Texture recognition module and display device

Abstract

The texture recognition module and display device provided by the present disclosure include a texture recognition substrate, the texture recognition substrate includes a substrate, and a plurality of photosensitive devices arranged in an array on one side of the substrate; a light confinement layer, which is directly in contact with the side of the texture recognition substrate having a plurality of photosensitive devices, the light confinement layer includes at least one diaphragm layer and a microlens layer located on the side of the diaphragm layer away from the texture recognition substrate; wherein, the diaphragm layer has light-transmitting holes arranged in an array, and the orthographic projection of the light-transmitting holes on the substrate is located within the orthographic projection of the photosensitive devices on the substrate; the microlens layer includes a plurality of microlenses arranged at intervals, and the orthographic projection of the microlenses on the substrate covers and is larger than the orthographic projection of the light-transmitting holes on the substrate.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and particularly to a texture recognition module and a display device. Background Art

[0002] With the rapid development of the information industry, biometric technologies have been increasingly widely applied. In particular, since the fingerprints of different users are different and it is convenient to confirm the user identity, fingerprint recognition technology has been widely used in multiple fields such as mobile terminals and smart homes to provide security protection for user information.

[0003] Optical fingerprint recognition is one of the means to achieve fingerprint recognition. The principle of optical fingerprint recognition is as follows: When a finger is placed above a display product, the emitted light of the light source included in the display product irradiates the valley and ridge positions of the finger, and after being reflected by the valley and ridge of the finger, it is incident on the photosensitive device included in the display product again. Since the light intensities reflected by the valley and ridge positions are different, the photosensitive device generates different electrical signals according to the difference in the above-mentioned reflected light intensities to achieve fingerprint recognition. Summary of the Invention

[0004] The texture recognition module and the display device provided by the embodiments of the present disclosure are specifically as follows:

[0005] On the one hand, the embodiments of the present disclosure provide a texture recognition module, including:

[0006] A texture recognition substrate, the texture recognition substrate includes a substrate, and a plurality of photosensitive devices arranged in an array on one side of the substrate;

[0007] A light confinement layer, which is directly in contact with the side of the texture recognition substrate having the plurality of photosensitive devices. The light confinement layer includes at least one diaphragm layer and a microlens layer located on the side of the diaphragm layer away from the texture recognition substrate; wherein, the diaphragm layer has light-transmitting holes arranged in an array, and the orthographic projection of the light-transmitting holes on the substrate is located within the orthographic projection of the photosensitive devices on the substrate; the microlens layer includes a plurality of microlenses arranged separately, and the orthographic projection of the microlenses on the substrate covers and is larger than the orthographic projection of the light-transmitting holes on the substrate.

[0008] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, the light confinement layer includes at least two diaphragm layers, and the light-transmitting holes in each diaphragm layer correspond to each other and at least partially overlap in the orthographic projection on the substrate.

[0009] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, in a direction away from the texture recognition substrate, the aperture layer includes a first aperture layer, a second aperture layer, and a third aperture layer arranged in sequence; wherein,

[0010] The first aperture layer includes first light-transmitting holes arranged in an array, the second aperture layer includes second light-transmitting holes arranged in an array, and the third aperture layer includes third light-transmitting holes arranged in an array;

[0011] The orthographic projection of the second light-transmitting hole on the substrate substrate covers and is larger than the orthographic projection of the first light-transmitting hole on the substrate substrate, and the orthographic projection of the second light-transmitting hole on the substrate substrate is located within the orthographic projection of the third light-transmitting hole on the substrate substrate.

[0012] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, there is a first distance between the orthographic projection of the center of the first light-transmitting hole on the substrate substrate and the orthographic projection of the center of the corresponding second light-transmitting hole on the substrate substrate;

[0013] There is a second distance between the orthographic projection of the center of the first light-transmitting hole on the substrate substrate and the orthographic projection of the center of the corresponding third light-transmitting hole on the substrate substrate;

[0014] The ratios of the first distance, the second distance to the aperture diameter of the first light-transmitting hole are all greater than or equal to 0 and less than or equal to 20%.

[0015] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the aperture diameter D2 of the second light-transmitting hole satisfies the following relational expression:

[0016] D2 = k * D1, D2 < D3;

[0017] wherein, 1 < k < 2, D1 is the aperture diameter of the first light-transmitting hole, and D3 is the aperture diameter of the third light-transmitting hole.

[0018] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the microlenses are arranged in one-to-one correspondence with the light-transmitting holes, and the microlenses include a convex surface and a flat surface, wherein the convex surface is located on a side of the flat surface away from the light-transmitting hole.

[0019] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the light confinement layer further includes a support layer alternately arranged with the aperture layer;

[0020] The aperture diameter D1 of the first light-transmitting hole satisfies the following relational expression:

[0021] D1 = [D 2 / (2hs ) + h s * [n x / (n - 1)] * tanθ;

[0022] Where D is the aperture of the microlens, h s is the height of the microlens, n is the refractive index of the microlens, n x is the refractive index of the support layer, and θ is the light-receiving angle.

[0023] In some embodiments, in the above-described pattern recognition module provided by the embodiments of the present disclosure, the support layer includes a first support layer, a second support layer, and a third support layer; wherein,

[0024] The first support layer is located between the first diaphragm layer and the second diaphragm layer, the second support layer is located between the second diaphragm layer and the third diaphragm layer, and the third support layer is located on the side of the third diaphragm layer away from the second diaphragm layer.

[0025] In some embodiments, in the above-described pattern recognition module provided by the embodiments of the present disclosure, the light confinement layer further includes a green resin layer, and the green resin layer is located between the first diaphragm layer and the first support layer.

[0026] In some embodiments, in the above-described pattern recognition module provided by the embodiments of the present disclosure, the green resin layer fills the first light-transmitting hole, the second support layer fills the second light-transmitting hole, and the third support layer fills the third light-transmitting hole. In some embodiments, in the above-described pattern recognition module provided by the embodiments of the present disclosure, the aperture D3 of the third light-transmitting hole satisfies the following relational expression:

[0027] D3 = D * (H - H3) / H;

[0028] Where H is the distance between the surface of the microlens layer facing the pattern recognition substrate side and the surface of the first diaphragm layer away from the pattern recognition substrate side, and H3 is the thickness of the third support layer.

[0029] In some embodiments, in the above-described pattern recognition module provided by the embodiments of the present disclosure, the thickness of the second diaphragm layer is substantially the same as the thickness of the third diaphragm layer;

[0030] The distance H between the surface of the microlens layer facing the pattern recognition substrate side and the surface of the first diaphragm layer away from the pattern recognition substrate side satisfies the following relational expression:

[0031] H = {[D 2 / (4h s )] * [n x / (n - 1)]} - {(3n - 2) * nx *h s / [2(n 2 -n)]};

[0032] H = H1 + H2 + H3 + H4 + 2h;

[0033] Wherein, H1 is the thickness of the first support layer, H2 is the thickness of the second support layer, H4 is the thickness of the green resin layer, and h is the thickness of the second aperture layer and the thickness of the third aperture layer.

[0034] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the thickness H1 of the first support layer satisfies the following relational expression:

[0035] H1 = D2*(H - H3) / D3 - H4.

[0036] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, 1.4 ≤ n x ≤ 1.7, 1.5 ≤ n ≤ 2.0, 1° ≤ θ ≤ 10°, 2μm ≤ D ≤ 50μm, 1μm ≤ D1 ≤ 10μm, 1μm < D2 < 40μm, 2μm ≤ D3 ≤ 50μm, 1μm ≤ hs ≤ 20μm, 1μm ≤ H1 ≤ 20μm, 1μm ≤ H2 ≤ 20μm, 1μm ≤ H3 ≤ 20μm, 0.5μm ≤ H4 ≤ 3μm, 0.5μm ≤ h ≤ 1.5μm, 4.5μm ≤ H ≤ 100μm.

[0037] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the material of the support layer includes transparent resin and / or green resin.

[0038] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the material of the first aperture layer includes metal, and the materials of the second aperture layer and the third aperture layer both include black resin.

[0039] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the distance between adjacent micro-lenses is greater than 0μm and less than or equal to 2μm.

[0040] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the orthographic projection shape of the micro-lens on the substrate is a rounded square, a circle, a right-angled square, or a hexagon.

[0041] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the texture recognition substrate further includes a plurality of pixel driving circuits, and the layer where the plurality of pixel driving circuits are located is between the layer where the plurality of photosensitive devices are located and the substrate. The pixel driving circuits are electrically connected to the photosensitive devices in a one-to-one correspondence.

[0042] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, each of the photosensitive devices includes at least one sub-photosensitive device, and the sub-photosensitive device includes a first electrode, a photoelectric conversion layer, and a second electrode which are stacked;

[0043] In the same photosensitive device including a plurality of the sub-photosensitive devices, each of the first electrodes is electrically connected to the corresponding pixel driving circuit, each of the second electrodes is independently arranged, and each of the photoelectric conversion layers is independently arranged.

[0044] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the texture recognition substrate further includes a plurality of connection electrodes, and the connection electrodes are arranged on the same layer as the first electrodes;

[0045] Each of the first electrodes of the same photosensitive device is electrically connected to the corresponding pixel driving circuit through the connection electrode.

[0046] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, each of the photosensitive devices includes four of the sub-photosensitive devices, and in the same photosensitive device, the four sub-photosensitive devices are arranged in two rows and two columns.

[0047] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the plurality of connection electrodes include a plurality of first connection electrodes, and the four first electrodes in one photosensitive device are electrically connected to the corresponding pixel circuit through the same first connection electrode, and the orthographic projection of the first connection electrode on the substrate overlaps with the orthographic projections of the four electrically connected first electrodes on the substrate.

[0048] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the plurality of connection electrodes further include a plurality of second connection electrodes, and each second connection electrode is electrically connected to two adjacent first electrodes in one photosensitive device, and the orthographic projection of the second connection electrode on the substrate overlaps with the orthographic projections of the two adjacent electrically connected first electrodes on the substrate.

[0049] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, one photoelectric conversion layer corresponds to at least one microlens.

[0050] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the photoelectric conversion layers correspond to the microlenses one by one, and the orthographic projection of the photoelectric conversion layer on the substrate is located within the orthographic projection of the corresponding microlens on the substrate.

[0051] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the microlenses and the light-transmitting holes are provided in one-to-one correspondence;

[0052] The orthographic projection of the light-transmitting hole on the substrate is located in the central region of the orthographic projection of the corresponding photoelectric conversion layer on the substrate, and the orthographic projection of the center of the photoelectric conversion layer on the substrate substantially coincides with the orthographic projection of the center of the light-transmitting hole on the substrate.

[0053] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the texture recognition substrate further includes a planarization layer, an insulating layer, and a transparent bias layer, wherein the planarization layer, the insulating layer, and the transparent bias layer are sequentially located on the side of the layer where the plurality of photosensitive devices are located away from the substrate.

[0054] The planarization layer includes a plurality of first vias, the first vias are provided in one-to-one correspondence with the second electrodes, and the orthographic projection of the first vias on the substrate is located within the orthographic projection of the corresponding second electrodes on the substrate; the insulating layer includes a plurality of second vias, the second vias are connected to the first vias in one-to-one correspondence, and the orthographic projection of the second vias on the substrate is located within the orthographic projection of the corresponding first vias on the substrate;

[0055] The second electrodes are electrically connected to the transparent bias layer through the communicatively arranged first vias and second vias.

[0056] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the orthographic projection of the first vias on the photoelectric conversion layer and the orthographic projection of the second vias on the photoelectric conversion layer are both located in the central region of the photoelectric conversion layer;

[0057] The orthographic projection of the center of the first vias on the photoelectric conversion layer and the orthographic projection of the center of the second vias on the photoelectric conversion layer both substantially coincide with the center of the photoelectric conversion layer.

[0058] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, the texture recognition substrate includes a texture recognition area and a noise reduction area located on at least one side of the texture recognition area;

[0059] The plurality of photosensitive devices, the light-transmitting holes, the first via holes and the second via holes are located in the texture recognition area, and the plurality of microlenses are located in the texture recognition area and the noise reduction area;

[0060] The texture recognition substrate further includes a capacitor located in the noise reduction area. The capacitor includes a first electrode plate and a second electrode plate which are oppositely arranged; wherein, the first electrode plate is of the same layer and the same material as the first electrode, and the second electrode plate is of the same layer and the same material as the second electrode;

[0061] The planarization layer further includes a third via hole located in the noise reduction area. A positive projection of the third via hole on the substrate is located within a positive projection of the first electrode plate on the substrate; the third via hole is filled with the insulating layer so that the first electrode plate and the second electrode plate are insulated from each other; the sum of the area of one third via hole and the area of the first via hole in the area where one photosensitive device is located is substantially the same.

[0062] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, the texture recognition substrate further includes a barrier layer and an electromagnetic shielding layer, wherein the barrier layer is located between the transparent bias layer and the light confinement layer, and the electromagnetic shielding layer is located between the barrier layer and the light confinement layer.

[0063] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, the pixel driving circuit includes: a reset transistor, an amplifying transistor and a reading transistor, wherein at least one of the reset transistor, the amplifying transistor and the reading transistor is a double-gate transistor.

[0064] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, the pixel driving circuit further includes a noise reduction transistor, and the noise reduction transistor is a single-gate transistor or a double-gate transistor.

[0065] On the other hand, the embodiments of the present disclosure provide a display device, including: a display module, a fingerprint recognition module and an adhesive layer; wherein, the fingerprint recognition module is the above-mentioned fingerprint recognition module provided by the embodiments of the present disclosure, and the fingerprint recognition module is located on the opposite side of the display side of the display module; the adhesive layer is located between the display module and the fingerprint recognition module, and a positive projection of the adhesive layer on the display module is located in the border area of the display module. Description of the Drawings

[0066] Figure 1 It is a schematic structural diagram of a texture recognition module provided by the embodiments of the present disclosure;

[0067] Figure 2Another structural schematic diagram of the texture recognition module provided by the embodiments of the present disclosure;

[0068] Figure 3 Another structural schematic diagram of the texture recognition module provided by the embodiments of the present disclosure;

[0069] Figure 4 Another structural schematic diagram of the texture recognition module provided by the embodiments of the present disclosure;

[0070] Figure 5 is along Figure 1 , Figure 2 Figure 3 or Figure 4 the sectional view along line I-II in

[0071] Figure 6 A matching schematic diagram of the light confinement layer and the photosensitive device provided by the embodiments of the present disclosure;

[0072] Figure 7 Another matching schematic diagram of the light confinement layer and the photosensitive device provided by the embodiments of the present disclosure;

[0073] Figure 8 Another matching schematic diagram of the light confinement layer and the photosensitive device provided by the embodiments of the present disclosure;

[0074] Figure 9 Another matching schematic diagram of the light confinement layer and the photosensitive device provided by the embodiments of the present disclosure;

[0075] Figure 10 is along Figure 6 , Figure 7 , Figure 8 or Figure 9 the sectional view along line III-IV in

[0076] Figure 11 The light acceptance angle curve of the texture recognition module provided by the embodiments of the present disclosure and the light acceptance angle curve of the texture recognition module in the related art;

[0077] Figure 12 The design layout of the area where a photosensitive device is located in the texture recognition area of the texture recognition module provided by the embodiments of the present disclosure;

[0078] Figure 13 is Figure 12 the structural schematic diagram of the layer where the first electrode is located in

[0079] Figure 14 is Figure 12 the structural schematic diagram of the layer where the photoelectric conversion layer and the second electrode are located in

[0080] Figure 15 is Figure 12Schematic diagram of the structure of the first flat layer and the first insulating layer;

[0081] Figure 16 is Figure 12 Schematic diagram of the structure of the transparent bias layer or the electromagnetic shielding layer in;

[0082] Figure 17 Schematic diagram of the structure of the area where a capacitor is located in the noise reduction area in the texture recognition module provided by the present disclosure;

[0083] Figure 18 is along Figure 17 Cross-sectional view of line V-VI in;

[0084] Figure 19 is Figure 12 Schematic diagram of the structure of the gate metal layer in;

[0085] Figure 20 is Figure 12 Schematic diagram of the structure of the active layer in;

[0086] Figure 21 is Figure 12 Schematic diagram of the structure of the gate insulating layer and the interlayer dielectric layer in;

[0087] Figure 22 is Figure 12 Schematic diagram of the structure of the source-drain metal layer in;

[0088] Figure 23 is Figure 12 Schematic diagram of the structure of the second flat layer and the second insulating layer in;

[0089] Figure 24 Another schematic diagram of the structure of the gate metal layer provided by the present disclosure;

[0090] Figure 25 is Figure 12 Schematic diagram of the structure of the pixel driving circuit included;

[0091] Figure 26 Signal-to-noise ratio comparison diagram of the amplification transistor under single-gate and double-gate provided by the present disclosure;

[0092] Figure 27 Another schematic diagram of the structure of the pixel driving circuit provided by the present disclosure;

[0093] Figure 28 is Figure 27 Design layout of the pixel driving circuit shown;

[0094] Figure 29 Schematic diagram of the structure of the display device provided by the present disclosure. Detailed implementation manners

[0095] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the following will clearly and completely describe the technical solutions of the embodiments of the present disclosure with reference to the accompanying drawings of the embodiments of the present disclosure. It should be noted that the sizes and shapes of the figures in the drawings do not reflect the true proportions, and the purpose is only to schematically illustrate the content of the present disclosure. Also, the same or similar reference numerals throughout indicate the same or similar elements or elements with the same or similar functions.

[0096] Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art to which the present disclosure pertains. The terms "first", "second", and similar terms used in the specification and claims of the present disclosure do not indicate any order, quantity, or importance, but are only used to distinguish different components. The terms such as "including" or "comprising" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. The terms such as "inside", "outside", "above", "below", etc. are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0097] In the related art, by multiplexing some of the film layers in the texture recognition substrate as the aperture layer of the collimating film and forming microlenses on the collimating film, three pain points of the bonding solution of the collimating structure (including the collimating film and the microlenses), namely, large-angle crosstalk, film material moiré / moiré pattern, and poor reliability (NG), can be effectively reduced, thereby improving the accuracy of the fingerprint information recognized during optical fingerprint recognition. However, since some of the film layers in the texture recognition substrate need to be multiplexed with the aperture layer, the manufacturing process of the film layers multiplexed as the aperture layer in the texture recognition substrate in the related art needs to be changed, thus increasing the manufacturing difficulty and being not conducive to mass production.

[0098] To at least solve the above technical problems existing in the related art, the embodiments of the present disclosure provide a texture recognition module for recognizing textures such as fingerprints and palm prints. In the present disclosure, the example of recognizing fingerprints is used for illustration. Specifically, as Figures 1 to 5 shown, the texture recognition module provided by the embodiments of the present disclosure includes:

[0099] A texture recognition substrate 100, the texture recognition substrate 100 includes a substrate 101, and a plurality of photosensitive devices 102 arranged in an array on one side of the substrate 101; optionally, the substrate 101 may be a flexible substrate, such as a polyimide (PI) substrate; or, the substrate 101 may also be a rigid substrate, such as a glass substrate.

[0100] The light confinement layer 200 is directly disposed in contact with the side of the texture recognition substrate 100 having a plurality of photosensitive devices 102. The light confinement layer 200 includes at least one aperture layer 201 (for example, including a first aperture layer 211, a second aperture layer 211, and a third aperture layer 213), and a microlens layer (including microlenses 202) located on the side of the aperture layer 201 away from the texture recognition substrate 100. Wherein, the aperture layer 201 can be made of a light-absorbing or low-reflectivity material such as a black matrix (BM) material, molybdenum oxide, aluminum oxide, or chromium metal. The aperture layer 201 has light-transmitting holes arranged in an array (for example, including a first light-transmitting hole a, a second light-transmitting hole b, and a third light-transmitting hole c). The orthographic projection of the light-transmitting holes on the substrate 101 is located within the orthographic projection of the photosensitive devices 102 on the substrate 101. The microlens layer includes a plurality of microlenses 202 spaced apart from each other. The orthographic projection of the microlenses 202 on the substrate 101 covers and is larger than the orthographic projection of the light-transmitting holes on the substrate 101.

[0101] In the above-mentioned texture recognition module provided by the embodiments of the present disclosure, by directly integrating the light confinement layer 200 on the surface of the texture recognition substrate 100, it is not necessary to change the related manufacturing process of the texture recognition substrate 100, which is beneficial to mass production. Moreover, since the light confinement layer 200 is directly in contact with the side of the texture recognition substrate 100 having a plurality of photosensitive devices 102 instead of being attached to the surface of the texture recognition substrate 100, it is possible to effectively improve the problems such as large-angle crosstalk, film texture / Moiré pattern, and poor reliability in the related art of the attachment collimation structure scheme. Therefore, the accuracy of the recognized fingerprint information can be improved during the optical fingerprint recognition process.

[0102] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figure 5 shown, the light confinement layer 200 may include at least two aperture layers 201. The light-transmitting holes in each aperture layer 201 correspond to each other one by one and at least partially overlap in the orthographic projection on the substrate 100, so as to achieve the collimation effect of light through the mutual cooperation of each aperture layer 201.

[0103] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figure 5As shown, in the direction Y away from the texture recognition substrate 100, the aperture layer 201 may include a first aperture layer 211, a second aperture layer 212, and a third aperture layer 213 arranged in sequence; wherein, the first aperture layer 211 includes first light-transmitting holes a arranged in an array, the second aperture layer 212 includes second light-transmitting holes b arranged in an array, and the third aperture layer 213 includes third light-transmitting holes c arranged in an array; the orthographic projection of the second light-transmitting hole b on the substrate 101 covers and is larger than the orthographic projection of the first light-transmitting hole a on the substrate 101, and the orthographic projection of the second light-transmitting hole b on the substrate 101 is located within the orthographic projection of the third light-transmitting hole c on the substrate 101.

[0104] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figures 6 to 10 shown, there is a first distance between the orthographic projection of the center O1 of the first light-transmitting hole a on the substrate 101 and the orthographic projection of the center O2 of the corresponding second light-transmitting hole b on the substrate (that is, the distance by which O1 and O2 are offset in the Figure 10 X direction); there is a second distance between the orthographic projection of the center O1 of the first light-transmitting hole a on the substrate 101 and the orthographic projection of the center O3 of the corresponding third light-transmitting hole c on the substrate 101 (that is, the distance by which O1 and O3 are offset in the Figure 10 X direction); the ratios of the first distance and the second distance to the aperture diameter D1 of the first light-transmitting hole a are both greater than or equal to 0 and less than or equal to 20%. Specifically, Figures 6 to 10 shows that the center O1 of the first light-transmitting hole a, the center O2 of the second light-transmitting hole b, and the center O3 of the third light-transmitting hole c are located on the same straight line (see the dotted line shown in Figure 10 ), which is equivalent to both the first distance and the second distance being 0.

[0105] It should be understood that, ideally, the center O1 of the first light-transmitting hole a, the center O2 of the second light-transmitting hole b, and the center O3 of the third light-transmitting hole c are located on the same straight line, and the collimation effect is the best. However, during the actual manufacturing process, due to factors such as alignment, there may be some deviation in the centers of the three. Within the above deviation range of 0 to 20%, the mutually overlapping first light-transmitting holes a, second light-transmitting holes b, and third light-transmitting holes c can still have an excellent collimation effect.

[0106] The abscissa represents the light collection angle of the light confinement layer 200, and the ordinate represents the transmittance (T) of the light-transmitting holes contained in the light confinement layer 200. The curve in this coordinate system is called the light collection angle curve. Among them, the full width at half maxima (FWHM) of the light collection angle curve is a core index characterizing the light confinement layer 200. Generally, to meet the requirements of fingerprint recognition, the FWHM is required to be within 7°. And the area enclosed by the light collection angle curve and the abscissa is the amount of fingerprint signals received by the photosensitive device 102. The higher the amount of fingerprint signals, the greater the recognition accuracy. Therefore, generally, when the FWHM is fixed, the higher the central transmittance of the light-transmitting holes (equivalent to the peak value of the light collection angle curve), the better.

[0107] Based on this, in the above-mentioned pattern recognition module provided by the embodiments of the present disclosure, as Figures 6 to 10 shown, the aperture D2 of the second light-transmitting hole b satisfies the following relational expression:

[0108] D2 = k * D1 (1);

[0109] D2 < D3 (2);

[0110] where 1 < k < 2, D1 is the aperture of the first light-transmitting hole a, and D3 is the aperture of the third light-transmitting hole c.

[0111] From Figure 10 it can be seen that the third light-transmitting hole c can transmit all the light within the range of L1 to L2, and there is an aperture for the second light-transmitting hole b and the first light-transmitting hole a that can exactly transmit all the light within the range of L1 to L2. Under the condition that the apertures of the first light-transmitting hole a, the second light-transmitting hole b, and the third light-transmitting hole c satisfy the above relational expressions (1) and (2), that is, all the light within the range of L1 to L2 transmitted through the third light-transmitting hole c can be irradiated onto the photosensitive device 102 through the second light-transmitting hole b and the first light-transmitting hole a in sequence, thereby maximizing the central transmittance of the light-transmitting holes, further increasing the amount of fingerprint signals received by the photosensitive device 102, and enhancing the accuracy of fingerprint recognition. In addition, as Figure 10 shown, under the condition that the apertures of the first light-transmitting hole a, the second light-transmitting hole b, and the third light-transmitting hole c satisfy the above relational expressions (1) and (2), it is also possible to effectively prevent crosstalk caused by stray light L3 and L4.

[0112] It should be noted that theoretically, the hole wall of the light-transmitting hole is perpendicular to the substrate 101. At this time, the aperture uniformity of the light-transmitting hole is better. However, due to the influence of the manufacturing process, the hole wall of the light-transmitting hole may not be perpendicular to the substrate 101, but forms a certain slope relative to the substrate 101 (as Figure 10 shown). At this time, the aperture of the light-transmitting hole gradually increases in the direction Y away from the substrate 101. In the present disclosure, the aperture of the light-transmitting hole can refer to the maximum value of the aperture.

[0113] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figure 10 shown, the microlenses 202 are arranged in one-to-one correspondence with the light-transmitting holes (including the first light-transmitting hole a, the second light-transmitting hole b, and the third light-transmitting hole c arranged in an overlapping manner). The microlenses 202 include a convex surface S1 and a flat surface S2. Among them, the convex surface S1 is located on the side of the flat surface S2 away from the light-transmitting hole, so that the microlenses 202 can effectively converge the reflected light of the fingerprint to the position corresponding to the light-transmitting hole.

[0114] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figure 10 shown, the light confinement layer 200 may further include a support layer 203 arranged alternately with the diaphragm layer 201; in order to enable all the light within the range of L1 to L2 passing through the third light-transmitting hole c to irradiate the photosensitive device 102 through the second light-transmitting hole b and the first light-transmitting hole a in sequence, the aperture D1 of the first light-transmitting hole a may satisfy the following relational expression:

[0115] D1 = [D 2 / (2h s ) + h s *[n x / (n - 1)]*tanθ (3);

[0116] wherein, D is the aperture of the microlens 202, h s is the height of the microlens 202, n is the refractive index of the microlens 202, n x is the refractive index of the support layer 203, and θ is the light collection angle.

[0117] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figure 10 shown, the support layer 203 may include a first support layer 231, a second support layer 232, and a third support layer 233; among them, the first support layer 231 is located between the first diaphragm layer 211 and the second diaphragm layer 212, the second support layer 232 is located between the second diaphragm layer 212 and the third diaphragm layer 213, and the third support layer 233 is located on the side of the third diaphragm layer 213 away from the second diaphragm layer 212. Optionally, the first support layer 231 fills the first light-transmitting hole a, the second support layer 232 fills the second light-transmitting hole b, and the third support layer 233 fills the third light-transmitting hole c.

[0118] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figure 10As shown, the light confinement layer 200 may further include a green resin layer 204, and the green resin layer 204 is located between the first aperture layer 211 and the first support layer 231. Since light with a wavelength above 600 nm in ambient light can pass through the finger and irradiate onto the light confinement layer 200, and then be received by the photosensitive device 102 to interfere with the fingerprint recognition effect. The green resin layer 204 can intercept light with a wavelength above 600 nm. Therefore, by disposing the green resin layer 204 between the first aperture layer 211 and the first support layer 231, interference from ambient light can be effectively avoided, and the fingerprint recognition effect can be improved. Moreover, disposing the green resin layer 204 between the first aperture layer 211 and the first support layer 231 is conducive to maintaining the process stability of fabricating the alternately arranged first support layer 231, second aperture layer 212, second support layer 232, third aperture layer 213, third support layer 233, and microlens layer in the related art.

[0119] In some embodiments, in the above-described texture recognition substrate 100 provided by the embodiments of the present disclosure, the material of the support layer 203 (including the first support layer 231, the second support layer 232, and the third support layer 233) may include a transparent resin (OC) and / or a green resin (G-Resin). It is easy to understand that when at least one of the first support layer 231, the second support layer 232, and the third support layer 233 is made of a green resin, filtering of ambient light with a wavelength above 600 nm can be achieved. At this time, the green resin layer 204 may not be provided, and the first support layer 231 fills the first light-transmitting hole a. Of course, the green resin layer 204 may also be provided to further intercept ambient light with a wavelength above 600 nm. When the first support layer 231, the second support layer 232, and the third support layer 233 are all made of a transparent resin, in order to effectively filter ambient light with a wavelength above 600 nm, the green resin layer 204 needs to be provided.

[0120] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, as Figure 10 shown, the aperture D3 of the third light-transmitting hole c satisfies the following relational expression:

[0121] D3 = D*(H - H3) / H (4);

[0122] where H is the distance between the surface of the microlens layer facing the texture recognition substrate 100 and the surface of the first aperture layer 211 away from the texture recognition substrate 100, and H3 is the thickness of the third support layer 233.

[0123] When the aperture D3 of the third light-transmitting hole c satisfies the above relationship (4), the aperture D3 of the third light-transmitting hole c can be set according to the distance H between the surface of the microlens layer (including the microlens 202) facing the side of the texture recognition substrate 100 and the surface of the first diaphragm layer 211 away from the side of the texture recognition substrate 100, the aperture D of the microlens 202, and the thickness H1 of the third support layer 233, so that the fingerprint reflected light converged by the microlens 202 can be almost completely converged to the position of the third light-transmitting hole c, and then sequentially irradiated onto the photosensitive device 102 through the third light-transmitting hole c, the second light-transmitting hole b, and the first light-transmitting hole a, thereby increasing the central transmittance, increasing the amount of fingerprint signals received by the photosensitive device 102, and improving the fingerprint recognition accuracy.

[0124] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, the thickness of the second diaphragm layer 212 is substantially the same as the thickness of the third diaphragm layer 213, that is, the difference in their thicknesses can be zero, or within the error range caused by measurement, manufacturing process, and equipment, etc. For example, the difference in their thicknesses is less than 0.2 μm; the distance H between the surface of the microlens layer (including the microlens 202) facing the side of the texture recognition substrate 100 and the surface of the first diaphragm layer 211 away from the side of the texture recognition substrate 100 satisfies the following relationship:

[0125] H = {[D 2 / (4h s )]*[n x / (n - 1)]}-{(3n - 2)*n x *h s / [2(n 2 - n)]} (5);

[0126] H = H1 + H2 + H3 + H4 + 2h (6);

[0127] wherein, H1 is the thickness of the first support layer 231, H2 is the thickness of the second support layer 232, H4 is the thickness of the green resin layer 204, and h is the thickness of the second diaphragm layer 212 and the third diaphragm layer 213.

[0128] In specific implementation, the value of the distance H between the surface of the microlens layer (including the microlens 202) facing the side of the texture recognition substrate 100 and the surface of the first diaphragm layer 211 away from the side of the texture recognition substrate 100 can be set according to the above relationship (5), and then the thickness H4 of the green resin layer 204, the thickness H1 of the first support layer 231, the thickness H2 of the second support layer 232, the thickness H3 of the third support layer 233, the thickness h of the second diaphragm layer 212, and the thickness h of the third diaphragm layer 213 can be reasonably set based on the relationship (6) to balance the effects of improving the central transmittance and preventing crosstalk.

[0129] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figure 10 shown, the thickness H1 of the first support layer 231 satisfies the following relational expression:

[0130] H1 = D2*(H - H3) / D3 - H4 (7).

[0131] When the thickness H1 of the first support layer 231 satisfies the relational expression (7), it can be ensured that the light collection angle θ is small, which is conducive to improving the accuracy of fingerprint recognition.

[0132] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, in order to make the central transmittance relatively high and still achieve the target FWHM, the value ranges of the above parameters can be respectively: 1.4 ≤ n x ≤ 1.7, 1.5 ≤ n ≤ 2.0, 1° ≤ θ ≤ 10°, 2μm ≤ D ≤ 50μm, 1μm ≤ D1 ≤ 10μm, 1μm < D2 < 40μm, 2μm ≤ D3 ≤ 50μm, 1μm ≤ hs ≤ 20μm, 1μm ≤ H1 ≤ 20μm, 1μm ≤ H2 ≤ 20μm, 1μm ≤ H3 ≤ 20μm, 0.5μm ≤ H4 ≤ 3μm, 0.5μm ≤ h ≤ 1.5μm, 4.5μm ≤ H ≤ 100μm.

[0133] Constrained by conditions such as the existing manufacturing process and equipment of the microlens 202, there is a constant interval (lens space) between adjacent microlenses 202. For example, the distance between adjacent microlenses 202 is greater than 0μm and less than or equal to 2μm. When the microlens 202 matches texture recognition substrates 100 with different resolutions (Pixels per inch, PPI), the size (Pitch) of the photosensitive devices 102 in the texture recognition substrate 100 with a lower resolution is larger, and the size of the microlens 202 matched with the photosensitive device 102 is correspondingly larger; the size of the photosensitive devices 102 in the texture recognition substrate 100 with a higher resolution is smaller, and the size of the microlens 202 matched with the photosensitive device 102 is correspondingly smaller. And compared with the smaller-sized microlens 202, the larger-sized microlens 202 can converge more fingerprint reflected light onto the matched photosensitive device 102. As a result, the amount of fingerprint signals received by the photosensitive device 102 in the texture recognition substrate 100 with a higher resolution is less than the amount of fingerprint signals received by the photosensitive device 102 in the texture recognition substrate 100 with a lower resolution. When meeting the requirement that the FWHM is within 7°, the central transmittance of the light-transmitting holes in the texture recognition substrate 100 with a higher resolution is less than the central transmittance of the through holes in the texture recognition substrate 100 with a lower resolution.

[0134] Based on this, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figures 1 to 4 、Figures 6 to 9 As shown, the orthographic projection shape of the microlens 202 on the substrate 101 can be a rounded square or a circle. From Figures 1 to 4 , Figures 6 to 9 it can be seen that when the aperture D of the microlens 202 is the same, the areas of the right-angled square, the rounded square, the circle, and the hexagon decrease in sequence. Therefore, compared with the hexagonal and circular microlenses 202, the right-angled square and rounded square microlenses 202 can converge more fingerprint reflected light onto the photosensitive device 102 below them, thereby increasing the central transmittance. Therefore, when the resolution of the texture recognition substrate 100 is large and the central transmittance is small, the right-angled square or rounded square microlens 202 can be selected to increase the central transmittance. When the resolution of the texture recognition substrate 100 is small and the central transmittance is large, the hexagonal or circular microlens 202 can be selected, and at this time the central transmittance hardly changes; of course, the right-angled square or rounded square microlens 202 can also be selected to further increase the central transmittance. Of course, in specific implementation, the orthographic projection shape of the microlens 202 on the substrate 101 can also be flexibly set according to actual needs, and no specific limitation is made here.

[0135] In some embodiments, one microlens 202 can be correspondingly arranged with a group of light-transmitting holes with overlapping orthographic projections (such as the first light-transmitting hole a, the second light-transmitting hole b, and the third light-transmitting hole c with overlapping orthographic projections), and when the orthographic projection shape of the microlens 202 is a circle, the corresponding group of light-transmitting holes are all circular holes, as Figure 6 shown; when the orthographic projection shapes of the microlens 202 are respectively a rounded square, a right-angled square, and a hexagon, the corresponding group of light-transmitting holes can be correspondingly rounded square holes (such as Figure 7 shown), right-angled squares (such as Figure 8 shown), hexagons (such as Figure 9 shown), or can all be Figure 6 the circular holes shown, and no specific limitation is made here.

[0136] Figure 11 shows the light collection angle curve M in the case where the above parameters are adopted and the microlens 202 is a rounded square, and the light collection angle curve M' of multiplexing a part of the film layer of the texture recognition substrate 100 as the diaphragm layer 201 in the related art. From Figure 11 it can be seen that when the FWHM reaches 7° equally, the central transmittance of the present disclosure is 42%, and the central transmittance of the related art is 30%. Therefore, compared with the related art, the central transmittance of the present disclosure increases by 12%, which is beneficial to improving the fingerprint recognition accuracy.

[0137] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figure 5As shown, the texture recognition substrate 100 may further include a plurality of pixel driving circuits 103. The layer where the plurality of pixel driving circuits 103 are located is between the layer where the plurality of photosensitive devices 102 are located and the substrate 101. The pixel driving circuits 103 are electrically connected to the photosensitive devices 102 one by one to achieve independent driving of the photosensitive devices 102 by the pixel driving circuits 103.

[0138] In some embodiments, the pixel driving circuit 102 can be in a passive (PPS) mode or an active (APS) mode. Among them, the APS mode is a pixel design scheme that improves image quality and reduces noise interference. The pixel driving circuit 102 in the APS mode amplifies the electrical signals provided to the photosensitive device 104 that is vulnerable to noise, so as to minimize the influence of external readout noise sources related to external chip (IC) amplifiers, and is less affected by impedance and can be prepared in a large area.

[0139] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figures 12 to 14 shown, in order to improve the pixel filling rate, each photosensitive device 102 may include at least one sub-photosensitive device S. The sub-photosensitive device S includes a first electrode 121, a photoelectric conversion layer 122, and a second electrode 123 that are stacked. In the same photosensitive device 102 including a plurality of sub-photosensitive devices S, each first electrode 121 is electrically connected to the corresponding pixel driving circuit 103, and each second electrode 123 is independently arranged, and each photoelectric conversion layer 122 is independently arranged.

[0140] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figures 12 to 14 shown, the texture recognition substrate 100 may further include a plurality of connection electrodes 121'. The connection electrodes 121' are arranged on the same layer as the first electrode 121. Each first electrode 121 of the same photosensitive device 102 is electrically connected to the corresponding pixel driving circuit 103 through the connection electrode 121'.

[0141] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figures 12 to 14 shown, to improve the pixel filling rate, each photosensitive device 102 may include four sub-photosensitive devices S. In the same photosensitive device 102, the four sub-photosensitive devices S are arranged in two rows and two columns.

[0142] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figures 12 to 14As shown, the multiple connection electrodes 121' may include multiple first connection electrodes 1211'. Among them, the four first electrodes 121 in one photosensitive device 102 can be electrically connected to the corresponding pixel driving circuit 103 through the same first connection electrode 1211'. The orthographic projection of the first connection electrode 1211' on the substrate 101 overlaps with the orthographic projections of the four first electrodes 121 being electrically connected on the substrate 101, which is equivalent to the first connection electrode 1211' being located in the central area of the photosensitive device 102.

[0143] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, as Figures 12 to 14 shown, the multiple connection electrodes 121' may further include multiple second connection electrodes 1212'. Each second connection electrode 1212' is electrically connected to two adjacent first electrodes 121 in one photosensitive device 102. The orthographic projection of the second connection electrode 1212' on the substrate 101 overlaps with the orthographic projections of the two adjacent first electrodes 121 being electrically connected on the substrate 101, which is equivalent to the second connection electrode 1212' extending from the gap between the two adjacent first electrodes 121 to the edge area of the first electrode 121. The second connection electrode 1212' can reduce the overall resistance value of the first electrodes 121 in the same photosensitive device 102.

[0144] It should be noted that the first connection electrode 1211' in the present disclosure is located in the central area of the photosensitive device 102, so it is convenient to connect the pixel driving circuit 103 and the photosensitive device 103 through the first connection electrode 1211'. However, in some embodiments, the second connection electrode 1212' can also be used to connect the pixel driving circuit 103 and the photosensitive device 103, and no specific limitation is made here.

[0145] In some embodiments, in the above-described texture recognition substrate provided by the embodiments of the present disclosure, as Figures 6 to 9 shown, the photoelectric conversion layers 122 correspond to the microlenses 202 one by one, and the orthographic projection of the photoelectric conversion layer 122 on the substrate 101 is located within the orthographic projection of the corresponding microlens 202 on the substrate 101, so that the fingerprint reflected light converged by the microlens 202 is all absorbed by the corresponding photoelectric conversion layer 122, thereby increasing the signal amount and the signal-to-noise ratio. Of course, in specific implementation, one photoelectric conversion layer 122 can also be correspondingly arranged with at least two microlenses 202, and no specific limitation is made here.

[0146] In some embodiments, in the above-described texture recognition substrate provided by the embodiments of the present disclosure, as Figures 6 to 9As shown, the orthographic projection of the light-transmitting holes (for example, including a first light-transmitting hole a, a second light-transmitting hole b, and a third light-transmitting hole c that are orthographically projected and overlapped) on the substrate 101 is located in the central region of the orthographic projection of the corresponding photoelectric conversion layer 122 on the substrate 101 (that is, the region close to the center O of the photoelectric conversion layer 122), and the orthographic projection of the center O of the photoelectric conversion layer 122 on the substrate 101 coincides approximately with the orthographic projection of the center of the light-transmitting holes (for example, including the center O1 of the first light-transmitting hole a, the center O2 of the second light-transmitting hole b, and the center O3 of the third light-transmitting hole c) that are orthographically projected and overlapped on the substrate 101.

[0147] It should be noted that in the embodiments provided in the present disclosure, due to process conditions or other factors such as measurement, "approximately coinciding" may exactly coincide or there may be some deviations (for example, having a deviation of ±0.6 μm). Therefore, as long as the relationship of "approximately coinciding" between relevant features meets the error tolerance, it belongs to the protection scope of the present disclosure.

[0148] In some embodiments, the photoelectric conversion layer 122 provided in the embodiments of the present disclosure may include a P-type semiconductor layer, an I-type semiconductor layer (also referred to as an intrinsic semiconductor layer), and an N-type semiconductor layer that are stacked. And the photoelectric conversion layer 122 and the second electrode 123 can be formed by a single patterning process. Optionally, as Figure 14 shown, to reduce the leakage current, the orthographic projection of the second electrode 123 on the substrate 101 needs to be slightly smaller than the orthographic projection of the photoelectric conversion layer 122 on the substrate 101. For example, the distance between the boundary of the orthographic projection of the second electrode 123 on the substrate 101 and the boundary of the orthographic projection of the photoelectric conversion layer 122 on the substrate 101 can be 0.5 μm to 2 μm.

[0149] In some embodiments, in the above-mentioned texture recognition module provided in the embodiments of the present disclosure, as Figure 5 、 Figure 12 、 Figures 14 to 16As shown in the figure, the texture recognition substrate 100 may further include a first planar layer 104, a first insulating layer 105, and a transparent bias layer 106. Among them, the first planar layer 104, the first insulating layer 105, and the transparent bias layer 106 are sequentially located on the side of the layer where the plurality of photosensitive devices 102 are located away from the substrate 101. To facilitate applying a bias voltage to the second electrode 123, the first planar layer 104 may include a plurality of first vias d, and the first vias d are provided in one-to-one correspondence with the second electrodes 123. The orthographic projection of the first via d on the substrate 101 is located within the orthographic projection of the corresponding second electrode 123 on the substrate 101. The first insulating layer 105 includes a plurality of second vias e, and the second vias e are connected to the first vias d in one-to-one communication. The orthographic projection of the second via e on the substrate 101 is located within the orthographic projection of the corresponding first via d on the substrate 101. The second electrode 123 is electrically connected to the transparent bias layer 106 through the first via d and the second via e that are connected in communication. In addition, from Figure 12 and Figure 16 It can be seen that the transparent bias layer 106 has patterns at the center and four corners of the pixel region where each photosensitive device 102 is located, and is hollowed out at the four sides between the four corners. This is to minimize the coupling capacitance formed between the transparent bias layer 106 and the underlying signal lines and reduce the mutual interference between the two.

[0150] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figure 14 and Figure 15 shown, the orthographic projection of the first via d on the photoelectric conversion layer 122 and the orthographic projection of the second via e on the photoelectric conversion layer 122 are both located in the central region of the photoelectric conversion layer 122. The orthographic projection of the center O4 of the first via d on the photoelectric conversion layer 122 and the orthographic projection of the center O5 of the second via e on the photoelectric conversion layer 122 both coincide approximately with the center O of the photoelectric conversion layer 122, that is, they may exactly coincide or may be within the allowable error range.

[0151] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, as Figure 1 and Figure 2 、 Figure 15 、 Figure 17 and Figure 18As shown, the texture recognition substrate 100 includes a texture recognition area AA and a noise reduction area BB located on at least one side of the texture recognition area AA; a plurality of photosensitive devices 102, light-transmitting holes (including a first light-transmitting hole a, a second light-transmitting hole b, and a third light-transmitting hole c), a first via hole d, and a second via hole e are located in the texture recognition area AA, and a plurality of microlenses 202 are located in the texture recognition area AA and the noise reduction area BB; the texture recognition substrate 100 further includes a capacitor 107 located in the noise reduction area BB, and the capacitor 107 includes a first electrode plate 171 and a second electrode plate 172 disposed opposite to each other; wherein, the first electrode plate 171 is of the same layer and the same material as the first electrode 121, and the second electrode plate 172 is of the same layer and the same material as the second electrode 123; the first planar layer 104 further includes a third via hole d' located in the noise reduction area BB, and the orthographic projection of the third via hole d' on the substrate 101 is located within the orthographic projection of the first electrode plate 171 on the substrate 101; the third via hole d' is filled with a first insulating layer 105 so that the first electrode plate 171 and the second electrode plate 172 are insulated from each other; the area of one third via hole d' is substantially the same as the sum of the areas of all the first via holes d (such as Figure 15 the four first via holes d shown) within the area where one photosensitive device 102 is located, so that the capacitance value of each area where a photosensitive device 102 is located in the texture recognition area AA is the same as the capacitance value of each area where a capacitor 107 is located in the noise reduction area BB, thereby enabling the capacitor 107 to perform noise reduction on the photosensitive device 102 and improving the accuracy of fingerprint recognition.

[0152] It should be noted that, in order to ensure the controllability of the process manufacturing, in the present disclosure, each aperture layer 201, each support layer 203, the microlens 202, and the green resin layer 204 are also fabricated in the noise reduction area AA, but the aperture layer 201 is not perforated, as Figure 18 shown.

[0153] In some embodiments, in the above-mentioned texture recognition module provided by the embodiments of the present disclosure, Figures 19 to 25 as shown, the pixel driving circuit 103 may include: a reset transistor T1, an amplifying transistor T2, and a reading transistor T3, wherein at least one of the reset transistor T1, the amplifying transistor T2, and the reading transistor T3 is a double-gate transistor to reduce noise.

[0154] Figure 26 shows the signal-to-noise ratio (SNR) when the reset transistor T1 and the reading transistor T3 both adopt double gates, and the amplifying transistor T2 adopts a single gate (the broken line marked with a dot in the figure) or a double gate (the broken line marked with a square in the figure). From Figure 26 it can be seen that when the amplifying transistor T2 adopts a double gate, most of the values of the signal-to-noise ratio are higher than the signal-to-noise ratio when the amplifying transistor T2 adopts a single gate. Therefore, compared with the single-gate structure, the double-gate structure of the amplifying transistor T2 can generally make the fingerprint recognition accuracy higher.

[0155] Continue to refer to Figure 5 and Figures 19 to 25 In the pixel driving circuit 103, the gate of the reset transistor T1 is electrically connected to the first signal line VRST. The first pole of the reset transistor T1 is electrically connected to the first electrode 121 through the fourth via g (penetrating the second planarization layer 111) and the fifth via j (penetrating the second insulating layer 112) which are connected in communication, and is electrically connected to the gate of the amplifying transistor T2 through the sixth via i (penetrating the interlayer dielectric layer 110). The second pole of the reset transistor T1 is electrically connected to the power supply line VDD. The first pole of the amplifying transistor T2 is electrically connected to the second pole of the reading transistor T3, and the second pole of the amplifying transistor T2 is electrically connected to the power supply line VDD. The gate of the reading transistor T3 is electrically connected to the second signal line VGH / VGL, and the first pole of the reading transistor T3 is electrically connected to the third signal line VRED. The storage capacitor C is arranged in parallel with the photosensitive device 102. The active layers of the respective transistors are electrically connected to the first pole and the second pole through the corresponding seventh via k (penetrating the gate insulating layer 109 and the interlayer dielectric layer 110). In some embodiments, the first pole of the amplifying transistor T2 and the second pole of the reading transistor T3 can be made of a conductive active layer material.

[0156] It should be noted that the above-mentioned respective transistors can be top-gate transistors or bottom-gate transistors, and are not limited herein. In some embodiments, the respective transistors are low-temperature polysilicon transistors to obtain a larger carrier mobility, which is beneficial to achieving high-frame-rate imaging in glass-based optical detection. However, in some other embodiments, the respective transistors can also be amorphous silicon transistors, oxide transistors, field-effect transistors, etc. In addition, the first pole and the second pole of the respective transistors are the drain and the source respectively, and their functions can be interchanged according to the transistor type and the different input signals, and no specific distinction is made herein. Generally, when the transistor is a P-type transistor, the first pole is the source, and the second pole is the drain; when the transistor is an N-type transistor, the first pole is the drain, and the second pole is the source.

[0157] In specific implementation Figure 25 the reset transistor T1 in controls the reset of the gate potential of the amplifying transistor T2. The amplifying transistor T2 amplifies the current signal output by the photosensitive device 102, and the reading transistor T3 provides the amplified current signal to the third signal line VRED. In some embodiments, the power supply line VDD is connected to a DC potential of about +5V, and the bias voltage V bias connected to a DC potential of about 0V can make the photosensitive device 102 in a reverse bias state. Figure 25The specific working process of the pixel driving circuit 103 shown is as follows: First, the reset transistor T1 is turned on under the control of the square wave signal provided by the first signal line VRST, so that the gate potential of the amplifying transistor T2 is reset to the fixed potential signal provided by the power supply line VDD, and the amplifying transistor T2 operates in the saturation state; then, the photosensitive device 102 enters the exposure stage, and the photosensitive device 102 is reverse-biased to generate a photocurrent signal; finally, the reading transistor T3 is turned on under the control of the square wave signal provided by the second signal line VGH / VGL, and the external reading chip (ROIC) reads the change in the gate potential of the amplifying transistor T2 (equivalent to the current signal on the path of the amplifying transistor T2 and the reading transistor T3) through the third signal line VRED.

[0158] In addition, Figure 5 Only the ramps of the first via d and the second via e are schematically shown as being in a polygonal shape. In some embodiments, the ramps of the first via d and the second via e can both be smooth arc shapes, which are not specifically limited herein.

[0159] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, as Figure 27 and Figure 28 shown, the pixel driving circuit 103 may further include a noise reduction transistor T4, and the noise reduction transistor T4 is a single-gate transistor or a double-gate transistor.

[0160] Figure 25 The structure of the pixel driving circuit 103 shown is simple and has a high fill factor. However, since Figure 25 there is no storage node in the pixel driving circuit 103 shown, a true correlated double sampling cannot be achieved. Specifically, generally Figure 25 the pixel driving circuit 103 shown uses a pseudo-correlated double sampling method to eliminate fixed pattern noise, but cannot eliminate time-related noise (kT / C). Figure 27 and Figure 28 The pixel driving circuit 103 shown, compared with Figure 25 the pixel driving circuit 103 shown, adds a noise reduction transistor T4 and a charge storage node - a floating diffusion point FD, that is, the capacitor C' shown by the dotted line; wherein the gate of the noise reduction transistor T4 is electrically connected to the third signal line G, the first pole is electrically connected to the gate of the second transistor T2, and the second pole is electrically connected to the first electrode 121 of the photosensitive device 102. Therefore Figure 27 and Figure 28 the pixel driving circuit 103 shown can achieve true correlated double sampling, eliminate FPN noise in the pixels, and has a low noise level.

[0161] In some embodiments, in the above-described texture recognition module provided by the embodiments of the present disclosure, as Figure 5 and Figure 18As shown, the texture recognition substrate 100 may further include: a buffer layer 108, a gate insulating layer 109, an interlayer dielectric layer 110, a second planarization layer 111, a second insulating layer 112, a protective layer 113, a barrier layer 114, and an electromagnetic shielding layer 115. Additionally, as Figure 1 and Figure 2 shown, a gate driver chip (Gate IC) 116, a source driver chip (Source IC) 117, etc. may also be disposed within the bonding region BD of the texture recognition substrate 100; among them, the gate driver chip 116 is electrically connected to the first signal line VRST and the second signal lines VGH / VGL, and the source driver chip 117 is electrically connected to the third signal line RED, the power supply line VDD, and the fourth signal line G. In some embodiments, as Figure 3 and Figure 4 shown, a gate driver circuit (GOA) 118 may be disposed on a side of the noise reduction region BB away from the texture recognition region AA, and the gate driver circuit 118 is used to provide drive signals for the first signal line VRST and the second signal lines VGH / VGL, so that it is not necessary to bond the gate driver chip 116, and the technical effect of a narrow border can be achieved. Other essential components of the texture recognition module are understood by those of ordinary skill in the art and will not be elaborated here, nor should they be regarded as a limitation to the present disclosure.

[0162] Based on the same inventive concept, an embodiment of the present disclosure provides a display device, as Figure 29 shown, including: a fingerprint recognition module 01, a display module 02, and an adhesive layer 03; among them, the fingerprint recognition module 01 is the above-mentioned fingerprint recognition module 01 provided by the embodiment of the present disclosure, and the fingerprint recognition module 01 is located on the opposite side of the display side of the display module 02; the adhesive layer 03 is located between the display module 02 and the fingerprint recognition module 01, and the orthographic projection of the adhesive layer 03 on the display module 02 is located in the border area of the display module 02, so that the space enclosed by the fingerprint recognition module 01, the display module 02, and the adhesive layer 03 forms an air layer, which is conducive to maintaining the unchanged optical path propagation direction of the finger reflected light.

[0163] During fingerprint recognition, when a finger touches the display module 01, the light confinement layer 200 can screen out the light with a small angle in the finger reflected light and make it nearly collimated, so that it reaches the photoelectric conversion layer 122 of the underlying photosensitive device 102. The photoelectric conversion layer 122 can detect the intensity of the light. Since the energies of the downward diffuse reflected lights of the valleys and ridges are different, the light intensities detected by the photosensitive device 102 array are different, and thus fingerprint image information is obtained.

[0164] In some embodiments, the display device provided by the embodiments of the present disclosure may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a smart watch, a fitness bracelet, a personal digital assistant, etc. The display device includes, but is not limited to: a radio frequency unit, a network module, an audio output & input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply, etc. In addition, those skilled in the art can understand that the above structure does not constitute a limitation on the display device provided by the embodiments of the present disclosure. In other words, the display device provided by the embodiments of the present disclosure may include more or fewer of the above components, or combine some components, or have different component arrangements.

[0165] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if these modifications and variations of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalent technologies, the present disclosure also intends to include these changes and modifications.

Claims

1. A texture recognition module, wherein, Comprising: A texture recognition substrate, which includes a substrate substrate and a plurality of photosensitive devices arranged in an array on one side of the substrate substrate; A light confinement layer, which is directly in contact with the side of the texture recognition substrate having the plurality of photosensitive devices. The light confinement layer includes at least one diaphragm layer and a microlens layer located on the side of the diaphragm layer away from the texture recognition substrate. Wherein, the diaphragm layer has light-transmitting holes arranged in an array, and the orthographic projection of the light-transmitting holes on the substrate substrate is located within the orthographic projection of the photosensitive devices on the substrate substrate; the microlens layer includes a plurality of microlenses arranged separately, and the orthographic projection of the microlenses on the substrate substrate covers and is larger than the orthographic projection of the light-transmitting holes on the substrate substrate; Wherein, the light confinement layer includes at least two diaphragm layers, and the light-transmitting holes in each diaphragm layer correspond to each other one by one and at least partially overlap in the orthographic projection on the substrate substrate; Wherein, in the direction away from the texture recognition substrate, the diaphragm layer includes a first diaphragm layer, a second diaphragm layer, and a third diaphragm layer arranged in sequence. Wherein, The first diaphragm layer includes first light-transmitting holes arranged in an array, the second diaphragm layer includes second light-transmitting holes arranged in an array, and the third diaphragm layer includes third light-transmitting holes arranged in an array; The orthographic projection of the second light-transmitting holes on the substrate substrate covers and is larger than the orthographic projection of the first light-transmitting holes on the substrate substrate, and the orthographic projection of the second light-transmitting holes on the substrate substrate is located within the orthographic projection of the third light-transmitting holes on the substrate substrate; Wherein, the light confinement layer further includes a support layer alternately arranged with the diaphragm layer; The aperture D1 of the first light-transmitting hole satisfies the following relational expression: D1 = [D 2 / (2h s ) + h s * [n x / (n - 1)] * tanθ; where D is the aperture of the microlens, h s is the height of the microlens, n is the refractive index of the microlens, n x is the refractive index of the support layer, and θ is the light collection angle.

2. The texture recognition module according to claim 1, wherein, There is a first distance between the orthographic projection of the center of the first light-transmitting hole on the substrate substrate and the orthographic projection of the center of the corresponding second light-transmitting hole on the substrate substrate; There is a second distance between the orthographic projection of the center of the first light-transmitting hole on the substrate substrate and the orthographic projection of the center of the corresponding third light-transmitting hole on the substrate substrate; The ratios of the first distance, the second distance to the aperture of the first light-transmitting hole are all greater than or equal to 0 and less than or equal to 20%; 3. The texture recognition module according to claim 1, wherein, The aperture D2 of the second light-transmitting hole satisfies the following relational expression: D2 = k * D1, D2 < D3; Wherein, 1 < k < 2, D1 is the aperture of the first light-transmitting hole, and D3 is the aperture of the third light-transmitting hole.

4. The texture recognition module according to claim 1, wherein, The microlenses are arranged in one-to-one correspondence with the light-transmitting holes. The microlenses include a convex surface and a flat surface. Wherein, the convex surface is located on the side of the flat surface away from the light-transmitting holes.

5. The texture recognition module according to claim 1, wherein, The support layer includes a first support layer, a second support layer, and a third support layer. Wherein, The first support layer is located between the first diaphragm layer and the second diaphragm layer, the second support layer is located between the second diaphragm layer and the third diaphragm layer, and the third support layer is located on the side of the third diaphragm layer away from the second diaphragm layer; 6. The texture recognition module according to claim 5, wherein, The light confinement layer further includes a green resin layer, and the green resin layer is located between the first diaphragm layer and the first support layer.

7. The texture recognition module according to claim 6, wherein, The green resin layer fills the first light-transmitting hole, the second support layer fills the second light-transmitting hole, and the third support layer fills the third light-transmitting hole.

8. The texture recognition module according to claim 7, wherein, The aperture D3 of the third light-transmitting hole satisfies the following relational expression: D3 = D*(H - H3) / H; wherein, H is the distance between the surface of the microlens layer facing the texture recognition substrate side and the surface of the first diaphragm layer away from the texture recognition substrate side, and H3 is the thickness of the third support layer.

9. The texture recognition module according to claim 8, wherein, The thickness of the second diaphragm layer is substantially the same as the thickness of the third diaphragm layer; The distance H between the surface of the microlens layer facing the texture recognition substrate side and the surface of the first diaphragm layer away from the texture recognition substrate side satisfies the following relational expression: H = {[D 2 / (4h s )]*[n x / (n - 1)]}-{(3n - 2)*n x *h s / [2(n 2 - n)]}; H = H1 + H2 + H3 + H4 + 2h; wherein, H1 is the thickness of the first support layer, H2 is the thickness of the second support layer, H4 is the thickness of the green resin layer, and h is the thickness of the second diaphragm layer and the third diaphragm layer.

10. The texture recognition module according to claim 9, wherein, The thickness H1 of the first support layer satisfies the following relational expression: H1 = D2*(H - H3) / D3 - H4.

11. The texture recognition module according to claim 10, wherein, 1.4 ≤ n x ≤ 1.7, 1.5 ≤ n ≤ 2.0, 1° ≤ θ ≤ 10°, 2μm ≤ D ≤ 50μm, 1μm ≤ D1 ≤ 10μm, 1μm < D2 < 40μm, 2μm ≤ D3 ≤ 50μm, 1μm ≤ hs ≤ 20μm, 1μm ≤ H1 ≤ 20μm, 1μm ≤ H2 ≤ 20μm, 1μm ≤ H3 ≤ 20μm, 0.5μm ≤ H4 ≤ 3μm, 0.5μm ≤ h ≤ 1.5μm, 4.5μm ≤ H ≤ 100μm。 12. The texture recognition module according to any one of claims 1 to 11, wherein, The material of the support layer includes transparent resin and / or green resin.

13. The texture recognition module according to any one of claims 1, 5, and 9, wherein, The material of the first diaphragm layer includes metal, and the materials of the second diaphragm layer and the third diaphragm layer both include black resin.

14. The texture recognition module according to any one of claims 1 to 11, wherein, The distance between adjacent microlenses is greater than 0 μm and less than or equal to 2 μm.

15. The texture recognition module according to any one of claims 1 to 11, wherein, The orthographic projection shape of the microlens on the substrate is a rounded square, a circle, a right-angled square or a hexagon.

16. The texture recognition module according to any one of claims 1 to 11, wherein, The texture recognition substrate further includes a plurality of pixel driving circuits, the layer where the plurality of pixel driving circuits are located is between the layer where the plurality of photosensitive devices are located and the substrate, and the pixel driving circuits are electrically connected to the photosensitive devices in one-to-one correspondence.

17. The texture recognition module according to claim 16, wherein, Each photosensitive device includes at least one sub-photosensitive device, and the sub-photosensitive device includes a first electrode, a photoelectric conversion layer and a second electrode which are stacked; in the same photosensitive device including a plurality of the sub-photosensitive devices, each of the first electrodes is electrically connected to the corresponding pixel driving circuit, each of the second electrodes is independently arranged, and each of the photoelectric conversion layers is independently arranged.

18. The texture recognition module according to claim 17, wherein, The texture recognition substrate further includes a plurality of connection electrodes, and the connection electrodes are arranged on the same layer as the first electrode; Each of the first electrodes of the same photosensitive device is electrically connected to the corresponding pixel driving circuit through the connection electrode.

19. The texture recognition module according to claim 18, wherein, Each photosensitive device includes four of the sub-photosensitive devices, and in the same photosensitive device, the four sub-photosensitive devices are arranged in two rows and two columns.

20. The texture recognition module according to claim 19, wherein, The plurality of connection electrodes includes a plurality of first connection electrodes, wherein, the four first electrodes in one photosensitive device are electrically connected to the corresponding pixel circuit through the same first connection electrode, and the orthographic projection of the first connection electrode on the substrate and the orthographic projections of the four first electrodes being electrically connected on the substrate all overlap each other.

21. The texture recognition module according to claim 19 or 20, wherein, The multiple connection electrodes further include a plurality of second connection electrodes, each of the second connection electrodes being electrically connected to two adjacent ones of the first electrodes in one of the photosensitive devices, and a positive projection of the second connection electrode on the substrate substantially overlaps positive projections of the two adjacent first electrodes to which the second connection electrode is electrically connected on the substrate.

22. The texture recognition module according to claim 17, wherein, One of the photoelectric conversion layers corresponds to at least one of the microlenses.

23. The texture recognition module according to claim 22, wherein, The photoelectric conversion layers correspond to the microlenses one by one, and a positive projection of the photoelectric conversion layer on the substrate is located within a positive projection of the corresponding microlens on the substrate.

24. The texture recognition module according to claim 23, wherein, The microlenses are provided corresponding to the light-transmitting holes one by one; A positive projection of the light-transmitting hole on the substrate is located in a central region of a positive projection of the corresponding photoelectric conversion layer on the substrate, and a positive projection of the center of the photoelectric conversion layer on the substrate substantially coincides with a positive projection of the center of the light-transmitting hole on the substrate.

25. The texture recognition module according to claim 17, wherein, The texture recognition substrate further includes a planar layer, an insulating layer, and a transparent bias layer, wherein the planar layer, the insulating layer, and the transparent bias layer are sequentially located on a side of the layer where the multiple photosensitive devices are located away from the substrate. The planar layer includes a plurality of first vias, the first vias being provided corresponding to the second electrodes one by one, and a positive projection of the first via on the substrate is located within a positive projection of the corresponding second electrode on the substrate; the insulating layer includes a plurality of second vias, the second vias being communicated with the first vias one by one, and a positive projection of the second via on the substrate is located within a positive projection of the corresponding first via on the substrate; The second electrode is electrically connected to the transparent bias layer through the communicatively arranged first via and second via.

26. The texture recognition module according to claim 25, wherein, A positive projection of the first via on the photoelectric conversion layer and a positive projection of the second via on the photoelectric conversion layer are both located in a central region of the photoelectric conversion layer; A positive projection of the center of the first via on the photoelectric conversion layer and a positive projection of the center of the second via on the photoelectric conversion layer both substantially coincide with the center of the photoelectric conversion layer.

27. The texture recognition module according to claim 25 or 26, wherein, The texture recognition substrate includes a texture recognition area and a noise reduction area located on at least one side of the texture recognition area; The multiple photosensitive devices, the light-transmitting holes, the first vias, and the second vias are located in the texture recognition area, and the multiple microlenses are located in the texture recognition area and the noise reduction area; The texture recognition substrate further includes a capacitor located in the noise reduction area, the capacitor including a first electrode plate and a second electrode plate disposed opposite to each other; wherein, the first electrode plate is of the same layer and the same material as the first electrode, and the second electrode plate is of the same layer and the same material as the second electrode.

28. The texture recognition module according to claim 27, wherein, The flat layer further includes a third via hole located in the noise reduction region, and a positive projection of the third via hole on the substrate is located within a positive projection of the first electrode plate on the substrate; the third via hole is filled with the insulating layer so that the first electrode plate and the second electrode plate are insulated from each other; the sum of the area of one third via hole and the area of the first via hole in the region where one photosensitive device is located is substantially the same.

29. The texture recognition module according to claim 25, wherein, The texture recognition substrate further includes a barrier layer and an electromagnetic shielding layer, wherein the barrier layer is located between the transparent bias layer and the light confinement layer, and the electromagnetic shielding layer is located between the barrier layer and the light confinement layer.

30. The texture recognition module according to claim 18, wherein, The pixel driving circuit includes: a reset transistor, an amplifying transistor, and a reading transistor, wherein at least one of the reset transistor, the amplifying transistor, and the reading transistor is a double-gate transistor.

31. The texture recognition module according to claim 30, wherein, The pixel driving circuit further includes a noise reduction transistor, and the noise reduction transistor is a single-gate transistor or a double-gate transistor.

32. A display device, wherein, Comprising: A display module, a fingerprint recognition module, and an adhesive layer; wherein, the fingerprint recognition module is the fingerprint recognition module according to any one of claims 1 to 31, the fingerprint recognition module is located on the opposite side of the display side of the display module; the adhesive layer is located between the display module and the fingerprint recognition module, and a positive projection of the adhesive layer on the display module is located in the border area of the display module.

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