Temperature control and heat dissipation system for chip testing

Abstract

The application discloses a temperature control and heat dissipation system for chip testing, which comprises a medium layer, a semiconductor refrigeration sheet and a heat dissipation piece. The medium layer comprises a first medium layer and a second medium layer. One end of the semiconductor refrigeration sheet is connected with a test board through the first medium layer, and the other end of the semiconductor refrigeration sheet is connected with the heat dissipation piece through the second medium layer. A plurality of control boards are connected on the test board, and one heat dissipation piece is arranged between two adjacent control boards. One end of the heat dissipation piece is connected with the second medium layer, and the other end of the heat dissipation piece is provided with a flow guide plate. The two ends of the flow guide plate are respectively abutted against two control boards and form air cooling gaps. Vent holes are arranged on the heat dissipation piece, and the air cooling gaps are communicated through the vent holes. The heat dissipation piece comprises a water cooling structure. The temperature control and heat dissipation system for chip testing adopts a combined temperature control and heat dissipation system of water cooling and air cooling, improves the heat dissipation efficiency, meets the heat dissipation demand of high power consumption in a unit volume, and guarantees to reach the required temperature range of the chip.

Description

Technical Field

[0001] This invention belongs to the field of temperature control and heat dissipation technology, specifically relating to a temperature control and heat dissipation system for chip testing. Background Technology

[0002] In a memory chip testing device, temperature control of the product under test directly affects the testing efficiency and results. Temperature control of the supporting test motherboard and system hardware is essential for the overall system operation and is also a crucial factor in the performance of the testing instrument.

[0003] In current DDR4 chip testing instruments, the heat dissipation and power consumption of the entire system are concentrated on the CPU. Generally, a standard CPU air-cooling or water-cooling system can meet the system's temperature control and heat dissipation requirements.

[0004] Currently, DDR5 memory has a much higher operating speed and frequency than DDR4 memory, resulting in faster system operation, more computation, and a significant increase in hardware heat dissipation and power consumption. This poses a greater challenge to heat dissipation. Furthermore, DDR5 memory differs structurally from DDR4. When the temperature control and heat dissipation system used for DDR4 memory is applied to the testing of DDR5 memory, the temperature control effect cannot meet the design requirements. Summary of the Invention

[0005] The purpose of this invention is to provide a temperature control and heat dissipation system for chip testing, in order to solve the above-mentioned problems existing in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A temperature control and heat dissipation system for chip testing, used on a test board, includes a dielectric layer, a semiconductor cooling chip, and a heat sink.

[0008] The dielectric layer is capable of conducting heat, and the dielectric layer includes a first dielectric layer and a second dielectric layer;

[0009] One end of the semiconductor cooling chip is connected to the test board through a first dielectric layer, and the other end of the semiconductor cooling chip is connected to the heat sink through a second dielectric layer.

[0010] Several control boards are connected to the test board. The control boards are set on the same side as the heat sink, and a heat sink is set between two adjacent control boards. One end of the heat sink is connected to the second medium layer, and the other end of the heat sink is provided with a guide plate. The two ends of the guide plate abut against the two control boards respectively and form a cooling gap. The heat sink is provided with ventilation holes. The end of the cooling gap near the medium layer is connected through the ventilation holes to form a cold air internal circulation.

[0011] The heat dissipation components include water-cooled structures for heat dissipation of the semiconductor cooling chip.

[0012] In one possible design, the heat sink includes a heat sink plate, thermally conductive copper pillars, a water inlet, a water outlet, and an impingement channel. One end of the heat sink plate is a high-temperature end with the thermally conductive copper pillars, which are arranged in a plurality of spaced-apart configurations and connected to the heat sink plate, with heat dissipation gaps formed between adjacent thermally conductive copper pillars. The other end of the heat sink plate is a low-temperature end with the water inlet and water outlet, which are arranged opposite to each other. The impingement channel is disposed on the heat sink plate and adjacent to the thermally conductive copper pillars.

[0013] One end of the inlet is provided with an inlet connector, and the other end of the inlet is connected to the impact channel through an inlet hole. One end of the outlet is provided with an outlet connector, and the other end of the outlet is connected to the impact channel through an outlet hole. The inlet connector, inlet, inlet hole, impact channel, outlet hole, outlet and outlet connector constitute the water-cooling structure.

[0014] In one possible design, the impact flow channel is provided with several equally spaced baffles, and sub-flow channels are formed between adjacent baffles.

[0015] In one possible design, both the inlet and outlet water connectors are located outside the heat sink and extend into the air-cooling gap, and the inlet and outlet water connectors are arranged opposite each other. A fan is provided between the inlet and outlet water connectors to accelerate the internal circulation speed of the cold air.

[0016] Water-cooled plates are provided on the sides of the water inlet and outlet connectors. The water-cooled plates are provided with heat dissipation fins that extend into the water-cooling structure. The fan is fixed on the water-cooled plate.

[0017] In one possible design, the heat dissipation component also includes an external water cooler, with an inlet connector and an outlet connector respectively connected to the external water cooler, so that the water cooling structure forms a circulating water cooling structure.

[0018] In one possible design, several heat pipes are laid on the heat sink, extending from the high-temperature end of the heat sink to the low-temperature end.

[0019] In one possible design, the ventilation hole is mounted on the heat dissipation plate and located below the impact flow channel, and correspondingly, the water inlet and water outlet are respectively provided on both sides of the ventilation hole.

[0020] In one possible design, the deflector includes a straight plate and an arc plate, with an arc plate connected to each end of the straight plate, and the arc plate can guide the direction of cold air flow.

[0021] In one possible design, the dielectric layer may be selected from thermally conductive silicone pads, thermally conductive silicone, phase change thermally conductive sheets, thermally conductive mica sheets, or thermally conductive ceramic sheets.

[0022] In one possible design, the test board is provided with multiple ASIC chips, and several semiconductor cooling pads are provided and are set one-to-one with the ASIC chips; the control board is provided with a secondary heat sink on at least one side, and the secondary heat sink faces the adjacent heat sink.

[0023] Beneficial effects:

[0024] The temperature control and heat dissipation system for chip testing adopts a combined water-cooling and air-cooling system, which improves heat dissipation efficiency, meets the heat dissipation requirements of high power consumption per unit volume, and ensures that the required temperature range of the chip is met. The air-cooling section, combined with the structure of the temperature control and heat dissipation system for chip testing, forms an internal circulation of cold air, thereby uniformly dissipating heat from the control board and preventing overheating. The water-cooling section takes into account the heat dissipation requirements of both the test board and the control board. That is, the water-cooling structure is directly used for heat dissipation of the test chip, and the water-cooling structure contacts the cold air and reduces the temperature of the cold air, thereby indirectly reducing the temperature of the control board.

[0025] Meanwhile, multiple thermoelectric coolers are connected to each chip on the test board to achieve one-to-one temperature control, enabling more precise independent temperature control of each chip and ensuring temperature uniformity among them. Furthermore, the temperature difference between the two sides of the thermoelectric cooler allows the chip surface to reach a very low temperature.

[0026] Furthermore, since the structure of DDR5 memory is different from that of DDR4 memory, the temperature control and heat dissipation system for chip testing has also been adapted in structure to better fit DDR5 memory, ensuring stable, uniform and thorough heat dissipation, and greatly improving the heat dissipation effect. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a temperature control and heat dissipation system for chip testing.

[0028] Figure 2 This is a schematic diagram of the assembly of the test board and the temperature control and heat dissipation system for testing the chip.

[0029] Figure 3 This is a cross-sectional view of the heat sink.

[0030] Figure 4 This is a schematic diagram of the front of the heat sink.

[0031] Figure 5 for Figure 4 A cross-sectional structural diagram.

[0032] Figure 6 This is a schematic diagram of the structure on the back of the heat sink.

[0033] Figure 7 This is a schematic diagram of the control board.

[0034] In the picture:

[0035] 100. Dielectric layer; 101. First dielectric layer; 102. Second dielectric layer; 200. Semiconductor cooling chip; 300. Heat sink; 301. Heat sink plate; 302. Thermally conductive copper pillar; 303. Water inlet; 304. Water outlet; 305. Impact channel; 306. Heat dissipation gap; 307. Water inlet connector; 308. Water inlet hole; 309. Water outlet connector; 310. Water outlet hole; 311. Partition plate; 312. Heat pipe; 313. Ventilation hole; 400. Test board; 401. ASIC chip; 500. Control board; 501. Secondary heat sink plate; 600. Guide plate; 601. Straight plate; 602. Curved plate; 701. Air-cooled gap; 702. Internal air circulation; 703. Fan; 704. Water-cooled plate. Detailed Implementation

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be briefly introduced below in conjunction with the accompanying drawings and descriptions of the embodiments or the prior art. Obviously, the following description of the structure of the accompanying drawings is only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the description of these embodiments is for the purpose of helping to understand the present invention, but does not constitute a limitation of the present invention.

[0037] Example:

[0038] To address the shortcomings of existing temperature control and heat dissipation systems in DDR5 memory testing, this invention provides a chip testing temperature control and heat dissipation system. This system employs a combination of water cooling and air cooling, improving heat dissipation efficiency, meeting the heat dissipation requirements of high power consumption per unit volume, and ensuring that the chip's required temperature range is maintained. The air cooling component, combined with the structure of the chip testing temperature control and heat dissipation system, forms a cold air internal circulation 702, thereby uniformly dissipating heat from the control board 500 and preventing overheating. The water cooling component addresses the heat dissipation needs of both the test board 400 and the control board 500; the water cooling structure directly dissipates heat from the test chip, and its contact with the cold air lowers the air temperature, indirectly reducing the temperature of the control board 500.

[0039] Meanwhile, multiple thermoelectric coolers 200 are provided and connected one-to-one with the chips on the test board 400 to achieve one-to-one temperature control, enabling more precise independent temperature control of each chip and ensuring temperature uniformity among the chips. Furthermore, the temperature difference between the two sides of the thermoelectric cooler 200 can be used to achieve a very low temperature on the chip surface.

[0040] Furthermore, since the structure of DDR5 memory is different from that of DDR4 memory, the temperature control and heat dissipation system for chip testing has also been adapted in structure to better fit DDR5 memory, ensuring stable, uniform and thorough heat dissipation, and greatly improving the heat dissipation effect.

[0041] like Figures 1-7 As shown, a temperature control and heat dissipation system for chip testing is used on a test board 400, including a dielectric layer 100, a semiconductor cooling chip 200, and a heat sink 300.

[0042] The dielectric layer 100 is capable of conducting heat, and the dielectric layer 100 includes a first dielectric layer 101 and a second dielectric layer 102;

[0043] One end of the semiconductor cooling chip 200 is connected to the test board 400 through the first dielectric layer 101, and the other end of the semiconductor cooling chip 200 is connected to the heat sink 300 through the second dielectric layer 102.

[0044] Several control boards 500 are connected to the test board 400. The control boards 500 are set on the same side as the heat sink 300, and a heat sink 300 is set between two adjacent control boards 500. One end of the heat sink 300 is connected to the second medium layer 102, and the other end of the heat sink 300 is provided with a guide plate 600. The two ends of the guide plate 600 abut against the two control boards 500 respectively and form a cooling gap 701. The heat sink 300 is provided with ventilation holes 313. The end of the cooling gap 701 near the medium layer 100 is connected through the ventilation holes 313 to form a cold air internal circulation 702.

[0045] The heat sink 300 includes a water-cooling structure for heat dissipation of the semiconductor cooling chip 200.

[0046] The test board 400 is densely packed with ASIC (Application Specific Integrated Circuit) chips. Each ASIC chip 401 controls the DUT (Device Under Test) on a one-to-one basis. Each ASIC chip 401 generates power and heat during operation. The ASIC chip 401 needs to be within a certain temperature range to ensure its normal operation; overheating can damage the ASIC chip 401 or even the entire test system. A control board 500 is connected to the test board 400. The control board 500 supplies power to the test board 400 and also houses the CPU (Central Processing Unit) and other heat-generating components. These components also require stable and uniform heat dissipation to ensure the normal operation of the entire test system.

[0047] Based on this, a thermoelectric cooler 200 is selected for heat dissipation of the ASIC chip 401. One side of the thermoelectric cooler 200 is a hot side and the other side is a cold side. Under ideal conditions, a constant and relatively large temperature difference will be generated between the hot side and the cold side. By controlling the temperature of the hot side, the cold side can be kept at a certain low temperature, or even below zero, thereby achieving continuous cooling through the cold side.

[0048] Specifically, the cold side of the thermoelectric cooler 200 is in close contact with the ASIC chip 401 through the first dielectric layer 101 to cool the ASIC chip 401, thereby maintaining the ASIC chip 401 within the required temperature range. The hot side of the thermoelectric cooler 200 is connected to a water-cooling structure through the second dielectric layer 102. The water-cooling structure cools the hot side of the thermoelectric cooler 200 to control the heat dissipation of the hot side, ensuring that both the hot and cold sides of the thermoelectric cooler 200 are stably maintained within the designed temperature range for stable, continuous, and efficient heat dissipation.

[0049] Cooling water flows in a certain direction within the water-cooled structure, creating a temperature difference between the inlet and outlet ends. This temperature difference is used to drive the flow of cold air within the chip testing temperature control and heat dissipation system. Simultaneously, the guide plate 600 isolates the system from the outside environment and guides the cold air. Combined with the ventilation holes 313, the air-cooling gap 701 is connected. The flowing cold air circulates within the chip testing temperature control and heat dissipation system. The heat generated on the control board 500 is conducted to the water-cooled structure through the cold air, achieving heat dissipation. Furthermore, the circulating cold air ensures more even heat dissipation on the control board 500, preventing localized high temperatures.

[0050] In this embodiment, the heat sink 300 includes a heat sink 301, a thermally conductive copper pillar 302, a water inlet 303, a water outlet 304, and an impingement channel 305. One end of the heat sink 301 is a high-temperature end with the thermally conductive copper pillar 302. Several thermally conductive copper pillars 302 are provided and spaced apart from each other and connected to the heat sink 301. A heat dissipation gap 306 is formed between adjacent thermally conductive copper pillars 302. The other end of the heat sink 301 is a low-temperature end with the water inlet 303 and the water outlet 304. The water inlet 303 and the water outlet 304 are arranged opposite to each other. The impingement channel 305 is provided on the heat sink 301 and adjacent to the thermally conductive copper pillar 302.

[0051] The inlet 303 has an inlet connector 307 at one end and an inlet hole 308 at the other end, which is connected to the impact channel 305. The outlet 304 has an outlet connector at one end and an outlet hole 310 at the other end, which is connected to the impact channel 305. The inlet connector 307, inlet 303, inlet hole 308, impact channel 305, outlet hole 310, outlet 304 and outlet connector 309 constitute the water-cooling structure.

[0052] Based on the above design, for the water-cooling section, the heat-conducting copper pillar 302 is in direct contact with the second dielectric layer 102. Simultaneously, heat from the hot surface of the semiconductor refrigeration chip 200 is transferred to the heat sink 301 via the heat-conducting copper pillar 302. The heat sink 301 is equipped with the aforementioned water-cooling structure, which contains circulating cooling water. The flow of the cooling water carries away heat, thereby controlling the temperature of the hot surface of the semiconductor refrigeration chip 200. Preferably, the heat sink 301 needs to conduct heat during the heat dissipation process; therefore, the heat sink 301 can be made of any suitable thermally conductive material.

[0053] Multiple thermally conductive copper pillars 302, semiconductor cooling pads 200, and ASIC chips 401 are provided and are arranged in a one-to-one correspondence. The heat dissipation gap 306 is the gap between adjacent ASIC chips 401. On the one hand, it avoids the heat concentration caused by the ASIC chips 401 being too close together. On the other hand, it also facilitates precise temperature control of each chip, making the heat dissipation effect of the ASIC chip 401 more accurate.

[0054] like Figure 3 As shown, the inlet 303 and outlet 304 are located on the same side and on opposite sides of the heat dissipation plate 301, respectively, to increase the distance between them and thus increase the length of the impact channel 305. The impact channel 305 is the main heat exchange area in the water-cooled structure, and its increased length can effectively increase the heat exchange area, thereby improving the heat dissipation efficiency. The inlet connector 307 and outlet connector 309 are used to connect external equipment, including but not limited to pipes and external water coolers. The external water cooler lowers the temperature of the cooling water to achieve the purpose of cooling water circulation.

[0055] In one possible implementation, the impingement channel 305 is provided with a plurality of equally spaced baffles 311, with adjacent baffles 311 forming sub-channels. Based on the above design, the impingement channel 305 is divided into several sub-channels by the baffles 311, which significantly increases the contact area between the cooling water and the impingement channel 305, effectively improving the efficiency and effect of heat dissipation. Preferably, the baffles 311 are also made of any suitable thermally conductive material to improve thermal conductivity and further improve the efficiency of heat exchange.

[0056] In one possible implementation, both the inlet connector 307 and the outlet connector 309 are located outside the heat sink 301 and extend into the air-cooling gap 701, with the inlet connector 307 and the outlet connector 309 positioned opposite each other. A fan 703 is provided between the inlet connector 307 and the outlet connector 309 to accelerate the flow rate of the internal air circulation 702. Based on this design, the fan 703 accelerates the air circulation speed, speeds up the removal of heat from the control board 500, and improves the air-cooling effect.

[0057] like Figure 3As shown, water-cooled plates 704 are provided on the sides of the water inlet connector 307 and the water outlet connector 309. The water-cooled plates 704 have heat dissipation fins extending into the water-cooling structure, and the fan 703 is fixed to the water-cooled plates 704. Based on this, the heat dissipation fins are used to connect the water-cooling structure and the air circulation. During air circulation, the heat dissipated by the control board 500 is carried away by the air, and the heated air is cooled by the heat dissipation fins to ensure that the air remains at a lower temperature.

[0058] In one possible implementation, the heat sink 300 further includes an external water cooler, with an inlet connector 307 and an outlet connector 309 respectively connected to the external water cooler to form a circulating water cooling structure. The function of the external water cooler has already been explained in conjunction with the water cooling structure and will not be repeated here. It is easy to understand that any suitable commercially available device can be selected as the external water cooler.

[0059] In one possible implementation, a plurality of heat pipes 312 are laid on the heat sink 301, extending from the high-temperature end of the heat sink 301 to the low-temperature end. Based on the above design, heat is transferred using the heat pipes 312, allowing the heat from the ASIC chip 401 to be transferred quickly and evenly to the impingement flow channel 305, improving heat exchange efficiency. Simultaneously, the heat pipes 312 also extend to the low-temperature end of the heat sink 301 and come into contact with cool air, allowing for cooling through the cool air.

[0060] The portion of heat sink 301 located above the impingement channel 305 is used for heat conduction from the ASIC chip 401. Before cooling through the impingement channel 305, this portion has a high temperature. If the ventilation hole 313 is located in this portion, the cooling effect will be poor. Therefore... Figure 3 and Figure 4 As shown, the ventilation hole 313 is disposed on the heat dissipation plate 301 and located below the impact flow channel 305. Correspondingly, the water inlet hole 308 and the water outlet hole 310 are respectively provided on both sides of the ventilation hole 313. The number of ventilation holes 313 can be adjusted according to the actual heat dissipation effect, based on the uniform arrangement, including but not limited to four, five or six.

[0061] In this embodiment, the guide plate 600 includes a straight plate 601 and an arc plate 602. An arc plate 602 is connected to each end of the straight plate 601, and the arc plate 602 guides the direction of cold air flow. Based on the above design, the curvature of the arc plate 602 guides the flow of cold air, facilitating the formation of an internal cold air circulation 702, thus ensuring uniform heat dissipation from the control plate 500.

[0062] In this embodiment, the dielectric layer 100 is selected from thermally conductive silicone pads, thermally conductive silicone, phase change thermally conductive sheets, thermally conductive mica sheets, or thermally conductive ceramic sheets. Based on the above design scheme, the dielectric layer 100 can be made of any suitable thermally conductive material according to actual usage conditions, including but not limited to the examples mentioned above. It is easy to understand that the first dielectric layer 101 and the second dielectric layer 102 are made of the same material to reduce usage costs.

[0063] In this embodiment, the test board 400 is provided with multiple ASIC chips 401, and several thermoelectric coolers 200 are provided, each corresponding to one of the ASIC chips 401. Based on the above design, multiple thermoelectric coolers 200 are provided and connected to the chips on the test board 400 in a one-to-one manner to achieve a one-to-one temperature control effect, enabling more precise independent temperature control of each chip and ensuring temperature uniformity among the chips.

[0064] like Figure 1 As shown, the control board 500 has a secondary heat sink 501 on at least one side, and the secondary heat sink 501 faces the adjacent heat sink 300. Based on the above design, the secondary heat sink 501 serves two purposes: firstly, it is used to fix the various components on the control board 500 to prevent them from becoming loose or falling off; secondly, it is used to conduct the heat dissipated by the various components on the control board 500, so that the heat is evenly dissipated and the local high temperature phenomenon is avoided. At the same time, the secondary heat sink 501 faces the adjacent heat sink 300, that is, the secondary heat sink 501 is in contact with the internal air circulation 702, and the heat is directly carried away by the cold air, resulting in faster and more rapid heat dissipation.

[0065] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A temperature control and heat dissipation system for chip testing, used on a test board (400), characterized in that, It includes a dielectric layer (100), a semiconductor cooling chip (200), and a heat sink (300); The dielectric layer (100) is capable of conducting heat, and the dielectric layer (100) includes a first dielectric layer (101) and a second dielectric layer (102); One end of the semiconductor cooling chip (200) is connected to the test board (400) through the first dielectric layer (101), and the other end of the semiconductor cooling chip (200) is connected to the heat sink (300) through the second dielectric layer (102). Several control boards (500) are connected to the test board (400). The control boards (500) are set on the same side as the heat sink (300), and a heat sink (300) is provided between two adjacent control boards (500). One end of the heat sink (300) is connected to the second medium layer (102), and the other end of the heat sink (300) is provided with a guide plate (600). The two ends of the guide plate (600) abut against the two control boards (500) respectively and form a cooling gap (701). The heat sink (300) is provided with a ventilation hole (313). The end of the cooling gap (701) near the medium layer (100) is connected through the ventilation hole (313) to form a cold air internal circulation (702). The heat sink (300) includes a water-cooled structure for heat dissipation of the semiconductor cooling chip (200).

2. The temperature control and heat dissipation system for chip testing according to claim 1, characterized in that, The heat sink (300) includes a heat sink (301), a thermally conductive copper pillar (302), a water inlet (303), a water outlet (304), and an impact flow channel (305). One end of the heat sink (301) is a high-temperature end with the thermally conductive copper pillar (302) provided. Several thermally conductive copper pillars (302) are provided and spaced apart from each other. A heat dissipation gap (306) is formed between adjacent thermally conductive copper pillars (302). The other end of the heat sink (301) is a low-temperature end with the water inlet (303) and the water outlet (304) provided. The water inlet (303) and the water outlet (304) are arranged opposite to each other. The impact flow channel (305) is provided on the heat sink (301) and adjacent to the thermally conductive copper pillar (302). The inlet (303) is provided with an inlet connector (307) at one end, and the other end of the inlet (303) is connected to the impact channel (305) through the inlet hole (308). The outlet (304) is provided with an outlet connector (309) at one end, and the other end of the outlet (304) is connected to the impact channel (305) through the outlet hole (310). The inlet connector (307), inlet (303), inlet hole (308), impact channel (305), outlet hole (310), outlet (304) and outlet connector (309) constitute the water-cooling structure.

3. The temperature control and heat dissipation system for chip testing according to claim 2, characterized in that, The impact flow channel (305) is provided with several equally spaced baffles (311), and sub-flow channels are formed between adjacent baffles (311).

4. The temperature control and heat dissipation system for chip testing according to claim 2, characterized in that, The water inlet connector (307) and the water outlet connector (309) are both located outside the heat sink (301) and extend into the air-cooled gap (701). The water inlet connector (307) and the water outlet connector (309) are arranged opposite to each other. A fan (703) is provided between the water inlet connector (307) and the water outlet connector (309) to accelerate the flow rate of the internal circulation (702) of the cold air. Water-cooled plates (704) are provided on the sides of the water inlet connector (307) and the water outlet connector (309). The water-cooled plates (704) are provided with heat dissipation fins extending into the water-cooling structure. The fan (703) is fixed on the water-cooled plates (704).

5. The temperature control and heat dissipation system for chip testing according to claim 2 or 4, characterized in that, The heat sink (300) also includes an external water cooler, and the water inlet connector (307) and the water outlet connector (309) are respectively connected to the external water cooler so that the water cooling structure forms a circulating water cooling structure.

6. The temperature control and heat dissipation system for chip testing according to claim 2, characterized in that, Several heat pipes (312) are laid on the heat sink (301), and the heat pipes (312) extend from the high temperature end of the heat sink (301) to the low temperature end of the heat sink (301).

7. The temperature control and heat dissipation system for chip testing according to claim 2, characterized in that, The ventilation hole (313) is provided on the heat dissipation plate (301) and located below the impact flow channel (305). Correspondingly, the water inlet hole (308) and the water outlet hole (310) are respectively provided on both sides of the ventilation hole (313).

8. The temperature control and heat dissipation system for chip testing according to claim 1, characterized in that, The deflector (600) includes a straight plate (601) and an arc plate (602). The two ends of the straight plate (601) are respectively connected to an arc plate (602), and the arc plate (602) can guide the direction of cold air flow.

9. The temperature control and heat dissipation system for chip testing according to claim 1, characterized in that, The dielectric layer (100) is selected from thermally conductive silicone sheet, thermally conductive silicone, phase change thermally conductive sheet, thermally conductive mica sheet or thermally conductive ceramic sheet.

10. The temperature control and heat dissipation system for chip testing according to claim 1, characterized in that, The test board (400) is provided with multiple ASIC chips (401), and the semiconductor cooling chip (200) is provided with several chips and is set one-to-one with the ASIC chips (401); the control board (500) is provided with a secondary heat sink (501) on at least one side, and the secondary heat sink (501) faces the adjacent heat sink (300).

Images