Display module, manufacturing method of display module and display device

Abstract

Embodiments of the present application provide a display module, a manufacturing method of the display module and a display device. The display module comprises a display panel, a back film, a supporting assembly, an NFC module and a circuit board. The back film is arranged on a side away from a light-out surface of the display panel. The supporting assembly is arranged on a side of the back film away from the display panel, and the supporting assembly is provided with a through hole. The NFC module is arranged on a side of the supporting assembly away from the light-out surface. The circuit board is arranged on a side of the NFC module away from the light-out surface. The circuit board comprises a first part attached to the NFC module, and the first part is an insulating part. The circuit board further comprises a second part not attached to the NFC module, and the second part comprises at least a conductive part arranged opposite to the through hole. A conductive connecting piece is arranged between the conductive part and the back film and passes through the through hole.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module, a method for manufacturing the display module, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs), also known as organic electroluminescent displays or organic light-emitting semiconductors (OLEDs), refer to the phenomenon where organic semiconductor materials and light-emitting materials emit light through carrier injection and recombination under an electric field. Compared to traditional LCD panels and TFT screens, OLEDs offer faster response times, higher contrast ratios, wider viewing angles, thinner profiles, and greater flexibility, and are currently widely used in electronic products such as mobile phones, tablets, and watches.

[0003] When manufacturing display modules, a back film needs to be attached to the backlight surface of the display area. Flexible OLED display modules often use TFE (Thin Film Barriers) encapsulation, where both the top and bottom layers are covered with non-conductive polymer materials. This makes it easy for static electricity to accumulate on the back film within the display module. If this static electricity is not released in time, it can lead to screen flickering or display anomalies. Conventional display module designs typically add conductive materials such as copper foil to the back of the display panel to release static electricity or static buildup caused by the external environment (during the display module manufacturing process or the overall device environment). However, in wearable products, the use of NFC (Near Field Communication) antennas prevents the design of a single copper layer between the display and the NFC antenna, as the copper layer would shield the NFC antenna's performance. Therefore, in wearable devices, the inability to release static electricity on the back film can cause screen flickering or display anomalies. Summary of the Invention

[0004] The purpose of this application is to provide a display module, a method for manufacturing a display module, and a display device to solve the problem of screen flickering or abnormal display caused by static electricity buildup on the back film in the display module.

[0005] An embodiment of the first aspect of this application provides a display module, including a display panel, a back film, a support assembly, an NFC module, a circuit board, and a reinforcing plate. The back film is disposed on the side of the back film away from the light-emitting surface of the display panel; the support assembly is disposed on the side of the back film away from the display panel, and the support assembly has a through hole; the NFC module is disposed on the side of the support assembly away from the light-emitting surface; the circuit board is disposed on the side of the NFC module away from the light-emitting surface, the circuit board includes a first portion that is attached to the NFC module, the first portion being an insulating portion, and the circuit board also includes a second portion that is not attached to the NFC module, the second portion including at least a conductive portion disposed opposite to the through hole; a conductive connector is provided between the conductive portion and the back film.

[0006] In some embodiments, the through-hole is provided on the side of the support assembly to form a U-shaped groove.

[0007] In some embodiments, the conductive portion is a copper leakage area.

[0008] In some embodiments, the display module further includes a reinforcing plate, which is arranged side-by-side with the NFC module on the side of the support assembly away from the light-emitting surface along the length of the display module, and the conductive connector is disposed at one end of the reinforcing plate along the width of the display module.

[0009] In some embodiments, at least a portion of the reinforcing plate includes a first layer, an intermediate layer, and a second layer sequentially disposed along the thickness direction of the display module, the intermediate layer including an extension beyond the first layer and the second layer; the conductive connector includes a first conductive adhesive layer, an intermediate conductive adhesive layer, and a second conductive adhesive layer sequentially disposed along the thickness direction of the display module, the first conductive adhesive layer and the second conductive adhesive layer being bonded to at least a portion of the upper and lower surfaces of the extension, and the intermediate conductive adhesive layer being bonded to a side of the intermediate layer perpendicular to the width direction of the display panel.

[0010] In some embodiments, the first conductive adhesive layer and the second conductive adhesive layer extend beyond the intermediate layer by a distance greater than or equal to 1 mm along the length direction of the display module on the side connected to the intermediate layer.

[0011] In some embodiments, the intermediate conductive adhesive layer at least completely covers the through-hole in its orthographic projection.

[0012] In some embodiments, the intermediate conductive adhesive layer is a black conductive adhesive layer.

[0013] In some embodiments, the thickness of the second conductive adhesive layer is equal to the thickness of the support component.

[0014] An embodiment of the second aspect of this application provides a method for manufacturing a display module, used to manufacture any of the display modules described in the present application, comprising:

[0015] A display panel is fabricated, and a back film is provided on the side of the display panel away from the light-emitting surface.

[0016] A support assembly is provided on the side of the back film away from the light-emitting surface, and through holes are formed on the support assembly.

[0017] An NFC module is fabricated on the side of the support assembly away from the light-emitting surface.

[0018] A circuit board is fabricated on the side of the NFC module away from the light-emitting surface. The circuit board includes a first part that is attached to the NFC module and is an insulating part. The circuit board also includes a second part that is not attached to the NFC module and includes at least a conductive part that is disposed opposite to the through hole. A conductive connector is fabricated between the conductive part and the back film.

[0019] An embodiment of the second aspect of this application provides a display device including any of the display modules described in the previous one.

[0020] In this embodiment, during the fabrication of the display module, attaching a back film to the side of the display panel away from the light-emitting surface provides protection and support. The support component attached to the side of the back film away from the light-emitting surface acts as a buffer. Through holes in the support component allow one end of a conductive connector to pass through the support component and connect to the back film. To meet the needs of wearable devices, an NFC module is placed on the side of the support component away from the light-emitting surface, enabling the display module to perform near-field communication (NFC). NFC also offers advantages such as high security and short setup time. To prevent the copper layer in the circuit board from affecting the performance of the NFC module, an insulating part is provided where the circuit board is attached to the NFC module, and a conductive part connected to the conductive connector is provided where it is not attached to the NFC module. The other end of the conductive connector is connected to the conductive part. When induced charges accumulate in the back film, the charges can be conducted through the conductive connector to the circuit board, and then to the ground, ultimately discharging the accumulated charges on the back film of the display module and releasing static electricity, thus avoiding problems such as screen flickering or abnormal display.

[0021] Of course, implementing any product or method of this application does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0023] Figure 1 This is a cross-sectional view of a display module in the prior art;

[0024] Figure 2a This is a schematic diagram of a first structure of a display module provided in an embodiment of this application;

[0025] Figure 2b for Figure 2a The illustrated embodiment is a schematic diagram of the principle of static electricity release.

[0026] Figure 3a This is a schematic diagram of a second structure of the display module provided in an embodiment of this application;

[0027] Figure 3b for Figure 3a The illustrated embodiment is a schematic diagram of the principle of static electricity release.

[0028] Figure 4 An exploded view of the display module provided in the embodiments of this application;

[0029] Figure 5 A partial enlarged view along the X direction of an exploded view of a display module provided in an embodiment of this application;

[0030] Figure 6 This is a partial enlarged view along the Y direction of an exploded view of the display module provided in an embodiment of this application.

[0031] Figure label:

[0032] Display panel 10; working area 100; light-emitting surface 101; back film 20; support assembly 30; through hole 300; NFC module 40; circuit board 50; first part 510; second part 520; conductive part 521; conductive connector 60; first conductive adhesive layer 610; second conductive adhesive layer 620; intermediate conductive adhesive layer 630; reinforcing plate 70; first layer 710; second layer 720; intermediate layer 730; extension part 731; charge 80; cover glass 910; optical adhesive layer 920; polarizing layer 930; width direction X of display module; length direction Y of display module; thickness direction Z of display module. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0034] Conventional flexible display module designs require the addition of conductive materials such as copper foil on the back of the display panel to dissipate static electricity or static buildup caused by external environmental factors (during the display module manufacturing process or the overall device environment). As NFC technology matures, it is increasingly being used in wearable products. Because the NFC antenna in wearable products can only radiate from the front of the screen (the back is near the hand), the structural design prevents the use of a single copper layer between the display and the NFC sensor (as a copper layer would shield the NFC antenna performance). Figure 1 As shown, under the influence of electrostatics / electrostatic fields, the display module induces a corresponding charge 80 on the display panel 10, which in turn causes the back film 20 to accumulate the corresponding charge 80. Without a path for electrostatic discharge, this leads to a forward bias of the threshold voltage in the thin-film transistors in the gate drive circuit, resulting in abnormal gate activation and causing screen flickering or display abnormalities. This defect has caused significant dissatisfaction in the terminal and urgently needs to be resolved.

[0035] To solve the problem of screen flickering or abnormal display on display panel 10, such as Figure 2a , Figure 2b , Figure 3a , Figure 3b As shown, an embodiment of the first aspect of this application provides a display module, including a display panel 10, a back film 20, a support component 30, an NFC module 40, a circuit board 50, and a reinforcing plate 70. The back film 20 is disposed on the side away from the light-emitting surface 101 of the display panel 10; the support component 30 is disposed on the side of the back film 20 away from the display panel 10, and the support component 30 is provided with a through hole 300; the NFC module 40 is disposed on the side of the support component 30 away from the light-emitting surface 101; the circuit board 50 is disposed on the side of the NFC module 40 away from the light-emitting surface 101, and the circuit board 50 includes a first portion 510 that is attached to the NFC module 40, the first portion 510 being an insulating portion, and the circuit board 50 also includes a second portion 520 that is not attached to the NFC module 40, the second portion 520 including at least a conductive portion 521 disposed opposite to the through hole 300; a conductive connector 60 is provided between the conductive portion 521 and the back film 20.

[0036] In this embodiment, during the fabrication of the display module, a through-hole 300 on the support component 30 is used to allow one end of the conductive connector 60 to pass through the support component 30 and connect to the back film 20. To meet the needs of wearable devices, an NFC module 40 is provided on the side of the support component 30 away from the light-emitting surface 101, enabling the display module to perform near-field communication. The NFC module 40 also has the advantages of high security and short setup time. To prevent the copper layer in the circuit board 50 from affecting the performance of the NFC module 40, the circuit board 50 is divided into two parts. The part of the circuit board 50 that is attached to the NFC module 40 is set as an insulating part, and the part that is not attached to the NFC module 40 is provided with a conductive part 521 connected to the conductive connector 60.

[0037] like Figure 2b and Figure 3b As shown, one end of the conductive connector 60 is connected to the conductive part 521, and the other end is connected to the back film 20 through the through hole 300. When the induced charge 80 accumulates in the back film 20, the charge 80 can be conducted through the conductive connector 60 to the conductive part 521 of the circuit board 50, and then conducted to the ground through the grounding structure such as the grounding wire of the circuit board 50. Finally, the charge 80 accumulated on the back film 20 in the display module is conducted away, releasing static electricity, thereby reducing the probability of screen flickering or abnormal display in the display panel 10. The back film 20 attached to the side of the display panel 10 away from the light-emitting surface 101 provides protection and support. The support component 30 attached to the side of the back film 20 away from the light-emitting surface 101 provides a buffering effect.

[0038] Specifically, the through hole 300 on the support component 30 can be set at the edge of the support component 30; provided that the internal wiring space of the display module is met, the through hole 300 can also be set at the middle position of the support component 30.

[0039] In some embodiments of this application, such as Figure 4 As shown, a through hole 300 is provided on the side of the support assembly 30 to form a U-shaped groove.

[0040] In the embodiments of this application, such as Figure 4 As shown, placing the through hole 300 at the edge of the support assembly 30 reduces the space occupied by the conductive connector 60 for the wiring. Since the conductive part 521 is correspondingly provided with the through hole 300, the conductive part 521 is also located at the edge of the circuit board 50. Placing the conductive part 521 at the edge reduces the manufacturing difficulty.

[0041] In some embodiments of this application, the conductive portion 521 is a copper leakage area, such as... Figure 4 , Figure 6As shown, the conductive part 521 is located in the area indicated by the dashed box. Specifically, a copper leakage area is provided on the bottom surface of the area marked by the dashed box to form the conductive part 521.

[0042] In this embodiment, the conductive part 521 is set as a copper leakage area, which eliminates the need to set a conductive layer on the circuit board 50. The copper layer in the circuit board 50 not only serves to transport current, but also connects with the conductive connector 60 to transmit charge, saving manufacturing costs and reducing the space occupied by the conductive part 521.

[0043] In some embodiments of this application, such as Figure 2a , Figure 2b , Figure 4 and Figure 5 As shown, the display module also includes a bending spacer 70, which is arranged side-by-side with the NFC module 40 on the side of the support assembly 30 away from the light-emitting surface 101 along the length Y direction of the display module. In a first feasible embodiment, as... Figure 2a , Figure 2b , Figure 4 and Figure 5 As shown, the conductive connector 60 is disposed at one end of the reinforcing plate 70 along the width direction X of the display module. The reinforcing plate 70 is disposed between the support assembly 30 and the portion of the display panel 10 bent to the back of the support assembly 30, and the reinforcing plate 70 is not connected to the NFC module 40. The connection method between the conductive connector 60 and the reinforcing plate 70 can be adhesive or snap-fit, etc. In the embodiments of this application, as... Figures 2a to 3b As shown, the reinforcing plate 70 provides support and strengthens the display module.

[0044] Furthermore, the reinforcing plate 70 can be a single structure or divided into several layers. Correspondingly, the conductive connector 60 can be a single structure or divided into several conductive adhesive layers. For example, the reinforcing plate 70 can be set as two layers, and to improve the overall flatness of the display module, the conductive connector 60 can also be set as two adhesive layers.

[0045] The reinforcing plate 70 and the NFC module 40 are arranged side by side on the side of the support assembly 30 away from the light-emitting surface 101, with a gap between them. In the second embodiment of this application, as shown... Figure 3a and Figure 3b As shown, the conductive connector 60 can be directly disposed at the interval position. One end of the conductive connector 60 is connected to the conductive part 521 of the circuit board 50, and the other end directly passes through the through hole 300 of the support component 30 and is connected to the back film 20. Compared with connecting the conductive connector 60 to the reinforcing plate 70, the embodiment of this application can save the process of manufacturing the display module.

[0046] In another embodiment, two conductive connectors 60 may be provided, that is, the conductive connectors 60 in the first embodiment and the second embodiment exist simultaneously, which can release the static electricity accumulated on the back film 20 more quickly.

[0047] In the embodiments of this application, such as Figures 2a to 3b As shown, the portion of the display panel 10 away from the light-emitting surface 101 includes a working area 100, which is the effective display area of ​​the display panel 10. The circuit board 50 can be a flexible circuit board 50. Compared with traditional printed circuit boards, the flexible circuit board 50 is thinner and lighter, can be bent arbitrarily, and is more stable during use, thereby improving the overall stability of the display module. The display module also includes a cover glass 910, an optical adhesive layer 920, and a polarizing layer 930 disposed on the side of the display panel 10 away from the back film 20. The cover glass 910, the optical adhesive layer 920, and the polarizing layer 930 are stacked sequentially along the thickness direction Z of the display module.

[0048] Specifically, the support component 30 can be an SCF (Super CleanFoam) component, which includes an adhesive layer and a foam layer stacked sequentially on the back film 20. During the manufacturing process of the display module, the support component 30 plays a buffering role and can also prevent the back film 20 from directly contacting the NFC module 40, thereby affecting the working performance of the NFC module 40.

[0049] In some embodiments of this application, such as Figure 4 and Figure 5 As shown, at least a portion of the reinforcing plate 70 includes a first layer 710, an intermediate layer 730, and a second layer 720 sequentially disposed along the thickness direction Z of the display module. The intermediate layer 730 includes an extension 731 extending beyond the first layer 710 and the second layer 720. The conductive connector 60 includes a first conductive adhesive layer 610, an intermediate conductive adhesive layer 630, and a second conductive adhesive layer 620 sequentially disposed along the thickness direction Z of the display module. The first conductive adhesive layer 610 and the second conductive adhesive layer 620 are bonded to at least a portion of the upper and lower surfaces of the extension 731. The intermediate conductive adhesive layer 630 is bonded to the side of the intermediate layer 730 perpendicular to the width direction X of the display panel.

[0050] In the embodiments of this application, such as Figure 4 and Figure 5As shown, a portion of the reinforcing plate 70 is divided into three layers, while another portion can be a single integral structure. The middle layer 730 has a longer extension 731 that extends beyond the first layer 710 and the second layer 720 along the length Y direction of the display module. This allows a portion of the reinforcing plate 70 along its thickness direction to connect with the conductive connector 60. Specifically, the first conductive adhesive layer 610 can have the same thickness as the first layer 710, the second conductive adhesive layer 620 can have the same thickness as the second layer 720, and the middle conductive adhesive layer 630 can have the same thickness as the middle layer 730. When the first conductive adhesive layer 610 is bonded to the upper surface of the extension 731, and the second conductive adhesive layer 620 is bonded to the lower surface of the extension 731, the thicknesses of the reinforcing plate 70 and the conductive connector 60 are equal. Therefore, the overall surface formed after the conductive connector 60 and the reinforcing plate 70 are connected is relatively flat, resulting in a relatively flat overall display module. By attaching the intermediate conductive adhesive layer 630 to the side of the intermediate layer 730, the connection strength between the conductive connector 60 and the reinforcing plate 70 can be increased.

[0051] Among them, such as Figures 2a to 3b , Figure 5 As shown, the first conductive adhesive layer 610, the intermediate conductive adhesive layer 630, and the second conductive adhesive layer 620 can be bonded together. Furthermore, the first conductive adhesive layer 610 is connected to the conductive portion 521 of the circuit board 50, and the second conductive adhesive layer 620 is connected to the back film 20, so that the conductive connector 60 connects the circuit board 50 and the back film 20. During the secondary assembly process, a foam pressing operation is performed to firmly bond the first conductive adhesive layer 610 to the conductive portion 521 of the circuit board 50.

[0052] In some embodiments of this application, such as Figure 4 and Figure 5 As shown, the first conductive adhesive layer 610 and the second conductive adhesive layer 620 extend beyond the intermediate layer 730 by a distance greater than or equal to 1 mm along the length Y direction of the display module on the side connected to the intermediate layer 730.

[0053] In the embodiments of this application, such as Figures 3a to 6 As shown, the first conductive adhesive layer 610 and the second conductive adhesive layer 620 are longer than the intermediate layer 730 in the length direction Y of the display module. Therefore, the connection area between the conductive connector 60 and the back film 20 or the conductive portion 521 can be increased, thereby increasing the conductivity efficiency. In some embodiments of this application, such as... Figure 6 As shown, the orthographic projection of the intermediate conductive adhesive layer 630 onto the through hole 300 at least completely covers the through hole 300.

[0054] In the embodiments of this application, such as Figure 6As shown, the intermediate conductive adhesive layer 630 can cover the edge area of ​​the through hole 300 to prevent light leakage from the edge area. Specifically, the difference between the intermediate conductive adhesive layer 630 and the edge of the through hole 300 is greater than or equal to 0.5mm, which can better achieve the effect of blocking darkness.

[0055] In some embodiments of this application, the intermediate conductive adhesive layer 630 is a black conductive adhesive layer.

[0056] In this embodiment, setting the intermediate conductive adhesive layer 630 as a black conductive adhesive layer can prevent light leakage from the display panel 10 and cause color differences, and easily form a unified black effect with the display panel 10 when the screen is off.

[0057] In some embodiments of this application, such as Figure 5 and Figure 6 As shown, the thickness of the second conductive adhesive layer 620 is equal to the thickness of the support component 30.

[0058] In this embodiment of the application, when manufacturing the display module, the second conductive adhesive layer 620 is located inside the through hole 300 of the support component 30. If the thickness of the second conductive adhesive layer 620 is less than the thickness of the support component 30, the second conductive adhesive layer 620 may not be able to adhere well to the conductive part 521 of the circuit board 50, thereby affecting the conductivity.

[0059] An embodiment of the second aspect of this application provides a method for manufacturing a display module, used to manufacture any of the above-described display modules, including:

[0060] S1: Fabricate a display panel 10 and set a back film 20 on the side of the display panel 10 away from the light-emitting surface 101.

[0061] S2: A support component 30 is provided on the side of the back film 20 away from the light-emitting surface 101. A through hole 300 is made on the support component 30 and is provided on the side of the back film 20 away from the light-emitting surface 101.

[0062] S3: An NFC module 40 is fabricated on the side of the support component 30 away from the light-emitting surface 101.

[0063] S4: A circuit board 50 is fabricated on the side of the NFC module 40 away from the light-emitting surface 101. The circuit board 50 includes a first part 510 that is attached to the NFC module 40. The first part 510 is an insulating part. The circuit board 50 also includes a second part 520 that is not attached to the NFC module 40. The second part 520 includes at least a conductive part 521 that is disposed opposite to the through hole 300. A conductive connector 60 is fabricated between the conductive part 521 and the back film 20.

[0064] In this embodiment, the structure of the display panel 10 obtained by the manufacturing method provided in this embodiment can be referred to as follows. Figures 2a to 3b, Figure 6 As shown. The conductive connector 60 connects the back film 20 to the conductive part 521 in the circuit board 50 through the through hole 300. The charge 80 generated in the back film 20 can be conducted to the conductive part 521 in the circuit board 50 through the conductive connector 60, and then conducted to the ground through the grounding structure such as the grounding wire of the circuit board 50. Finally, the charge 80 accumulated on the back film 20 in the display module is conducted away, releasing static electricity and realizing electrostatic protection for the display panel 10, thereby reducing the probability of screen flickering or abnormal display in the display panel 10.

[0065] An embodiment of the second aspect of this application provides a display device, including any display module.

[0066] In this embodiment of the application, the display device including the above-mentioned display module can conduct static electricity in the back film 20 of the display module to the circuit board 50 and then to the ground through the conductive connector 60, thereby improving the anti-static capability of the display device and reducing the probability of problems such as screen flickering or abnormal display.

[0067] Specifically, the display device may include: computer monitors, televisions, billboards, laser printers with display functions, telephones, mobile phones, personal digital assistants (PDAs), laptops, digital cameras, portable camcorders, viewfinders, vehicles, large walls, theater screens, or stadium signs, etc.

[0068] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0069] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0070] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A display module, characterized in that, include: Display panel; The back film is disposed on the side away from the light-emitting surface of the display panel; A support component is disposed on the side of the back film away from the display panel, and the support component is provided with through holes; An NFC module is located on the side of the support assembly away from the light-emitting surface; A circuit board is disposed on the side of the NFC module away from the light-emitting surface. The circuit board includes a first part that is attached to the NFC module and is an insulating part. The circuit board also includes a second part that is not attached to the NFC module. The second part includes at least a conductive part that is disposed opposite to the through hole. A conductive connector passing through the through hole is provided between the conductive part and the back film. The display module further includes a reinforcing plate. Along the length of the display module, the reinforcing plate and the NFC module are arranged side by side on the side of the support assembly away from the light-emitting surface. The conductive connector is disposed at one end of the reinforcing plate along the width of the display module or in the gap between the reinforcing plate and the NFC module. At least a portion of the reinforcing plate includes a first layer, an intermediate layer, and a second layer arranged sequentially along the thickness direction of the display module, wherein the intermediate layer includes an extension that extends beyond the first layer and the second layer; The conductive connector includes: a first conductive adhesive layer, an intermediate conductive adhesive layer, and a second conductive adhesive layer sequentially disposed along the thickness direction of the display module. The first conductive adhesive layer and the second conductive adhesive layer are attached to at least a portion of the upper surface and the lower surface of the extension. The intermediate conductive adhesive layer is attached to the side of the intermediate layer perpendicular to the width direction of the display panel.

2. The display module according to claim 1, characterized in that, The through hole is provided on the side of the support assembly to form a U-shaped groove.

3. The display module according to claim 1, characterized in that, The conductive part is a copper leakage area.

4. The display module according to claim 1, characterized in that, The first conductive adhesive layer and the second conductive adhesive layer extend beyond the intermediate layer by a distance greater than or equal to 1 mm along the length direction of the display module on the side connected to the intermediate layer.

5. The display module according to claim 1, characterized in that, The intermediate conductive adhesive layer at least completely covers the through hole when projected onto the through hole.

6. The display module according to claim 1, characterized in that, The intermediate conductive adhesive layer is a black conductive adhesive layer.

7. The display module according to any one of claims 1-6, characterized in that, The thickness of the second conductive adhesive layer is equal to the thickness of the support component.

8. A method for manufacturing a display module, used to manufacture the display module according to any one of claims 1-7, characterized in that, include: A display panel is fabricated, and a back film is provided on the side of the display panel away from the light-emitting surface; A support assembly is provided on the side of the back film away from the light-emitting surface, and through holes are formed on the support assembly; An NFC module and a reinforcing plate are fabricated on the side of the support assembly away from the light-emitting surface. Along the length of the display module, the reinforcing plate and the NFC module are arranged side by side. A circuit board is fabricated on the side of the NFC module away from the light-emitting surface. The circuit board includes a first part that is attached to the NFC module and is an insulating part. The circuit board also includes a second part that is not attached to the NFC module and the second part includes at least a conductive part that is disposed opposite to the through hole. A conductive connector that passes through the through hole is fabricated between the conductive part and the back film. The through hole is located at one end of the reinforcing plate along the width direction of the display module, or the through hole is located in the gap between the reinforcing plate and the NFC module. At least a portion of the reinforcing plate includes a first layer, an intermediate layer, and a second layer arranged sequentially along the thickness direction of the display module, wherein the intermediate layer includes an extension that extends beyond the first layer and the second layer; The conductive connector includes: a first conductive adhesive layer, an intermediate conductive adhesive layer, and a second conductive adhesive layer sequentially disposed along the thickness direction of the display module. The first conductive adhesive layer and the second conductive adhesive layer are attached to at least a portion of the upper surface and the lower surface of the extension. The intermediate conductive adhesive layer is attached to the side of the intermediate layer perpendicular to the width direction of the display panel.

9. A display device, characterized in that, Includes the display module as described in any one of claims 1-7.

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