A printing method for Miniled display substrate
By adsorbing the substrate through the fixture base and cover plate structure and adjusting the cover plate thickness, the problem of unstable gap between the steel mesh and the substrate is solved, and efficient and stable printing of Miniled display substrates is achieved, which extends the service life of the steel mesh and reduces production costs.
Patent Information
- Application Number
- CN202310473988.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-04-28
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2043-04-28
AI Technical Summary
During the solder printing process of Miniled display substrates, the gap setting between the steel mesh and the substrate is unstable, resulting in inconsistent printing effects. The steel mesh is easily worn and has a short service life. In addition, the existing technology requires frequent replacement of the protective film to adapt to the thickness difference of the substrate, which affects printing efficiency.
A jig base and jig cover structure is adopted. By setting grooves and vents in the jig base and combining it with an exhaust device, the substrate is adsorbed in the groove. The gap between the steel mesh and the substrate is controlled by adjusting the thickness of the jig cover. Covers of different thicknesses are used to adapt to different substrate thicknesses, prevent friction between the steel mesh and the substrate, and simplify the printing operation.
The consistency of the printing gap of the substrate is achieved, the printing effect and efficiency are improved, the service life of the steel mesh is extended, and the production cost is reduced.