Equivalent simplification method, simulation method, device and medium for radiator model

Abstract

The application discloses a heat sink model equivalent simplification method, a simulation method, equipment and a medium, and comprises the following steps: in the first stage, the number of heat dissipation fins in each group of finned heat sinks is simplified in an initial heat sink model, and the structural form of each heat dissipation fin is simplified to obtain an initial simplified model; the model is not equivalent and can cause changes in heat dissipation performance. Then in the second stage, based on the change in the heat dissipation surface area in the initial simplified model, the heat dissipation coefficients of the multiple groups of finned heat sinks are adjusted to target heat dissipation coefficients, and based on the change in the fluid resistance and flow rate in the initial simplified model, the thickness of each heat dissipation fin is adjusted to a target thickness to obtain a target simplified model. The target simplified model can achieve the equivalent simplification effect after being adjusted from the initial simplified model, so that the global modeling of the multiple groups of finned heat sinks can be approximately realized.

Description

Technical Field

[0001] This invention relates to the field of power system transformer simulation technology, and in particular to a method for equivalent simplification of radiator models, a simulation method, equipment, and medium. Background Technology

[0002] Currently, oil-immersed transformers mainly use plate-type radiators for heat dissipation. Generally, multiple sets of plate-type radiators are installed side by side on both sides of this type of oil-immersed transformer, and each set of plate-type radiators consists of upper and lower oil manifolds and a certain number of heat dissipation fins.

[0003] Currently, researchers both domestically and internationally often use numerical simulation methods to study the impact of different heat sink structures on heat dissipation capacity. This research plays an important role in improving heat dissipation structures and optimizing layout schemes. However, due to limitations in simulation software performance and computing power, researchers can often only model single heat sinks or single groups of heat sinks, making full-field simulation calculations for all heat sinks difficult to achieve. Summary of the Invention

[0004] Therefore, it is necessary to provide methods for equivalent simplification of radiator models, simulation methods, equipment, and media to solve the problem of difficulty in performing full-field simulation calculations for all radiators.

[0005] A method for simplifying an equivalent radiator model is applied to an initial radiator model comprising multiple sets of plate-type radiators, each set of plate-type radiators including multiple heat sinks. The method includes:

[0006] Within the initial radiator model, the number of heat sinks in each group of plate radiators is simplified, and the structural form of each heat sink is simplified to obtain the initial simplified model;

[0007] Based on the changes in the heat dissipation surface area within the initial simplified model, the heat dissipation coefficients of the multiple sets of plate heat sinks are adjusted to the target heat dissipation coefficients. Based on the changes in fluid resistance and flow velocity within the initial simplified model, the thickness of each heat sink is adjusted to the target thickness to obtain the target simplified model. The simplification of the number and structural form of the heat sinks causes changes in the heat dissipation surface area, as well as changes in fluid resistance and flow velocity.

[0008] In one embodiment, simplifying the number of heat sinks in each group of finned heat sinks includes:

[0009] The number of heat sinks in each group of heat sinks is gradually reduced until the current computing power consumption is less than the preset computing power threshold; where the number of heat sinks is positively correlated with computing power consumption.

[0010] In one embodiment, simplifying the structural form of each heat sink includes:

[0011] Remove the partition structure of each heatsink and the chamfer features at the inner corners.

[0012] In one embodiment, adjusting the heat dissipation coefficient of the multiple sets of plate heat sinks to the target heat dissipation coefficient based on the change in heat dissipation surface area within the initial simplified model includes:

[0013] Obtain the first total heat dissipation surface area of ​​each group of plate heat sinks before simplification of the number and structure, and the second total heat dissipation surface area after simplification of the number and structure.

[0014] The area change factor is calculated based on the first total heat dissipation surface area and the second total heat dissipation surface area, and the product of the area change factor and the preset initial heat transfer coefficient is used as the target heat dissipation coefficient.

[0015] The heat dissipation coefficient of the multiple sets of plate heat sinks is adjusted from the initial heat transfer coefficient to the target heat dissipation coefficient.

[0016] In one embodiment, adjusting the thickness of each heat sink to the target thickness based on the fluid resistance and velocity variations within the initial simplified model includes:

[0017] Before simplifying the quantity and structural form, obtain the cross-sectional area of ​​the fluid passing through each heat sink and the first number of heat sinks in each group of plate heat sinks;

[0018] After simplifying the quantity and structural form, obtain the second number of heat sinks in each group of plate heat sinks, calculate the target thickness of each heat sink based on the cross-sectional area, the first number, the second number and the width of each heat sink, and adjust the thickness of each heat sink to the target thickness.

[0019] In one embodiment, the formula for calculating the target thickness is:

[0020] Target thickness = cross-sectional area × first quantity / second quantity / width of heat sink.

[0021] A method for simulating the thermal-fluid coupled field of a transformer, the method comprising:

[0022] Obtain the constructed slab-style simplified model and slab-style initial model; wherein, the slab-style simplified model is a model of a set of slab-style heat sinks in the target simplified model, the target simplified model is simplified by a heat sink model equivalent simplification method as described above or the method described in any embodiment, and the slab-style initial model is a model of a set of slab-style heat sinks in the initial heat sink model;

[0023] The basic parameters are obtained, and a thermal-fluid coupled field simulation is performed on the simplified plate model based on the basic parameters to obtain a first simulation result. A thermal-fluid coupled field simulation is then performed on the initial plate model based on the basic parameters to obtain a second simulation result. The basic parameters include the relationship curves of density, viscosity, thermal conductivity, and specific heat capacity with temperature, mesh size, inlet velocity and temperature of the oil flow, outlet boundary conditions, and wall boundary conditions. The simulation results include the simulated temperature difference of the oil flow at the inlet and outlet of the plate radiator and the simulated heat dissipation of the plate radiator.

[0024] In one embodiment, the method further includes:

[0025] When the error ratio between the simulated temperature difference in the first simulation result and the simulated temperature difference in the second simulation result is less than a preset first ratio threshold, and the error ratio between the simulated heat dissipation in the first simulation result and the simulated heat dissipation in the second simulation result is less than a preset second ratio threshold, the target simplified model is saved.

[0026] A computer-readable storage medium storing a computer program, which, when executed by a processor, causes the processor to perform the steps of the above-described heat sink model simplification method and transformer thermal-fluid coupling field simulation method.

[0027] A device for simplifying an equivalent heat sink model includes a memory and a processor. The memory stores a computer program, which, when executed by the processor, causes the processor to perform the steps of the aforementioned simplification method for an equivalent heat sink model and the simulation method for a transformer thermal-fluid coupled field.

[0028] This invention provides a method, simulation method, equipment, and medium for equivalent simplification of radiator models. It is applied to an initial radiator model comprising multiple sets of plate-type radiators, each set including multiple heat sinks. In the first stage, the number of heat sinks in each set of plate-type radiators and the structural shape of each heat sink are simplified within the initial radiator model to obtain an initial simplified model. This model is not equivalent and will cause changes in heat dissipation performance. Then, in the second stage, based on the changes in the heat dissipation surface area within the initial simplified model, the heat dissipation coefficient of the multiple sets of plate-type radiators is adjusted to a target heat dissipation coefficient. Furthermore, based on the changes in fluid resistance and flow velocity within the initial simplified model, the thickness of each heat sink is adjusted to a target thickness to obtain a target simplified model. This target simplified model, after adjustments to the initial simplified model, achieves an equivalent simplification effect, thus enabling approximately global modeling of the multiple sets of plate-type radiators. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] in:

[0031] Figure 1 This is a flowchart illustrating an equivalent simplification method for a heat sink model in one embodiment;

[0032] Figure 2 This is a schematic diagram of the initial heat sink model before simplification in one embodiment;

[0033] Figure 3 This is a simplified schematic diagram of each group of plate heat sinks in one embodiment;

[0034] Figure 4 This is a simplified schematic diagram of each group of plate heat sinks in one embodiment;

[0035] Figure 5 This is a flowchart illustrating the process of adjusting the heat dissipation coefficient of a plate heat sink in one embodiment.

[0036] Figure 6 The thickness of each heatsink is adjusted in one embodiment;

[0037] Figure 7 This is a flowchart illustrating an equivalent simplification method for a heat sink model in one embodiment;

[0038] Figure 8 This is a schematic diagram showing the simulation results of a simplified sheet model and an initial sheet model in one embodiment;

[0039] Figure 9 This is a structural block diagram of a simplified equivalent device based on a heat sink model in one embodiment. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] like Figure 1 As shown, Figure 1 This is a flowchart illustrating an equivalent simplification method for a heat sink model in one embodiment, applied to an initial heat sink model including multiple sets of plate-type heat sinks, such as... Figure 2 The image shown is a schematic diagram of the initial heatsink model before simplification. Each group of plate-type heatsinks includes multiple heatsink fins, such as... Figure 3 The diagram shown is a simplified representation of each group of heat sinks. Due to limitations in simulation software performance and computing power, researchers can often only model individual heat sinks or groups of heat sinks, but full-field simulation calculations for all heat sinks are difficult to achieve.

[0042] Therefore, the steps provided by the heat sink model simplification method in this embodiment include:

[0043] S101, within the initial radiator model, simplify the number of heat sinks in each group of plate radiators and simplify the structural shape of each heat sink to obtain the initial simplified model.

[0044] Here, when simplifying the number of heat sink fins in each heat sink group, the reduction in fin count is determined by the computing power and simulation software performance. It's understandable that the number of heat sink fins is positively correlated with computing power consumption; therefore, gradually reducing the number of heat sink fins will ultimately meet the performance requirements of the computing power and simulation software. Simultaneously, simplifying the structural form should ensure that the basic functions of the original heat sink are not affected.

[0045] In one specific embodiment, the step of simplifying the number of heat sinks is as follows: a computational threshold is preset, and then the number of heat sinks in each group of plate heat sinks is reduced one by one until the current computing power consumption is less than the preset computing power threshold. For example, as shown... Figure 3 As shown, the original heatsink had 36 fins; Figure 4 As shown, the simplified heat sink has 12 fins.

[0046] In one specific embodiment, the structural simplification step involves removing the partition structure of each heat sink and the chamfered features at the inner corners. For example... Figure 4 As shown, the partition structure of each heat sink and the chamfer features at the inner corners have been removed after simplification.

[0047] It is understandable that by simplifying the single-plate structure of the heat sink and reducing the number of heat sinks in each group in the above way, the number of meshes and the degree of freedom of the solution in the computational model can be effectively reduced, which is conducive to realizing the full-field simulation of the heat sink.

[0048] S102, based on the changes in heat dissipation surface area within the initial simplified model, adjust the heat dissipation coefficient of multiple sets of plate heat sinks to the target heat dissipation coefficient, and based on the changes in fluid resistance and flow velocity within the initial simplified model, adjust the thickness of each heat sink to the target thickness to obtain the target simplified model.

[0049] It is understandable that simplifying the number and structure of the heat sinks in S101 will cause changes in the heat dissipation surface area, as well as changes in fluid resistance and flow velocity. Therefore, in S102, the heat transfer coefficient and thickness of the heat sinks are varied within a reasonable range to compensate for the changes in heat dissipation surface area, as well as the changes in fluid resistance and flow velocity.

[0050] In one specific embodiment, such as Figure 5 As shown, the heat dissipation coefficient of a finned heatsink can be adjusted through the following steps:

[0051] S102A, obtain the first total heat dissipation surface area of ​​the heat sinks in each group of plate heat sinks before simplification of quantity and structural form, and the second total heat dissipation surface area after simplification of quantity and structural form.

[0052] For example, the first total heat dissipation surface area before simplification of quantity and structural form is S1, and the second total heat dissipation surface area after simplification of quantity and structural form is S2.

[0053] S102B calculates the area change factor based on the first total heat dissipation surface area and the second total heat dissipation surface area, and uses the product between the area change factor and the preset initial heat transfer coefficient as the target heat dissipation coefficient.

[0054] For example, the formula for calculating the area change factor n is n = S1 / S2, where n indicates the factor by which the area is reduced. Assuming the initial heat transfer coefficient is H1, the target heat transfer coefficient is H1 × n.

[0055] S102C adjusts the heat dissipation coefficient of multiple finned heat sinks from the initial heat transfer coefficient to the target heat dissipation coefficient.

[0056] Of course, due to the existence of error, the initial heat transfer coefficient can also be adjusted to a value near the target heat transfer coefficient (H1×n).

[0057] In one adjusted example, the total surface area for heat dissipation before statistical structure simplification is S1 = 106.99 m². 2 The simplified second heat dissipation total surface area S2 = 44.22m² 2 Therefore, the calculated area change factor n = 2.42 times, meaning the area decreased by a factor of 2.42. Further analysis revealed the initial heat transfer coefficient H1 to be 10 (m²). 2 Therefore, the adjusted target heat dissipation coefficient H2 varies within the range of H1×n=10×2.42=24.2W / (m²). 2 Near K.

[0058] In one specific embodiment, such as Figure 6 As shown, the thickness of each heatsink is adjusted using the following steps:

[0059] S102a, Obtain the cross-sectional area of ​​the fluid passing through each heat sink and the first number of heat sinks in each group of plate heat sinks before simplification of quantity and structural form.

[0060] For example, before the simplification of quantity and structural form, the cross-sectional area of ​​the fluid passing through each heat sink is A1, and the first number of heat sinks in each group of plate heat sinks is m1.

[0061] S102b, after simplifying the quantity and structural form, obtain the second number of heat sinks in each group of plate heat sinks, calculate the target thickness of each heat sink based on the cross-sectional area, the first number, the second number and the width of each heat sink, and adjust the thickness of each heat sink to the target thickness.

[0062] For example, after simplifying the quantity and structural form, the second number of heat sinks in each group of plate heat sinks is m2. The width of each heat sink is l. Then, the target thickness d can be calculated based on the cross-sectional area A, the first number m1, the second number m2, and the width l of each heat sink.

[0063] In one specific embodiment, the formula for calculating the target thickness is:

[0064] Target thickness = Cross-sectional area × First quantity / Second quantity / Width of heat sink

[0065] Of course, due to the existence of error, the thickness of each heat sink can also be adjusted to a value near the target thickness d.

[0066] In one example of adjustment, the cross-sectional area A1 of the fluid passing through the single-piece heat sink before structural simplification was statistically determined to be 0.00317 m². 2 Before the structural simplification, the first number of heat sinks in each heat sink group was m1=36, and after the structural simplification, the second number of heat sinks in each heat sink group was m2=12, and the width of each heat sink was l=0.52.

[0067] The adjusted thickness d of each individual heat sink is approximately A1×m1 / m2 / l=0.00317×36 / 12 / 0.52=0.0183m=18.3mm.

[0068] The aforementioned simplification method for the radiator model involves several steps. First, within the initial radiator model, the number of heat sinks in each group of plate radiators is simplified, along with the structural shape of each heat sink, resulting in an initial simplified model. This initial simplified model is not equivalent and will cause changes in heat dissipation performance. Next, in the second stage, based on the changes in the heat dissipation surface area within the initial simplified model, the heat dissipation coefficients of the multiple groups of plate radiators are adjusted to the target heat dissipation coefficients. Furthermore, based on the changes in fluid resistance and flow velocity within the initial simplified model, the thickness of each heat sink is adjusted to the target thickness, resulting in a target simplified model. This target simplified model, after adjustments to the initial simplified model, achieves an equivalent simplification effect, thus enabling approximately global modeling of the multiple groups of plate radiators.

[0069] like Figure 7 As shown, Figure 7 This is a flowchart illustrating a transformer thermal-fluid coupling field simulation method in one embodiment. The steps provided by the transformer thermal-fluid coupling field simulation method in this embodiment include:

[0070] S701, obtain the constructed simplified piecewise model and the initial piecewise model.

[0071] Firstly, the model can be built using simulation software such as CFD. And among them, such as... Figure 8 As shown in (b), the constructed slab-type simplified model is a model of a set of slab-type heat sinks in the target simplified model. This target simplified model is obtained by simplifying the heat sink model using the equivalent simplification method described above. Figure 8 As shown in (a), the constructed plate-type initial model is a model of a set of plate-type heat sinks in the initial heat sink model. This plate-type initial model has not been simplified.

[0072] S702, obtain the basic parameters set, perform thermal-fluid coupling field simulation on the simplified sheet model based on the basic parameters to obtain the first simulation result, and perform thermal-fluid coupling field simulation on the initial sheet model based on the basic parameters to obtain the second simulation result.

[0073] The basic parameters include the relationship curves of density, viscosity, thermal conductivity, and specific heat capacity as a function of temperature, mesh size, inlet velocity and temperature of the oil flow, outlet boundary conditions, and wall boundary conditions. These basic parameters are input into the CFD simulation software, and simulations are performed on both the simplified plate model and the initial plate model to obtain the first simulation result for the simplified plate model and the second simulation result for the initial plate model. Specifically, each simulation result includes the simulated temperature difference of the oil flow at the inlet and outlet of the plate radiator and the simulated heat dissipation of the plate radiator.

[0074] Furthermore, the effectiveness of model equivalence simplification is tested by constructing a suitable evaluation system, including:

[0075] When the error ratio between the simulated temperature difference in the first simulation result and the simulated temperature difference in the second simulation result is less than the preset first ratio threshold, and the error ratio between the simulated heat dissipation in the first simulation result and the simulated heat dissipation in the second simulation result is less than the preset second ratio threshold, it is considered that the overall temperature distribution of the heat sink before and after simplification is similar, the simplified model is equivalent and reasonable, and the target simplified model is saved.

[0076] In one simulation example, the first scaling threshold was preset to 2%, and the second scaling threshold to 4%. The simulated temperature difference between the fluid (transformer oil) outlet and inlet before and after simplification was 29.1K and 29.5K, respectively, with an error of 1.37%, which is less than the preset first scaling threshold of 2%. Simultaneously, the simulated heat dissipation of a single heat sink before and after simplification was 11567W and 11203W, respectively, with an error of 3.15%, which is less than the preset first scaling threshold of 4%. Therefore, the overall temperature distribution of the heat sink is similar before and after simplification, and the simplified model is equivalent and reasonable; the target simplified model is saved. It is understood that the first and second scaling thresholds can be adjusted according to actual conditions, and no specific limitations are imposed here.

[0077] Figure 9 An internal structural diagram of a simplified equivalent device based on a heat sink model in one embodiment is shown. Figure 9 As shown, the simplification device for the radiator model includes a processor, memory, and a network interface connected via a system bus. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system and may also store a computer program. When executed by the processor, this computer program enables the processor to implement the simplification method for the radiator model. The internal memory may also store a computer program, which, when executed by the processor, enables the processor to execute the simplification method for the radiator model. Those skilled in the art will understand that… Figure 9 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the equivalent simplified device of the radiator model to which the present application is applied. The specific equivalent simplified device of the radiator model may include more or fewer components than shown in the figure, or combine certain components, or have different component arrangements.

[0078] A device for simplifying a radiator model includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it performs the following steps: within an initial radiator model, simplifies the number of heat sinks in each group of plate radiators and simplifies the structural shape of each heat sink to obtain an initial simplified model; based on the changes in the heat dissipation surface area within the initial simplified model, adjusts the heat dissipation coefficient of multiple groups of plate radiators to a target heat dissipation coefficient, and based on the changes in fluid resistance and flow velocity within the initial simplified model, adjusts the thickness of each heat sink to a target thickness to obtain a target simplified model.

[0079] The following steps are performed: obtaining the constructed simplified plate model and the initial plate model; wherein, the simplified plate model is a set of plate heat sink models in the target simplified model, the target simplified model is simplified by the above heat sink model equivalent simplification method, and the initial plate model is a set of plate heat sink models in the initial heat sink model; obtaining the set basic parameters, performing thermal-fluid coupling field simulation on the simplified plate model based on the basic parameters to obtain the first simulation result, and performing thermal-fluid coupling field simulation on the initial plate model based on the basic parameters to obtain the second simulation result.

[0080] A computer-readable storage medium storing a computer program, which, when executed by a processor, performs the following steps: within an initial heat sink model, simplifies the number of heat sinks in each group of plate heat sinks and simplifies the structural form of each heat sink to obtain an initial simplified model; based on the changes in the heat dissipation surface area within the initial simplified model, adjusts the heat dissipation coefficient of multiple groups of plate heat sinks to a target heat dissipation coefficient, and based on the changes in fluid resistance and flow velocity within the initial simplified model, adjusts the thickness of each heat sink to a target thickness to obtain a target simplified model.

[0081] The following steps are performed: obtaining the constructed simplified plate model and the initial plate model; wherein, the simplified plate model is a set of plate heat sink models in the target simplified model, the target simplified model is simplified by the above heat sink model equivalent simplification method, and the initial plate model is a set of plate heat sink models in the initial heat sink model; obtaining the set basic parameters, performing thermal-fluid coupling field simulation on the simplified plate model based on the basic parameters to obtain the first simulation result, and performing thermal-fluid coupling field simulation on the initial plate model based on the basic parameters to obtain the second simulation result.

[0082] It should be noted that the above-mentioned simplification method, simulation method, device and medium for radiator model equivalents belong to a general inventive concept, and the contents of the simplification method, simulation method, device and medium embodiments for radiator model equivalents can be applied to each other.

[0083] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0084] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for equivalent simplification of a radiator model, characterized in that, Applied to an initial heat sink model comprising multiple sets of plate-type heat sinks, each set of plate-type heat sinks including multiple heat sink fins, the method includes: Within the initial radiator model, the number of heat sinks in each group of plate radiators is simplified, and the structural form of each heat sink is simplified to obtain the initial simplified model; Based on the changes in the heat dissipation surface area within the initial simplified model, the heat dissipation coefficients of the multiple sets of plate heat sinks are adjusted to the target heat dissipation coefficients. Based on the changes in fluid resistance and flow velocity within the initial simplified model, the thickness of each heat sink is adjusted to the target thickness to obtain the target simplified model. The simplification of the number and structural form of the heat sinks causes changes in the heat dissipation surface area, as well as changes in fluid resistance and flow velocity. The step of adjusting the heat dissipation coefficient of the multiple sets of plate-type heat sinks to the target heat dissipation coefficient based on the change in heat dissipation surface area within the initial simplified model includes: Obtain the first total heat dissipation surface area of ​​each group of plate heat sinks before simplification of the number and structure, and the second total heat dissipation surface area after simplification of the number and structure. The area change factor is calculated based on the first total heat dissipation surface area and the second total heat dissipation surface area, and the product of the area change factor and the preset initial heat transfer coefficient is used as the target heat dissipation coefficient. The heat dissipation coefficient of the multiple sets of plate heat sinks is adjusted from the initial heat transfer coefficient to the target heat dissipation coefficient; The step of adjusting the thickness of each heat sink to the target thickness based on the fluid resistance and velocity changes within the initial simplified model includes: Before simplifying the quantity and structural form, obtain the cross-sectional area of ​​the fluid passing through each heat sink and the first number of heat sinks in each group of plate heat sinks; After simplifying the quantity and structural form, obtain the second number of heat sinks in each group of plate heat sinks, calculate the target thickness of each heat sink based on the cross-sectional area, the first number, the second number and the width of each heat sink, and adjust the thickness of each heat sink to the target thickness. The formula for calculating the target thickness is as follows: Target thickness = cross-sectional area × first quantity / second quantity / width of heat sink.

2. The method according to claim 1, characterized in that, The simplification of the number of heat sinks in each group of plate heat sinks includes: The number of heat sinks in each group of heat sinks is gradually reduced until the current computing power consumption is less than the preset computing power threshold; where the number of heat sinks is positively correlated with computing power consumption.

3. The method according to claim 1, characterized in that, The simplification of the structural form of each heat sink includes: Remove the partition structure of each heatsink and the chamfer features at the inner corners.

4. A method for simulating the thermal-fluid coupled field of a transformer, characterized in that, The method includes: Obtain the constructed slab-type simplified model and slab-type initial model; wherein, the slab-type simplified model is a model of a set of slab-type heat sinks in the target simplified model, the target simplified model is simplified by the method described in any one of claims 1-3, and the slab-type initial model is a model of a set of slab-type heat sinks in the initial heat sink model; The basic parameters are obtained, and a thermal-fluid coupled field simulation is performed on the simplified plate model based on the basic parameters to obtain a first simulation result. A thermal-fluid coupled field simulation is then performed on the initial plate model based on the basic parameters to obtain a second simulation result. The basic parameters include the relationship curves of density, viscosity, thermal conductivity, and specific heat capacity with temperature, mesh size, inlet velocity and temperature of the oil flow, outlet boundary conditions, and wall boundary conditions. The simulation results include the simulated temperature difference of the oil flow at the inlet and outlet of the plate radiator and the simulated heat dissipation of the plate radiator.

5. The method according to claim 4, characterized in that, The method further includes: When the error ratio between the simulated temperature difference in the first simulation result and the simulated temperature difference in the second simulation result is less than a preset first ratio threshold, and the error ratio between the simulated heat dissipation in the first simulation result and the simulated heat dissipation in the second simulation result is less than a preset second ratio threshold, the target simplified model is saved.

6. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, the processor performs the steps of the method as described in any one of claims 1 to 5.

7. A simplified device equivalent to a heat sink model, comprising a memory and a processor, characterized in that, The memory stores a computer program that, when executed by the processor, causes the processor to perform the steps of the method as described in any one of claims 1 to 5.

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