that is, through the superposition of the longitudinal and transverse movement directions, the blade 431 can cut the PCB board 2 in an inclined direction. In this way, the cutting device can cut the PCB board 2 in multiple directions, and the compatibility of the depaneling machine 1 is further improved.

[0050] It is understood that in the above embodiments, the transmission component is used to drive the servo motor and the second tool holder 433, and this transmission component can be a gear transmission structure. That is, the output shaft of the servo motor is fitted with a driving gear, and the second tool holder 433 is fitted with a driven gear, with the driven gear meshing with the driving gear. The transmission component can also be a belt pulley transmission structure, which is not specifically limited here.

[0051] Furthermore, the supporting device 30 includes a supporting drive component 31, a carrier plate 32, and a pressure plate 33. The pressure plate 33 includes a plate body 331 and a pressing drive component 332, which includes a pressing cylinder, a connecting seat, and a positioning cylinder. Specifically, the supporting drive component 31 is fixedly connected to the frame 10, and the carrier plate 32 is throttle-connected to the supporting drive component 31. Driven by the supporting drive component 31, the carrier plate 32 reciprocates between the conveying station 11 and the cutting station 12 relative to the frame 10. The surface of the carrier plate 32 is machined to form a through hole that penetrates both the upper and lower surfaces. The telescopic rod of the pressing cylinder extends out of the through hole toward the upper part of the carrier plate 32. The connecting seat is fixedly connected to the end of the telescopic rod of the pressing cylinder by screws. A slide rail is installed on the inner side of the connecting seat toward the carrier plate 32. The slide rail extends along the length of the carrier plate 32. The side of the plate body 331 toward the connecting seat is machined to form a groove that matches the slide rail. The slide rail is slidably embedded in the groove, slidably connecting the plate body 331 and the connecting seat.

[0052] In practical applications, the carrier drive 31 drives the carrier plate 32 to move to the conveying station 11, and the avoidance cylinder drives the pressure plate 33 to move, exposing the carrier plate 32 and avoiding interference when placing the PCB board 2. The material transfer device 20 places the PCB board 2 to be cut on the carrier plate 32, the avoidance cylinder drives the pressure plate 33 to move above the PCB board 2, and the pressing cylinder drives the connecting seat to move downward, so that the board body 331 is pressed against the surface of the PCB board 2 and cooperates with the carrier plate 32 to fix it. The carrier drive 31 drives the carrier plate 32 to move to the cutting station 12, and the cutting cylinder 422 drives the cutter 43 to move towards the side of the carrier plate 32. After reaching the preset position, the cutting linear module 421 drives the cutting cylinder 422 to move laterally so that the cutter 43 cuts along the extension direction of the PCB board 2. After cutting, the lowering cylinder 422 drives the cutter 43 to move upward, the carrying drive component 31 drives the carrier plate 32 to move back to the conveying station 11, the pressing cylinder drives the connecting seat to move upward, releasing the cut PCB board 2, the avoidance cylinder drives the plate body 331 to move relative to the carrier plate 32, the material transfer device 20 grabs the cut PCB board 2 and conveys it to the next section.

[0053] In this invention, the pressure plate 33 not only fixes the PCB board 2 to be cut, ensuring that the cutter 43 cuts the PCB board 2 along the preset trajectory line, but also flattens the PCB board 2 through the force of the pressure cylinder and the plate body 331, preventing the PCB board 2 from warping and deforming during the cutting process, thereby ensuring the flatness of the PCB board 2 after cutting to a greater extent and improving the separation effect of the PCB board 2.

[0054] Furthermore, in this embodiment, the cutting device also includes a visual positioning camera 45 and a height detection sensor 46. The visual positioning camera 45 is a charge-coupled device (CCD) camera, mounted on the lower blade cylinder 422, and communicates with the cutting linear module 421 via an electronic connection line. The height detection sensor 46 is mounted on the frame 10 and communicates with the lower blade cylinder 422 via an electronic connection line. When the PCB board 2 on the carrier board 32 moves to the cutting station 12, the visual positioning camera 45 captures the position of the PCB board 2 and sends its position information to one side of the cutting linear module 421, which then drives the lower blade cylinder 422 to move accurately to a preset position. The height detection sensor 46 detects the position of the PCB board 2 in the height direction and sends a signal to one side of the lower blade cylinder 422, which then drives the cutter 43 to move accurately downward to the preset position to cut the PCB board 2. By setting the visual positioning camera 45 and the height detection sensor 46, the accuracy of the depaneling machine 1 can be significantly improved in this application.

[0055] Furthermore, in one embodiment of this application, a dust collection platform 13 is also provided at the cutting station 12. This dust collection platform 13 has a dust collection hole connected to a negative pressure pump via a pipe. Multiple dust passage holes 32a are provided on the carrier plate 32, penetrating both the upper and lower surfaces of the carrier plate 32. At the cutting station 12, the carrier plate 32 is positioned above the dust collection platform 13. When cutting the PCB board 2, debris generated during the separation process enters the dust collection hole through the dust passage hole 32a. By providing the dust passage hole 32a and the dust collection platform 13, this application can absorb the debris and dust generated during cutting, thereby ensuring the cleanliness of the separation machine 1 to a greater extent.

[0056] In one embodiment of the present invention, the material transfer device 20 includes a loading dock 21, a gripper (not shown), and a unloading conveyor belt 23 arranged sequentially at intervals on the frame 10. The gripper moves between the loading dock 21 and the unloading conveyor belt 23 to grip the PCB board 2 from the loading dock 21 or to grip the PCB board 2 to one side of the unloading conveyor belt 23.

[0057] Please refer to Figure 4 and Figure 5Specifically, the material gripping component includes a material gripping linear module 221, a mounting frame 222, a feeding nozzle 223, and a discharging nozzle 224. The material gripping linear module 221 is fixedly connected to the frame 10 and located at the conveying station 11, while the mounting frame 222 is drivenly connected to the material gripping linear module 221. In this application, there are two mounting brackets 222. One mounting bracket 222 is used to install multiple feeding suction nozzles 223, and the other mounting bracket 222 is used to install multiple unloading suction nozzles 224. The multiple feeding suction nozzles 223 are arranged adjacent to the side of the feeding dock 21, and the multiple unloading suction nozzles 224 are arranged adjacent to the side of the unloading conveyor belt 23. In this way, when the material gripping linear module 221 drives the feeding suction nozzles 223 to grip the PCB board 2 on the feeding dock 21, the unloading suction nozzles 224 can pick up the PCB board 2 that has been cut on the conveyor station 11. When the feeding suction nozzles 223 place the PCB board 2 to be cut on the carrier board 32 on the conveyor station 11, the unloading suction nozzles 224 can just place the PCB board 2 on the unloading conveyor belt 23, which will then transport it to the next section. The feeding suction nozzles 223 and unloading suction nozzles 224 continuously pick up the PCB board 2, so the gripping component has high efficiency in gripping and placing the PCB board 2. Meanwhile, this application uses the loading nozzle 223 and unloading nozzle 224 to pick up the PCB board 2, which can largely avoid scratching the surface of the PCB board 2, thereby improving the yield of PCB board 2 separation.

[0058] To enable the gripper to adapt to PCB boards 2 of different models and sizes, i.e., the positions of the loading nozzle 223 and the unloading nozzle 224 are adjustable, in one embodiment of the present invention, the mounting frame 222 includes a frame body 2221, a first mounting rod 2222, a second mounting rod 2223, a first connector, and a second connector. The frame body 2221 is formed from a metal profile through machining, and its overall shape is rectangular. The frame body 2221 is fixedly connected to the gripping linear module 221 and has openings... The fixing hole 2221a extends along the moving direction of the bearing device 30, that is, the fixing hole 2221a is a strip-shaped hole. The first mounting rod 2222 has a first mounting hole 2222a and a first waist-shaped hole 2222b. The first waist-shaped hole 2222b extends along the length direction of the first mounting rod 2222. The second mounting rod 2223 has a second waist-shaped hole 2223a. The second waist-shaped hole 2223a extends along the length direction of the second mounting rod 2223. The first connector passes through the first mounting hole 2222a and the fixing hole 2221a, connecting the first mounting rod 2222 and the frame 2221. The second connector passes through the second waist-shaped hole 2223a and the first waist-shaped hole 2222b, connecting the second mounting rod 2223 and the first mounting rod 2222. The end of the second mounting rod 2223 is provided with a locking hole, in which the feeding nozzle 223 and the unloading nozzle 224 are engaged. In this application, the first and second connectors can be screws or pins. The first mounting rod 2222 can be installed at any position along the extension direction of the fixing hole 2221a, and the second mounting rod 2223 can be installed at any position along the extension direction of the first oblong hole 2222b. Simultaneously, the second mounting rod 2223 can also be tilted and rotated relative to the first mounting rod 2222. That is, by adjusting the installation positions of the first mounting rod 2222 and the second mounting rod 2223, the loading nozzle 223 or the unloading nozzle 224 can be installed at any position on the frame 2221. The installation positions of these multiple loading nozzles 223 or multiple unloading nozzles 224 can well adapt to the production needs of different PCB boards 2, making the depaneling machine 1 more compatible.

[0059] In one embodiment of the present invention, the material conveying device 20 further includes a waste trough 24, which is located at the conveying station 11 and inclined towards the lower part of the frame 10. The waste trough 24 is located below the unloading suction nozzle 224. The cut PCB board 2 is moved from the carrier board 32 to the conveying station 11. The unloading suction nozzle 224 picks up the cut PCB board 2 and the waste board edge. Driven by the material gripping linear module 221, the unloading suction nozzle 224 moves above the waste trough 24. The unloading suction nozzle 224 that has partially picked up the waste board edge releases the vacuum. Under its own gravity, the waste board edge falls into the waste trough 24 located below it and slides to the outside of the waste trough 24. The cut PCB board 2 is released onto the unloading conveyor belt 23. In this way, the cleaning of the waste board edge is more convenient, and the efficiency of the depaneling machine 1 is further improved.

[0060] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A PCB depaneling machine, applied to PCB boards, characterized in that, The depaneling machine includes: The frame is equipped with a conveyor station and a cutting station; A material transfer device is provided at the transfer station for transferring the PCB board; A carrying device, disposed on the frame, reciprocates between the conveying station and the cutting station; and A cutting device includes a mounting base, a cutting drive, a cutter, and a support structure. The mounting base is located at the cutting station, and the cutting drive is located on the mounting base and has a mounting end and a connecting end that are arranged opposite to each other. The connection trajectory line of the mounting end and the connecting end is set at a 90° angle with the cutting direction. The cutter is connected to the connecting end and is located on the upper part of the bearing device. The support structure is fixedly connected to the mounting end and the frame and is located on the lower part of the mounting base.

2. The PCB depaneling machine as described in claim 1, characterized in that, The support structure includes a limiting protrusion and a limiting seat. The limiting seat is fixedly connected to the frame and extends along the cutting direction of the cutter. The limiting seat is provided with a limiting mounting groove, and the limiting protrusion is embedded in the limiting mounting groove.

3. The PCB depaneling machine as described in claim 2, characterized in that, The cutting drive includes a cutting linear module and a lowering cylinder. The cutting linear module is mounted on the mounting base, the lowering cylinder is driven to the cutting linear module, and the cutter is driven to the output end of the lowering cylinder.

4. The PCB depaneling machine as described in claim 3, characterized in that, The cutting blade includes a blade body, a first blade holder, a second blade holder, and a rotary drive component. The first blade holder is throttle-connected to the lower blade cylinder. The rotary drive component is mounted on the first blade holder. The second blade holder is rotatably connected to the first blade holder and throttle-connected to the rotary drive component. The blade body is rotatably connected to the second blade holder.

5. The PCB depaneling machine as described in claim 1, characterized in that, The material transfer device includes a loading dock, a gripping component, and a unloading conveyor belt arranged sequentially at intervals on the frame. The gripping component moves between the loading dock and the unloading conveyor belt to grip PCB boards from the loading dock or to grip the PCB boards to one side of the unloading conveyor belt.

6. The PCB depaneling machine as described in claim 5, characterized in that, The material gripping component includes a material gripping linear module, a mounting frame, a feeding nozzle, and a discharging nozzle. The material gripping linear module is disposed at the conveying station. The mounting frame is drivenly connected to the material gripping linear module. The feeding nozzle and the discharging nozzle are detachably connected to the mounting frame. The feeding nozzle is adjacent to the feeding docking platform, and the discharging nozzle is adjacent to the discharging conveyor belt.

7. The PCB depaneling machine as described in claim 6, characterized in that, The mounting frame includes a frame body, a first mounting rod, a second mounting rod, a first connector, and a second connector. The frame body is connected to the material gripping linear module and has a fixing hole. The fixing hole extends along the moving direction of the bearing device. The first mounting rod has a first mounting hole and a first oblong hole, and the second mounting rod has a second oblong hole. The first connector passes through the first mounting hole and the fixing hole to connect the first mounting rod and the frame. The second connector passes through the second waist-shaped hole and the first waist-shaped hole to connect the second mounting rod and the first mounting rod. The feeding nozzle and the unloading nozzle are fixed to the second mounting rod.

8. The PCB depaneling machine as described in claim 7, characterized in that, The material conveying device also includes a waste trough, which is located at the conveying station and inclined toward the lower part of the frame. The waste trough is located below the feeding nozzle.

9. The depaneling machine as described in any one of claims 1 to 8, characterized in that, The bearing device includes a bearing drive component, a carrier plate, and a pressure plate. The bearing drive component is disposed on the frame, the carrier plate is drivenly connected to the bearing drive component, and the pressure plate can move toward or away from the carrier plate to press a portion of the PCB board onto the carrier plate.

10. The PCB depaneling machine as described in claim 9, characterized in that, The pressure plate includes a plate body and a pressing drive component. The pressing drive component is disposed on the carrier plate, and the plate body is throttledly connected to the pressing drive component. The pressing drive component drives the plate body to reciprocate toward or away from the carrier plate.

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