An electronic signal testing method and device, electronic equipment and storage medium

Abstract

The application provides an electronic signal test method and device, electronic equipment and storage medium. The method comprises: obtaining identification information of a to-be-tested mainboard; obtaining a test item list of the to-be-tested mainboard according to the identification information; determining a test point sequence corresponding to a plurality of test items in the test item list; determining a plurality of point test information corresponding to execution of point test on the plurality of test items of the to-be-tested mainboard by a point test device according to the test point sequence; controlling the to-be-tested mainboard to reach a preset test condition corresponding to the plurality of test items; and controlling the point test device to perform point test on the to-be-tested mainboard according to the plurality of point test information, to obtain an electronic signal test result of the to-be-tested mainboard. In this way, by determining a plurality of point test information of the to-be-tested mainboard and controlling the point test device to perform point test on the to-be-tested mainboard according to the point test information, automatic test of an electronic signal of the to-be-tested mainboard is realized, manual assistance is not required throughout the test, the test efficiency is high, and the test quality is high.

Description

Technical Field

[0001] This application relates to the field of signal detection, and more particularly to an electronic signal testing method, apparatus, electronic device, and storage medium. Background Technology

[0002] Circuit boards (PCBs), as a crucial component of the electronics industry, play a key role in the continuous development of various electronic products. Their quality directly impacts product quality and cost; therefore, testing PCBs is an effective means of assessing their design and manufacturing quality. Currently, PCB testing includes electronic signal testing, but existing methods still require manual operation, preventing unmanned testing, resulting in low efficiency and poor quality. Summary of the Invention

[0003] This application provides an electronic signal testing method, apparatus, electronic device, and storage medium.

[0004] According to a first aspect of this application, a method is provided, the method comprising: acquiring identification information of a motherboard under test; acquiring a test item list of the motherboard under test based on the identification information; determining a test point sequence corresponding to multiple test items in the test item list; determining multiple test point information corresponding to the test point sequence for a testing device to perform test point testing on the multiple test items of the motherboard under test; controlling the motherboard under test to meet preset test conditions corresponding to the multiple test items; controlling the testing device to perform test point testing on the motherboard under test based on the multiple test point information, and obtaining electronic signal test results of the motherboard under test.

[0005] According to one embodiment of this application, obtaining the test item list of the motherboard under test based on the identification information includes: obtaining the motherboard under test data information of the motherboard under test from a first dataset based on the identification information, wherein the first dataset includes test data information of multiple types of motherboards; matching the motherboard under test data information with a second dataset to obtain the test item list of the motherboard under test, wherein the second dataset includes multiple test items and the electronic signals under test corresponding to the multiple test items.

[0006] According to one embodiment of this application, the second dataset further includes component reference numbers for the receiving and transmitting ends corresponding to the plurality of test items; correspondingly, determining the test point sequence corresponding to the plurality of test items in the test item list includes: obtaining the component reference number of the electronic signal under test corresponding to the plurality of test items in the test item list from the second dataset according to the test item list, wherein the component reference number under test includes the component reference number of the receiving end or the component reference number of the transmitting end; obtaining the test coordinate information of the component under test indicated by the component reference number under test from the first dataset according to the component reference number under test, wherein the test coordinate information includes the test coordinates of the component under test and the test pad coordinate information; obtaining a plurality of pad points within a set distance of the test coordinates according to the test coordinates to obtain a test point sequence, wherein the plurality of test points in the test point sequence are arranged according to the size priority of the test pad model.

[0007] According to one embodiment of this application, the point testing device includes a point testing robotic arm; correspondingly, determining multiple point testing information corresponding to the point testing device performing point testing on multiple test items of the motherboard under test based on the test point sequence includes: calibrating multiple test points of the test point sequence to obtain a first test point sequence; acquiring a test environment for testing the motherboard under test; determining the initial point testing angle of multiple test points in the first test point sequence based on obstacles in the test environment and the obstacle avoidance algorithm of the point testing robotic arm, wherein the initial point testing angle includes the absolute values ​​of the angle between the point testing robotic arm and the plane and the angle between the point testing robotic arm and the solder pads; and determining the initial point testing information corresponding to the multiple test points based on the multiple test points and the initial point testing information of the multiple test points. The multiple test points are prioritized based on the initial measurement angle to obtain a measurement task list, which includes multiple test points and their corresponding initial measurement angles. The measurement robot arm is controlled to take pictures of the multiple test points according to the initial measurement angles to obtain the profile information to be tested, which includes multiple profiles to be tested corresponding to the multiple test points. Based on the component reference number corresponding to the test point, a template profile with a corresponding angle to the multiple profiles to be tested is obtained from the component database to obtain template profile information. Based on the template profile information and the profile information to be tested, defect detection is performed to obtain the target test point. The measurement coordinates and measurement angle of the target test point are collectively referred to as measurement information.

[0008] According to one embodiment of this application, calibrating multiple test points of the test point sequence to obtain a first test point sequence includes: obtaining the CPU model of the CPU from the first dataset based on the CPU identification information of the motherboard under test; exporting the corresponding CPU profile from the CPU profile database based on the CPU model; controlling the robotic arm to take a picture of the motherboard under test to obtain the profile of the motherboard under test; if the CPU profile matches the profile of the motherboard under test successfully, determining the actual coordinates of the preset marker point in the motherboard under test based on the coordinates of the CPU, the size information of the CPU, and the preset coordinates of the preset marker point; controlling the point-testing robotic arm to identify the actual coordinates to obtain an identification result; and calibrating the coordinates of the multiple test points based on the identification result to obtain the first test point sequence.

[0009] According to one embodiment of this application, after obtaining the target test point, the method further includes: controlling the robotic arm to take a picture of the target test point according to the point measurement coordinates and point measurement angle of the target test point to obtain a target test point area image; determining the actual point measurement coordinates of the actual test points in the target test point area image; comparing the actual point measurement coordinates with the point measurement coordinates to obtain a comparison result; calibrating the point measurement coordinates corresponding to the plurality of test items according to the comparison result to obtain target point measurement coordinates; and replacing the point measurement coordinates with the target point measurement coordinates.

[0010] According to one embodiment of this application, the point testing device includes a testing device; correspondingly, controlling the point testing device to perform point testing on the motherboard under test according to the plurality of point testing information to obtain the electronic signal test results of the motherboard under test includes: controlling the robotic arm to reach the point testing position indicated by the point testing coordinates, and performing point testing on the point testing position according to the angle indicated by the point testing angle; when the testing device meets the preset acquisition conditions, acquiring the waveform and data shown by the testing device to obtain the electronic signal test results of the motherboard under test.

[0011] According to a second aspect of this application, an electronic signal testing apparatus is provided. The apparatus includes: an identification acquisition module for acquiring identification information of a motherboard under test; a test item acquisition module for acquiring a list of test items of the motherboard under test based on the identification information; a test point acquisition module for determining a sequence of test points corresponding to multiple test items in the test item list; a test point information acquisition module for determining multiple test point information corresponding to the test point information performed by a test point device on the multiple test items of the motherboard under test based on the test point sequence; a motherboard under test control module for controlling the motherboard under test to meet preset test conditions corresponding to the multiple test items; and a test point device control module for controlling the test point device to perform test point testing on the motherboard under test based on the multiple test point information to obtain the electronic signal test results of the motherboard under test.

[0012] According to a third aspect of this application, an electronic device is provided, comprising:

[0013] At least one processor; and

[0014] A memory communicatively connected to the at least one processor; wherein,

[0015] The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method described in this application.

[0016] According to a fourth aspect of this application, a non-transitory computer-readable storage medium is provided storing computer instructions for causing the computer to perform the methods described in this application.

[0017] The method of this application embodiment obtains the identification information of the motherboard under test; obtains a test item list of the motherboard under test based on the identification information; determines the test point sequence corresponding to multiple test items in the test item list; determines multiple test point information corresponding to the test point information to be executed by the test point device for multiple test items of the motherboard under test based on the test point sequence; controls the motherboard under test to meet the preset test conditions corresponding to multiple test items; controls the test point device to perform test on the motherboard under test according to the multiple test point information, and obtains the electronic signal test results of the motherboard under test. By automatically generating the test items of the motherboard under test and determining multiple test point information of the motherboard under test, and then controlling the test point device to perform test on the motherboard under test according to the test point information, the electronic signal testing of the motherboard under test can be automated, without the need for manual assistance, resulting in high testing efficiency and high testing quality.

[0018] It should be understood that the teachings of this application do not need to achieve all the above-mentioned beneficial effects, but a specific technical solution can achieve a specific technical effect, and other embodiments of this application can also achieve beneficial effects not mentioned above. Attached Figure Description

[0019] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. Several embodiments of this application are illustrated in the drawings by way of example and not limitation, in which:

[0020] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0021] Figure 1 This illustration shows an application scenario of the electronic signal testing method according to an embodiment of this application;

[0022] Figure 2 The following is a schematic diagram illustrating the implementation flow of the electronic signal testing method according to an embodiment of this application;

[0023] Figure 3 A schematic diagram illustrating the implementation flow of the test item list acquisition method of the electronic signal testing method according to an embodiment of this application is shown;

[0024] Figure 4 A schematic diagram illustrating the implementation principle of the test point sequence acquisition method of the electronic signal testing method according to an embodiment of this application is shown.

[0025] Figure 5 A schematic diagram illustrating the implementation flow of the point measurement information acquisition method of the electronic signal testing method according to an embodiment of this application is shown;

[0026] Figure 6 A schematic diagram illustrating the implementation flow of the test point calibration method in the electronic signal testing method of this application embodiment is shown;

[0027] Figure 7 A schematic diagram illustrating the implementation flow of the point measurement coordinate calibration method of the electronic signal testing method according to an embodiment of this application is shown;

[0028] Figure 8 A schematic diagram illustrating the implementation flow of the point measurement method of the electronic signal testing method according to an embodiment of this application is shown;

[0029] Figure 9 A schematic diagram of the electronic signal testing device according to an embodiment of this application is shown;

[0030] Figure 10 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown. Detailed Implementation

[0031] To make the objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0033] In the following description, the terms "first" and "second" are used merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first" and "second" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0035] Currently, the existing method for testing electronic signals on circuit boards is as follows: First, hardware designers select the test items to be tested based on the functional modules and circuit schematic of the circuit board under test, and compile the net names of the electronic signals to be tested corresponding to the test items. Then, testers find the corresponding electronic signals to be tested in the schematic and PCB diagrams, and select appropriate test points based on their extensive testing experience. After determining the test points, testers align the oscilloscope probes with the test points on the circuit board for manual point testing or manually solder the leads to the test points for point testing. Finally, during the point testing process, testers operate the test equipment and set the test parameters. Based on the waveform displayed on the oscilloscope, they adjust the oscilloscope and other test equipment to obtain the correct waveform and data, and fill the waveform and data into the test report. According to the pre-set judgment criteria in the test report, they judge whether the obtained data is qualified, and highlight the unqualified test items.

[0036] The existing electronic signal testing solutions mentioned above require manual operation by experienced personnel, which is labor-intensive, inefficient, and results in inconsistent test quality due to varying levels of experience and judgment among individuals.

[0037] This application provides an electronic signal testing method, apparatus, electronic device, and storage medium, which aims to solve the technical problems of the prior art.

[0038] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0039] Figure 1 This illustration shows an application scenario of the electronic signal testing method according to an embodiment of this application. The terminal device 101 is connected to both the motherboard under test 102 and the point testing device 103. The terminal device 101 can automatically determine the test items and test points, and combine with the point testing device 103 to determine the point testing information corresponding to the test items of the motherboard under test 102. The point testing device 103 may include a point testing robotic arm and other testing equipment needed during the testing process. The terminal device 101 can also control the point testing device 103 to perform point testing on the motherboard under test 102 based on the obtained data, and generate a report on the point testing results.

[0040] The terminal device 101 may be, but is not limited to, computer devices such as laptops and desktops.

[0041] The motherboard under test can include motherboards of computer devices such as laptops, all-in-ones, and desktops. The motherboard under test is composed of multiple functional modules, which may include CPU (Central Processing Unit) module, GPU (Graphics Processing Unit) module, RAM (Random Access Memory) module, WLAN (Wireless Local Area Network) module, etc.

[0042] Figure 2 The diagram illustrates the implementation flow of the electronic signal testing method according to an embodiment of this application.

[0043] refer to Figure 2This application provides a method for testing electronic signals, comprising: operation 201, acquiring identification information of a motherboard under test; operation 202, acquiring a list of test items for the motherboard under test based on the identification information; operation 203, determining a sequence of test points corresponding to multiple test items in the test item list; operation 204, determining multiple test points corresponding to the test points to be performed by a test point device on multiple test items of the motherboard under test based on the test point sequence; operation 205, controlling the motherboard under test to meet the preset test conditions corresponding to the multiple test items; and operation 206, controlling the test point device to perform test points on the motherboard under test based on the multiple test points to obtain the electronic signal test results of the motherboard under test.

[0044] In operation 201, obtain the identification information of the motherboard under test.

[0045] Specifically, the motherboard under test is composed of many functional modules, such as CPU (Central Processing Unit) module, GPU (Graphics Processing Unit) module, RAM (Random Access Memory) module, WLAN (Wireless Local Area Network) module, etc.

[0046] Furthermore, during the testing of the electronic signals of the motherboard under test, the identification information of the motherboard under test is first obtained. The identification information may include the type information of the motherboard under test, the multiple functional modules included in the motherboard under test, and the model information corresponding to the functional modules.

[0047] Furthermore, the motherboard under test includes identification markings, such as QR codes, which can be used to obtain the identification information of the motherboard under test. It should be noted that this application does not specifically limit the method for obtaining the identification information of the motherboard under test; any solution capable of obtaining the identification information of the motherboard under test falls within the scope of protection of this application.

[0048] In one embodiment of this application, the motherboard under test is a laptop motherboard.

[0049] In operation 202, based on the identification information, obtain the test item list of the motherboard under test.

[0050] Specifically, there are many types of motherboards to be tested, such as motherboards for business laptops, gaming laptops, or ultra-thin laptops.

[0051] The specific test items required for different types of motherboards vary. For example, motherboards for laptops with USB ports require USB testing, while those for laptops with Type-C ports require Type-C testing. Furthermore, gaming laptops have higher requirements for their graphics cards, so testing the motherboard for a gaming laptop requires testing the graphics card at high speeds, while testing the motherboard for a business laptop only requires testing the graphics card at medium speeds.

[0052] Furthermore, the identification information of the motherboard under test can indicate the motherboard type information. Here, the test items for this type of motherboard can be determined through the motherboard type information, thus obtaining the test item list for the motherboard under test.

[0053] In operation 203, determine the sequence of test points corresponding to multiple test items in the test item list.

[0054] Specifically, each of the multiple test items for testing the motherboard under test has a specific electronic signal to be tested. Therefore, based on the electronic signal to be tested, multiple test points corresponding to each test item can be determined, resulting in a test point sequence.

[0055] In operation 204, based on the test point sequence, the point testing device is determined to perform multiple point testing information corresponding to multiple test items on the motherboard under test.

[0056] Specifically, the test point sequence includes multiple test points that can be used for point testing when testing the electronic signal corresponding to the test item. The test points are the pads (soldering pads) of the components. The test point sequence includes multiple test points and the coordinate information of multiple test points.

[0057] A test point sequence is a set of multiple ideal test points for testing the electronic signals corresponding to the test items. During actual point testing, points within the test point sequence that can be tested can be selected as target test points. This allows for more accurate testing of the electronic signals on the motherboard under test. The point test coordinates and angle of the target test point constitute the point test information. In operation 205, the motherboard under test is controlled to meet the preset test conditions corresponding to multiple test items.

[0058] Specifically, testing a test item involves performing quality and timing tests on the electronic signal under test (DUT) within that test item. Each test item includes preset test conditions for its corresponding DUT. When testing the electronic signal, the motherboard under test is first adjusted to meet the requirements specified in the preset test conditions. For example, if the DUT is a high-speed signal, it needs to be adjusted to a high-speed signal setting for testing.

[0059] Operation 206: Control the point testing equipment to perform point testing on the motherboard under test based on multiple point testing information, and obtain the electronic signal test results of the motherboard under test.

[0060] Specifically, the point test information shows the point test angle and point test coordinates when testing the electronic signals corresponding to multiple test items of the motherboard under test. By controlling the point test equipment to perform point tests on the motherboard under test according to the point test angle and point test coordinates shown in the point test information, the electronic signal test results of multiple electronic signals corresponding to multiple test items in the motherboard under test can be obtained.

[0061] Thus, in the process of testing the motherboard under test in this embodiment of the application, the test item list, test point sequence, and point test information are all automatically determined. Furthermore, the point test of the motherboard under test is also automatically controlled by the terminal device to perform the point test, avoiding the problem of inaccurate electronic signal testing caused by inaccurate selection of point test positions or hand tremors when performing point tests by subjective human operation. In addition, the automated testing process effectively avoids the waste of human resources and significantly improves testing efficiency and testing quality.

[0062] Figure 3 The diagram illustrates the implementation flow of the test item list acquisition method of the electronic signal testing method according to an embodiment of this application.

[0063] refer to Figure 3 In one embodiment of this application, step 202 above, obtaining the test item list of the motherboard under test according to the identification information, specifically includes: operation 301, obtaining the test motherboard data information of the motherboard under test from the first dataset according to the identification information, the first dataset including test data information of multiple types of motherboards; operation 302, matching the test motherboard data information with the second dataset to obtain the test item list of the motherboard under test, the second dataset including multiple test items and the test electronic signals corresponding to the multiple test items.

[0064] In operation 301, the test motherboard data information of the motherboard under test is obtained from the first dataset based on the identification information. The first dataset includes test data information of multiple types of motherboards.

[0065] Specifically, there are many types of motherboards, such as motherboards for business laptops and motherboards for gaming laptops. Each type of motherboard includes multiple functional modules to meet its own functional requirements.

[0066] Furthermore, in one embodiment of this application, before obtaining the identification information of the motherboard under test in operation 201, a complete set of circuit schematics including all types of functional modules included in the motherboard under test can be compiled. The complete set of circuit schematics includes component reference numbers and electronic signals in multiple functional modules.

[0067] In practical applications, when combining multiple functional modules from the complete circuit schematic set to obtain the circuit schematic of the required motherboard under test, local mismatches may occur, requiring local modifications. Therefore, after determining the complete circuit schematic set, logical rules need to be established for naming the component reference numbers and electronic signals within the complete circuit schematic set. This ensures that the component reference numbers and electronic signals modified when combining multiple functional modules can be automatically named. For example, NVVDD_EN_R, after passing through a resistor, should be named NVVDD_EN_R_R according to the logical rules.

[0068] Furthermore, based on the complete set of circuit schematics and the logical rules applied to them, data information for various types of motherboards under test can be combined to obtain the first dataset. This data includes netlest (electronic signal list), component reference numbers, pad coordinates, pad models, and BOM (Bill of Materials) data.

[0069] In this embodiment of the application, the test motherboard data information corresponding to the test motherboard can be obtained from the first dataset obtained above based on the type information of the test motherboard indicated by the identification information.

[0070] In operation 302, the data information of the motherboard under test is matched with the second dataset to obtain the test item list of the motherboard under test. The second dataset includes multiple test items and the electronic signals under test corresponding to the multiple test items.

[0071] In one embodiment of this application, after generating the first dataset, the test item electronic signal data is organized to obtain a second dataset. The second dataset includes the electronic signal to be tested and the test items corresponding to the electronic signal to be tested. The electronic signal to be tested includes the electronic signal net. One test item can correspond to multiple electronic signals to be tested, and one electronic signal to be tested can also correspond to multiple test items. For example, the same test item can correspond to two electronic signal tests or three electronic signal tests.

[0072] Furthermore, the data information of the motherboard under test includes a list of electronic signals to be tested corresponding to the motherboard under test. Based on the electronic signals to be tested, the list of electronic signals to be tested is matched with a second dataset to obtain test items in the second dataset corresponding to multiple electronic signals to be tested in the list of electronic signals, thus obtaining a test item list for the motherboard under test. The test item list includes multiple test items and their corresponding electronic signals to be tested.

[0073] Thus, in this embodiment of the application, after determining the list of electronic signals of the motherboard under test by using a pre-generated second dataset, the list of electronic signals can be directly matched with the pre-generated second dataset to obtain a list of test items. This avoids the problems of low testing efficiency and wasted manpower caused by manually determining test items through the circuit schematic and PCB diagram of the motherboard under test.

[0074] Figure 4 This diagram illustrates the implementation principle of the test point sequence acquisition method in the electronic signal testing method of this application.

[0075] refer to Figure 4 In one embodiment of this application, the above-mentioned operation 203, which determines the test point sequence corresponding to multiple test items in the test item list, may include the following steps: Operation 401, according to the test item list, obtaining the component reference number of the electronic signal under test corresponding to multiple test items in the test item list from the second dataset, wherein the component reference number under test includes the component reference number of the receiving end or the component reference number of the transmitting end; Operation 402, according to the component reference number under test, obtaining the test coordinate information of the component under test indicated by the component reference number under test from the first dataset, wherein the test coordinate information includes the test coordinate of the component under test and the test pad coordinate information; Operation 403, according to the test coordinate, obtaining multiple pad points within a set distance of the test coordinate to obtain a test point sequence, wherein the multiple test points in the test point sequence are arranged according to the size priority of the test pad model.

[0076] In operation 401, the component reference number of the electronic signal under test corresponding to multiple test items in the test item list is obtained from the second dataset based on the test item list.

[0077] Specifically, the test items in the second dataset are also bound to the component reference numbers of the transmitting or receiving end of the electronic signal under test corresponding to the test item. The component reference number to be tested corresponding to the test item is obtained through the second dataset. The component reference number to be tested can be either the component reference number of the transmitting end or the component reference number of the receiving end. The choice between the component reference number of the transmitting end and the component reference number of the receiving end is determined by the component reference number bound to the test item.

[0078] In operation 402, the coordinate information of the component under test, as indicated by the component under test's tag number, is obtained from the first dataset.

[0079] Specifically, the coordinates of the component under test are obtained through the first dataset, thus obtaining the coordinate information of the component under test, and the coordinate information of the pad corresponding to the component under test is obtained, thus obtaining the coordinate information of the pad under test.

[0080] In operation 403, based on the coordinates to be tested, multiple pad points within the set distance of the coordinates to be tested are obtained to obtain the test point sequence.

[0081] Specifically, multiple pad points are selected at a certain set distance from the coordinates to be tested as test points corresponding to the electronic signal under test. Then, the selected test points are deleted according to the set logic based on the circuit principle. The set distance is a distance that will not affect the testing of the electronic signal under test, and the specific distance value is not limited.

[0082] Furthermore, based on the circuit principle, the selected test points are deleted according to the set logic. The reduction of the electronic signal within a certain distance is calculated according to the circuit principle, and a reduction value that conforms to the rule is determined as the set logic. Test points that do not conform to the set logic are deleted, resulting in a test point sequence.

[0083] In this embodiment of the application, multiple test points in the test point sequence are prioritized according to the size of the pad model to facilitate subsequent point testing.

[0084] Thus, in this embodiment of the application, the test points corresponding to the test items are automatically determined based on the first dataset and the second dataset. Compared with the prior art, which relies on testers to select test points by eye, this method is more efficient and the test point selection is more accurate.

[0085] Figure 5 The diagram illustrates the implementation flow of the point measurement information acquisition method of the electronic signal testing method according to an embodiment of this application.

[0086] refer to Figure 5 In one embodiment of this application, the point testing device includes a point testing robotic arm. Operation 204 determines multiple point testing information corresponding to multiple test items based on the test point sequence, including: operation 501, calibrating multiple test points in the test point sequence to obtain a first test point sequence; operation 502, acquiring the test environment for testing the motherboard to be tested; operation 503, determining the initial point testing angles of multiple test points in the first test point sequence based on obstacles in the test environment and the obstacle avoidance algorithm of the point testing robotic arm, wherein the initial point testing angles include the absolute values ​​of the angle between the point testing robotic arm and the plane and the angle between the point testing robotic arm and the solder pads; operation 504, adjusting the multiple test points and the initial point testing angles corresponding to the multiple test points according to the multiple test points. The test points are prioritized to obtain a test task list, which includes multiple test points and their corresponding initial test angles. Operation 505 controls the test robot arm to take pictures of the multiple test points according to the initial test angles to obtain the profile information to be tested, which includes multiple profiles to be tested corresponding to the multiple test points. Operation 506 retrieves a template profile with a corresponding angle from the component database based on the component reference number corresponding to the test point to obtain the template profile information. Operation 507 performs defect detection based on the template profile information and the profile information to be tested to obtain the target test point. The test coordinates and test angles of the target test point are collectively referred to as test information.

[0087] In one embodiment of this application, the spot testing device includes a spot testing robotic arm, which is controlled by a terminal device and can perform spot testing on the motherboard to be tested under the control of the terminal device.

[0088] In operation 501, multiple test points in the test point sequence are calibrated to obtain the first test point sequence.

[0089] Specifically, the coordinates carried by multiple test points in the test point sequence are ideal coordinates calculated by the terminal device. The actual point testing process is performed by the point testing device on the motherboard under test. Therefore, it is necessary to calculate the actual coordinates corresponding to multiple test points in the test point sequence, which are the coordinates used by the point testing device when performing point testing.

[0090] Furthermore, by calibrating multiple test points in the test point sequence, the actual coordinates corresponding to the test points can be obtained, thus obtaining the first test point sequence.

[0091] Operation 502 retrieves the test environment for testing the motherboard under test.

[0092] Specifically, in order to facilitate spot testing of the motherboard under test, it is first necessary to obtain the test environment for testing the motherboard under test, so as to avoid physical objects in the test environment from blocking the spot testing equipment from spot testing the motherboard under test and reducing the test efficiency.

[0093] In operation 503, based on the obstacles in the test environment and the obstacle avoidance algorithm of the point measurement robot, the initial point measurement angles of multiple test points in the first test point sequence are determined.

[0094] Specifically, the point-testing robotic arm comes equipped with its own obstacle avoidance algorithm at the factory. By analyzing multiple obstacles in the test environment, the algorithm calculates the initial point-testing angles at which the robotic arm can perform point-testing at multiple test points in the test point sequence. These initial point-testing angles include the angle between the robotic arm and the plane, and the angle between the robotic arm and the pad.

[0095] In operation 504, multiple test points are prioritized based on the initial test angles corresponding to the multiple test points to obtain a test task list.

[0096] Specifically, in this embodiment of the application, the multiple test points in the test point sequence are prioritized according to the angle between the testing robot arm and the plane and the angle between the testing robot arm and the pad, resulting in a testing task list. The testing task list includes multiple test points sorted by priority and the initial test angles corresponding to each test point.

[0097] During operation 505, the control point measurement robot arm takes pictures of multiple test points according to the initial point measurement angle to obtain the contour information to be measured.

[0098] Specifically, performing point testing according to the initial testing angle corresponding to each test point is not always successful. For example, when testing a test point using the initial testing angle, the test point may be obstructed due to the height of the component, preventing the testing robot arm from reaching it and thus failing to complete the test. Therefore, it is necessary to further filter out obstructed test points based on the actual scenario of the testing robot arm performing point testing.

[0099] Furthermore, the point-testing robotic arm carries a camera, which can be controlled to take pictures of the test point according to the initial point-testing angle of the test point, and obtain the corresponding contour information of the test point.

[0100] In operation 506, based on the component reference number corresponding to the test point, the template contour with a corresponding angle to multiple test contours is obtained from the component database, thus obtaining the template contour information.

[0101] Specifically, in one embodiment of this application, a component database is pre-established. The component database includes template outline information of all types of components. The template outline information includes the local outline, pad outline, solder outline, and the angle between the component and the plane and the direction of the pad under multi-dimensional angles for each type of component.

[0102] Furthermore, based on the initial point measurement angle, which is the photo-taking angle of the point measurement robot arm, the template contour information of the component corresponding to the test point is obtained from the component database.

[0103] In operation 507, defect detection is performed based on the template contour information and the contour information to be tested to obtain the target test point.

[0104] Specifically, the contour template information of multiple test points in the test point sequence is compared with the contour information to be tested obtained by the point-testing robotic arm to perform defect detection, and the test points that can be tested are selected as target test points. During the defect detection process, the blocked area is the defect part and is determined as the untestable area, while the unblocked area is determined as the testable area.

[0105] Furthermore, the target test point is determined based on the testable area and the angle at which the testable robotic arm takes pictures of the corresponding testable area. The target test point is the solder part corresponding to the pad point. The test angle and test coordinates of the target test point are used as test information. The test coordinates are the coordinates of the testable solder part, and the test angle is the angle at which the testable robotic arm takes pictures of the target test point, which is the initial test angle corresponding to the target test point.

[0106] Furthermore, by determining the point test information for multiple test items of the motherboard under test according to the above scheme, the point test information for multiple test items corresponding to the motherboard under test can be obtained.

[0107] In this way, by converting the coordinates of the test points on the terminal device into the actual coordinates used by the point testing robot, and combining the actual scenario during the point testing process of the point testing robot, the point testing information corresponding to multiple test items of the motherboard under test can be calculated. Compared with the existing technology where staff rely on experience to find the position and angle of the point test on the motherboard under test, this method is more efficient and the determined point testing information is more accurate.

[0108] Figure 6 A schematic diagram illustrating the implementation flow of the test point calibration method of the electronic signal testing method according to an embodiment of this application is shown.

[0109] refer to Figure 6 In one embodiment of this application, the above-mentioned operation 501 calibrates multiple test points of the test point sequence to obtain a first test point sequence, including: operation 601, obtaining the CPU model from a first dataset based on the CPU identification information of the motherboard under test; operation 602, exporting the corresponding CPU profile from the CPU profile database based on the CPU model; operation 603, controlling the point measurement robot arm to take a picture of the motherboard under test to obtain the profile of the motherboard under test; operation 604, if the CPU profile and the profile of the motherboard under test are successfully matched, determining the actual coordinates of the preset marker points in the motherboard under test based on the CPU coordinates, the CPU size information, and the preset coordinates of the preset marker points; operation 605, controlling the point measurement robot arm to identify the actual coordinates to obtain the identification result; operation 606, calibrating the coordinates of multiple test points based on the identification result to obtain the first test point sequence.

[0110] Specifically, each side of the motherboard has at least three preset marker points for SMT (Surface Mount Technology) PCB fabrication calibration. The SMT PCB fabrication process includes: assembling the irregularly shaped motherboard into a rectangular board, using one corner as the (0,0) origin for position confirmation, then locking the positions of the three preset marker points based on the coordinates of the origin and the three preset marker points, then visually calibrating the center position of each preset marker point before fabrication to correct positional deviations, and finally performing component placement based on the calibrated preset marker points.

[0111] Furthermore, test point calibration can be performed using preset markers. However, the motherboard used for electronic signal testing is a motherboard that has been removed from the panel, and the origin coordinates have disappeared. The position of the preset markers cannot be locked, so there is no way to perform position calibration. In addition, the preset markers are too small, with a diameter of about 1mm, making it very difficult to find the preset markers on the entire motherboard through template matching.

[0112] Therefore, the location of the preset marker point must first be determined before the test point can be calibrated.

[0113] In Operation 601, the CPU model is obtained from the first dataset based on the CPU identification information of the motherboard under test.

[0114] Specifically, there are many types of motherboards, but each type of motherboard includes a CPU, so the test points can be calibrated through the CPU.

[0115] First, based on the CPU identification information of the motherboard under test, the CPU model is obtained from the first dataset.

[0116] In operation 602, the corresponding CPU profile is exported from the CPU profile database based on the CPU model.

[0117] Specifically, in one embodiment of this application, a CPU profile database containing profile templates for all CPU models is prepared in advance.

[0118] Export the CPU profile from the CPU profile database based on the CPU model.

[0119] During operation 603, the control point measurement robotic arm takes a picture of the motherboard under test to obtain the outline of the motherboard under test.

[0120] Specifically, the outline of the motherboard under test is obtained by taking pictures of the motherboard under test through the control point measurement robotic arm.

[0121] In operation 604, if the CPU outline and the motherboard outline under test are successfully matched, the actual coordinates of the preset marker points in the motherboard under test are determined based on the CPU's coordinates and size information and the preset coordinates of the preset marker points.

[0122] Specifically, the CPU outline is first matched with the outline of the motherboard under test. After successful matching, the actual coordinates of the preset marker point on the motherboard under test are calculated based on the CPU's coordinates and size.

[0123] During operation 605, the control point measurement robot arm identifies the actual coordinates and obtains the identification results.

[0124] Specifically, after calculating the actual coordinates of the preset marker point on the motherboard under test, the control point measurement robot arm identifies the position indicated by the calculated actual coordinates of the preset marker point on the motherboard under test. It can identify whether the actual position of the preset marker point on the motherboard is the position indicated by the actual coordinates, thereby obtaining the coordinate calibration parameters, which are error parameters.

[0125] In operation 606, the coordinates of multiple test points are calibrated based on the recognition results to obtain the first test point sequence.

[0126] Specifically, the identification results include coordinate calibration parameters. By calibrating multiple test points in the test point sequence using the coordinate calibration parameters, the calibrated first test point sequence can be obtained.

[0127] Furthermore, by calibrating the test point sequence corresponding to each of the multiple test items on the motherboard under test one by one using the above calibration method, the calibration of all test points on the motherboard under test can be completed.

[0128] Figure 7 A schematic diagram illustrating the implementation flow of the point measurement coordinate calibration method of the electronic signal testing method according to an embodiment of this application is shown.

[0129] refer to Figure 7 In one embodiment of this application, after obtaining the target test point, the point measurement coordinates of the target test point are further calibrated, specifically including: operation 701, controlling the robotic arm to take a picture of the target test point according to the point measurement coordinates and point measurement angle of the target test point, and obtaining an image of the target test point area; operation 702, determining the actual point measurement coordinates of the actual test points in the target test point area image; operation 703, comparing the actual point measurement coordinates with the point measurement coordinates, and obtaining a comparison result; operation 704, calibrating the point measurement coordinates corresponding to multiple test items according to the comparison result, and obtaining the target point measurement coordinates; operation 705, replacing the point measurement coordinates with the target point measurement coordinates.

[0130] In operation 701, the robotic arm is controlled to take pictures of the target test point based on the point measurement coordinates and point measurement angle, thereby obtaining an image of the target test point area.

[0131] Specifically, when using a point-testing robotic arm to perform point tests on the motherboard under test, since the point-testing robotic arm needs to reach the target test points corresponding to multiple test items, the point-testing coordinates of the target test points are also calibrated in order to ensure the accuracy of the target test points.

[0132] Furthermore, the robotic arm is first controlled to take pictures of the target test point's coordinate position according to the target test point's measurement angle, thus obtaining an image of the target test point area.

[0133] In operation 702, determine the actual point coordinates of the actual test points in the target test point area image.

[0134] Specifically, the actual test points on the motherboard under test are searched through the target area image, and the coordinates of the actual test points are determined as the actual test coordinates.

[0135] In operation 703, the actual measured coordinates are compared with the measured coordinates to obtain the comparison results.

[0136] Specifically, if the coordinates of the target test point are accurate, the measured coordinates and the actual measured coordinates of the target test point are the same. However, in general, there is a deviation between the measured coordinates and the actual measured position. Therefore, after obtaining the actual measured coordinates, the actual measured coordinates are compared with the measured coordinates to determine the deviation between the measured coordinates and the actual coordinates, and the comparison result is obtained. The comparison result can be regarded as the deviation between the measured coordinates and the actual coordinates.

[0137] In operation 704, based on the comparison results, the point coordinates corresponding to multiple test items are calibrated to obtain the target point coordinates.

[0138] Specifically, for multiple target test points corresponding to multiple test items, there are multiple comparison results. The point measurement coordinates of the target test points corresponding to multiple test items are calibrated by using multiple comparison results to obtain the target point measurement coordinates corresponding to multiple test items.

[0139] In operation 705, replace the point coordinates with the target point coordinates.

[0140] Specifically, the calibration of the target test point's coordinates is completed by replacing the target test point's coordinates with the coordinates obtained after calibration.

[0141] Figure 8 A schematic diagram illustrating the implementation flow of the point-testing method of the electronic signal testing method according to an embodiment of this application is shown.

[0142] refer to Figure 8 In one embodiment of this application, the spot testing device further includes a testing device. Accordingly, the test results of the electronic signals of the motherboard under test can be obtained by spot testing the motherboard under test through the following operations: Operation 801, control the robotic arm to reach the spot testing position indicated by the spot testing coordinates, and perform spot testing on the spot testing position according to the angle indicated by the spot testing angle; Operation 802, when the testing device meets the preset acquisition conditions, acquire the waveform and data shown by the testing device to obtain the electronic signal test results of the motherboard under test.

[0143] In operation 801, the robotic arm is controlled to reach the point measurement position shown by the point measurement coordinates, and the point measurement position is measured according to the angle shown by the point measurement angle.

[0144] Specifically, after obtaining the point measurement coordinates and point measurement angles, the motherboard under test has completed power-on, and multiple test items of the motherboard under test have been controlled to the test conditions corresponding to the test items.

[0145] Furthermore, by controlling the robotic arm to reach the point measurement position on the motherboard under test as indicated by the point measurement coordinates, and by controlling the robotic arm to reach the angle indicated by the point measurement angle, the motherboard under test can be subjected to point measurement.

[0146] In operation 802, when the test equipment meets the preset acquisition conditions, the waveforms and data displayed by the test equipment are acquired, and the electronic signal test results of the motherboard under test are obtained.

[0147] Specifically, during the point testing process, different test items correspond to different test conditions, and the waveforms that need to be captured when testing the electronic signals corresponding to the test items are also different. Therefore, multiple preset acquisition conditions can be preset for multiple test items. Furthermore, when testing the electronic signals corresponding to multiple test items of the motherboard under test, the test equipment is controlled to reach the preset acquisition conditions corresponding to the test items to capture waveforms and data, thereby obtaining the electronic signal test results corresponding to multiple test items.

[0148] Furthermore, multiple electronic signal test results can be compiled into an electronic signal test report for later review.

[0149] Thus, this application improves testing efficiency and avoids wasting manpower by controlling a robotic arm to perform spot testing on the motherboard under test, compared with the existing technology that uses manual spot testing.

[0150] In one embodiment of this application, the test equipment is an oscilloscope. It should be noted that this application does not limit the test equipment. The test equipment can be any test equipment required for electronic signal testing, such as a load cell, a DC current detection device, etc.

[0151] Figure 9A schematic diagram of the composition structure of the electronic signal testing device according to an embodiment of this application is shown.

[0152] Based on the above-described electronic signal testing method, this application embodiment also provides an electronic signal testing device 90, which includes: an identification acquisition module 901 for acquiring identification information of the motherboard under test; a test item acquisition module 902 for acquiring a list of test items of the motherboard under test based on the identification information; a test point acquisition module 903 for determining a sequence of test points corresponding to multiple test items in the test item list; a point test information acquisition module 904 for determining multiple point test information corresponding to the point test performed by the point test device on multiple test items of the motherboard under test based on the test point sequence, wherein the point test information includes point test coordinates and point test angles; a motherboard under test control module 905 for controlling the motherboard under test to reach the preset test conditions corresponding to multiple test items; and a point test device control module 906 for controlling the point test device to perform point tests on the motherboard under test based on the multiple point test information to obtain the electronic signal test results of the motherboard under test.

[0153] In one embodiment of this application, the test item acquisition module 902 includes: a test motherboard data information acquisition submodule, used to acquire test motherboard data information of the test motherboard from a first dataset according to the identification information, the first dataset including test data information of multiple types of motherboards; and a matching submodule, used to match the test motherboard data information with a second dataset to obtain a test item list of the test motherboard, the second dataset including multiple test items and the test electronic signals corresponding to the multiple test items.

[0154] In one embodiment of this application, the second dataset also includes component reference numbers for the receiving and transmitting ends corresponding to multiple test items; correspondingly, the test point acquisition module 903 includes: a component reference number acquisition submodule, used to acquire the component reference numbers of the electronic signals under test corresponding to multiple test items in the test item list from the second dataset according to the test item list, wherein the component reference numbers include the component reference numbers of the receiving end or the component reference numbers of the transmitting end; a coordinate information acquisition submodule, used to acquire the test coordinate information of the component under test indicated by the component reference number from the first dataset according to the component reference number, wherein the test coordinate information includes the test coordinates of the component under test and the test pad coordinate information; and a test point sequence acquisition submodule, used to acquire multiple pad points within a set distance of the test coordinates to obtain a test point sequence, wherein the multiple test points in the test point sequence are arranged according to the size priority of the test pad model.

[0155] In one embodiment of this application, the point testing device includes a point testing robotic arm; correspondingly, the point testing information acquisition module 904 includes: a calibration submodule, used to calibrate multiple test points in a test point sequence to obtain a first test point sequence; a test environment acquisition submodule, used to acquire the test environment for testing the motherboard under test; an initial point testing angle determination submodule, used to determine the initial point testing angle of multiple test points in the first test point sequence based on obstacles in the test environment and the obstacle avoidance algorithm of the point testing robotic arm, wherein the initial point testing angle includes the absolute values ​​of the angle between the point testing robotic arm and the plane and the angle between the point testing robotic arm and the solder pad; and a priority sorting submodule, used to sort multiple test points according to the multiple test points and the initial point testing angles corresponding to the multiple test points. The test points are prioritized to obtain a test task list, which includes multiple test points and their corresponding initial test angles. A control submodule controls the test robot to take pictures of the multiple test points at the initial test angles to obtain the contour information to be tested, which includes multiple contours to be tested corresponding to the test points. A contour acquisition submodule retrieves template contours with corresponding angles from the component database based on the component reference numbers corresponding to the test points, obtaining template contour information. A defect detection submodule performs defect detection based on the template contour information and the contour information to be tested, obtaining the target test point. The test coordinates and test angles of the target test point are collectively referred to as test information.

[0156] In one embodiment of this application, the calibration submodule includes: a CPU model acquisition unit, used to acquire the CPU model of the CPU from a first dataset based on the CPU identification information of the motherboard under test; a contour export unit, used to export the corresponding CPU contour from a CPU contour database based on the CPU model; a control imaging unit, used to control a robotic arm to take pictures of the motherboard under test to obtain the contour of the motherboard under test; an actual coordinate determination unit, used to determine the actual coordinates of a preset marker point in the motherboard under test based on the CPU coordinates, the CPU size information, and the preset coordinates of the preset marker point, when the CPU contour and the motherboard under test contour are successfully matched; an identification unit, used to control the point testing robotic arm to identify the actual coordinates and obtain the identification result; and a coordinate calibration unit, used to calibrate the coordinates of multiple test points based on the identification result to obtain a first test point sequence.

[0157] In one embodiment of this application, the point measurement information acquisition module 904 further includes: a target test point photography control submodule, used to control the robotic arm to take a picture of the target test point according to the point measurement coordinates and point measurement angle of the target test point to obtain an image of the target test point area; an actual point measurement coordinate determination submodule, used to determine the actual point measurement coordinates of the actual test points in the image of the target test point area; a comparison submodule, used to compare the actual point measurement coordinates with the point measurement coordinates to obtain a comparison result; a target test point coordinate acquisition submodule, used to calibrate the point measurement coordinates corresponding to multiple test items according to the comparison result to obtain the target point measurement coordinates; and a replacement submodule, used to replace the point measurement coordinates with the target point measurement coordinates.

[0158] In one embodiment of this application, the point testing device includes a testing device. Accordingly, the point testing device control module 906 includes: a position control submodule, used to control the robotic arm to reach the point testing position indicated by the point testing coordinates, and to perform point testing on the point testing position according to the angle indicated by the point testing angle; and a result acquisition submodule, used to acquire the waveform and data shown by the testing device when the testing device meets the preset acquisition conditions, and to obtain the electronic signal test results of the motherboard under test.

[0159] It should be noted that the description of the device in this application embodiment is similar to the description of the method embodiment described above, and the beneficial effects similar to those in the method embodiment will not be repeated. For any technical details not covered in the assisted driving device provided in this application embodiment, please refer to... Figures 1 to 8 Please refer to the accompanying illustrations for clarification.

[0160] According to embodiments of this application, this application also provides an electronic device and a non-transitory computer-readable storage medium.

[0161] Figure 10 A schematic block diagram of an example electronic device 800 that can be used to implement embodiments of this application is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the application described and / or claimed herein.

[0162] like Figure 10As shown, the electronic device 100 includes a computing unit 1001, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 1002 or a computer program loaded from a storage unit 1008 into a random access memory (RAM) 1003. The RAM 1003 may also store various programs and data required for the operation of the electronic device 100. The computing unit 1001, ROM 1002, and RAM 1003 are interconnected via a bus 1004. An input / output (I / O) interface 1005 is also connected to the bus 1004.

[0163] Multiple components in electronic device 100 are connected to I / O interface 1005, including: input unit 1006, such as keyboard, mouse, etc.; output unit 1007, such as various types of displays, speakers, etc.; storage unit 1008, such as disk, optical disk, etc.; and communication unit 1009, such as network card, modem, wireless transceiver, etc. Communication unit 1009 allows electronic device 100 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0164] The computing unit 1001 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 1001 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 1001 performs the various methods and processes described above, such as electronic signal testing methods. For example, in some embodiments, the electronic signal testing method may be implemented as a computer software program tangibly contained in a machine-readable medium, such as storage unit 1009. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 1000 via ROM 1002 and / or communication unit 1009. When the computer program is loaded into RAM 1003 and executed by the computing unit 1001, one or more steps of the electronic signal testing method described above may be performed. Alternatively, in other embodiments, the computing unit 1001 may be configured to perform electronic signal testing methods by any other suitable means (e.g., by means of firmware).

[0165] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0166] The program code used to implement the methods of this application may be written in any combination of one or more programming languages. This program code may be provided to a processor or controller of a general-purpose computer, special-purpose computer, or other programmable data processing device, such that when executed by the processor or controller, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The program code may be executed entirely on a machine, partially on a machine, as a standalone software package partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0167] In the context of this application, a machine-readable medium can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. Machine-readable media can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0168] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the computer. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0169] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as a data server), or computing systems that include middleware components (e.g., an application server), or computing systems that include frontend components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with embodiments of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., a communication network). Examples of communication networks include local area networks (LANs), wide area networks (WANs), and the Internet.

[0170] Computer systems can include clients and servers. Clients and servers are generally located far apart and typically interact via communication networks. Client-server relationships are created by computer programs running on the respective computers and having a client-server relationship with each other. Servers can be cloud servers, servers in distributed systems, or servers incorporating blockchain technology.

[0171] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this application can be achieved, and this is not limited herein.

[0172] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic signal testing method, characterized by, The method includes: Obtain the identification information of the motherboard under test; Based on the identification information, obtain the test item list for the motherboard under test; Determine the sequence of test points corresponding to multiple test items in the test item list; Based on the test point sequence, determine the multiple test point information corresponding to the test point device performing multiple test points on multiple test items of the motherboard under test; Control the motherboard under test to meet the preset test conditions corresponding to the multiple test items; The point testing device is controlled to perform point testing on the motherboard under test according to the multiple point testing information to obtain the electronic signal test results of the motherboard under test; The point measurement device includes a point measurement robotic arm; correspondingly, The step of determining multiple point test information corresponding to the point test device performing point tests on multiple test items of the motherboard under test according to the test point sequence includes: The test points of the test point sequence are calibrated to obtain the first test point sequence; Obtain the test environment for testing the motherboard under test; Based on the obstacles in the test environment and the obstacle avoidance algorithm of the point measurement robot, the initial point measurement angles of multiple test points in the first test point sequence are determined. The initial point measurement angles include the absolute values ​​of the angle between the point measurement robot and the plane and the angle between the point measurement robot and the pad. The test points are prioritized according to the test points and the initial test angles corresponding to the test points to obtain a test task list. The test task list includes the test points and the initial test angles corresponding to the test points. The robotic arm is controlled to take pictures of the multiple test points according to the initial test angle to obtain the contour information to be measured, which includes multiple contours to be measured corresponding to the multiple test points. Based on the component reference number corresponding to the test point, obtain the template contour with the corresponding angle to the multiple test contours from the component database to obtain the template contour information; Based on the template contour information and the contour information to be tested, defect detection is performed to obtain the target test point. The point measurement coordinates and point measurement angles of the target test point are collectively referred to as point measurement information.

2. The method of claim 1, wherein, The step of obtaining the test item list of the motherboard under test based on the identification information includes: The test motherboard data information of the test motherboard is obtained from the first dataset according to the identification information. The first dataset includes test data information of multiple types of motherboards. The test motherboard data information is matched with the second dataset to obtain a test item list for the test motherboard. The second dataset includes multiple test items and the corresponding electronic signals to be tested for each test item.

3. The method of claim 2, wherein, The second dataset also includes the component reference numbers of the receiving and transmitting ends corresponding to the plurality of test items; accordingly, Determining the sequence of test points corresponding to multiple test items in the test item list includes: According to the test item list, the test component reference number of the electronic signal under test corresponding to multiple test items in the test item list is obtained from the second dataset. The test component reference number includes the component reference number of the receiving end or the component reference number of the transmitting end. Based on the component under test (SUT) reference number, obtain the SUT coordinate information of the SUT indicated by the SUT reference number from the first dataset. The SUT coordinate information includes the SUT coordinates of the SUT and the SUT pad coordinate information. Based on the coordinates to be tested, multiple pad points within a set distance of the coordinates to be tested are obtained to obtain a test point sequence. The multiple test points in the test point sequence are arranged according to the size priority of the pad model to be tested.

4. The method according to claim 1, characterized in that, The calibration of multiple test points in the test point sequence to obtain the first test point sequence includes: Based on the CPU identification information of the motherboard under test, the CPU model of the CPU is obtained from the first dataset; Based on the CPU model, export the corresponding CPU profile from the CPU profile database; The robotic arm is controlled to take pictures of the motherboard under test to obtain the outline of the motherboard under test; If the CPU outline successfully matches the outline of the motherboard under test, the actual coordinates of the preset marker point in the motherboard under test are determined based on the coordinates of the CPU, the size information of the CPU, and the preset coordinates of the preset marker point. The robotic arm is controlled to identify the actual coordinates and obtain the identification result; The coordinates of the multiple test points are calibrated based on the recognition results to obtain the first test point sequence.

5. The method according to claim 1, characterized in that, After obtaining the target test point, the method further includes: The robotic arm is controlled to take pictures of the target test point according to the point measurement coordinates and point measurement angle, thereby obtaining an image of the target test point area; Determine the actual point coordinates of the actual test points in the target test point area image; The actual measured coordinates are compared with the measured coordinates to obtain the comparison result; Based on the comparison results, the point coordinates corresponding to the multiple test items are calibrated to obtain the target point coordinates; Replace the measured coordinates of the point with the measured coordinates of the target point.

6. The method according to claim 5, characterized in that, The point testing equipment includes testing equipment; correspondingly, The control of the testing device to perform point tests on the motherboard under test based on the multiple point test information, and to obtain the electronic signal test results of the motherboard under test, including: The robotic arm is controlled to reach the point measurement position indicated by the point measurement coordinates, and the point measurement position is measured according to the angle indicated by the point measurement angle. When the test equipment meets the preset acquisition conditions, the waveforms and data displayed by the test equipment are acquired to obtain the electronic signal test results of the motherboard under test.

7. An electronic signal testing device, characterized in that, The device includes: The identifier acquisition module is used to acquire the identifier information of the motherboard under test; The test item acquisition module is used to acquire a list of test items for the motherboard under test based on the identification information. The test point acquisition module is used to determine the sequence of test points corresponding to multiple test items in the test item list; The point test information acquisition module is used to determine multiple point test information corresponding to the point test device performing point tests on multiple test items of the motherboard under test based on the test point sequence; The motherboard under test control module is used to control the motherboard under test to meet the preset test conditions corresponding to the multiple test items; The point testing equipment control module is used to control the point testing equipment to perform point testing on the motherboard under test according to the multiple point testing information, and obtain the electronic signal test results of the motherboard under test; The point testing device includes a point testing robotic arm; correspondingly, the point testing information acquisition module includes: a calibration submodule, used to calibrate multiple test points in the test point sequence to obtain a first test point sequence; a test environment acquisition submodule, used to acquire the test environment for testing the motherboard under test; an initial point testing angle determination submodule, used to determine the initial point testing angles of multiple test points in the first test point sequence based on obstacles in the test environment and the obstacle avoidance algorithm of the point testing robotic arm, the initial point testing angles including the absolute values ​​of the angle between the point testing robotic arm and the plane and the angle between the point testing robotic arm and the solder pads; and a priority sorting submodule, used to sort the multiple test points according to the multiple test points and the initial point testing angles corresponding to the multiple test points. The system prioritizes and sorts the data to obtain a list of test points, which includes multiple test points and their corresponding initial test angles. A control submodule controls the robotic arm to take pictures of the test points at the initial test angles, obtaining the contour information to be measured. This contour information includes multiple contours corresponding to the test points. A contour acquisition submodule retrieves template contours with corresponding angles from the component database based on the component reference numbers of the test points, obtaining template contour information. A defect detection submodule performs defect detection based on the template contour information and the contour information to be measured, obtaining the target test point. The test coordinates and test angles of the target test point are collectively referred to as test information.

8. An electronic device, characterized in that, include: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method of any one of claims 1-6.

9. A non-transitory computer-readable storage medium storing computer instructions, characterized in that, The computer instructions are used to cause the computer to perform the method according to any one of claims 1-6.

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