Display panel and display device
By integrating touch signals and display drivers into a comprehensive processing chip, the problems of large area and process differences in flexible circuit boards for OLED displays have been solved, resulting in reduced area, lower cost, and improved process yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2023-02-22
- Publication Date
- 2026-07-03
AI Technical Summary
OLED displays have a large flexible circuit board area, which leads to a wider driving section that occupies space in other structures. Furthermore, the difference in manufacturing processes between the touch signal section and the display driving section results in high costs, and complex film structures are required to isolate the intersecting traces.
It adopts a comprehensive processing chip that integrates the touch signal unit and the display driver unit. By replacing the area through the chip packaging structure, the space occupied by the driver unit is reduced, and the wiring is integrated into the chip to avoid intersection and reduce costs.
The reduced drive area avoids complex film structures, lowers costs, improves process yield and economy, and enhances heat dissipation capabilities.
Smart Images
Figure CN116259237B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and more particularly to a display panel and display device. Background Technology
[0002] Among related technologies, Organic Light Emitting Diode (OLED) display technology, as the benchmark for next-generation display technology, boasts advantages such as wide color gamut, wide viewing angle, high contrast, fast response, low power consumption, and suitability for flexible substrates. Consequently, it has experienced rapid development. In the process of development, OLED displays are increasingly being used in touch display products, thus placing increasingly higher demands on their performance.
[0003] However, OLED displays still have the problem of having a large area of flexible circuit boards. Summary of the Invention
[0004] This application provides a display panel and display device to address all or part of the shortcomings in the related art.
[0005] According to a first aspect of the present application, a display panel is provided, including a first panel portion, a curved portion, and a driving portion arranged in sequence; the curved portion is located between the first panel portion and the driving portion, the first panel portion is connected to the curved portion, and the curved portion is connected to the driving portion;
[0006] The first panel portion is at least configured to perform a display function, the driving portion is at least configured to drive the first panel portion to perform the display function, and the bending portion is at least configured to cause the orthographic projection of the driving portion on the first panel portion to be located within the first panel portion by bending itself.
[0007] The driving unit is provided with an integrated processing chip; the integrated processing chip is provided with an independent touch signal unit and a display driving unit; the touch signal unit is at least configured to receive touch signals from the first panel, and the display driving unit is at least configured to drive the first panel to perform display functions.
[0008] In some embodiments, the driving unit includes a second panel portion and a flexible circuit board; the second panel portion is located between the bent portion and the flexible circuit board, the second panel portion is connected to the bent portion, and the flexible circuit board is connected to the second panel portion;
[0009] The integrated processing chip is bonded to the second panel.
[0010] In some embodiments, the integrated processing chip further includes a packaging substrate and contact pins;
[0011] The display driving unit is located on the packaging substrate; the touch signal unit is located on the display driving unit, and the touch signal unit is located on the side of the display driving unit away from the packaging substrate; the contact pin is located on the side of the packaging substrate away from the touch signal unit and the display driving unit, and the contact pin is electrically connected to the touch signal unit and the display driving unit.
[0012] In some embodiments, the contact pin includes a first pin portion and a second pin portion; the first pin portion includes at least two first pins, and the second pin portion includes at least two second pins; the first pin portion surrounds the second pin portion.
[0013] The touch signal section is electrically connected to the first pin in the first pin section; the display driving section is electrically connected to the second pin in the second pin section.
[0014] In some embodiments, the integrated processing chip further includes an encapsulation portion; the encapsulation portion is located on the same side of the packaging substrate as the touch signal portion and the display driving portion, and directly covers the touch signal portion and the display driving portion;
[0015] The surface of the encapsulation portion away from the packaging substrate exposes the surface of the touch signal portion away from the packaging substrate.
[0016] In some embodiments, the integrated processing chip further includes a packaging substrate and contact pins;
[0017] The touch signal section is located on the packaging substrate; the display driving section is located on the touch signal section, and the display driving section is located on the side of the touch signal section away from the packaging substrate; the contact pin is located on the side of the packaging substrate away from the touch signal section and the display driving section, and the contact pin is electrically connected to the touch signal section and the display driving section.
[0018] In some embodiments, the contact pin includes a first pin portion and a second pin portion; the first pin portion includes at least two first pins, and the second pin portion includes at least two second pins; the first pin portion surrounds the second pin portion.
[0019] The display driver unit is electrically connected to the first pin in the first pin unit; the touch signal unit is electrically connected to the second pin in the second pin unit.
[0020] In some embodiments, the integrated processing chip further includes an encapsulation portion; the encapsulation portion is located on the same side of the packaging substrate as the touch signal portion and the display driving portion, and directly covers the touch signal portion and the display driving portion;
[0021] The surface of the encapsulation portion away from the packaging substrate exposes the surface of the display driving portion away from the packaging substrate.
[0022] In some embodiments, the integrated processing chip includes a packaging substrate and contact pins;
[0023] The touch signal section and the display driving section are both located on the packaging substrate and on the same side of the packaging substrate; the contact pins are located on the side of the packaging substrate away from the touch signal section and the display driving section.
[0024] According to a second aspect of the embodiments of this application, a display device is provided, including any of the above-described display panels.
[0025] As can be seen from the embodiments of this application, since the integrated processing chip is a chip package structure, its integration density is far superior to simply arranging the touch signal section and the display driver section close together. Therefore, by setting up an integrated processing chip that integrates the touch signal section and the display driver section, the area occupied by the integrated processing chip can replace the area occupied by the touch signal section and the display driver section. At the same time, the width of the driver section is avoided from becoming wider, thereby reducing the area occupied by the touch signal section and the display driver section, and correspondingly reducing the area occupied by the driver section. Furthermore, by setting up an integrated processing chip that integrates the touch signal section and the display driver section, different traces can be connected to the integrated processing chip, achieving the effect of traces converging at the integrated processing chip and dispersing from the integrated processing chip. This avoids the inevitable intersection of traces electrically connected to the touch signal section and traces electrically connected to the display driver section, and further avoids the need for complex film layer structures to ensure mutual isolation between different traces. Meanwhile, the integrated processing chip houses independent touch signal and display driver units, which are integrated together through a chip packaging structure. This design avoids forcibly unifying the manufacturing processes of the touch signal and display driver units, thereby reducing the area occupied by the driver unit and eliminating the need for complex film layer structures to ensure isolation between different traces. This reduces the cost of the integrated processing chip, making it more economical. Furthermore, the process complexity of mounting the entire integrated processing chip within the driver unit is lower than that of mounting the touch signal and display driver units separately, thus improving the yield rate of the integrated processing chip mounted within the driver unit.
[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.
[0028] Figure 1 This is a schematic diagram of the structure of a display panel according to an embodiment of this application;
[0029] Figure 2 This is a schematic diagram of the structure of a comprehensive processing chip according to an embodiment of this application;
[0030] Figure 3 This is a top view of a comprehensive processing chip according to an embodiment of this application;
[0031] Figure 4 This is a bottom view of an integrated processing chip according to an embodiment of this application;
[0032] Figure 5 This is a schematic diagram of another display panel structure according to an embodiment of this application;
[0033] Figure 6 This is a schematic diagram of another integrated processing chip structure according to an embodiment of this application;
[0034] Figure 7 This is a top view of another integrated processing chip according to an embodiment of this application;
[0035] Figure 8 This is a diagram showing the definition of contact pins of a comprehensive processing chip according to an embodiment of this application;
[0036] Figure 9 This is a schematic diagram of another integrated processing chip structure according to an embodiment of this application;
[0037] Figure 10 This is a top view of another integrated processing chip according to an embodiment of this application;
[0038] Figure 11 This is a diagram showing the definition of contact pins of another integrated processing chip according to an embodiment of this application. Detailed Implementation
[0039] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0040] This application embodiment provides a display panel 10, Figure 1 This is a schematic diagram of one structure of the display panel 10. For example... Figure 1 As shown, the display panel 10 includes a first panel portion 11, a curved portion 12, and a driving portion 13 arranged in sequence. The curved portion 12 is located between the first panel portion 11 and the driving portion 13. The first panel portion 11 is connected to the curved portion 12, and the curved portion 12 is connected to the driving portion 13.
[0041] The first panel portion 11 is configured to perform a display function, the driving portion 13 is configured to drive the first panel portion 11 to perform a display function, and the bending portion 12 is configured to cause the orthographic projection of the driving portion 13 on the first panel portion 11 to be located within the first panel portion 11 by bending itself.
[0042] The drive unit 13 is equipped with a comprehensive processing chip 14. Figure 2 The diagram shown is a schematic representation of the structure of a comprehensive processing chip 14. (Reference) Figure 2 As shown, the integrated processing chip 14 includes an independent touch signal unit 141 and a display driver unit 142. The touch signal unit 141 is configured to receive touch signals from the first panel unit 11, and the display driver unit 142 is configured to drive the first panel unit 11 to perform display functions.
[0043] Because the touch signal unit 141 and the display driving unit 142 are respectively located in different parts of the driving unit 13, their separate arrangement results in a larger overall area occupied by the touch signal unit 141 and the display driving unit 142. Therefore, with the touch signal unit 141 and the display driving unit 142 requiring a larger overall area, the driving unit 13 becomes larger, which in turn encroaches on the space of other structures, such as the battery structure in some cases. Simply arranging the touch signal unit 141 and the display driving unit 142 close together can reduce the area of the driving unit 13 to some extent, but it easily causes the width X1 of the driving unit 13 to increase. This increased width X1 of the driving unit 13, in turn, increases the width X2 of the curved portion 12. This increased width X2 of the curved portion 12 also encroaches on the space of other structures.
[0044] It should be noted that, since the width X2 of the generally curved portion 12 is the same as, or nearly the same as, the width X1 of the driving portion 13, therefore, in Figure 1 In the example, the width X2 of the curved part 12 and the width X1 of the drive part 13 are marked on the same width, but in reality, the width X2 and the width X1 are different widths.
[0045] Furthermore, since the touch signal unit 141 and the display driving unit 142 are respectively located in different parts of the driving unit 13, the traces electrically connected to the touch signal unit 141 and the traces electrically connected to the display driving unit 142 will inevitably intersect. At the intersection of different traces, in order to avoid problems such as insulation and electromagnetic shielding between the traces electrically connected to the touch signal unit 141 and the traces electrically connected to the display driving unit 142, a multi-layer structure is required to ensure mutual isolation between the different traces.
[0046] Meanwhile, the manufacturing processes for the touch signal unit 141 and the display driver unit 142 differ significantly. If a new single-wafer chip were designed to simultaneously function as both the touch signal unit 141 and the display driver unit 142, then the more sophisticated manufacturing process for the touch signal unit 141 and the display driver unit 142 would be required during the manufacturing of the new chip. Consequently, the cost of the new chip would be higher than that of manufacturing the touch signal unit 141 and the display driver unit 142 separately, which would be detrimental to production.
[0047] Since the integrated processing chip 14 is a chip package structure, its integration density is far superior to simply arranging the touch signal unit 141 and the display driver unit 142 close together. Therefore, by setting up an integrated processing chip 14 that integrates the touch signal unit 141 and the display driver unit 142, the area occupied by the integrated processing chip 14 can replace the area occupied by the touch signal unit 141 and the display driver unit 142. At the same time, the width X1 of the driver unit 13 is not widened. Thus, the area occupied by the touch signal unit 141 and the display driver unit 142 can be reduced, and the area occupied by the driver unit 13 can be reduced accordingly. Furthermore, by reducing the area occupied by the driver unit 13, space can be made for the arrangement of other structures.
[0048] Furthermore, by providing an integrated processing chip 14 that integrates the touch signal unit 141 and the display driver unit 142, different traces can be connected to the integrated processing chip 14, so that the traces converge into the integrated processing chip 14 and then disperse from the integrated processing chip 14. This avoids the inevitable intersection of traces electrically connected to the touch signal unit 141 and traces electrically connected to the display driver unit 142. In addition, it avoids the need to set up complex film layer structures to ensure mutual isolation between different traces.
[0049] Meanwhile, the integrated processing chip 14 contains independent touch signal units 141 and display driver units 142, which are integrated together through a chip packaging structure. This arrangement avoids forcibly unifying the manufacturing processes of the touch signal units 141 and display driver units 142, thereby reducing the area occupied by the driver unit 13 and avoiding the need for complex film layer structures to ensure mutual isolation between different traces, while also reducing the cost of the integrated processing chip 14, making it more economical.
[0050] Meanwhile, the process complexity of installing the overall integrated processing chip 14 into the driver unit 13 is lower than that of installing the touch signal unit 141 and the display driver unit 142 into the driver unit 13, thereby improving the process yield of installing the overall integrated processing chip 14 into the driver unit 13.
[0051] In some embodiments, Figure 5 This is a schematic diagram of another type of display panel 10. (See diagram below.) Figure 1 or Figure 5 As shown, the drive unit 13 includes a second panel portion 131 and a flexible circuit board 132. The second panel portion 131 is located between the bent portion 12 and the flexible circuit board 132, and the second panel portion 131 is connected to the bent portion 12. The flexible circuit board 132 is connected to the second panel portion 131. The integrated processing chip 14 is bonded to the second panel portion 131.
[0052] Since the display driver unit 142 is generally bonded to the second panel unit 131, and the touch signal unit 141 is disposed on the flexible circuit board 132, by encapsulating and integrating the touch signal unit 141 and the display driver unit 142 into the integrated processing chip, and bonding the integrated processing chip 14 to the second panel unit 131, it is convenient to electrically connect the wiring to the integrated processing chip 14. Since the flexible circuit board 132 no longer needs to be equipped with the touch signal unit 141, the area of the flexible circuit board 132 can be reduced. As a result, the area occupied by the driver unit 13 can be further reduced. In addition, by reducing the area occupied by the driver unit 13, space can be left for the installation of other structures.
[0053] In some embodiments, such as Figure 1 or Figure 5 As shown, the display panel 10 also includes a display section 20, a first touch signal line 151, a second touch signal line 152, a display data line 16, a flexible circuit board assembly 17, and flexible circuit board traces 18.
[0054] Specifically, the display unit 20 is configured to perform display functions. The first touch signal line 151 and the second touch signal line 152 surround the display unit 20.
[0055] The second touch signal line 152 includes a first portion 1521 and a second portion 1522. The first touch signal line 151 and the second touch signal line 152 are configured to receive touch signals from the display panel 10. The display panel 10 includes a first direction X and a second direction Y that are perpendicular to each other. The first touch signal line 151 can be configured to receive signals from touch electrodes extending along the first direction X and arranged along the second direction Y. The second touch signal line 152 can be configured to receive signals from touch electrodes extending along the second direction Y and arranged along the first direction X.
[0056] The two ends of the display data line 16 are electrically connected to the display unit 20 and the integrated processing chip 14, respectively. The display data line 16 is configured to transmit the drive signals issued by the integrated processing chip 14 to the first panel unit 11.
[0057] The flexible circuit board assembly 17 comprises various electronic devices, including resistors, disposed on the flexible circuit board 132. It should be noted that the flexible circuit board assembly 17 described here is merely an example of electronic devices disposed on the flexible circuit board 132; it is only exemplary and does not imply that the actual form and arrangement of electronic devices are consistent with those shown in the accompanying drawings.
[0058] The flexible circuit board trace 18 is electrically connected to the flexible circuit board assembly 17, the integrated processing chip 14, and other structures within the display panel 10 that require electrical connection.
[0059] In some embodiments, Figure 3 This is a top view of the integrated processing chip 14. (As shown) Figure 2 and Figure 3 As shown, the integrated processing chip 14 also includes a packaging substrate 143 and contact pins 144.
[0060] The display driving unit 142 is located on the packaging substrate 143. The touch signal unit 141 is located on the display driving unit 142, and the touch signal unit 141 is located on the side of the display driving unit 142 away from the packaging substrate 143. The contact pin 144 is located on the side of the packaging substrate 143 away from the touch signal unit 141 and the display driving unit 142, and the contact pin 144 is electrically connected to the touch signal unit 141 and the display driving unit 142.
[0061] This configuration allows for a further reduction in the area occupied by the integrated processing chip 14, which in turn integrates the touch signal unit 141 and the display driver unit 142. Consequently, the area occupied by the driver unit 13 can be further reduced, and by reducing the area occupied by the driver unit 13, space can be made for the arrangement of other structures.
[0062] In some embodiments, such as Figure 2 As shown, the integrated processing chip 14 also includes a bonding wire 145. The bonding wire 145 is configured to electrically connect the touch signal unit 141 to the contact pin 144, or to electrically connect the display driving unit 142 to the contact pin 144.
[0063] In some embodiments, Figure 4 The image shown is a bottom view of the integrated processing chip 14. (As shown) Figure 2 , Figure 4 and Figure 5 As shown, the contact pin 144 includes a first pin portion 1441 and a second pin portion 1442. The first pin portion 1441 includes at least two first pins 1443, and the second pin portion 1442 includes at least two second pins 1444. The first pin portion 1441 surrounds the second pin portion 1442.
[0064] The touch signal unit 141 is electrically connected to the first pin 1443 within the first pin unit 1441. The display driving unit 142 is electrically connected to the second pin 1444 within the second pin unit 1442.
[0065] This configuration allows the first pin 1443, electrically connected to the touch signal unit 141, and the second pin 1444, electrically connected to the display driver unit 142, to be symmetrically distributed on both sides of the touch signal unit 141 and the display driver unit 142. Correspondingly, the first touch signal line 151 and the second touch signal line 152 can be electrically connected to both sides of the integrated processing chip 14, that is, the first part 1521 and the second part 1522 of the second touch signal line can be electrically connected to both sides of the integrated processing chip, without the need for... Figure 1 As shown, the second touch signal line 1521 and the second touch signal line 1522 intersect with the display data line 16, thereby avoiding the intersection of the first part 1521 and the second part 1522 of the second touch signal line with the display data line 16. Furthermore, it can further avoid setting up a complex film layer structure to ensure mutual isolation between different traces.
[0066] In some embodiments, such as Figure 2 As shown, the integrated processing chip 14 also includes an encapsulation section 146. The encapsulation section 146 is located on the same side of the packaging substrate 143 as the touch signal section 141 and the display driving section 142, and directly covers the touch signal section 141 and the display driving section 142.
[0067] The surface of the encapsulation portion 146 away from the packaging substrate 143 exposes the surface of the touch signal portion 141 away from the packaging substrate 143.
[0068] Specifically, the encapsulation portion 146 not only directly covers the touch signal portion 141 and the display driver portion 142, but also directly covers the bonding wire 145. Since the touch signal portion 141 and the display driver portion 142 in this embodiment adopt a stacked structure, they have only a smaller heat dissipation area under the same heat generation conditions, thus requiring higher heat dissipation performance. By exposing the surface of the encapsulation portion 146 away from the packaging substrate 143 to the surface of the touch signal portion 141 away from the packaging substrate 143, the encapsulation effect of the encapsulation portion 146 can be ensured while enhancing the heat dissipation capability of the integrated processing chip 14, thereby mitigating the impact of the greater heat dissipation requirements brought about by the stacked structure.
[0069] In some embodiments, Figure 6 The diagram shown is a schematic of another integrated processing chip 14. Figure 7 This is a top view of another integrated processing chip 14. (See diagram below.) Figure 6 and Figure 7 As shown, the integrated processing chip 14 also includes a packaging substrate 143 and contact pins 144.
[0070] A touch signal unit 141 is located on a package substrate 143. A display driving unit 142 is located on the touch signal unit 141, and the display driving unit 142 is located on the side of the touch signal unit 141 away from the package substrate 143. A contact pin 144 is located on the side of the package substrate 143 away from the touch signal unit 141 and the display driving unit 142, and the contact pin 144 is electrically connected to the touch signal unit 141 and the display driving unit 142.
[0071] This configuration allows for a further reduction in the area occupied by the integrated processing chip 14, which in turn integrates the touch signal unit 141 and the display driver unit 142. Consequently, the area occupied by the driver unit 13 can be further reduced, and by reducing the area occupied by the driver unit 13, space can be made for the arrangement of other structures.
[0072] In some embodiments, Figure 6 and Figure 7 The bottom view of the integrated processing chip 14 shown can be referenced. Figure 4 The content shown. For example... Figure 6 and Figure 7 As shown, and refer to Figure 4 As shown, contact pin 144 includes a first pin portion 1441 and a second pin portion 1442. The first pin portion 1441 includes at least two first pins 1443, and the second pin portion 1442 includes at least two second pins 1444. The first pin portion 1441 surrounds the second pin portion 1442.
[0073] The display driver unit 142 is electrically connected to the first pin 1443 within the first pin unit 1441. The touch signal unit 141 is electrically connected to the second pin 1444 within the second pin unit 1442.
[0074] This configuration allows the first pin 1443, electrically connected to the display driver unit 142, and the second pin 1444, electrically connected to the touch signal unit 141, to be symmetrically distributed on both sides of the touch signal unit 141 and the display driver unit 142. Correspondingly, the first touch signal line 151 and the second touch signal line 152 can be electrically connected to both sides of the integrated processing chip 14, that is, the first part 1521 and the second part 1522 of the second touch signal line can be electrically connected to both sides of the integrated processing chip, without the need for... Figure 1 As shown, the second touch signal line 1521 and the second touch signal line 1522 intersect with the display data line 16, thereby avoiding the intersection of the first part 1521 and the second part 1522 of the second touch signal line with the display data line 16. Furthermore, it can further avoid setting up a complex film layer structure to ensure mutual isolation between different traces.
[0075] In some embodiments, such as Figure 6 As shown, the integrated processing chip 14 also includes an encapsulation section 146. The encapsulation section 146 is located on the same side of the packaging substrate 143 as the touch signal section 141 and the display driving section 142, and directly covers the controlled signal section 141 and the display driving section 142.
[0076] The surface of the encapsulation portion 146 away from the encapsulation substrate 143 exposes the surface of the display driving portion 142 away from the encapsulation substrate 143.
[0077] Specifically, the encapsulation portion 146 not only directly covers the touch signal portion 141 and the display driver portion 142, but also directly covers the bonding wire 145. Since the touch signal portion 141 and the display driver portion 142 in this embodiment adopt a stacked structure, they have only a smaller heat dissipation area under the same heat generation conditions, thus requiring higher heat dissipation performance. By exposing the surface of the encapsulation portion 146 away from the packaging substrate 143 to the surface of the display driver portion 142 away from the packaging substrate 143, the encapsulation effect of the encapsulation portion 146 can be ensured while enhancing the heat dissipation capability of the integrated processing chip 14, thereby mitigating the impact of the greater heat dissipation requirements brought about by the stacked structure.
[0078] In some embodiments, Figure 8 The diagram shows the definition of contact pins 144 of a comprehensive processing chip 14. (See diagram for reference.) Figure 8As shown, the integrated processing chip 14 includes: power supply and transformer pin 21, boost pin 22, logic and communication pin 23, display data pin 24, initialization pin 25, first touch signal receiving pin 26, second touch signal receiving pin 27, and general output pin 28.
[0079] Among them, the power supply and transformer pin 21, the boost pin 22, the logic and communication pin 23, the first touch signal receiving pin 26, and the second touch signal receiving pin 27 are pins electrically connected to the touch signal unit 141. The display data pin 24, the initialization pin 25, and the general output pin 28 are pins electrically connected to the display driver unit 142.
[0080] In some embodiments, Figure 9 The diagram shown is a schematic of another integrated processing chip 14. Figure 10 This is a top view of another integrated processing chip 14. (See diagram below.) Figure 9 and Figure 10 As shown, the integrated processing chip 14 includes a packaging substrate 143 and contact pins 144.
[0081] The touch signal unit 141 and the display driving unit 142 are both located on the packaging substrate 143 and on the same side of the packaging substrate 143. The contact pin 144 is located on the side of the packaging substrate 143 away from the touch signal unit 141 and the display driving unit 142.
[0082] In some embodiments, Figure 11 This diagram shows the definition of contact pins 144 of another integrated processing chip 14. (See diagram for example.) Figure 11 As shown, the integrated processing chip 14 includes: power supply and transformer pin 21, boost pin 22, logic and communication pin 23, display data pin 24, initialization pin 25, first touch signal receiving pin 26, second touch signal receiving pin 27, and general output pin 28.
[0083] Among them, the power supply and transformer pin 21, the boost pin 22, the logic and communication pin 23, the first touch signal receiving pin 26, and the second touch signal receiving pin 27 are pins electrically connected to the touch signal unit 141. The display data pin 24, the initialization pin 25, and the general output pin 28 are pins electrically connected to the display driver unit 142.
[0084] This application also provides a display device, including any of the above-described display panels 10.
[0085] The above embodiments of this application can complement each other without causing conflict.
[0086] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.
[0087] The term “multiple” means two or more, unless otherwise expressly defined.
[0088] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.
[0089] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.
Claims
1. A display panel, characterized in that, It includes a first panel portion, a curved portion, and a driving portion arranged in sequence; the curved portion is located between the first panel portion and the driving portion, the first panel portion is connected to the curved portion, and the curved portion is connected to the driving portion; The first panel portion is at least configured to perform a display function, the driving portion is at least configured to drive the first panel portion to perform the display function, and the bending portion is at least configured to cause the orthographic projection of the driving portion on the first panel portion to be located within the first panel portion by bending itself. The driving unit is provided with an integrated processing chip; the integrated processing chip is provided with an independent touch signal unit and a display driving unit; the touch signal unit is at least configured to receive touch signals from the first panel, and the display driving unit is at least configured to drive the first panel to perform display functions; The integrated processing chip also includes a packaging substrate and contact pins. The touch signal section and the display driving section adopt a stacked structure. The contact pins are located on the side of the packaging substrate away from the touch signal section and the display driving section, and the contact pins are electrically connected to the touch signal section and the display driving section.
2. The display panel according to claim 1, characterized in that, The driving unit includes a second panel and a flexible circuit board; the second panel is located between the bent portion and the flexible circuit board, the second panel is connected to the bent portion, and the flexible circuit board is connected to the second panel; The integrated processing chip is bonded to the second panel.
3. The display panel according to claim 2, characterized in that, The display driving unit is located on the packaging substrate; the touch signal unit is located on the display driving unit, and the touch signal unit is located on the side of the display driving unit away from the packaging substrate.
4. The display panel according to claim 3, characterized in that, The contact pin includes a first pin portion and a second pin portion; the first pin portion includes at least two first pins, and the second pin portion includes at least two second pins; the first pin portion surrounds the second pin portion. The touch signal section is electrically connected to the first pin in the first pin section; the display driving section is electrically connected to the second pin in the second pin section.
5. The display panel according to claim 3, characterized in that, The integrated processing chip also includes an encapsulation section; the encapsulation section, the touch signal section, and the display driving section are located on the same side of the packaging substrate, and directly cover the touch signal section and the display driving section; The surface of the encapsulation portion away from the packaging substrate exposes the surface of the touch signal portion away from the packaging substrate.
6. The display panel according to claim 2, characterized in that, The touch signal section is located on the packaging substrate; the display driving section is located on the touch signal section, and the display driving section is located on the side of the touch signal section away from the packaging substrate.
7. The display panel according to claim 6, characterized in that, The contact pin includes a first pin portion and a second pin portion; the first pin portion includes at least two first pins, and the second pin portion includes at least two second pins; the first pin portion surrounds the second pin portion. The display driver unit is electrically connected to the first pin in the first pin unit; the touch signal unit is electrically connected to the second pin in the second pin unit.
8. The display panel according to claim 6, characterized in that, The integrated processing chip also includes an encapsulation section; the encapsulation section, the touch signal section, and the display driving section are located on the same side of the packaging substrate, and directly cover the touch signal section and the display driving section; The surface of the encapsulation portion away from the packaging substrate exposes the surface of the display driving portion away from the packaging substrate.
9. A display device, characterized in that, The display panel includes any one of claims 1 to 8.