Water tank with drying mechanism and floor sweeper

Abstract

The application relates to the technical field of floor sweeping machines, in particular to a water tank with a drying mechanism and a floor sweeping machine, which comprises a mop assembly, the drying mechanism is arranged between the water tank and the mop assembly; the drying mechanism comprises a heating part arranged at the bottom of the water tank, a transferring part arranged at the bottom of the heating part and a heat radiating part connected with the transferring part. In the water tank with the drying mechanism, the drying mechanism can dry the mop assembly, the transferring part absorbs the heat emitted by the heating part, the heat of the transferring part is radiated through the heat radiating part, the heat is evenly radiated on the mop assembly, so that the mop assembly is dried and sterilized, and therefore the problem that bacteria breed due to the fact that the mop assembly cannot be heated and dried in the prior art can be solved.

Description

A water tank and sweeper with a drying mechanism Technical Field

[0001] This invention relates to the technical field of sweepers, and in particular to a water tank with a drying mechanism and a sweeper. Background Technology

[0002] Robotic vacuum cleaners, also known as automatic sweepers, smart vacuums, or robotic vacuums, are a type of smart home appliance that uses artificial intelligence to automatically clean floors in a room. They typically use a combination of brushing and vacuuming to collect debris into their dustbin, thus completing the cleaning process. Generally, robots that perform sweeping, vacuuming, and mopping are all categorized under the term "robot vacuum cleaner."

[0003] After the sweeper finishes mopping, the mop is wet or dripping wet, which can easily breed bacteria and cause secondary pollution when used again.

[0004] Therefore, existing technologies have shortcomings and need to be improved. Summary of the Invention

[0005] The main objective of this invention is to provide a water tank and a sweeper with a drying mechanism, which aims to solve the problem that bacteria grow when the mop cloth is not dried after the sweeper has finished mopping.

[0006] To achieve the above objectives, the technical solution of the present invention is as follows: a water tank with a drying mechanism for a sweeper, comprising: a mop assembly, wherein the drying mechanism is disposed between the water tank and the mop assembly;

[0007] The drying mechanism includes a heating element disposed at the bottom of the water tank, a transmission element disposed at the bottom of the heating element, and a heat dissipation element connected to the transmission element.

[0008] The transfer section is used to absorb the heat from the heating section, and the heat dissipation section is used to transfer the heat from the transfer section to the mop assembly for drying.

[0009] In the water tank with the drying mechanism described above, the drying mechanism further includes a refrigeration unit, which is located on the side away from the transmission unit and is used to cool the water tank.

[0010] Using the above technical solutions, in the water tank with drying mechanism, the transmission part includes a first conductive member, the heat dissipation part includes a heat dissipation fan, one side of the first conductive member is in contact with the heat-generating part, and the other side of the first conductive member is connected to the heat dissipation fan;

[0011] The first conductive element absorbs the heat from the heating element, and the heat from the first conductive element is sent out by the cooling fan through airflow to dry the mop assembly.

[0012] In the above-mentioned technical solutions, the water tank with the drying mechanism further includes a second conductive element. The second conductive element is in contact with the mop assembly. The second conductive element is used to absorb part of the heat sent out by the cooling fan and transfer the absorbed heat to the mop assembly.

[0013] In the above-mentioned technical solutions, the water tank with drying mechanism has an installation groove at the bottom, a temperature sensor is installed in the installation groove, and a sealing plug is provided at the bottom of the installation groove.

[0014] Using the above technical solutions, in the water tank with drying mechanism, the mop assembly includes a mop plate and a mop. The mop plate is connected to the second conductive member, and the mop is disposed on the mop plate. The mop plate is used to absorb the heat of the second conductive member and transfer it to the mop, so that the mop is heated and dried.

[0015] Using the above technical solutions, in the water tank with drying mechanism, the second conductive member is embedded in the mop plate to form a connection with the mop plate, and the second conductive member is facing the mop. An air inlet channel is also provided between the second conductive member and the cooling fan. The second conductive member is provided with several air outlet channels, and the air outlet channels are directed toward the mop.

[0016] When the cooling fan is working, airflow enters from the air inlet duct and is then blown onto the mop from the several air outlet ducts under the action of the cooling fan.

[0017] Using the above technical solutions, in the water tank with the drying mechanism, the periphery of the first conductive element has a hollow structure, and the heat dissipation fan is arranged between the hollow structures to accelerate the dissipation of heat.

[0018] In the above-mentioned technical solutions, the cooling part and the heating part in the water tank with the drying mechanism are integrally formed semiconductor elements.

[0019] A sweeper includes a water tank with a drying mechanism, the water tank with the drying mechanism being disposed on the sweeper.

[0020] The beneficial effects of this invention are as follows: In the water tank and sweeper with drying mechanism of this invention, the drying mechanism can dry the mop assembly. The heat is absorbed by the heat-generating part through the transmission part and dissipated through the heat dissipation part, so that the heat is evenly distributed on the mop assembly, thereby drying and sterilizing the mop assembly. This solves the problem of residual sewage in the mop assembly of existing sweepers, which leads to bacterial growth. Attached Figure Description

[0021] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present invention;

[0022] Figure 2 is a cross-sectional structural schematic diagram of a drying mechanism according to an embodiment of the present invention;

[0023] Figure 3 is an exploded structural diagram of a drying mechanism according to an embodiment of the present invention;

[0024] Figure 4 is a schematic cross-sectional view of a water tank according to an embodiment of the present invention;

[0025] Figure 5 is a schematic diagram of the structure of the first conductive element according to an embodiment of the present invention;

[0026] Figure 6 is a schematic diagram of a hollow structure according to an embodiment of the present invention.

[0027] Among them, 1-sweeper; 2-mop assembly; 3-drying mechanism; 30-heating part; 31-transmission part; 32-heat dissipation part; 33-cooling part; 310-first conductive component; 311-second conductive component; 320-heat dissipation fan; 4-temperature sensor; 5-water tank; 20-mop plate; 21-mop; 6-air inlet duct; 7-air outlet duct; 50-mounting groove; 51-sealing plug; 3101-hollow structure.

[0028] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0029] It should be understood that the embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0030] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] As shown in Figures 1 and 2, this application embodiment provides a water tank with a drying mechanism for a sweeper 1, including: a mop assembly 2, and the drying mechanism 3 is disposed between the water tank 5 and the mop assembly 2;

[0034] The drying mechanism 3 includes a heating part 30 disposed at the bottom of the water tank 5, a transmission part 31 disposed at the bottom of the heating part 30, and a heat dissipation part 32 connected to the transmission part 31.

[0035] The transmission part 31 is used to absorb the heat from the heating part 30, and the heat dissipation part 32 is used to send the heat from the transmission part 31 to the mop assembly 2 for drying.

[0036] In this embodiment, the drying mechanism 3 can dry the mop assembly 2. The heat is absorbed by the heating part 30 through the transmission part 31 and dissipated through the heat dissipation part 32, so that the heat is evenly distributed on the mop assembly 2, thereby drying and sterilizing the mop assembly 2. This solves the problem that the sweeper 1 in the prior art cannot heat and dry the mop assembly 2, resulting in bacterial residue.

[0037] In one embodiment, when the drying mechanism 3 is installed on the sweeper 1, the operation of the drying mechanism 3 can be controlled by the sweeper 1. When the sweeper 1 stops working or when the mop assembly 2 stops working, the heating component is controlled to start working. Heat is generated by the heating part 30 and transferred to the transfer part 31 by heat transfer. The transfer part can be made of a heat-sensitive material, such as aluminum, which has good thermal conductivity. The heat is dissipated by the heat dissipation part 32, so that the heat reaches the mop assembly 2 to achieve heating and drying. This allows the mop assembly 2 to be dried or disinfected after the work is completed, preventing the growth of bacteria in the undried mop assembly 2.

[0038] As shown in Figure 2, the drying mechanism 3 further includes a refrigeration unit 33, which is located on the side away from the transmission unit 31 and is used to refrigerate the water tank 5.

[0039] In this embodiment, the drying mechanism 3 is equipped with a cooling unit 33, which can cool down and inhibit bacteria in the water tank 5 on the sweeper 1. When the liquid in the water tank 5 is stored in the sweeper 1 for a long time and the water tank 5 is sealed to prevent the water in the water tank 5 from spilling out when it is moved, the liquid in the water tank 5 needs to be cooled down and inhibited to reduce the growth of bacteria. In addition, cooling can prevent the liquid in the water tank 5 from smelling bad, thereby improving the cleaning effect of the cleaning liquid in the water tank 5. The cooling unit 33 is set at the bottom of the water tank 5 and cools down the water tank 5 by temperature transfer, so that the cleaning liquid in the water tank 5 is cooled down.

[0040] As shown in Figure 3, the transmission part 31 further includes a first conductive member 310, and the heat dissipation part 32 includes a heat dissipation fan 320. One side of the first conductive member 310 is in contact with the heat-generating part 30, and the other side of the first conductive member 310 is connected to the heat dissipation fan 320.

[0041] The first conductive element 310 absorbs the heat from the heating element 30, and the heat from the first conductive element 310 is sent out by the cooling fan 320 through airflow to dry the mop assembly 2.

[0042] In this embodiment, the first conductive member 310 is used to absorb the heat from the heating element 30. The first conductive member 310 is in close contact with the heating element 30 to ensure uniform heat absorption. The first conductive member 310 can be configured as a semi-enclosed hollow structure 3101, so that the cooling fan 320 is positioned on the semi-enclosed structure (i.e., there is a groove at the bottom of the first conductive member 310, the cooling fan 320 is placed in the groove, and the periphery of the cooling fan 320 is the hollow structure 3101 of the first conductive member 310). The heat is concentrated on the hollow structure 3101 by the first conductive member 310. On 101, the heat dissipation effect of the cooling fan 320 can be improved. The heat on the first conductive component 310 is transferred to the mop assembly 2 by blowing air through the cooling fan. The flow of hot air can make the drying effect of the mop assembly 2 more uniform. Even the part of the mop assembly 2 that is far away from the drying mechanism can receive the heat of the hot air, so that the undried mop assembly 2 can get a better drying effect, preventing residual moisture on the mop assembly 2 from breeding bacteria, thereby improving the cleaning ability of the mop assembly 2 and preventing secondary pollution caused by bacterial growth.

[0043] As shown in Figure 3, the system further includes a second conductive element 311. The second conductive element 311 contacts the mop assembly 2 and is used to absorb some of the heat emitted by the cooling fan 320 and transfer the absorbed heat to the mop assembly 2. In this embodiment, the second conductive element 311 is provided so that the heat emitted by the cooling fan 320 cannot be completely absorbed by the mop assembly 2. By providing the second conductive element 311, some of the heat can be absorbed and transferred to the mop assembly 2 through contact. This allows the second conductive element 311 to assist the drying mechanism 3 in drying the mop assembly 2 by heat preservation, thereby improving the drying efficiency of the mop assembly 2 and saving energy consumption.

[0044] It is worth mentioning that, based on considerations such as the nature of the work and cost, the main body of the mop plate of the mop assembly 2 is often made of plastic. However, the heat absorption effect of plastic is not ideal. Therefore, a second conductive element 311 (such as a metal second conductive element 311) with better heat transfer / heat absorption function can be set to help absorb the heat emitted by the cooling fan 320 in all directions. Based on the contact between the second conductive element 311 and the mop assembly 2, the heat is transferred to the contact position of the mop assembly.

[0045] As shown in Figure 4, the bottom of the water tank 5 is provided with an installation groove 50, a temperature sensor 4 is provided in the installation groove 50, and a sealing plug 51 is provided at the bottom of the installation groove 50.

[0046] In this embodiment, the temperature sensor 4 is configured to detect the temperature of the water tank 5 on the sweeper 1. By electrically connecting the temperature sensor 4, the cooling unit 33, and the sweeper 1, the temperature sensor 4 detects the temperature inside the water tank 5 and can program the sweeper 1. When the temperature sensor 4 detects that the temperature inside the water tank 5 is higher than the preset temperature, it starts to control the cooling unit 33 to start cooling. When it detects that the temperature inside the water tank 5 is lower than the preset temperature, it stops working, thereby reducing energy consumption and cooling and inhibiting bacteria in the cleaning fluid inside the water tank 5.

[0047] Specifically, the water tank 5 can be used to load the cleaning fluid required by the sweeper 1 during cleaning, and can supply the cleaning fluid to the mop assembly 2 to clean the base plate. An installation groove 50 is set at the bottom of the water tank 5, and the temperature sensor 4 is placed in the installation groove 50. The temperature sensor 4 is sealed with a sealing plug 51 to prevent the cleaning fluid in the water tank 5 from soaking into the temperature sensor 4, thereby improving the service life of the temperature sensor 4. Furthermore, the extension direction of the groove is towards the inside of the water tank 5, which allows the temperature sensor 4 to detect the temperature of the cleaning fluid in the water tank 5 more accurately. At the same time, it does not occupy the space of the drying mechanism 3. The sealing plug 51 can prevent the heat from the heating part 30 from being transmitted into the temperature sensor 4, which would cause inaccurate detection.

[0048] As shown in Figure 2, the mop assembly 2 further includes a mop plate 20 and a mop 21. The mop plate 20 is connected to the second conductive member 311, and the mop 21 is disposed on the mop plate 20. The mop plate 20 is used to absorb the heat of the second conductive member 311 and transfer it to the mop 21, so that the mop 21 is heated and dried.

[0049] In this embodiment, the mop assembly 2 is configured to absorb heat transferred by the second conductive member 311 through the mop plate 20, and then dissipate the absorbed heat to the mop 21, thus drying the undried mop 21. The mop 21 has the same cleaning performance as the conventional sweeper 1, used to mop up dirt on the floor, and is cleaned by the cleaning liquid in the water tank 5. When the mop 21 is cleaned, it is easy to have water droplets or be in a undried state. The conventional sweeper 1 does not have the effect of drying the mop 21 or drying the residual water droplets on the mop 21. The mop 21 is in close contact with the mop plate 20. When the mop assembly 2 stops working, the mop 21 absorbs the heat from the mop plate 20 for heat transfer drying.

[0050] As shown in Figure 2, the second conductive member 311 is further inserted into the mop plate 20 to form a connection with the mop plate 20, and the second conductive member 311 faces the mop 21. An air inlet duct 6 is also provided between the second conductive member 311 and the cooling fan 320. The second conductive member 311 is provided with a plurality of air outlet ducts 7, which are directed toward the mop 21.

[0051] When the cooling fan 320 is working, the airflow enters from the air inlet 6 and is then blown onto the mop 21 from the air outlet 7 under the action of the cooling fan 320.

[0052] In this embodiment, the air inlet duct 6 allows airflow to the cooling fan 320 during operation. Airflow enters through the air inlet duct 6 and exits through the air outlet duct 7 on the second conductive member 311, balancing the airflow within the drying mechanism 3. This directly guides the hot airflow to the mop, reducing heat loss and improving the cooling effect of the cooling fan 320 during operation. Furthermore, the second conductive member 311, through an interlocking design, has at least two surfaces in contact with each other. This multi-faceted contact allows for faster heat transfer. In addition to the heat conducted through the mop plate, some of the heat absorbed by the second conductive member 311 can be effectively transferred to the opposing mop 21 through contact. Combined with the aforementioned air outlet duct 7 guiding towards the mop 21, this creates a circulating airflow towards the mop 21, improving the overall drying effect and speed of the mop 21.

[0053] In another embodiment, the second conductive member 311 and the mop plate 20 can be replaced with a mortise and tenon structure. The mortise and tenon structure makes the connection between the second conductive member 311 and the mop plate 20 more stable, and the mortise and tenon structure allows multiple end faces of the second conductive member 311 and the mop plate 20 to come into contact with each other, thereby improving the efficiency of heat transfer.

[0054] As shown in Figures 5 and 6, the first conductive member 310 has a hollow structure 3101 on its periphery, and the heat dissipation fan 320 is disposed between the hollow structure 3101 to accelerate the dissipation of heat.

[0055] In this embodiment, by setting the periphery of the first conductive member 310 as a hollow structure 3101 and the heat dissipation fan 320 is arranged between the hollow structures 3101, the heat of the first conductive member 310 can be dissipated more quickly on the hollow structure 3101 on the periphery. Furthermore, the heat dissipation fan 320 is located between the hollow structures 3101, causing the heat to accumulate around the heat dissipation fan 320. This allows the heat of the first conductive member 310 to be effectively dissipated by the heat dissipation fan 320, thereby drying the mop assembly 2.

[0056] As shown in Figure 3, the cooling unit 33 and the heating unit 30 are integrally formed semiconductor elements.

[0057] In this embodiment, the cooling unit 33 and the heating unit 30 are integrally formed semiconductor elements. By setting one side of the semiconductor as the cooling unit 33 and the other side as the heating unit 30, the cooling unit 33 and the heating unit 30 can be compactly arranged in the drying mechanism 3, improving space utilization. Furthermore, by realizing the functions of cooling and heating simultaneously through a single semiconductor element, energy consumption can be reduced, and practicality can be improved.

[0058] In one embodiment, the number of drying mechanisms 3 is two sets. In this embodiment, by setting the number of drying mechanisms 3 to two sets and distributing them between the mop assembly 2 and the water tank 5, the efficiency of cooling and heating drying is improved.

[0059] A sweeper 1 includes a water tank 5 with a drying mechanism 3, the water tank 5 with the drying mechanism 3 being disposed on the sweeper 1.

[0060] In this embodiment, the water tank 5 with the drying mechanism 3 is installed on the sweeper 1. The sweeper 1 controls the operation of the water tank 5 with the drying mechanism 3, thereby enabling the sweeper 1 to have the function of drying the mop assembly 2, preventing the growth of bacteria on the undried mop assembly 2.

[0061] In one embodiment, the sweeper 1 is further provided with a control system. The temperature sensor 4 detects the temperature signal of the water tank 5 and transmits it to the control system, which controls the working temperature of the refrigeration unit 33.

[0062] In this embodiment, the detection unit, the cooling unit 33 and the control system of the sweeper 1 are electrically connected. The detection unit detects the temperature in the water tank 5 and transmits the detected temperature signal to the control system. When the detection unit detects that the temperature in the water tank 5 is higher than the preset temperature, it starts to control the cooling unit 33 to start cooling. When the detection unit detects that the temperature in the water tank 5 is lower than the preset temperature, it starts to control the cooling unit 33 to stop working, thereby reducing energy consumption, realizing intelligent control of the cooling unit 33, and enabling the cleaning liquid in the water tank 5 to be cooled and sterilized.

[0063] By adopting the above-mentioned technical solutions, in the water tank and sweeper with drying mechanism of the present invention, the drying mechanism 3 can dry the mop assembly 2. The heat is absorbed by the heat-generating part 30 through the transmission part 31 and dissipated by the heat dissipation part 32, so that the heat is evenly distributed on the mop assembly 2, thereby drying and sterilizing the mop assembly 2. This solves the problem of residual sewage in the mop assembly 2 of the sweeper 1 in the prior art, which leads to bacterial growth. The cooling part 33 can cool down and inhibit bacteria in the water tank 5 on the sweeper 1. When the liquid in the water tank 5 is stored in the sweeper 1 for a long time, and the water tank 5 is sealed to prevent the water in the water tank 5 from spilling during movement, the liquid in the water tank 5 needs to be cooled down and sterilized to reduce bacterial growth. Cooling also prevents the liquid in the water tank 5 from smelling bad, thereby improving the cleaning effect of the cleaning liquid in the water tank 5 of the sweeper 1.

[0064] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A water tank with a drying mechanism for a sweeper, characterized in that, include: A mop assembly, wherein a drying mechanism is disposed between the water tank and the mop assembly; wherein the drying mechanism includes a heating element disposed at the bottom of the water tank, a transmission element disposed at the bottom of the heating element, and a heat dissipation element connected to the transmission element; the transmission element is used to absorb heat from the heating element, and the heat dissipation element is used to transfer the heat from the transmission element to the mop assembly for drying; the transmission element includes a first conductive member, and the heat dissipation element includes a cooling fan, one side of the first conductive member is in contact with the heating element, and the other side of the first conductive member is connected to the cooling fan; wherein the first conductive member absorbs heat from the heating element... The heat from the hot part is sent out by the cooling fan through the airflow of the first conductive member to dry the mop assembly; it also includes a second conductive member, which is in contact with the mop assembly. The second conductive member is used to absorb part of the heat sent out by the cooling fan and transfer the absorbed heat to the mop assembly. The second conductive member is provided so that the heat blown out by the cooling fan cannot be completely absorbed by the mop assembly. By setting the second conductive member, part of the heat can be absorbed and transferred to the mop assembly through contact, so that the second conductive member assists the drying mechanism in drying the mop assembly by heat preservation.

2. The water tank with a drying mechanism according to claim 1, characterized in that, The drying mechanism also includes a refrigeration unit, which is located on the side away from the transmission unit and is used to cool the water tank.

3. The water tank with a drying mechanism according to claim 1, characterized in that, The bottom of the water tank is provided with an installation groove, in which a temperature sensor is installed, and at the bottom of the installation groove is a sealing plug.

4. The water tank with a drying mechanism according to claim 1, characterized in that, The mop assembly includes a mop plate and a mop. The mop plate is connected to the second conductive member, and the mop is disposed on the mop plate. The mop plate is used to absorb the heat of the second conductive member and transfer it to the mop, so that the mop is heated and dried.

5. The water tank with a drying mechanism according to claim 4, characterized in that, The second conductive member is embedded in the mop plate to form a connection with the mop plate, and the second conductive member faces the mop. An air inlet is provided between the second conductive member and the cooling fan. The second conductive member is provided with several air outlets, which are directed toward the mop. When the cooling fan is working, the airflow enters from the air inlet and is then blown toward the mop from the several air outlets under the action of the cooling fan.

6. The water tank with a drying mechanism according to claim 4, characterized in that, The first conductive element has a hollow structure on its periphery, and the heat dissipation fan is disposed between the hollow structures to accelerate the dissipation of heat.

7. The water tank with a drying mechanism according to claim 2, characterized in that, The cooling section and the heating section are integrally formed semiconductor components.

8. A sweeper, comprising a water tank with a drying mechanism as described in any one of claims 1 to 7, wherein the water tank with the drying mechanism is disposed on the sweeper.

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