Chip heat dissipation device

Abstract

The application provides a chip heat dissipation device, which comprises a heat dissipation unit, wherein the heat dissipation unit comprises heat dissipation plates clamped on two sides of a chip, the pins of the chip are exposed from the heat dissipation plates, pin locking pieces are arranged on the two sides of the gap between the heat dissipation plates, the pin locking pieces are used for fixed connection with the pins, and the pin locking pieces are clamped on the two sides of the gap between the heat dissipation plates to prevent the chip from moving relative to the gap between the heat dissipation plates. The pin locking pieces arranged on the two sides of the gap between the heat dissipation plates are used for clamping the two sides of the chip relative to the heat dissipation plates, the chip is prevented from moving relative to the gap between the heat dissipation plates, and the structure is simple and convenient to install. The water cooling plates are arranged on the heat dissipation plates, the adjacent water cooling plates can be connected and combined, the modular integration is facilitated, and the number of heat dissipation plates can be arranged according to the use requirement.

Description

Technical Field

[0001] This invention belongs to the field of chip heat dissipation technology, and in particular, a chip heat dissipation device. Background Technology

[0002] The Motor Controller Unit (MCU), also known as an inverter, is one of the key components (core three-electric system) of pure electric or hybrid vehicles. The Insulated Gate Bipolar Transistor (IGBT) is one of the key components of the MCU and also the component that generates the most heat. The heat dissipation capacity of the IGBT chip greatly determines the maximum output power of the MCU. Therefore, the design of heat dissipation and cooling solutions for the IGBT chip has always been one of the key focuses of motor controller R&D. Double-sided heat dissipation IGBT chips can achieve double-sided heat dissipation, that is, the IGBT chip is sandwiched between heat sinks. Although this structure is simple and has good heat dissipation performance, this method is inconvenient for the fixed installation of the IGBT chip, as the chip can easily slide out between the other two heat sinks. Summary of the Invention

[0003] The main objective of this invention is to provide a chip heat dissipation device that enables the fixed installation of IGBTs and heat sinks.

[0004] In a first aspect, the present invention provides a chip heat dissipation device, including a heat dissipation unit, wherein the heat dissipation unit includes heat dissipation plates sandwiched between two sides of a chip, the pins of the chip protruding between the heat dissipation plates, and pin locking members are provided on both sides of the gap between the heat dissipation plates of the heat dissipation unit, the pin locking members being fixedly connected to the pins, and the pin locking members being engaged with both sides of the gap between the heat dissipation plates to prevent the chip from moving relative to the gap between the heat dissipation plates.

[0005] In conjunction with the first aspect, in some embodiments, the pin locking member is provided with a screw hole connected to the pin, and an insulating stop is provided around the screw hole, wherein the stop located on opposite sides of the pin is provided with a locking claw for locking the pin.

[0006] In conjunction with the first aspect, in some embodiments, the pin locking member is provided with an anti-rotation hole for tooling positioning, which is parallel to the screw hole.

[0007] In conjunction with the first aspect, in some embodiments, the heat sink has connecting holes distributed on its side, and the heat sinks are connected to each other through the connecting holes. The connecting holes are higher than the side of the heat sink to prevent two adjacent heat sinks from being squeezed together. The pin locking member is located between two adjacent connecting holes, and the connecting holes restrict the pin locking member from moving along the side of the heat sink.

[0008] In conjunction with the first aspect, in some embodiments, the heat sink is clamped between two opposing pressure plates, the edges of which are higher than the edges of the heat sink.

[0009] In conjunction with the first aspect, in some embodiments, the pressure plate is provided with connection holes corresponding to the connection holes on the heat sink, and gaskets are spaced between the connection holes.

[0010] In conjunction with the first aspect, in some embodiments, at least two heat dissipation units are arranged side by side between the pressure plates.

[0011] In conjunction with the first aspect, in some embodiments, the heat sink is a water-cooled plate, and the water-cooled plate is provided with water-cooling channels.

[0012] In conjunction with the first aspect, in some embodiments, the water-cooled plate is provided with a port connecting the inside and outside of the water-cooling channel, and the ports of adjacent water-cooled plates are connected together.

[0013] In conjunction with the first aspect, in some embodiments, the water-cooling channel is located on the other side of the water-cooling plate opposite to the chip, and heat dissipation fins are provided inside the water-cooling channel.

[0014] Compared with the prior art, the chip heat dissipation device of the present invention has the following advantages:

[0015] This invention utilizes pin locking components positioned on both sides of the gap in the heat sink to lock the chip relative to the heat sink, preventing the chip from moving relative to the gap. The structure is simple and installation is convenient. A water-cooling plate is mounted on the heat sink, and adjacent water-cooling plates can be docked together, facilitating modular integration and allowing the number of heat sinks to be adjusted according to usage requirements. Attached Figure Description

[0016] In the accompanying drawings, for the purpose of illustrating details and facilitating understanding of the principles, they are not necessarily drawn to scale, and similar reference numerals may describe similar parts in different views. The accompanying drawings generally illustrate the embodiments discussed herein by way of example and not limitation.

[0017] Figure 1 This is a three-dimensional schematic diagram of a chip heat dissipation device provided by the present invention.

[0018] Figure 2 yes Figure 1 A top view of the chip heat dissipation device.

[0019] Figure 3 yes Figure 1 A side view of the chip heat dissipation device.

[0020] Figure 4 yes Figure 1A schematic diagram of the end side of the chip heat dissipation device.

[0021] Figure 5 This is a schematic diagram of a chip that utilizes the chip heat dissipation device provided by the present invention for heat dissipation.

[0022] Figure 6 This is a schematic diagram of the AC power pin locking component of the chip heat dissipation device of the present invention.

[0023] Figure 7 This is a schematic diagram of the DC power pin locking component of the chip heat dissipation device of the present invention.

[0024] Figure 8 This is a schematic diagram of the heat sink of the chip heat dissipation device of the present invention.

[0025] Figure 9 This is a schematic diagram showing a cross-section of the heat sink plate of the chip heat dissipation device of the present invention.

[0026] Figure 10 This is a schematic diagram showing the connection between two adjacent heat sinks in the chip heat dissipation device of the present invention.

[0027] Figure 11 This is a schematic diagram of a chip heat dissipation device with only two heat sinks.

[0028] In the diagram, 1. Water nozzle assembly; 2. Pressure plate; 3. Chip; 4. Pin locking component; 5. Heat sink; 6. Bolt hole; 7. Water nozzle inlet; 8. Sealing ring groove; 9. Water outlet; 10. AC power pin; 11. DC power pin; 12. Anti-rotation hole; 13. Insulating stop; 14. Screw hole; 16. Claw; 21. Heat sink fins; 22. Water cooling channel; 23. Water nozzle; 24. Connection hole; 25. Water cooling plate; 26. Water channel port. Detailed Implementation

[0029] The following are specific embodiments of the present invention, and the technical solution of the present invention will be further described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments, and the following embodiments do not limit the invention covered by the claims. Furthermore, not all combinations of the features described in the embodiments are necessary for the inventive solution.

[0030] Those skilled in the art will understand that all directional references (e.g., above, below, up, up, down, down, top, bottom, left, right, vertical, horizontal, etc.) are used descriptively in the drawings to aid the reader's understanding and do not imply (e.g., limitations on the scope of the invention as defined by the appended claims) a limitation on the location, orientation, or use of the invention. Furthermore, some vague terms (e.g., substantially, certain, generally, etc.) may refer to slight inaccuracies or minor deviations in conditions, quantities, values, or dimensions, some of which are within manufacturing tolerances or allowable limits. Example 1

[0031] like Figure 1 , 2 As shown in Figures 3 and 4, a chip heat dissipation device includes a basic heat dissipation unit. The heat dissipation unit includes heat sinks 5 sandwiched between two sides of an IGBT chip 3. The pins of the chip 3 protrude from between the heat sinks 5. Figure 5 As shown, the IGBT chip 3 has an AC power pin 10 on one side and two DC power pins 11 on the other side. Each pin has a fixing hole for a screw to pass through. Pin locking members 4 are provided on both sides of the gap between the heat sink 5 and the heat dissipation unit for connecting the power pins on both sides. The pin locking members 4 are used to fix the pins together, and each pin locking member has a screw hole 14 corresponding to the fixing hole of the pin. The pin locking members 4 are engaged on both sides of the gap between the heat sink 5 to prevent the chip 3 from moving relative to the gap between the heat sink 5 and the heat sink 5.

[0032] The main body of the pin locking member 4 is a block shape, and the screw hole 14 is provided on the block shape. After the pin is bent, the fixing hole of the pin is coaxially aligned with the screw hole 14, so that the pin can be fixed to the block shape by screws.

[0033] like Figure 6 As shown, the AC power pin 10 is equipped with an AC power pin locking element 4, as follows: Figure 7 As shown, the DC power pin 11 is represented by a DC power pin locking component 4. Since there are two DC power pins 11, the block-shaped body of the DC power pin locking component 4 is provided with two screw holes 14 for fixed connection. Insulating blocks 13 are provided around the screw holes 14 of the AC power pin locking component 4, and insulating blocks 13 are also provided on both sides of the two screw holes 14 of the DC power pin locking component 4. The insulating blocks 13 ensure electrical safety isolation between the power pins and other electrical components.

[0034] The stop body located on opposite sides of the pin is provided with a locking claw 16 for locking the pin. The locking claw 16 is located at the end of the stop body and is used to lock the side of the pin to prevent the pin from rotating relative to the block body.

[0035] The pin locking component is provided with anti-rotation holes 12 arranged parallel to the screw holes 14 for tooling positioning. During the locking process, the anti-rotation holes 12 cooperate with the tooling to prevent the power terminal locking structure from squeezing the AC side power terminals as the bolts rotate, thus eliminating the risk of damage to the AC side power terminals due to assembly stress during assembly.

[0036] like Figure 8As shown, connection holes 24 are distributed along the side of the heat sink 5. The heat sinks 5 are connected to each other through the connection holes 24. The connection holes 24 are higher than the side of the heat sink 5. The pin locking member is located between two adjacent connection holes 24. The connection holes 24 restrict the movement of the pin locking member along the side of the heat sink 5. The connection holes 24 are located on the guide posts, and the end face of the guide posts is coplanar with the side of the heat sink 5. They are used to limit the deformation of the heat sink 5, reduce the deformation of the heat sink 5, suppress the warping deformation of the heat sink 5, improve the effect of the thermal grease coating and pressing between the heat sink 5 and the IGBT, and ensure the high efficiency of double-sided heat dissipation of the IGBT.

[0037] The heat sink 5 is clamped between two opposing pressure plates 2, with the sides of the pressure plates 2 higher than the sides of the heat sink 5 to protect it. The pressure plate 2 assembly includes front and rear pressure plates 2, which are made of high-strength materials with strong resistance to deformation and vibration. Nuts are symmetrically riveted or threaded around the front pressure plate 2, and the front and rear pressure plates 2 are locked together with bolts to press the heat sink 5. The pressing force is transmitted from the pressure plates 2 to the plane of the heat sink 5 and the guide posts, thus clamping the IGBT. The plane of the heat sink 5 is the main pressure surface, and the guide posts on both sides are coplanar with the plane of the heat sink 5 to limit and reduce the deformation of the pressure plates 2.

[0038] In this embodiment, two heat dissipation units are arranged side by side between the pressure plates 2, that is, four heat dissipation plates 5 are included. The pressure plates 2 are provided with connection holes 24 corresponding to the connection holes 24 of the heat dissipation plates 5, and gaskets are spaced between the connection holes 24.

[0039] like Figure 9 As shown, the heat dissipation plate 5 is equipped with a water-cooling plate 25, and the water-cooling plate 25 has a water-cooling channel 22. Water flows through the water-cooling channel 22 to carry away heat and improve heat dissipation efficiency. Figure 10 As shown, the water-cooled plate 25 is provided with a water channel port 26 that connects the inside and outside of the water-cooled flow channel 22. The water channel ports 26 of adjacent water-cooled plates 25 are connected by docking. The connection method is simple and convenient, and the number of heat dissipation plates 5 can be flexibly combined as needed.

[0040] The water-cooling channel 22 is located on the other side of the water-cooling plate 25 opposite to the chip 3, to prevent the chip from squeezing and damaging the channel. The water-cooling channel 22 is provided with heat dissipation fins 21 to improve heat exchange efficiency.

[0041] A water nozzle 23 is provided at one end of one side of the water-cooled plate 25. A water nozzle 23 assembly 1 is also connected to the water-cooled plate 25. The water nozzle 23 assembly 1 includes a sealing ring and a water nozzle 23 body. The sealing ring is placed in the sealing ring groove 8. The water inlet end 7 of the water nozzle 23 and the water nozzle 23 on the water-cooled plate 25 on the water outlet side form a radial seal through the sealing ring. The other end of the water nozzle 23 is the water outlet end 9, which also forms a radial seal with the MCU housing. The water nozzle 23 assembly 1 is also provided with bolt holes 6 for connecting with the MCU housing.

[0042] The number of heat sinks can be set as needed, for example, Figure 1 As shown, this is the configuration with four heat sinks installed. Figure 11 As shown, this is the state with two heat sinks set up.

[0043] Although this document uses a number of technical terms, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of the invention; interpreting them as any additional limitation would contradict the spirit of the invention. The order of actions, steps, etc., in the apparatus and methods shown in the specification and drawings can be implemented in any order unless otherwise expressly specified, and provided that the output of a preceding process is not used in a subsequent process. Similar sequential terms used for descriptive convenience (e.g., "firstly," "next," "secondly," "again," "then," etc.) do not imply that the actions must be performed in such an order.

[0044] The specific embodiments described herein are merely illustrative examples illustrating the spirit of the invention. Those skilled in the art can make various modifications or additions to the described embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A chip heat dissipation device, characterized in that, The device includes a heat dissipation unit, wherein the heat dissipation unit includes heat sinks (5) sandwiched between two sides of a chip (3), and the pins of the chip (3) protrude from between the heat sinks (5). Pin locking members (4) are provided on both sides of the gap between the heat sinks (5) of the heat dissipation unit. The pin locking members (4) are used to fix the pins together and are locked to both sides of the gap between the heat sinks (5) to prevent the chip (3) from moving relative to the gap between the heat sinks (5). The pin locking members are provided with screw holes (14) for connecting to the pins, and insulating blocks (13) are provided around the screw holes (14). The pin is secured by a locking claw (16) on the stop body on both sides of the pin; the heat sink (5) has connecting holes (24) distributed on its side, and the heat sink (5) is connected to each other through the connecting holes (24). The connecting holes (24) are higher than the side of the heat sink (5) to prevent the two adjacent heat sinks from being squeezed. The pin locking member is located between two adjacent connecting holes (24), and the connecting holes (24) restrict the pin locking member from moving along the side of the heat sink (5); the heat sink (5) is clamped between two opposing pressure plates (2), and the side of the pressure plate (2) is higher than the side of the heat sink (5).

2. The chip heat dissipation device according to claim 1, characterized in that, The pin locking member is provided with an anti-rotation hole (12) for tooling positioning, which is parallel to the screw hole (14).

3. The chip heat dissipation device according to claim 1, characterized in that, The pressure plate (2) is provided with connection holes (24) corresponding to the connection holes (24) on the heat sink (5), and gaskets are spaced between the connection holes (24).

4. The chip heat dissipation device according to claim 1, characterized in that, At least two heat dissipation units are arranged side by side between the pressure plates (2).

5. The chip heat dissipation device according to claim 1, characterized in that, The heat dissipation plate (5) is a water-cooled plate (25), and a water-cooled flow channel (22) is provided inside the water-cooled plate (25).

6. The chip heat dissipation device according to claim 5, characterized in that, The water-cooled plate (25) is provided with a port that connects the inside and outside of the water-cooled flow channel (22), and the ports of adjacent water-cooled plates (25) are connected.

7. The chip heat dissipation device according to claim 5, characterized in that, The water-cooling channel (22) is located on the other side of the water-cooling plate (25) opposite to the chip (3), and heat dissipation fins (21) are provided in the water-cooling channel (22).

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