A FLASH chip packaging device and a packaging method

Abstract

The application relates to the field of chip packaging, in particular to a FLASH chip packaging equipment and a packaging method. The equipment comprises a rack, an intermittent discharging and extruding mechanism and a feeding mechanism. The intermittent discharging and extruding mechanism comprises a discharging box, a supporting plate, an elastic assembly, a lifting plate, a baffle, a piston assembly a, a piston assembly b, a piston cylinder, a push plate, a pressure bearing plate and a moving driving mechanism for driving the lifting plate to lift, the discharging box, the piston cylinder and the moving driving mechanism are arranged on the rack, the discharging box is internally provided with a vertical storage bin, the discharging box is provided with a horizontal through discharging channel, the bottom of the supporting plate is connected with the lifting plate through the elastic assembly, the baffle is arranged at the bottom of the discharging box, the piston assembly a is sealingly connected with one end of the piston cylinder in the vertical direction, the top end of the piston assembly a is connected with the lifting plate, and the piston assembly b is sealingly connected with the other end of the piston cylinder in the horizontal direction. The application can accurately align the lower packaging box, the chip and the upper packaging box, so as to guarantee the chip packaging quality.

Description

Technical Field

[0001] This invention relates to the field of chip packaging, and in particular to a FLASH chip packaging device and packaging method. Background Technology

[0002] A chip is a miniature integrated circuit, a method of miniaturizing circuits in electronics, and is often manufactured on the surface of a semiconductor wafer. Chips are inherently fragile, and during transportation, exposed chips are inevitably touched, causing damage to the microcircuits and pins on the chip's surface. Damaged chips are no longer usable.

[0003] Chinese Patent Publication No. CN113921426B discloses a novel radio frequency chip packaging device, belonging to the field of chip manufacturing. It includes a conveyor belt and chips placed on the conveyor belt. Packaging box pushing mechanisms are provided above and below the conveyor belt. The conveyor belt has drop holes for chip passage. The packaging box pushing mechanisms and the conveyor belt are mounted on a fixed frame. The upper and lower packaging boxes are interlocked under the pressure of two packaging hydraulic cylinders, encapsulating the chip within the sealed box formed by the upper and lower packaging boxes, completing the packaging process. This device can simultaneously complete chip loading and packaging, and the packaging steps are fast and efficient. The pushing hydraulic cylinder and the packaging hydraulic cylinder are connected by oil pipes, moving in opposite directions and interlocked in their movement. The packaging boxes and chips cooperate in loading, enabling continuous chip packaging and efficient production.

[0004] However, the solution described in the aforementioned patent has the following shortcomings:

[0005] When the upper packaging hydraulic cylinder pushes the upper packaging box downwards, the upper packaging box may become misaligned, causing it to fail to align with the lower packaging box and thus fail to accurately fasten the upper and lower packaging boxes together. Summary of the Invention

[0006] The purpose of this invention is to address the problems existing in the background technology by proposing a FLASH chip packaging device and packaging method that can accurately align the lower packaging box, the chip, and the upper packaging box, thereby ensuring the chip packaging quality.

[0007] On the one hand, the present invention proposes a FLASH chip packaging device, including a frame, an intermittent feeding and extrusion mechanism, and a feeding mechanism;

[0008] The intermittent discharge and extrusion mechanism includes a feeding box, a pallet, an elastic component, a lifting plate, a baffle, piston assembly a, piston assembly b, a piston cylinder, a push plate, a pressure plate, and a moving drive mechanism for driving the lifting plate to rise and fall. The feeding box, piston cylinder, and moving drive mechanism are all mounted on the frame. The feeding box has a vertical storage bin inside, in which multiple lower packaging boxes are stacked. The feeding box has a horizontally penetrating discharge channel that connects to the bottom of the storage bin. The pallet is located on one side of the feeding box, and the bottom of the pallet is connected to the lifting plate through the elastic component. The baffle is located at the bottom of the feeding box. The lifting plate has a groove for the baffle to pass through. Piston assembly a is slidably and sealingly connected to one end of the piston cylinder in the vertical direction. The top of piston assembly a is connected to the lifting plate. Piston assembly b is slidably and sealingly connected to the other end of the piston cylinder in the horizontal direction. The end of piston assembly b away from the piston cylinder is connected to the push plate. The pressure plate is mounted on the feeding box and is located above the pallet.

[0009] The feeding mechanism is mounted on the frame. The feeding mechanism clamps the chip and the upper package box and can intermittently feed the chip and the upper package box.

[0010] Preferably, multiple sets of elastic components are arranged in the array. The elastic components include a sliding rod, a stop, and an elastic element. The sliding rod is vertically arranged at the bottom of the support plate, passes through the lifting plate, and is slidably connected to the lifting plate. The stop is arranged at the bottom of the sliding rod, and the elastic element is vertically arranged. The two ends of the elastic element in the vertical direction are respectively connected to the stop and the lifting plate.

[0011] Preferably, the elastic element is a compression spring, which is sleeved on the outer periphery of the sliding rod.

[0012] Preferably, the moving drive mechanism is a pneumatic cylinder, an electric push rod, or a hydraulic cylinder.

[0013] Preferably, piston assembly a includes a connecting column a and a piston head a, the connecting column a being vertically arranged and its two ends being connected to the lifting plate and the piston head a respectively; piston assembly b includes a connecting column b and a piston head b, the connecting column b being horizontally arranged and its two ends being connected to the piston head b and the push plate respectively; piston cylinder includes a vertical cylinder section and a horizontal cylinder section, the vertical cylinder section being vertically distributed and the horizontal cylinder section being horizontally distributed, the piston head a being slidably and sealingly connected to the inner side of the vertical cylinder section, and the piston head b being slidably and sealingly connected to the inner side of the horizontal cylinder section.

[0014] Preferably, a positioning plate is provided on the top of the end of the pallet away from the feeding box.

[0015] Preferably, the feeding mechanism includes a rotating column, a mounting plate, an even number of assembly clamping assemblies evenly arranged around the mounting plate, and a drive mechanism for driving the rotating column to rotate. Each assembly clamping assembly includes a connecting rod, a mounting frame, two clamping plates, and two symmetrically distributed drive cylinders. The two ends of the connecting rod are connected to the mounting plate and the mounting frame, respectively. The drive cylinders are mounted on the mounting frame and are driven by the clamping plates. The mounting plate is mounted on the rotating column, the rotating column is rotatably mounted on the frame, and the drive mechanism is mounted on the frame.

[0016] Preferably, the drive mechanism includes a motor, a gear, a gear ring, and a mounting cover. The motor is mounted on the frame and is driven by the gear. The gear is meshed with the gear ring, which is mounted on a rotating column. The mounting cover is mounted on the frame, and the motor, gear, and gear ring are all located inside the mounting cover.

[0017] On the other hand, the present invention proposes a packaging method for the above-mentioned FLASH chip packaging device, comprising the following steps:

[0018] S1. Stack multiple lower packaging boxes into the storage bin, and clamp multiple chips and multiple upper packaging boxes at intervals on the feeding mechanism;

[0019] S2. The lifting plate is driven to move down by the moving drive mechanism. The lifting plate can drive the piston assembly a to slide down in the piston cylinder. The lifting plate can also drive the pallet to move down through the elastic component. After the pallet is blocked by the baffle, the top surface of the pallet is flush with the bottom surface of the storage bin. The lifting plate continues to move down. The lifting plate continues to drive the piston assembly a to slide down. When the piston assembly a moves down, it will squeeze the air inside the piston cylinder and drive the piston assembly b to slide away from the piston cylinder. The piston assembly b drives the push plate to move. The push plate pushes the lower packaging box located at the bottom in the storage bin out through the discharge channel and pushes the lower packaging box onto the pallet.

[0020] S3. A chip is placed onto the lower packaging box via the feeding mechanism;

[0021] S4. The upper package box is placed on the lower package box by the feeding mechanism, so that the chip is located between the lower package box and the upper package box;

[0022] S5. The lifting plate is driven to move upward by the moving drive mechanism. The lifting plate drives the piston assembly a to move upward. Due to the air pressure inside and outside the piston cylinder, the piston assembly b moves in the opposite direction. The push plate moves in the opposite direction, and the stacked lower packaging boxes move downward. After the push plate moves away, the lifting plate pushes the tray to move upward. The lower packaging box, chip and upper packaging box placed on the tray from bottom to top move upward until the upper packaging box moves to the pressure plate. The lower packaging box and upper packaging box are pressed together to achieve chip packaging.

[0023] S6. Repeat steps S2-S5 to perform continuous chip packaging operations.

[0024] Compared with the prior art, the present invention has the following beneficial technical effects:

[0025] This invention accurately aligns the lower packaging box, chip, and upper packaging box, ensuring chip packaging quality. A moving drive mechanism drives a lifting plate downwards. The lifting plate, via an elastic component, moves a support plate downwards to a baffle. The lifting plate also drives a push plate outwards via piston assembly a, piston cylinder, and piston assembly b, pushing the lower packaging box onto the support plate, thus loading the lower packaging box. Then, a loading mechanism sequentially aligns and stacks the chip and upper packaging box on the lower packaging box. Finally, the moving drive mechanism drives the lifting plate upwards, causing the lower and upper packaging boxes to snap together under pressure between the support plate and the pressure plate, thereby achieving chip packaging. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention;

[0027] Figure 2 This is a partial structural cross-sectional view of an embodiment of the present invention;

[0028] Figure 3 for Figure 2 Enlarged view of the structure at point A in the middle;

[0029] Figure 4 for Figure 2 Enlarged view of the structure at point B;

[0030] Figure 5 This is a schematic diagram of the intermittent loading of chips and upper packaging boxes according to an embodiment of the present invention.

[0031] Reference numerals: 1. Lower packaging box; 2. Chip; 3. Upper packaging box; 4. Feed box; 401. Feed channel; 5. Pallet; 6. Sliding rod; 7. Baffle; 8. Elastic element; 9. Lifting plate; 901. Groove; 10. Moving drive mechanism; 11. Baffle; 12. Connecting column a; 13. Piston cylinder; 14. Connecting column b; 15. Push plate; 16. Positioning plate; 17. Motor; 18. Gear; 19. Gear ring; 20. Rotating column; 21. Mounting plate; 22. Connecting rod; 23. Mounting bracket; 24. Drive cylinder; 25. Frame; 26. Mounting cover; 27. Pressure plate. Detailed Implementation

[0032] Example 1

[0033] like Figures 1-5 As shown in the figure, the FLASH chip packaging equipment proposed in this embodiment includes a frame 25, an intermittent discharge and extrusion mechanism, and a feeding mechanism.

[0034] The intermittent discharge and extrusion mechanism includes a feeding box 4, a pallet 5, an elastic component, a lifting plate 9, a baffle 11, a piston assembly a, a piston assembly b, a piston cylinder 13, a push plate 15, a pressure plate 27, and a moving drive mechanism 10 for driving the lifting plate 9 to rise and fall. The feeding box 4, the piston cylinder 13, and the moving drive mechanism 10 are all mounted on the frame 25. The moving drive mechanism 10 is a cylinder, an electric push rod, or a hydraulic cylinder. The feeding box 4 has a vertical storage bin inside, in which multiple lower packaging boxes 1 are stacked. The feeding box 4 has a horizontally penetrating discharge channel 401, which is connected to the storage bin. The bottom of the hopper is connected, the pallet 5 is located on the horizontal side of the feeding box 4, the bottom of the pallet 5 is connected to the lifting plate 9 through an elastic component, the baffle 11 is set at the bottom of the feeding box 4, the lifting plate 9 is provided with a groove 901 for the baffle 11 to pass through, the piston assembly a is slidably and sealed to one end of the piston cylinder 13 in the vertical direction, the top of the piston assembly a is connected to the lifting plate 9, the piston assembly b is slidably and sealed to the other end of the piston cylinder 13 in the horizontal direction, the end of the piston assembly b away from the piston cylinder 13 is connected to the push plate 15, the pressure plate 27 is set on the feeding box 4, and the pressure plate 27 is located above the pallet 5.

[0035] The feeding mechanism is mounted on the frame 25. The feeding mechanism clamps the chip 2 and the upper packaging box 3 and can intermittently feed the chip 2 and the upper packaging box 3.

[0036] The packaging method of the above-mentioned FLASH chip packaging equipment includes the following steps:

[0037] S1. Stack multiple lower packaging boxes 1 into the storage bin, and clamp multiple chips 2 and multiple upper packaging boxes 3 at intervals on the feeding mechanism;

[0038] S2. The lifting plate 9 is driven to move down by the moving drive mechanism 10. The lifting plate 9 can drive the piston assembly a to slide down in the piston cylinder 13. The lifting plate 9 can also drive the support plate 5 to move down through the elastic component. After the support plate 5 is blocked by the baffle 11, the top surface of the support plate 5 is flush with the bottom surface of the storage bin. The lifting plate 9 continues to move down. The lifting plate 9 continues to drive the piston assembly a to slide down. When the piston assembly a moves down, it will squeeze the air inside the piston cylinder 13 and drive the piston assembly b to slide away from the piston cylinder 13. The piston assembly b drives the push plate 15 to move. The push plate 15 pushes the lower packaging box 1 located at the bottom in the storage bin out through the discharge channel 401 and pushes the lower packaging box 1 onto the support plate 5.

[0039] S3. A chip 2 is placed onto the lower packaging box 1 by the feeding mechanism;

[0040] S4. The upper packaging box 3 is placed on the lower packaging box 1 by the feeding mechanism, so that the chip 2 is located between the lower packaging box 1 and the upper packaging box 3.

[0041] S5. The lifting plate 9 is driven to move upward by the moving drive mechanism 10. The lifting plate 9 drives the piston assembly a to move upward. Due to the air pressure inside and outside the piston cylinder 13, the piston assembly b moves in the opposite direction. The push plate 15 moves in the opposite direction, and the stacked lower packaging boxes 1 move downward. After the push plate 15 moves away, the lifting plate 9 pushes the tray 5 to move upward. The lower packaging box 1, chip 2 and upper packaging box 3 placed on the tray 5 from bottom to top move upward until the upper packaging box 3 moves to the pressure plate 27. The lower packaging box 1 and the upper packaging box 3 are fastened by squeezing to realize the packaging of chip 2. The lower packaging box 1 and the upper packaging box 3 are existing packaging boxes that can be fastened.

[0042] S6. Repeat steps S2-S5 to perform continuous chip packaging operations, thereby improving the chip packaging efficiency.

[0043] This embodiment accurately aligns the lower packaging box 1, chip 2, and upper packaging box 3, ensuring chip packaging quality. The lifting plate 9 is driven downwards by the moving drive mechanism 10. The lifting plate 9, through an elastic component, moves the support plate 5 downwards to the baffle 11. The lifting plate 9 can also drive the push plate 15 outwards via piston assembly a, piston cylinder 13, and piston assembly b, pushing the lower packaging box 1 onto the support plate 5, thus loading the lower packaging box 1. Then, the loading mechanism sequentially aligns and stacks the chip 2 and upper packaging box 3 on the lower packaging box 1. Finally, the moving drive mechanism 10 drives the lifting plate 9 upwards, causing the lower packaging box 1 and upper packaging box 3 to snap together between the support plate 5 and the pressure plate 27, thereby achieving chip 2 packaging.

[0044] Example 2

[0045] like Figures 1-5 As shown, this embodiment of the FLASH chip packaging device, compared to embodiment one, has multiple sets of elastic component arrays. The elastic components include a sliding rod 6, a stop 7, and an elastic element 8. The sliding rod 6 is vertically positioned at the bottom of the support plate 5, passing through and slidably connecting with the lifting plate 9. The stop 7 is positioned at the bottom of the sliding rod 6. The elastic element 8 is vertically positioned, with its two ends connected to the stop 7 and the lifting plate 9 respectively. The elastic element 8 is a compression spring, sleeved on the outer periphery of the sliding rod 6, allowing it to extend and retract stably without falling off. When the lifting plate 9 moves downwards and the support plate 5 is blocked by the stop 11, as the lifting plate 9 continues to move downwards, it slides downwards on the sliding rod 6. The elastic element 8 is compressed between the stop 7 and the lifting plate 9, allowing the piston assembly a to continue moving downwards, thereby realizing the outward movement of the push plate 15 to fully push the lower packaging box 1 onto the stationary support plate 5.

[0046] Example 3

[0047] like Figures 1-5As shown in the figure, the FLASH chip packaging device proposed in this embodiment, compared with the first embodiment, the piston assembly a in this embodiment includes a connecting post a12 and a piston head a, the connecting post a12 is vertically arranged and its two ends are respectively connected to the lifting plate 9 and the piston head a.

[0048] The piston assembly b includes a connecting column b14 and a piston head b. The connecting column b14 is horizontally positioned and its two ends are connected to the piston head b and the push plate 15, respectively.

[0049] The piston cylinder 13 includes a vertical cylinder section and a horizontal cylinder section. The vertical cylinder section is vertically distributed, and the horizontal cylinder section is horizontally distributed. Piston head a is slidably and sealingly connected to the inside of the vertical cylinder section, and piston head b is slidably and sealingly connected to the inside of the horizontal cylinder section. The two piston heads can slide stably, and the movement of the push plate 15 can be ultimately achieved by using air pressure.

[0050] Example 4

[0051] like Figures 1-5 As shown in the figure, in this embodiment of the FLASH chip packaging device, compared with the first embodiment, a positioning plate 16 is provided on the top of the end of the tray 5 away from the unloading box 4. The positioning plate 16 can position the extreme position of the lower packaging box 1 pushed by the push plate 15, so as to ensure that the lower packaging box 1 is in a more accurate packaging position.

[0052] Example 5

[0053] like Figures 1-5 As shown in this embodiment, a FLASH chip packaging device is proposed. Compared with Embodiment 1, in this embodiment, the feeding mechanism includes a rotating column 20, a mounting plate 21, an even number of assembly clamping assemblies evenly arranged around the mounting plate 21, and a driving mechanism for driving the rotating column 20 to rotate. Each assembly clamping assembly includes a connecting rod 22, a mounting frame 23, two clamping plates, and two symmetrically distributed driving cylinders 24. The two ends of the connecting rod 22 are respectively connected to the mounting plate 21 and the mounting frame 23. The driving cylinders 24 are mounted on the mounting frame 23 and are drivenly connected to the clamping plates. The mounting plate 21 is mounted on the rotating column 20, and the rotating column 20 is rotatably mounted on the frame 25. The driving mechanism is mounted on the frame 25. Chips 2 and upper packaging boxes 3 are clamped at intervals on the even number of assembly clamping assemblies. Specifically, the chips 2 or upper packaging boxes 3 are clamped by the two driving cylinders 24 in each assembly clamping assembly. The driving cylinders 24 drive the clamping plates to move, clamping the chips 2 or upper packaging boxes 3 between the two clamping plates.

[0054] The drive mechanism includes a motor 17, a gear 18, a gear ring 19, and a mounting cover 26. The motor 17 is mounted on the frame 25 and is driven by the gear 18. The gear 18 meshes with the gear ring 19, which is mounted on a rotating column 20. The mounting cover 26 is also mounted on the frame 25, with the motor 17, gear 18, and gear ring 19 all located inside the mounting cover 26. The motor 17 drives the gear 18 to rotate, which in turn drives the gear ring 19 to rotate. The gear ring 19 then drives the rotating column 20 to rotate. The rotating column 20, via the mounting plate 21, drives the multi-assembly clamp assembly to rotate, thereby rotating and conveying the chip 2 and the upper packaging box 3 to the upper packaging box 1 and placing them down sequentially, achieving accurate loading.

[0055] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. A FLASH chip packaging device, characterized in that, include: Rack (25); The intermittent discharge and extrusion mechanism includes a feeding box (4), a pallet (5), an elastic component, a lifting plate (9), a baffle (11), a piston assembly a, a piston assembly b, a piston cylinder (13), a push plate (15), a pressure plate (27), and a moving drive mechanism (10) for driving the lifting plate (9) to rise and fall. The feeding box (4), the piston cylinder (13), and the moving drive mechanism (10) are all mounted on the frame (25). The feeding box (4) has a vertical storage bin inside, and multiple lower packaging boxes (1) are stacked in the storage bin. The feeding box (4) has a horizontally penetrating discharge channel (401), which is connected to the bottom of the storage bin. The pallet (5) Located on the horizontal side of the feeding box (4), the bottom of the tray (5) is connected to the lifting plate (9) through an elastic component. The baffle (11) is set at the bottom of the feeding box (4). The lifting plate (9) is provided with a groove (901) for the baffle (11) to pass through. The piston assembly a is slidably and sealed to one end of the piston cylinder (13) in the vertical direction. The top end of the piston assembly a is connected to the lifting plate (9). The piston assembly b is slidably and sealed to the other end of the piston cylinder (13) in the horizontal direction. The end of the piston assembly b away from the piston cylinder (13) is connected to the push plate (15). The pressure plate (27) is set on the feeding box (4) and is located above the tray (5); and A feeding mechanism is set on a frame (25), which holds a chip (2) and an upper package box (3) and can intermittently feed the chip (2) and the upper package box (3).

2. The FLASH chip packaging equipment according to claim 1, characterized in that, Multiple sets of elastic components are arranged in the array. The elastic components include a sliding rod (6), a stop (7), and an elastic element (8). The sliding rod (6) is vertically arranged at the bottom of the support plate (5). The sliding rod (6) passes through the lifting plate (9) and is slidably connected to the lifting plate (9). The stop (7) is arranged at the bottom of the sliding rod (6). The elastic element (8) is vertically arranged. The two ends of the elastic element (8) in the vertical direction are connected to the stop (7) and the lifting plate (9) respectively.

3. The FLASH chip packaging device according to claim 2, characterized in that, The elastic element (8) is a compression spring, and the elastic element (8) is sleeved on the outer periphery of the sliding rod (6).

4. The FLASH chip packaging device according to claim 1, characterized in that, The moving drive mechanism (10) is a pneumatic cylinder, an electric push rod, or a hydraulic cylinder.

5. The FLASH chip packaging equipment according to claim 1, characterized in that, Piston assembly a includes a connecting column a (12) and a piston head a. The connecting column a (12) is vertically arranged and its two ends are respectively connected to the lifting plate (9) and the piston head a. Piston assembly b includes a connecting column b (14) and a piston head b. The connecting column b (14) is horizontally arranged and its two ends are respectively connected to the piston head b and the push plate (15). Piston cylinder (13) includes a vertical cylinder and a horizontal cylinder. The vertical cylinder is vertically distributed and the horizontal cylinder is horizontally distributed. The piston head a is slidably and sealed to the inside of the vertical cylinder, and the piston head b is slidably and sealed to the inside of the horizontal cylinder.

6. The FLASH chip packaging device according to claim 1, characterized in that, A positioning plate (16) is provided on the top of the end of the pallet (5) away from the feeding box (4).

7. The FLASH chip packaging device according to claim 1, characterized in that, The feeding mechanism includes a rotating column (20), a mounting plate (21), an even number of assembly clamping assemblies evenly arranged around the mounting plate (21), and a drive mechanism for driving the rotating column (20) to rotate. Each assembly clamping assembly includes a connecting rod (22), a mounting frame (23), two clamping plates, and two symmetrically distributed drive cylinders (24). The two ends of the connecting rod (22) are connected to the mounting plate (21) and the mounting frame (23) respectively. The drive cylinders (24) are mounted on the mounting frame (23) and are driven by the clamping plates. The mounting plate (21) is mounted on the rotating column (20), the rotating column (20) is rotatably mounted on the frame (25), and the drive mechanism is mounted on the frame (25).

8. The FLASH chip packaging device according to claim 7, characterized in that, The drive mechanism includes a motor (17), a gear (18), a gear ring (19), and a mounting cover (26). The motor (17) is mounted on the frame (25). The motor (17) is driven by the gear (18). The gear (18) is meshed with the gear ring (19). The gear ring (19) is mounted on the rotating column (20). The mounting cover (26) is mounted on the frame (25). The motor (17), gear (18), and gear ring (19) are all located inside the mounting cover (26).

9. A packaging method for a FLASH chip packaging device according to claim 1, characterized in that, Includes the following steps: S1. Stack multiple lower packaging boxes (1) into the storage bin, and clamp multiple chips (2) and multiple upper packaging boxes (3) at intervals on the feeding mechanism; S2. The lifting plate (9) is driven to move down by the moving drive mechanism (10). The lifting plate (9) can drive the piston assembly a to slide down in the piston cylinder (13). The lifting plate (9) can also drive the tray (5) to move down through the elastic component. After the tray (5) is blocked by the baffle (11), the top surface of the tray (5) is flush with the bottom surface of the storage bin. The lifting plate (9) continues to move down. The lifting plate (9) continues to drive the piston assembly a to slide down. When the piston assembly a moves down, it will squeeze the air inside the piston cylinder (13) and drive the piston assembly b to slide away from the piston cylinder (13). The piston assembly b drives the push plate (15) to move. The push plate (15) pushes the lower packaging box (1) located at the bottom in the storage bin out through the discharge channel (401) and pushes the lower packaging box (1) onto the tray (5). S3. A chip (2) is placed onto the lower packaging box (1) by the feeding mechanism; S4. An upper package box (3) is placed on the lower package box (1) by a feeding mechanism, so that the chip (2) is located between the lower package box (1) and the upper package box (3); S5. The lifting plate (9) is driven to move upward by the moving drive mechanism (10). The lifting plate (9) drives the piston assembly a to move upward. Because of the air pressure inside and outside the piston cylinder (13), the piston assembly b moves in the opposite direction. The push plate (15) moves in the opposite direction, and the stacked lower packaging boxes (1) move downward. After the push plate (15) moves away, the lifting plate (9) pushes the tray (5) to move upward. The lower packaging box (1), chip (2) and upper packaging box (3) placed on the tray (5) from bottom to top move upward until the upper packaging box (3) moves to the pressure plate (27). The lower packaging box (1) and the upper packaging box (3) are pressed together to achieve the packaging of the chip (2). S6. Repeat steps S2-S5 to perform continuous chip packaging operations.

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